Wafer disc withdrawing device and probe station

Abstract

The invention relates to the technical field of wafer disc detection, in particular to a wafer disc withdrawing device and a probe station. The wafer disc extraction device comprises a lower bottom plate and an upper top plate which are arranged in parallel relatively; the lower bottom plate and the upper top plate are connected through a plate type guide rail, and limiting assemblies used for limiting the relative positions of the lower bottom plate and the upper top plate in the first direction are arranged on the lower bottom plate and the upper top plate correspondingly. The first positioning assembly is used for keeping the upper top plate at the working position and comprises a plurality of first positioning beads and first stop pins which are correspondingly arranged; when the first positioning bead is matched with the first stop pin, resistance for preventing the upper top plate from moving forwards in the first direction can be applied to the upper top plate. The device is compact in structure and occupies a small design space; a first positioning bead is combined with a first stop pin, so that the working position of the upper top plate can be accurately positioned, and the detection precision is improved; and after the upper top plate is pulled out, the wafer can be replaced outside the shielding cavity, so that the efficiency of manually replacing the wafer is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer disc detection, and particularly designs a wafer disc extraction device and a probe station. Background Art

[0002] Currently in the field of semiconductor testing, probe stations are becoming more and more important testing equipment for wafer and chip testing. During the wafer testing process, the chuck serves as a carrier for the wafer, and the wafer under test and the chuck move synchronously in the working area. In order to meet the special environment of high and low temperature wafer testing and RF testing, the entire testing process must be completed in a shielded chamber.

[0003] In order to solve the problem of convenience in replacing wafers on the probe station, the prior art usually adopts a switchable shielding chamber structure, that is, by opening the upper cover of the shielding chamber, the wafer can be replaced and tested by switching between the open and closed states at the opening, but this method has a small operating space and is inconvenient to take and put the wafer. In addition, a reversible probe card station is used to flip the table as a whole; a flip door structure is designed in the operating position cavity to leave a position for replacing wafers, but the overall flip probe card station is inconvenient to flip and has poor operability. Summary of the invention

[0004] The present invention aims to improve the inconvenience of replacing wafers in the background technology and provides a wafer tray extracting device.

[0005] The wafer disc extraction device is implemented as follows: comprising a lower bottom plate and an upper top plate which are arranged relatively parallel;

[0006] The lower bottom plate and the upper top plate are connected by at least two plate guide rails, so that the upper top plate can reciprocate relative to the lower bottom plate along a first direction;

[0007] The lower bottom plate and the upper top plate are respectively provided with limiting components for limiting the relative position between the lower bottom plate and the upper top plate in a first direction;

[0008] It also includes a first positioning assembly for keeping the upper plate in the working position, the first positioning assembly includes a plurality of first positioning beads and first stop pins that are arranged correspondingly; one of the first positioning beads and the first stop pin is arranged on the lower surface of the upper plate, and the other is arranged on the upper surface of the lower base plate;

[0009] Set in the first direction, the direction in which the upper plate is pulled out relative to the lower plate is forward, and the opposite direction is backward; when the first positioning bead cooperates with the first stop pin, a resistance can be applied to the upper plate to prevent it from moving forward along the first direction.

[0010] In a preferred embodiment, the limit assembly includes a limit seat disposed on the left and right sides of the upper top plate and close to the front side of the upper top plate, and a buffer assembly disposed on the left and right sides of the lower bottom plate and close to the rear side of the lower bottom plate; the limit seat cooperates with the buffer assembly to limit the maximum push-in position of the upper top plate;

[0011] The limit assembly also includes rear stops arranged on the left and right sides of the upper top plate and close to the rear side of the upper top plate, and front stops arranged on the left and right sides of the lower bottom plate and close to the front side of the lower bottom plate; the rear stops cooperate with the front stops to limit the maximum withdrawal position of the upper top plate.

[0012] In a preferred embodiment, the buffer assembly includes a buffer seat and a buffer, the buffer seat is arranged on the lower base plate, and the buffer is arranged on the buffer seat for abutting against the limiting seat.

[0013] In a preferred embodiment, a second positioning assembly is further included, and the second positioning assembly includes a second positioning bead arranged on the limiting seat, and a second stop pin arranged at a corresponding position of the buffer seat.

[0014] In a preferred embodiment, there are five first positioning beads, three of which are arranged at the rear side of the upper top plate, and two are arranged at the front side of the upper top plate.

[0015] In a preferred embodiment, a pull plate is provided on the front side of the upper top plate, and a lock column is provided on the front side of the lower bottom plate;

[0016] When the upper plate is located at the working position, the pull plate can be engaged with the lock column to limit the movement of the upper plate in the first direction.

[0017] In a preferred embodiment, a shock absorbing member is provided on the front block or the rear block to reduce the impact force between the front block and the rear block.

[0018] In a preferred embodiment, a distance sensor is provided at the rear end of the lower base plate for detecting the position of the upper top plate.

[0019] In a preferred embodiment, at least three adjustment bolts arranged at intervals and not collinearly are provided on the upper top plate, and a leveling support plate for supporting the wafer disk is provided on the upper surface of the adjustment bolts.

[0020] The present invention also provides a probe station, comprising a shielding cabin and the wafer disc extraction device;

[0021] The wafer disc extraction device is arranged in the shielding cabin, a hatch is arranged on one side of the shielding cabin, and the upper top plate can be extracted from the hatch.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] A plate guide rail is used between the upper plate and the lower plate to achieve a sliding connection, which reduces the height of the wafer plate, has a compact structure, and occupies a smaller design space; the combination of the first positioning bead and the first stop pin can accurately locate the working position of the upper plate and improve the detection accuracy; after the upper plate is pulled out, the wafer can be replaced outside the shielding cavity, which is more human-machine interactive and improves the efficiency of manual wafer replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a schematic diagram from a first perspective of a wafer disc extraction device (without a leveling support plate installed) provided in an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of a wafer disc extraction device (with a leveling support plate installed) provided in an embodiment of the present invention from a second viewing angle;

[0027] Figure 3 A schematic diagram of the working position of the wafer disc extraction device provided in an embodiment of the present invention in the shielding cavity of the probe station;

[0028] Figure 4 A schematic diagram of the position of the wafer disc extraction device provided in an embodiment of the present invention after being extracted from the shielding cabin of the probe station;

[0029] Numbers in the figure:

[0030] 1-Pull plate; 2-First positioning bead; 3-Upper top plate;

[0031] 4-locking column; 5-plate guide rail; 6-lower base plate;

[0032] 7-first stop pin; 8-buffer; 9-second stop pin;

[0033] 10- shock absorbing member; 11- third positioning bead; 12- second positioning bead;

[0034] 13-Adjusting bolt; 14-Left limit seat; 15-Leveling support plate,

[0035] 16-left buffer seat; 17-distance sensor; 18-right buffer seat;

[0036] 19-right rear stopper; 20-right front stopper; 21-right limit seat. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and marked in the drawings can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0041] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0042] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0044] The wafer disc extraction device provided in this embodiment is as follows: Figure 1 and Figure 2 shown.

[0045] Specifically, the wafer tray extraction device includes a lower bottom plate 6 and an upper top plate 3 which are arranged relatively parallel to each other;

[0046] The lower bottom plate 6 and the upper top plate 3 are connected by two plate guide rails 5, so that the upper top plate 3 can reciprocate relative to the lower bottom plate 6 along a first direction;

[0047] Limiting components are respectively provided on the lower bottom plate 6 and the upper top plate 3 to limit the relative position between the lower bottom plate 6 and the upper top plate 3 in the first direction.

[0048] In the first direction, the direction in which the upper plate 3 is pulled out relative to the lower plate 6 is the front direction, and the opposite direction is the rear direction.

[0049] The limit assembly includes a limit seat disposed on the left and right sides of the upper top plate 3 and close to the front side of the upper top plate, and a buffer assembly disposed on the left and right sides of the lower bottom plate 6 and close to the rear side of the lower bottom plate 6. The buffer assembly includes a buffer seat and a buffer mounted on the buffer seat.

[0050] Specifically, Figure 2 As shown, the left limit seat 14 cooperates with the left buffer seat 16, and the right limit seat 21 cooperates with the right buffer seat 18 to jointly limit the maximum push-in position of the upper top plate 3. Buffers 8 are respectively arranged on the left buffer seat 16 and the right buffer seat 18. When the upper top plate 3 is pushed back, the buffers 8 are used to abut against the left limit seat 14 and the right limit seat 21 to provide buffering for the upper top plate 3.

[0051] The position limiting assembly further includes rear stoppers arranged on the left and right sides of the upper top plate 3 and close to the rear side of the upper top plate 3, and front stoppers arranged on the left and right sides of the lower bottom plate 6 and close to the front side of the lower bottom plate 6. Taking the right rear stopper 19 and the right front stopper 20 shown in the figure as an example (the same applies to the left side), the right rear stopper 19 cooperates with the right front stopper 20 to limit the maximum withdrawal position of the upper top plate 3.

[0052] A first positioning assembly for keeping the upper plate 3 in the working position is also provided between the upper plate 3 and the lower plate 6. The first positioning assembly includes a plurality of first positioning beads 2 and first stop pins 7 which are provided in correspondence with each other; wherein the first positioning beads 2 are provided on the lower surface of the upper plate 3, and the first stop pins 7 are provided on the upper surface of the lower plate 6. When the first positioning beads 2 cooperate with the first stop pins 7, a resistance can be applied to the upper plate 3 to prevent it from moving forward in the first direction. The magnitude of the interaction force between the first positioning beads 2 and the first stop pins 7 can be controlled by adjusting the screw-in length of the first positioning beads 2.

[0053] In other embodiments, the positions of the first positioning bead 2 and the second stopping pin 7 may also be interchanged.

[0054] More specifically, in this embodiment, the number of the first positioning beads 2 is 5, three of which are arranged at the rear side of the upper top plate 3, and two are arranged at the front side of the upper top plate 3, and the positioning beads on the front and rear sides are staggered. When the upper top plate 3 is pulled out, the positioning beads at the rear side of the upper top plate 3 do not contact the stop pin on the front side of the lower base plate 6.

[0055] In a preferred embodiment, a second positioning assembly is also included, which includes a second positioning bead 12 arranged on the left limit seat 14 and the right limit seat 21, and a second stop pin 9 arranged at corresponding positions of the left buffer seat 16 and the right buffer seat 18.

[0056] In a preferred embodiment, the front block and the rear block are both "L" shaped and hooked to each other to form a limit. Taking the right rear block 19 and the right front block 20 as an example (the same applies to the left side), a shock absorber 10 is provided on the right front block 20 to reduce the impact force between the right rear block 19 and the right front block 20.

[0057] The shock absorbing member 10 may also be arranged on the right rear stopper 19 and move with the upper top plate 3 .

[0058] In a preferred embodiment, a third positioning bead 11 is provided on the right rear block, and a corresponding slot is provided on the right front block, so that the upper plate 3 and the lower base plate 6 can be relatively fixed after the upper plate 3 is pulled out into place.

[0059] A pull plate 1 is also provided on the front side of the upper plate 3, and a locking column 4 is provided on the front side of the lower bottom plate 6; when the upper plate 3 is in the working position, the pull plate 1 can be folded back to fit the front side surface of the upper plate 3, and can be engaged with the locking column 4 to limit the movement of the upper plate 3 in the first direction. When the upper plate 3 needs to be pulled out, the pull plate 1 is released from the locking column 4 and folded forward to form a handle for dragging, so that the operator can easily pull out the upper plate 3.

[0060] In a preferred embodiment, a distance sensor 17 is provided at the rear end of the lower base plate 6 to detect the position of the upper top plate 3. If the upper top plate 3 is not pushed back into place, the distance sensor 17 can sound an alarm to prohibit the probe station from performing detection work.

[0061] In addition, in this embodiment, at least three adjustment bolts 13 arranged at intervals and not in a colinear manner are provided on the upper top plate 3, and a leveling support plate 15 for supporting the wafer disk is provided on the upper surface of the adjustment bolts 13. By adjusting the tightening degree of the adjustment bolts 13, the horizontal position of the leveling support plate 15 can be adjusted to keep the wafer disk level, thereby providing a good test environment for wafer inspection.

[0062] This embodiment also provides a probe station, such as Figure 3 and Figure 4 The probe station includes a shielding cabin and the wafer plate extraction device;

[0063] The wafer disc extraction device is arranged in the shielding cabin, and a hatch is arranged on one side of the shielding cabin, and the upper top plate 3 can be extracted from the hatch.

[0064] The wafer disc can be pulled out by rotating the pull plate 1 and pulling the upper plate 3 outwards. The pull-out position can be locked by the limit assembly and the third positioning bead 11, which is convenient for wafer replacement. When the wafer disc is in the working position, that is, when the upper plate 3 is returned, the left and right limit seats connected to the upper plate 3 and the buffer on the lower bottom plate 6 interact with each other, and the pull plate 1 is rotated at the same time to make it contact with the locking column 4 and lock it, thereby fixing the relative position of the upper plate 3 and the lower bottom plate 6.

[0065] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer disc extraction device, characterized in that: It includes a lower bottom plate and an upper top plate which are arranged relatively parallel to each other; The lower bottom plate and the upper top plate are connected by at least two plate guide rails, so that the upper top plate can reciprocate relative to the lower bottom plate along a first direction; The lower bottom plate and the upper top plate are respectively provided with limiting components for limiting the relative position between the lower bottom plate and the upper top plate in a first direction; It also includes a first positioning assembly for keeping the upper plate in the working position, the first positioning assembly includes a plurality of first positioning beads and first stop pins that are arranged correspondingly; one of the first positioning beads and the first stop pin is arranged on the lower surface of the upper plate, and the other is arranged on the upper surface of the lower base plate; Set in the first direction, the direction in which the upper plate is pulled out relative to the lower base plate is forward, and the opposite direction is backward; when the first positioning bead cooperates with the first stop pin, a resistance can be applied to the upper plate to prevent it from moving forward in the first direction.

2. The wafer extraction device according to claim 1, characterized in that: The limit assembly includes a limit seat arranged on the left and right sides of the upper top plate and close to the front side of the upper top plate, and a buffer assembly arranged on the left and right sides of the lower bottom plate and close to the rear side of the lower bottom plate; the limit seat cooperates with the buffer assembly to limit the maximum push-in position of the upper top plate; The limit assembly also includes rear stops arranged on the left and right sides of the upper top plate and close to the rear side of the upper top plate, and front stops arranged on the left and right sides of the lower bottom plate and close to the front side of the lower bottom plate; the rear stops cooperate with the front stops to limit the maximum withdrawal position of the upper top plate.

3. The wafer extraction device according to claim 2, characterized in that: The buffer assembly includes a buffer seat and a buffer. The buffer seat is arranged on the lower bottom plate. The buffer is arranged on the buffer seat and is used to abut against the limiting seat.

4. The wafer extraction device according to claim 3, characterized in that: It also includes a second positioning assembly, which includes a second positioning bead arranged on the limiting seat and a second stop pin arranged at a corresponding position of the buffer seat.

5. The wafer extraction device according to claim 1, characterized in that: There are five first positioning beads, three of which are arranged at the rear side of the upper top plate, and two are arranged at the front side of the upper top plate.

6. The wafer extraction device according to claim 1, characterized in that: A pull plate is provided on the front side of the upper top plate, and a lock column is provided on the front side of the lower bottom plate; When the upper plate is located at the working position, the pull plate can be engaged with the lock column to limit the movement of the upper plate in the first direction.

7. The wafer extraction device according to claim 2, characterized in that: A shock absorbing member is arranged on the front block or the rear block to reduce the impact force between the front block and the rear block.

8. The wafer extraction device according to claim 1, characterized in that: A distance sensor is arranged at the rear end of the lower base plate to detect the position of the upper top plate.

9. The wafer extraction device according to claim 1, characterized in that: At least three adjustment bolts arranged at intervals and not in a colinear manner are arranged on the upper top plate, and a leveling support plate for supporting the wafer disk is arranged on the upper surface of the adjustment bolts.

10. A probe station, characterized in that: It comprises a shielding cabin and a wafer disc extraction device as claimed in any one of claims 1 to 9; The wafer disc extraction device is arranged in the shielding cabin, a hatch is arranged on one side of the shielding cabin, and the upper top plate can be extracted from the hatch.

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