Wafer fixing device and operation method thereof

Abstract

The invention provides a wafer fixing device. The wafer holding device includes a platen configured to support a semiconductor wafer and a holder assembly. The fixture assembly includes: a mounting member coupled to the platen; a lever; and a biasing member including a first end coupled to the lever and a second end coupled to the mounting member. A biasing member is configured to bias the lever to a closed position relative to the platen. The lever prevents movement of the semiconductor wafer when the lever is in the closed position. The embodiment of the invention also relates to a method for operating the wafer fixing device.

Description

Technical Field

[0001] Embodiments of the present application relate to a wafer fixing device and an operating method thereof. Background Art

[0002] Semiconductor devices are formed on, in and / or from semiconductor wafers and are used in a variety of electronic devices, such as mobile phones, laptops, desktop computers, tablet computers, watches, gaming systems, and a variety of other industrial, commercial, and consumer electronic products. One or more semiconductor manufacturing processes are performed to form semiconductor devices on, in and / or from semiconductor wafers. Summary of the invention

[0003] Some embodiments of the present application provide a wafer fixing device, comprising: a table configured to support a semiconductor wafer; and a fixture assembly, comprising: a mounting member coupled to the table; a lever; and a biasing member, comprising a first end coupled to the lever and a second end coupled to the mounting member, wherein: the biasing member is configured to bias the lever to a closed position relative to the table; and when the lever is in the closed position, the lever prevents movement of the semiconductor wafer.

[0004] Other embodiments of the present application provide a method for operating a wafer fixing device, which includes: a table configured to support a semiconductor wafer; a fixture assembly including a lever and a biasing member configured to bias the lever to a closed position relative to the table; and a lever engaging member configured to engage the lever; and the method includes: applying a lever opening force to the lever through the lever engaging member to move the lever from the closed position to an open position relative to the table; and when the lever is in the open position, transferring the semiconductor wafer to a target wafer position relative to the table.

[0005] Some other embodiments of the present application provide a wafer fixing device, comprising: a table configured to support a semiconductor wafer; a first fixture assembly comprising: a first mounting member coupled to the table; and a first lever pivotally coupled to the first mounting member; and a second fixture assembly comprising: a second mounting member coupled to the table; and a second lever pivotally coupled to the second mounting member; and a lever engaging structure comprising: a main body; a first lever engaging member protruding from the main body and configured to engage the first lever; and a second lever engaging member protruding from the main body and configured to engage the second lever, wherein: when the first lever is in When the first lever is in a first closed position relative to the table, the first lever prevents movement of the semiconductor wafer; when the second lever is in a second closed position relative to the table, the second lever prevents movement of the semiconductor wafer; and the lever engagement structure is configured to simultaneously: apply a first lever opening force to the first lever through the first lever engagement member to move the first lever from the first closed position to the first open position relative to the table; and apply a second lever opening force to the second lever through the second lever engagement member to move the second lever from the second closed position to the second open position relative to the table. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] When read in conjunction with the accompanying drawings, various aspects of the disclosed embodiments can be best understood from the following detailed description. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, for clarity of discussion, the size of the various components may be arbitrarily increased or reduced.

[0007] Figure 1 A side view of a wafer holding device according to some embodiments is shown.

[0008] Figure 2A A wafer holding device is shown in a closed state according to some embodiments.

[0009] Figure 2B A wafer holding device is shown during transition from a closed state to an open state in accordance with some embodiments.

[0010] Figure 2C A wafer holding device is shown in an open state according to some embodiments.

[0011] Figure 2D A semiconductor wafer is shown positioned relative to a wafer holder in an open state in accordance with some embodiments.

[0012] Figure 2E A semiconductor wafer is shown being held by a wafer holding device in a closed state, in accordance with some embodiments.

[0013] Figure 3 A perspective view of a portion of a wafer holding device is shown in accordance with some embodiments.

[0014] Figure 4 A top view of a wafer holding device is shown when a semiconductor wafer is held by the wafer holding device, according to some embodiments.

[0015] Figure 5A A top view of a wafer holding device is shown in accordance with some embodiments.

[0016] Figure 5B A top view of a wafer holding device is shown in accordance with some embodiments.

[0017] Figure 6 A cross-sectional view of a portion of a semiconductor wafer including an edge of the semiconductor wafer is shown in accordance with some embodiments.

[0018] Fig. 7A A holder assembly of a wafer holding device according to some embodiments is shown.

[0019] Figure 7B A biasing member of a wafer holding device according to some embodiments is shown.

[0020] Fig. 8A A top view of a wafer holding device in an environment including a processor box and / or a processing chamber is shown in accordance with some embodiments.

[0021] Figure 8B A top view of a wafer holding device in an environment including a processor box and / or a processing chamber is shown in accordance with some embodiments.

[0022] Figure 8C A top view of a wafer holding device in an environment including a processor box and / or a processing chamber is shown in accordance with some embodiments.

[0023] Fig.8D A top view of a wafer holding device in an environment including a processor box and / or a processing chamber is shown in accordance with some embodiments.

[0024] Fig. 8E A top view of a wafer holding device in an environment including a processor box and / or a processing chamber is shown in accordance with some embodiments.

[0025] Fig. 9 Schemes related to a semiconductor manufacturing process according to some embodiments are shown.

[0026] Fig. 10A A wafer holding device is shown in a closed state according to some embodiments.

[0027] Fig. 10B A wafer holding device is shown in an open state according to some embodiments.

[0028] Fig.11 is a flow chart illustrating a method of operating a wafer holding device according to some embodiments.

[0029] Fig.12 Exemplary computer-readable media are shown according to some embodiments, which may include processor-executable instructions configured to embody one or more of the provisions set forth herein. DETAILED DESCRIPTION

[0030] The following disclosure provides many different embodiments or examples for realizing the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the disclosed embodiments. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are directly contacted, and may also include an embodiment in which an additional component may be formed between the first component and the second component so that the first component and the second component may not be in direct contact. In addition, the disclosed embodiments may repeat reference numerals or characters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0031] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another (or additional) elements or components as shown in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should likewise be interpreted accordingly.

[0032] Semiconductor wafers are subjected to various processes during the manufacture of semiconductor devices. In some embodiments, when the semiconductor manufacturing process is performed on the semiconductor wafer, the semiconductor wafer is fixed by a wafer fixing device. Some wafer fixing devices use a clamp ring (wherein the clamp extends inward from the clamp ring) to fix the semiconductor wafer, and require the semiconductor wafer to be fixed through a slit in the clamp ring. However, passing the semiconductor wafer through the slit increases the possibility of damage to the semiconductor wafer, such as at least one of scratches, cracks, etc.

[0033] According to some embodiments, a wafer fixture device is provided that includes a platen and a fixture assembly coupled to the platen. The fixture assembly includes at least one of a mounting member, a lever, or a biasing member. In some embodiments, the fixture assembly includes a first end coupled to the lever and a second end coupled to the mounting member. In some embodiments, the biasing member is configured to bias the lever to a closed position relative to the platen. In some embodiments, the wafer fixture device includes a lever engagement member configured to apply a lever opening force to the lever to move the lever from a closed position to an open position relative to the platen. In some embodiments, when the lever is in the open position, the semiconductor wafer is mounted relative to the wafer fixture device, thereby providing a reduced possibility of damaging the semiconductor wafer when the semiconductor wafer is mounted relative to the wafer fixture device compared to a wafer fixture device that requires the semiconductor wafer to pass through a slit defined by a clamp ring.

[0034] Figure 1 A wafer fixing device 100 according to some embodiments is shown. In some embodiments, the wafer fixing device 100 includes at least one of a platen 114, a first fixture assembly 152, a second fixture assembly 154, a lever engagement structure 156, or one or more other components configured to support a semiconductor wafer 104. In some embodiments, the semiconductor wafer 104 is disposed on a surface 114a of the platen 114. In some embodiments, the semiconductor wafer 104 includes at least one of a substrate, a photomask, a semiconductor device, a die, etc. In some embodiments, the wafer fixing device 100 is configured to fix the semiconductor wafer 104 when a semiconductor manufacturing process is performed on the semiconductor wafer 104.

[0035] In some embodiments, the first fixture assembly 152 (such as a first clamping unit) includes a first lever 102, a first mounting member 106 (in Figure 1In some embodiments, the first lever 102 is coupled to (such as pivotally coupled to) the first mounting member 106. In some embodiments, the first biasing member 108 includes at least one of a first end 108a coupled to the first lever 102 or a second end 108b coupled to the first mounting member 106. In some embodiments, the first biasing member 108 includes at least one of a first spring, a first solenoid (not shown), or other suitable biasing devices. In some embodiments, the first lever 102 includes at least one of a first weighted region 162, a first fulcrum region 164, or a first powered region 165. In some embodiments, the first fulcrum region 164 is pivotally coupled to the first mounting member 106.

[0036] In some embodiments, the first biasing member 108 is configured to bias the first lever 102 to a first closed position relative to the platen 114 . Figure 1 The first lever 102 is depicted in a first closed position according to some embodiments. In some embodiments, the first lever 102 transitions between a first closed position and a first open position relative to the platen 114. Figure 2C The first lever 102 is depicted in a first open position according to some embodiments. In some embodiments, the first biasing member 108 is configured to apply a first biasing force to the first lever 102. In some embodiments, the first end 108a of the first biasing member 108 is coupled to the first powered region 165 of the first lever 102. In some embodiments, the first biasing member 108 applies a first biasing force to the first powered region 165 of the first lever 102 to rotate the first lever 102 in a first lever closing direction 168 about an axis 166 passing through the first fulcrum region 164. In some embodiments, the axis 166 extends through the location of a first pivot axis (not shown) that pivotally couples the first fulcrum region 164 to the first mounting member 106. In some embodiments, the wafer holding device 100 includes a first hard stop (not shown) configured to prevent the first lever 102 from moving in the first lever closing direction 168 beyond a defined position, such as a first closed position of the first lever 102 or other positions of the first lever 102. Thus, according to some embodiments, when the first lever 102 is in the first closed position, the first hard stop prevents the first lever 102 from moving (further) in the first lever closing direction 168 even when the first biasing member 108 applies the first biasing force to the first powered region 165 .

[0037] In some embodiments, when the first lever 102 is in the first open position, the first spring of the first biasing member 108 is in an uncompressed and / or extended state. In some embodiments, when the first lever 102 is in the first open position, the first spring of the first biasing member 108 is in a compressed and / or loaded state. Other configurations of the first spring and / or the first biasing member 108 are within the scope of the disclosed embodiments. In some embodiments, when the first lever 102 is in the first open position, the first biasing force is greater than when the first lever 102 is in the first closed position.

[0038] In some embodiments, when the first lever 102 is in the first closed position, the first lever 102 blocks the first movement path 158 of the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first closed position, the first protrusion 162a of the first weighted region 162 is located above the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first closed position, the first lever 102 is in at least one of direct contact with the semiconductor wafer 104 or indirect contact with the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first closed position, the first lever 102 is in at least one of direct contact with the first surface 104a of the semiconductor wafer 104 or indirect contact with the first surface 104a of the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first closed position, the first lever 102 is in at least one of direct contact with an edge of the semiconductor wafer 104 or indirect contact with an edge of the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first closed position, the first lever 102 or at least one of the one or more other levers of the wafer holding device 100 applies a wafer holding force to the semiconductor wafer 104 to hold the semiconductor wafer 104 at a target wafer position, such as Figure 1 . In some embodiments, when the first lever 102 is in the first closed position, the first lever 102 applies a first wafer holding force to the semiconductor wafer 104 (e.g., to an edge of the semiconductor wafer 104) in a first lever closing direction 168. In some embodiments, the first wafer holding force applied to the semiconductor wafer 104 is generated by a first biasing force applied to the first lever 102 by the first biasing member 108.

[0039] In some embodiments, the lever engagement structure 156 includes a first lever engagement member 120 configured to engage the first lever 102. In some embodiments, the first lever engagement member 120 is configured to apply a first lever opening force to the first lever 102 to move the first lever 102 from the first closed position to the first open position relative to the platen 114. In some embodiments, the first lever engagement member 120 is coupled to the first power region 165 of the first lever 102. In some embodiments, the first lever engagement member 120 applies the first lever opening force to the first power region 165 of the first lever 102 to rotate the first lever 102 in a first lever opening direction 160 about an axis 166 passing through the first fulcrum region 164. In some embodiments, the first lever opening direction 160 is opposite to the first lever closing direction 168. In some embodiments, when the first lever opening force applied by the first lever engagement member 120 overcomes the first biasing force applied by the first biasing member 108, the first lever 102 is moved from the first closed position (such as Figure 1 ) to a first open position (such as Figure 2C ).

[0040] In some embodiments, when the first lever 102 is in the first open position, the first lever 102 does not block the first movement path 158 of the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first open position, the first protrusion 162a is not located above the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first open position, the first lever 102 does not contact the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first open position, the first lever 102 or at least one of the one or more other levers of the wafer holding device 100 does not apply a wafer holding force to the semiconductor wafer 104. In some embodiments, when the first lever 102 is in the first open position, the first lever 102 does not apply a first wafer holding force to the semiconductor wafer 104 in the first lever closing direction 168.

[0041] In some embodiments, the second fixture assembly 154 (such as a second clamping unit) includes a second lever 110, a second mounting member 112 (in Figure 1In some embodiments, the second lever 110 is coupled to (e.g., pivotally coupled to) the second mounting member 112. In some embodiments, the second biasing member 142 includes at least one of a first end 142a coupled to the second lever 110 or a second end 142b coupled to the second mounting member 112. In some embodiments, the second biasing member 142 includes at least one of a second spring, a second solenoid (not shown), or other suitable biasing device. In some embodiments, the second lever 110 includes at least one of a second weight region 172, a second fulcrum region 174, or a second power region 175. In some embodiments, the second fulcrum region 174 is pivotally coupled to the second mounting member 112.

[0042] In some embodiments, the second biasing member 142 is configured to bias the second lever 110 to a second closed position relative to the platen 114 . Figure 1 The second lever 110 is depicted in a second closed position according to some embodiments. In some embodiments, the second lever 110 transitions between a second closed position and a second open position relative to the platen 114. Figure 2C The second lever 110 is depicted in a second open position according to some embodiments. In some embodiments, the second biasing member 142 is configured to apply a second biasing force to the second lever 110. In some embodiments, the first end 142a of the second biasing member 142 is coupled to the second power region 175 of the second lever 110. In some embodiments, the second biasing member 142 applies a second biasing force to the second power region 175 of the second lever 110 to rotate the second lever 110 in a second lever closing direction 178 about an axis 176 passing through the second fulcrum region 174. In some embodiments, the axis 176 extends through the position of a second pivot (not shown) that pivotally couples the second fulcrum region 174 to the second mounting member 112. In some embodiments, the wafer holding device 100 includes a second hard stop (not shown) configured to prevent the second lever 110 from moving beyond a defined position (such as a second closed position of the second lever 110 or other positions of the second lever 110) in the second lever closing direction 178. Thus, according to some embodiments, when the second lever 110 is in the second closed position, the second hard stop prevents the second lever 110 from moving (further) in the second lever closing direction 178 even when the second biasing member 142 applies the second biasing force to the second powered region 175 .

[0043] In some embodiments, when the second lever 110 is in the second open position, the second spring of the second biasing member 142 is in an uncompressed and / or extended state. In some embodiments, when the second lever 110 is in the second open position, the second spring of the second biasing member 142 is in a compressed and / or loaded state. Other configurations of the second spring and / or the second biasing member 142 are within the scope of the disclosed embodiments. In some embodiments, when the second lever 110 is in the second open position, the second biasing force is greater than when the second lever 110 is in the second closed position.

[0044] In some embodiments, when the second lever 110 is in the second closed position, the second lever 110 blocks the first movement path 158 of the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second closed position, the second protrusion 172a of the second weighted region 172 is located above the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second closed position, the second lever 110 is in at least one of direct contact with the semiconductor wafer 104 or indirect contact with the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second closed position, the second lever 110 is in at least one of direct contact with the first surface 104a of the semiconductor wafer 104 or indirect contact with the first surface 104a of the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second closed position, the second lever 110 is in at least one of direct contact with the edge of the semiconductor wafer 104 or indirect contact with the edge of the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second closed position, the second lever 110 or at least one of the one or more other levers of the wafer holding device 100 applies a wafer holding force to the semiconductor wafer 104 to hold the semiconductor wafer 104 in a target wafer position. In some embodiments, when the second lever 110 is in the second closed position, the second lever 110 applies a second wafer holding force to the semiconductor wafer 104 (e.g., to an edge of the semiconductor wafer 104) in a second lever closing direction 178. In some embodiments, the second wafer holding force applied to the semiconductor wafer 104 is generated by a second biasing force applied to the second lever 110 by the second biasing member 142.

[0045] In some embodiments, the lever engagement structure 156 includes a second lever engagement member 122 configured to engage the second lever 110. In some embodiments, the second lever engagement member 122 is configured to apply a second lever opening force to the second lever 110 to move the second lever 110 from the second closed position to the second open position relative to the platen 114. In some embodiments, the second lever engagement member 122 is coupled to the second power region 175 of the second lever 110. In some embodiments, the second lever engagement member 122 applies the second lever opening force to the second power region 175 of the second lever 110 to rotate the second lever 110 in a second lever opening direction 170 about an axis 176 passing through the second fulcrum region 174. In some embodiments, the second lever opening direction 170 is opposite to the second lever closing direction 178. In some embodiments, when the second lever opening force applied by the second lever engagement member 122 overcomes the second biasing force applied by the second biasing member 142, the second lever 110 is moved from the second closed position (such as Figure 1 ) to a second open position (such as Figure 2C ).

[0046] In some embodiments, when the second lever 110 is in the second open position, the second lever 110 does not block the first movement path 158 of the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second open position, the second protrusion 172a is not located above the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second open position, the second lever 110 does not contact the semiconductor wafer 104. In some embodiments, when the second lever 110 is in the second open position, the second lever 110 does not apply the second wafer fixing force to the semiconductor wafer 104 in the second lever closing direction 178.

[0047] In some embodiments, the wafer fixture device 100 includes any number of fixture assemblies, such as one fixture assembly (e.g., the first fixture assembly 152), two fixture assemblies (e.g., the first fixture assembly 152 and the second fixture assembly 154), three fixture assemblies, four fixture assemblies, or more than four fixture assemblies. In some embodiments, each fixture assembly of some or all of the fixture assemblies of the wafer fixture device 100 includes at least some of the elements (e.g., levers, mounting members, and / or biasing members), configurations, etc., and the relationships between them provided herein with respect to the first fixture assembly 152 and / or the second fixture assembly 154. In some embodiments, the fixture assemblies of the wafer fixture device 100 are configured to be operated simultaneously by the lever engagement structure 156.

[0048] In some embodiments, the lever engagement structure 156 includes a body 124. In some embodiments, at least one of the first lever engagement member 120 or the second lever engagement member 122 protrudes from the body 124 of the lever engagement structure 156. In some embodiments, at least one of the first lever engagement member 120 or the second lever engagement member 122 is attached to the body 124. It should be understood that, as used herein, by attachment, the first lever engagement member 120, the second lever engagement member 122, and the body 124 are not limited to including three separate structures attached. Instead, in some embodiments, at least two of the first lever engagement member 120, the body 124, or the second lever engagement member 122 are integrally formed, one-piece formed, a single composite piece, etc. In some embodiments, the lever engagement structure 156 includes two or three or more separate structures attached, such as with mechanical fasteners, welding, adhesives, etc.

[0049] In some embodiments, the lever engagement structure 156 is configured to simultaneously engage some or all of the levers of the wafer fixing device 100. In some embodiments, the lever engagement structure 156 includes any number of lever engagement members, such as one lever engagement member (e.g., the first lever engagement member 120), two lever engagement members (e.g., the first lever engagement member 120 and the second lever engagement member 122), three lever engagement members, four lever engagement members, or more than four lever engagement members. In some embodiments, the number of lever engagement members of the lever engagement structure 156 matches the number of fixture assemblies of the wafer fixing device 100. In some embodiments, for each fixture assembly of the wafer fixing device 100, the lever engagement structure 156 includes a lever engagement member configured to engage a lever of the fixture assembly. In some embodiments, each of the lever engagement members of one, some, or all of the lever engagement members of the lever engagement structure 156 includes an (adapter) pin. In some embodiments, at least one of the following exists: the first lever engagement member 120 includes a first (adapter) pin; or the second lever engagement member 122 includes a second (adapter) pin. In some embodiments, each of one, some or all of the fixture assemblies of the wafer fixture device 100 includes a (side fixture) chuck pin. In some embodiments, at least one of the following conditions exists: the first lever 102 includes a first (side fixture) chuck pin; or the second lever 110 includes a second (side fixture) chuck pin.

[0050] In some embodiments, the wafer holding device 100 switches between an open state and a closed state. Figure 1 The wafer holding device 100 is depicted in a closed state according to some embodiments. Figure 2CThe wafer fixture device 100 is depicted in an open state according to some embodiments. In some embodiments, when the wafer fixture device 100 is in the open state, one, some, or all of the levers of the wafer fixture device 100 are in respective open positions relative to the platen 114. For example, when the wafer fixture device 100 is in the open state, at least one of the following conditions exists: the first lever 102 is in the first open position; the second lever 110 is in the second open position; or one or more other levers of the wafer fixture device 100 are in respective open positions. In some embodiments, when the wafer fixture device 100 is in the open state, the first movement path 158 of the semiconductor wafer 104 is not blocked by one, some, or all of the levers of the wafer fixture device 100.

[0051] In some embodiments, when the wafer fixture device 100 is in the closed state, one, some, or all of the levers of the wafer fixture device 100 are in respective open positions relative to the platen 114. In some embodiments, when the wafer fixture device 100 is in the closed state, one, some, or all of the levers of the wafer fixture device 100 are in respective closed positions relative to the platen 114. For example, when the wafer fixture device 100 is in the closed state, at least one of the following conditions exists: the first lever 102 is in the first closed position; the second lever 110 is in the second closed position; or one or more other levers of the wafer fixture device 100 are in respective closed positions. In some embodiments, when the wafer fixture device 100 is in the closed state, the first movement path 158 of the semiconductor wafer 104 is blocked by one, some, or all of the levers of the wafer fixture device 100. In some embodiments, when the wafer fixing device 100 is in a closed state, one, some or all of the levers of the wafer fixing device 100 apply a wafer fixing force to the semiconductor wafer 104, such as a first wafer fixing force applied by the first lever 102, a second wafer fixing force applied by the second lever 110, or at least one of one or more other wafer fixing forces applied by one or more other levers of the wafer fixing device 100, so as to fix the semiconductor wafer 104 at a target wafer position relative to the platen 114.

[0052] In some embodiments, before the semiconductor wafer 104 is secured by the wafer securing device 100, the wafer securing device 100 is switched from a closed state to an open state to receive the semiconductor wafer 104. In some embodiments, when switched to the open state, the wafer securing device 100 remains in the open state for a period of time while the semiconductor wafer 104 is moved to a target wafer position relative to the platen 114. In some embodiments, the semiconductor wafer 104 is moved to the target wafer position, such as being placed on the surface 114a of the platen 114, using at least one of a robot arm, a transfer assembly, or other suitable assembly. In some embodiments, in response to the semiconductor wafer 104 being moved to the target wafer position (e.g., in response to the semiconductor wafer 104 being placed on the surface 114a of the platen 114), the wafer securing device 100 is switched from the open state to the closed state to secure the semiconductor wafer 104. In some embodiments, when switched to the closed state, the wafer securing device 100 remains in the closed state for a period of time to secure the semiconductor wafer 104 at the target wafer position relative to the platen 114 while a semiconductor manufacturing process is performed on the semiconductor wafer 104. In some embodiments, in response to the completion of the semiconductor manufacturing process, the wafer holding device 100 is switched from the closed state to the open state to release the semiconductor wafer 104. In some embodiments, when switched to the open state, the wafer holding device 100 remains in the open state for a period of time to allow the semiconductor wafer 104 to be collected and / or moved from the target wafer position relative to the platen 114 to a location such as at least one of a wafer storage device, a processing station, etc. In some embodiments, the wafer storage device (not shown) includes at least one of a front opening unified box (FOUP), a cassette box, a reticle box, or other types of wafer storage devices. In some embodiments, the semiconductor wafer 104 is collected and / or moved to the location using at least one of a robot arm, a transfer assembly, or other suitable assembly.

[0053] In some embodiments, the wafer holding device 100 includes a hard stop device 116 configured to separate the semiconductor wafer 104 from the semiconductor processing components by at least a threshold distance. Figure 1 In some embodiments, the hard stop device 116 is coupled (such as removably mounted) to the platen 114. In some embodiments, the hard stop device 116 has a fixed position relative to the platen 114.

[0054] At least one of the following conditions exists: (i) size d1 ( Figure 1) is between about 15 mm and about 25 mm; (ii) dimension d2 is between about 15 mm and about 22 mm; (iii) the sum of dimension d3 and dimension d4 is between about 150 mm and about 235 mm; (iv) dimension d5 is between about 15 mm and about 18.5 mm; and (v) dimension d6 is between about 18.5 mm and about 19.5 mm. Other values ​​of dimension d1, dimension d2, the sum of dimension d3 and dimension d4, dimension d5, and dimension d6 are within the scope of the embodiments of the present disclosure. In some embodiments, at least one of dimension d1, dimension d2, dimension d3, dimension d4, dimension d5, or dimension d6 is configured based on the wafer size of at least one of the semiconductor wafer 104 or one or more other semiconductor wafers that the wafer fixing device 100 is configured to fix. In some embodiments, dimension d1 corresponds to the lever (e.g., at least one of the first lever 102, the second lever 110, etc.) along the z direction ( Figure 1 In some embodiments, dimension d2 corresponds to the thickness of platen 114 along the z-direction. In some embodiments, dimension d3 corresponds to the length of platen 114 in the x-direction ( Figure 1 ). In some embodiments, the x-direction corresponds to a radial direction (e.g., relative to the platen 114). In some embodiments, the dimension d3 corresponds to a diameter of the platen 114. In some embodiments, the dimension d4 corresponds to a length of the hard stop device 116 along the x-direction. In some embodiments, the dimension d5 corresponds to a length of a lever (e.g., at least one of the first lever 102, the second lever 110, etc.) along the x-direction. In some embodiments, the dimension d6 corresponds to a length of a mounting member (e.g., at least one of the first mounting member 106, the second mounting member 112, etc.) along the z-direction. An angle θ1 between a line 182 extending along a surface 186 of a lever (e.g., at least one of the first lever 102, the second lever 110, etc.) and a line 184 extending along a surface 188 of the lever is between about 15 degrees and about 19 degrees. Other values ​​of the angle θ1 are within the scope of the embodiments of the present disclosure. In some embodiments, the line 184 is parallel to the z-direction. In some embodiments, the angle θ1 is configured based on a wafer edge profile of the semiconductor wafer 104.

[0055] FIG. 2A to FIG. 2E A scheme 200 associated with using the wafer holding device 100 to hold a semiconductor wafer 104 is shown. Figure 2AThe wafer holding device 100 is shown in a closed state according to some embodiments. In some embodiments, the wafer holding device 100 is located on a base 208. In some embodiments, the base 208 is in at least one of having a fixed position or not moving. In some embodiments, the lever engagement structure 156 includes a supplementary structure between the body 124 and the base 208. In some embodiments, the supplementary structure includes at least one of the supplementary body 206, the structure 202 coupled to at least one of the supplementary body 206 or the body 124, or the structure 204 coupled to at least one of the supplementary body 206 or the body 124.

[0056] Figure 2B to Figure 2C The transition of the wafer holding device 100 from the closed state to the open state is shown. In some embodiments, the transition from the closed state to the open state is performed in anticipation of receiving the semiconductor wafer 104. Figure 2B The wafer holding device 100 is shown during a transition from a closed state to an open state according to some embodiments. In some embodiments, at least some of the wafer holding device 100 , including the lever engagement structure 156 , moves in a first direction 230 toward the base 208 . Figure 2B The wafer holding device 100 is depicted when the lever engagement structure 156 reaches the base 208 during movement in the first direction 230. In some embodiments, the wafer holding device 100 is moved in the first direction 230 using at least one of a robot arm, a transfer assembly, or other suitable assembly. In some embodiments, once the wafer holding device 100 reaches the base 208 (such as Figure 2B), at least some of the wafer fixture device 100 continues to move in the first direction 230 relative to the lever engagement structure 156. For example, at least one of the platen 114, the fixture assembly, etc. of the wafer fixture device 100 moves in the first direction 230 relative to the lever engagement structure 156, wherein the lever engagement structure 156 does not move in the first direction 230 due to the abutment of the lever engagement structure 156 against the base 208. In some embodiments, when the lever engagement structure 156 abuts against the base 208, the movement of at least some of the wafer fixture device 100 in the first direction 230 causes a reaction force to be applied by the base 208 through the lever engagement structure 156 to one, some, or all of the levers of the wafer fixture device 100. In some embodiments, the reaction force is applied to the lever engagement structure 156 in a second direction 232. In some embodiments, the second direction 232 is opposite to the first direction 230. In some embodiments, the reaction force applied to the lever engagement structure 156 is converted into a lever opening force applied to one, some, or all of the levers of the wafer fixing device 100 by the engagement member of the lever engagement structure 156, such as at least one of a first lever opening force applied to the first lever 102 by the first lever engagement member 120 in a first lever opening direction 160 by the first power region 165 to move the first lever 102, a second lever opening force applied to the second lever 110 by the second power region 175 to move the second lever 110 in a second lever opening direction 170 by the second lever engagement member 122, etc. Therefore, according to some embodiments, the wafer fixing device 100 is converted from a closed state to an open state by the lever engagement structure 156 simultaneously moving one, some, or all of the levers of the wafer fixing device 100 in a corresponding lever opening direction from a corresponding closed position of the lever to a corresponding open position of the lever. In some embodiments, when a corresponding lever opening force applied to the lever of the wafer fixing device 100 by the lever engaging structure 156 overcomes a corresponding biasing force applied by a corresponding biasing member of the wafer fixing device 100, the lever is transformed from a corresponding closed position to a corresponding open position to transform the wafer fixing device 100 to an open state, such as when a first lever opening force overcomes a first biasing force, a second lever opening force overcomes a second biasing force, or one or more other lever opening forces applied by the lever engaging structure 156 overcome at least one of one or more other biasing forces. Figure 2C The wafer holding device 100 is shown in an open state according to some embodiments. In some embodiments, in the open state, at least one of the first powered region 165 of the first lever 102, the second powered region 175 of the second lever 110, the first lever engagement member 120, or the second lever engagement member 122 extends into one or more openings defined by the platen 114, such as at least one of a slot, a slot, a crack, etc.

[0057] Figure 2D The semiconductor wafer 104 is shown being transferred to a target wafer position relative to the platen 114 according to some embodiments. In some embodiments, when the semiconductor wafer 104 is at the target wafer position, the second surface 104b of the semiconductor wafer 104 is in at least one of direct contact with the surface 114a of the platen 114 or in indirect contact with the surface 114a of the platen 114. In some embodiments, the semiconductor wafer 104 is transferred to the target wafer position via a second motion path 234. In some embodiments, the second motion path 234 is in at least one of overlapping with the first motion path 158 or having a direction opposite to the direction of the first motion path 158.

[0058] Figure 2E The transition of the wafer holding device 100 from the open state to the closed state is shown. In some embodiments, the transition from the open state to the closed state is implemented to fix the semiconductor wafer 104 in a target wafer position. In some embodiments, the wafer holding device 100 is in the closed state when a semiconductor manufacturing process is performed on the semiconductor wafer 104 to fix the semiconductor wafer 104 in a target wafer position relative to the platen 114 when the semiconductor manufacturing process is performed.

[0059] In some embodiments, at least some of the wafer fixture device 100 (including the lever engagement structure 156) moves away from the base 208 in the second direction 232. In some embodiments, the wafer fixture device 100 moves in the second direction 232 using at least one of a robot arm, a transfer assembly, or other suitable assembly. In some embodiments, during the movement of the wafer fixture device 100 in the second direction 232, at least some of the reaction force applied by the base 208 through the lever engagement structure 156 is released, so that the biasing force applied by one, some, or all biasing members of the wafer fixture device 100 causes one, some, or all of the levers of the wafer fixture device 100 to move in one or more corresponding lever closing directions to convert from one or more corresponding open positions to one or more corresponding closed positions. For example, during the movement of the wafer fixture device 100 in the second direction 232, at least one of the following conditions exists: the first biasing force applied by the first biasing member 108 causes the first lever 102 to move in the first lever closing direction 168; the second biasing force applied by the second biasing member 142 causes the second lever 110 to move in the second lever closing direction 178, etc. Therefore, according to some embodiments, the wafer fixing device 100 is converted from an open state to a closed state by simultaneously moving one, some or all of the levers of the wafer fixing device 100 in the corresponding lever closing direction from the corresponding open position of the lever to the corresponding closed position of the lever through the biasing member of the wafer fixing device 100.

[0060] Figure 3A perspective view of a portion 300 of a wafer fixture device 100 is shown in accordance with some embodiments. In some embodiments, the wafer fixture device 100 includes a first protective structure 302 at least partially surrounding the first lever 102. In some embodiments, the first protective structure 302 protects at least one of the first lever 102 or one or more other components of the first fixture assembly 152 from at least one of debris, damage caused by collision with an object, etc. In some embodiments, the first protective structure 302 at least partially surrounds at least one of the first fulcrum region 164 of the first lever 102 or a first pivot coupling the first fulcrum region 164 to the first mounting member 106. In some embodiments, the first protective structure 302 is coupled to at least one of the first mounting member 106 or the platen 114.

[0061] In some embodiments, the first mounting member 106 includes at least one of the first portion 106a or the second portion 106b. In some embodiments, the first portion 106a is attached to the second portion 106b. It should be understood that, as used herein, by attachment, the first portion 106a and the second portion 106b are not limited to including two separate structures attached. On the contrary, in some embodiments, the first portion 106a and the second portion 106b are integrally formed, one-piece formed, a single composite piece, etc. In some embodiments, the first mounting member 106 includes two or three or more separate structures attached, such as with mechanical fasteners, welding, adhesives, etc.

[0062] In some embodiments, the second end 108b of the first biasing member 108 is coupled to the first portion 106a of the first mounting member 106. In some embodiments, at least one of the first portion 106a or the second portion 106b of the first mounting member 106 is coupled to the platen 114 such that the first mounting member 106 has a fixed position relative to the platen 114. In some embodiments, at least one of the first portion 106a or the second portion 106b of the first mounting member 106 is coupled to a portion 308 of the platen 114. In some embodiments, the platen 114 defines an opening 304 between the portion 308 and a second portion (not shown) of the platen 114. In some embodiments, when the wafer holding device 100 is transitioned from the closed state to the open state, the opening 304 allows the first powered region 165 of the first lever 102 to move through the opening 304 from the first closed position (e.g., in the first lever opening direction 160) to the first open position.

[0063] Figure 4 A top view of the wafer holding device 100 is shown when the semiconductor wafer 104 is held by the wafer holding device 100 , in accordance with some embodiments. Figure 4Wafer fixture device 100 is depicted in a closed state according to some embodiments. In some embodiments, wafer fixture device 100 includes a first fixture assembly 152 including first lever 102 , a second fixture assembly 154 including second lever 110 , and a third fixture assembly including third lever 402 . Figure 4 The view depicted in FIG. 4 shows the top surfaces of the respective weighted areas of the first lever 102 , the second lever 110 , and the third lever 402 .

[0064] In some embodiments, the third fixture assembly includes at least some of the elements, configurations, etc., and the relationships therebetween, provided herein with respect to the first fixture assembly 152 and / or the second fixture assembly 154. In some embodiments, the third fixture assembly includes at least one of a third mounting member (not shown), a third biasing member (not shown), or one or more other suitable components.

[0065] In some embodiments, the third mounting member is coupled to the platen 114. In some embodiments, when the third mounting member is coupled to the platen 114, the third mounting member has a fixed position relative to the platen 114. In some embodiments, the third biasing member includes at least one of a first end coupled to the third lever 402 or a second end coupled to the third mounting member. In some embodiments, the third biasing member includes at least one of a third spring, a third solenoid (not shown), or other suitable biasing devices. In some embodiments, the third lever 402 includes at least one of a third counterweight region, a third fulcrum region, or a third power region. In some embodiments, the third fulcrum region is pivotally coupled to the third mounting member. In some embodiments, the third biasing member is configured to bias the third lever 402 to a third closed position relative to the platen 114. In some embodiments, the third lever 402 transitions between a third closed position and a third open position relative to the platen 114. In some embodiments, the third biasing member is configured to apply a third biasing force to the third lever 402 (e.g., when the third lever 402 is in the third closed position). In some embodiments, the first end of the third biasing member is coupled to the third power region of the third lever 402. In some embodiments, the third biasing member applies a third biasing force to the third powered region of the third lever 402 to rotate the third lever 402 in the third lever closing direction about an axis 414 passing through the third fulcrum region. In some embodiments, the axis 414 extends through a location that pivotally couples the third fulcrum region to a third pivot axis (not shown) of the third mounting member. Figure 41 and 10. A representation of the axis 166 associated with the first lever 102 and the axis 176 associated with the second lever 110 are depicted in FIG. In some embodiments, the wafer holding device 100 includes a third hard stop (not shown) configured to prevent the third lever 402 from moving beyond a defined position (such as a third closed position of the third lever 402 or other positions of the third lever 402) in a third lever closing direction.

[0066] In some embodiments, when the third lever 402 is in the third open position, the third spring of the third biasing member is in an uncompressed and / or extended state. In some embodiments, when the third lever 402 is in the third open position, the third spring of the third biasing member is in a compressed and / or loaded state. Other configurations of the third spring and / or the third biasing member are within the scope of the disclosed embodiments. In some embodiments, when the third lever 402 is in the third open position, the third biasing force is greater than when the third lever 402 is in the third closed position.

[0067] In some embodiments, when the third lever 402 is in the third closed position, the third lever 402 blocks the first movement path 158 ( Figure 1 ). In some embodiments, when the third lever 402 is in the third closed position, the third protrusion 416 of the third weighted region of the third lever 402 is located above the semiconductor wafer 104. In some embodiments, when the third lever 402 is in the third closed position, the third lever 402 is in at least one of direct contact with the semiconductor wafer 104 or indirect contact with the semiconductor wafer 104. In some embodiments, when the third lever 402 is in the third closed position, the third lever 402 is in at least one of direct contact with the first surface 104a of the semiconductor wafer 104 or indirect contact with the first surface 104a of the semiconductor wafer 104. In some embodiments, when the third lever 402 is in the third closed position, the third lever 402 is in at least one of direct contact with the edge of the semiconductor wafer 104 or indirect contact with the edge of the semiconductor wafer 104. In some embodiments, when the third lever 402 is in the third closed position, the third lever 402 or at least one of the one or more other levers of the wafer fixing device 100 applies a wafer fixing force to the semiconductor wafer 104 to fix the semiconductor wafer 104 at a target wafer position. In some embodiments, when the third lever 402 is in the third closed position, the third lever 402 applies a third wafer holding force to the semiconductor wafer 104 (e.g., to an edge of the semiconductor wafer 104) in a third lever closing direction. In some embodiments, the third wafer holding force applied to the semiconductor wafer 104 is generated by a third biasing force applied to the third lever 402 by a third biasing member.

[0068] In some embodiments, the lever engagement structure 156 includes a third lever engagement member (not shown) configured to engage the third lever 402. In some embodiments, the third lever engagement member is configured to apply a third lever opening force to the third lever 402 to move the third lever 402 from the third closed position to the third open position relative to the platen 114. In some embodiments, the third lever engagement member is coupled to a third power region of the third lever 402. In some embodiments, the third lever engagement member applies a third lever opening force to the third power region of the third lever 402 to rotate the third lever 402 around the axis 414 in a third lever opening direction. In some embodiments, the third lever opening direction is opposite to the third lever closing direction. In some embodiments, when the third lever opening force applied by the third lever engagement member overcomes the third biasing force applied by the third biasing member, the third lever 402 moves from the third closed position to the third open position.

[0069] In some embodiments, when the third lever 402 is in the third open position, the third lever 402 does not block the first movement path 158 of the semiconductor wafer 104. In some embodiments, when the third lever 402 is in the third open position, the third protrusion 416 is not located above the semiconductor wafer 104. In some embodiments, when the third lever 402 is in the third open position, the third lever 402 does not contact the semiconductor wafer 104. In some embodiments, when the third lever 402 is in the third open position, the third lever 402 does not apply a third wafer fixing force to the semiconductor wafer 104 in the third lever closing direction.

[0070] Figure 4 A line L1 extending from the first lever 102 to a point 412, a line L2 extending from the second lever 110 to the point 412, and a line L3 extending from the third lever 402 to the point 412 are depicted. In some embodiments, the point 412 corresponds to the center of at least one of the platen 114 or the semiconductor wafer 104. In some embodiments, the levers of the wafer fixture 100 are spaced approximately evenly around the platen 114 so that the angles 406, 408, and 410 are approximately equal to each other. The angle 410 between the line L1 and the line L2 is between about 110 degrees and about 130 degrees. The angle 406 between the line L1 and the line L3 is between about 110 degrees and about 130 degrees. The angle 408 between the line L2 and the line L3 is between about 110 degrees and about 130 degrees. Other values ​​of the angles 406, 408, and 410 are within the scope of the embodiments of the present disclosure.

[0071] Embodiments are contemplated in which one, some, or all of the protrusions of the respective levers (such as at least one of the first protrusion 162a, the second protrusion 172a, or the third protrusion 416) are not located above the semiconductor wafer 104 when the respective levers are in the respective closed positions. Embodiments are contemplated in which at least one of the first lever 102 does not include the first protrusion 162a, the second lever 110 does not include the second protrusion 172a, the third lever 402 does not include the third protrusion 416, etc.,

[0072] Figure 5A A first top view representation 500 of the wafer holding device 100 is shown without a semiconductor wafer disposed thereon, in accordance with some embodiments. Figure 5A The top surfaces of the protective structures respectively disposed above the first lever 102, the second lever 110, and the third lever 402 are shown. In some embodiments, the wafer holding device 100 includes at least one of the first protective structure 302 at least partially surrounding the first lever 102, the second protective structure 510 at least partially surrounding the second lever 110, or the third protective structure 502 at least partially surrounding the third lever 402. Figure 5A Surface 114a of platen 114 is shown according to some embodiments. In some embodiments, platen 114 includes one or more annular grooves defined in surface 114a for heat dissipation. In some embodiments, one or more annular grooves include at least one of annular groove 506a, annular groove 506b, annular groove 506c, or one or more other annular grooves. Dimension 520 is at most about 120 mm. Dimension 522 is at most about 115 mm. Dimension 524 is between about 150 mm and about 235 mm. Other values ​​of dimension 520, dimension 522, and dimension 524 are within the scope of the embodiments of the present disclosure. In some embodiments, at least one of dimension 520, dimension 522, or dimension 524 is configured based on the wafer size of at least one of semiconductor wafer 104 or one or more other semiconductor wafers that wafer fixing device 100 is configured to fix.

[0073] Figure 5B A second top view representation 550 of the wafer mount device 100 without a semiconductor wafer disposed thereon is shown in accordance with some embodiments. In some embodiments, the wafer mount device 100 includes at least one of the first protection structure 302 , the second protection structure 510 , or the third protection structure 502 . Figure 5BSurface 114a of platen 114 is shown according to some embodiments. In some embodiments, one or more annular grooves defined in surface 114a include at least one of annular groove 506a, annular groove 506b, annular groove 506c, annular groove 506d, annular groove 506e, or one or more other annular grooves. In some embodiments, platen 114 includes one or more first radial grooves defined in surface 114a. In some embodiments, one or more first radial grooves include at least one of radial groove 552a, radial groove 552b, radial groove 552c, or one or more other radial grooves. In some embodiments, one or more first radial grooves are adapted to receive a lifter.

[0074] Figure 6 A cross-sectional view of a portion 600 of a semiconductor wafer 104 including an edge (shown by reference numeral 610) of the semiconductor wafer 104 is shown in accordance with some embodiments. In some embodiments, a first portion 602 of the first surface 104a tapers at an angle θ3 relative to a second portion 604 of the first surface 104a. Angle θ3 is between about 15 degrees and about 40 degrees. Other values ​​of angle θ3 are within the scope of embodiments of the present disclosure. In some embodiments, a first portion 606 of the second surface 104b tapers at an angle θ4 relative to a second portion 608 of the second surface 104b. Angle θ4 is between about 15 degrees and about 40 degrees. Other values ​​of angle θ4 are within the scope of embodiments of the present disclosure. In some embodiments, angle θ1 ( Figure 1 ) is configured based on at least one of the angle θ3 or the angle θ4 of the semiconductor wafer 104.

[0075] Fig. 7A A fixture assembly 700 of a wafer fixture device 100 according to some embodiments is shown. In some embodiments, the fixture assembly 700 corresponds to at least one of the first fixture assembly 152, the second fixture assembly 154, or the third fixture assembly. In some embodiments, the fixture assembly 700 includes at least one of a lever 701, a mounting member 703, or a biasing member 702, such as at least one of a spring, a solenoid (not shown), or other suitable biasing devices. In some embodiments, the lever 701 corresponds to at least one of the first lever 102, the second lever 110, or the third lever 402. In some embodiments, the lever 701 includes a side fixture chuck pin. In some embodiments, the mounting member 703 corresponds to at least one of the first mounting member 106, the second mounting member 112, or the third mounting member. In some embodiments, the mounting member 703 includes a first portion 704 and a second portion 708. In some embodiments, the biasing member 702 corresponds to at least one of the first biasing member 108, the second biasing member 142, or the third biasing member.

[0076] Fig. 7A Depicted is a lever 701 in an open position according to some embodiments. In some embodiments, the lever 701 includes at least one of a weighted region 706, a fulcrum region 710, or a powered region 709. In some embodiments, the lever 701 includes at least one of one or more metals, one or more polymer-based materials, or one or more other suitable materials. In some embodiments, a first portion of the lever 701 includes one or more first materials, and a second portion of the lever 701 includes one or more second materials. In some embodiments, the first portion of the lever 701 includes at least one of the weighted region 706 or the powered region 709. In some embodiments, the one or more first materials include one or more metals, such as an aluminum alloy, or at least one of one or more other suitable materials. In some embodiments, the second portion of the lever 701 includes a fulcrum region. In some embodiments, the one or more second materials include one or more polymer-based materials, such as polyimide, or at least one of one or more other suitable polymer-based materials.

[0077] In some embodiments, the power region 709 contacts a lever engagement member 714 coupled to the body 124 of the lever engagement structure 156. In some embodiments, the lever engagement member 714 corresponds to at least one of the first lever engagement member 120, the second lever engagement member 122, or the third lever engagement member. In some embodiments, the bearing 715 of the lever engagement member 714 is in at least one of direct contact with the power region 709 of the lever 701 or in indirect contact with the power region 709 of the lever 701. In some embodiments, the fulcrum region 710 is pivotally coupled to the second portion 708 of the mounting member 703, such that the lever 701 is pivotable in a lever opening direction 721 and a lever closing direction 723 about an axis 711 passing through the fulcrum region 710. In some embodiments, the axis 711 extends through a location of a pivot (not shown) that pivotally couples the fulcrum region 710 to the mounting member 703. In some embodiments, the pivot (or other component of the retainer assembly 700) includes a stop portion to secure the lever 701 in the open position once the lever 701 (i) moves beyond a point of no return during movement of the lever 701 in the lever opening direction 721 or (ii) reaches the open position.

[0078] There is at least one of the following situations: (i) Dimension A is between about 5 mm and about 12 mm; (ii) Dimension C is between about 5 mm and about 12 mm; or (iii) Dimension D is between about 5 mm and about 12 mm. Other values ​​of Dimension A, Dimension C, and Dimension D are within the scope of the presently disclosed embodiments. In some embodiments, when the lever 701 is in the open position, Dimension D corresponds to the spring length (e.g., the minimum spring length) of the biasing member 702. In some embodiments, Dimension A is greater than Dimension C. In some embodiments, Dimension D is greater than Dimension A. In some embodiments, the ratio of Dimension A to Dimension B is between about 1:1 and about 1:3, such as about 1:2.2. In some embodiments, the ratio of Dimension A to Dimension C is between about 1:1 and about 3:1, such as about 1.8:1. In some embodiments, the ratio of Dimension B to Dimension C is between about 2:1 and about 8:1, such as about 3.9:1. In some embodiments, the ratio A:B:C corresponds to about 1.8:3.9:1. The angle θ2 between the surface 724 of the lever 701 and the line 722 is between about 20 degrees and about 30 degrees. Other values ​​of the angle θ2 are within the scope of the embodiments of the present disclosure. In some embodiments, the line 722 is parallel to at least some of the surfaces 114a of the platen 114. In some embodiments, the line 722 corresponds to the direction in which the surface 725 of the second portion 708 of the mounting member 703 extends.

[0079] Figure 7B A biasing member 702 according to some embodiments is shown. In some embodiments, the biasing member 702 includes a spring having a spring diameter E and a spring length F. In some embodiments, the spring includes one or more metals, such as at least one of steel or one or more other suitable metals. In some embodiments, the spring diameter E and the spring length F correspond to the spring diameter and spring length of the spring in an uncompressed and / or extended state, such as when the lever 701 is in a closed position. The spring diameter E is between about 3 mm and about 7 mm. The spring length F is between about 18 mm and about 22 mm. The spring stiffness K of the spring is at least about 0.08 kilograms of force / millimeter (Kgf / mm). Other values ​​of the spring diameter E, the spring length F, and the spring stiffness K are within the scope of the disclosed embodiments.

[0080] FIG. 8A to FIG. 8E A top view of a scheme 800 associated with using the wafer holding device 100 to hold a semiconductor wafer 104 is shown. Fig. 8AThe wafer holding device 100 is shown in an environment 850 including at least one of a processor box 812 or a process chamber 814 (such as a target chamber) according to some embodiments. In some embodiments, at least one of an arm 802 or a wafer gripper 804 coupled to the arm 802 is disposed in the processor box 812. In some embodiments, the arm 802 comprises a robotic arm. In some embodiments, the wafer holding device 100 is disposed in the process chamber 814. In some embodiments, a lifter 808 is disposed above the platen 114 in the process chamber 814. In some embodiments, the lifter 808 is used to mount the semiconductor wafer 104 to a target wafer position relative to the platen 114. Figure 8B The semiconductor wafer 104 is shown being held using a wafer holder 804 in accordance with some embodiments. In some embodiments, a lifter 808 is located above the platen 114. Figure 8C FIG. 8 shows a semiconductor wafer 104 being transferred from a first position in a processor box 812 to a second position in a processing chamber 814 according to some embodiments. In some embodiments, when the semiconductor wafer 104 is in the second position (such as Figure 8C ), the semiconductor wafer 104 is disposed on an elevator 808 located above the platen 114. In some embodiments, the semiconductor wafer 104 is transferred from a first position to a second position using an arm 802. Fig.8D 812. The wafer holder 804 is shown transferred to the processor box 812 according to some embodiments. In some embodiments, in response to or concurrently with the transfer of the wafer holder 804 to the processor box 812, the elevator 808 moves toward the platen 114 while the semiconductor wafer 104 is mounted on the elevator 808 to move the semiconductor wafer 104 to a target wafer position relative to the platen 114, such as along the second motion path 234 ( Figure 2D In some embodiments, the lifter 808 enters one or more radial slots in the platen 114, such as one or more first radial slots ( Figure 5B ) to permit the semiconductor wafer 104 to be secured at a target wafer position of the wafer securing device 100. In some embodiments, when the semiconductor wafer 104 is at the target wafer position, at least a portion of the lifter 808 is disposed in one or more radial grooves, such as one or more first radial grooves. In some embodiments, before the semiconductor wafer 104 is moved to the target wafer position relative to the platen 114, the wafer securing device 100 is switched from a closed state to an open state to receive the semiconductor wafer 104. In some embodiments, in response to moving the semiconductor wafer 104 to the target wafer position relative to the platen 114, the wafer securing device 100 is switched from an open state to a closed state to secure the semiconductor wafer 104. Fig. 8EFIG. 8 shows a rotation 806 of the semiconductor wafer 104 and the wafer holder 100 to a vertical orientation according to some embodiments. In some embodiments, the semiconductor wafer 104 and the wafer holder 100 are in a Fig. 8E A semiconductor manufacturing process is performed on the semiconductor wafer 104 when it is in the vertical orientation shown in FIG.

[0081] In some embodiments, the processing chamber 814 is defined by one or more walls of a processing station configured to perform a semiconductor manufacturing process on the semiconductor wafer 104 to produce a processed semiconductor wafer. In some embodiments, the processing station includes a processor box 812. In some embodiments, the processing station performs a semiconductor manufacturing process on the semiconductor wafer 104 while the semiconductor wafer 104 is held in the processing chamber 814 by the wafer holding device 100. In some embodiments, the processing station includes: (i) ion implantation equipment; (ii) chemical vapor deposition (CVD) equipment; (iii) physical vapor deposition (PVD) equipment; (iv) etching equipment, such as plasma etching equipment, wet etching equipment, dry etching equipment, reactive ion etching (RIE) equipment, atomic layer etching (ALE) equipment, buffered oxide etching equipment, or ion beam milling equipment; (v) photolithography equipment; (vi) chemical mechanical planarization (CMP) equipment; (vii) plating equipment; (viii) cleaning equipment; (ix) furnace, such as a semiconductor furnace tool; or (x) at least one of other equipment. In some embodiments, the semiconductor manufacturing process includes at least one of an ion implantation process, a PVD process, a plating process, an etching process, a photolithography process, a CMP process, a CVD process, a thermal process, a cleaning process, or other processes.

[0082] In some embodiments, in response to performing a semiconductor manufacturing process on the semiconductor wafer 104 to produce a processed semiconductor wafer, the wafer fixing device 100 releases the semiconductor wafer 104 by switching from a closed state to an open state, wherein the processed semiconductor wafer is removed from the wafer fixing device 100 when the wafer fixing device 100 is in the open state.

[0083] Fig. 9 A scheme 900 is shown in accordance with some embodiments in connection with a semiconductor manufacturing process performed on a semiconductor wafer 104. In some embodiments, the processing chamber 814 comprises an ion implantation chamber, and the semiconductor manufacturing process comprises an ion implantation process. In some embodiments, the processing station comprises: an implanter tool 902 comprising one or more ion implantation components used in the ion implantation process. In some embodiments, the processing station comprises at least one of an ion source assembly 930, a first plate P1, a beamline chamber 906, a second plate P2, a first faraday cup C1, a fourth plate P4, a second faraday cup C2, a third faraday cup C3, a first power supply 936, or a second power supply 934.

[0084] In some embodiments, ions 932 (such as ion plasma) travel along the ion plasma path 924 to process the semiconductor wafer 104. In some embodiments, at least some of the ions 932 are implanted into the semiconductor wafer 104. In some embodiments, the ions 932 are implanted into the semiconductor wafer 104 to form a doped region of a semiconductor device, such as at least one of a transistor, a diode, etc. In some embodiments, at least one of the first plate P1, the second plate P2, the third plate P3, or the fourth plate P4 defines an opening for shaping the ion plasma traveling along the ion plasma path 924. In some embodiments, at least one of the first plate P1, the second plate P2, the third plate P3, or the fourth plate P4 includes at least one of graphite or other suitable materials. In some embodiments, at least one of the voltage between the first plate P1 and the ion source assembly 930 or the voltage between the third plate P3 and the semiconductor wafer 104 is controlled to guide the flow direction of the ion plasma. In some embodiments, the number of plates of the processing station or the voltage applied by at least one of the first power supply 936 or the second power supply 934 depends on one or more parameters of the ion implantation process, such as the target implantation depth of the ion implantation process.

[0085] In some embodiments, the first plate P1 is used as a suppression electrode for suppressing the interaction of secondary electrons with the ion plasma. In some embodiments, the secondary electrons are generated by collisions between ions and at least one of electrons or gas molecules in the processing chamber 814. In some embodiments, a vacuum is established in the processing chamber 814. In some embodiments, the implantation depth of the ion implantation process depends on the energy level of the ion plasma applied to the semiconductor wafer 104, which depends on the voltage between the third plate P3 and the semiconductor wafer 104. In some embodiments, the voltage is controlled to achieve a target implantation depth, such as by controlling the voltage so that the ions implanted into the semiconductor wafer 104 have a depth of about the target implantation depth. The fourth plate P4 is grounded (e.g., Fig. 9 as shown in scheme 900) or not grounded.

[0086] In some embodiments, a Faraday cup (such as at least one of the first Faraday cup C1, the second Faraday cup C2, or the third Faraday cup C3) of the processing station is configured to detect ions during an ion implantation process performed on the semiconductor wafer 104. In some embodiments, the Faraday cup measures the number of ions that strike the Faraday cup during the ion implantation process. In some embodiments, during a first portion of the ion implantation process, the first Faraday cup C1 is positioned Fig. 9. In some embodiments, the first Faraday cup C1 is configured to measure the first ion quantity during a first portion of the ion implantation process. In some embodiments, after the first portion of the ion implantation process, the first Faraday cup C1 is moved to a position away from the ion plasma path 924 to allow the ions 932 to pass through at least one of the third plate P3 or the fourth plate P4 along the ion plasma path 924. In some embodiments, one or more parameters of the ion implantation process are at least one of controlled, adjusted, etc. based on the first ion quantity.

[0087] In some embodiments, the second Faraday cup C2 is disposed at a detection position (not shown) to detect and / or measure ions 932. In some embodiments, the detection position corresponds to Fig. 9 In some embodiments, the semiconductor wafer 104 and the wafer holding device 100 are positioned at Fig. 9 Before the second Faraday cup C2 is moved to the corresponding position shown in , the second Faraday cup C2 is set at the detection position. In some embodiments, when the second Faraday cup C2 is set at the detection position, the second Faraday cup C2 measures the second ion quantity of the ion implantation process. In some embodiments, in response to measuring the second ion quantity, at least one of the following conditions exists: (i) the second Faraday cup C2 moves to Fig. 9 or (ii) the semiconductor wafer 104 and the wafer holding device 100 are positioned at Fig. 9 In some embodiments, one or more parameters of the ion implantation process are at least one of controlled, adjusted, etc. based on the second ion population.

[0088] In some embodiments, the third Faraday cup C3 is used to detect ions or determine at least one of one or more measurements of ions during an ion implantation process, such as when the semiconductor wafer 104 is treated with an ion plasma. In some embodiments, the one or more measurements include the number of ions detected by the third Faraday cup C3. In some embodiments, the hard stop device 116 is configured to separate the semiconductor wafer 104 from the third Faraday cup C3 by at least a threshold distance 933. The threshold distance 933 is between about 100 millimeters and about 300 millimeters. Other values ​​of the threshold distance 933 are within the scope of the embodiments of the present disclosure. In some embodiments, the third Faraday cup C3 is at least one of coupled to the wafer fixture device 100, moved with the wafer fixture device 100, or maintained close to the wafer fixture device 100. In some embodiments, the use of the hard stop device 116 to establish a separation of at least the threshold distance 933 between the semiconductor wafer 104 and the third Faraday cup C3 provides increased accuracy and / or precision of one or more measurements determined using the third Faraday cup C3. In some embodiments, one or more parameters of the ion implantation process are at least one of controlled, adjusted, etc. based on one or more measurements determined using the third Faraday cup C3.

[0089] Apart from Figure 1 and FIG. 2A to FIG. 2E Other configurations of the one or more biasing members of the wafer holding device 100 besides those shown in FIG. 1 are within the scope of the disclosed embodiments. FIG. 10A to FIG. 10B A scheme 1000 associated with a wafer holding device 100 according to an embodiment is shown, wherein a spring of a biasing member is: (i) in an uncompressed state when the corresponding lever is in a closed position; and / or (ii) in an extended state when the corresponding lever is in an open position. Fig. 10AThe wafer holding device 100 is shown in a closed state according to some embodiments. In some embodiments, a first spring of a first biasing member 108 is coupled to the first lever 102 and the body 124 of the lever engagement structure 156, such as where one end of the first spring is coupled to the first lever 102 and the other end of the first spring is coupled to the body 124. In some embodiments, a second spring of a second biasing member 142 is coupled to the second lever 110 and the body 124 of the lever engagement structure 156, such as where one end of the second spring is coupled to the second lever 110 and the other end of the second spring is coupled to the body 124. In some embodiments, when the first lever 102 is in the first closed position, the first spring of the first biasing member 108 is in an uncompressed state. In some embodiments, when the second lever 110 is in the second closed position, the second spring of the second biasing member 142 is in an uncompressed state. When a spring is in an uncompressed state, an unstretched state, an untensioned state, etc., it is generally in a state of equilibrium, relaxation, etc., such that it applies little to no biasing force (e.g., no pushing, no pulling, no stress, no strain, no tension, etc.).

[0090] Fig. 10B FIG. 1 shows the wafer holding device 100 in an open state according to some embodiments. In some embodiments, when the first lever 102 is in the first open position, the first spring of the first biasing member 108 is in an extended state. In some embodiments, when the first spring is in the Fig. 10B In the extended state shown in , since the length of the first spring is greater than the equilibrium length of the first spring, the first spring applies the first biasing force to the first lever 102, thereby generating a pulling force of the first spring on the first lever 102. In some embodiments, when the second lever 110 is in the second open position, the second spring of the second biasing member 142 is in the extended state. In some embodiments, when the second spring is in Fig. 10B In the extended state shown in , since the length of the second spring is greater than the equilibrium length of the second spring, the second spring applies a second biasing force to the second lever 110 , thereby generating a pulling force of the second spring on the second lever 110 .

[0091] In some embodiments, when the first spring is in Fig. 10B In the extended state shown in FIG. , the first biasing force applied by the first spring of the first biasing member 108 is greater than when the first spring is in the extended state shown in FIG. Fig. 10A is larger in the uncompressed state shown in .

[0092] In some embodiments, when the second spring is in Fig. 10B In the extended state shown in FIG. , the second biasing force applied by the second spring of the second biasing member 142 is greater than when the second spring is in the extended state shown in FIG. Fig. 10A is larger in the uncompressed state shown in .

[0093] According to some embodiments, Fig.11 1100 of a wafer holding device such as wafer holding device 100 is shown. The wafer holding device includes at least one of: (i) a platen configured to support a semiconductor wafer; (ii) a holder assembly including at least one of a mounting member coupled to the platen, a lever, or a biasing member configured to bias the lever to a closed position relative to the platen; or (iii) a lever engagement member configured to engage the lever. In some embodiments, at least one of the following conditions exists: (i) the platen includes the platen 114; (ii) the semiconductor wafer includes the semiconductor wafer 104; (iii) the fixture assembly includes at least one of the first fixture assembly 152, the second fixture assembly 154, or the third fixture assembly; (iv) the mounting member includes at least one of the first mounting member 106, the second mounting member 112, or the third mounting member; (v) the lever includes at least one of the first lever 102, the second lever 110, or the third lever 402; (vi) the biasing member includes at least one of the first biasing member 108, the second biasing member 142, or the third biasing member; or (vii) the lever engagement member includes at least one of the first lever engagement member 120, the second lever engagement member 122, or the third lever engagement member. In 1102, a lever opening force is applied to the lever by the lever engagement member to move the lever from a closed position to an open position relative to the platen. In 1104, when the lever is in the open position, the semiconductor wafer is transferred to a target wafer position relative to the platen. In some embodiments, a semiconductor wafer is transferred from a wafer storage device to a target wafer position relative to a platen.

[0094] In some embodiments, when the semiconductor wafer is in a target wafer position relative to the platen, the biasing force applied by the biasing member is used to move the lever to a closed position relative to the platen. Figure 2C As shown in , the biasing force is applied by a spring of the biasing member, the spring having at least one of the following conditions: (i) having a length less than the equilibrium length of the spring; or (ii) applying a thrust to the lever. In some embodiments, such as Fig. 10B As shown in , the biasing force is applied by a spring of the biasing member, and the spring has at least one of the following conditions: (i) having a length greater than the equilibrium length of the spring; or (ii) applying a pulling force to the lever. In some embodiments, when the lever is in the closed position, the lever prevents movement of the semiconductor wafer from the target wafer position.

[0095] In some embodiments, when the lever is in the open position, the lever does not block the movement path of the semiconductor wafer, such as the second movement path 234. In some embodiments, when the lever is in the open position, the semiconductor wafer is transferred to the target wafer position by moving the semiconductor wafer along the movement path to the target wafer position. In some embodiments, when the lever is in the closed position, the lever blocks the movement path of the semiconductor wafer.

[0096] In some embodiments, the lever moves from the closed position to the open position when the lever opening force overcomes the biasing force applied to the lever by the biasing member.

[0097] One or more embodiments are directed to a computer-readable medium comprising processor-executable instructions configured to implement one or more of the techniques presented herein. Fig.12 , where an exemplary computer-readable medium is shown, wherein an embodiment 1200 includes a computer-readable medium 1208 (e.g., a CD-R, DVD-R, flash drive, hard drive platter, etc.) having computer-readable data 1206 encoded thereon. The computer-readable data 1206 in turn includes a set of processor-executable computer instructions 1204 configured to implement one or more of the principles set forth herein when executed by a processor. In some embodiments 1200, the processor-executable computer instructions 1204 are configured to implement a method 1202 when executed by a processor, such as at least some of the methods described above. In some embodiments, the processor-executable computer instructions 1204 are configured to implement a system when executed by a processor, such as at least some of one or more of the systems described above. Many such computer-readable media configured to operate according to the techniques presented herein can be designed by one of ordinary skill in the art.

[0098] In some embodiments, a wafer fixture is provided. The wafer fixture includes a platen configured to support a semiconductor wafer and a fixture assembly. The fixture assembly includes: a mounting member coupled to the platen; a lever; and a biasing member including a first end coupled to the lever and a second end coupled to the mounting member. The biasing member is configured to bias the lever to a closed position relative to the platen. When the lever is in the closed position, the lever prevents movement of the semiconductor wafer.

[0099] In some embodiments, the wafer holding device includes a lever engagement member configured to apply a lever opening force to the lever to move the lever from a closed position to an open position relative to the platen.

[0100] In some embodiments, when the lever is in the closed position, the lever blocks the first movement path of the semiconductor wafer, and when the lever is in the open position, the lever does not block the first movement path of the semiconductor wafer.

[0101] In some embodiments, the lever moves from the closed position to the open position when the lever opening force overcomes the biasing force applied to the lever by the biasing member.

[0102] In some embodiments, the wafer holding device includes a hard stop device coupled to the platen and configured to separate the semiconductor wafer from the semiconductor processing component by at least a threshold distance.

[0103] In some embodiments, a semiconductor processing assembly includes a Faraday cup configured to detect ions during an ion implantation process performed on a semiconductor wafer.

[0104] In some embodiments, the biasing member comprises a spring.

[0105] In some embodiments, the lever includes a powered region coupled to the first end of the biasing member, a weighted region blocking the movement path of the semiconductor wafer when the lever is in a closed position, and a fulcrum region pivotably coupled to the mounting member.

[0106] In some embodiments, a wafer fixing device is provided. The wafer fixing device includes: a platen configured to support a semiconductor wafer; a fixture assembly; and a lever engaging member. The fixture assembly includes: a mounting member coupled to the platen; and a lever including a counterweight region configured to prevent movement of the semiconductor wafer when the lever is in a closed position relative to the platen and a fulcrum region pivotally coupled to the mounting member. The lever engaging member is configured to apply a lever opening force to the lever to move the lever from a closed position to an open position relative to the platen. Movement of the lever from the closed position to the open position includes rotation of the lever around an axis passing through the fulcrum region.

[0107] In some embodiments, when the lever is in the closed position, the lever blocks the first movement path of the semiconductor wafer, and when the lever is in the open position, the lever does not block the first movement path of the semiconductor wafer.

[0108] In some embodiments, the wafer holding device includes a hard stop device coupled to the platen and configured to separate the semiconductor wafer from the semiconductor processing component by at least a threshold distance.

[0109] In some embodiments, a semiconductor processing assembly includes a Faraday cup configured to detect ions during an ion implantation process performed on a semiconductor wafer.

[0110] In some embodiments, a method for operating a wafer fixture device is provided. The wafer fixture device includes: (i) a platen configured to support a semiconductor wafer; (ii) a fixture assembly including a lever and a biasing member configured to bias the lever to a closed position relative to the platen; and (iii) a lever engagement member configured to engage the lever. The method includes: applying a lever opening force to the lever through the lever engagement member to move the lever from the closed position to an open position relative to the platen. The method includes: when the lever is in the open position, transferring the semiconductor wafer to a target wafer position relative to the platen.

[0111] In some embodiments, the method includes: when the semiconductor wafer is in a target wafer position relative to the platen, using a biasing force applied to the lever by a biasing member to move the lever to a closed position relative to the platen, wherein when the lever is in the closed position, the lever prevents movement of the semiconductor wafer from the target wafer position.

[0112] In some embodiments, when the lever is in the open position, the lever does not block the movement path of the semiconductor wafer. Transferring the semiconductor wafer to the target wafer position includes moving the semiconductor wafer along the movement path to the target wafer position when the lever is in the open position. The method includes using the lever to block the movement path of the semiconductor wafer when the lever is in the closed position.

[0113] In some embodiments, the lever moves from the closed position to the open position when the lever opening force overcomes the biasing force applied to the lever by the biasing member.

[0114] In some embodiments, a wafer fixing device is provided. The wafer fixing device includes a table configured to support a semiconductor wafer, a first fixture assembly, a second fixture assembly, and a lever engagement structure. The first fixture assembly includes: a first mounting member coupled to the table; and a first lever pivotally coupled to the first mounting member. The second fixture assembly includes: a second mounting member coupled to the table; and a second lever pivotally coupled to the second mounting member. The lever engagement structure includes: a body; a first lever engagement member protruding from the body and configured to engage the first lever; and a second lever engagement member protruding from the body and configured to engage the second lever. When the first lever is in a first closed position relative to the table, the first lever prevents movement of the semiconductor wafer. When the second lever is in a second closed position relative to the table, the second lever prevents movement of the semiconductor wafer. The lever engagement structure is configured to simultaneously: apply a first lever opening force to the first lever through a first lever engagement member to move the first lever from a first closed position to a first open position relative to the table; and apply a second lever opening force to the second lever through a second lever engagement member to move the second lever from a second closed position to a second open position relative to the table.

[0115] In some embodiments, when the first lever is in a first closed position, the first lever blocks the first movement path of the semiconductor wafer, when the first lever is in a first open position, the first lever does not block the first movement path of the semiconductor wafer, when the second lever is in a second closed position, the second lever blocks the first movement path of the semiconductor wafer, and when the second lever is in a second open position, the second lever does not block the first movement path of the semiconductor wafer.

[0116] In some embodiments, the first fixture assembly includes a first biasing member including a first end coupled to the first lever and a second end coupled to the first mounting member, wherein the first biasing member is configured to bias the first lever to a first closed position, and the second fixture assembly includes a second biasing member including a first end coupled to the second lever and a second end coupled to the second mounting member, wherein the second biasing member is configured to bias the second lever to a second closed position.

[0117] In some embodiments, the first biasing member includes a first spring and the second biasing member includes a second spring.

[0118] In some embodiments, when the first lever opening force overcomes the first biasing force applied to the first lever by the first biasing member, the first lever moves from the first closed position to the first open position, and when the second lever opening force overcomes the second biasing force applied to the second lever by the second biasing member, the second lever moves from the second closed position to the second open position.

[0119] In some embodiments, the wafer holding device includes a hard stop device coupled to the platen and configured to separate the semiconductor wafer from the semiconductor processing component by at least a threshold distance.

[0120] In some embodiments, a semiconductor processing assembly includes a Faraday cup configured to detect ions during an ion implantation process performed on a semiconductor wafer.

[0121] In some embodiments, the wafer holding device includes: a first protection structure at least partially surrounding the first lever; and a second protection structure at least partially surrounding the second lever.

[0122] Some embodiments of the present application provide a wafer fixing device, comprising: a table configured to support a semiconductor wafer; and a fixture assembly, comprising: a mounting member coupled to the table; a lever; and a biasing member, comprising a first end coupled to the lever and a second end coupled to the mounting member, wherein: the biasing member is configured to bias the lever to a closed position relative to the table; and when the lever is in the closed position, the lever prevents movement of the semiconductor wafer.

[0123] In some embodiments, the wafer holding device includes: a lever engagement member configured to apply a lever opening force to the lever to move the lever from the closed position to an open position relative to the platen. In some embodiments, when the lever is in the closed position, the lever blocks a first movement path of the semiconductor wafer; and when the lever is in the open position, the lever does not block the first movement path of the semiconductor wafer. In some embodiments, when the lever opening force overcomes the biasing force applied to the lever by the biasing member, the lever moves from the closed position to the open position. In some embodiments, the wafer holding device includes: a hard stop device coupled to the platen and configured to separate the semiconductor wafer from a semiconductor processing component by at least a threshold distance. In some embodiments, the semiconductor processing component includes a Faraday cup configured to detect ions during an ion implantation process performed on the semiconductor wafer. In some embodiments, the biasing member includes a spring. In some embodiments, the lever includes: a power region coupled to the first end of the biasing member; a counterweight region that blocks the movement path of the semiconductor wafer when the lever is in the closed position; and a fulcrum region pivotally coupled to the mounting member.

[0124] Other embodiments of the present application provide a method for operating a wafer fixing device, which includes: a table configured to support a semiconductor wafer; a fixture assembly including a lever and a biasing member configured to bias the lever to a closed position relative to the table; and a lever engaging member configured to engage the lever; and the method includes: applying a lever opening force to the lever through the lever engaging member to move the lever from the closed position to an open position relative to the table; and when the lever is in the open position, transferring the semiconductor wafer to a target wafer position relative to the table.

[0125] In some embodiments, when the semiconductor wafer is in the target wafer position relative to the platen, the lever is moved to the closed position relative to the platen using a biasing force applied to the lever by the biasing member, wherein when the lever is in the closed position, the lever blocks movement of the semiconductor wafer from the target wafer position. In some embodiments, when the lever is in the open position, the lever does not block a movement path of the semiconductor wafer; transferring the semiconductor wafer to the target wafer position includes moving the semiconductor wafer along the movement path to the target wafer position when the lever is in the open position; and the method includes blocking the movement path of the semiconductor wafer using the lever when the lever is in the closed position. In some embodiments, the lever moves from the closed position to the open position when the lever opening force overcomes the biasing force applied to the lever by the biasing member.

[0126] Some other embodiments of the present application provide a wafer fixing device, comprising: a table configured to support a semiconductor wafer; a first fixture assembly comprising: a first mounting member coupled to the table; and a first lever pivotally coupled to the first mounting member; and a second fixture assembly comprising: a second mounting member coupled to the table; and a second lever pivotally coupled to the second mounting member; and a lever engaging structure comprising: a main body; a first lever engaging member protruding from the main body and configured to engage the first lever; and a second lever engaging member protruding from the main body and configured to engage the second lever, wherein: when the first lever is in When the first lever is in a first closed position relative to the table, the first lever prevents movement of the semiconductor wafer; when the second lever is in a second closed position relative to the table, the second lever prevents movement of the semiconductor wafer; and the lever engagement structure is configured to simultaneously: apply a first lever opening force to the first lever through the first lever engagement member to move the first lever from the first closed position to the first open position relative to the table; and apply a second lever opening force to the second lever through the second lever engagement member to move the second lever from the second closed position to the second open position relative to the table.

[0127] In some embodiments, when the first lever is in the first closed position, the first lever blocks the first movement path of the semiconductor wafer; when the first lever is in the first open position, the first lever does not block the first movement path of the semiconductor wafer; when the second lever is in the second closed position, the second lever blocks the first movement path of the semiconductor wafer; and when the second lever is in the second open position, the second lever does not block the first movement path of the semiconductor wafer.

[0128] In some embodiments, the first fixture assembly includes a first biasing member, the first biasing member includes a first end coupled to the first lever and a second end coupled to the first mounting member, wherein the first biasing member is configured to bias the first lever to the first closed position; and the second fixture assembly includes a second biasing member, the second biasing member includes a first end coupled to the second lever and a second end coupled to the second mounting member, wherein the second biasing member is configured to bias the second lever to the second closed position. In some embodiments, the first biasing member includes a first spring; and the second biasing member includes a second spring. In some embodiments, when the first lever opening force overcomes a first biasing force applied to the first lever by the first biasing member, the first lever moves from the first closed position to the first open position; and when the second lever opening force overcomes a second biasing force applied to the second lever by the second biasing member, the second lever moves from the second closed position to the second open position. In some embodiments, the wafer holding device includes: a hard stop device coupled to the platen and configured to separate the semiconductor wafer from the semiconductor processing assembly by at least a threshold distance. In some embodiments, the semiconductor processing assembly includes a Faraday cup configured to detect ions during an ion implantation process performed on the semiconductor wafer. In some embodiments, a first protection structure at least partially surrounds the first lever; and a second protection structure at least partially surrounds the second lever.

[0129] The features of several embodiments are summarized above so that those skilled in the art can better understand the various aspects of the embodiments of the present disclosure. Those skilled in the art should understand that they can easily use the embodiments of the present disclosure as a basis to design or modify other processes and structures for performing the same purpose and / or achieving the same advantages as the embodiments introduced herein. Those skilled in the art should also appreciate that such equivalent configurations do not deviate from the spirit and scope of the embodiments of the present disclosure, and that they can make various changes, substitutions, and modifications herein without departing from the spirit and scope of the embodiments of the present disclosure.

[0130] Although the subject matter has been described in language directed to structural features or method steps, it should be understood that the subject matter of the appended claims is not necessarily limited to the specific features or steps described above. Instead, the specific features and steps described above are disclosed as exemplary forms of implementing at least some of the claims.

[0131] The individual operations of the embodiments are provided herein. The order of describing some or all operations should not be interpreted as implying that these operations must rely on the order. With the benefit of this description, it should be understood that the optional order. In addition, it should be understood that not all operations must be present in each embodiment provided herein. In addition, it should be understood that in some embodiments, not all operations are required.

[0132] It should be understood that, for example, for the purpose of simplicity and ease of understanding, the layers, components, elements, etc. described herein are shown with specific dimensions relative to each other, such as structural dimensions or orientations, and in some embodiments, their actual dimensions are substantially different from those shown herein. In addition, for example, there are various techniques for forming the layers, regions, components, elements, etc. described herein, such as at least one of etching techniques, planarization techniques, implantation techniques, doping techniques, spin coating techniques, sputtering techniques, growth techniques, or deposition techniques such as chemical vapor deposition (CVD).

[0133] In addition, "exemplary" and the like are used herein to indicate use as examples, instances, illustrations, etc., and are not necessarily advantageous. As used in this application, "or" is intended to mean an inclusive "or", rather than an exclusive "or". In addition, "a" and "an" as used in this application and the appended claims are generally interpreted as meaning "one or more", unless otherwise specified or clearly pointed to the singular form from the context. In addition, at least one of A and B, etc. generally means A or B or A and B. In addition, in the case of using "includes", "having", "has", "with" or their variations, such terms are intended to be included in a manner similar to the term "comprising". In addition, unless otherwise specified, "first", "second", etc. are not intended to imply time aspects, spatial aspects, order, etc. On the contrary, such terms are only used as identifiers, names, etc. for parts, elements, items, etc. For example, the first element and the second element generally correspond to element A and element B, or two different or two identical elements, or the same element.

[0134] In addition, although the embodiments of the present disclosure have been shown and described with respect to one or more embodiments, other persons of ordinary skill in the art will make equivalent changes and modifications based on the reading and understanding of this specification and the accompanying drawings. The embodiments of the present disclosure include all such modifications and changes and are limited only by the scope of the appended claims. In particular, with respect to the various functions implemented by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terms used to describe such components are intended to correspond to any component (e.g., functionally equivalent) that implements the specified functions of the described components, even if they are not structurally equivalent to the disclosed structures. In addition, although the specific features of the embodiments of the present disclosure may be disclosed only with respect to one of several embodiments, such features may be combined with one or more other features of other embodiments, which may be desirable and advantageous for any given or specific application.

Claims

1. A wafer fixing device, comprising: a platen configured to support a semiconductor wafer; as well as Fixture assembly, comprising: a mounting member coupled to the deck; Leverage; and a biasing member including a first end coupled to the lever and a second end coupled to the mounting member, in: The biasing member is configured to bias the lever to a closed position relative to the deck; and When the lever is in the closed position, the lever prevents movement of the semiconductor wafer.

2. The wafer fixing device according to claim 1, comprising: A lever engagement member is configured to apply a lever opening force to the lever to move the lever from the closed position to an open position relative to the deck.

3. The wafer holding device according to claim 2, wherein: When the lever is in the closed position, the lever blocks a first movement path of the semiconductor wafer; as well as When the lever is in the open position, the lever does not block the first movement path of the semiconductor wafer.

4. The wafer holding device according to claim 2, wherein: The lever moves from the closed position to the open position when the lever opening force overcomes the biasing force applied to the lever by the biasing member.

5. The wafer holding device according to claim 1, comprising: A hard stop device is coupled to the platen and configured to separate the semiconductor wafer from a semiconductor processing component by at least a threshold distance.

6. The wafer holding device according to claim 5, wherein: The semiconductor processing assembly includes a Faraday cup configured to detect ions during an ion implantation process performed on the semiconductor wafer.

7. The wafer holding device according to claim 1, wherein: The biasing member includes a spring.

8. The wafer holding device according to claim 1, wherein: The levers include: a power region coupled to the first end of the biasing member; a counterweight region that blocks a movement path of the semiconductor wafer when the lever is in the closed position; and A fulcrum region is pivotally coupled to the mounting member.

9. A method of operating a wafer holding device, The wafer fixing device comprises: a platen configured to support a semiconductor wafer; a retainer assembly including a lever and a biasing member configured to bias the lever to a closed position relative to the deck; as well as a lever engagement member configured to engage the lever; as well as The method comprises: applying a lever opening force to the lever via the lever engagement member to move the lever from the closed position to an open position relative to the deck; as well as When the lever is in the open position, the semiconductor wafer is transferred to a target wafer position relative to the platen.

10. A wafer fixing device, comprising: a platen configured to support a semiconductor wafer; The first fixture assembly includes: a first mounting member coupled to the deck; and a first lever pivotably coupled to the first mounting member; and The second fixture assembly includes: a second mounting member coupled to the deck; and a second lever pivotably coupled to the second mounting member; and The lever engagement structure comprises: main body; a first lever engagement member protruding from the body and configured to engage the first lever; and a second lever engaging member protruding from the body and configured to engage the second lever, in: The first lever blocks movement of the semiconductor wafer when the first lever is in a first closed position relative to the platen; The second lever prevents movement of the semiconductor wafer when the second lever is in a second closed position relative to the platen; and The lever engagement structure is configured to simultaneously: applying a first lever opening force to the first lever via the first lever engagement member to move the first lever from the first closed position to a first open position relative to the deck; and A second lever opening force is applied to the second lever through the second lever engagement member to move the second lever from the second closed position to a second open position relative to the deck.

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