Dissolving device for detecting metal elements on surface of silicon wafer

Abstract

The invention discloses a dissolving device for detecting metal elements on the surface of a silicon wafer, and relates to the technical field of semiconductor detection. The device comprises a supporting assembly, a plurality of supporting rods are fixedly mounted at the top of the inner wall of the supporting assembly, a dissolving tank is fixedly mounted in the supporting assembly, the outer wall of the dissolving tank is fixedly mounted at the bottoms of the supporting rods, a sealing cover is arranged at the top of the dissolving tank, and a fixing frame is arranged below the interior of the dissolving tank; a temperature difference prevention device is arranged in the dissolving tank, a mixing prevention device is arranged below the temperature difference prevention device, and a gathering prevention device is arranged on the periphery of the mixing prevention device. The solvent in the dissolving tank is uniformly heated through the heating plate and the heating assembly, the metal element dissolving efficiency of the solvent is improved, the detection time is shortened, meanwhile, the stirring range and the heat conduction range are continuously changed when the elastic telescopic plate stretches out and draws back, and the heating uniformity and the metal element dissolving rate are further improved on the original basis.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor detection, and in particular to a dissolving device for detecting metal elements on the surface of a silicon wafer. Background Art

[0002] In the semiconductor manufacturing process, the surface quality of silicon wafers is crucial. In order to ensure the performance and reliability of silicon wafers, the metal elements on their surface need to be tested. Before testing, the silicon wafers usually need to be dissolved in a specific solvent to extract and analyze the metal elements. However, the existing dissolution devices are small in size, which is not convenient for dissolving the entire silicon wafer. There are also problems such as inconvenient operation and easy introduction of impurities.

[0003] The patent with patent announcement number CN215492773U discloses a rapid dissolution device for soil heavy metal detection, which belongs to the field of soil detection technology. A rapid dissolution device for soil heavy metal detection includes a body, two feed hoppers are provided on the upper surface of the body, a drive motor is fixed on the upper surface of the body, a vertically arranged drive shaft is provided at the inner center of the body, the top of the drive shaft is connected to the output end of the body, a plurality of groups of stirring rods are fixed on the outer wall of the drive shaft, the ends of the stirring rods are connected to vertically arranged scrapers, the scrapers are fitted with the inner wall of the body, and a first shearing net and a second shearing net are fixed between the upper and lower stirring rods, which can realize rapid stirring and dissolution of the soil by combining the stirring rod and the circulating water flow impact, which can effectively avoid the soil adhering to the inner wall of the body and sinking to the bottom, effectively avoid the stirring dead corner, greatly improve the dissolution rate of the soil, and improve the dissolution efficiency.

[0004] However, the device still has some shortcomings: the device can improve the dissolution efficiency of the detected material, but in the dissolution process of semiconductor material silicon wafers, since the dissolution of metal elements on the surface of the silicon wafer is more difficult than soil, it is difficult to improve the dissolution efficiency of the metal elements by simply relying on solvents and stirring the solvents, which can easily lead to a decrease in detection efficiency to a certain extent. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a dissolution device for detecting metal elements on the surface of a silicon wafer, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a dissolution device for detecting metal elements on the surface of a silicon wafer, comprising a support assembly, a plurality of support rods are fixedly installed on the top of the inner wall of the support assembly, a dissolution tank is fixedly installed inside the support assembly, the outer wall of the dissolution tank is fixedly installed on the bottom of the support rods, a sealing cover is provided on the top of the dissolution tank, and a fixing frame is provided at the bottom of the dissolution tank;

[0007] The dissolving tank is provided with a temperature difference prevention device inside, an anti-mixing device is provided below the temperature difference prevention device, and an anti-aggregation device is provided outside the anti-mixing device;

[0008] The temperature difference protection device includes an electric reciprocating screw, the bottom of which is rotatably mounted at the top center of the fixed frame, the outer wall of which passes through and is movably mounted with a filter plate, and the filter plate has a built-in limiting hole, the bottom of the filter plate contacts the top of the fixed frame, the outer wall of the filter plate is slidably connected to the inner wall of the dissolving tank, a plurality of push rods are fixedly mounted at the top edge of the filter plate, the push rods are equidistantly distributed at the top of the filter plate, a storage mesh plate is fixedly mounted on the top of the push rod, a cylinder is fixedly mounted on the top of the electric reciprocating screw, and the outer wall of the cylinder is equidistantly and fixedly mounted There are several heating plates, and the heating plates are equipped with heating components. The heating plate is fixedly installed with an elastic telescopic plate on one side close to the inner wall of the dissolving tank. A hollow arc block is fixedly installed on the outer wall of the push rod. The support component limits the dissolving tank. The bottom of the dissolving tank is designed in an arc shape, and the dissolving tank and the sealing cover are used to contain the solvent and the silicon wafer. The material is polytetrafluoroethylene material to prevent the solvent from corroding the device. At the same time, the sealing cover prevents the solvent from volatilizing and impurities from entering, and the sealing cover is connected to the dissolving tank by a threaded connection. When testing is required, the silicon wafer is first placed in the dissolving tank, and then Add an appropriate amount of solvent, cover with a sealing cover, heat for a certain period of time through the heating plate and the heating component, turn off the heating plate, open the sealing cover, take out the silicon wafer, and carry out steps such as acid removal, volume adjustment, and machine testing on the dissolved solution; place the silicon wafer inside the storage mesh plate, the storage mesh plate carries the silicon wafer, and then start the electric reciprocating screw. When the electric reciprocating screw rotates along the top of the fixed frame, the reciprocating spiral groove on its outer wall restricts the built-in card block of the filter plate, drives the filter plate to slide upward along the inner wall of the dissolving tank and reset, and the filter plate drives the push rod to move synchronously, and the push rod promotes The storage net plate can realize reciprocating up and down motion; when the electric reciprocating screw rod rotates, it drives the cylinder to rotate, and the cylinder drives the heating plate to revolve. When the heating plate revolves, it drives the heating component inside itself to move synchronously. At the same time, the heating plate drives the elastic telescopic plate to revolve. The elastic telescopic plate has thermal conductivity. When the elastic telescopic plate revolves, its own telescopic end is separated from the resistance of the arc surface of the hollow arc block. The elastic telescopic plate is reset by the elastic force of its own internal spring. When the arc surface of the telescopic end of the elastic telescopic plate contacts the arc surface of the hollow arc block again, a resistance force is generated. At this time, the telescopic end of the elastic telescopic plate contracts toward its fixed end, and this process repeats.

[0009] According to the above technical solution, the outer wall of the storage mesh plate contacts the inner wall of the dissolving tank, the surface of the heating plate has a polytetrafluoroethylene coating, and the arc surface of the hollow arc block contacts the side of the telescopic end of the elastic telescopic plate close to the inner wall of the dissolving tank.

[0010] The filter element is fixedly mounted on the bottom of the filter element, and the top of the L-shaped downstream plate is slidably mounted on the inner wall of the dissolving tank near the inner wall of the dissolving tank. The bottom of the sieve plate is fixedly mounted on the top of the L-shaped downstream plate. When the filter plate moves upward and resets, the rotating rod is driven to move synchronously through the limiting hole. At this time, the limiting plate connected by a thread limits the spiral groove on the outer wall of the rotating rod, prompting the rotating rod to generate a rotating force and start rotating. The rotating rod drives the limiting disk to rotate and move upward. The limiting disk limits the L-shaped downstream plate through the annular groove, prompting the L-shaped downstream plate to slide and move upward along the annular groove of the limiting disk. The L-shaped downstream plate drives the sieve plate to move synchronously. When the filter plate drives the rotating rod to reset, the sieve plate is reset synchronously, and this process is repeated.

[0011] According to the above technical solution, the interior of the limiting plate is threadedly connected to the rotating rod, an annular groove is provided inside the limiting disc, and the sieve disc is located below the filter plate.

[0012] According to the above technical solution, the anti-mixing device also includes a plurality of circular frames and telescopic magnetic plates. The plurality of circular frames are equidistant and fixedly mounted on the outer wall surface of the rotating rod. A U-shaped groove is provided at the lower interior of the circular frame. The fixed end of the telescopic magnetic plate is fixedly mounted on the inner wall of the circular frame near one end of the rotating rod. When the rotating rod rotates, the circular frame is driven to rotate, and the circular frame drives the telescopic magnetic plate to revolve. When the telescopic magnetic plate revolves, it can quickly disturb the solvent around itself.

[0013] According to the above technical scheme, the anti-aggregation device includes a plurality of anti-skid wheels, a transmission rod and a rolling roller. The outer walls of the plurality of anti-skid wheels are symmetrical and rotatably installed on the inner wall of the U-shaped groove of the circular frame. The bottom of the anti-skid wheel contacts the top of the filter plate. Both ends of the transmission rod are fixedly installed at the center of the opposite side of the anti-skid wheel. A reciprocating spiral groove is provided on the outer wall of the end of the transmission rod away from the rotating rod. The rolling roller penetrates through the inside and is fixedly installed on the outer wall of the end of the transmission rod close to the rotating rod. When the circular frame revolves, it drives the anti-skid wheel to slide synchronously along the top of the filter plate and generates friction. The anti-skid wheel starts to rotate due to the friction. When the anti-skid wheel rotates, it drives the transmission rod to rotate. The transmission rod drives the rolling roller to rotate along the top of the filter plate in a circular trajectory.

[0014] According to the above technical solution, the anti-aggregation device also includes a sliding plate, an L-shaped plate, a resistance plate, a swinging plate and a plurality of arc-shaped plates. The sliding plate passes through the inside and is movably installed on the outer wall of the reciprocating spiral groove of the transmission rod. The top of the sliding plate is slidably installed on the top of the U-shaped groove of the circular frame. The bottom of the L-shaped plate is fixedly installed on the top of the sliding plate. The resistance plate is fixedly installed on the outer wall of the L-shaped plate at one end close to the outer wall of the circular frame. The end of the swinging plate away from the rotating rod is hinged at the edge of the outer wall of the circular frame through a torsion spring. The arc-shaped plates are equidistant from the side away from the outer wall of the circular frame and are fixedly installed on the inner wall of the swinging plate. When the transmission rod rotates, the reciprocating spiral groove restricts the built-in block of the sliding plate and the block The transmission rod drives the sliding plate to slide back and forth along its own outer wall by continuously contacting the inner wall of the reciprocating spiral groove. The sliding plate drives the L-shaped plate to move synchronously, and the L-shaped plate drives the contact plate to move synchronously. At the same time, the L-shaped plate will pull the telescopic end of the telescopic magnetic plate to extend away from the outer wall of the rotating rod and reset. At the same time, when the contact plate moves away from the outer wall of the rotating rod, it will resist the arc surface of the arc-shaped piece to generate a resistance force. At this time, the swinging plate starts to rotate its own hinge axis under the push of the arc-shaped piece, and the swinging plate swings in an arc trajectory with the hinge axis as the axis away from the outer wall of the circular frame. As the contact plate gradually slides, the swing amplitude of the swinging plate gradually increases. After that, the swinging plate falls off the resistance of the arc-shaped piece and is reset by the torsion spring.

[0015] According to the above technical solution, the top of the L-shaped plate is fixedly installed on the outer wall of the telescopic end of the telescopic magnetic plate close to one side of the outer wall of the circular frame, and the arc surface of the arc-shaped plate is located on the movement trajectory of the resistance plate.

[0016] The present invention provides a dissolution device for detecting metal elements on the surface of a silicon wafer. It has the following beneficial effects:

[0017] (1) In the present invention, during the detection, the silicon wafer is first placed in the dissolving tank, and then an appropriate amount of solvent is added, and the sealing cover is covered. After heating for a certain period of time through the heating plate and the heating component, the heating plate is turned off, the sealing cover is opened, the silicon wafer is taken out, and the dissolved solution is subjected to the steps of removing acid, fixing the volume, and testing on the machine; by setting the anti-mixing device, the dissolving tank, the sealing cover, the support component, the electric reciprocating screw, the filter plate, the push rod, the storage mesh plate, the cylinder, the heating plate, the elastic telescopic plate and the hollow arc block are matched, and the metal elements on the surface of the silicon wafer are quickly and effectively dissolved by heating, thereby improving the detection efficiency. At the same time, the design of the sealing cover makes the device simple and convenient to operate, and prevents the solvent from volatilizing and impurities from entering. In addition, the polytetrafluoroethylene material is used to increase the service life of the device;

[0018] The above cooperation facilitates the placement and removal steps of silicon wafers. At the same time, the placement mesh plate promotes the reciprocating flushing between the metal on the surface of the silicon wafer and the solvent to improve the extraction efficiency of the test substance. Then, the filter holes of the placement mesh plate and the filter plate cooperate with each other, so that the metal elements are quickly dissolved in the solvent during the falling process; at the same time, the heating plate and the heating component are used to evenly heat the solvent inside the dissolution tank, thereby improving the solvent's dissolution efficiency for the metal elements and shortening the detection time. At the same time, the elastic telescopic plate continuously changes the stirring range and the heat conduction range when it is extended and retracted, thereby further improving the heating uniformity and the dissolution rate of the metal elements on the original basis.

[0019] (2) The present invention adopts the setting of the anti-mixing device, and cooperates with the filter plate, the rotating rod, the limit plate, the limit disc, the L-shaped downstream plate, the sieve plate, the circular frame and the telescopic magnetic plate. The sieve plate is used to quickly sieve the solvent inside the arc-shaped end of the dissolving tank, that is, the solvent accumulated at the bottom of the dissolving tank and the dissolved metal elements can be fully combined, so as to ensure that the metal element content inside the solvent is relatively balanced when the solvent is taken out for detection, thereby avoiding excessive differences in single detection results; and the telescopic magnetic plate can rotate and adsorb the metal particles that are about to fall to the top of the filter plate during the revolution, thereby removing the metal particles in the solvent and preventing the metal particles from being mixed in the solvent without being dissolved, thereby reducing the accuracy of the detection result.

[0020] (3) The present invention, through the setting of the anti-aggregation device, cooperates with the circular frame, anti-skid wheel, transmission rod, rolling roller, sliding plate, L-shaped plate, resistance plate, swing plate and arc-shaped plate, and relies on the self-rotation of the rolling roller to crush the metal particles that are intercepted by the telescopic magnetic plate and fall under the impact of the solvent. The rolling roller squeezes the metal particles on the top of the filter plate to make them powderized, and then dissolves them in the solvent for a second time under the flushing of the solvent, thereby ensuring that the metal elements lifted once can be fully dissolved, preventing the detection result data from being too low; and effectively expanding the interception range of the telescopic magnetic plate, and the reciprocating extension and retraction of the telescopic magnetic plate facilitates the falling of metal particles, preventing the metal particles from widely gathering on the surface of the telescopic magnetic plate and being difficult to be crushed and dissolved. At the same time, the swing plate reciprocates to slap the upward surging solvent in the direction of the telescopic magnetic plate, preventing the metal particles in the solvent from floating upward under the disturbance of the solvent, and preventing the telescopic magnetic plate from reducing the capture efficiency of the metal particles. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the present invention as a whole;

[0022] Figure 2 It is a cross-sectional schematic diagram of the present invention as a whole;

[0023] Figure 3 It is a schematic diagram of the temperature difference protection device of the present invention;

[0024] Figure 4 It is a cross-sectional schematic diagram of the temperature difference protection device of the present invention;

[0025] Figure 5 It is a schematic diagram of the anti-mixing device of the present invention;

[0026] Figure 6 This is a schematic diagram of the anti-mixing device from the top perspective of the present invention;

[0027] Figure 7 It is a schematic diagram of the anti-aggregation device of the present invention;

[0028] Figure 8 It is a schematic diagram showing the overall structure of the anti-aggregation device of the present invention;

[0029] Fig. 9 For the present invention Figure 8 A schematic diagram of the enlarged structure in the middle.

[0030] In the figure: 1. support assembly; 2. support rod; 3. dissolving tank; 31. sealing cover; 32. fixing frame; 4. temperature difference prevention device; 41. electric reciprocating screw; 42. filter plate; 43. push rod; 44. storage mesh plate; 45. cylinder; 46. heating plate; 47. elastic telescopic plate; 48. hollow arc block; 5. anti-mixing device; 51. rotating rod; 52. limit plate; 53. limit disc; 54. L-shaped downstream plate; 55. sieve plate; 56. circular frame; 57. telescopic magnetic plate; 6. anti-aggregation device; 61. anti-skid wheel; 62. transmission rod; 63. rolling roller; 64. sliding plate; 65. L-shaped plate; 66. resistance plate; 67. swing plate; 68. arc sheet. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0032] See also Figure 1-Figure 9 , one embodiment of the present invention is: a dissolution device for detecting metal elements on the surface of a silicon wafer, comprising a support assembly 1, a plurality of support rods 2 are fixedly installed on the top of the inner wall of the support assembly 1, a dissolution tank 3 is fixedly installed inside the support assembly 1, the outer wall of the dissolution tank 3 is fixedly installed on the bottom of the support rods 2, a sealing cover 31 is arranged on the top of the dissolution tank 3, and a fixing frame 32 is arranged at the bottom of the dissolution tank 3;

[0033] The dissolving tank 3 is provided with a temperature difference prevention device 4 inside, an anti-mixing device 5 is provided below the temperature difference prevention device 4, and an anti-aggregation device 6 is provided outside the anti-mixing device 5;

[0034] The temperature difference protection device 4 includes an electric reciprocating screw 41, the bottom of the electric reciprocating screw 41 is rotatably installed at the top center of the fixed frame 32, the outer wall of the electric reciprocating screw 41 passes through and is movably installed with a filter plate 42, and the filter plate 42 has a built-in limiting hole, the bottom of the filter plate 42 contacts the top of the fixed frame 32, the outer wall of the filter plate 42 is slidably connected to the inner wall of the dissolving tank 3, a plurality of push rods 43 are fixedly installed at the top edge of the filter plate 42, and the plurality of push rods 43 are equidistantly distributed on the top of the filter plate 42, a storage mesh plate 44 is fixedly installed on the top of the push rods 43, a cylinder 45 is fixedly installed on the top of the electric reciprocating screw 41, and a plurality of heating plates 46 are equidistantly and fixedly installed on the outer wall of the cylinder 45, and the heating plate 46 has a heating component built in, and the heating plate 46 is close to the inner wall of the dissolving tank 3 An elastic telescopic plate 47 is fixedly installed, and a hollow arc block 48 is fixedly installed on the outer wall of the push rod 43. The above cooperation facilitates the placement and removal steps of the silicon wafer. At the same time, the placement mesh plate 44 is relied on to promote the reciprocating flushing between the metal on the surface of the silicon wafer and the solvent to improve the extraction efficiency of the detection substance. Then, the filter holes 42 of the placement mesh plate 44 and the filter plate cooperate with each other, so that the metal elements are quickly dissolved in the solvent during the falling process; through the above cooperation, the heating plate 46 and the heating component are relied on to evenly heat the solvent inside the dissolution tank 3, improve the solvent's dissolution efficiency of the metal elements, shorten the detection time, and at the same time, the elastic telescopic plate 47 continuously changes the stirring range and the heat conduction range when it is expanded and contracted, further improving the heating uniformity and the dissolution rate of the metal elements on the original basis.

[0035] The outer wall of the storage mesh plate 44 contacts the inner wall of the dissolving tank 3 , the surface of the heating plate 46 has a polytetrafluoroethylene coating, and the arc surface of the hollow arc block 48 contacts the side of the telescopic end of the elastic telescopic plate 47 close to the inner wall of the dissolving tank 3 .

[0036] When in use, the support component 1 limits the dissolving tank 3, the bottom of the dissolving tank 3 is designed in an arc shape, and the dissolving tank 3 and the sealing cover 31 are used to contain the solvent and the silicon wafer, which are made of polytetrafluoroethylene material to prevent the solvent from corroding the device. At the same time, the sealing cover 31 prevents the solvent from volatilizing and impurities from entering, and the sealing cover 31 is connected to the dissolving tank 3 by a threaded connection. When testing is required, first put the silicon wafer into the dissolving tank 3, then add an appropriate amount of solvent, cover the sealing cover 31, and heat it for a certain period of time through the heating plate 46 and the heating component, then turn off the heating plate 46, open the sealing cover 31, and take out The silicon wafer is placed inside the storage mesh 44, and the storage mesh 44 carries the silicon wafer. Then, the electric reciprocating screw 41 is started. When the electric reciprocating screw 41 rotates along the top of the fixing frame 32, the filter plate 42 is driven to slide upward along the inner wall of the dissolving tank 3 and reset by the restriction of the built-in block of the filter plate 42 by the reciprocating spiral groove on its outer wall. The filter plate 42 drives the push rod 43 to move synchronously, and the push rod 43 causes the storage mesh 44 to realize reciprocating up and down movement. The above cooperation facilitates the placement and removal of silicon wafers. Step, at the same time, the placement mesh plate 44 is used to promote the reciprocating flushing between the metal on the surface of the silicon wafer and the solvent to improve the extraction efficiency of the detected substance, and then the placement mesh plate 44 and the filter plate filter holes 42 cooperate with each other, so that the metal element is quickly dissolved in the solvent during the falling process; the electric reciprocating screw 41 drives the cylinder 45 to rotate when it rotates, and the cylinder 45 drives the heating plate 46 to revolve, and the heating plate 46 drives the heating components inside itself to move synchronously when it revolves, and the heating plate 46 drives the elastic telescopic plate 47 to revolve, and the elastic telescopic plate 47 has thermal conductivity, and the elastic telescopic plate 47 revolves when its own telescopic end is separated from the air The elastic telescopic plate 47 is reset by its own internal spring force when the arc surface of the elastic telescopic end of the elastic telescopic plate 47 contacts the arc surface of the hollow arc block 48 again, and a resistance force is generated. At this time, the elastic telescopic end of the elastic telescopic plate 47 contracts toward the inside of its fixed end, and this process is repeated repeatedly. Through the above cooperation, the heating plate 46 and the heating component are used to evenly heat the solvent inside the dissolving tank 3, thereby improving the solvent's dissolution efficiency for metal elements and shortening the detection time. At the same time, the elastic telescopic plate 47 continuously changes the stirring range and the heat conduction range when it is extended and retracted, thereby further improving the heating uniformity and the dissolution rate of metal elements on the original basis.

[0037] See also Figure 1-Figure 9 , based on the above embodiment, another embodiment of the present invention further includes an anti-mixing device 5;

[0038] The anti-mixing device 5 includes a rotating rod 51, a limiting plate 52, a limiting disc 53, an L-shaped downstream plate 54 and a sieve plate 55. The outer wall of the rotating rod 51 passes through and is rotatably installed inside the limiting hole of the filter plate 42. The limiting plate 52 is fixedly installed on the inner wall of the dissolving tank 3 away from the rotating rod 51. The top of the limiting disc 53 is fixedly installed on the bottom of the rotating rod 51. The top of the L-shaped downstream plate 54 is slidably installed on the inner wall of the dissolving tank 3. The bottom of the sieve plate 55 is fixedly installed on the top of the L-shaped downstream plate 54.

[0039] The interior of the limiting plate 52 is threadedly connected to the rotating rod 51, an annular groove is provided inside the limiting disc 53, and the sieve plate 55 is located below the filter plate 42. Through the above cooperation, the sieve plate 55 is used to quickly sieve the solvent inside the arc-shaped end of the dissolving tank 3, so that the solvent accumulated at the bottom of the dissolving tank 3 and the dissolved metal elements can be fully combined, ensuring that the metal element content inside the solvent is relatively balanced when it is taken out for testing, avoiding excessive differences in single test results.

[0040] The anti-mixing device 5 also includes a plurality of circular frames 56 and a telescopic magnetic plate 57. The plurality of circular frames 56 are equidistant and fixedly mounted on the outer wall surface of the rotating rod 51. A U-shaped groove is provided at the lower interior of the circular frame 56. The fixed end of the telescopic magnetic plate 57 is fixedly mounted on the inner wall of the circular frame 56 near one end of the rotating rod 51. Through the above cooperation, the telescopic magnetic plate 57 can rotate and adsorb the metal particles that are about to fall onto the top of the filter plate 42 during the revolution, thereby removing the metal particles in the solvent and preventing the metal particles from being mixed in the solvent and not being dissolved, thereby reducing the accuracy of the detection result.

[0041] When in use, the filter plate 42 moves upward and drives the rotating rod 51 to move synchronously through the limiting hole when it is reset. At this time, the limiting plate 52 connected by thread limits the spiral groove on the outer wall of the rotating rod 51, prompting the rotating rod 51 to generate a rotating force and start to rotate, and the rotating rod 51 drives the limiting disc 53 to rotate and move upward. The limiting disc 53 limits the L-shaped downstream plate 54 through the annular groove, prompting the L-shaped downstream plate 54 to slide along the annular groove of the limiting disc 53 and move upward, and the L-shaped downstream plate 54 drives the sieve plate 55 to move synchronously. When the filter plate 42 drives the rotating rod 51 to reset, the sieve plate 55 is reset synchronously, and so on. Through the above cooperation, the sieve plate 55 relies on the arc end of the dissolving tank 3 to move The solvent is quickly screened, that is, the solvent accumulated at the bottom of the dissolution tank 3 is enabled to fully combine with the dissolved metal elements, ensuring that the metal element content inside the solvent is relatively balanced when it is taken out for detection, thereby avoiding excessive differences in single test results; when the rotating rod 51 rotates, it drives the circular frame 56 to rotate, and the circular frame 56 drives the telescopic magnetic plate 57 to revolve, and the telescopic magnetic plate 57 can quickly disturb the solvent around itself when it revolves. Through the above cooperation, the telescopic magnetic plate 57 can rotate and adsorb the metal particles that are about to fall to the top of the filter plate 42 during the revolution, thereby removing the metal particles in the solvent and preventing the metal particles from being mixed in the solvent and not being dissolved, thereby reducing the accuracy of the test results.

[0042] See also Figure 1-Figure 9 , based on the above embodiment, another embodiment of the present invention further includes an anti-aggregation device 6;

[0043] The anti-aggregation device 6 includes a plurality of anti-skid wheels 61, a transmission rod 62 and a rolling roller 63. The outer walls of the plurality of anti-skid wheels 61 are symmetrical and rotatably mounted on the inner wall of the U-shaped groove of the circular frame 56. The bottom of the anti-skid wheel 61 contacts the top of the filter plate 42. Both ends of the transmission rod 62 are fixedly mounted at the center of the opposite side of the anti-skid wheel 61. A reciprocating spiral groove is provided on the outer wall of the end of the transmission rod 62 away from the rotating rod 51. The rolling roller 63 penetrates through the inside and is fixedly mounted on the outer wall of the end of the transmission rod 62 close to the rotating rod 51. Through the above coordination and relying on the self-rotation movement of the rolling roller 63, the metal particles that are intercepted by the telescopic magnetic plate 57 and fall under the impact of the solvent can be crushed and pulverized. The metal particles are squeezed on the top of the filter plate 42 by the rolling roller 63 to powderize them, and then dissolved in the solvent for a second time under the flushing of the solvent, to ensure that the metal elements lifted once can be fully dissolved, thereby preventing the detection result data from being too low.

[0044] The anti-aggregation device 6 also includes a sliding plate 64, an L-shaped plate 65, a resistance plate 66, a swinging plate 67 and a plurality of arc-shaped pieces 68. The sliding plate 64 penetrates the inside and is movably installed on the outer wall of the reciprocating spiral groove of the transmission rod 62. The top of the sliding plate 64 is slidably installed on the top of the U-shaped groove of the circular frame 56. The bottom of the L-shaped plate 65 is fixedly installed on the top of the sliding plate 64. The resistance plate 66 is fixedly installed on the outer wall of the L-shaped plate 65 at one end close to the outer wall of the circular frame 56. The swinging plate 67 is hinged at the edge of the outer wall of the circular frame 56 at one end away from the rotating rod 51 through a torsion spring. A plurality of arc-shaped pieces 68 are equidistant from the side of the outer wall of the circular frame 56 and are fixedly installed on the inner wall of the swinging plate 67.

[0045] The top of the L-shaped plate 65 is fixedly installed on the outer wall of the telescopic end of the telescopic magnetic plate 57 near the outer wall of the circular frame 56, and the arc surface of the arc-shaped plate 68 is located on the movement trajectory of the resistance plate 66. The above cooperation effectively expands the interception range of the telescopic magnetic plate 57, and the reciprocating extension and retraction of the telescopic magnetic plate 57 facilitates the falling of metal particles, preventing metal particles from widely gathering on the surface of the telescopic magnetic plate 57 and being difficult to be crushed and dissolved. At the same time, the swing plate 67 swings back and forth to hit the upward surging solvent in the direction of the telescopic magnetic plate 57, preventing the metal particles in the solvent from floating upward under the disturbance of the solvent, and preventing the telescopic magnetic plate 57 from reducing the efficiency of capturing metal particles.

[0046] When in use, the circular frame 56 drives the anti-skid wheel 61 to slide synchronously along the top of the filter plate 42 and generate friction force when it revolves. The anti-skid wheel 61 starts to rotate due to the friction force. When the anti-skid wheel 61 rotates, it drives the transmission rod 62 to rotate. The transmission rod 62 drives the rolling roller 63 to rotate along the top of the filter plate 42 in a circular trajectory. Through the above cooperation and relying on the rotation of the rolling roller 63, the metal particles that are intercepted by the telescopic magnetic plate 57 and fall under the impact of the solvent can be crushed and pulverized. The particles are squeezed on the top of the filter plate 42 to make them powderized, and then dissolved in the solvent for a second time under the flushing of the solvent, ensuring that the metal elements lifted in a single time can be fully dissolved to prevent the detection result data from being too low; when the transmission rod 62 rotates, the reciprocating spiral groove restricts the built-in block of the sliding plate 64, and the block constantly contacts the inner wall of the reciprocating spiral groove, and the transmission rod 62 drives the sliding plate 64 to slide back and forth along its own outer wall, and the sliding plate 64 drives the L-shaped plate 65 to move synchronously, and the L-shaped plate 65 drives the contact plate 66 to move synchronously At the same time, the L-shaped plate 65 will pull the telescopic end of the telescopic magnetic plate 57 to extend away from the outer wall of the rotating rod 51 and reset. At the same time, when the contact plate 66 moves away from the outer wall of the rotating rod 51, it will contact the arc surface of the arc-shaped piece 68 to generate a contact force. At this time, the hinge axis of the swing plate 67 starts to rotate under the push of the arc-shaped piece 68, and the swing plate 67 swings in an arc trajectory with the hinge axis as the axis center away from the outer wall of the circular frame 56. As the contact plate 66 gradually slides, the swing amplitude of the swing plate 67 gradually increases. Afterwards, the swing plate 67 is reset by the torsion spring after falling off the arc-shaped piece 68. The above cooperation effectively expands the interception range of the telescopic magnetic plate 57, and the telescopic magnetic plate 57 reciprocates to facilitate the falling of metal particles, preventing metal particles from widely gathering on the surface of the telescopic magnetic plate 57 and being difficult to be crushed and dissolved. At the same time, the swing plate 67 reciprocates to hit the upward surging solvent in the direction of the telescopic magnetic plate 57, preventing the metal particles in the solvent from floating upward under the disturbance of the solvent, and preventing the telescopic magnetic plate 57 from reducing the efficiency of capturing metal particles.

[0047] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A dissolution device for detecting metal elements on the surface of a silicon wafer, comprising a support assembly (1), characterized in that: A plurality of support rods (2) are fixedly mounted on the top of the inner wall of the support assembly (1); a dissolving tank (3) is fixedly mounted inside the support assembly (1); an outer wall of the dissolving tank (3) is fixedly mounted on the bottom of the support rods (2); a sealing cover (31) is arranged on the top of the dissolving tank (3); and a fixing frame (32) is arranged at the bottom of the dissolving tank (3); The dissolving tank (3) is provided with a temperature difference prevention device (4) inside, an anti-mixing device (5) is provided below the temperature difference prevention device (4), and an anti-aggregation device (6) is provided outside the anti-mixing device (5); The temperature difference protection device (4) comprises an electric reciprocating screw (41), the bottom of the electric reciprocating screw (41) is rotatably mounted at the top center of the fixed frame (32), a filter plate (42) is movably mounted through the outer wall of the electric reciprocating screw (41), and the filter plate (42) has a built-in limiting hole, the bottom of the filter plate (42) contacts the top of the fixed frame (32), the outer wall of the filter plate (42) is slidably connected to the inner wall of the dissolving tank (3), and a plurality of push rods (43) are fixedly mounted at the top edge of the filter plate (42). The push rods (43) are equidistantly distributed on the top of the filter plate (42); a storage mesh plate (44) is fixedly mounted on the top of the push rods (43); a cylinder (45) is fixedly mounted on the top of the electric reciprocating screw rod (41); a plurality of heating plates (46) are equidistantly and fixedly mounted on the outer wall of the cylinder (45); and a heating component is built into the heating plate (46); an elastic telescopic plate (47) is fixedly mounted on one side of the heating plate (46) close to the inner wall of the dissolving tank (3); and a hollow arc block (48) is fixedly mounted on the outer wall of the push rod (43).

2. A dissolution device for detecting metal elements on the surface of a silicon wafer according to claim 1, characterized in that: The outer wall of the storage mesh plate (44) contacts the inner wall of the dissolving tank (3), the surface of the heating plate (46) has a polytetrafluoroethylene coating, and the arc surface of the hollow arc block (48) contacts the side of the telescopic end of the elastic telescopic plate (47) close to the inner wall of the dissolving tank (3).

3. A dissolution device for detecting metal elements on the surface of a silicon wafer according to claim 2, characterized in that: The anti-mixing device (5) comprises a rotating rod (51), a limiting plate (52), a limiting disc (53), an L-shaped downstream plate (54) and a sieve plate (55); the outer wall of the rotating rod (51) penetrates through and is rotatably mounted inside the limiting hole of the filter plate (42); the limiting plate (52) is fixedly mounted on the inner wall of the dissolving tank (3) at a side away from the rotating rod (51); the top of the limiting disc (53) is fixedly mounted on the bottom of the rotating rod (51); the top of the L-shaped downstream plate (54) is slidably mounted inside the annular groove of the limiting disc (53) at a side close to the inner wall of the dissolving tank (3); and the bottom of the sieve plate (55) is fixedly mounted on the top of the L-shaped downstream plate (54).

4. A dissolution device for detecting metal elements on the surface of a silicon wafer according to claim 3, characterized in that: The interior of the limiting plate (52) is threadedly connected to the rotating rod (51), an annular groove is provided inside the limiting disc (53), and the sieve disc (55) is located below the filter plate (42).

5. A dissolution device for detecting metal elements on the surface of a silicon wafer according to claim 4, characterized in that: The anti-mixing device (5) further comprises a plurality of circular frames (56) and a telescopic magnetic plate (57). The plurality of circular frames (56) are equidistantly and fixedly mounted on the outer wall surface of the rotating rod (51). A U-shaped groove is provided at the lower part of the circular frame (56). The fixed end of the telescopic magnetic plate (57) is fixedly mounted on the inner wall of the circular frame (56) close to one end of the rotating rod (51).

6. A dissolution device for detecting metal elements on the surface of a silicon wafer according to claim 5, characterized in that: The anti-aggregation device (6) comprises a plurality of anti-skid wheels (61), a transmission rod (62) and a rolling roller (63); the outer walls of the plurality of anti-skid wheels (61) are symmetrically and rotatably mounted on the inner wall of the U-shaped groove of the circular frame (56); the bottom of the anti-skid wheel (61) contacts the top of the filter plate (42); both ends of the transmission rod (62) are fixedly mounted at the center of the opposite side of the anti-skid wheel (61); a reciprocating spiral groove is formed on the outer wall of the end of the transmission rod (62) away from the rotating rod (51); and the rolling roller (63) penetrates inside and is fixedly mounted on the outer wall of the end of the transmission rod (62) close to the rotating rod (51).

7. A dissolution device for detecting metal elements on the surface of a silicon wafer according to claim 6, characterized in that: The anti-aggregation device (6) also includes a sliding plate (64), an L-shaped plate (65), a contact plate (66), a swing plate (67) and a plurality of arc-shaped sheets (68); the sliding plate (64) penetrates the inside and is movably mounted on the outer wall of the reciprocating spiral groove of the transmission rod (62); the top of the sliding plate (64) is slidably mounted on the top of the U-shaped groove of the circular frame (56); the bottom of the L-shaped plate (65) is fixedly mounted on the top of the sliding plate (64); one end of the contact plate (66) close to the outer wall of the circular frame (56) is fixedly mounted on the outer wall of the L-shaped plate (65); one end of the swing plate (67) away from the rotating rod (51) is hinged to the outer wall edge of the circular frame (56) through a torsion spring; and a plurality of arc-shaped sheets (68) are equidistantly and fixedly mounted on the inner wall of the swing plate (67) on the side away from the outer wall of the circular frame (56).

8. A dissolution device for detecting metal elements on the surface of a silicon wafer according to claim 7, characterized in that: The top of the L-shaped plate (65) is fixedly mounted on the outer wall of the telescopic end of the telescopic magnetic plate (57) close to one side of the outer wall of the circular frame (56), and the arc surface of the arc-shaped sheet (68) is located on the movement trajectory of the abutment plate (66).

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