High-precision high-cleanliness semiconductor Stock equipment walking shaft and operation method

Abstract

The invention discloses a high-precision and high-cleanliness semiconductor Stocker equipment walking shaft and an operation method, the high-precision and high-cleanliness semiconductor Stocker equipment walking shaft comprises a guide rail and a sliding table mechanism, the guide rail is fixedly arranged on the upper surface of a bottom plate mechanism, the bottom plate mechanism comprises first bottom plates and second bottom plates, the bottom plate mechanism is formed by splicing a plurality of first bottom plates and second bottom plates, and the first bottom plates and the second bottom plates are arranged on the sliding table mechanism. A moving mechanism used for adjusting the position of the bottom plate mechanism is arranged below the bottom plate mechanism, the modularization degree is improved and the flexibility is improved by segmenting the walking shaft, the bottom plate mechanism is formed by splicing the first bottom plates and the second bottom plates, and the bottom plate mechanism is arranged on the bottom plate mechanism. The laser displacement sensor and the moving mechanism are arranged on the first bottom plate and the second bottom plate, and the moving mechanism is controlled to perform position adjustment according to coordinates and distance parameters obtained by the laser displacement sensor, so that the bottom plate mechanism is automatically adjusted to a target position during assembly, and the parallelism and flatness of the walking shaft are ensured.

Description

Technical Field

[0001] The invention relates to the technical field of travel axes, and in particular to a travel axis and an operating method of a semiconductor Stocker device with high precision and high cleanliness. Background Art

[0002] In semiconductor wafer and ingot stocker equipment, the travel axis of the stacker is mostly formed in one piece, which has low flexibility. When adapting to different stackers, the one-piece manufacturing method has great limitations. Therefore, the travel axis with different stroke lengths can only be manufactured according to different requirements, which increases the manufacturing cost.

[0003] There are also modular walking shafts on the market. That is, walking shafts with larger volume and length are divided into sections and then the sectioned walking shafts are spliced ​​together. However, since the walking shafts are relatively narrow, the parallelism and flatness of the walking shafts cannot be guaranteed during the splicing process, and the operation is more difficult. In actual production use, it will affect the smoothness of the stacker's travel. The walking shafts and the wheels of the stacker are prone to friction, which easily produces metal dust particles and cannot meet the higher grade requirements of the clean room. Summary of the invention

[0004] The main purpose of the present invention is to provide a high-precision and high-cleanliness semiconductor Stocker equipment travel axis and operation method, which solves the problems of low modularity, difficult installation, low parallelism, flatness and cleanliness of the semiconductor Stocker travel axis in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides a high-precision and high-cleanliness walking axis of a semiconductor Stocker equipment, including a guide rail and a slide mechanism, and is characterized in that it also includes a base plate mechanism, the guide rail is fixedly arranged on the upper surface of the base plate mechanism, the base plate mechanism includes a first base plate and a second base plate, and the base plate mechanism is formed by splicing a plurality of first base plates and second base plates.

[0006] Furthermore, the first base plate is installed on both sides of the base plate mechanism, and the second base plate is installed on the inner side of the base plate mechanism. One side of the first base plate and both sides of the second base plate are provided with open grooves. The grooves of the first base plate and the second base plate are mirror-imaged and can cooperate with each other. A limiting groove is provided on the upper surface of the base plate mechanism.

[0007] Furthermore, the grooves of the first bottom plate and the second bottom plate can be spliced ​​to form a closed groove, and the closed groove is connected to a self-made assembly fixture through bolts.

[0008] Furthermore, a moving mechanism for adjusting the position of the base plate mechanism is arranged under the base plate mechanism, and the moving mechanism includes a mounting plate, a first slide rail, a second slide rail, a first drive motor, a second drive motor and a telescopic cylinder. The first slide rail is fixedly mounted on the mounting plate, the first slide rail is driven by the first drive motor, the first slide rail is connected to the second slide rail via a slider, the first slide rail and the second slide rail are vertically mounted, the second slide rail is driven by the second drive motor, the second slide rail is connected to the telescopic cylinder via a slider, and the base plate mechanism is arranged at the output end of the telescopic cylinder.

[0009] Furthermore, a moving mechanism is provided at each of the four bottom corners of the bottom plate mechanism.

[0010] Furthermore, a laser displacement sensor is also provided on the base plate mechanism.

[0011] Furthermore, the guide rail includes at least two parallel sub-guide rails, which are spliced ​​from several segmented guide rails. A rack is fixedly installed on the sub-guide rail, and the rack is parallel to the sub-guide rail. The rack and the guide rail, and the guide rail and the base plate mechanism are positioned by positioning pins and positioning holes.

[0012] Furthermore, the slide mechanism includes a servo motor, a gear, a roller and a transmission shaft. The gear is meshed with the rack, and the gear is fixedly connected to the transmission shaft. The bottom of the transmission shaft is slidably connected with a roller through a rolling bearing. The roller is located inside a limiting groove. The gear is fixedly connected to the servo motor and is controlled by the servo motor. The servo motor rotates to drive the gear to rotate and then moves the roller along the rack and in the limiting groove, thereby driving the slide to move.

[0013] A method for operating a travel axis of a semiconductor Stocker device with high precision and high cleanliness, comprising the following steps:

[0014] Step 1: Acquire the coordinates and distance parameters between corresponding points of adjacent base plate mechanisms by collecting laser displacement sensor data;

[0015] Step 2: Send the acquired coordinates and distance parameters to the control system, the control system sends instructions to the controller, and the controller controls the moving mechanism;

[0016] Step 3: After the mobile mechanism adjusts the bottom plate mechanism each time, the laser displacement sensor data continues to be collected, and the controller controls the mobile mechanism to further adjust until the set target position is reached;

[0017] Step 4: After the base plate mechanism is spliced ​​and adjusted, assemble and splice the guide rails on the upper surface of the base plate mechanism.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention improves the modularization degree by segmenting the traveling shaft, and can form traveling shafts with different travel lengths by segmented splicing, thereby reducing the manufacturing cost and improving the flexibility;

[0020] 2. The present invention forms a base plate mechanism by splicing a plurality of first base plates and second base plates, and arranges a laser displacement sensor and a moving mechanism on the first base plate and the second base plate, and controls the moving mechanism to adjust the position through the coordinates and distance parameters obtained by the laser displacement sensor, so that the base plate mechanism is automatically adjusted to the target position during assembly, thereby ensuring the parallelism and flatness of the base plate mechanism, and the grooves on the base plate mechanism cooperate with each other to form a closed groove, and the closed groove is connected to a self-made assembly fixture through bolts, thereby fixing and assembling the base plate mechanism, and the walking axis is positioned through the positioning hole and the positioning pin and installed on the assembled base plate mechanism, thereby ensuring the parallelism and flatness of the walking axis, so that there is no need to directly adjust the narrower walking axis, reducing the difficulty of installation and maintenance, and improving the high cleanliness of the walking axis. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of an overall top view of the present invention;

[0022] Figure 2 It is a schematic side view of the whole of the present invention;

[0023] Figure 3 It is a schematic diagram of the displacement mechanism of the present invention;

[0024] Figure 4 It is a schematic diagram of the guide rail of the present invention;

[0025] Figure 5 It is a partial structural schematic diagram of the guide rail of the present invention;

[0026] Figure 6 It is a schematic diagram of the groove and the jig of the present invention;

[0027] Reference numerals

[0028] 1. Bottom plate mechanism; 2. Moving mechanism; 3. Slide mechanism; 4. Guide rail; 11. First bottom plate; 12. Second bottom plate; 13. Limiting groove; 14. Fixture; 21. Mounting plate; 22. First slide rail; 23. Second slide rail; 24. First drive motor; 25. Second drive motor; 26. Telescopic cylinder; 15. Groove; 41. Sub-guide rail; 42. Rack; 43. Positioning hole; 44. Segmented guide rail; 31. Servo motor; 32. Gear; 33. Roller; 34. Transmission shaft. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figure 1 As shown, the present invention proposes a high-precision and high-cleanliness semiconductor Stocker equipment walking axis, including a guide rail 4 and a slide mechanism 3, and also includes a bottom plate mechanism 1, the guide rail 4 is fixedly arranged on the upper surface of the bottom plate mechanism 1, the slide mechanism 3 is arranged on the guide rail 4, the guide rail 4 is slidably connected with the slide mechanism 3, the bottom plate mechanism 1 includes a first bottom plate 11 and a second bottom plate 12, the bottom plate mechanism is formed by splicing a plurality of first bottom plates 11 and second bottom plates 12

[0031] like Figure 1 and Figure 6 As shown, the base plate mechanism 1 includes a first base plate 11 and a second base plate 12. The first base plate 11 is installed on both sides of the base plate mechanism 1, and the second base plate 12 is installed on the inner side of the base plate mechanism 1. One side of the first base plate 11 and both sides of the second base plate 12 are provided with open grooves 15. The grooves 15 of the first base plate 11 and the second base plate 12 are mirror-imaged, and the grooves 15 can cooperate with each other.

[0032] A base plate mechanism 1 is formed by selecting the first base plate 11 and the second base plate 12 for splicing. The first base plate 11 mechanism 1 can only be located at the outer end of the base plate mechanism 1, and the second base plate 12 is located on the inner side of the base plate mechanism 1. There are several first base plates 11 and second base plates 12, and the specific number depends on the actual required walking axis length requirement.

[0033] like Figure 1 and Figure 6 As shown, the first bottom plate 11 and the groove 15 of the first bottom plate 11 or the second bottom plate 12 can be spliced ​​to form a closed groove 15, and the closed groove 15 is connected to the self-made assembly fixture 14 by bolts. By aligning and splicing one end of the first bottom plate 11 with the groove 15 and the other end of the first bottom plate 11 with the groove 15, or one end of the first bottom plate 11 with the groove 15 and one end of the second bottom plate 12 with the groove 15, or one end of the second bottom plate 12 with the groove 15 and one end of the second bottom plate 12 with the groove 15, a closed groove 15 can be formed, and the closed groove 15 is connected to the self-made assembly fixture 14 by bolts, so that the two bottom plates are fixedly spliced.

[0034] like Figure 2 and Figure 3As shown, the bottom corners of the bottom plate mechanism 1 are all provided with moving mechanisms 2 for adjusting the position of the bottom plate mechanism 1, and the bottom plate mechanism 1 is provided with a laser displacement sensor. The moving mechanism 2 includes a mounting plate 21, a first slide rail 22, a second slide rail 23, a first drive motor 24, a second drive motor 25 and a telescopic cylinder 26. The first slide rail 22 is fixedly mounted on the mounting plate 21, and the first slide rail 22 is driven by the first drive motor 24. The first slide rail 22 is connected to the second slide rail 23 through a slider. The first slide rail 22 and the second slide rail 23 are vertically mounted, and the second slide rail 23 is driven by the second drive motor 25. The second slide rail 23 is connected to the telescopic cylinder 26 through a slider. The output end of the telescopic cylinder 26 is provided with the bottom plate mechanism 1. By collecting the laser displacement sensor data on the bottom plate mechanism 1, the adjacent bottom plate mechanism is obtained. The coordinates and distance parameters between the corresponding points of structure 1 are obtained, and the acquired coordinates and distance parameters are sent to the control system. The control system sends an instruction to continuously adjust the adjacent bottom plate mechanism 1 by controlling the mobile mechanism 2. Each time the mobile mechanism 2 adjusts the bottom plate mechanism 1, the laser displacement sensor data is re-collected, and the mobile mechanism 2 is continued to be controlled for further adjustment until the set target position is reached. Then, the jig 14 is used for splicing. The bottom plate mechanism 1 can be adjusted in the front, back, left, right, up and down directions through the first slide rail 22, the second slide rail 23 and the telescopic cylinder 26. By arranging the mobile mechanisms 2 at the four corners of the bottom plate mechanism 1, the bottom plate mechanism 1 can be adjusted with high precision to ensure the parallelism and flatness of the bottom plate mechanism 1. After the splicing and adjustment of the bottom plate mechanism 1 are completed, the guide rails 4 are assembled and spliced ​​on the upper surface of the bottom plate mechanism 1.

[0035] like Figure 1 , Figure 4 and Figure 5 As shown, a guide rail 4 is provided in the middle of the upper surface of the base plate mechanism 1. In the present embodiment, two sub-guide rails 41 are provided which are parallel to each other. The direction of the guide rail 4 is perpendicular to the splicing direction of the base plate mechanism 1. The sub-guide rails 41 on the same straight line are spliced ​​by a plurality of segmented guide rails 44. The number of segmented guide rails 44 is determined according to the actual required length of the walking axis, and the length of the sub-guide rail 41 is smaller than the length of the base plate mechanism 1. A rack 42 is provided on the guide rail 4. The rack 42 is parallel to the sub-guide rail 41. The rack 42 and the guide rail 4 and the guide rail 4 and the base plate mechanism 1 are positioned by positioning pins and positioning holes 43.

[0036] like Figure 2As shown, the slide mechanism 3 includes a servo motor 31, a gear 32, a roller 33, and a transmission shaft 34. The gear 32 is meshed with the rack 42. The gear 32 is fixedly connected to the transmission shaft 34. The bottom of the transmission shaft 34 is slidably connected with a roller 33 through a rolling bearing. The roller 33 is located inside the limiting groove 13. The gear 32 is fixedly connected to the servo motor 31 and is controlled by the servo motor 31. The servo motor 31 rotates to drive the gear 32 to rotate, thereby causing the roller 33 to move along the rack 42 and in the limiting groove 13, thereby driving the slide to move.

[0037] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention. As long as they are within the spirit of the present invention, any changes or modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A high-precision and high-cleanliness semiconductor Stocker equipment travel axis, comprising a guide rail (4) and a slide mechanism (3), characterized in that: It also comprises a bottom plate mechanism (1), the guide rail (4) being fixedly arranged on the upper surface of the bottom plate mechanism (1), the bottom plate mechanism (1) comprising a first bottom plate (11) and a second bottom plate (12), and the bottom plate mechanism (1) is formed by splicing a plurality of first bottom plates (11) and second bottom plates (12).

2. The high-precision and high-cleanliness semiconductor Stocker equipment travel axis according to claim 1, characterized in that: The first base plate (11) is installed on both sides of the base plate mechanism (1), and the second base plate (12) is installed on the inner side of the base plate mechanism (1). One side of the first base plate (11) and both sides of the second base plate (12) are provided with open grooves (15). The grooves (15) of the first base plate (11) and the second base plate (12) are mirror-imaged, and the grooves (15) can cooperate with each other. A limiting groove (13) is provided on the upper surface of the base plate mechanism (1).

3. The high-precision and high-cleanliness semiconductor Stocker equipment travel axis according to claim 2, characterized in that: The grooves (15) of the first bottom plate (11) and the second bottom plate (12) are spliced ​​to form a closed groove (15), and the closed groove (15) is connected to a self-made assembly fixture (14) via bolts.

4. The high-precision and high-cleanliness semiconductor Stocker equipment travel axis according to claim 1, characterized in that: A moving mechanism (2) for adjusting the position of the base plate mechanism (1) is arranged below the base plate mechanism (1). The moving mechanism (2) comprises a mounting plate (21), a first slide rail (22), a second slide rail (23), a first drive motor (24), a second drive motor (25) and a telescopic cylinder (26). The first slide rail (22) is fixedly mounted on the mounting plate (21). The first slide rail (22) is driven by the first drive motor (24). The first slide rail (22) is connected to the second slide rail (23) via a slider. The first slide rail (22) and the second slide rail (23) are vertically mounted. The second slide rail (23) is driven by the second drive motor (25). The second slide rail (23) is connected to the telescopic cylinder (26) via a slider. The base plate mechanism (1) is arranged at the output end of the telescopic cylinder (26).

5. The high-precision and high-cleanliness semiconductor Stocker equipment travel axis according to claim 1, characterized in that: A moving mechanism (2) is provided at each of the four bottom corners of the bottom plate mechanism (1).

6. The high-precision and high-cleanliness semiconductor Stocker equipment travel axis according to claim 1, characterized in that: The base plate mechanism (1) is also provided with a laser displacement sensor.

7. The high-precision and high-cleanliness semiconductor Stocker equipment travel axis according to claim 1, characterized in that: The guide rail (4) comprises at least two parallel sub-guide rails (41), the sub-guide rail (41) being formed by splicing a plurality of segmented guide rails (44), a rack (42) being fixedly mounted on the sub-guide rail (41), the rack (42) being parallel to the sub-guide rail (41), and the rack (42) and the guide rail (4) and the guide rail (4) and the bottom plate mechanism (1) being positioned by positioning pins and positioning holes (43).

8. The high-precision and high-cleanliness semiconductor Stocker equipment travel axis according to claim 1, characterized in that: The slide mechanism (3) comprises a servo motor (31), a gear (32), a roller (33) and a transmission shaft (34); the gear (32) is meshed with a rack (42); the gear (32) is fixedly connected to the transmission shaft (34); a roller (33) is slidably connected to the bottom of the transmission shaft (34) via a rolling bearing; the roller (33) is located inside the limiting groove (13); the gear (32) is fixedly connected to the servo motor (31) and is controlled by the servo motor (31); the servo motor (31) rotates to drive the gear (32) to rotate, thereby causing the roller (33) to move along the rack (42) and in the limiting groove (13), thereby driving the slide to move.

9. The method for operating the travel axis of a semiconductor Stocker device with high precision and high cleanliness according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1: acquiring coordinates and distance parameters between corresponding points of adjacent base plate mechanisms (1) by collecting data from a laser displacement sensor; Step 2: Send the acquired coordinates and distance parameters to the control system, the control system sends instructions to the controller, and the controller controls the moving mechanism (2); Step 3: After each time the moving mechanism (2) adjusts the base plate mechanism (1), the laser displacement sensor data continues to be collected, and the controller controls the moving mechanism (2) to further adjust until the set target position is reached; Step 4: After the bottom plate mechanism (1) is spliced ​​and adjusted, the guide rail (4) is assembled and spliced ​​on the upper surface of the bottom plate mechanism (1).

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