Liquid cooling device with multiple flow paths for different on-board heat generating electronic components

Abstract

A liquid cooling apparatus and system for immersion cooling of electronic devices, particularly including a server and other IT hardware nodes with an array of heat generating devices including microprocessors, RAMs, mainboards, etc. with different operating temperatures. The apparatus and system are adapted for at least series-connected cooling liquid streams in direct contact with different heat generating devices, providing multi-stage heat transfer stages, improving energy efficiency and operational control and performance of electronic devices.

Description

Technical Field

[0001] The present concept relates to a liquid cooling system for effectively and efficiently cooling heat-generating electronic components, and particularly, but not exclusively, to a liquid cooling system for cooling IT components, servers, computing electronic devices, etc., by directly immersing these components and equipment in a dielectrically cooled liquid coolant. Background Art

[0002] Due to the continuous development of smaller, faster, higher density and higher power capacity electronic devices, cooling of electronic devices, especially IT components with graphics and central processing units, servers, data storage devices and computing electronics has become a major technical challenge.

[0003] Computing devices generate heat during operation. With tens of thousands of these devices in a data center, the heat generated can be very high. As the demand for greater processing and data storage continues to expand, the density of server systems continues to increase, and the resulting heat dissipation becomes a significant practical obstacle.

[0004] Conventional fan-based cooling systems require large amounts of electricity. As a result, the power requirements to drive such systems increase significantly as server density increases. Immersion cooling of IT components is a relatively recent development. Operating hot electronic devices are directly immersed in a dielectric (electrically insulating) cooling liquid that is circulated and cooled through the use of a heat exchanger, for example. Cooling of electronic devices improves their performance efficiency, enabling higher processing speeds (e.g., overclocking of CPUs). Heat generated by the circuits is quickly and efficiently removed directly at the heat source by the dielectric liquid. However, there is an overall need to continue to improve the operating efficiency of existing liquid immersion cooling systems, both to improve the cooling efficiency of electronic components and to improve the thermal management and circulation of the cooling liquid to achieve efficient energy reuse. Summary of the invention

[0005] One object of the present disclosure is to provide an apparatus and method for accurate and efficient liquid cooling of electronic equipment. A specific object is to provide an electronic component liquid cooling system to enable IT components and the like to operate at high temperatures. Another specific object is to provide a refrigeration system to maximize the operating temperature of the dielectric liquid, which is due to heat transfer with the electronic components for subsequent energy reuse. Another specific object is to provide a system that allows the dielectric liquid to flow out at a uniform / constant temperature (after heat transfer with the electronic components). This configuration maximizes the efficiency and effectiveness of thermal energy transfer using a suitable heat exchanger or similar device to achieve thermal energy reuse.

[0006] The present system provides a liquid immersion / submersion arrangement in which IT electronic components are spatially separated / isolated based on their operating temperature and effective power consumption. Specifically, the present system is configured to cool the electronic components via direct contact and circulation with a refrigerant liquid to provide a single liquid refrigeration system for cooling each electronic component individually and / or independently of each other as needed based on the operating performance, type, operating temperature, size and / or configuration of the electronic component.

[0007] "Electronic components", "electronic devices", or similar components mentioned in this specification include heat-generating electronic components, such as those installed on larger IT components / equipment, such as servers, motherboards, data storage devices, programmable logic controller boards, etc. Such heat-generating electronic components include, for example, circuits and / or electronic devices located on motherboards or other printed circuit board devices, random access memory (RAM); graphics processing units (GPUs); central processing units (CPUs); chips, sockets; peripheral component interconnect standard (PCI) slots; read-only memory (ROM) components, chips and slots; graphics processing components, ports, slots, chips; bridges; battery components, ports and slots; power plugs, slots and ports, electronic connectors; electronic heat sinks; switches; jumpers; capacitors; transistors; diodes; components related to operating power; current and / or voltage regulators and modules; power converters, etc.

[0008] The present system is configured to deliver coolant liquid to heat generating electronic devices based on typical, normal, average and / or maximum operating temperatures of the heat generating electronic devices according to a variety of different possible liquid flow circuit configurations. For example, the present system is compatible with liquid flow configurations in series, parallel and / or a combination of series and parallel based on the spatial positioning of the electronic components according to the typical, normal, average and / or maximum operating temperatures of the electronic components. Thus, the present system provides an outflow liquid flow at a maximum outflow temperature and a constant / uniform temperature over time. The heated dielectric liquid can then be efficiently and effectively processed for thermal reuse via a heat exchanger or the like, wherein the thermal energy is transferred from the dielectric liquid to an auxiliary application or device that requires a temporary or continuous supply of thermal energy.

[0009] The outflow of dielectric liquid heated to maximum and uniform operating work (over time) provides an efficient and effective heat source for heat reuse technology. This is achieved by spatially separating / isolating the heat generating devices based on their respective operating temperatures. Specifically, at least one, and in particular a group of first heat generating electronic components can be separated and located in a first area or chamber of the device for initial contact with the dielectric liquid. At least one second element or a group of additional heat generating electronic components (having a higher operating temperature than the first electronic device) can be located in an isolated or separated area (or enclosure) of the system / device for separation and / or subsequent contact with the dielectric liquid. This arrangement allows the dielectric liquid to be retained to directly contact the first heat generating electronic component and then directly contact the second heat generating electronic component, so that the temperature of the dielectric liquid output in the outflow area of ​​the device is the sum of the temperature increases of the liquid that has been in contact with the electronic devices in all spatially isolated areas.

[0010] In one aspect, the system includes a package (or lid) that can be positioned to (at least partially) surround an electronic device (e.g., CPU / GPU). The package can be mounted above the chip (with or without a heat sink) or on top of the chip (e.g., cold plate technology). The coolant is then configured to flow through each package area to capture all heat generated by the electronic device. This arrangement enables the electronic device (CPU / GPU) to operate at its optimal or typical operating temperature, while also allowing the temperature of the outflow flow of cooling liquid to be high and remain uniform over time to improve energy reuse.

[0011] In one aspect, the system provides for isolating submerged heat generating devices according to their operating temperature ranges so that all submerged heat generating devices are in contact with different portions of a cooling fluid within a fluid container at a given time. The fluid within the container is driven to a cooling device where it is cooled in preparation for being driven into the container again, thereby effectively cooling the submerged heat generating devices in series. The fluid can be driven through the system in such a way that it first contacts the isolated heat generating devices having the lowest operating temperature. The partially heated fluid is then driven into contact with the next group of isolated heat generating devices having the second lowest operating temperature, where its temperature can be further increased. This process is repeated until a group of isolated heat generating devices having the highest operating temperature is in contact with the dielectric liquid, which is then driven to a cooling device (i.e., a heat exchanger).

[0012] According to a first aspect of the present concept, there is provided a liquid cooling device for an electronic device, comprising: a first housing defining a chamber to at least partially accommodate at least one first heat-generating electronic component of the electronic device; at least one inlet and at least one outlet, disposed at the first housing, to enable a dielectric cooling liquid to enter and leave the chamber in direct contact with the first heat-generating electronic component; a second housing defining an enclosure to at least partially accommodate at least one second heat-generating electronic component of the electronic device; at least one inlet and at least one outlet, disposed at the second housing, to enable the dielectric cooling liquid to enter and leave the enclosure in direct contact with the second heat-generating electronic component; at least one cooling unit, fluidically connected to at least one of the inlets and at least one of the outlets to cool the dielectric cooling liquid received from at least one of the outlets and to deliver the dielectric cooling liquid to at least one of the inlets; and a control unit, to control the liquid to flow through the chamber and the enclosure.

[0013] Preferably, the at least one outlet of the chamber is connected in fluid communication with the at least one inlet of the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

[0014] Preferably, the electronic device has: at least one first heat generating electronic component, which is at least partially contained in the chamber and is used to be immersed in the liquid in the chamber; and at least one second heat generating electronic component, which is at least partially contained in the enclosure and is used to be immersed in the liquid in the enclosure. The second heat generating electronic component can reach or include a higher operating temperature than the first heat generating electronic component.

[0015] The first heat generating electronic components mentioned in this specification include relatively low heat generating devices / components (LHGA), such as RAM, motherboard, etc. Similarly, the second heat generating electronic components mentioned in this article include relatively high heat generating components (HHGD), such as microprocessors, CPUs, GPUs, etc. The first and second heat generating electronic components are distinguished in this article by their relative normal, typical, standard and / or maximum operating temperatures. This is the heat energy generated by such a device during use and / or the heat energy as described in detail in the electronic component data sheet, database, etc. Therefore, the low heat generating component / device generally includes a normal, typical, standard and / or maximum operating temperature lower than the high heat generating component / device. In certain specific implementations, the low heat generating component / device can be configured to generate less than 200W of heat under normal or typical operation. In addition, in certain specific implementations, the high heat generating component / device can be configured to generate more than 200W of heat under normal or typical operation. However, these values ​​are for reference only, and those skilled in the art will understand that the 200W value applied to LGHD and HHGD herein may vary depending on the type of electronic component.

[0016] Preferably, at least one outlet of the enclosure is connected in fluid communication with an inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with at least one inlet of the chamber. Optionally, the chamber is connected in serial fluid communication with the enclosure.

[0017] Preferably, the control unit is configured to control the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component, and then control the liquid to flow through the enclosure for a second heat energy exchange with the second heat generating electronic component, the second heat energy exchange being a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increase of the liquid that has passed through the chamber and the enclosure. The control unit may include one or more electronic control units, modules or devices, which may include a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, a server, a printed circuit board, a motherboard or other similar devices. The control unit may include a sensor, the sensor including at least one of a flow rate, temperature, proximity, motion, current, voltage, pH and / or a magnet sensor. The control unit may include at least one control valve, which may include a solenoid valve, a diaphragm valve, a multi-way valve controlled by a pilot valve, and combinations thereof. The control unit may be located locally or remotely in the system and device for local and / or remote control of the device. The control unit may be operated via a cloud network, wireless or wired communication paths and associated elements.

[0018] Optionally, the device comprises a plurality of enclosed areas defined by respective second shells, each of the second shells enclosing a respective heat-generating electronic component arranged at the electronic device; the plurality of enclosed areas are fluidically connected in series with each other; wherein the respective heat-generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged in a sequence of increasing operating temperatures within the respective second shells; wherein the liquid is able to flow through the respective second shells, and the respective second shells are in contact with the respective heat-generating electronic components in series from relatively low to high operating temperatures.

[0019] Optionally, the system may include a plurality of enclosed areas defined by respective second shells, each of the second shells enclosing a respective heat-generating electronic component disposed at the electronic device; the plurality of enclosed areas being arranged parallel to each other along a fluid flow direction; wherein the respective heat-generating electronic components include substantially the same operating temperature or include different operating temperatures arranged in a sequence of increasing operating temperatures within the respective second shells; wherein the liquid is able to flow through the respective second shells, and the respective second shells are in contact with the respective heat-generating electronic components in parallel.

[0020] Multiple enclosures can be positioned in series and / or in parallel with each other. Thus, the liquid can be configured to flow through the chamber according to a first path, then flow through at least one enclosure via a second path in series, and then flow through another enclosure in series with the first enclosure. Each enclosure may include the same or different heat-generating electronic components with the same or different operating temperatures. When the enclosures are connected in parallel, the liquid supply can be divided / divided into independent streams that flow into each of the respective enclosures in parallel. The isolated parallel flow streams can then be merged into a single flow stream after flowing through the enclosures (in the direction of fluid flow).

[0021] Optionally, the first housing may include a liquid immersion tank, and the second housing may be smaller in size than the first housing and located within the chamber.

[0022] Optionally, the apparatus may include a dielectric cooling liquid contained within said chamber of said first housing, and wherein said second housing is at least partially immersed or fully immersed in said liquid within said chamber of said first housing. The dielectric cooling liquid may be a type of liquid suitable for immersion cooling of IT components, having suitable electrical insulating properties, providing safe direct contact with live electronic components, and importantly, having no liquid electrical conductivity.

[0023] Optionally, at least a portion of the second heat generating electronic component is positioned in direct contact with the liquid within the enclosure defined by the second housing, and / or at least a portion of the first heat generating electronic component is positioned in direct contact with the liquid within the chamber.

[0024] Optionally, the electronic device may include any one or a combination of the following: a computer entity; a server; a mainboard; a printed circuit board including a plurality of electronic components. Optionally, the first heat generating electronic component and / or the second heat generating electronic component include any one or a combination of the following: a mainboard; a random access memory (RAM); a graphics processing unit (GPU); a central processing unit (CPU).

[0025] Optionally, the device may include a pump (connected in fluid communication with the chamber and the enclosure) to drive the liquid through the first chamber and the enclosure. Preferably, the cooling unit may include a heat exchanger to transfer heat energy from the liquid to the heat transfer fluid. Optionally, the heat exchanger includes a refrigerant fluid, which is configured to circulate within a fluid circuit or network, which is isolated from the dielectric liquid, and the dielectric liquid network is configured to flow through the chamber and the enclosure. These exchangers are configured to allow heat energy to be transferred between the dielectric liquid and the refrigerant fluid, in particular to allow heat energy to be transferred from the dielectric liquid to the refrigerant working fluid.

[0026] Optionally, the first housing is larger than the second housing so that the chamber comprises an enclosure. The first housing may comprise a liquid immersion box or tank and the second housing may comprise a cover, hood, container, pocket or sub-chamber to separately house different heat generating electronic components that are spatially separated relative to the larger first housing, thereby allowing separate / isolated liquid flows to contact different (groups of) electronic devices. Optionally, the second housing may be exclusively and / or completely contained within the first housing.

[0027] Optionally, the device comprises at least one sensor. Optionally, the at least one sensor may comprise at least one of a flow rate, temperature, proximity, motion, current, voltage, pH and / or magnet sensor. Optionally, the device may comprise at least one temperature sensor for determining the temperature or relative temperature difference between the liquid and the first and / or second heat generating electronic element, the temperature sensor being arranged to communicate electronically with the control unit. Optionally, the electronic device of the first and / or second heat generating electronic element may comprise a temperature sensor for determining the temperature or relative temperature difference between the liquid and the first and / or second heat generating electronic element.

[0028] Optionally, the device comprises at least one electronically controllable valve connected in fluid communication with at least one of the inlet and the outlet and controllable by the control unit. Optionally, the device comprises a first electronically controllable valve connected in fluid communication with the inlet and / or the outlet of the chamber and a second electronically controllable valve connected in fluid communication with the inlet and / or the outlet of the enclosure.

[0029] Optionally, the device comprises a liquid return conduit in fluid communication with the outlet of the chamber and the inlet of the enclosure to circulate the liquid leaving the chamber into the enclosure. Optionally, the device comprises a temporary storage container connected in fluid communication between the outlet of the chamber and the inlet of the enclosure to temporarily store a volume of the liquid for circulation from the chamber to the enclosure. Optionally, the inlet of the chamber comprises a plenum to distribute the flow of the liquid into the chamber.

[0030] Optionally, the device includes at least one weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the first shell and / or the second shell. Optionally, the device includes a first weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the cover. Optionally, the device may include a second weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the shell. The "weir arrangement" mentioned in the specification includes at least one hole, a partition wall, a flow restriction body, etc., which is configured to at least partially isolate the first volume of liquid from the second volume of liquid, so that the liquid is configured to flow from the first volume to the second volume via a restricted flow path at the weir arrangement. This arrangement includes an overflow or throughflow arrangement. Optionally, the weir arrangement can provide overflow or throughflow under the action of gravity.

[0031] Optionally, the device includes at least one storage container in fluid communication with the chamber to supply and / or receive liquid in the chamber and maintain a predetermined volume of liquid in the chamber. Optionally, the device may include at least one main storage container in fluid communication with at least one of the inlet and outlet of the enclosure / lid to store liquid as part of the fluid flow network. Optionally, the main storage container includes a pressurizing mechanism to change the pressure of the liquid within the fluid flow network. Optionally, the pressurizing mechanism includes at least one electronically controllable valve to control the volume of liquid in the main storage container and / or the fluid flow network.

[0032] According to another aspect of the present concept, a method for cooling at least a portion of an electronic device is provided, comprising: delivering a dielectric cooling liquid to flow into a chamber via at least one inlet of a first housing, the chamber at least partially housing an electronic device having at least one first heat-generating electronic component, and allowing the liquid to flow out of the chamber via at least one outlet of the first housing, the first heat-generating electronic component being positioned in direct contact with the liquid within the chamber; delivering the flow of dielectric cooling liquid into an enclosure via at least one inlet of a second housing, the enclosure at least partially housing at least one second heat-generating electronic component of the electronic device, and allowing the liquid to flow out of the enclosure via at least one outlet of the second housing, the second heat-generating electronic component being positioned in direct contact with the liquid within the enclosure; sending the liquid from at least one of the outlets of the chamber and / or the enclosure to at least one cooling unit to reduce the temperature of the liquid received from the chamber and / or the enclosure; and controlling the flow of the liquid through the chamber and the enclosure using a control unit.

[0033] Optionally, the method includes controlling the flow of the liquid through the chamber and enclosure using at least one electronically controllable valve disposed in a fluid flow path of the liquid. Optionally, the method also includes controlling the flow of the liquid along a first flow path through the chamber in direct contact with the first heat generating electronic component and then along a second flow path through the enclosure in direct contact with the second heat generating electronic component, such that the heat energy transferred to the liquid is the sum of the heat energy transferred to the liquid from the first heat generating electronic component and the second heat generating electronic component.

[0034] Optionally, the second heat generating electronic component is capable of reaching or comprising a higher operating temperature than the first heat generating electronic component.The chamber is connected in series in fluid communication with the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

[0035] Preferably, the method includes providing a serial flow of the liquid through respective multiple enclosed areas, the multiple enclosed areas are defined by respective second shells, each of the second shells enclosing respective heat-generating electronic components arranged at the electronic device; wherein the respective heat-generating electronic components include substantially the same operating temperature or include different operating temperatures arranged in a sequence of increasing operating temperatures within the respective second shells, so that the liquid is configured to flow through the respective second shells, and the respective second shells are in contact with the respective heat-generating electronic components in series from relatively low to high operating temperatures.

[0036] Preferably, the method comprises controlling the flow of the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component and then through the enclosure for a second heat energy exchange with the second heat generating electronic component, the second heat energy exchange being supplementary and additional to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid having passed through the chamber and then through the enclosure. Preferably, the method comprises driving the flow of the liquid through the chamber and / or the enclosure using a pump.

[0037] According to another aspect of the present concept, there is provided a liquid immersion cooling tank for cooling an electronic device having at least one heat generating electronic component, the tank comprising an apparatus as described and claimed herein; and an electronic device having at least one heat generating electronic component, the device and the heat generating electronic component being respectively immersed in the liquid contained in the chamber and / or the enclosure.

[0038] Preferably, the liquid immersion cooling tank comprises a plurality of electronic devices, each electronic device having first and second heat generating electronic components, the devices and the heat generating electronic components being at least partially immersed in the liquid contained within the chamber and the enclosure, respectively.

[0039] Preferably, the liquid immersion cooling tank comprises at least one first shell defining the chamber to accommodate the electronic device; and a plurality of second shells located within the chamber to define respective enclosures to at least partially accommodate the respective second heat-generating electronic components of the device; wherein the device is immersed in the liquid contained within the chamber, and the second heat-generating electronic components are immersed in the liquid contained within the respective enclosures.

[0040] According to another aspect of the present concept, there is provided an electronic device rack for storing electronic devices, each electronic device having at least one heat generating electronic component, the rack comprising an apparatus as described and claimed herein; and an electronic device having at least one heat generating electronic component, the device and the heat generating electronic component being at least partially immersed in the dielectric cooling liquid contained in the chamber and the enclosure, respectively; wherein the electronic device is mounted on the rack at least partially via the first housing.

[0041] Optionally, the electronic equipment rack includes a plurality of electronic equipment, each electronic equipment having at least one heat generating electronic component, the equipment being immersed in the liquid contained in the chamber, and the at least one heat generating electronic component being immersed in the liquid respectively contained in the enclosures.

[0042] Optionally, the electronic device rack includes a plurality of first shells defining respective chambers to accommodate respective electronic devices; and a plurality of second shells defining enclosed areas and respectively located within the chambers to respectively accommodate the at least one heat-generating electronic component; wherein the plurality of electronic devices are immersed in the liquid contained within the respective chambers, and the at least one heat-generating electronic component is immersed in the liquid contained within the respective enclosed areas.

[0043] BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Specific implementations of the present concepts will now be described by way of example only and with reference to the accompanying drawings, in which:

[0045] Figure 1 is a perspective view of an immersion cooling tank for accommodating a plurality of IT hardware nodes, each of which has a microprocessor array, according to a specific implementation of the present concept;

[0046] Figure 2 Another implementation of the present concept is to install in a vertical arrangement Figure 1 A perspective view of the rack of multiple IT hardware nodes in the system;

[0047] Figure 3is a schematic diagram of a precision isolated cooling device for cooling respective first and second heat generating electronic components mounted on an IT hardware node;

[0048] Figure 4 is a schematic diagram of selected elements of a precision isolation cooling system having a circulating fluid network for circulating a cooling liquid in direct contact with a plurality of heat generating electronic components;

[0049] Figure 5 is a schematic diagram of selected elements of a precision isolation cooling system configured to deliver cooling liquid to a low heat generating device and a plurality of high heat generating devices mounted on an IT hardware node;

[0050] Figure 6 is another schematic diagram of selected elements of a precision isolation cooling system configured to deliver cooling liquid in series to Figure 5 IT hardware nodes and heat-generating equipment;

[0051] Figure 7 is a schematic diagram of a plurality of adjustably mounted covers configured to receive cooling liquid to cool a plurality of heat generating devices of an IT hardware node;

[0052] Figure 8 is a schematic diagram of an enclosure enclosing a high heat generating device, the enclosure having a control valve at an entrance to the enclosure to regulate the flow of cooling liquid;

[0053] Fig. 9 yes Figure 8 A schematic diagram of an enclosure and a heat generating device, wherein the enclosure is moved to a lowered position to reduce the internal volume within the enclosure;

[0054] Fig.10 yes Figure 8 Another schematic diagram of an arrangement in which the enclosure is elevated to increase the interior volume of the enclosure;

[0055] Fig.11 is a perspective view of a tray housing an IT hardware node having a plurality of microprocessors, the tray being provided with an internal dividing weir wall for controlled circulation of a cooling liquid;

[0056] Fig.12a is a cross-sectional side view of a first arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0057] Figure 12b is a cross-sectional side view of a second arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0058] Fig.12c is a cross-sectional side view of a third arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0059] Fig.13 is a schematic diagram of an immersion cooling system according to a specific implementation of the present concepts, the system having IT hardware nodes immersed in cooling liquid contained in an immersion cooling tank and connected to a circulating cooling liquid network and manifold;

[0060] Fig.14 is a schematic diagram of a cooling liquid circulation system according to a specific implementation of the present concept, the system being used to separate and circulate cooling liquid at each heat generating device installed at an IT hardware node;

[0061] Fig.15 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0062] Fig.16 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0063] Fig.17 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0064] Fig.18 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0065] Fig.19 It is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, which is used to separately transport and circulate cooling liquid at respective heat generating devices installed at IT hardware nodes. DETAILED DESCRIPTION

[0066] The present compartmentalized cooling fluid system attempts to maximize energy efficiency within a circulating cooling fluid network by isolating / compartmentalizing the delivery of working fluid to a series of onboard heat generating devices (typically microprocessors) having different maximum or typical operating temperatures. Specifically, the present system provides a multi-stage series cooling liquid circulation network, in which a dielectric cooling liquid can be delivered via an initial flow path in direct contact with at least one heat generating device having a relatively low maximum operating temperature, and then flows via a second flow path in direct contact with at least one or more heat generating devices (roughly located at the same location as the low heat generating device), so that thermal energy is transferred from the low heat generating device to the high heat generating device, as a multi-stage heat transfer process occurs in series. This construction maximizes the temperature change of the circulating cooling liquid. The present system can be implemented in an immersion cooling tank or a more conventional IT hardware node rack.

[0067] Reference Figure 1 The immersion cooling tank 10 includes an inner cavity 12 for accommodating a plurality of IT hardware nodes 11 (such as servers, etc.), each of which has an array of different heat generating devices (HGDs) in the form of onboard electronic components, which may generally include relatively low heat generating components (e.g., RAM, motherboard, etc.) and relatively high heat generating devices (e.g., microprocessors), which themselves may have different maximum operating temperatures. Figure 2 An alternative arrangement for mounting IT hardware nodes 11 is shown in the form of a support rack 13, wherein the IT hardware nodes 11 are mounted within a generally upright frame 70. A plurality of horizontal rails 71 allow for mounting of respective trays 14, each tray being configured to accommodate at least one IT hardware node 11, so as to provide an array of nodes 11 mounted on the rack 13 vertically relative to each other.

[0068] Reference Figure 3 The system includes a first housing 15 defining an inner cavity 28 containing a dielectric cooling liquid 18. The housing 15 is sized to accommodate an IT hardware node, in particular, an electronic device such as a motherboard 16, which in turn has a plurality of electronic components mounted thereon, specifically, a plurality of low heat generating devices 17 (LHGD) and a plurality of high heat generating devices 19 (HHGD). For ease of illustration, Figure 3A single LHGD 17 and HHGD 19 are shown, along with a single cover 20 for each. However, it will be appreciated that the device includes a plurality of such elements. A plurality of second housings (or covers) 20 are located above and around each respective HHGD 19. A conduit 21 provides fluid communication between the outlet port 23 of the housing 15 and the respective enclosure 27 defined by each cover 20. Each cover 20 includes an opening 37 having a cross-sectional area greater than the size / cross-sectional area of ​​each HHGD 19. Thus, at least a portion of each HHGD 19 can be accommodated or disposed within each enclosure 27, each enclosure 27 being defined by each cover 20 located above and around each HHGD 19. Each opening 37 is correspondingly located in an area surrounding each HHGD 19, in contact or near contact with the motherboard 16. The housing 15 also includes an inlet 22 located at a respective opposite end relative to the outlet 23. Inlet manifold 24 is connected in fluid communication between inlet 22 and heat exchanger 26, which has respective outlet 26a and inlet 26b. Respective return manifolds 25 provide fluid communication between housing outlet 23 and heat exchanger inlet 26b. Thus, the dielectric cooling liquid is configured to circulate through chamber 28 and directly contact LHGD 17 and HHGD 19 (via inlet 22 and outlet 23), heat exchanger 26, and manifolds 25 and 24. Heat exchanger 26 includes an internal heating coil with a respective working fluid or other similar arrangement configured to transfer energy from the dielectric cooling liquid received at inlet 26b so that the temperature of the liquid output at outlet 26a is lower than the temperature of the incoming liquid (through inlet 26b).

[0069] According to the series split immersion cooling of the respective LHGD 17 and HHGD 19, the temperature difference of the liquid at the outlet 23 and the inlet 22 is maximized, thereby maximizing the energy efficiency of the present arrangement. Figure 3 In the arrangement of FIG. 2 , cooling liquid enters chamber 28 via inlet 22, and the liquid then contacts LHGD 17 for a first energy exchange, thereby slightly increasing the temperature of the dielectric liquid. Due to the suction force, the partially warmed liquid is drawn into enclosure 27 via each opening 37. The liquid contained in each cover 20 undergoes a second level of energy exchange with HHGD 19, which operates at a much higher temperature relative to LHGD 17. Therefore, the already warmed liquid is further heated to its maximum operating temperature. The fluid is then output from enclosure 27 (and chamber 28) and delivered to heat exchanger 26 via outlet 23 and return manifold 25. Once cooled in heat exchanger 26, the dielectric liquid is recirculated to inlet 22 via inlet manifold 24, and the cycle is repeated.

[0070] According to various embodiments described herein, the device and system include a control unit, sensors, and electronically controllable fluid flow valves to control and regulate the flow rate of the dielectric liquid flowing through each area of ​​the device and maximize energy efficiency, in particular, maximize the required heat energy exchange with the LHGD 17 and HHGD 19. The control unit may include a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, and / or a motherboard, etc. The sensor may include a flow rate, temperature, proximity, motion, current, voltage, pH, and / or magnetic sensor. The control valve may include a solenoid valve, a diaphragm valve, or other solenoid valve, for example, including direct actuation, pilot valve control, two-way, three-way, four-way valves, and combinations thereof. The system and device may be locally and / or remotely controlled via a cloud network, and may be configured to monitor various operating characteristics of the system and device locally or remotely, including the operating performance of electronic components and / or dielectric cooling fluids.

[0071] Reference Figure 4 , the present device is configured to achieve maximum temperature variation of the dielectric cooling liquid (delivered in direct contact with the plurality of LHGDs 17 and HHGDs 19) in addition to supplying a constant temperature cooling liquid to the heat exchanger. This configuration maximizes the operating performance of the heat exchanger and the present system. Figure 4 In the embodiment of the present invention, the inlet manifold 24 provides fluid communication between the plurality of LHGDs 17 and the plurality of spaced-apart HHGDs 19 (all mounted on the IT hardware node). Each HHGD 19 is at least partially encapsulated by a respective cover 20 ( Figure 3 ). Specifically, the incoming cooling liquid is divided via the inlet conduit 24a so as to provide parallel liquid flow streams to each enclosure 27 housing each HHGD 19. The heated fluid is then output from each respective enclosure 27 via the conduit 21. The flow control valve 29 is electronically communicated with a control unit 33, which is also provided with appropriate sensors (not shown) to monitor at least one operating characteristic at each HHGD 19 and / or region of the enclosure 27, in particular including the flow rate, temperature and / or temperature change of the cooling liquid at each HHGD 19. The flow streams from the conduit 21 are then configured to converge via the outlet conduit 25a to provide a single flow stream to the return manifold 25. A temperature sensor 30 (electronically connected to the control unit 33) is provided at the manifold 25. The pump 31 drives the liquid through the circuit, in particular in direct contact with the LHGD 17 and the HHGD 19, and forward to the heat exchanger 26. Inlet manifold 24 provides return flow from heat exchanger 26 to LHGD 17 for a first stage of thermal energy exchange before flowing to HHGD 19.

[0072] Reference Figure 5, describes a specific implementation of the flow paths at the LHGD 17 and HHGD 19. The cooling liquid 18 within the shell 15 is conveyed in direct contact with the LHGD 17 for a first stage of heat transfer. The partially heated liquid is then output via an outlet 61 at the shell 15. The partially heated fluid can then be returned to the inlet 22 via a return manifold. The liquid is then separated for further thermal energy exchange with the LHGD 17 while also being transferred to the cover 20 located above and around the respective HHGD 19 via conduits 38. The partially warmed liquid enters the enclosure 27 via respective inlets 34, flows in direct contact with respective HHGDs 19, and then exits the enclosure 27 via respective outlets 35. The dielectric liquid is thereby heated to its maximum operating temperature. The outlet conduits 39 provide fluid communication between each enclosure 27 (defined by the cover 20) and a single combined outlet conduit 21, which in turn is arranged to be in fluid communication with the heat exchanger 26. By Figure 5 In an implementation manner, the dielectric liquid is exclusively delivered to the enclosure 27 via respective conduits 38 .

[0073] Figure 6 Shows Figure 5 In this arrangement, the dielectric liquid 18 within the housing 15 undergoes a first stage of heat transfer with the LHGD 17. The partially warmed liquid is then drawn into each respective enclosure 27 via a respective inlet port 34, which is at least partially immersed in the liquid 18 (within chamber 28) in which the electronic device 16 is immersed. The liquid then undergoes a second stage of thermal energy exchange with the HHGD 19 before being output to the heat exchanger 26. Figure 6 The arrangement is configured to operate in series with respect to a first stage heat energy transfer with an initial LHGD 17 and a subsequent second stage heat energy transfer with the HHGD 19, which is carried out via the isolation / separation of the LHGD 17 from the HHGD 19 via the cover 20 and various cooling liquid flow paths.

[0074] Reference Figure 7 According to one implementation, each cover 20 includes an opening 37 to allow the HHGD 19 to be surrounded and at least partially contained within the inner enclosure 27. The dielectric cooling liquid 18 is pumped via a suction pump 31 ( Figure 4) flows into the enclosure 27 under suction to pass through and circulate in direct contact with the HHGD 19 within the partially separated enclosure 27 for heat energy transfer between the HHGD 19 and the liquid 18. In normal use, each HHGD 19 mounted on the main board 16 has different operating characteristics, particularly including processing requirements and heat energy output. The present system is adapted to adjust the supply of cooling liquid as required and through automatic or semi-automatic response operation, with the aim of delivering the working liquid heated to the maximum operating temperature and at a constant temperature to the heat exchanger. This flow control (as well as temperature regulation of the dielectric liquid 18) is achieved via a control unit 33 and an adjustably mounted cover 20. Specifically, each cover 20 can be mounted relative to the main board 16 so as to be able to move forward and backward (toward and away from) each respective HHGD 19, thereby changing the internal volume of each respective enclosure 27, as shown in reference Figures 8 to 10 Described in detail. Figure 8 , each enclosure 27, and in particular each cover 20, may include a control valve 40, which is electronically controlled via the control unit 33 to regulate the flow of liquid 18 to each enclosure 27 (and each HHGD 19). Typically, when installed on the electronic device 16, each device 19 includes a main processor, a thermal interface material, a heat sink, a second thermal interface material and a heat sink. It is advantageous to minimize such thermal connections, so according to the present apparatus and system, each HHGD 19 may include a microprocessor, a thermal interface material and a series of heat sinks 41 extending upward from the microprocessor / thermal interface material into the enclosure 27. When the microprocessor is operating at its maximum processing rate, and therefore at its maximum operating temperature, the valve 40 can be controlled to a fully open position to maximize the flow of liquid between the inlet conduit 38 and the outlet conduit 35.

[0075] Fig. 9 and 10 The arrangement can represent Figure 8 The invention can be an alternative configuration of the valve control arrangement of the embodiment, or can be a combination of these embodiments, and also includes a corresponding control valve 40 (optionally installed at the inlet conduit 38 and / or the outlet conduit 35) Fig. 9 and 10 ). Fig. 9 and 10 , an electronically controllable actuator 42 is connected to the cover 20, which in turn may be adjustably mounted on the device via another support or specifically via the actuator 42. Thus, each cover 20 is able to reciprocate to and from each HHGD 19. Fig. 9 The cover 20 is in its closest position relative to the HHGD 19. In this position, the dielectric liquid 18 is delivered and forced between the fins 41 to exchange maximum heat energy with the HHGD 19. Fig.10 The cover 20 is raised by the actuator 42 in the position of the fin 41. In this position, the liquid 18 is allowed to flow around the fins 41, but not necessarily between the fins 41, so as to reduce the exchange of heat energy with the HHGD 19 (which may be running at a lower process rate and therefore generating less heat). Each actuator 42 is connected to the control unit 33 (such as Figure 4 17 and HHGD 19) to provide local or remote control of the flow rate through the system and to be in direct contact with the HHGD 19 to directly respond to the operating status of each HHGD 19 (microprocessor), in particular their respective operating temperatures. This arrangement is advantageous for maximizing the thermal energy transferred from the LHGD 17 and HHGD 19 to the liquid 18 and also for regulating the liquid delivered to the heat exchanger 26 to a constant temperature.

[0076] This device can be realized as Figure 1 Immersion cooling tank or Figure 2 The support frame may include one or more liquid flow weir arrangements. The weir arrangement may be arranged at or toward the inlet of the chamber 28 and / or each enclosure 27, and / or at the respective outlets of the chamber 28 and / or each enclosure 27. Fig.11 The tray construction may be particularly suitable for Figure 2 An embodiment of a rack in which an electronic device 16 can be at least partially accommodated and located within the inner groove 14b, relative to the annular portion surrounding the outer groove 14a. The grooves 14a, 14b are separated by a plurality of dividing weir walls 46c extending upward from the base 43a. The outer groove 14a is also defined by a plurality of outer tray walls 43b extending upward from the base 43a. The height of the wall 43c is preferably slightly smaller than the outer wall 43b, so that when the liquid 18 is delivered to the outer groove 14a via the inlet 22, the liquid is configured to overflow from the outer groove 14a into the inner groove 14b via the weir arrangement (above the dividing wall 43c). The liquid 18 is then allowed to flow out of the tray 14 via the outlet 23.

[0077] Fig.12a , b and c show different configurations of the weir arrangement for controlling the flow of liquid into the inner tank 14b. Fig.12a Shows Fig.11 An arrangement in which liquid 18a in outer tank 14a is transferred to liquid 18b in inner tank 14b via weir arrangement 44. Figure 12b In the embodiment, each partition wall 45 separating the outer tank 14a from the inner tank 14b includes at least one port 45a to allow the liquid 18a to flow directly from the outer tank 14a to the inner tank 14b (liquid 18b), and also allows the liquid 18a to flow through the partition wall 45. Fig.12c4. A siphon effect weir arrangement is shown in FIG. 4. In this embodiment, a siphon flange 46 extends around the upper end of the partition wall 46c so as to define a weir flow path between the respective outer and inner grooves 14a, 14b, thereby providing a flow path based on suction siphoning. Each tray 14 (each tray containing an electronic device 16 with respective devices 17 and 19) can then be detachably stored on the rack 13 via a track 71 that engages with a corresponding slide (not shown) disposed transversely on each respective tray 14.

[0078] Fig.13 Another embodiment of the present cooling device implemented as part of a liquid immersion cooling tank arrangement is shown. Chamber 28 corresponds to tank 10 ( Figure 1 ) of the main chamber 12, which supports a plurality of electronic devices arranged side by side and suspended / immersed in a cooling liquid 18. As shown, the electronic device 16 may have a plurality of groups of HHGDs 19, which may be arranged and distinguished by their respective operating temperatures, particularly their respective maximum operating temperatures. Specifically, the first group 19a is located toward the inlet 48, and the second group 19b is located downstream in the flow direction of the first group 19a, away from the inlet 48. The first group 19a is configured to be in fluid communication with the second group 19b via respective ports 36, and the first group 19a is configured to be in fluid communication with the inlet 48 via ports 34. Each HHGD 19 in the first 19a and the second group 19b is separated from the main chamber 28 via respective covers 20, and each cover may be optionally connected via Figures 8 to 10 The housing 15 is configured for inflow of cooling liquid via the inlet 22, according to Fig.13The arrangement of the inlet 22 is provided with a plenum 47 to evenly distribute / distribute the incoming liquid flow within the chamber 28. The housing 15 is provided with at least one respective weir arrangement 44 located at the upper end of the tank 10. Thus, the cooling liquid is configured to overflow into at least one temporary storage container 49 as a liquid holding volume 50. The gravity return manifold 25 provides fluid communication with the holding volume 50 and the inlet 48. The device also includes an outlet flow conduit network 52, which provides fluid communication from the HHGD group 19a, 19b to the heat exchanger 26 via an intermediate control valve 51. The heat exchanger 26 may include the pump 31 as an integral element, or the device may include other pumps at different locations within the liquid flow network. The heat exchanger 26 includes an internal heat transfer coil 54 connected to a working fluid network 72, which is configured to receive thermal energy from the dielectric cooling liquid 18. The heated working fluid (within the network 72) can then be delivered (as a heat source) to supplementary or auxiliary elements 53 within a data center or the like, in which the present system can be implemented. In operation, the dielectric liquid is initially introduced into the chamber 28 via the inlet 22 and the plenum 47 so as to flow upward against gravity toward the weir 44 (within the chamber 28). In this path, the liquid 18 flows in direct contact with the LHGD 17, so that the liquid overflowing into the holding volume 50 is at least partially heated / warmed. The warmed liquid is then returned to the inlet 48 via the manifold 25, where it is delivered directly to the first group 19a of HHGDs 19 for a second stage of heat transfer. The flow to each HHGD 19 within the first group 19a occurs in parallel. The flow then continues and flows in series from the first group 19a to the second group 19b. Likewise, the flow at each HHGD 19 within the second group 19b occurs in parallel. Thus, the present system is configured to provide serial delivery of dielectric liquid 18 according to a three-stage heat transfer process, including a first stage of delivery using LHGD 17, a second stage of delivery using a first set of HHGDs 19a, and a third stage of delivery using a second set of HHGDs 19b. The liquid is then supplied to heat exchanger 26 via pump 31 and (via control valve 51) and then recirculated to chamber 28 via return manifold 24.

[0079] The packaging of each HHGD 19 and the corresponding separation relative to the other HHGDs 19 and LHGDs 17 increases the temperature difference of the dielectric liquid initially delivered to the tank 10 (at the inlet 22) relative to the heating liquid delivered to the heat exchanger device 26. In addition, via the control unit 33 ( Figure 4), various sensors 30, control valves 40 and / or actuators 42, the system is adapted to maximize energy efficiency via automatic or semi-automatic dynamic response to the operating state of each HHGD 19, i.e., operating between minimum and maximum operating temperatures based on process rate. Single or various operating characteristics / states (i.e., temperature, power generation, process rate, etc.) of each LHGD and HHGD can be monitored and / or supplied and utilized by the system in real time to control the cooling liquid 18 (e.g., to adjust the liquid flow rate) in various different areas of the loop.

[0080] Figures 14 to 19 A further specific implementation of a circulating cooling liquid network forming part of the present apparatus and system is shown, the circulating cooling liquid network being implemented as an immersion cooling tank 10 ( Figure 1 ) or storage rack 13( Figure 2 ). Figures 14 to 19 The arrangement is configured for further operational control of fluid flow via other storage containers and / or pressurized tanks at different areas of the system in which the dielectric cooling liquid can be temporarily stored and its temperature and / or pressure regulated as part of its circulation within the network.

[0081] Reference Fig.14 , the cooling liquid network includes an inlet manifold 24, a heat exchanger 26, a second return manifold 58, a gravity return manifold 25, a storage container 56 (containing a stored liquid volume 57), a pump 31, and an immersion tank or rack and tray arrangement (providing fluid communication between the manifolds 24 and 25). According to the specific implementation, a weir arrangement 44 is provided at the inlet end of the chamber 28 to regulate the flow of cooling liquid to the electronic equipment 16. The LHGD 17 is at least partially immersed in the cooling liquid for the first thermal energy transfer. The cooling liquid is then output to the second weir arrangement 44 via the outlet valve 61, which provides fluid communication with the gravity return manifold 25. The liquid is then transferred to the storage container 56 (buffer storage) and then returned to the heat exchanger 26 via the manifold 58, continuing to flow forward to the inlet manifold 24 in the form of cooling liquid. The liquid flowing into the inlet 22 is diverted via the connecting valve 74 and also flows into the respective enclosure 27 and directly contacts the HHGD 19. The combined flow from enclosure 27 then passes through conduit 21 between outlet flow valves 60 which in turn are in fluid communication with gravity return manifold 25 for combined flow with the liquid from valve 61 . Fig.14 The liquid in the circuit can be pressurized or can be realized at atmospheric pressure. The system includes a control unit 33 (not shown) and related sensors (not shown) as described herein to provide a real-time dynamic response liquid cooling system, thereby achieving the advantages described herein.

[0082] Fig.15 yes Fig.14 A simplified embodiment of the arrangement of generally includes substantially the same elements and functions, including manifolds 24, 55, 58; storage container 56; pump 31 and heat exchanger 26. Fig.15 In the embodiment of the present invention, the electronic device 16 is contained in a chamber 28 having an inlet 22 and an outlet 23, which are in direct fluid communication with respective manifolds 24, 55. The series flow on the LHGD 17 and HHGD 19 is as described in reference Figure 3 As described in the implementation method. Fig.16 Shown as Fig.15 Another embodiment of a variation of the embodiment of is realized by replacing the storage container 56 with a pressurized container 59 and providing an inlet weir arrangement 44 at the inlet 22 of the housing 15 . Fig.17 5, wherein a storage vessel 56 is also connected downstream of a return manifold 55, which in turn is connected to an outlet valve 61 of chamber 28 via an outlet weir arrangement 44. Outlet valve 61 is configured to receive warmed liquid partially heated by LHGD 17. Outlet valve 60 is configured to receive fully heated liquid from HHGD 19 for subsequent delivery to manifold 58 and transfer to heat exchanger 26. As shown, partially warmed liquid (from outlet valve 61) is transferred to each closed HHGD 19 via manifold 55, storage vessel 56 and pump 31 according to multiple stages of serial heat energy exchange (relative to primary heating by LHGD 17).

[0083] Fig.18 Shown with Fig.17 Another embodiment of a cooling liquid network with a similar arrangement is shown in FIG. 6 . A first stage heating outlet valve 61 is connected to a first return manifold 55a, which in turn is connected to a feed storage container 56. A second return manifold 55b is connected to a second stage outlet valve 60, the output of which is connected to a pump 31 for transfer to a manifold 58 and subsequently to a heat exchanger 26 for delivery to an inlet manifold 24. The storage container 56 is also connected upstream to the pump 31 so that the outlet cooling liquid flows from the valves 61, 60 are combined to flow into the return manifold 58 for heat transfer at the heat exchanger 26. Fig.19 Shows Fig.16 A further embodiment and variation of the arrangement has a weir arrangement 44 at the inlet 22 and further comprises a second weir arrangement 44 at the outlet 23 for forward delivery to a return manifold 25 which is arranged in fluid communication with a storage container 56. Fig.19 The embodiment also includes a pump 31, a manifold 58, a heat exchanger 26 and an inlet manifold 24, as shown in FIG. Fig.16 and are connected in fluid flow communication.

Claims

1. A liquid cooling device for electronic equipment, comprising: a first housing defining a chamber to at least partially house at least one first heat-generating electronic component of the electronic device; at least one inlet and at least one outlet disposed at the first housing to enable a dielectric cooling liquid to enter and exit the chamber in direct contact with the first heat generating electronic component; a second housing defining an enclosure to at least partially house at least one second heat-generating electronic component of the electronic device; at least one inlet and at least one outlet disposed at the second housing to enable the dielectric cooling liquid to enter and exit the enclosure in direct contact with the second heat generating electronic component; at least one cooling unit connected in fluid communication with at least one of the inlets and at least one of the outlets to cool the dielectric cooling liquid received from at least one of the outlets and to deliver the dielectric cooling liquid to at least one of the inlets; and A control unit controls the flow of the liquid through the chamber and the enclosure.

2. The device according to claim 1, wherein: The at least one outlet of the chamber is connected in fluid communication with the at least one inlet of the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

3. The apparatus according to claim 1, comprising an electronic device having: at least one first heat generating electronic component at least partially contained within the chamber for immersion in the liquid within the chamber; and At least one second heat generating electronic component is at least partially contained within the enclosure for immersion in the liquid within the enclosure.

4. The device according to claim 2 or 3, wherein: The second heat generating electronic component is capable of reaching or including a higher operating temperature than the first heat generating electronic component.

5. A device according to any one of the preceding claims, wherein: The at least one outlet of the enclosure is connected in fluid communication with the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the at least one inlet of the chamber.

6. The device according to claim 5, wherein: The chamber is connected in series in fluid communication with the enclosure.

7. The device according to claim 6, wherein: The control unit is configured to control the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component, and then control the liquid to flow through the enclosure for a second heat energy exchange with the second heat generating electronic component, wherein the second heat energy exchange is a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid that has passed through the chamber and the enclosure.

8. Apparatus according to any preceding claim, when dependent on claim 3, comprising: a plurality of enclosures defined by respective second housings, each of the second housings enclosing a respective heat-generating electronic component disposed at the electronic device; The plurality of enclosures are connected in series in fluid communication with each other; wherein the respective heat generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged in a sequence of increasing operating temperatures within the respective second housings; Wherein the liquid is able to flow through the respective second housing, the respective second housing is in contact with the respective heat generating electronic component in series from relatively low to high operating temperature.

9. The device according to any one of claims 1 to 6, when dependent on claim 3, comprising: a plurality of enclosures defined by respective second housings, each of the second housings enclosing a respective heat-generating electronic component disposed at the electronic device; The plurality of enclosed areas are arranged parallel to each other along a fluid flow direction; wherein the respective heat generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged in a sequence of increasing operating temperatures within the respective second housings; The liquid is capable of flowing through the respective second housings, and the respective second housings are in contact with the respective heat-generating electronic components connected in parallel.

10. The device according to any one of the preceding claims, wherein: The first housing includes a liquid immersion tank, and the second housing has a size smaller than that of the first housing and is located within the chamber.

11. The apparatus of any preceding claim, comprising a dielectric cooling liquid contained within the chamber of the first housing, and wherein the second housing is at least partially immersed or fully immersed in the liquid within the chamber of the first housing.

12. The device according to claim 11, wherein At least a portion of the second heat generating electronic component is positioned in direct contact with the liquid within the enclosure defined by the second housing, and / or at least a portion of the first heat generating electronic component is positioned in direct contact with the liquid within the chamber.

13. An apparatus according to any preceding claim, when dependent on claim 2, wherein the electronic device comprises any one or a combination of the following: Computer entity; ·server; Motherboard; A printed circuit board including multiple electronic components.

14. The device according to any one of the preceding claims, when dependent on claim 2, wherein the first heat generating electronic component and / or the second heat generating electronic component comprises any one or a combination of the following: Motherboard; Random access memory (RAM); Graphics processing unit (GPU); Central Processing Unit (CPU).

15. The device of any of the preceding claims, further comprising a pump connected in fluid communication with the chamber and enclosure to drive the liquid through the first chamber and enclosure.

16. A device according to any one of the preceding claims, wherein: The cooling unit comprises a heat exchanger to transfer thermal energy from the liquid to a heat transfer fluid.

17. A device according to any one of the preceding claims, wherein: The first shell is larger than the second shell such that the chamber contains the enclosure.

18. A device according to any of the preceding claims, comprising at least one temperature sensor for determining the temperature or relative temperature difference of the liquid and the first and / or second heat generating electronic component, the temperature sensor being arranged in electronic communication with the control unit.

19. Apparatus according to any preceding claim, and when dependent on claim 3, wherein: The electronics of the first and / or second heat generating electronic component comprises a temperature sensor to determine the temperature or the temperature difference between the liquid and the first and / or second heat generating electronic component.

20. Apparatus according to any preceding claim, comprising at least one electronically controllable valve connected in fluid communication with at least one of the inlet and outlet and controllable by the control unit.

21. The device according to claim 20 comprises a first electronically controllable valve connected in fluid communication with the inlet and / or the outlet of the chamber and a second electronically controllable valve connected in fluid communication with the inlet and / or the outlet of the enclosure.

22. The device according to any of the preceding claims, further comprising a liquid return conduit in fluid communication with the outlet of the chamber and the inlet of the enclosure to circulate the liquid leaving the chamber into the enclosure.

23. The apparatus of claim 22 further comprising a temporary storage container fluidly connected between the outlet of the chamber and the inlet of the enclosure to temporarily store a volume of the liquid for circulation from the chamber to the enclosure.

24. The device according to claim 22 or 23, wherein: The inlet of the chamber includes a plenum to distribute the flow of liquid into the chamber.

25. A method of cooling at least a portion of an electronic device, comprising: delivering a dielectric cooling liquid to flow into a chamber via at least one inlet of a first housing, the chamber at least partially housing an electronic device having at least one first heat generating electronic component, and allowing the liquid to flow out of the chamber via at least one outlet of the first housing, the first heat generating electronic component being positioned in direct contact with the liquid within the chamber; delivering the flow of dielectric cooling liquid into an enclosure via at least one inlet of a second housing, the enclosure at least partially housing at least one second heat generating electronic component of the electronic device, and allowing the liquid to flow out of the enclosure via at least one outlet of the second housing, the second heat generating electronic component being positioned in direct contact with the liquid within the enclosure; routing said liquid from at least one of said outlets of said chamber and / or said enclosure to at least one cooling unit to reduce the temperature of said liquid received from said chamber and / or enclosure; The flow of the liquid through the chamber and enclosure is controlled using a control unit.

26. The method of claim 25, comprising controlling the flow of the liquid through the chamber and enclosure using at least one electronically controllable valve disposed in a fluid flow path of the liquid.

27. The method according to claim 25 or 26 comprises controlling the liquid flow to flow along a first flow path through the chamber in direct contact with the first heat-generating electronic component, and then along a second flow path through the enclosure in direct contact with the second heat-generating electronic component, so that the heat energy transferred to the liquid is the sum of the heat energy transferred to the liquid from the first heat-generating electronic component and the second heat-generating electronic component.

28. A method according to any one of claims 25 to 27, wherein: The second heat generating electronic component is capable of reaching or including a higher operating temperature than the first heat generating electronic component.

29. The method according to any one of claims 25 to 28, wherein: The chamber is connected in series in fluid communication with the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

30. A method according to any one of claims 25 to 28, comprising: providing a serial flow of the liquid through a plurality of enclosures, the plurality of enclosures being defined by respective second housings, each of the second housings enclosing a respective heat generating electronic component disposed at the electronic device; Wherein, the respective heat-generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged in a sequence of increasing operating temperatures within respective second shells, so that the liquid is configured to flow through the respective second shells, and the respective second shells are in contact with the respective heat-generating electronic components in series from relatively low to high operating temperatures.

31. The method according to any one of claims 25 to 30, comprising controlling the flow of the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component and then through the enclosure for a second heat energy exchange with the second heat generating electronic component, the second heat energy exchange being supplemental and additional to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid having passed through the chamber and then through the enclosure.

32. The method of any one of claims 25 to 30, further comprising driving the liquid through the chamber and / or the enclosure using a pump.

33. A liquid immersion cooling tank for cooling an electronic device having at least one heat generating electronic component, the tank comprising the apparatus of any one of claims 1 to 22; and An electronic device having at least one heat-generating electronic component, the device and the heat-generating electronic component being immersed in the liquid contained in the chamber and / or the enclosure, respectively.

34. The liquid immersion cooling tank of claim 33, comprising a plurality of electronic devices, each electronic device having first and second heat generating electronic components, the devices and the heat generating electronic components being at least partially immersed in the liquid contained within the chamber and the enclosure, respectively.

35. The liquid immersion cooling tank of claim 34, comprising: at least one first housing defining said chamber to house said electronic device; and a plurality of second housings located within the chamber and defining respective enclosures to at least partially house the respective second heat generating electronic components of the device; wherein the device is immersed in the liquid contained within the chamber and the second heat generating electronic component is immersed in the liquid contained within the respective enclosures.

36. An electronic equipment rack for storing electronic equipment, each electronic equipment having at least one heat generating electronic component, the rack comprising the apparatus of any one of claims 1 to 24; and an electronic device having at least one heat generating electronic component, said device and said heat generating electronic component being at least partially immersed in said dielectric cooling liquid contained in said chamber and said enclosure, respectively; in, The electronic device is mounted on the rack at least in part via the first housing.

37. An electronic device rack according to claim 36, comprising a plurality of electronic devices, each electronic device having at least one heat-generating electronic component, the device being immersed in the liquid contained in the chamber, and the at least one heat-generating electronic component being immersed in the liquid contained in the enclosure respectively.

38. The electronic equipment rack of claim 37, comprising: a plurality of first housings defining respective chambers for accommodating respective electronic devices; and A plurality of second shells defining an enclosed area and respectively located in the chamber to respectively accommodate the at least one heat-generating electronic component; wherein the plurality of electronic devices are immersed in the liquid contained within the respective chambers, and the at least one heat-generating electronic component is immersed in the liquid contained within the respective enclosures.

39. The electronic equipment rack according to claim 37, wherein: Each of the plurality of electronic devices has first and second heat generating electronic components, the device and the first heat generating electronic component being at least partially immersed or completely immersed in the liquid contained within the first housing, and the second heat generating electronic component being at least partially immersed in the liquid contained within the enclosure.

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