Firmware updating method and laser projection equipment

Abstract

The embodiment of the invention belongs to the electronic equipment technology, and provides a firmware updating method and laser projection equipment. The laser projection device comprises a processor, a first switch module, at least one first chip and at least one second chip. The laser projection equipment can obtain a first data packet and a second data packet through the processor; performing firmware updating on the first chip by using the first data packet, and performing firmware updating on the second chip by using the second data packet; when the first switch module is connected with a target electronic device through a target connecting line, if the first switch module detects a first target voltage, a first data packet is obtained, a first channel between the first switch module and the first chip is conducted, and the first data packet is sent to the first chip; and if a second target voltage is detected, obtaining a second data packet, conducting a second channel between the second chip and the second data packet, and sending the second data packet to the second chip. The firmware updating efficiency and integration of the laser projection equipment are improved.

Description

Technical Field

[0001] The embodiments of the present application relate to electronic equipment technology, and more specifically, to a firmware update method and a laser projection device. Background Art

[0002] The operating logic program of the chip can be stored in the flash memory (Flash) of the chip. Usually, after the chip is assembled into the laser projection device, it may be necessary to upgrade the firmware of the chip (that is, update the operating logic in the Flash corresponding to the chip). At present, for chips that do not support the online upgrade function, the laser projection device where the chip is located must be disassembled first. Then, for different chips, use an offline burner to burn different chips offline through the interfaces corresponding to different chips.

[0003] Therefore, existing laser projection equipment has the problems of low upgrading efficiency and poor integration. Summary of the invention

[0004] The exemplary embodiments of the present application provide a firmware update method and a laser projection device, which can improve the firmware upgrade efficiency and integration of the laser projection device.

[0005] In a first aspect, the present application provides a laser projection device, the laser projection device comprising a processor, a first switch module, at least one first chip, and at least one second chip, the processor and the first switch module are both connected to the first chip, and the processor and the first switch module are both connected to the second chip; the processor is configured as follows:

[0006] Acquire a first data packet of the first chip and a second data packet of the second chip;

[0007] Using the first data packet to perform firmware update on the first chip, and using the second data packet to perform firmware update on the second chip;

[0008] When the first switch module is connected to the target electronic device through the target connection line, the first switch module is configured as follows:

[0009] If the first target voltage is detected, the first data packet is acquired, and a first channel between the first switch module and the first chip is turned on to send the first data packet to the first chip through the first channel;

[0010] If the second target voltage is detected, the second data packet is acquired, and a second channel between the first switch module and the second chip is turned on to send the second data packet to the second chip through the second channel.

[0011] In some embodiments, the second chip is connected to a target first chip, the target first chip is one of the at least one first chip, and the processor is configured to:

[0012] A target level signal is sent to the second chip through the target first chip, so that the second chip responds to the target level signal and uses the second data packet to perform firmware update according to the target upgrade method.

[0013] In some embodiments, the first switch module is configured as:

[0014] When the first switch module is connected to the target device through the target connection line and the second target voltage is detected, the target level signal is sent to the second chip so that the second chip responds to the target level signal and uses the second data packet to update the firmware according to the target upgrade method.

[0015] In some embodiments, the laser projection device further includes: a second switch module, the processor and the first switch module are connected to the second chip through the second switch module; the second switch module is configured as:

[0016] Conducting a channel between the processor and the second chip;

[0017] or,

[0018] When the first switch module is connected to the target device through the target connection line and the second target voltage is detected, the channel between the second switch module and the second chip is turned on; when the first switch module is connected to the target device through the target connection line and the second target voltage is detected, the first switch module is configured to: turn on the channel between the first switch module and the second switch module.

[0019] In some embodiments, the first switch module includes: a first interface, a first transistor, and a first switch unit, the first interface is an interface for connecting the first switch module to the target electronic device through a target connection line, and the first interface includes: a voltage input sub-interface and a data transmission sub-interface;

[0020] The voltage input sub-interface is connected to the base of the first transistor, the collector of the first transistor is connected to the first end of the first switch unit and the second chip, the second end of the first switch unit is connected to the data transmission sub-interface, the third end of the first switch unit is connected to the first chip, and the fourth end of the first switch unit is connected to the second switch module;

[0021] The first switch unit is configured as:

[0022] When the first target voltage transmitted from the target connection line to the base of the first transistor is detected through the voltage input sub-interface, the first data packet is obtained from the target electronic device through the data transmission sub-interface, and the first channel between the first switch unit and the first chip is turned on to send the first data packet to the first chip through the first channel;

[0023] When the transmission of the second target voltage from the target connection line to the base of the first transistor is detected through the voltage input sub-interface, the second data packet is obtained from the target electronic device through the data transmission sub-interface, and the channel between the first switch unit and the second switch module is turned on to send the second data packet to the second chip through the second channel.

[0024] In some embodiments, the second switch module includes: a second switch unit, and a second transistor; the first end of the second switch unit is connected to the fourth end of the first switch unit, the second end of the second switch unit is connected to the processor, and the third end of the second switch unit is connected to the second chip; the voltage input sub-interface is connected to the base of the second transistor, and the collector of the second transistor is connected to the fourth end of the second switch unit.

[0025] In some embodiments, the laser projection device further includes: a connection module, the second switch module is connected to one end of the connection module, and the other end of the connection module is connected to the first ends of the plurality of second chips.

[0026] In some embodiments, the laser projection device includes multiple first chips, among which there is at least one first chip of the first type and at least one first chip of the second type; the first chip of the first type is a first chip that does not include Flash; the first chip of the first type is connected to the corresponding Flash; the second type first chip is a first chip that includes Flash; the second chip includes: at least one digital light processing DLP chip.

[0027] In some embodiments, the communication protocol for firmware upgrade between the processor and each of the first chips, and the communication protocol for firmware upgrade between the first switch module and each of the first chips are both I2C communication protocols.

[0028] In a second aspect, the present application provides a chip firmware update method, which is applied to a laser projection device, wherein the laser projection device includes a processor, a first switch module, at least one first chip, and at least one second chip, wherein the processor and the first switch module are both connected to the first chip, and the processor and the first switch module are both connected to the second chip; the method includes:

[0029] Obtaining, by the processor, a first data packet of the first chip and a second data packet of the second chip; updating the firmware of the first chip using the first data packet and updating the firmware of the second chip using the second data packet;

[0030] When the first switch module is connected to the target electronic device through the target connection line, if the first target voltage is detected through the first switch module, the first data packet is obtained, and the first channel between the first switch module and the first chip is turned on to send the first data packet to the first chip through the first channel; if the second target voltage is detected, the second data packet is obtained, and the second channel between the first switch module and the second chip is turned on to send the second data packet to the second chip through the second channel.

[0031] The firmware update method and laser projection device provided in the present application are such that the laser projection device can obtain the first data packet of the first chip and the second data packet of the second chip through the processor, and use the first data packet to perform firmware update on the first chip and use the second data packet to perform firmware update on the second chip through the processor. When the first switch module is connected to the target electronic device through the target connection line, the laser projection device can obtain the first data packet through the first switch module when the first target voltage is detected and use the first data packet to perform firmware update on the first chip; when the second target voltage is detected, obtain the second data packet and use the second data packet to perform firmware update on the second chip. Through the above-mentioned firmware update method, the multiple chips of the laser projection device can be updated online without disassembling the laser projection device, thereby improving the efficiency of the firmware update of the laser projection device. In addition, through the above-mentioned method, there is no need for multiple different types of interfaces to perform firmware updates on different chips, thereby improving the integration of the laser projection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0033] Figure 1a is a structural schematic diagram of a laser projection device provided in an embodiment of the present application;

[0034] Figure 1b A schematic diagram of the scenario for upgrading the existing FPGA firmware;

[0035] Figure 2 A schematic diagram of a scenario of an existing DLP firmware upgrade;

[0036] Figure 3 A schematic diagram of another existing DLP firmware upgrade scenario;

[0037] Figure 4 This is a schematic diagram of the scenario for upgrading the existing MCU firmware;

[0038] Figure 5 A schematic diagram of the structure of a laser projection device provided in this application;

[0039] Figure 6a A schematic diagram of the structure of another laser projection device provided in this application;

[0040] Figure 6b A schematic diagram of the structure of another laser projection device provided in this application;

[0041] Figure 7 A schematic diagram of the structure of another laser projection device provided in this application;

[0042] Figure 8 A schematic diagram of the structure of a first switch module provided in this application;

[0043] Fig. 9 A schematic diagram of the structure of a second switch module provided in this application;

[0044] Fig.10 A schematic diagram of the structure of another laser projection device provided in this application;

[0045] Fig.11 A schematic diagram of the structure of another laser projection device provided in this application;

[0046] Fig.12 A schematic diagram of the structure of another first switch module provided in the present application;

[0047] Fig.13 A schematic diagram of the structure of another second switch module provided in the present application. DETAILED DESCRIPTION

[0048] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0049] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their ordinary and common meanings.

[0050] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0051] Figure 1a Schematic diagram of the structure of a laser projection device provided in an embodiment of the present application. Figure 1a As shown, after the upper shell of the laser projection device is disassembled, the internal structure is divided according to the optical function, and may include a light source 100, an optical machine 200, and a lens 300, wherein the light source 100 is used to provide a light source illumination beam, which is transmitted to the rear-end optical modulation device and the projection lens. The light source 100 may include a laser of at least one color, such as a blue laser, or a two-color laser, such as a blue laser and a red laser, or a three-color laser light source, including red, green, and blue lasers, for providing a three-color laser illumination beam.

[0052] The laser beam provided by the light source 100 enters the illumination optical path of the optical machine 200 after light combination and shaping. In the DLP projection architecture, the DMD chip is the core optical modulation device. The DMD chip receives the driving control signal corresponding to the image signal, and flips the thousands of tiny mirrors on its surface to the positive or negative angle corresponding to the driving signal, and reflects the light beam irradiating its surface into the lens 300.

[0053] The lens 300 may be an ultra-short-throw projection lens, and the ultra-short-throw projection lens 300 is used to project an image beam onto a projection screen, thereby realizing projection image display. The laser projection device in the above example may be an ultra-short-throw laser projection device.

[0054] The operating logic program of the chip can be stored in the flash memory (Flash, or flash) of the chip. Before the chip is assembled into the whole machine (such as the above-mentioned laser projection device), the chip can be burned offline using an offline burner, and then the chip with the firmware burned (that is, the operating logic program of the chip has been burned into the corresponding flash) is patched on the corresponding circuit board to make a board product. After the chip is patched, it is necessary to enter the whole machine assembly stage, and the whole machine can only be shipped after the assembly test passes. However, during the test process, it may be found that some chip firmware (that is, the operating logic stored in the corresponding Flash of the chip) has errors (bugs).

[0055] Laser projection equipment may include a variety of different types of chips. According to whether the chip can be upgraded online, the chip type can be divided into chips that support online upgrade function and chips that do not support online upgrade function. Exemplarily, the above-mentioned chips that do not support online upgrade function may include: Field Programmable Gate Array (FPGA) chip, Digital Light Processing (DLP) chip, Microcontroller Unit (MCU) and the like of laser projection equipment.

[0056] For the above chips that do not support the online upgrade function, if the chip has an error, it is necessary to perform offline burning to upgrade the chip's firmware (that is, to update the firmware of the logic program in the chip's Flash). If you choose to use a batch offline burner for offline burning at this time, you need to remove the chip with the wrong firmware from the circuit board in the whole machine before you can use the batch offline burner to burn it. After the burning is completed, the chip must be mounted again. This is not only inefficient, but also requires high temperature control when removing the chip from the circuit board. Poor temperature control may damage the internal logic circuit of the chip.

[0057] At present, some existing embodiments propose to use different firmware upgrade methods for different chips to perform offline burning on a single chip. The following describes the existing firmware upgrade method using the above-mentioned FPGA chip, DLP chip, and MCU chip as examples:

[0058] Figure 1b The following is a schematic diagram of the existing FPGA firmware upgrade scenario. Figure 1bAs shown, when the existing firmware upgrade method is used to upgrade the FPGA chip (that is, to update the logic program in the Flash connected to the FPGA chip), the laser projection device needs to be provided with a Joint Test Action Group (JTAG) interface. Then, the user can use the firmware offline burner to connect to the JTAG interface and upgrade the logic program in the Flash through the Serial Peripheral Interface (SPI) between the FPGA and the Flash.

[0059] Take a laser projection device including four DLP chips, and the laser projection device does not have abnormal power failure as an example. Figure 2 FIG. 1 is a schematic diagram of an existing DLP firmware upgrade scenario. Figure 2 As shown, when the DLP chip is upgraded using the existing firmware upgrade method, each DLP can be connected to the flash through a parallel interface. The flash connected to the master DLP can be upgraded through a universal serial bus (USB) interface. The flash connected to the three slave DLPs (also called slave DLPs) can be transmitted to the three slave DLPs through SPI communication via the master DLP to implement the flash upgrade.

[0060] Take the abnormal power outage of laser projection equipment as an example (abnormal power outage during upgrade will cause illegal rewriting of Flash). Figure 3 FIG. 1 is a schematic diagram of another existing DLP firmware upgrade scenario. Figure 3 As shown, the system boot lock signal (Hold boot) interfaces of the four DLPs must all be grounded to pull the hold signal low. For example, tweezers can be used to ground the interface. Then, the Flash of each DLP is upgraded through four USBs.

[0061] Figure 4 The following is a schematic diagram of the existing MCU firmware upgrade scenario. Figure 4 As shown, when the MUC chip is upgraded using the existing firmware upgrade method, the laser projection device needs to be provided with a SWD (a name for a serial debug interface) interface. Then, the user can use a firmware offline burner to connect to the SWD interface to upgrade the logic program in the flash in the MCU.

[0062] Therefore, when using the above existing firmware upgrade method, it is necessary to disassemble the machine and upgrade different chips offline through the offline burners corresponding to different chips and the interfaces corresponding to different chips. Therefore, the existing laser projection equipment has the problems of low upgrade efficiency and poor integration.

[0063] Considering the above problems in the existing firmware upgrade method, the present application proposes a method for updating the firmware of multiple chips of a laser projection device without disassembling the device, thereby improving the efficiency of the firmware update of the laser projection device and eliminating the need for multiple different types of interfaces, thereby improving the integration of the laser projection device. The execution subject of the method can be a laser projection device, or different devices in the laser projection device, such as a processor and other devices.

[0064] The following takes the execution subject of the firmware update method as a laser projection device as an example, and describes the technical solution of the present application in detail in combination with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0065] First, the structure of the laser projection device provided by the present application is described in detail below. Figure 5 This is a schematic diagram of the structure of a laser projection device provided in this application. Figure 5 As shown, the laser projection device may include a processor, a first switch module, at least one first chip, and at least one second chip. The first chip and the second chip may both be chips that do not support the online upgrade function. Exemplarily, the processor may be, for example, a system on chip (SOC) of the laser projection device.

[0066] For example, taking whether the first chip includes Flash as an example, the first chip can be divided into a first type and a second type. Among them, the first chip of the first type is a first chip that does not include Flash. The first chip of the second type can be a first chip that includes Flash. Taking the laser projection device including multiple first chips as an example, optionally, the types of the multiple first chips can be the same or different, and the present application does not limit this. For example, among the multiple first chips included in the laser projection device, there can be at least one first chip of the first type, and at least one first chip of the second type. In this implementation, the first chip of the first type can be connected to the Flash corresponding to the first chip. Alternatively, in some embodiments, among the first chips included in the laser projection device, there may be only a first chip of the first type, or only a first chip of the second type, etc.

[0067] Exemplarily, the first chip of the first type mentioned above may include: an FPGA chip. That is, the flash of the FPGA chip may be connected to the FPGA chip. Optionally, the role of the FPGA chip in the laser projection device may refer to the FPGA chip in any existing laser projection device, which is not limited in the present application. The first chip of the second type mentioned above may include: an MCU chip. The MCU chip includes flash. Optionally, the role of the MCU chip in the laser projection device may refer to the MCU chip in any existing laser projection device, which is not limited in the present application. Optionally, the second chip mentioned above may include: at least one DLP chip.

[0068] like Figure 5 As shown, the processor and the first switch module may both be connected to the first chip. The processor and the first switch module may both be connected to the second chip.

[0069] It should be understood that the present application does not limit the connection mode between the above-mentioned processor and the first chip, and the connection mode between the first switch module and the first chip. Optionally, the connection mode between the processor and the first chip and the connection mode between the first switch module and the first chip may be the same or different. For example, the communication protocol for firmware upgrade between the processor and each first chip, and the communication protocol for firmware upgrade between the first switch module and each first chip may both be I2C (the name of a simple, bidirectional two-wire synchronous serial bus, the full English name: Inter-Integrated Circuit) communication protocol.

[0070] The processor may obtain a first data packet of the first chip and a second data packet of the second chip. Then, the processor may use the first data packet to perform a firmware update on the first chip and use the second data packet to perform a firmware update on the second chip. Optionally, the firmware update may include, for example, firmware update operations such as firmware upgrade, which is not limited in the present application.

[0071] Optionally, the first data packet may include, for example, a logic program after the firmware corresponding to the first chip is updated. The second data packet may include, for example, a logic program after the firmware corresponding to the second chip is updated. It should be understood that, optionally, the contents included in the first data packets corresponding to different first chips may be different or the same. Optionally, the contents included in the second data packets corresponding to different second chips may be different or the same.

[0072] Exemplarily, the processor may, for example, obtain the first data packet and the second data packet from a USB flash drive by connecting to the USB flash drive. Alternatively, the processor may also obtain the first data packet and the second data packet through a wired network (e.g., connected to an Ethernet cable) or a wireless network (e.g., WiFi). Alternatively, the processor may also obtain the first data packet and the second data packet through any existing method of obtaining an upgrade package, which is not limited in this application.

[0073] Exemplarily, taking the above-mentioned first chip as an FPGA as an example, after the processor obtains the first data packet of the FPGA, for example, through the existing Android system's automatic upgrade method, based on the I2C communication protocol, the first data packet can be pushed to the FPGA chip, so that the FPGA chip upgrades the first data packet to the flash connected to the FPGA through the SPI interface protocol, thereby realizing the firmware upgrade of the FPGA. Taking the above-mentioned first chip as an MCU as an example, after the processor obtains the first data packet of the MCU, for example, based on the I2C communication protocol, the first data packet can be upgraded to the flash included in the MCU.

[0074] Taking the above-mentioned second chip as a DLP chip as an example, after the processor obtains the second data packet of the DLP, it can, for example, push the second data packet to each DLP, so that the DLP can upgrade the second data packet to the flash connected to the DLP through the Parallel interface, thereby realizing the firmware upgrade of the second chip.

[0075] When the processor is normal, the laser projection device can execute the firmware update operation of the first chip and the second chip through the processor. However, if the processor is abnormal, such as a bug in the processor operation, the laser projection device may not be able to update the chip firmware through the processor.

[0076] Optionally, the user can, for example, use a target connection line to connect the first switch module of the laser projection device to a target electronic device when the processor is abnormal (or the processor is normal).

[0077] The first switch module can obtain a first data packet when the first switch module is connected to the target electronic device through the target connection line and a first target voltage is detected, and a first channel between the first switch module and the first chip is turned on to send the first data packet to the first chip through the first channel. By sending the first data packet to the first chip, the first chip can use the first data packet to update the firmware of the first chip.

[0078] When the first switch module is connected to the target electronic device through the target connection line, if the first switch module detects the first target voltage, the first switch module can obtain the second data packet and conduct the second channel between the first switch module and the second chip to send the second data packet to the second chip through the second channel. By sending the second data packet to the second chip, the second chip can use the second data packet to update the firmware of the second chip.

[0079] Optionally, the values ​​of the first target voltage and the second target voltage may be different. In some embodiments, the first target voltage may be 0, and the second target voltage may be a voltage value that is not 0. In this implementation, the first switch module may obtain a first data packet when the second target voltage is not detected, and turn on the first channel between the first switch module and the first chip to send the first data packet to the first chip through the first channel. The first switch module may obtain a second data packet when the second target voltage is detected, and turn on the second channel between the first switch module and the second chip to send the second data packet to the second chip through the second channel. Alternatively, both the first target voltage and the second target voltage may be non-0.

[0080] Optionally, the first switch module can obtain the above-mentioned first data packet or second data packet from the target electronic device through the above-mentioned target connection line. Optionally, the target connection lines used for upgrading different chips may be different. For example, the target connection line for upgrading the second chip can output the above-mentioned second target voltage to the first switch module of the laser projection device through the above-mentioned target electronic device, so that the first switch module can detect the second target voltage. Therefore, the first switch module can determine to obtain the second data packet. The target connection line for upgrading the first chip may not be able to transmit voltage, so the first switch module of the laser projection device detects the first target voltage by connecting with the target electronic device through the target connection line of the first chip. Therefore, the first switch module can determine to obtain the first data packet.

[0081] Optionally, the first switch module can push the first data packet to the first chip through the I2C communication protocol, so that the first chip can use the first data packet to perform firmware update. Optionally, the first switch module can push the second data packet to the second chip, so that the second chip can use the second data packet to perform firmware update.

[0082] In this embodiment, the laser projection device can obtain the first data packet of the first chip and the second data packet of the second chip through the processor, and use the first data packet to perform firmware update on the first chip and use the second data packet to perform firmware update on the second chip through the processor. When the first switch module is connected to the target electronic device through the target connection line, the laser projection device can obtain the first data packet and use the first data packet to perform firmware update on the first chip when the first target voltage is detected through the first switch module; and obtain the second data packet and use the second data packet to perform firmware update on the second chip when the second target voltage is detected. Through the above-mentioned firmware update method, the multiple chips of the laser projection device can be updated online without disassembling the laser projection device, thereby improving the efficiency of the firmware update of the laser projection device. In addition, through the above-mentioned method, it is not necessary to have multiple different types of interfaces to perform firmware updates on different chips, thereby improving the integration of the laser projection device.

[0083] The following is a detailed description of how to update the firmware of the second chip when there is no abnormality in the above processor:

[0084] Figure 6a This is a schematic diagram of the structure of another laser projection device provided by this application. Figure 6a As shown, as a possible implementation, the second chip can be connected to the target first chip. The target first chip can be one of the at least one first chip. In this implementation, the processor can send a target level signal to the second chip through the target first chip, so that the second chip responds to the target level signal and uses the second data packet to perform firmware update according to the target upgrade method.

[0085] Optionally, the target level signal may be any preset level signal, such as a low level signal or a high level signal, etc., which is not limited in the present application.

[0086] Exemplarily, the target first chip may be, for example, an MCU. The MCU may output a target level signal so that the second chip may receive the target level signal for firmware update. The target upgrade method may refer to any existing chip firmware update method, and the present application will not repeat the descriptions here. Exemplarily, taking the second chip as a DLP as an example, the target upgrade method may refer to the firmware update method of the DLP when the laser projection device has an abnormal power failure.

[0087] In this embodiment, the laser projection device can send a target level signal to the second chip through the target first chip, so that the second chip responds to the target level signal and performs a firmware update, thereby triggering the second chip to start the firmware update, so that the firmware of the second chip can be updated without disassembling the laser projection device.

[0088] The following describes in detail how to update the firmware of the second chip by connecting the first switch module to the target device through the target connection line:

[0089] Figure 6b This is a schematic diagram of the structure of another laser projection device provided by this application. Figure 6b As shown, as a possible implementation, the other end of the second chip can also be connected to the other end of the first switch module. In this implementation, the first switch module can be connected to the target device through the target connection line and send the target level signal to the second chip when the second target voltage is detected, so that the second chip responds to the target level signal and uses the second data packet to perform firmware update according to the target upgrade method.

[0090] Optionally, when the first switch module detects the second target voltage, the first switch module can determine that the firmware of the second chip is currently being updated, so the first switch module can send the target level signal to the second chip to trigger the second chip to start executing the operation of "using the second data packet to perform firmware update in accordance with the aforementioned target upgrade method."

[0091] In this embodiment, when the processor is abnormal, the laser projection device can send a target level signal to the second chip through the first switch module, so that the second chip responds to the target level signal and performs a firmware update, thereby triggering the second chip to start the firmware update, so that when the processor is abnormal, the firmware of the second chip can be updated without disassembling the laser projection device.

[0092] Figure 7 This is a schematic diagram of the structure of another laser projection device provided by this application. Figure 7 As shown, as a possible implementation, the laser projection device may further include: a second switch module. The processor and the first switch module may be connected to the second chip through the second switch module.

[0093] In some embodiments, the second switch module can conduct the channel between the processor and the second chip when the processor is normal. By conducting the channel between the processor and the second chip, the processor can send the second data packet to the second chip, thereby laying a foundation for the firmware update of the second chip.

[0094] When the first switch module is connected to the target device through the target connection line and the second target voltage is detected, the second switch module can conduct the channel between the second switch module and the second chip. In this implementation, the first switch module can conduct the channel between the first switch module and the second switch module when the first switch module is connected to the target device through the target connection line and the second target voltage is detected. By conducting the channel between the second switch module and the second chip through the second switch module, and the first switch module conducts the channel between the first switch module and the second switch module, the second channel between the first switch module and the second chip can be conducted. Therefore, through the above method, the channel between the first switch module and the second chip can be conducted, so that the laser projection device can send the second data packet to the second chip through the first switch module and the second switch module, thereby laying the foundation for the firmware update of the second chip when the processor is abnormal.

[0095] The structure of the first switch module is described in detail below:

[0096] Figure 8 This is a schematic diagram of the structure of a first switch module provided in this application. Figure 8 As shown, as a possible implementation, the first switch module may include: a first interface, a first transistor, and a first switch unit. The first interface is an interface for connecting the first switch module to the target electronic device through a target connection line. The first interface may include: a voltage input sub-interface and a data transmission sub-interface.

[0097] The voltage input sub-interface is connected to the base of the first transistor. The collector of the first transistor can be connected to the first end of the first switch unit, and the second chip. In some embodiments, the first end of the first switch unit can also be a port for receiving the working voltage of the first switch unit (for example, it can come from the system power supply of the laser projection device). Optionally, the emitter of the first transistor can be grounded, for example. The second end of the first switch unit can be connected to the data transmission sub-interface. The third end of the first switch unit can be connected to the first chip. The fourth end of the first switch unit is connected to the second switch module.

[0098] Exemplarily, the target electronic device may be any existing electronic device capable of sending the first data packet and the second data packet to the first switch unit and capable of outputting the second target voltage and the first target voltage. For example, the target electronic device may be a personal computer (PC). Exemplarily, the first interface may be a Micro USB interface of the laser projection device.

[0099] In this implementation, the first switch unit can obtain a first data packet from the target electronic device through the above-mentioned data transmission sub-interface, and turn on the first channel between the first switch unit and the first chip to send the above-mentioned first data packet to the first chip through the first channel when the first target voltage transmitted from the target connection line to the base of the first transistor through the above-mentioned voltage input sub-interface (for example, the above-mentioned first switch unit can transmit the second target voltage to the base of the first transistor without the target connection line through the voltage input sub-interface).

[0100] Alternatively, when the target connection line transmits the second target voltage to the base of the first transistor through the voltage input sub-interface, that is, when the first switch unit detects through the voltage input sub-interface that the second target voltage is transmitted from the target connection line to the base of the first transistor, the first switch unit obtains a second data packet from the target electronic device through the above-mentioned data transmission sub-interface, and turns on the channel between the first switch unit and the second switch module to send the second data packet to the second chip through the aforementioned second channel.

[0101] In this embodiment, the laser projection device can determine whether the first target voltage and the second target voltage are detected through the first transistor in the first switch module, and then obtain the first data packet from the target electronic device through the data transmission sub-interface when the first target voltage is detected, laying the foundation for the subsequent upgrade of the first chip. When the second target voltage is detected, the second data packet is obtained from the target electronic device through the data transmission sub-interface, laying the foundation for the subsequent upgrade of the second chip.

[0102] The structure of the second switch module is described in detail below:

[0103] Fig. 9 This is a schematic diagram of the structure of a second switch module provided in this application. Fig. 9 As shown, as a possible implementation, the second switch module may include: a second switch unit, and a second triode. The first end of the second switch unit is connected to the fourth end of the first switch unit. The second end of the second switch unit may be connected to the processor. The third end of the second switch unit may be connected to the second chip. The above-mentioned voltage input sub-interface may be connected to the base of the second triode. The collector of the second triode may be connected to the fourth end of the second switch unit. In some embodiments, the fourth end of the second switch unit may also be a port for receiving the working voltage of the second switch unit (for example, from the system power supply of the laser projection device). In some embodiments, the emitter of the first triode may be grounded, for example.

[0104] The voltage input sub-interface is connected to the base of the second transistor in the second switch module, so that the second switch module can detect whether the second target voltage exists. If the second switch module detects the second target voltage through the second transistor, the second switch module can conduct the channel between the second switch module and the second chip to conduct the second channel, thereby enabling the first switch module to transmit the second data packet to the second chip, so that the second chip can perform firmware update based on the second data packet.

[0105] Fig.10 This is a schematic diagram of the structure of another laser projection device provided by this application. Fig.10 As shown, as a possible implementation, the laser projection device may further include: a connection module, wherein the second switch module may be connected to one end of the connection module, and the other end of the connection module is connected to a plurality of second chips.

[0106] Exemplarily, the connection module may be, for example, a USB Hub (a name for a hub). It should be understood that the present application does not limit the number of second chips that can be connected to the connection module.

[0107] Through the above-mentioned connection module, the second switch module can be connected to multiple second chips through the connection module, so that the second switch module does not need to reserve multiple interfaces for connecting the second chips, thereby reducing the complexity of the second switch module and improving the flexibility of the laser projection device.

[0108] It should be understood that Figure 5 , Figure 6a , Figure 6b , Figure 7 , Fig.10 The above is only an exemplary description of the first chip of the laser projection device by taking two first chips (eg, first chip 1 and first chip 2) as an example. Figure 5 , Figure 6a , Figure 6b , Fig.10 The above is only an exemplary description of the second chip of the laser projection device, taking four second chips (for example, second chip 1, second chip 2, second chip 3, second chip 4) as an example. This application does not limit the number of first chips and the number of second chips included in the laser projection device. For example, taking the laser projection device as an 8K laser TV and the second chip as DLP as an example, the laser projection device may include four DLPs. Taking the laser projection device as a 4K laser TV and the second chip as DLP as an example, the laser projection device may include 2 DLPs.

[0109] For example, the laser projection device is an 8K laser TV, the processor is the SOC of the laser TV, the first chip of the first type is an FPGA chip, the second chip of the second type is an MCU, the second chip is a DLP, the first switch module is USB1, the second switch module is USB2, and the connection module is a USB Hub. Fig.11 This is a schematic diagram of the structure of another laser projection device provided in this application.

[0110] When there is no abnormality in the SOC, the laser projection device can upgrade the firmware of the above chips through the SOC. Fig.11 As shown, the SOC can detect whether there is an upgrade package through an Ethernet cable or connecting to WiFi, or connecting to a USB flash drive, and when an upgrade package is detected, push the upgrade package to automatically upgrade through the Android system.

[0111] For example, the SOC can communicate with the FPGA through I2C and push the first data packet corresponding to the FPGA to the FPGA. Then, the FPGA can upgrade the upgrade package to the Flash of the FPGA through the SPI interface protocol. The SOC can communicate with the MCU through I2C and upgrade the first data packet corresponding to the MCU to the Flash of the MCU.

[0112] For example, Fig.12 A schematic structural diagram of another first switch module provided in the present application. Fig.13 A schematic diagram of the structure of another second switch module provided in the present application.

[0113] like Fig.12 As shown, transistor V72 (model MMBT3904LT1) can be the first transistor. The first switch unit (also called the first USB switch) N960 (model DIO3212MP10) can be the aforementioned first switch unit. DUSB+5 can be the aforementioned voltage input sub-interface. +3.3V_Normal can refer to the operating voltage of the first switch unit. Micro_DUSB_DP can be the aforementioned data transmission sub-interface. SCL_BL, and SDA_BL are connected to the SOC of the laser projection device. In addition, Fig.12 As shown, the first switch module may also include, for example, resistor R9481, resistor R9482, capacitor C6308, capacitor C6307, resistor R9483, inductor L2320, capacitor C6305, capacitor C6306, resistor R9484, resistor R9485 and other components. The connection relationship between the components and the component models can refer to the following. Fig.12 As shown in , I will not repeat them here.

[0114] Pin 2 of the first switch unit is Fig.13The 1st pin of the second switch unit N930 is connected as shown in FIG. 1 , and the 1st pin of the first switch unit is connected as shown in FIG. Fig.13 The second switch unit (also referred to as the second USB switch) shown in FIG. 1 is connected to the 2 pin of N930. The second switch unit can be connected to the SOC through USB3_DP and USB3_DM. The second switch unit can be connected to the second chip through DUSB_DAT_P and DUSB_DAT_N.

[0115] like Fig.13 As shown, transistor V53 may be the aforementioned second transistor. +3.3V_Normal may refer to the operating voltage of the second switch unit. DUSB_SW may refer to the USB signal channel switch (or switch). Fig.13 As shown, the second switch module may also include, for example: resistor R6097, resistor R6098, resistor R700, resistor R287, capacitor C446, capacitor C828, capacitor C709, capacitor C710, and inductor L2301. The connection relationship between the components and the component models can refer to the following. Fig.13 As shown in , I will not repeat them here.

[0116] Based on Fig.12 He Ru Fig.13 As shown, the SOC and DLP are connected through the USB2 switch (the second switch module). If the USB2 switch does not detect the 5V power supply of the Micro USB interface, the general-purpose input / output (GPIO) defaults to a high level. The channel between the USB2 switch and the DLP chip is opened by default, and the second data packet is subsequently pushed to each DLP chip through a one-to-four USB hub. The SOC communicates through I2C to enable the MCU to send a GPIO to pull down the hold boot switch of the DLP chip (that is, the SOC sends instructions through I2C to control the MCU to output a low GPIO level to pull down the four DLP holdboot switches), causing the four DLPs to enter an abnormal power-off upgrade state, so that each DLP can perform a firmware upgrade synchronously.

[0117] When there is an abnormality in the mainboard SOC, the laser projection device can realize offline upgrade of each chip of the display board without disassembling the device based on the unified Micro USB interface of the laser projection device.

[0118] Taking the above-mentioned target electronic device as a PC computer as an example, the PC computer can connect an upgrade cable to the Micro USB interface of the mainboard to perform offline upgrades on the above-mentioned chips.

[0119] Taking FPGA upgrade as an example, the PC is connected to the Micro USB port (without 5V power supply) of the laser projection device through the upgrade cable (I2C protocol upgrade cable). Therefore, the USB1 switch does not detect the 5V power supply. Fig.12 and Fig.13 , the GPIO defaults to high level, and the channel between the USB1 switch and the FPGA is open. USB1 can push the first data packet to the FPGA through the I2C communication protocol. Then, the FPGA performs Flash firmware upgrade through the SPI interface protocol.

[0120] Taking MCU upgrade as an example, the PC is connected to the Micro USB port (without 5V power supply) of the laser projection device through the upgrade cable (I2C protocol upgrade cable). Therefore, the USB1 switch does not detect the 5V power supply. Fig.12 and Fig.13 , the GPIO defaults to a high level, and the channel between the USB1 switch and the MCU is opened. USB1 can push the first data packet to the MCU through the I2C communication protocol, so that the MCU can perform a firmware upgrade.

[0121] Taking DLP upgrade as an example, the PC is connected to the Micro USB port (with 5V power supply) of the laser projection device through the upgrade cable (USB protocol upgrade cable). Therefore, the USB1 switch detects the 5V power supply, based on the following Fig.12 and Fig.13 , then GPIO becomes low level, and the channel between USB1 switch and USB2 switch is opened. At the same time, USB2 switch detects Micro USB 5V power supply, GPIO becomes low level, and the channel between USB2 switch and DLP chip is opened. Then, the second data packet is pushed to each DLP chip through the one-to-four USB Hub. The USB1 switch can also pull down the hold boot switch of the DLP chip through GPIO, so that the four DLPs enter the abnormal power-off upgrade state, so that each DLP can perform firmware upgrade synchronously.

[0122] In this embodiment, the hardware design of the laser projection device is upgraded with a compatible interface, and the firmware of all chips is upgraded through the SOC. And through a unified Micro USB interface, offline firmware upgrades of various chips of the laser projection device can be achieved without disassembling the device. Therefore, through the above firmware upgrade method, the efficiency of firmware upgrade is improved, and the integration of the laser projection device is improved.

[0123] The present application also provides a firmware update method, the specific implementation of which can refer to the firmware update method described in any of the above embodiments, which will not be described in detail here. The firmware update method provided in the embodiments of the present application has similar principles and technical effects, which will not be described in detail here.

[0124] The present application also provides a computer-readable storage medium, which may include: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, and other media that can store program codes. Specifically, the computer-readable storage medium stores program instructions, and the program instructions are used for the methods in the above embodiments.

[0125] The present application also provides a program product, which includes an execution instruction, which is stored in a readable storage medium. At least one control module of the laser projection device can read the execution instruction from the readable storage medium, and at least one control module executes the execution instruction so that the laser projection device implements the firmware update method provided by the various embodiments described above.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0127] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A laser projection device, characterized in that: The laser projection device includes a processor, a first switch module, at least one first chip, and at least one second chip, wherein the processor and the first switch module are both connected to the first chip, and the processor and the first switch module are both connected to the second chip; the processor is configured as follows: Acquire a first data packet of the first chip and a second data packet of the second chip; Using the first data packet to perform firmware update on the first chip, and using the second data packet to perform firmware update on the second chip; When the first switch module is connected to the target electronic device through the target connection line, the first switch module is configured as follows: If the first target voltage is detected, the first data packet is acquired, and a first channel between the first switch module and the first chip is turned on to send the first data packet to the first chip through the first channel; If the second target voltage is detected, the second data packet is acquired, and a second channel between the first switch module and the second chip is turned on to send the second data packet to the second chip through the second channel.

2. The laser projection device according to claim 1, characterized in that: The second chip is connected to a target first chip, the target first chip is one of the at least one first chip, and the processor is configured to: A target level signal is sent to the second chip through the target first chip, so that the second chip responds to the target level signal and uses the second data packet to perform firmware update according to the target upgrade method.

3. The laser projection device according to claim 2, characterized in that: The first switch module is configured as follows: When the first switch module is connected to the target device through the target connection line and the second target voltage is detected, the target level signal is sent to the second chip so that the second chip responds to the target level signal and uses the second data packet to update the firmware according to the target upgrade method.

4. The laser projection device according to any one of claims 1 to 3, characterized in that: The laser projection device further includes: a second switch module, through which the processor and the first switch module are connected to the second chip; the second switch module is configured as follows: Conducting a channel between the processor and the second chip; or, When the first switch module is connected to the target device through the target connection line and the second target voltage is detected, the channel between the second switch module and the second chip is turned on; when the first switch module is connected to the target device through the target connection line and the second target voltage is detected, the first switch module is configured to: turn on the channel between the first switch module and the second switch module.

5. The laser projection device according to claim 4, characterized in that: The first switch module includes: a first interface, a first transistor, and a first switch unit, the first interface is an interface for connecting the first switch module to the target electronic device through a target connection line, and the first interface includes: a voltage input sub-interface and a data transmission sub-interface; The voltage input sub-interface is connected to the base of the first transistor, the collector of the first transistor is connected to the first end of the first switch unit and the second chip, the second end of the first switch unit is connected to the data transmission sub-interface, the third end of the first switch unit is connected to the first chip, and the fourth end of the first switch unit is connected to the second switch module; The first switch unit is configured as: When the first target voltage transmitted from the target connection line to the base of the first transistor is detected through the voltage input sub-interface, the first data packet is obtained from the target electronic device through the data transmission sub-interface, and the first channel between the first switch unit and the first chip is turned on to send the first data packet to the first chip through the first channel; When the transmission of the second target voltage from the target connection line to the base of the first transistor is detected through the voltage input sub-interface, the second data packet is obtained from the target electronic device through the data transmission sub-interface, and the channel between the first switch unit and the second switch module is turned on to send the second data packet to the second chip through the second channel.

6. The laser projection device according to claim 5, characterized in that: The second switch module includes: a second switch unit, and a second transistor; the first end of the second switch unit is connected to the fourth end of the first switch unit, the second end of the second switch unit is connected to the processor, and the third end of the second switch unit is connected to the second chip; the voltage input sub-interface is connected to the base of the second transistor, and the collector of the second transistor is connected to the fourth end of the second switch unit.

7. The laser projection device according to claim 4, characterized in that: The laser projection device further includes: a connection module, the second switch module is connected to one end of the connection module, and the other end of the connection module is connected to the first ends of the plurality of second chips.

8. The laser projection device according to any one of claims 1 to 3, characterized in that: The laser projection device includes multiple first chips, among which there is at least one first chip of the first type and at least one first chip of the second type; the first chip of the first type is a first chip that does not include Flash; the first chip of the first type is connected to the corresponding Flash; the second chip of the second type is a first chip that includes Flash; the second chip includes: at least one digital light processing DLP chip.

9. The laser projection device according to any one of claims 1 to 3, characterized in that: The communication protocol for firmware upgrade between the processor and each of the first chips, and the communication protocol for firmware upgrade between the first switch module and each of the first chips are both I2C communication protocols.

10. A firmware update method, characterized in that: The method is applied to a laser projection device, which includes a processor, a first switch module, at least one first chip, and at least one second chip, wherein the processor and the first switch module are both connected to the first chip, and the processor and the first switch module are both connected to the second chip; the method includes: Obtaining, by the processor, a first data packet of the first chip and a second data packet of the second chip; updating the firmware of the first chip using the first data packet and updating the firmware of the second chip using the second data packet; When the first switch module is connected to the target electronic device through the target connection line, if the first target voltage is detected through the first switch module, the first data packet is obtained, and the first channel between the first switch module and the first chip is turned on to send the first data packet to the first chip through the first channel; if the second target voltage is detected, the second data packet is obtained, and the second channel between the first switch module and the second chip is turned on to send the second data packet to the second chip through the second channel.

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