Magnetic flow type vapor chamber heat dissipation system and application thereof

Abstract

The invention discloses a magnetic flow type vapor chamber heat dissipation system and application thereof. A vapor chamber comprises a first accommodating chamber, a second accommodating chamber and a heat dissipation device, the second accommodating chamber and the first accommodating chamber form a communicating loop structure; the high-thermal-conductivity magnetic fluid can pass through the first containing chamber and flow between the second containing chambers, the high-thermal-conductivity magnetic fluid comprises a composite nano magnetic capsule suspended in the carrier fluid and a microcapsule formed by taking a high-thermal-conductivity microsphere as a core, taking ferroferric oxide (Fe3O4) nanoparticles as a shell and covering the surface of the high-thermal-conductivity microsphere, and the composite nano magnetic capsule and the microcapsule supplement each other and multiply each other; the composite nano magnetic capsule has high thermal conductivity and permanent magnetism, and the defect of insufficient thermal conductivity of a conventional magnetic fluid is overcome; the magnetic field generating component is arranged on the inner bottom edge face of the second containing chamber and used for enabling the second containing chamber to form a circulation pipeline with a magnetic field, so that when the high-heat-conduction magnetic fluid passes through the second containing chamber, the flow speed of the high-heat-conduction magnetic fluid is increased, and the heat transfer efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to a magnetic flow type heat spreader heat dissipation system and its application, and in particular to a heat spreader heat dissipation system using a high thermal conductivity magnetic fluid with both "high thermal conductivity" and "permanent magnetism" combined with a long flat magnetic field generating component. Background Art

[0002] In our daily lives, such as mobile phones, high-speed computing communication vehicles, ultra-thin notebook computers, wearable vehicles for virtual reality applications, AI chips or future 5G communication system components, the heat generated per unit volume is increasing as the size of the working components is getting smaller and smaller, the speed and efficiency of the work are getting higher and higher.

[0003] To solve the above problems, currently, high-heat-generating electronic components are brought into thermal contact with a temperature vapor chamber, so that the heat energy generated by the electronic components is transferred to the temperature vapor chamber, and then the working medium inside the temperature vapor chamber takes the heat away from the location of the electronic components and releases the heat through the working medium, thereby maintaining the electronic components and the surrounding areas at a suitable temperature.

[0004] However, according to investigation, the traditional vapor chamber uses the working (heat dissipation) fluid enclosed in the plate-shaped cavity to absorb latent heat on the heat absorption surface of the vapor chamber to produce phase change, and the vaporized molecules are evenly diffused to the heat dissipation surface of the vapor chamber, and return to the liquid state after releasing the latent heat, and perform evaporation and condensation cycles, so that the vapor chamber has the functions of rapid heat conduction and heat diffusion, so the heat of electronic components can be discharged more quickly and evenly through the thermal bonding vapor chamber. However, the traditional vapor chamber is easy to collide with the gaseous working fluid and the liquid working fluid in the cavity or hinder each other's flow, resulting in part of the working fluid being unable to convert from the high-temperature gas state to the low-temperature liquid state, causing some areas of the cavity to often present a high temperature state, thereby reducing the heat dissipation efficiency of the vapor chamber, and thus the heat dissipation effect is poor; therefore, the well-known vapor chamber still needs to be improved.

[0005] According to the paper "Research on Heat Conduction of Magnetic Fluids" by Wang Longfu of National Chiao Tung University in Taiwan, magnetic fluids are composed of nano-scale ferromagnetic particles suspended in a carrier fluid. The magnetic fluid composition is composed of nano-scale magnetic particles (ferroferric oxide particles), surfactants and base fluids. The size of the nanoparticles is about 10nm. The main method of manufacturing magnetic fluids is to attach surfactants to nano-scale magnetic particles through chemical synthesis to prevent the attraction between particles from agglomerating or precipitation due to gravity, centrifugal force and magnetic force, and evenly dissolve them in an aqueous or oily base fluid, so that they have both magnetic and flowable properties.

[0006] Papell, a scientist at NASA, crushed magnetite into ultrafine particles in a pulverizer, added a surfactant, and dispersed it in a solvent to form a magnetic fluid. The magnetic particles will not be affected by the magnetic field, Van der Waals force or gravity field, and will not condense and separate from the liquid. When the magnetic fluid is placed in a magnetic field, due to the effect of the magnetic field, the magnetic particles in the suspension will move in the direction of the strong magnetic field, and at the same time, the solvent molecules will move together. The general application of magnetic fluid at this stage is mainly in three parts: (a) space technology, (b) damping mechanism and (c) shaft sealing technology. The above records are found in Wang Longfu's paper. The relevant magnetic fluid manufacturing method is found in patents such as US Patent No. 3,215,527, US Patent No. 3,917,538, US Patent No. 4,356,098, and US Patent No. 5,851,416. However, according to investigations, the magnetic particles in magnetic fluids at this stage are mainly composed of nano-scale magnetic particles (iron tetroxide particles), so they are generally called "ferrofluids". Ferrofluids are commonly used in loudspeakers to absorb the heat generated between the voice coil and the magnets, while passively damping the movement of the speaker cone. The ferrofluid is usually located in the air gap between the voice coils and is held in place by the magnets in the speaker. Ferrofluids are paramagnetic and thus satisfy Curie's law: their magnetism decreases as the temperature increases. As the speaker magnets generate heat during operation, the surrounding heated ferrofluid becomes less magnetic and is replaced by the surrounding cold ferrofluid. This is an effective way to dissipate heat without requiring external energy.

[0007] However, with the development of AI chips and 5G communication system components, the size of working components is getting smaller and smaller, the speed and efficiency of work are getting higher and higher, and the heat generated per unit volume is getting higher and higher. Under such circumstances, the thermal conductivity of commonly used ferromagnetic fluids is still insufficient.

[0008] Therefore, how to improve the characteristics of magnetic fluid (also called Ferrofluid) and then use it on the vapor chamber to further improve the heat dissipation efficiency of the conventional vapor chamber is a problem to be solved by the present invention. Summary of the invention

[0009] The main purpose of the present invention is to provide a magnetic flow type temperature equalizing plate heat dissipation system and its use, which uses a high thermal conductivity magnetic fluid and replaces the gravity field with an external magnetic field to produce a convection effect, thereby accelerating the flow speed of the working fluid and thereby improving the heat dissipation efficiency.

[0010] Another object of the present invention is to provide a magnetic flow type heat spreader heat dissipation system and its use, which can effectively enhance the heat transfer effect by utilizing the collision between particles in the high thermal conductivity magnetic fluid and the collision between particles and the tube wall.

[0011] Another object of the present invention is to provide a magnetic flow type temperature homogenizing plate heat dissipation system and its use, which has the advantages of simple structure, low manufacturing cost and small size and improved efficiency.

[0012] To achieve the above-mentioned purpose, the technical means adopted by the temperature equalizer of the present invention are as follows. The present invention provides a magnetic flow type temperature equalizer heat dissipation system, comprising: a first plate body and a second plate body, the first plate body and the second plate body are sealed corresponding to each other, and a first chamber is formed between the first plate body and the second plate body, and the first chamber is composed of a continuous slender pipe; a second chamber, which is a tubular body, is arranged on the side of the first chamber, and has an input port and an output port, and forms a connecting loop structure with the first chamber; a high thermal conductivity magnetic fluid is filled in the first chamber, and the high thermal conductivity magnetic fluid can pass through the first chamber and flow between the second chamber. , wherein the high thermal conductivity magnetic fluid includes a composite nano-magnetic capsule suspended in a carrier fluid, the composite nano-magnetic capsule has a high thermal conductivity microsphere as a core and a ferroferric oxide (Fe3O4) nanoparticle as a shell, and is a microcapsule formed by the ferroferric oxide nanoparticles covering the surface of the high thermal conductivity microsphere; and a magnetic field generating component, which is arranged in an elongated shape and arranged on the inner bottom edge surface of the second container, so that the second container forms a flow channel with a magnetic field, so that when the high thermal conductivity magnetic fluid passes through the second container, the flow rate of the high thermal conductivity magnetic fluid is promoted, thereby improving the heat dissipation efficiency.

[0013] According to the above features, in a feasible embodiment, the high thermal conductivity microspheres include microspheres made of any high thermal conductivity material selected from molybdenum, tin, carbon, silver, silicon carbide, silicon, tungsten, copper or aluminum.

[0014] According to the above features, in a feasible embodiment, the magnetic field generating component may include a N and S magnetic pole line sheet.

[0015] According to the above features, in another feasible embodiment, the magnetic field generating component may also include a flat stator coil with an external current.

[0016] According to the above features, in a feasible embodiment, the temperature homogenizing plate may include a plate-shaped body without heat dissipation fins, and the plate-shaped body may be configured to be rectangular, circular or other geometric shapes.

[0017] According to the above features, in another feasible embodiment, the temperature homogenizing plate may also include a three-dimensional shape with heat dissipation fins, and the three-dimensional shape may be configured as a rectangle, a circle or other geometric shapes.

[0018] According to the above-mentioned features, in a feasible embodiment, the first chamber includes an array of slender pipes, and is respectively provided with two connected liquid storage chambers at the front and rear ends, and the two liquid storage chambers are respectively connected to the second chambers arranged on the left and right sides, and the magnetic field elements are respectively provided in the second chambers on the left and right sides.

[0019] Based on the above characteristics, the applications of the temperature vapor chamber include being used in mobile phone back panels, projectors, servers, solid-state drives, power routers, LED lamps, motor cooling, power batteries, cooling chips, computers, display cards, network communication equipment, power crystals (SSR), fluorine-free refrigerators, CPUs, GPUs, solar panels or thermostats.

[0020] With the aid of the above technical means, the present invention has the following improved effects that need to be further explained:

[0021] 1. The present invention uses a high thermal conductivity magnetic fluid in a temperature equalizing plate, and replaces the gravity field with an external long flat magnetic field generating component to produce a convection effect, so that the flow speed of the working fluid is accelerated, thereby improving the heat dissipation efficiency.

[0022] 2. In the high thermal conductivity magnetic fluid of the present invention, the composite nano-magnetic capsule has a high thermal conductivity microsphere as the core and ferroferric oxide (Fe3O4) nanoparticles as the shell. The ferroferric oxide is coated on the surface of the high thermal conductivity microsphere to form a microcapsule. The high thermal conductivity magnetic fluid includes a composite nano-magnetic capsule suspended in a carrier fluid. In addition to the high thermal conductivity of the core, the ferroferric oxide (Fe3O4) nanoparticles coated on the surface are arranged in a chain due to the magnetic field. The chain increases the heat transfer between particles, the collision between particles and the collision between particles and the tube wall, so that the high thermal conductivity "core" and the magnetic "shell" complement each other, have both "high thermal conductivity" and "permanent magnetism", improve the defect of insufficient thermal conductivity of common magnetic fluids, and greatly increase the heat transfer efficiency.

[0023] 3. The temperature vapor chamber of the present invention has the advantages of simple structure, low manufacturing cost and small size, so it is convenient to be used in many electronic products such as mobile phone back panels, projectors, servers, etc. The high thermal conductivity magnetic fluid inside the temperature vapor chamber takes the heat away from the location of the electronic components, and releases the heat through the high thermal conductivity magnetic fluid, so as to keep the electronic components and the surrounding areas at a suitable temperature, thereby increasing the service life of the electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A It is an exploded perspective view of a preferred embodiment of the present invention.

[0025] Figure 1B It is a schematic diagram of a feasible embodiment of the magnetic field generating component of the present invention.

[0026] Figure 1CIt is a schematic diagram of another feasible embodiment of the magnetic field generating component of the present invention.

[0027] Figure 2A It is a combined stereogram of a preferred embodiment of the present invention.

[0028] Figure 2B yes Figure 2A Sectional view of section 2B-2B.

[0029] Figure 2C It is a schematic diagram showing the composite nano-magnetic capsule in the carrier fluid of the present invention.

[0030] Figure 3A yes Figure 2A Sectional view of section 3A-3A.

[0031] Figure 3B yes Figure 3A A magnified view of some of the structures in .

[0032] Figure 4A It is a schematic diagram of the arrangement of the composite nano-magnetic capsules under zero magnetic field (H=0) of the present invention.

[0033] Figure 4B It is a schematic diagram of the arrangement of the composite nano-magnetic capsules under a relatively low magnetic field (H=Low) of the present invention.

[0034] Figure 4C It is a schematic diagram of the arrangement of the composite nano-magnetic capsules under a relatively strong magnetic field (H=High) of the present invention.

[0035] Figure 5A It is a top view of another feasible embodiment of the first chamber and the second chamber of the temperature homogenizing plate of the present invention.

[0036] Figure 5B is a cross-sectional view of another possible embodiment of the present invention, showing a temperature homogenizing plate with heat dissipation fins.

[0037] Figure 5C FIG. 1 is a top view of another possible embodiment of a temperature vapor chamber of the present invention, showing a piezoelectric lattice material.

[0038] Figure 5D FIG. 4 is a top view of another possible embodiment of a temperature vapor chamber of the present invention, showing a circular temperature vapor chamber.

[0039] Figure 5E FIG. 1 is a top view of another possible embodiment of a temperature vapor chamber of the present invention, showing a columnar temperature vapor chamber.

[0040] Fig. 5F FIG. 1 is a top view of another possible embodiment of a temperature vapor chamber of the present invention, showing a non-planar temperature vapor chamber.

[0041] Figure 5GFIG. 1 is a top view of another possible embodiment of a temperature vapor chamber of the present invention, showing a flexible temperature vapor chamber.

[0042] Figure 6 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to traditional heat sink fins.

[0043] Figure 7 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a traditional columnar radiator.

[0044] Figure 8 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a traditional multi-axis radiator.

[0045] Fig. 9 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a traditional mobile phone.

[0046] Fig.10 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a traditional display card.

[0047] Fig.11 This is a reference diagram of the use status of the temperature equalizer of the present invention applied to a traditional solid state hard disk.

[0048] Fig.12 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a conventional automotive LED lamp.

[0049] Fig.13 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a traditional projector.

[0050] Fig.14 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a traditional server.

[0051] Fig.15 This is a reference diagram of the use status of the temperature equalizing plate of the present invention when applied to a traditional heat dissipation pump.

[0052] Fig.16 This is a reference diagram of the use status of the temperature equalizing plate of the present invention when applied to a traditional LED street lamp.

[0053] Fig.17 This is a reference diagram of the use status of the temperature equalizing plate of the present invention applied to a traditional LED traffic light.

[0054] Description of Figure Numbers:

[0055] 10 temperature plate; 11 first plate body; 12 second plate body; 12a piezoelectric lattice material; 13 first chamber; 13a, 13b liquid storage chamber; 14 second chamber; 141 input port; 142 output port; 15 sealing; 20 magnetic fluid; 21 composite nano magnetic capsule; 211 high thermal conductivity microsphere; 212 ferroferric oxide (Fe3O4) nanoparticles; 22 carrier fluid; 23 tetramethylammonium hydroxide; 30 magnetic field generating component; 30a N, S magnetic pole line array; 30b flat stator coil; 40 cooling fins; 41 base; 50 columnar radiator; 51 base; 60 multi-axis radiator; 61 base; 70 mobile phone; 71 back panel; 80 display card; 81 back panel; 90 solid state drive; 91 circuit board; 100 automotive LED lamp cooling module; 101 cooling fins; 110 projector; 111 body; 120 server; 121 body; 130 cooling pump; 131 cover; 132 LCD panel; 140 LED street light; 141 body; 150 LED traffic light; 151 body. DETAILED DESCRIPTION

[0056] The following is an explanation of the implementation of the present invention by means of specific embodiments. A person skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in the present invention specification. The present invention can also be implemented or applied by means of other different specific embodiments, and the details in the present invention specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0057] First, see Figure 1A to Figure 4C As shown, the present invention provides a magnetic flow type heat spreader heat dissipation system, and a preferred specific embodiment of the heat spreader 10 includes: a first plate body 11 and a second plate body 12, the first plate body 11 and the second plate body 12 are sealed 15 with each other, and a first chamber 13 is formed between the first plate body 11 and the second plate body 12, and the first chamber 13 is composed of a continuous slender pipe; in this embodiment, a second chamber 14 is a tubular body arranged on the side of the first chamber 13, which has an input port 141 and an output port 142, and forms a connecting loop structure with the first chamber 13;

[0058] like Figure 2A and Figure 2B As shown, a high thermal conductivity magnetic fluid (Magnetic Fluid or Ferrofluid) 20 is filled in the first chamber 13. The high thermal conductivity magnetic fluid 20 can pass through the first chamber 13 and flow between the second chamber 14. The high thermal conductivity magnetic fluid 20 is a liquid that is strongly polarized in the presence of a magnetic field. The high thermal conductivity magnetic fluid of the present invention is different from the traditional magnetic fluid. Figure 2CAs shown, the high thermal conductivity magnetic fluid 20 includes a composite nano-magnetic capsule 21 suspended in a carrier fluid 22. The composite nano-magnetic capsule 21 has a high thermal conductivity microsphere 211 as a core and a ferroferric oxide (Fe3O4) nanoparticle 212 as a shell. The ferroferric oxide nanoparticle 212 is a microcapsule formed by coating the surface of the high thermal conductivity microsphere 211. The so-called "microcapsule" is a technology that coats a trace amount of a substance on the surface of another material in a shell. The present invention utilizes microcapsule technology to combine the high thermal conductivity "core" and the magnetic "shell" into the composite nano-magnetic capsule 21. Since the particle size of the microencapsulated material is small and the specific surface area is large, a larger heat transfer area is also provided. The high thermal conductivity "core" and the magnetic "shell" complement each other, and the composite nano-magnetic capsule 21 with both "high thermal conductivity" and "permanent magnetism" improves the defect of insufficient thermal conductivity of common magnetic fluids and greatly increases the heat transfer efficiency. Only in this way can it be combined with the temperature plate 10 to achieve the required heat dissipation performance. In this embodiment, the high thermal conductivity microsphere 211 includes a microsphere made of any high thermal conductivity material of molybdenum, tin, carbon, silver, silicon carbide, silicon, tungsten, copper, and aluminum.

[0059] Please refer to Figure 2C As shown, the composite nano-magnetic capsule 21 suspended in the carrier fluid 22 has a surface covered with "negatively charged" nano-iron tetroxide (Fe3O4) nanoparticles 212. The carrier matrix 22 is usually an organic solvent, including polyalphaolefin (PAO), alkyl naphthalene (AN) series and fluoro oil (Perfluoropolyether) series, which has a high saturation magnetization. Through magnetic field control, the liquid carrier fluid 22 has controllable fluidity, lubricity and sealing properties.

[0060] Generally applicable surfactants can be divided into two categories. One is the type with hydrophilic and lipophilic ends, such as oleic acid; the other is the type with anions and cations, such as tetramethylammonium hydroxide. Oleic acid will use the hydrophilic end to surround the composite nanomagnetic capsule 21 inward, and the long chain lipophilic end to face outward, forming a greasy coating. The greasy coating will pull the distance between the composite nanomagnetic capsules 21 to avoid the occurrence of agglomeration. Tetramethylammonium hydroxide is composed of tetramethylammonium ions (cations) and hydroxide (anions). The hydroxide ions first approach the composite nanomagnetic capsule 21, and the tetramethylammonium ions will be attracted by electricity and coated on the outermost surface to become a positively charged colloid. The colloids are stably suspended in water due to the Coulomb repulsion. The schematic diagram of the interaction between tetramethylammonium hydroxide 23 and ferrous oxide (Fe3O4) nanoparticles 212 is shown in Figure 2C shown.

[0061] The main feature of the present invention is to utilize the above-mentioned characteristics of the high thermal conductivity magnetic fluid 20 and then apply it to the temperature vapor chamber 10, thereby improving the heat dissipation efficiency problem of the known temperature vapor chamber.

[0062] Therefore, the present invention uses a magnetic field generating member 30, which is arranged in a long and flat shape and is arranged on the bottom edge surface of the second chamber 14, so that the second chamber 14 forms a flow channel with a magnetic field, such as Figure 3A , Figure 3B As shown, when the high thermal conductivity magnetic fluid 20 passes through the second chamber 14, the flow rate of the high thermal conductivity magnetic fluid 20 is increased to improve the heat dissipation efficiency. Figure 1B As shown in FIG. 1 , in this embodiment, the magnetic field generating component 30 may include a N, S magnetic pole line sheet 30a. Figure 1C As shown, the magnetic field generating component 30 can also be formed by a flat stator coil 30b with an external current. In this embodiment, the magnetic field generating component 30 is configured in a long flat shape and can be disposed in the second chamber 14, and cleverly forms the external magnetic field of the magnetic fluid 20. It has the advantages of simple structure, low manufacturing cost and small size, so that it can be used in the heat dissipation device of various electronic products, and has substantial benefits.

[0063] like Figure 4A to Figure 4C As shown, the high thermal conductivity magnetic fluid 20 has extremely high plasticity and fluidity under the control of the magnetic field. Since the composite nanomagnetic capsule 21 of the present invention uses ferroferric oxide as the shell, it has permanent magnetism. When these composite nanomagnetic capsules 21 are dispersed in a solvent environment, the magnetic domain of each composite nanomagnetic capsule 21 is equally oriented in all directions. Therefore, the nanomagnetic particles under the zero magnetic field have no magnetic moment, such as Figure 4A As shown in , the magnetic moment M is zero in zero magnetic field (H = 0). Figure 4B As shown, when the magnetic field of the magnetic field generating member 30 begins to increase, the magnetic field is low (H=Low), and the composite nano-magnetic capsules 21 begin to move in an arranged manner along the direction of the magnetic field. Figure 4C As shown, when the magnetic field is strong (H=High), the magnetic domains of the nanomagnetic particles 21 tend to align along the external magnetic field, and when the external magnetic field is removed, the magnetic domains of the composite nanomagnetic capsule 21 tend to relax due to Brownian motion, and all directions are directly equal. When the external magnetic field is removed, the magnetic moment of the composite nanomagnetic capsule 21 disappears, which is the so-called superparamagnetism.

[0064] Since the high thermal conductivity magnetic fluid is a kind of suspended liquid with superparamagnetism, the composite nanomagnetic capsule 21 will not settle due to gravity, nor will it condense or agglomerate due to magnetic attraction. When an external magnetic force is applied, the superparamagnetic high thermal conductivity magnetic fluid will be attracted by the magnetic field and produce various protruding peaks along the direction of the magnetic lines of force. The stronger the magnetic field, the more obvious the protruding peaks. When the magnetic force disappears, the magnetic fluid 20 will return to a normal fluid. Therefore, the high thermal conductivity magnetic fluid 20 is equipped with a magnetic field generating component 30, and the magnetic iron oxide (Fe3O4) particles are arranged in a chain (such as Figure 4C As shown, the chain shape increases the heat transfer between particles, greatly increasing the heat transfer efficiency. The present invention utilizes the above characteristics of the high thermal conductivity magnetic fluid 20, skillfully combines the magnetic field generating component 30 and uses it in the temperature plate 10, thereby improving the heat dissipation efficiency problem of the known temperature plate.

[0065] In a feasible embodiment, the temperature plate 10 includes a plate-shaped body without heat dissipation fins, and the plate-shaped body can be set in a rectangular, circular or other geometric shape. Furthermore, the temperature plate 10 can also include a three-dimensional shape with heat dissipation fins, and the three-dimensional shape can be set in a rectangular, circular or other geometric shape. The following only gives several feasible embodiments for illustration, but is not limited thereto.

[0066] First, if Figure 5A As shown, in a feasible embodiment, the first chamber 13 of the temperature equalizing plate 10 includes an array of slender pipes, and is respectively provided with two connected liquid storage chambers 13a and 13b at the front and rear ends. The two liquid storage chambers 13a and 13b are respectively connected to the second chamber 14 arranged on the left and right sides, and the magnetic field element 30 is respectively provided in the second chamber 14 on the left and right sides.

[0067] Furthermore, if Figure 5B As shown in FIG. 1 , in another feasible embodiment, the temperature homogenizing plate 10 may be configured as a three-dimensional shape having heat dissipation fins. Figure 5C As shown, the top of the three-dimensional temperature equalizing plate 10 may be coated with a piezoelectric lattice material 12 a. Figure 5D FIG. 1 is a top view of another feasible embodiment of the temperature vapor chamber 10 of the present invention, showing that the temperature vapor chamber 10 may also be configured to be circular. Figure 5E The display temperature plate 10 can also be configured as a column. Fig. 5F As shown, the temperature plate 10 can also be configured in a planar shape, such as a U-shape, an L-shape or other geometric shapes. Figure 5G As shown, the temperature vapor chamber 10 of the present invention can also be a flexible or bendable temperature vapor chamber type.

[0068] Based on the above structure, the temperature equalizing plate 10 can be used in mobile phone back panels, projectors, servers, solid-state drives, power routers, LED lamps, motor cooling, power batteries, cooling chips, computers, display cards, network communication equipment, power crystals (SSR), fluorine-free refrigerators, CPUs, GPUs, solar panels, thermostats... etc., which will not be repeated here.

[0069] The following are several examples to illustrate the application fields and usage conditions of the temperature equalizer 10 of the present invention: First, please refer to Figure 6 As shown in FIG. 1 , it shows the use state of the temperature averaging plate 10 of the present invention applied to the conventional heat sink fin 40. The temperature averaging plate 10 can be set to the same size as the base 41 area of ​​the heat sink fin 40, or as shown in FIG. Figure 6 As shown, it can be conveniently implemented by setting it to be slightly larger than the area of ​​the heat dissipation fins 40.

[0070] like Figure 7 As shown, it shows a reference diagram of the use status of the temperature equalizing plate 10 of the present invention applied to a traditional columnar radiator 50. The temperature equalizing plate 10 can be matched with the shape and structure of the circular base 51 of the columnar radiator 50, and is set into a circular body, and then affixed to the bottom of the circular base 51, so that the heat dissipation efficiency of the columnar radiator 50 can be improved.

[0071] like Figure 8 As shown in FIG. 1 , it shows a reference diagram of the use of the temperature averaging plate 10 of the present invention applied to a conventional multi-axis radiator 60. The temperature averaging plate 10 can be configured to be the same size as the base 61 of the multi-axis radiator 50, or as Figure 8 As shown, it can be conveniently implemented by setting it to be slightly larger than the base 61.

[0072] like Fig. 9 As shown, it shows a reference diagram of the use status of the temperature equalizing plate 10 of the present invention applied to a traditional mobile phone 70. The temperature equalizing plate 10 can be matched with the shape of the back panel 71 of the mobile phone 70 and built inside the back panel 71. Of course, it can also be attached to the back panel 71 in an external manner, which can be conveniently implemented.

[0073] like Fig.10 As shown, it shows the reference diagram of the use status of the temperature equalizer 10 of the present invention applied to a traditional graphics card 80. The temperature equalizer 10 can be matched with the shape of the back plate 81 of the graphics card 80 and built inside the back plate 81. Of course, it can also be attached to the back plate 81 in an external manner, which can be conveniently implemented.

[0074] like Fig.11As shown, it shows a reference diagram of the use status of the temperature equalizer 10 of the present invention applied to a traditional solid-state drive (SSD) 90. The temperature equalizer 10 can be matched with the shape and structure of the solid-state drive 90 and arranged on the circuit board 91, so as to improve the heat dissipation efficiency of the solid-state drive 90.

[0075] like Fig.12 As shown, it shows the reference diagram of the use status of the temperature equalizing plate 10 of the present invention applied to the traditional automotive LED lamp heat dissipation module 100. The temperature equalizing plate 10 can be matched with the shape and structure of the automotive LED lamp heat dissipation module 100, and is arranged at the bottom of the heat dissipation fin 101, so as to improve the heat dissipation efficiency of the automotive LED lamp.

[0076] like Fig.13 As shown, it shows a reference diagram of the use status of the temperature equalizing plate 10 of the present invention applied to a conventional projector 110. The temperature equalizing plate 10 can be matched with the shape and structure of the projector 110 and arranged inside or at the bottom of the body 111 of the projector 110, so as to improve the heat dissipation efficiency of the projector 110.

[0077] like Fig.14 As shown, it shows a reference diagram of the use status of the temperature vapor chamber 10 of the present invention applied to a traditional server 120. The temperature vapor chamber 10 can be matched with the shape and structure of the server 120 and arranged inside or at the bottom of the body 121 of the server 120, so as to improve the heat dissipation efficiency of the server 12.

[0078] like Fig.15 As shown, it shows the reference diagram of the use state of the temperature averaging plate 10 of the present invention applied to the traditional heat pump 130. The temperature averaging plate 10 can be matched with the shape and structure of the heat pump 130 and is arranged in the body of the heat pump 130. The motor and the rotor of the heat pump 130 are magnetically connected, not directly transmitted, so that the high thermal conductivity magnetic fluid in the temperature averaging plate 10 will not leak out, and the heat dissipation efficiency of the heat pump 130 can be improved. In addition, the cover 131 of the heat pump 130 can be provided with a liquid crystal display panel 132, which can display the dynamic temperature of the magnetic fluid and can also automatically adjust the motor speed of the sleep and close motor.

[0079] like Fig.16 As shown, it shows a reference diagram of the use status of the temperature equalizing plate 10 of the present invention applied to a traditional LED street lamp 140. The temperature equalizing plate 10 can be matched with the shape and structure of the LED street lamp 140 and arranged in the body 141 of the LED street lamp 140, so as to improve the heat dissipation efficiency of the LED street lamp 140.

[0080] like Fig.17As shown, it shows a reference diagram of the use status of the temperature equalizing plate 10 of the present invention applied to a traditional LED traffic light 150. The temperature equalizing plate 10 can be matched with the shape and structure of the LED traffic light 150 and arranged in the body 151 of the LED traffic light 150, so as to improve the heat dissipation efficiency of the server 12.

[0081] With the help of the above technical means, the present invention has the following improved effects that need to be further explained:

[0082] 1. The present invention uses a high thermal conductivity magnetic fluid 20 in the temperature equalizing plate 10 and uses an additional long flat magnetic field generating component 30 to replace the gravity field to produce a convection effect, so as to accelerate the flow speed of the working fluid and thereby improve the heat dissipation efficiency.

[0083] Second, the present invention can use the high thermal conductivity magnetic fluid 20, the composite nano magnetic capsule 21 with high thermal conductivity microsphere 211 as the core, with ferroferric oxide (Fe3O4) nanoparticles 212 as the shell, and the surface of the high thermal conductivity microsphere 211 is coated to form a microcapsule. In addition to the core having high thermal conductivity, the ferroferric oxide (Fe3O4) nanoparticles 212 coated on the surface are arranged in a chain due to the magnetic field. The chain increases the heat transfer between particles, the collision between particles and the collision between particles and the tube wall, so that the high thermal conductivity "core" and the magnetic "shell" complement each other, and the composite nano magnetic capsule 21 with both "high thermal conductivity" and "permanent magnetism" is formed, which improves the defect of insufficient thermal conductivity of conventional magnetic fluids and greatly increases the heat transfer efficiency.

[0084] 3. The temperature vapor chamber 10 of the present invention has the advantages of simple structure, low manufacturing cost and small size, so it is convenient to be used in many electronic products such as mobile phone back panels, projectors, servers, etc. The high thermal conductivity magnetic fluid 20 inside the temperature vapor chamber 10 takes the heat away from the location of the electronic components, and releases the heat through the high thermal conductivity magnetic fluid 20, so as to keep the electronic components and the surrounding areas at a suitable temperature, thereby increasing the service life of the electronic products.

[0085] Any modification or equivalent changes made by a person skilled in the art who is familiar with this field in accordance with the spirit and scope of the present invention should still be included in the protection scope of the patent of the present invention.

Claims

1. A magnetic flow type heat spreader heat dissipation system, characterized in that: The temperature chamber includes: A first plate and a second plate, the first plate and the second plate are sealed to each other, and a first chamber is formed between the first plate and the second plate, and the first chamber is composed of a continuous elongated pipe; A second chamber, in a tubular shape, is disposed on the side of the first chamber, has an input port and an output port, and forms a communicating loop structure with the first chamber; A high thermal conductivity magnetic fluid is filled in the first chamber. The high thermal conductivity magnetic fluid can pass through the first chamber and flow between the second chambers. The high thermal conductivity magnetic fluid includes a composite nano-magnetic capsule suspended in a carrier fluid. The composite nano-magnetic capsule has a high thermal conductivity microsphere as a core and ferroferric oxide (Fe3O4) nanoparticles as a shell. The ferroferric oxide nanoparticles are coated on the surface of the high thermal conductivity microsphere to form a microcapsule; and A magnetic field generating component is arranged in an elongated shape and is arranged on the bottom edge surface of the second chamber to form a flow channel with a magnetic field in the second chamber, so that when the high thermal conductivity magnetic fluid passes through the second chamber, the flow rate of the high thermal conductivity magnetic fluid is promoted to improve the heat dissipation efficiency.

2. The magnetic flow type heat spreader cooling system according to claim 1, characterized in that: The high thermal conductivity microspheres include microspheres made of any high thermal conductivity material of molybdenum, tin, carbon, silver, silicon carbide, silicon, tungsten, copper or aluminum.

3. The magnetic flow type heat spreader cooling system according to claim 2, characterized in that: The magnetic field generating component comprises a N and S magnetic pole line array sheet.

4. The magnetic flow type heat spreader heat dissipation system according to claim 2, characterized in that: The magnetic field generating component comprises a flat stator coil to which an external current is impressed.

5. The magnetic flow type heat spreader cooling system according to claim 3 or 4, characterized in that: The temperature homogenizing plate comprises a plate-shaped body without heat dissipation fins, and the plate-shaped body can be configured into a rectangular, circular or other geometric shapes.

6. The magnetic flow type heat spreader cooling system according to claim 3 or 4, characterized in that: The temperature equalizing plate comprises a three-dimensional shape with heat dissipation fins, and the three-dimensional shape can be set to a rectangle, a circle or other geometric shapes.

7. The magnetic flow type heat spreader cooling system according to claim 3 or 4, characterized in that: The first chamber comprises an array of elongated pipes, and is provided with two communicating liquid storage chambers at the front and rear ends respectively. The two liquid storage chambers are further connected to the second chambers at the left and right sides respectively, and the magnetic field elements are respectively provided in the second chambers at the left and right sides.

8. Use of the magnetic flow type vapor chamber heat dissipation system according to any one of claims 1 to 7, characterized in that: The applications of this temperature vapor chamber include: mobile phone back panel, projector, server, solid state drive, power router, LED lamp, motor cooling, power battery, cooling chip, computer, display card, network communication equipment, power crystal (SSR), fluorine-free small refrigerator, CPU, GPU, solar panel or thermostat.

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