Liquid-cooled electronic water pump

Abstract

The invention relates to a liquid-cooled electronic water pump which is characterized in that a waterproof sleeve and a waterproof sleeve sealing ring are respectively arranged on a stator assembly and a pump body, the waterproof sleeve and the pump body are welded into a whole through plastic welding to form a pump body assembly, a rotor assembly and a wear-resistant gasket are sequentially arranged on a fixed shaft of the pump body assembly, and a pump head sealing ring is sleeved on the outer edge of a spigot of the waterproof sleeve; then the pump head and the pump body are welded into a whole through plastic welding to form a water pump assembly, a heat dissipation metal plate sealing ring and a heat dissipation metal plate are installed on the water pump assembly and sealed through the sealing ring to form a water pump assembly assembly, heat conduction glue is coated on the surface of the heat dissipation metal plate, and a driver assembly is placed on the heat conduction glue; the driver assembly is fixed to the water pump assembly combined part through screws, and meanwhile the pump body, the rear cover, the motor leading-out PIN and the plug PIN are welded into a whole to form the liquid-cooled electronic water pump. The effects of miniaturization, high performance, low cost and long service life of the electronic water pump are achieved, and the cooling requirements of various electronic devices in the high-temperature environment are met.

Description

Technical Field

[0001] The invention relates to the technical field of electronic water pumps, in particular to a liquid-cooled electronic water pump. Background Art

[0002] Electronic water pumps are widely used in many fields, such as automotive cooling circulation systems, medical equipment, industrial automation, electronic equipment, etc. Electronic water pumps use brushless motors to drive the impeller to rotate, increase the liquid pressure, and drive water, coolant and other media to circulate; for example, patents CN106640681B and CN206054322U provide two typical electronic water pump installation structure diagrams. The typical structure is the separation of dry and wet cavities, the driver is directly connected to the stator armature, and the driver relies on natural air cooling to dissipate heat. Existing electronic water pumps have heat dissipation problems during use, especially when the driver temperature is too high, which may cause system failure. Traditional heat dissipation methods such as air cooling have limited heat dissipation effects and cannot meet the heat dissipation requirements of high-power equipment. Therefore, there is an urgent need for an effective liquid-cooled electronic water pump to solve this problem. Summary of the invention

[0003] In view of the above problems, the present invention provides a miniaturized liquid-cooled electronic water pump that effectively dissipates heat, improves system stability, reduces costs.

[0004] The technical solution adopted by the present invention to solve the above technical problems is: a liquid-cooled electronic water pump, including a stator assembly, a rotor assembly, a pump head, a wear-resistant gasket, a pump body, a waterproof sleeve, a heat dissipation metal plate, a rear cover, a driver assembly, a waterproof sleeve sealing ring, a heat dissipation metal plate sealing ring and a thermal conductive adhesive, the waterproof sleeve and the waterproof sleeve sealing ring are respectively placed on the stator assembly and the pump body, and the waterproof sleeve and the pump body are welded together by plastic fusion to form a pump body assembly, the center of the waterproof sleeve is plastic-wrapped with a fixed shaft as the rotation center of the water pump, the rotor assembly and the wear-resistant gasket are sequentially installed on the fixed shaft of the pump body assembly, and the pump head sealing ring is inserted into the outside of the waterproof sleeve stop. The pump head is installed on the waterproof cover at the same time, the pump head and the pump body are integrated into a water pump assembly by plastic fusion welding, the heat dissipation metal plate sealing ring and the heat dissipation metal plate are installed on the water pump assembly and sealed by installing the water inlet sealing ring and the water outlet sealing ring to form a water pump assembly assembly, the thermal conductive adhesive is coated on the surface of the heat dissipation metal plate, the driver assembly is placed on the thermal conductive adhesive, and the driver assembly is fixed to the water pump assembly assembly by screws, and the motor lead-out PIN and the plug PIN are welded to the pump body by plastic fusion welding, and the rear cover and the pump body are integrated into a liquid-cooled electronic water pump by plastic fusion welding.

[0005] Preferably, the driver assembly adopts liquid cooling for heat dissipation, and the heat dissipation channel of the driver assembly is heat generating component - PCB copper sheet - thermal conductive adhesive - heat dissipation metal plate - water pump body, and heat exchange occurs in the liquid reservoir formed between the pump body and the heat dissipation metal plate, and the liquid reservoir is composed of a heat dissipation metal plate heat exchange liquid reservoir arranged as a base and a pump body heat exchange liquid reservoir and a pump body flow channel hole arranged on the base, the pump body flow channel hole and the pump body heat exchange liquid reservoir are connected and at least two pump body flow channel holes are provided, a heat dissipation metal plate sealing ring and a pump body are placed on the heat dissipation metal plate, and the heat dissipation metal plate is fitted on the bottom surface of the pump body to form a semi-open heat exchange liquid reservoir.

[0006] Preferably, the heat dissipation metal plate includes a PCB mounting heat dissipation plane and a heat dissipation metal plate mounting sealing surface which are relatively set up, the thermal conductive adhesive is coated on the PCB mounting heat dissipation plane, the heat dissipation metal plate sealing ring is arranged on the heat dissipation metal plate mounting sealing surface, and also includes a heat dissipation metal plate countersunk threaded hole, a heat dissipation metal plate positioning mounting hole, a PCB board mounting hole and a heat exchange liquid storage tank of the heat dissipation metal plate. The heat dissipation metal plate is made of a material with good thermal conductivity, the surface roughness of the heat dissipation metal plate mounting sealing surface Ra≤3.2 and the surface flatness ≤0.05mm, and the depth of the heat exchange liquid storage tank of the heat dissipation metal plate is between 1 and 3mm.

[0007] Preferably, the thickness of the thermally conductive adhesive is between 0.3 and 1.0 mm, and the thermally conductive adhesive is a gel with a thermal conductivity of 1.5 to 5 W / mK.

[0008] Preferably, the pump body includes a heat dissipation metal plate sealing ring mounting groove, a pump body flow channel hole, a pump body heat exchange liquid storage tank, a stator armature grounding PIN, a heat dissipation metal plate positioning column, a PCB board positioning mounting hole, a heat dissipation metal plate mounting hole, a three-phase PIN outlet hole, a heat dissipation metal plate mounting plane and an outlet socket. The heat dissipation metal plate sealing ring mounting groove is arranged on the heat dissipation metal plate mounting sealing surface and is used to install the heat dissipation metal plate sealing ring. The heat dissipation metal plate positioning column is correspondingly installed in the heat dissipation metal plate positioning mounting hole. The PCB board positioning mounting hole is set at a position corresponding to the PCB board mounting hole and is fixed by screw connection. The heat dissipation metal plate mounting hole and the heat dissipation metal plate countersunk threaded hole are set at a corresponding position and are fixed by screw connection. The heat dissipation metal plate mounting plane fits the heat dissipation metal plate mounting sealing surface. At the same time, the surface roughness Ra≤1.6 and the flatness ≤0.1mm of the heat dissipation metal plate mounting plane and the heat dissipation metal plate sealing ring mounting groove.

[0009] Preferably, the rotor assembly includes an impeller cover and an impeller base which are integrated by plastic fusion welding, and the impeller base is composed of a rotor core, a magnet, an injection molded support seat and a graphite bearing which are integrally injection molded by coating with plastic resin. The rotor core is the assembly body, and the magnets are evenly distributed along the outer circumference of the rotor core. An injection molded support seat is placed in the inner hole of the rotor core, and a graphite bearing is placed at both ends of the injection molded support seat.

[0010] Preferably, the pump head and the waterproof cover are sealed with liquid by using a pump head sealing ring, and the pump body and the waterproof cover are sealed by using a waterproof cover sealing ring, thereby forming a dry cavity and a wet cavity of the electronic water pump. The wet cavity is bounded by the waterproof cover, the inner cavity surface of the pump head, and the upper end surface of the liquid storage tank of the heat dissipation metal plate and is combined into a cavity filled with liquid by the pump head sealing ring. The dry cavity is bounded by the outer surface of the waterproof cover, the pump body and the inner surface of the back cover and is combined into a cavity by the waterproof cover sealing ring.

[0011] Preferably, the plastic welding is performed by fusion welding, and the fusion welding is performed by laser or ultrasonic welding.

[0012] Preferably, the heat dissipation metal plate is commonly made of aluminum or copper.

[0013] Preferably, the pump body is made of a resin with high structural strength, good toughness, high temperature resistance and good insulation performance.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention can achieve the effects of miniaturization, light weight, high performance, low cost and long life of the electronic water pump, and the liquid-cooled electronic water pump of the present invention is suitable for the cooling needs of various electronic equipment in high temperature environments, and has a wide range of application prospects in the field of electronic equipment; 2. The present invention can effectively reduce the temperature of the driver assembly and improve the stability of the system through heat exchange between the heat dissipation metal plate and the liquid; 3. The high-power water pump of the present invention can be made of plastic shell, and the parts that need heat dissipation can be made of metal plates, which can not only greatly reduce the cost, but also have no effect on the heat dissipation of the driver assembly; 4. The good sealing design of the present invention avoids internal leakage and external leakage, and prolongs the service life of the pump; 5. The liquid-cooled electronic water pump of the present invention has a simple structure, low cost and is easy to manufacture. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic cross-sectional view of the structure of the present invention; Figure 2 yes Figure 1 The enlarged schematic diagram at I in the middle; Figure 3It is a schematic diagram of the heat dissipation metal plate structure in the present invention (Figure a is the heat dissipation plane installed on the PCB, and Figure b is the sealing surface installed on the heat dissipation metal plate); Figure 4 It is a schematic diagram of the pump body structure in the present invention; Figure 5 It is a schematic diagram of the structure of the rotor assembly in the present invention; Figure 6 It is a thermal simulation cloud diagram of a traditional structure electronic water pump; Figure 7 This is a thermal simulation cloud diagram of the electronic water pump of the present invention; Figure 8 It is a comparison chart of the temperature rise of key components of the traditional structure electronic water pump and the electronic water pump of the present invention under the same working conditions. DETAILED DESCRIPTION

[0016] The following will be combined Figure 1-8 The present invention is described in detail. The exemplary embodiments and descriptions of the present invention are used to explain the present invention but are not intended to limit the present invention.

[0017] A liquid-cooled electronic water pump comprises a stator assembly 11, a rotor assembly 12, a pump head 13, a wear-resistant gasket 14, a pump body 15, a waterproof cover 16, a heat dissipation metal plate 17, a rear cover 18, a driver assembly 19, a waterproof cover sealing ring 1104, a heat dissipation metal plate sealing ring 1105 and a thermal conductive adhesive 112, wherein the thickness of the thermal conductive adhesive is between 0.3 and 1.0 mm, and the thermal conductive adhesive is a gel with a thermal conductivity of 1.5 to 5 W / mK. The waterproof cover 16 and the waterproof cover sealing ring 1104 are placed on the stator assembly 11 and the pump body 15 respectively, and the waterproof cover 16 and the pump body 15 are welded together by plastic welding to form a pump body assembly. The center of the waterproof cover is plastic-wrapped with a fixed shaft 161 as the rotation center of the water pump. The rotor assembly 12 and the wear-resistant gasket 14 are sequentially installed on the fixed shaft 161 of the pump body assembly and the pump head sealing ring 1103 is inserted into the outer edge of the waterproof cover stop. At the same time, the pump head is installed on the waterproof cover. The pump head and the pump body are welded together by plastic welding to form a water pump assembly. The heat dissipation metal plate The sealing ring 1105 and the heat dissipation metal plate 17 are installed on the water pump assembly and sealed by installing the water inlet sealing ring 1101 and the water outlet sealing ring 1102 to form a water pump assembly assembly. The thermal conductive adhesive 112 is coated on the surface of the heat dissipation metal plate 17, and the driver assembly is placed on the thermal conductive adhesive 112. The driver assembly 19 is fixed to the water pump assembly assembly by screws. At the same time, the motor lead-out PIN and the plug PIN are welded to the pump body 15 by plastic welding, and the rear cover 18 and the pump body are welded together by plastic welding to form a liquid-cooled electronic water pump.

[0018] like Figure 1 and Figure 2As shown, the driver assembly 19 of the water pump transfers heat to the heat dissipation metal plate 17 through the heat conductive glue 112, and the heat dissipation metal plate 17 contacts with the liquid for heat exchange, and the liquid rotates at high speed through the rotor assembly 12, wherein the outer ring of the rotor assembly 12 adopts a straight edge design in the circumferential direction to increase the friction between the rotor assembly and the liquid. The high-speed running rotor assembly 12 causes the liquid to stir quickly, so that the heat exchange inside the liquid is realized quickly, so that the water pump driver assembly can exchange heat with the liquid very well. At the same time, the heat dissipation metal plate 17 has a good sealing design, and it completely isolates the liquid in the pump body 15 (dry cavity) from the liquid in the waterproof cover 16 through the waterproof cover sealing ring 1104 and the heat dissipation metal plate sealing ring 1105, ensuring that the driver assembly 19 dissipates heat while avoiding driver failure caused by leakage. Specifically, the water pump driver assembly is located below the heat dissipation metal plate 17, and heat exchange is carried out through the contact between the heat dissipation metal plate and the liquid, thereby taking away the heat generated by the driver assembly. This design utilizes the good thermal conductivity and thermal convection of the liquid, and can effectively reduce the temperature of the driver. At the same time, the design of the heat dissipation metal plate 17 takes into account the problem of thermal expansion. Through appropriate structural design, the heat dissipation metal plate 17 can remain stable when the temperature changes. In addition, the heat dissipation metal plate also adopts a good sealing design. This sealing design not only ensures that the liquid will not leak out, but also prevents external contaminants from entering the pump body, thereby extending the service life of the pump and ensuring the stability of the drive assembly. The heat dissipation metal plate sealing ring 1105 is designed with corrosion-resistant and anti-aging materials, while considering assembly accuracy and sealing performance to ensure the best sealing effect.

[0019] The installation sequence of the liquid-cooled electronic water pump is as follows: Step 1: With the pump body 15 as the installation body, the stator assembly 11 is sequentially installed, and then the waterproof cover 16 and the waterproof cover sealing ring 1104 are placed on the stator assembly and the pump body. The waterproof cover 16 and the pump body 15 are ultrasonically welded together to form a pump body assembly. A wear-resistant fixed shaft 161 is plastic-coated in the center of the waterproof cover as the rotation center of the water pump; Step 2: With the pump body assembly as the installation body, install the rotor assembly 12 and the wear-resistant gasket 14 onto the fixed shaft 161 in sequence, then insert the pump head sealing ring 1103 into the outer edge of the waterproof cover stop, and finally install the pump head on the waterproof cover. The pump head 13 and the pump body 15 are welded together by ultra-ultrasonic welding to form a water pump assembly; Step 3: With the water pump assembly as the installation body, install the heat dissipation metal plate sealing ring 1105 and the heat dissipation metal plate 17 on the water pump assembly by screws, and finally install the water inlet sealing ring 1101 and the water outlet sealing ring 1102. After completion, perform the water pump wet cavity sealing test. The wet cavity airtightness requirement meets the air pressure ≥250kPa test for 1min, and the leakage is ≤20Pa. After the airtightness test meets the requirements, the water pump assembly is formed; Step 4: Take the water pump assembly as the installation body, apply a layer of thermal conductive glue on the surface of the heat dissipation metal plate 17, place the driver assembly 19 on the thermal conductive glue, and then fix the driver assembly 19 to the water pump assembly assembly with screws, and finally weld the motor lead PIN and plug PIN to the driver connection point. After completion, test the water pump performance. If it meets the requirements, finally weld the back cover 18 to the pump body 15 by ultrasonic welding, and then perform a dry cavity airtight test on the water pump assembly. If it meets the requirements, perform marking test and put it into storage to complete a liquid-cooled electronic water pump, and complete the manufacturing of liquid-cooled electronic water pump.

[0020] Furthermore, the driver assembly 19 adopts liquid cooling. The driver assembly includes a heat-generating component and a PCB copper sheet. The heat dissipation channel of the driver assembly is a heat-generating component - a PCB copper sheet - a thermally conductive adhesive - a heat-dissipating metal plate - a water pump body. At the same time, heat exchange occurs in a liquid reservoir formed between the pump body 15 and the heat-dissipating metal plate 17. The liquid reservoir is composed of a heat-dissipating metal plate heat exchange liquid reservoir 1701 set as a base and a pump body heat exchange liquid reservoir 1502 and a pump body flow channel hole 1501 set on the base. The pump body flow channel hole 1501 is connected to the pump body heat exchange liquid reservoir 1502 and there are at least two pump body flow channel holes. A heat-dissipating metal plate sealing ring 1105 and the pump body 15 are placed on the heat-dissipating metal plate, and the heat-dissipating metal plate is fitted on the bottom surface of the pump body to form a semi-open heat exchange liquid reservoir, thereby ensuring that the liquid in the liquid reservoir flows smoothly during the rotation of the rotor.

[0021] Furthermore, the heat dissipation metal plate 17 includes a PCB mounting heat dissipation plane 21 and a heat dissipation metal plate mounting sealing surface 26 which are relatively set up, the thermal conductive adhesive 112 is coated on the PCB mounting heat dissipation plane, the heat dissipation metal plate sealing ring 1105 is arranged on the heat dissipation metal plate mounting sealing surface 26, and also includes a heat dissipation metal plate countersunk threaded hole 22, a heat dissipation metal plate positioning mounting hole 23, a PCB board mounting hole 24 and a heat dissipation metal plate heat exchange reservoir 1701 which are arranged on the heat dissipation metal plate. The heat dissipation metal plate is made of a material with good thermal conductivity, and commonly used materials are aluminum, copper, etc. The heat dissipation metal plate mounting sealing surface 26 needs to be finely processed, and the surface roughness Ra≤3.2 and the surface flatness≤0.05mm. The depth of the heat dissipation metal plate heat exchange reservoir 1701 is between 1 and 3mm, and the structure is as follows Figure 3 As shown, in this solution, there are three countersunk threaded holes 22 of the heat dissipation metal plate and three positioning and mounting holes 23 of the heat dissipation metal plate, and two mounting holes 24 of the PCB board.

[0022] Furthermore, if Figure 4The pump body 15 shown includes a heat dissipation metal plate sealing ring mounting groove 31, a pump body flow channel hole 1501, a pump body heat exchange liquid storage tank 1502, a stator armature grounding PIN 34, a heat dissipation metal plate positioning column 35, a PCB board positioning mounting hole 36, a heat dissipation metal plate mounting hole 37, a three-phase PIN outlet hole 38, a heat dissipation metal plate mounting plane 39 and an outlet socket 310. The heat dissipation metal plate sealing ring mounting groove is arranged on the heat dissipation metal plate mounting sealing surface 26 and is used to install the heat dissipation metal plate sealing ring 1105. The heat dissipation metal plate positioning column 35 is correspondingly installed in the heat dissipation metal plate positioning mounting hole 23. The PCB board positioning mounting hole 36 is arranged at a position corresponding to the PCB board mounting hole 24, and the same number is also corresponding and fixed by screw connection. The heat dissipation metal plate mounting hole 37 is countersunk with the heat dissipation metal plate. The head threaded holes 22 are arranged at corresponding positions, the number corresponds and are fixed by screws. The heat dissipation metal plate mounting plane 39 fits the heat dissipation metal plate mounting sealing surface. At the same time, the surface roughness Ra≤1.6 and the flatness ≤0.1mm of the heat dissipation metal plate mounting plane 39 and the heat dissipation metal plate sealing ring mounting groove 31 are made of resin with high structural strength, good toughness, high temperature resistance and good insulation performance; the preferred material is PPS or PPA, etc.; the pump body flow channel holes and the pump body heat exchange liquid storage tank need to be smooth together, the number of pump body flow channel holes is set to 2 or more, and ensure that the flow channel holes do not affect the fixed axis strength and rigidity of the pump body assembly.

[0023] Furthermore, if Figure 5 As shown, the rotor assembly includes an impeller cover 41 and an impeller base 42 which are integrated by plastic fusion welding. The impeller base is composed of a rotor core 43, a magnet 44, an injection-molded support seat 45 and a graphite bearing 46 which are integrally injection-molded by coating with a high-strength plastic resin. The rotor core is the assembly body. The magnets 44 are evenly distributed along the outer circumference of the rotor core. An injection-molded support seat 45 is placed in the inner hole of the rotor core, and a graphite bearing 46 is placed at both ends of the injection-molded support seat 45. During installation, the impeller base and the impeller cover 41 are welded together by plastic fusion welding, and the impeller cover and the impeller base should be able to withstand an axial tensile force ≥ 200N without being damaged, and finally the required rotor assembly is manufactured.

[0024] Furthermore, the pump body and the pump head, and the pump body and the back cover are welded together by plastic fusion welding, and laser or ultrasonic welding is preferably used for fusion welding. The pump head 13 and the waterproof sleeve 16 are sealed by the pump head sealing ring 1103 to achieve liquid sealing, and the pump body 15 and the waterproof sleeve 16 are sealed by the waterproof sleeve sealing ring 1104, thereby forming a dry cavity and a wet cavity of the electronic water pump. The wet cavity is bounded by the waterproof sleeve 16 and the inner cavity surface of the pump head 13 and the upper end surface of the liquid storage tank of the heat dissipation metal plate 17 and is combined into a cavity filled with liquid through the pump head sealing ring. The dry cavity is bounded by the outer surface of the waterproof sleeve 16, the pump body 15 and the inner surface of the back cover 18 and is combined into a cavity through the waterproof sleeve sealing ring. The dry cavity is provided with components such as an electronic assembly and a driver assembly, and the sealing level of the dry cavity meets the IP68 protection level requirements.

[0025] All sealing rings in the present application are made of rubber materials with high elasticity, high pressure resistance, high temperature resistance, corrosion resistance and other characteristics, and preferably the materials are EPDM, fluororubber and other materials.

[0026] Implementation example Figure 6-8 As shown, the driver is thermally simulated and measured under the same environmental conditions at 120W working condition. The specific data is shown in Table 1:

[0027] It can be seen from this that under the same working conditions, the overall temperature rise of the liquid-cooled electronic water pump is about 8 to 15K lower than that of the same components of the traditional water pump. The low temperature rise of the electronic components of the water pump improves reliability. The liquid-cooled electronic water pump of the present invention is suitable for the cooling needs of various electronic equipment in high temperature environments.

[0028] The technical solutions provided by the embodiments of the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the embodiments of the present invention. The description of the above embodiments is only applicable to help understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, according to the embodiments of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A liquid-cooled electronic water pump, characterized in that: The invention comprises a stator assembly (11), a rotor assembly (12), a pump head (13), a wear-resistant gasket (14), a pump body (15), a waterproof sleeve (16), a heat dissipation metal plate (17), a rear cover (18), a driver assembly (19), a waterproof sleeve sealing ring (1104), a heat dissipation metal plate sealing ring (1105) and a thermal conductive adhesive (112), wherein the waterproof sleeve (16) and the waterproof sleeve sealing ring (1104) are respectively placed on the stator assembly (11) and the pump body (15), and the waterproof sleeve (16) and the pump body (15) are integrated into a pump body assembly by plastic fusion welding, and a fixed shaft (161) serving as the rotation center of the water pump is plastic-wrapped in the center of the waterproof sleeve, and the rotor assembly (12) and the wear-resistant gasket (14) are sequentially installed on the fixed shaft (161) of the pump body assembly and the pump head sealing ring (1104) is installed on the fixed shaft (161) of the pump body assembly. 03) is inserted into the outer edge of the stop of the waterproof sleeve, and the pump head is installed on the waterproof sleeve at the same time. The pump head and the pump body are integrated by plastic fusion welding to form a water pump assembly. The heat dissipation metal plate sealing ring (1105) and the heat dissipation metal plate (17) are installed on the water pump assembly and sealed by installing the water inlet sealing ring (1101) and the water outlet sealing ring (1102) to form a water pump assembly assembly. The thermal conductive adhesive (112) is coated on the surface of the heat dissipation metal plate (17), the driver assembly is placed on the thermal conductive adhesive (112), and the driver assembly (19) is fixed to the water pump assembly assembly by screws. At the same time, the motor lead PIN and the plug PIN are welded to the pump body (15) by plastic fusion welding, and the rear cover (18) and the pump body are integrated by plastic fusion welding to form a liquid-cooled electronic water pump.

2. The liquid-cooled electronic water pump according to claim 1, characterized in that: The driver assembly (19) adopts liquid cooling for heat dissipation. The heat dissipation channel of the driver assembly is a heat generating component - PCB copper sheet - thermal conductive adhesive - heat dissipation metal plate - water pump body. At the same time, heat exchange occurs in a liquid storage tank formed between the pump body (15) and the heat dissipation metal plate (17). The liquid storage tank is composed of a heat dissipation metal plate heat exchange liquid storage tank (1701) arranged as a base, a pump body heat exchange liquid storage tank (1502) arranged on the base, and a pump body flow channel hole (1501). The pump body flow channel hole (1501) and the pump body heat exchange liquid storage tank (1502) are connected, and at least two pump body flow channel holes are provided. A heat dissipation metal plate sealing ring (1105) and the pump body (15) are placed on the heat dissipation metal plate, and the heat dissipation metal plate is fitted on the bottom surface of the pump body to form a semi-open heat exchange liquid storage tank.

3. The liquid-cooled electronic water pump according to claim 1, characterized in that: The heat dissipation metal plate (17) comprises a PCB mounting heat dissipation plane (21) and a heat dissipation metal plate mounting sealing surface (26) which are arranged opposite to each other; the heat conductive adhesive (112) is coated on the PCB mounting heat dissipation plane; the heat dissipation metal plate sealing ring (1105) is arranged on the heat dissipation metal plate mounting sealing surface (26); and the heat dissipation metal plate countersunk threaded hole (22), the heat dissipation metal plate positioning mounting hole (23), the PCB board mounting hole (24) and the heat dissipation metal plate heat exchange liquid storage tank (1701) are arranged on the heat dissipation metal plate; the heat dissipation metal plate (17) is made of a material with good thermal conductivity; the surface roughness Ra of the heat dissipation metal plate mounting sealing surface (26) is ≤3.2 and the surface flatness is ≤0.05 mm; the depth of the heat dissipation metal plate heat exchange liquid storage tank (1701) is between 1 and 3 mm.

4. The liquid-cooled electronic water pump according to claim 1, characterized in that: The thickness of the thermal conductive adhesive is between 0.3 and 1.0 mm, and the thermal conductive adhesive is a gel with a thermal conductivity of 1.5 to 5 W / mK.

5. The liquid-cooled electronic water pump according to claim 3, characterized in that: The pump body (15) comprises a heat dissipation metal plate sealing ring mounting groove (31), a pump body flow channel hole (1501), a pump body heat exchange liquid storage tank (1502), a stator armature grounding PIN (34), a heat dissipation metal plate positioning column (35), a PCB board positioning mounting hole (36), a heat dissipation metal plate mounting hole (37), a three-phase PIN outlet hole (38), a heat dissipation metal plate mounting plane (39) and an outlet socket (310), the pump body flow channel hole (1501) and the pump body heat exchange liquid storage tank (1502) are connected and at least two pump body flow channel holes are provided, the heat dissipation metal plate sealing ring mounting groove is provided on the heat dissipation metal plate mounting sealing surface (26) and is used to The heat dissipation metal plate sealing ring (1105) is installed, the heat dissipation metal plate positioning column (35) is installed in the heat dissipation metal plate positioning mounting hole (23), the PCB board positioning mounting hole (36) is set at a position corresponding to the PCB board mounting hole (24) and is fixed by screw connection, the heat dissipation metal plate mounting hole (37) is set at a position corresponding to the heat dissipation metal plate countersunk threaded hole (22) and is fixed by screw connection, the heat dissipation metal plate mounting plane (39) is in contact with the heat dissipation metal plate mounting sealing surface, and the surface roughness Ra of the heat dissipation metal plate mounting plane (39) and the heat dissipation metal plate sealing ring mounting groove (31) is ≤1.6 and the flatness is ≤0.1mm.

6. The liquid-cooled electronic water pump according to claim 1, characterized in that: The rotor assembly comprises an impeller cover (41) and an impeller base (42) which are integrated by plastic fusion welding. The impeller base is composed of a rotor core (43), a magnet (44), an injection-molded support seat (45) and a graphite bearing (46) which are integrally injection-molded by coating with plastic resin. The rotor core is an assembly body. The magnet (44) is evenly distributed along the outer circumference of the rotor core. The inner hole of the rotor core is provided with an injection-molded support seat (45) and a graphite bearing (46) is placed at both ends of the injection-molded support seat (45).

7. The liquid-cooled electronic water pump according to claim 1, characterized in that: The pump head (13) and the waterproof sleeve (16) are sealed by a pump head sealing ring (1103), and the pump body (15) and the waterproof sleeve (16) are sealed by a waterproof sleeve sealing ring (1104), thereby forming a dry cavity and a wet cavity of the electronic water pump. The wet cavity is bounded by the inner cavity surface of the waterproof sleeve (16) and the pump head (13) and the upper end surface of the liquid storage tank of the heat dissipation metal plate (17) and is combined into a cavity filled with liquid through the pump head sealing ring. The dry cavity is bounded by the outer surface of the waterproof sleeve (16), the pump body (15) and the inner surface of the rear cover (18) and is combined into a cavity through the waterproof sleeve sealing ring.

8. The liquid-cooled electronic water pump according to claim 1, characterized in that: The plastic welding is performed by fusion welding, and the fusion welding adopts laser or ultrasonic welding.

9. The liquid-cooled electronic water pump according to claim 1, characterized in that: The heat dissipation metal plate is usually made of aluminum or copper.

10. The liquid-cooled electronic water pump according to claim 1, characterized in that: The pump body is made of resin with high structural strength, good toughness, high temperature resistance and good insulation performance.

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