Wafer bearing device, vapor deposition equipment and use method

Abstract

The invention discloses a wafer bearing device, vapor deposition equipment and a using method, and the wafer bearing device comprises a rotatable base which is arranged at the bottom of the interior of a reaction cavity; the tray is arranged on the base and is used for bearing a wafer; a positioning block is arranged on the surface, facing the base, of the tray, a positioning groove matched with the positioning block is formed in the base, and the tray is positioned through cooperation of the positioning block and the positioning groove; and the gas channel is arranged in the base and is used for spraying gas to the positioning block, so that the centers of the tray and the base tend to coincide. According to the invention, the position of the tray can be accurately controlled through the cooperation of the gas channel, the positioning groove and the positioning block, so that the centers of the tray and the base coincide, and uniform temperature distribution on the tray and the wafer is ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a wafer carrying device, a vapor deposition device and a use method thereof. Background Art

[0002] In the semiconductor manufacturing process, some processes require the use of single wafer deposition. For the single wafer deposition process, the tray carrying the wafer is generally placed on a base, and heaters are evenly arranged in the base. During the deposition process, the tray and the wafer are driven by the base to rotate at a constant speed so that the crystals on the wafer grow evenly, thereby forming a uniform film.

[0003] However, in the existing single wafer deposition process, when the tray, which serves as a wafer carrier, is placed on the base and rotated by the base, the center of the tray and the center of the base are usually not aligned, which results in inconsistent distances between the two ends of the tray and the center of the heater, and the average temperature of the end of the tray close to the center of the heater is always higher than the average temperature of the end far from the center of the heater, resulting in temperature eccentricity on the tray, i.e., uneven temperature distribution, which can easily lead to eccentric film thickness of the wafer on the tray, i.e., uneven film formation. Therefore, it is necessary to adjust the overall structure of the wafer carrier. Summary of the invention

[0004] The object of the present invention is to provide a wafer carrying device, a vapor deposition device and a method of use, wherein gas can be sprayed toward a positioning block fixed on a tray through a gas channel arranged in a base so that the centers of the tray and the base tend to coincide, thereby ensuring uniform temperature distribution on the tray and the wafer.

[0005] In order to achieve the above object, the present invention is implemented by the following technical solutions:

[0006] A wafer carrier device, used in a reaction chamber of a vapor deposition device, the wafer carrier device comprising:

[0007] A rotatable base is disposed at the inner bottom of the reaction chamber;

[0008] A tray is arranged on the base and used to carry wafers; a positioning block is arranged on the surface of the tray facing the base, and a positioning groove matching the positioning block is arranged on the base, and the tray is positioned by the cooperation between the positioning block and the positioning groove; and

[0009] A gas channel is arranged in the base and is used for spraying gas toward the positioning block so that the centers of the tray and the base tend to coincide.

[0010] Optionally, the positioning groove includes at least four first grooves, the first grooves are evenly distributed along the circumference of the base, and the number of the first grooves is an even number; the first groove includes two opposite first side walls, and only one of the first side walls in the same first groove is connected to the gas channel.

[0011] Optionally, the first side walls communicating with the gas channel in two first grooves opposite to each other with respect to the center of the base are not located on or are located on the same side.

[0012] Optionally, the positioning groove includes at least four second grooves, the second grooves are evenly distributed along the circumference of the base, and the number of the second grooves is an even number; the second groove includes two opposite second side walls, and each of the second side walls is connected to the gas channel.

[0013] Optionally, the gas channel includes: a first air inlet channel connected to the air supply device; a first driving air hole, whose inlet end is connected to the first air inlet channel and whose outlet end passes through the side wall of the corresponding groove, for spraying the gas in a preset direction onto the positioning block in the corresponding groove.

[0014] Optionally, the first driving air hole is a strip-shaped hole, and the preset direction is consistent with the length direction of the first driving air hole.

[0015] Optionally, the base comprises an inner side wall and an outer side wall opposite to each other, and the inner side wall is located inside the outer side wall;

[0016] The positioning groove includes at least four third grooves, the third grooves are evenly distributed along the circumference of the base, and the number of the third grooves is an even number; the third groove includes two opposite third side walls;

[0017] The positioning block comprises a first positioning side wall arranged opposite to the third side wall and a second positioning side wall arranged opposite to the inner side wall;

[0018] The orthographic projection of the second positioning side wall on the surface where the inner side wall is located at least partially overlaps with the inner side wall, and the inner side wall overlapping with the orthographic projection of the second positioning side wall is in communication with the gas channel.

[0019] Optionally, all the third grooves form a regular 2n-gon and n≥2, wherein the inner side walls on both sides of n adjacent third grooves are in communication with the gas channel.

[0020] Optionally, the inner side walls on both sides of each of the third grooves are connected to the gas channel.

[0021] Optionally, the gas channel includes: a second air inlet channel connected to the air supply device; a second driving air hole, whose inlet end is connected to the second air inlet channel and whose outlet end passes through the inner wall, for spraying the gas onto the second positioning side wall corresponding to the positioning block.

[0022] Optionally, the gas is sprayed in a direction toward the center of the base.

[0023] Optionally, the wafer supporting device further includes: a heater, disposed in the base, for heating the wafer to a preset temperature.

[0024] Optionally, below 1000° C., the width of the positioning groove on the base is greater than the width of the positioning block.

[0025] Optionally, the gas is an inert gas or nitrogen.

[0026] On the other hand, the present invention further provides a vapor deposition device, which includes: a reaction chamber; and the wafer carrying device as described above.

[0027] Optionally, the vapor deposition device further comprises: a position adjustment system; and the position adjustment system comprises:

[0028] A photoelectric detection mechanism, disposed on the side wall of the reaction chamber, for detecting the deviation between the center of the tray and the center of the base and generating a deviation signal;

[0029] a signal processing mechanism connected to the photoelectric detection mechanism, and used to determine whether the position of the tray needs to be corrected according to the deviation signal, and also used to obtain a first gas flow rate and a first gas pressure required to make the center of the tray coincide with the center of the base when the position of the tray needs to be corrected;

[0030] The gas control mechanism is connected to the signal processing mechanism and the gas channel, and is used to control the gas flow rate and gas pressure sprayed from the gas channel to the positioning block, so that the centers of the tray and the base tend to coincide.

[0031] Optionally, the signal processing mechanism is further used to obtain a second gas flow rate and a second gas pressure required to make the tray stationary relative to the base when there is no need to correct the position of the tray and the base is rotating.

[0032] On the other hand, this embodiment also provides a method for using the wafer carrier as described above, the method comprising:

[0033] Step S1, placing the tray on the base, and positioning the tray by cooperating between the positioning block and the positioning groove;

[0034] Step S2, spraying gas toward the positioning block through the gas channel so that the centers of the tray and the base tend to coincide with each other.

[0035] Optionally, step S2 includes:

[0036] Step S21, spraying the gas toward the positioning block through the gas channel to generate a first driving force to drive the positioning block to move so that the centers of the tray and the base tend to coincide; or

[0037] Step S22: spraying the gas toward the positioning block through the gas channel to generate a second driving force to make the positioning block stationary relative to the rotating base, so that the tray is stationary relative to the rotating base.

[0038] Optionally, before step S2, the process also includes detecting whether the center of the tray deviates from the center of the base. If so, executing step S21; if not and the base rotates, executing step S22; if not and the base does not rotate, not executing step S2.

[0039] Compared with the prior art, the present invention has at least one of the following advantages:

[0040] The present invention provides a wafer carrying device, vapor deposition equipment and use method. A tray for carrying wafers in the wafer carrying device is arranged on a rotatable base. A positioning block is provided on the surface of the tray facing the base. A positioning groove matching the positioning block is provided on the base. The tray can be positioned by cooperating between the positioning block and the positioning groove. At the same time, a gas channel is also provided in the base, and gas can be sprayed toward the positioning block through the gas channel to achieve precise control of the position of the tray (including position adjustment and position fixation), so that the centers of the tray and the base tend to coincide, thereby ensuring uniform temperature distribution on the tray and the wafer.

[0041] The positioning groove in the present invention may include at least four grooves, and all the grooves are evenly distributed along the circumference of the base; correspondingly, the number of positioning blocks is the same as the number of grooves, and all the positioning blocks can be evenly distributed along the circumference of the pallet, so that a positioning block can be placed in each groove, so that the position of the pallet can be adjusted in multiple directions by moving the positioning block in each groove, and the uniformity of the adjustment of the pallet position can also be ensured.

[0042] In the present invention, gas can be sprayed onto the corresponding positioning block along a preset direction or toward the center of the base through a gas channel to independently control the moving direction of the positioning block, thereby improving the flexibility and efficiency of the tray position adjustment, and further enabling rapid alignment of the tray center and the base center.

[0043] In the present invention, after the centers of the tray and the base coincide with each other, if the base rotates, gas can also be sprayed onto the corresponding positioning block along a preset direction or toward the center of the base through the gas channel, so that the positioning block is stationary relative to the rotating base, thereby ensuring that the positioning block will not shake in the corresponding groove during the rotation of the base, thereby making the tray stationary relative to the rotating base, that is, fixing the position of the tray, so that the centers of the tray and the base still coincide with each other during the rotation of the base.

[0044] In the vapor deposition equipment provided by the present invention, the photoelectric detection mechanism can detect the deviation between the center of the tray and the center of the base to obtain a deviation signal; the signal processing mechanism can determine whether the position of the tray needs to be corrected according to the deviation signal, and when the position of the tray needs to be corrected, the signal processing mechanism sends the first gas data required to make the center of the tray coincide with the center of the base to the gas control mechanism; the gas control mechanism can select the gas channel that needs to spray gas according to the first gas data, and control the gas flow and gas pressure of the selected gas channel sprayed to the positioning block to drive the positioning block to move so that the center of the tray and the base coincide. The present invention can adjust the position of the tray in real time, automatically and accurately, effectively improving the efficiency and accuracy of the tray position adjustment.

[0045] When the signal processing mechanism in the present invention determines that there is no need to correct the position of the tray based on the deviation signal, if the base is in a rotating state, the signal processing mechanism sends the second gas data required to make the tray stationary relative to the rotating base to the gas control mechanism; the gas control mechanism selects the gas channel that needs to spray gas based on the second gas data, and controls the gas flow and gas pressure sprayed to the positioning block through the selected gas channel, so that the positioning block is stationary relative to the rotating base, so that the tray is stationary relative to the rotating base, thereby ensuring that the centers of the tray and the base remain coincident during the rotation of the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 is a schematic structural diagram of a vapor deposition device provided by one embodiment of the present invention;

[0047] Figure 2 It is a structural schematic diagram of a tray and a positioning block in a wafer carrying device provided by an embodiment of the present invention;

[0048] Figure 3 It is a structural schematic diagram of a base in a wafer carrying device provided by an embodiment of the present invention;

[0049] Figure 4 It is a structural schematic diagram of a wafer carrying device provided by an embodiment of the present invention when the first side walls in two opposite first grooves connected with the gas channel are not located on the same side;

[0050] Figure 5It is a structural schematic diagram of a wafer carrying device provided by an embodiment of the present invention when first side walls in two opposite first grooves connected with a gas channel are located on the same side;

[0051] Figure 6 is a longitudinal cross-sectional schematic diagram of a gas channel in a wafer carrying device provided by an embodiment of the present invention;

[0052] Figure 7 is a structural schematic diagram of a second groove in a wafer carrying device provided by another embodiment of the present invention;

[0053] Figure 8 is a structural schematic diagram of a base in a wafer carrying device provided by another embodiment of the present invention;

[0054] Fig. 9 It is a structural schematic diagram of the inner side walls on both sides of two adjacent third grooves in a wafer carrying device provided by another embodiment of the present invention being connected with the gas channel;

[0055] Fig.10 It is a structural schematic diagram of a wafer carrying device provided by another embodiment of the present invention, in which the inner side walls on both sides of each third groove are connected to the gas channel;

[0056] Fig.11 is a longitudinal cross-sectional schematic diagram of a gas channel in a wafer carrying device provided by another embodiment of the present invention;

[0057] Fig.12 It is a structural schematic diagram of a tray and a positioning block in a wafer carrying device provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0058] The following is a further detailed description of the wafer carrier device, vapor deposition equipment and method of use proposed in the present invention in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that can be produced by the present invention and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0059] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0060] Embodiment 1

[0061] Combined with Figures 1 to 6 As shown, the present embodiment provides a wafer carrying device for a reaction chamber 100 of a vapor deposition device, the wafer carrying device comprising: a rotatable base 110, arranged at the inner bottom of the reaction chamber 100; a tray 120, arranged on the base 110, for carrying a wafer 101; and a positioning block 121 is provided on the surface of the tray 120 facing the base 110, and a positioning groove 111 matching the positioning block 121 is provided on the base 110, and the positioning block 121 cooperates with the positioning groove 111 to align the tray 101. The tray 120 is positioned; and a gas channel 130 is arranged in the base 110, for spraying gas to the positioning block 121 to control the position of the tray 120 (including position adjustment and position fixation), so that the centers of the tray 120 and the base 110 tend to coincide; wherein, the adjustment of the position of the tray 120 refers to moving the position of the tray 120 relative to the base 110, and the fixing of the position of the tray 120 refers to keeping the tray 120 stationary relative to the base 110.

[0062] It is understandable that the wafer carrying device further includes: a heater 140, which is disposed in the base 110 and is used to heat the wafer 101 to a preset temperature.

[0063] Specifically, in this embodiment, when the tray 120 is placed on the stationary base 110, the positioning block 121 on the bottom surface of the tray 120 (i.e., the surface of the tray facing the base) can be placed in the positioning groove 111 accordingly. At this time, the initial positioning of the tray 120 can be achieved through the cooperation between the positioning block 121 and the positioning groove 111, thereby achieving a rough alignment of the centers of the tray 120 and the base 110. After the tray 120 is placed on the base 110, whether the base 110 is in a stationary state or a rotating state, if the centers of the tray 120 and the base 110 do not coincide, the gas with a certain flow rate can be sprayed to the positioning block 121 through the gas channel 130 to generate a first driving force to move the positioning block 121 in the corresponding positioning groove 111, thereby accurately adjusting the position of the tray 120, and then making the centers of the tray 120 and the base 110 coincide. After the centers of the tray 120 and the base 110 are aligned, if the base 110 rotates, the gas can also be sprayed toward the positioning block 121 through the gas channel 130 to generate a second driving force to make the positioning block 121 stationary relative to the rotating base 110, that is, to fix the position of the positioning block 121, thereby ensuring that the positioning block 121 does not shake in the corresponding positioning groove 111 during the rotation of the base 110, so that the tray 120 is stationary relative to the rotating base 110, that is, to fix the position of the tray 120, thereby ensuring that the centers of the tray 120 and the base 110 still overlap during the rotation of the base 110.

[0064] Further, the gas channel 130 can be connected to a gas supply device (not shown in the figure), and the gas is stored in the gas supply device; optionally, the gas is an inert gas or nitrogen to prevent the gas from affecting the film forming process. The end of the base 110 away from the tray 120 (i.e., the bottom end of the base) can be connected to a rotating mechanism 170, and when the rotating mechanism 170 rotates, it drives the base 110 to rotate synchronously, thereby driving the tray 120 and the wafer 101 on the base 110 to rotate synchronously to meet the deposition process requirements; optionally, the rotating mechanism 170 is a motor, but the present invention is not limited to this, as long as it can drive the base 110 to rotate.

[0065] More specifically, the heater 140 is arranged at one end of the base 110 close to the tray 120 (i.e., the top of the base); when the centers of the tray 120 and the base 110 coincide, the heater 140 can uniformly heat the tray 120 so that the temperature distribution on the tray 120 is uniform, so that the wafer 101 can be uniformly heated to the preset temperature through the tray 120, so that a uniform thin film is formed on the surface of the wafer 101. Optionally, the preset temperature is less than or equal to 1000°C; and below 1000°C, the width of the positioning groove 111 on the base 110 (i.e., the distance of the positioning groove in the circumferential direction of the base) is greater than the width of the positioning block 121 (i.e., the distance of the positioning block in the circumferential direction of the tray), so that when the heater 140 heats the tray 120 and the wafer 101, even if the positioning block 121 and the positioning groove 111 are expanded and deformed due to heat, the expanded positioning block 121 can still be moved in the expanded positioning groove 111, thereby ensuring that the position of the tray 120 can always be adjusted throughout the entire deposition process, so that the centers of the tray 120 and the base 110 always coincide during the entire deposition process, ensuring uniform temperature distribution on the tray 120 and the wafer 101 during the entire deposition process.

[0066] Please continue to refer to Figures 3 to 6 The positioning groove 111 includes at least four first grooves 1110, the first grooves 1110 are evenly distributed along the circumference of the base 110, and the number of the first grooves 1110 is an even number; the first groove 1110 includes two opposite first side walls 1111, and only one of the first side walls 1111 in the same first groove 1110 is connected to the gas channel 130.

[0067] It can be understood that the gas channel 130 includes: a first gas inlet channel 1303, which is connected to the gas supply device; a first driving gas hole 1301, whose inlet end is connected to the first gas inlet channel 1303, and whose outlet end penetrates the side wall of the corresponding groove, and is used to spray the gas in a preset direction onto the positioning block 121 in the corresponding groove. Optionally, the first driving gas hole 1301 is a strip hole, and the preset direction is consistent with the length direction of the first driving gas hole 1301.

[0068] Specifically, in the present embodiment, all the first grooves 1110 are arranged at one end of the base 110 close to the tray 120; and the number of the first grooves 1110 can be the same as the number of the positioning blocks 121 fixed on the bottom surface of the tray 120, so that one positioning block 121 can be placed in each of the first grooves 1110, so that when the centers of the tray 120 and the base 110 do not coincide, the position of the tray 120 can be adjusted in multiple directions by moving the positioning block 121 in each of the first grooves 1110, and after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the position of the tray 120 can be fixed by fixing the positioning block 121 in any of the first grooves 1110; at the same time, all the first grooves 1110 are evenly distributed along the circumference of the base 110, and correspondingly, all the positioning blocks 121 can be evenly distributed along the circumference of the tray 120 to ensure the uniformity of the position adjustment of the tray 120. More specifically, each of the positioning blocks 121 may include two first positioning side walls 1211 (eg, Figure 2 As shown in FIG. 1 , when the positioning blocks 121 are placed in the first grooves 1110 in a one-to-one correspondence, the first positioning side walls 1211 of the positioning blocks 121 are arranged opposite to the first side walls 1111 of the first grooves 1110. Preferably, the positioning blocks 121 are rectangular parallelepiped, but the present invention is not limited thereto.

[0069] Specifically, in this embodiment, only one first side wall 1111 in the same first groove 1110 is connected to the gas channel 130 , and the number of the gas channels 130 is the same as the number of the first grooves 1110 . Furthermore, the gas can be separately supplied to the first groove 1110 connected to the gas channel 130 along the preset direction through the gas channel 130, so that when the centers of the tray 120 and the base 110 do not coincide, the moving direction of the positioning block 121 in the first groove 1110 can be independently controlled, so that the position of the tray 120 can be independently regulated in the preset direction, thereby improving the flexibility and efficiency of the position adjustment of the tray 120, and realizing the rapid alignment of the center of the tray 120 and the center of the base 110; in addition, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the positioning block 121 in the first groove 1110 can be relatively stationary relative to the rotating base 110, so that the tray 120 can be relatively stationary relative to the rotating base, thereby realizing the fixation of the position of the tray 120.

[0070] More specifically, the first air inlet channel 1303 in each of the gas channels 130 can be vertically arranged in the base 110, and the inlet end of the first air inlet channel 1303 is connected to the air supply device; the first driving air hole 1301 is located at one end of the base 110 close to the tray 120, and the first driving air hole 1301 can be horizontally arranged in the base 110, and at the same time, the inlet end of the first driving air hole 1301 is connected to the outlet end of the first air inlet channel 1303, and the outlet end of the first driving air hole 1301 passes through a first side wall 1111 corresponding to the first groove 1110 and then communicates with the first groove 1110, so that the gas in the air supply device can pass through the first air inlet channel 1303 and the first driving air hole 1301 are supplied to the first groove 1110 along the preset direction, so that the gas is sprayed onto the first positioning side wall 1211 of the positioning block 121 in the first groove 1110 along the preset direction, and then when the centers of the tray 120 and the base 110 do not coincide, a first driving force is generated to drive the positioning block 121 to move along the preset direction to adjust the position of the tray 120 in the preset direction, or after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, a second driving force is generated to make the positioning block 121 stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110. Optionally, the first driving air hole 1301 is a strip-shaped hole, which can shorten the flow path of the gas in the first driving air hole 1301 as much as possible and reduce the flow resistance of the gas, so that the gas can be quickly sprayed onto the positioning block 121, thereby improving the efficiency of adjusting the position of the tray 120 and the stability of the fixed position of the tray 120, but the present invention is not limited to this.

[0071] Please continue to refer to Figure 4 and Figure 5 The first side walls 1111 in the two first grooves 1110 opposite to each other with respect to the center of the base 110 and connected to the gas channel 130 may not be located at or may be located at the same side.

[0072] Specifically, the number of the first grooves 1110 is set to 2m (m≥2). If the first side walls 1111 in the two first grooves 1110 that are opposite to each other with respect to the center of the base 110 and that are connected to the gas channel 130 are not located on the same side, the gas can be supplied to the first grooves 1110 from 2m directions through the gas channel 130, so that when the centers of the tray 120 and the base 110 do not coincide, the gas generates a first driving force in the 2m directions, driving the corresponding positioning blocks 121 to move, thereby independently adjusting the position of the tray 120 in the 2m directions; in addition, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the gas supplied to the first grooves 1110 from 2m directions can generate a second driving force in the 2m directions, so that each positioning block 121 is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110. For example, Figure 4 As shown, the number of the first grooves 1110 is 4, and the first side walls 1111 in the two first grooves 1110 opposite to each other with respect to the center of the base 110 and connected to the gas channel 130 are not located on the same side. At this time, the gas can be respectively introduced into the corresponding first grooves 1110 along the four directions of X+, X-, Y+, and Y- through the gas channel 130; wherein, when the centers of the tray 120 and the base 110 do not coincide, when the gas generates a first driving force in the X+ direction to move the corresponding positioning block 121, the tray 120 as a whole will move in the X+ direction, thereby adjusting the position of the tray 120 in the X+ direction. adjustment; similarly, the gas can also generate a first driving force in the X-, Y+, and Y- directions to drive the corresponding positioning block 121 to move, so as to adjust the position of the tray 120 in the X-, Y+, and Y- directions respectively, so that the centers of the tray 120 and the base 110 coincide with each other; further, after the centers of the tray 120 and the base 110 coincide with each other and the base 110 rotates, the gas can also generate a second driving force in the X+, X-, Y+, and Y- directions, so that each positioning block 121 is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110.

[0073] Specifically, if the first side walls 1111 that are connected to the gas channel 130 in the two first grooves 1110 that are opposite to each other with respect to the center of the base 110 are located on the same side, the gas can be supplied to the first grooves 1110 from m directions through the gas channel 130, so that when the centers of the tray 120 and the base 110 do not coincide, the gas generates a first driving force in m directions, driving the corresponding positioning blocks 121 to move, thereby independently adjusting the position of the tray 120 in m directions; in addition, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the gas supplied to the first grooves 1110 from m directions can generate a second driving force in m directions, so that each positioning block 121 is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110. For example, Figure 5 As shown, the number of the first grooves 1110 is 4, and the first side walls 1111 of the two first grooves 1110 opposite to the center of the base 110 and connected to the gas channel 130 are located on the same side. At this time, the gas can be introduced into the corresponding first grooves 1110 along the X+ and Y+ directions through the gas channel 130, so that when the centers of the tray 120 and the base 110 do not coincide, the gas generates a first driving force in the X+ and Y+ directions to drive the corresponding positioning block 121 to move, so as to adjust the position of the tray 120 in the X+ and Y+ directions, so that the centers of the tray 120 and the base 110 coincide with each other; further, after the centers of the tray 120 and the base 110 coincide with each other and the base 110 rotates, the gas can also generate a second driving force in the X+ and Y+ directions, so that each positioning block 121 is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110.

[0074] Embodiment 2

[0075] Combined with Figures 1 to 3 As shown in , 6 and 7, different from the first embodiment, the positioning groove 111 in this embodiment includes at least four second grooves 1120, the second grooves 1120 are evenly distributed along the circumference of the base 110, and the number of the second grooves 1120 is an even number; the second groove 1120 includes two opposite second side walls 1121, and each of the second side walls 1121 is connected to the gas channel 130.

[0076] Specifically, in this embodiment, all the second grooves 1120 are arranged at one end of the base 110 close to the tray 120; and the number of the second grooves 1120 can be the same as the number of the positioning blocks 121 fixed on the bottom surface of the tray 120, so that one positioning block 121 can be placed in each of the second grooves 1120, so that when the centers of the tray 120 and the base 110 do not coincide, the position of the tray 120 can be adjusted in multiple directions by moving the positioning block 121 in each of the second grooves 1120, and after the centers of the tray 120 and the base 110 coincide and when the base 110 rotates, the position of the tray 120 can be fixed by fixing the position of the positioning block 121 in any of the second grooves 1120; at the same time, all the second grooves 1120 are evenly distributed along the circumference of the base 110 to ensure the uniformity of the position adjustment of the tray 120. More specifically, when the positioning blocks 121 are placed in the second grooves 1120 in a one-to-one correspondence, the first positioning side walls 1211 (such as Figure 2 As shown) is arranged opposite to the second side wall 1121 of the second groove 1120.

[0077] Specifically, in this embodiment, the two second side walls 1121 in the same second groove 1120 are respectively connected to the gas channel 130, and the number of the gas channels 130 is twice the number of the second grooves 1120. Further, the gas can be supplied to the second groove 1120 connected to the gas channel 130 along the preset direction through one gas channel 130, so that when the centers of the tray 120 and the base 110 do not coincide, the moving direction of the positioning block 121 in the second groove 1120 can be independently controlled, thereby independently adjusting the position of the tray 120 in the preset direction; in addition, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the positioning block 121 in the second groove 1120 is relatively stationary relative to the rotating base 110, so that the tray 120 is relatively stationary relative to the rotating base, thereby achieving the fixation of the position of the tray 120. More specifically, the outlet end of the first driving air hole 1301 in each of the gas channels 130 passes through the second side wall 1121 of the corresponding second groove 1120 and then communicates with the second groove 1120, so that the gas can pass through the first air inlet channel 1303 and the first driving air hole 1301 and be supplied to the second groove 1120 along the preset direction, so that the gas is sprayed onto the first positioning side wall 1211 of the positioning block 121 in the second groove 1120 along the preset direction, and then when the centers of the tray 120 and the base 110 do not coincide, a first driving force is generated to drive the positioning block 121 to move along the preset direction to adjust the position of the tray 120 in the preset direction, or after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, a second driving force is generated to make the positioning block 121 stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110.

[0078] Specifically, in this embodiment, the number of the second grooves 1120 is set to 2p (p≥2), and the gas can be supplied to the second grooves 1120 from 2p directions through the gas channel 130, so that when the centers of the tray 120 and the base 110 do not coincide, the gas generates a first driving force in 2p directions to drive the corresponding positioning blocks 121 to move, thereby independently adjusting the position of the tray 120 in the 2p directions; in addition, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the gas supplied to the second grooves 1120 from 2p directions can generate a second driving force in 2p directions, so that each positioning block 121 is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110. For example, Figure 7 As shown, the number of the second grooves 1120 is 4, and the gas can be introduced into the corresponding second grooves 1120 along the four directions of X+, X-, Y+, and Y- through the gas channel 130, so that when the centers of the tray 120 and the base 110 do not coincide, the gas generates a first driving force in the X+, X-, Y+, and Y- directions to drive the corresponding positioning block 121 to move, thereby adjusting the position of the tray 120 in the X+, X-, Y+, and Y- directions, respectively, so that the centers of the tray 120 and the base 110 coincide; further, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the gas can also generate a second driving force in the X+, X-, Y+, and Y- directions, so that each of the positioning blocks 121 is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110.

[0079] In addition, in the present embodiment, since the two second side walls 1121 in the same second groove 1120 are respectively connected to the gas channel 130, the gas can be simultaneously supplied to the second groove 1120 through the two gas channels 130 connected to the same second groove 1120, so as to prevent the first positioning side wall 1211 of the positioning block 121 from abutting against the second side wall 1121 corresponding to the second groove 1120 during the process of adjusting the position of the tray 120, thereby preventing the problem of inaccurate positioning of the tray 120 caused by the thermal expansion and deformation of the second side wall 1121; and in this case, during the process of adjusting the position of the tray 120, the two gas channels 130 connected to the same second groove 1120 need to keep supplying the gas to the second groove 1120.

[0080] Embodiment 3

[0081] Combined with Figure 1 , 8 As shown in Figures 1 to 12, different from the first embodiment, the base 110 in this embodiment includes an inner wall 1101 and an outer wall 1102 relative to each other, and the inner wall 1101 is located on the inner side of the outer wall 1102; the positioning groove 111 includes at least four third grooves 1130, and the third grooves 1130 are evenly distributed along the circumference of the base 110, and the number of the third grooves 1130 is an even number; the third groove 1130 includes two relative third side walls 1131; the positioning block 121′ includes a first positioning side wall 1211 arranged opposite to the third side wall 1131 and a second positioning side wall 1212 arranged opposite to the inner wall 1101; the orthographic projection of the second positioning side wall 1212 on the surface where the inner wall 1101 is located at least partially overlaps with the inner wall 1101, and the inner wall 1101 overlapping with the orthographic projection of the second positioning side wall 1212 is connected to the gas channel 130′.

[0082] It can be understood that the gas channel 130' includes: a second gas inlet channel 1304, which is connected to the gas supply device; a second driving gas hole 1302, whose inlet end is connected to the second gas inlet channel 1304, and whose outlet end penetrates the inner side wall 1101, and is used to spray the gas onto the second positioning side wall 1212 corresponding to the positioning block 121'. Optionally, the spray direction of the gas is toward the center of the base 110.

[0083] Specifically, in this embodiment, all the third grooves 1130 are arranged at one end of the base 110 close to the tray 120; and the number of the third grooves 1130 can be the same as the number of the positioning blocks 121' fixed on the bottom surface of the tray 120, so that one positioning block 121' can be placed in each of the third grooves 1130, so that when the centers of the tray 120 and the base 110 do not coincide, the positioning blocks 121' in each of the third grooves 1130 can be moved to achieve a plurality of The position of the tray 120 can be adjusted in the direction and when the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the position of the tray 120 is fixed by fixing the positioning block 121 in any of the third grooves 1130; at the same time, all the third grooves 1130 are evenly distributed along the circumference of the base 110, and correspondingly, all the positioning blocks 121′ can be evenly distributed along the circumference of the tray 120 to ensure the uniformity of the position adjustment of the tray 120.

[0084] More specifically, Fig.12As shown, each of the positioning blocks 121′ includes not only two oppositely arranged first positioning side walls 1211, but also two second positioning side walls 1212 connected to the first positioning side walls 1211 at an angle; and when the positioning blocks 121′ are placed one by one in the third groove 1130, the first positioning side walls 1211 of the positioning blocks 121′ are arranged opposite to the third side walls 1131 of the third groove 1130, and the second positioning side walls 1212 are arranged opposite to the inner side walls 1101 of the base 110. Optionally, the base 110 is a cylinder, and the second positioning side wall 1212 is an arc-shaped side wall; and the second positioning side wall 1212 can be connected to the first positioning side wall 1211 at 90 degrees or approximately 90 degrees, that is, the positioning block 121′ is a T-shaped body, so that after the inner side walls 1101 on both sides of the same third groove 1130 are connected to the gas channel 130′, the gas channel 130′ on both sides of the third groove 1130 can spray the gas to the two second positioning side walls 1212 corresponding to the positioning block 121′ to ensure the stability of the movement of the positioning block 121′.

[0085] Specifically, in this embodiment, the second air inlet channel 1304 in the gas channel 130′ can be vertically arranged in the base 110, and the inlet end of the second air inlet channel 1304 is connected to the air supply device; the second driving air hole 1302 is located at one end of the base 110 close to the tray 120, and the second driving air hole 1302 can be horizontally arranged in the base 110, and at the same time, the inlet end of the second driving air hole 1302 is connected to the outlet end of the second air inlet channel 1304, and the outlet end of the second driving air hole 1302 passes through the inner side wall 1101 that coincides with the positive projection of the second positioning side wall 1212 of the positioning block 121′, so that the air supply device in the gas supply device is not blocked. The gas can be sprayed onto the second positioning side wall 1212 of the positioning block 121′ through the second air inlet channel 1304 and the second driving air hole 1302, thereby generating a first driving force to drive the positioning block 121′ to move toward the center of the base 110 to adjust the position of the tray 120 when the centers of the tray 120 and the base 110 do not coincide with each other, or generating a second driving force to make the positioning block 121′ stationary relative to the rotating base 110 when the centers of the tray 120 and the base 110 coincide with each other and the base 110 rotates, so that the tray 120 is stationary relative to the rotating base 110, that is, the position of the tray 120 is fixed. Optionally, the second driving air hole 1302 is a strip hole to shorten the flow path of the gas in the second driving air hole 1302 as much as possible and reduce the flow resistance of the gas, so that the gas can be quickly sprayed onto the positioning block 121' to improve the efficiency of adjusting the position of the tray 120 and the stability of fixing the position of the tray 120.

[0086] More specifically, in this embodiment, the gas can be individually sprayed along the direction toward the center of the base 110 onto the second positioning side wall 1212 corresponding to the positioning block 121′ through the gas channel 130′. In this way, when the centers of the tray 120 and the base 110 do not coincide, the moving direction of the positioning block 121′ can be independently controlled, thereby improving the flexibility and efficiency of the position adjustment of the tray 120 and achieving rapid alignment of the center of the tray 120 and the center of the base 110.

[0087] Please continue to refer to Fig. 9, all the third grooves 1130 form a regular 2n-gon (that is, the number of the third grooves 1130 is 2n) and n≥2, wherein the inner side walls 1101 on both sides of the n adjacent third grooves 1130 are connected to the gas channels 130′, and the number of the gas channels 130′ is the same as the number of the third grooves 1130; at this time, the gas can be sprayed from n directions to the corresponding positioning blocks 121′ through the gas channels 130′, so that the gas does not overlap the centers of the tray 120 and the base 110. When the first driving force is generated in n directions to drive the corresponding positioning block 121' to move, the position of the tray 120 is adjusted independently in n directions; in addition, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the gas sprayed from n directions to the corresponding positioning block 121' can generate a second driving force in n directions, so that each positioning block 121' is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110. For example, Fig. 9 As shown, the number of the third grooves 1130 is 4, and the inner side walls 1101 on both sides of two adjacent third grooves 1130 are connected to the gas channel 130′. At this time, the gas can be sprayed to the corresponding positioning block 121′ along the X- and Y-directions through the gas channel 130′, so that the gas generates a first driving force in the X- and Y-directions to drive the corresponding positioning block 121′ to move, so as to adjust the position of the tray 120 in the X- and Y-directions, respectively, so that the centers of the tray 120 and the base 110 coincide with each other; further, after the centers of the tray 120 and the base 110 coincide with each other and the base 110 rotates, the gas can also generate a second driving force in the X- and Y-directions, so that each positioning block 121′ is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110.

[0088] Please continue to refer to Fig.10In some embodiments, the inner sidewalls 1101 on both sides of each of the third grooves 1130 are connected to the gas channels 130 ′, and the number of the gas channels 130 ′ is twice the number of the third grooves 1130 . Specifically, the number of the third grooves 1130 is also set to 2n (n≥2), and the gas can be sprayed from 2n directions to the corresponding positioning blocks 121' through the gas channel 130', so that when the centers of the tray 120 and the base 110 do not coincide, the gas generates a first driving force in 2n directions to drive the corresponding positioning blocks 121' to move, thereby independently adjusting the position of the tray 120 in the 2n directions; in addition, after the centers of the tray 120 and the base 110 coincide and the base 110 rotates, the gas sprayed from 2n directions to the corresponding positioning blocks 121' can generate a second driving force in 2n directions, so that each positioning block 121' is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110. For example, Fig.10 As shown, the number of the third grooves 1130 is 4, and the inner side walls 1101 on both sides of each of the third grooves 1130 are connected to the gas channel 130'. At this time, the gas can be sprayed to the corresponding positioning block 121' along the four directions of X+, X-, Y+, and Y- through the gas channel 130', so that when the centers of the tray 120 and the base 110 do not coincide, the gas generates a first driving force in the X+, X-, Y+, and Y- directions to drive the corresponding positioning block 121' to move. Thereby, the position of the tray 120 is adjusted in the X+, X-, Y+, and Y- directions respectively, so that the centers of the tray 120 and the base 110 coincide with each other; further, after the centers of the tray 120 and the base 110 coincide with each other and the base 110 rotates, the gas can also generate a second driving force in the X+, X-, Y+, and Y- directions, so that each of the positioning blocks 121′ is stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110.

[0089] In addition, since the inner side walls 1101 on both sides of each of the third grooves 1130 are connected to the gas channel 130′, the gas can be simultaneously sprayed toward the two positioning blocks 121′ opposite to each other with respect to the center of the base 110 through the gas channels 130′ on both sides of the two third grooves 1130 opposite to each other with respect to the center of the base 110, so as to prevent the second positioning side walls 1212 of the positioning blocks 121′ from abutting against the inner side walls 1101 of the base 110 during the process of adjusting the position of the tray 120, thereby avoiding the problem of inaccurate positioning of the tray 120 caused by the thermal expansion and deformation of the inner side walls 1101; and in this case, during the process of adjusting the position of the tray 120, the gas channels 130′ on both sides of the two third grooves 1130 opposite to each other with respect to the center of the base 110 need to keep spraying the gas toward the corresponding positioning blocks 121′, but the present invention is not limited to this.

[0090] On the other hand, this embodiment further provides a vapor deposition device, which includes: a reaction chamber 100; and a wafer carrying device as described in the first embodiment, the second embodiment or the third embodiment but not limited to the above embodiments.

[0091] It can be understood that the vapor deposition equipment also includes: a position adjustment system; and the position adjustment system includes: a photoelectric detection mechanism 150, which is arranged on the side wall of the reaction chamber 100, and is used to detect the deviation between the center of the tray 120 and the center of the base 110 and generate a deviation signal; a signal processing mechanism (not shown in the figure), which is connected to the photoelectric detection mechanism 150, and is used to determine whether it is necessary to correct the position of the tray 120 according to the deviation signal, and is also used to obtain the first gas flow rate and the first gas pressure required to make the center of the tray 120 coincide with the center of the base 110 when the position of the tray 120 needs to be corrected, and is also used to obtain the second gas flow rate and the second gas pressure required to make the tray 120 stationary relative to the base 110 when the position of the tray 120 does not need to be corrected and the base 110 rotates; a gas control mechanism (not shown in the figure), which is connected to the signal processing mechanism and the gas channel (such as Figure 6 130 or as shown Fig.11 130′) is connected to control the gas channel to spray to the positioning block (such as Figure 2 121 as shown or Fig.12 121′) to adjust the gas flow rate and pressure so that the centers of the tray 120 and the base 110 tend to coincide.

[0092] Specifically, in this embodiment, an observation window 160 is provided on the side wall of the reaction chamber 100, and the photoelectric detection mechanism 150 may be a laser distance measuring device. The photoelectric detection mechanism 150 may transmit a detection signal to the tray 120 in a stationary state or a high-speed rotating state through the observation window 160, so as to detect the deviation between the center of the tray 120 and the center of the base 110 in a regular or real-time manner during the entire deposition process, thereby obtaining the deviation signal. More specifically, when the signal processing mechanism determines that the position of the tray 120 needs to be corrected according to the deviation signal, the signal processing mechanism will send the first gas data (including the first gas flow rate and the first gas pressure) required to make the center of the tray 120 coincide with the center of the base 110 to the gas control mechanism; the gas control mechanism selects the gas channel that needs to spray the gas according to the first gas data, and controls the selected gas channel to spray the gas with the first gas flow rate and the first gas pressure to the positioning block, so as to generate a first driving force to move the positioning block, thereby completing one adjustment of the position of the tray 120. In addition, after completing one adjustment of the position of the tray 120, the photoelectric detection mechanism 150 generates a new deviation signal. If the signal processing mechanism determines that the position of the tray 120 needs to be corrected based on the new deviation signal, the position of the tray 120 is adjusted again through the gas control mechanism and the gas channel until the signal processing mechanism determines that the position of the tray 120 does not need to be corrected based on the deviation signal, that is, the centers of the tray 120 and the base 110 coincide.

[0093] Furthermore, when the signal processing mechanism determines that there is no need to correct the position of the tray 120 based on the deviation signal, if the base 110 is in a rotating state, the signal processing mechanism will send the second gas data (including a second gas flow rate and a second gas pressure) required to make the tray 120 stationary relative to the rotating base 110 to the gas control mechanism; the gas control mechanism selects the gas channel that needs to spray the gas based on the second gas data, and controls the selected gas channel to spray the gas with the second gas flow rate and the second gas pressure to the positioning block, so as to generate a second driving force to make the positioning block stationary relative to the rotating base 110, so as to make the tray 120 stationary relative to the rotating base 110, thereby ensuring that the centers of the tray 120 and the base 110 remain coincident during the rotation of the base 110.

[0094] In addition, when the signal processing mechanism determines that the position of the tray 120 does not need to be corrected based on the deviation signal, if the base 110 is in a stationary state, the signal processing mechanism will not send gas data to the gas control mechanism, and the gas channel will not spray the gas.

[0095] On the other hand, the present embodiment also provides a method for using the wafer carrier device as described in the first embodiment, the second embodiment or the third embodiment but not limited to the above embodiments, the method comprising: step S1, placing the tray 120 on the base 110, and passing the positioning block (such as Figure 2 121 as shown or Fig.12 121′) cooperates with the positioning groove 111 to position the tray 120; step S2, through the gas channel (such as Figure 6 130 or as shown Fig.11 130 ′) as shown, sprays gas toward the positioning block so that the centers of the tray 120 and the base 110 tend to coincide.

[0096] It can be understood that the step S2 includes: step S21, spraying the gas to the positioning block through the gas channel to generate a first driving force to drive the positioning block to move, so that the centers of the tray 120 and the base 110 tend to coincide; or step S22, spraying the gas to the positioning block through the gas channel to generate a second driving force to make the positioning block stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110.

[0097] It can be understood that before step S2, it also includes detecting whether the center of the tray 120 deviates from the center of the base 110. If so, step S21 is executed; if not and the base 110 rotates, step S22 is executed; if not and the base 110 does not rotate, step S2 is not executed.

[0098] Specifically, in this embodiment, before executing the step S2, if it is detected that the center of the tray 120 deviates from the center of the base 110, it is also necessary to obtain the first gas data (including the first gas flow rate and the first gas pressure) required to make the center of the tray 120 coincide with the center of the base 110. When executing the step S21, the gas channel that needs to spray the gas can be selected according to the first gas data, and the selected gas channel can be controlled to spray the gas with the first gas flow rate and the first gas pressure to the positioning block to generate a first driving force to move the positioning block, thereby completing an adjustment of the position of the tray 120. In addition, after completing an adjustment of the position of the tray 120, it is necessary to re-detect whether the center of the tray 120 deviates from the center of the base 110. If deviated, the step S21 is executed again until it is detected that the center of the tray 120 does not deviate from the center of the base 110, that is, the centers of the tray 120 and the base 110 coincide.

[0099] Specifically, in this embodiment, before executing the step S2, if it is detected that the center of the tray 120 does not deviate from the center of the base 110 and the base 110 rotates, it is also necessary to obtain the second gas data (including the second gas flow rate and the second gas pressure) required to make the tray 120 stationary relative to the rotating base 110. When executing the step S22, the gas channel that needs to spray the gas can be selected according to the second gas data, and the selected gas channel can be controlled to spray the gas with the second gas flow rate and the second gas pressure to the positioning block to generate a second driving force to make the positioning block stationary relative to the rotating base 110, so that the tray 120 is stationary relative to the rotating base 110, thereby ensuring that the centers of the tray 120 and the base 110 still coincide during the rotation of the base 110.

[0100] In summary, the present embodiment provides a wafer carrier, vapor deposition equipment and use method, wherein a tray for carrying wafers in the wafer carrier is arranged on a rotatable base, a positioning block is arranged on the surface of the tray facing the base, a positioning groove matching the positioning block is arranged on the base, and the tray can be positioned by the positioning block and the positioning groove; at the same time, a gas channel is also arranged in the base, and gas can be sprayed to the positioning block through the gas channel to achieve precise control of the position of the tray (including position adjustment and position fixation), so that the centers of the tray and the base tend to coincide, thereby ensuring uniform temperature distribution on the tray and the wafer. In the present embodiment, the positioning groove may include at least four grooves, and all the grooves are evenly distributed along the circumference of the base; correspondingly, the number of positioning blocks is the same as the number of grooves, and all the positioning blocks can be evenly distributed along the circumference of the tray, so that a positioning block can be placed in each groove, so that the position of the tray can be adjusted in multiple directions by moving the positioning block in each groove, and the uniformity of the adjustment of the position of the tray can also be ensured. In addition, in this embodiment, gas can be sprayed onto the corresponding positioning block in a preset direction or in a direction toward the center of the base through a gas channel, so as to independently control the moving direction of the positioning block, thereby improving the flexibility and efficiency of adjusting the position of the tray, and further enabling rapid alignment of the center of the tray and the center of the base. After the centers of the tray and the base coincide, if the base rotates, gas can also be sprayed onto the corresponding positioning block in a preset direction or in a direction toward the center of the base through the gas channel, so that the positioning block is stationary relative to the rotating base, thereby ensuring that the positioning block does not shake in the corresponding groove during the rotation of the base, and further making the tray stationary relative to the rotating base, that is, fixing the position of the tray, so that the centers of the tray and the base still coincide during the rotation of the base.

[0101] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A wafer carrier device, used in a reaction chamber of a vapor deposition device, characterized in that: The wafer carrying device comprises: A rotatable base is disposed at the inner bottom of the reaction chamber; A tray is arranged on the base and used to carry wafers; a positioning block is arranged on the surface of the tray facing the base, and a positioning groove matching the positioning block is arranged on the base, and the tray is positioned by the cooperation between the positioning block and the positioning groove; and A gas channel is arranged in the base and is used for spraying gas toward the positioning block so that the centers of the tray and the base tend to coincide.

2. The wafer carrier device according to claim 1, characterized in that: The positioning groove includes at least four first grooves, the first grooves are evenly distributed along the circumference of the base, and the number of the first grooves is an even number; the first groove includes two opposite first side walls, and only one of the first side walls in the same first groove is connected to the gas channel.

3. The wafer carrier device according to claim 2, characterized in that: The first side walls communicating with the gas channel in the two first grooves opposite to each other with respect to the center of the base are not located or are located on the same side.

4. The wafer carrier device according to claim 1, characterized in that: The positioning groove includes at least four second grooves, the second grooves are evenly distributed along the circumference of the base, and the number of the second grooves is an even number; the second groove includes two opposite second side walls, and each of the second side walls is connected to the gas channel.

5. The wafer carrier device according to any one of claims 2 to 4, characterized in that: The gas channel includes: a first air inlet channel connected to the air supply device; a first driving air hole, whose inlet end is connected to the first air inlet channel and whose outlet end passes through the side wall of the corresponding groove, and is used to spray the gas in a preset direction onto the positioning block in the corresponding groove.

6. The wafer carrier device according to claim 5, characterized in that: The first driving air hole is a strip-shaped hole, and the preset direction is consistent with the length direction of the first driving air hole.

7. The wafer carrier device according to claim 1, characterized in that: The base includes an inner side wall and an outer side wall opposite to each other, and the inner side wall is located inside the outer side wall; The positioning groove includes at least four third grooves, the third grooves are evenly distributed along the circumference of the base, and the number of the third grooves is an even number; the third groove includes two opposite third side walls; The positioning block comprises a first positioning side wall arranged opposite to the third side wall and a second positioning side wall arranged opposite to the inner side wall; The orthographic projection of the second positioning side wall on the surface where the inner side wall is located at least partially overlaps with the inner side wall, and the inner side wall overlapping with the orthographic projection of the second positioning side wall is in communication with the gas channel.

8. The wafer carrier device according to claim 7, characterized in that: All the third grooves form a regular 2n-gon with n≥2, wherein the inner side walls on both sides of n adjacent third grooves are in communication with the gas channel.

9. The wafer carrier device according to claim 7, characterized in that: The inner side walls on both sides of each of the third grooves are communicated with the gas channel.

10. The wafer carrier device according to any one of claims 7 to 9, characterized in that: The gas channel includes: a second air inlet channel connected to the air supply device; a second driving air hole, whose inlet end is connected to the second air inlet channel and whose outlet end passes through the inner wall, and is used to spray the gas onto the second positioning side wall corresponding to the positioning block.

11. The wafer carrier device according to claim 10, characterized in that: The jetting direction of the gas is toward the center of the susceptor.

12. The wafer carrier device according to claim 1, characterized in that: Also includes: The heater is arranged in the base and is used for heating the wafer to a preset temperature.

13. The wafer carrier device according to claim 12, characterized in that: Below 1000° C., the width of the positioning groove on the base is greater than the width of the positioning block.

14. The wafer carrier device according to claim 1, characterized in that: The gas is an inert gas or nitrogen.

15. A vapor deposition device, characterized in that: The vapor deposition equipment comprises: a reaction chamber; and a wafer carrying device as claimed in any one of claims 1 to 14.

16. The vapor deposition apparatus according to claim 15, characterized in that The vapor deposition device further includes: a position adjustment system; and the position adjustment system includes: A photoelectric detection mechanism, disposed on the side wall of the reaction chamber, for detecting the deviation between the center of the tray and the center of the base and generating a deviation signal; a signal processing mechanism connected to the photoelectric detection mechanism, and used to determine whether the position of the tray needs to be corrected according to the deviation signal, and also used to obtain a first gas flow rate and a first gas pressure required to make the center of the tray coincide with the center of the base when the position of the tray needs to be corrected; The gas control mechanism is connected to the signal processing mechanism and the gas channel, and is used to control the gas flow and pressure of the gas sprayed from the gas channel to the positioning block, so that the centers of the tray and the base tend to coincide.

17. The vapor deposition apparatus according to claim 16, wherein: The signal processing mechanism is further configured to obtain a second gas flow rate and a second gas pressure required to make the tray stationary relative to the base when there is no need to correct the position of the tray and the base is rotating.

18. A method for using the wafer carrier device according to any one of claims 1 to 14, characterized in that: The method of use includes: Step S1, placing the tray on the base, and positioning the tray by cooperating between the positioning block and the positioning groove; Step S2, spraying gas toward the positioning block through the gas channel so that the centers of the tray and the base tend to coincide with each other.

19. The method for using the wafer carrier as claimed in claim 18, wherein: The step S2 comprises: Step S21, spraying the gas toward the positioning block through the gas channel to generate a first driving force to drive the positioning block to move so that the centers of the tray and the base tend to coincide; or Step S22: spraying the gas toward the positioning block through the gas channel to generate a second driving force to make the positioning block stationary relative to the rotating base, so that the tray is stationary relative to the rotating base.

20. The method for using the wafer carrier as claimed in claim 19, wherein: Before step S2, the method further includes detecting whether the center of the tray deviates from the center of the base, and if so, executing step S21; if not and the base rotates, executing step S22; If there is no deviation and the base does not rotate, step S2 is not performed.

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