Solvent-free magnetic material infiltrating liquid as well as preparation method and application thereof

Abstract

The invention provides a solvent-free magnetic material infiltrating fluid as well as a preparation method and application thereof, and the solvent-free magnetic material infiltrating fluid comprises the following components in parts by weight: 100 parts of an epoxy resin composition and 10-150 parts of a curing agent, the epoxy resin composition comprises the following components in parts by weight: 100 parts of epoxy resin and 5-45 parts of epoxy reactive diluent. According to the solvent-free type magnetic material infiltrating fluid, the strength of a magnetic material can be effectively improved, no solvent is needed, and the solvent-free type magnetic material infiltrating fluid is safer and more environmentally friendly.

Description

Technical Field

[0001] The invention belongs to the technical field of metal powder alloy infiltration materials, and in particular relates to a solvent-free magnetic material infiltration liquid and a preparation method and application thereof. Background Art

[0002] The core impregnation process is a process technology widely used in the core manufacturing process. The principle is to immerse the core in a liquid impregnation liquid with a certain viscosity, and then fill the impregnation liquid into the small holes of the core through vacuum suction or pressure, so that a vacuum-like state is formed inside the core channel. Through impregnation, the excellent properties of the impregnation liquid can be utilized to effectively reduce bubbles caused by oxidation and other reasons, and improve the insulation, heat resistance, strength and precision of the core material. Therefore, choosing a suitable impregnation liquid is crucial to improving the performance of the core material.

[0003] The impregnation liquid used in the traditional magnetic core impregnation process is usually composed of resin, curing agent, solvent and additives; among them, in order to ensure the safety of production and the performance of the product after impregnation, the solvent used is usually a non-flammable and non-explosive but toxic and harmful organic solvent. However, in recent years, due to the pressure of environmental protection needs, the market has begun to seek environmentally friendly organic solvents, but environmentally friendly organic solvents generally have problems such as high cost, poor solvent performance, and many restrictions on use. At the same time, the improvement of product strength by traditional impregnation liquids is relatively limited.

[0004] CN113441714A discloses an impregnation liquid, comprising 30-60% epoxy resin, 3-7% ethylene-vinyl acetate copolymer, 3-7% ethylene acrylic acid copolymer, 30-60% acetone solution and 0.1% antioxidant. The impregnation liquid effectively improves the strength of the finished magnetic core by adjusting the ratio between the epoxy resin, ethylene-vinyl acetate copolymer, ethylene acrylic acid copolymer and acetone solution; however, the impregnation liquid still needs to use an organic solvent, which is not environmentally friendly, and the strength of the magnetic core needs to be further improved.

[0005] Therefore, developing a solvent-free impregnation liquid that can still effectively improve the strength of the magnetic core is an urgent problem to be solved in the art. Summary of the invention

[0006] In view of the shortcomings of the prior art, the present invention aims to provide a solvent-free magnetic material impregnation liquid and a preparation method and application thereof. The solvent-free magnetic material impregnation liquid can effectively improve the strength of the magnetic material, does not require the use of solvents, and is safer and more environmentally friendly.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] In a first aspect, the present invention provides a solvent-free magnetic material impregnation liquid, which comprises, by weight, 100 parts of an epoxy resin composition and 10 to 150 parts of a curing agent; and, by weight, the epoxy resin composition comprises 100 parts of an epoxy resin and 5 to 45 parts of an epoxy reactive diluent.

[0009] In the present invention, by adding a specific content of epoxy active diluent, no solvent is needed, and the prepared impregnation liquid can effectively improve the strength of the magnetic material and is safer and more environmentally friendly.

[0010] In the present invention, 10 to 150 parts of curing agent can be, for example, 10 parts, 20 parts, 30 parts, 40 parts, 50 parts, 52 parts, 55 parts, 58 parts, 60 parts, 62 parts, 65 parts, 68 parts, 70 parts, 72 parts, 75 parts, 78 parts, 80 parts, 82 parts, 85 parts, 88 parts, 90 parts, 92 parts, 95 parts, 98 parts, 100 parts, 105 parts, 110 parts, 115 parts, 120 parts, 125 parts, 130 parts, 135 parts, 140 parts, 145 parts, 150 parts, etc.

[0011] In the present invention, 5 to 45 parts of epoxy reactive diluent can be, for example, 5 parts, 6 parts, 8 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, 42 parts, 44 parts, 45 parts, etc.

[0012] Preferably, the epoxy reactive diluent includes a first reactive diluent and / or a second reactive diluent.

[0013] The molecular structure of the first reactive diluent contains phenyl and / or cycloalkyl groups; the number of epoxy groups in the molecular structure of the second reactive diluent is ≥3, for example, 3, 4, 5, 6, etc.; and / or the molecular structure of the second reactive diluent has a long fatty chain structure.

[0014] In the present invention, the first active diluent can increase the crosslinking density, enhance the thermal stability and weather resistance of the resin, etc.; the second active diluent can enhance the thermal stability of the resin, or can improve the toughness and impact resistance of the resin; the use of a specific type of active diluent is conducive to obtaining a magnetic material with better performance.

[0015] Preferably, the epoxy reactive diluent comprises a first reactive diluent and a second reactive diluent, and the mass ratio of the first reactive diluent to the second reactive diluent is 1:(0.5-3), wherein the specific value in (0.5-3) can be, for example, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3, etc., and more preferably 1:(0.8-2.6).

[0016] Preferably, the first reactive diluent includes at least one of phenyl glycidyl ether, benzyl glycidyl ether, o-cresyl glycidyl ether, 3,4-epoxycyclohexyl methacrylate or 1,2-cyclohexanediol diglycidyl ether.

[0017] Preferably, the second reactive diluent includes reactive diluent A and / or reactive diluent B; the number of epoxy groups in the molecular structure of reactive diluent A is ≥3; and the molecular structure of reactive diluent B has a long fatty chain structure.

[0018] Preferably, the reactive diluent A comprises at least one of trimethylolpropane triglycidyl ether, glycerol triglycidyl ether or pentaerythritol tetraglycidyl ether.

[0019] Preferably, the active diluent B includes at least one of polypropylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, and C6-C20 alkyl glycidyl ether.

[0020] In the present invention, the polypropylene glycol diglycidyl ether illustratively includes but is not limited to LS207 of Wuhan Shuer Biotechnology Co., Ltd., HX-206 of Luohe Chemical (Shanghai) Co., Ltd., and the like.

[0021] In the present invention, the C6-C20 alkyl glycidyl ether includes C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, and C20 alkyl glycidyl ethers; illustratively, including octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, dodecyl glycidyl ether, tetradecyl glycidyl ether, and the like.

[0022] Preferably, the epoxy resin comprises liquid epoxy resin.

[0023] Preferably, the epoxy resin includes at least one of bisphenol A epoxy resin, novolac epoxy resin, and alicyclic epoxy resin.

[0024] In the present invention, illustratively, the bisphenol A type epoxy resin includes but is not limited to CYD128, E44, E42, etc. of Yueyang Baling Huaxing Petrochemical Co., Ltd.; the phenolic epoxy resin includes but is not limited to F51, F44, F48, etc. of Bluestar Chemical New Materials Co., Ltd.; the alicyclic epoxy resin includes but is not limited to DER732, DER736, DER750, etc. of Dow Chemical.

[0025] Preferably, the curing agent includes at least one of an aromatic amine curing agent (e.g., dimethylthiotoluene diamine, meta-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, meta-aminobenzylamine, etc.), an anhydride curing agent (e.g., phthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, nadic anhydride, etc.), or an imidazole curing agent (e.g., 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, etc.).

[0026] In the present invention, the solvent-free formulation uses a curing agent with low reaction activity, preferably a high-temperature epoxy curing agent.

[0027] Preferably, in parts by weight, the solvent-free magnetic material impregnation solution also includes 0.01 to 5 parts of additives, for example, 0.01, 0.02, 0.04, 0.06, 0.08, 0.1, 0.2, 0.4, 0.6, 0.8, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, etc.

[0028] Preferably, the auxiliary agent includes at least one of a defoaming agent, a leveling agent or a penetrant.

[0029] In the present invention, the leveling agent includes an acrylic leveling agent; and the penetrant includes a non-ionic penetrant.

[0030] In the present invention, the non-ionic penetrant includes but is not limited to JFC, JFC-3, JFC-5 and the like produced by Guangzhou Runlong Chemical Technology Co., Ltd.

[0031] In a second aspect, the present invention provides a method for preparing the solvent-free magnetic material impregnation solution according to the first aspect, the preparation method comprising the following steps:

[0032] The epoxy resin composition and the curing agent are mixed evenly to obtain the solvent-free magnetic material impregnation liquid.

[0033] Preferably, the mixed material further comprises an auxiliary agent.

[0034] Preferably, the preparation method of the epoxy resin composition comprises: mixing an epoxy resin and an epoxy reactive diluent to obtain the epoxy resin composition.

[0035] Preferably, the mixing temperature of the epoxy resin and the epoxy reactive diluent is 25-60°C, for example, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, etc.

[0036] In a third aspect, the present invention provides a magnetic material infiltration process, the magnetic material infiltration process comprising:

[0037] The magnetic material is mixed with the impregnation liquid, and solidified to obtain the impregnated magnetic material; the impregnation liquid includes the solvent-free magnetic material impregnation liquid according to the first aspect.

[0038] Preferably, the mixing method comprises immersing the magnetic material in the impregnation liquid for mixing, and / or dripping the impregnation liquid onto the surface of the magnetic material for infiltration mixing.

[0039] Preferably, the mixing pressure is -0.01 to -0.1 MPa, for example, it can be -0.01 MPa, -0.02 MPa, -0.04 MPa, -0.06 MPa, -0.08 MPa, -0.1 MPa, etc.; the mixing time is 5 to 180 min, for example, it can be 5 min, 10 min, 20 min, 30 min, 40 min, 50 min, 60 min, 70 min, 80 min, 90 min, 100 min, 120 min, 140 min, 160 min, 180 min, etc.

[0040] Preferably, the mixing further includes a step of standing.

[0041] Preferably, the standing time is 1 to 60 min, for example, 1 min, 5 min, 10 min, 15 min, 20 min, 25 min, 30 min, 35 min, 40 min, 45 min, 50 min, 55 min, 60 min, etc.

[0042] Preferably, the curing includes a first curing and a second curing performed sequentially.

[0043] Preferably, the temperature of the first curing is 100-140°C, for example, 100°C, 110°C, 120°C, 130°C, 140°C, etc.; the time is 0.5-2h, for example, 0.5h, 0.6h, 0.8h, 1h, 1.2h, 1.4h, 1.6h, 1.8h, 2h, etc.

[0044] Preferably, the second curing temperature is 160-200°C, for example, 160°C, 170°C, 180°C, 190°C, 200°C, etc.; the time is 1-5h, for example, 1h, 2h, 3h, 4h, 5h, etc.

[0045] Preferably, a third curing is further included between the first curing and the second curing.

[0046] Preferably, the temperature of the third curing is 130-170°C, for example, 130°C, 140°C, 150°C, 160°C, 170°C, etc.; the time is 0.5-2h, for example, 0.5h, 0.6h, 0.8h, 1h, 1.2h, 1.4h, 1.6h, 1.8h, 2h, etc.

[0047] In the present invention, the magnetic material includes a magnetic core.

[0048] The numerical range described in the present invention not only includes the point values ​​listed above, but also includes any point values ​​between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0049] Compared with the prior art, the present invention has the following beneficial effects:

[0050] The solvent-free magnetic material impregnation liquid provided by the present invention adopts a solvent-free formula and can effectively improve the strength of the magnetic material by adding a specific content of active diluent and is safer and more environmentally friendly. DETAILED DESCRIPTION

[0051] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0052] The materials used in the present invention can be purchased from the market or prepared by conventional methods. Unless otherwise specified, the materials used in the present invention are as follows:

[0053] Bisphenol A epoxy resin: CYD128, Yueyang Baling Huaxing Petrochemical Co., Ltd.

[0054] Phenolic epoxy resin: F51, Bluestar Chemical New Materials Co., Ltd.;

[0055] Alicyclic epoxy resin: DER732, Dow Chemical;

[0056] Polypropylene glycol diglycidyl ether: LS207, Wuhan Shuer Biotechnology Co., Ltd.;

[0057] Acrylic leveling agent: DH-3170, Suzhou Qingtian New Materials Co., Ltd.;

[0058] Non-ionic penetrant: JFC, Guangzhou Runlong Chemical Technology Co., Ltd.

[0059] Example 1

[0060] The present embodiment provides a solvent-free magnetic material impregnation liquid, which comprises, by weight, 100 parts of an epoxy resin composition, 80 parts of an organic acid anhydride curing agent (methyl hexahydrophthalic anhydride, 1 part of an acrylic ester leveling agent, and 1 part of a non-ionic penetrant; by weight, the epoxy resin composition comprises 100 parts of bisphenol A epoxy resin and 30 parts of an epoxy reactive diluent; the epoxy reactive diluent comprises phenyl glycidyl ether and trimethylolpropane triglycidyl ether in a mass ratio of 1:2.

[0061] This embodiment provides a method for preparing a solvent-free magnetic material, which specifically includes the following steps:

[0062] According to the formula amount, bisphenol A epoxy resin and epoxy reactive diluent are mixed at room temperature to obtain an epoxy resin composition; according to the formula amount, the epoxy resin composition is evenly mixed with an organic acid anhydride curing agent, an acrylate leveling agent, and a non-ionic penetrant to obtain the solvent-free magnetic material.

[0063] Example 2

[0064] The present embodiment provides a solvent-free magnetic material impregnation liquid, which comprises, in parts by weight, 100 parts of an epoxy resin composition, 70 parts of an organic acid anhydride curing agent (nadic anhydride), 1 part of an acrylate leveling agent and 1 part of a non-ionic penetrant; in parts by weight, the epoxy resin composition comprises 100 parts of a phenolic epoxy resin and 40 parts of an epoxy reactive diluent; the epoxy reactive diluent comprises 3,4-epoxycyclohexyl methacrylate and polypropylene glycol diglycidyl ether in a mass ratio of 1:1.

[0065] This embodiment provides a method for preparing a solvent-free magnetic material, which specifically includes the following steps:

[0066] According to the formula, the phenolic epoxy resin is heated to 50° C., and then an epoxy reactive diluent is added thereto to obtain an epoxy resin composition; according to the formula, the epoxy resin composition is evenly mixed with an organic acid anhydride curing agent, an acrylate leveling agent, and a non-ionic penetrant to obtain the solvent-free magnetic material.

[0067] Example 3

[0068] This embodiment provides a solvent-free magnetic material impregnation liquid, which differs from Embodiment 1 only in that, in parts by weight, the epoxy resin composition comprises 100 parts of bisphenol A epoxy resin and 35 parts of epoxy reactive diluent; the epoxy reactive diluent comprises phenyl glycidyl ether and pentaerythritol tetraglycidyl ether in a mass ratio of 1:2, and other components, amounts and preparation methods are the same as those in Embodiment 1.

[0069] Example 4

[0070] This embodiment provides a solvent-free magnetic material impregnation liquid, which differs from Embodiment 1 only in that the total amount of the epoxy reactive diluent remains unchanged, including phenyl glycidyl ether and trimethylolpropane triglycidyl ether in a mass ratio of 1:0.6, and the other components, amounts and preparation methods are the same as those in Embodiment 1.

[0071] Example 5

[0072] This embodiment provides a solvent-free magnetic material impregnation liquid, which differs from Embodiment 1 only in that the total amount of the epoxy reactive diluent remains unchanged, including phenyl glycidyl ether and trimethylolpropane triglycidyl ether in a mass ratio of 1:2.9, and the other components, amounts and preparation methods are the same as those in Embodiment 1.

[0073] Example 6

[0074] This embodiment provides a solvent-free magnetic material impregnation liquid, which differs from Embodiment 1 only in that the total amount of the epoxy reactive diluent remains unchanged, including phenyl glycidyl ether and ethylene glycol diglycidyl ether in a mass ratio of 1:2, and the other components, amounts and preparation methods are the same as those in Embodiment 1.

[0075] Example 7

[0076] This embodiment provides a solvent-free magnetic material impregnation liquid, which differs from Example 2 only in that the total amount of the epoxy reactive diluent remains unchanged, including decyl glycidyl ether and butyl glycidyl ether in a mass ratio of 1:1, and the other components, amounts and preparation methods are the same as those in Example 2.

[0077] Example 8

[0078] This embodiment provides a solvent-free magnetic material impregnation liquid, which differs from Embodiment 1 only in that the total amount of the epoxy reactive diluent remains unchanged, including polypropylene glycol diglycidyl ether and trimethylolpropane triglycidyl ether in a mass ratio of 1:2, and the other components, amounts and preparation methods are the same as those in Embodiment 1.

[0079] Example 9

[0080] The present embodiment provides a solvent-free magnetic material impregnation liquid, which comprises, by weight, 100 parts of an epoxy resin composition, 90 parts of an organic acid anhydride curing agent (methylhexahydrophthalic anhydride), 1 part of an acrylate leveling agent and 1 part of a non-ionic penetrant; by weight, the epoxy resin composition comprises 100 parts of an alicyclic epoxy resin and 10 parts of polypropylene glycol diglycidyl ether.

[0081] This embodiment provides a method for preparing a solvent-free magnetic material impregnation liquid, and the specific steps are the same as those in Embodiment 1.

[0082] Example 10

[0083] This embodiment provides a solvent-free magnetic material impregnation liquid, which differs from Embodiment 1 only in that methylhexahydrophthalic anhydride is replaced with an equal mass of diaminodicyclohexylmethane, and other components, amounts and preparation methods are the same as those in Embodiment 1.

[0084] Comparative Example 1

[0085] This comparative example provides a magnetic material impregnation liquid, which includes, by weight, 20 parts of an epoxy resin mixture and 80 parts of anhydrous ethanol; the epoxy resin mixture includes 100 parts of bisphenol A epoxy resin, 80 parts of an organic acid anhydride curing agent (methyl hexahydrophthalic anhydride), 1 part of an acrylic leveling agent and 1 part of a non-ionic penetrant.

[0086] This comparative example provides a method for preparing a magnetic material impregnation liquid, which specifically comprises the following steps:

[0087] According to the formula amount, bisphenol A epoxy resin, organic acid anhydride curing agent, acrylate leveling agent and non-ionic penetrant are uniformly mixed to obtain an epoxy resin mixture; then, according to the formula amount, the epoxy resin mixture is mixed with anhydrous ethanol to obtain the magnetic material impregnation liquid.

[0088] Application Example 1

[0089] This application example provides a magnetic core impregnation process, which specifically includes the following steps:

[0090] The annular magnetic core sample was completely immersed in the impregnation liquid (the solvent-free magnetic material impregnation liquid provided in Example 1), placed in a negative pressure environment of -0.09 MPa for 30 minutes, then taken out, and after standing for 10 minutes, the remaining impregnation liquid was wiped off with a paper towel, and then placed in an oven for baking and curing. The specific curing process was to cure at 120°C for 1 hour and then at 180°C for 2 hours to obtain the impregnated magnetic core material.

[0091] Application Example 2

[0092] This application example provides a magnetic core impregnation process, which specifically includes the following steps:

[0093] The annular magnetic core sample was completely immersed in the impregnation liquid (the solvent-free magnetic material impregnation liquid provided in Example 2), placed in a negative pressure environment of -0.09 MPa for 30 minutes, then taken out, and after standing for 10 minutes, the remaining impregnation liquid was wiped off with a paper towel, and then placed in an oven for baking and curing. The specific curing process was as follows: curing at 120°C for 1 hour, curing at 150°C for 1 hour, and then curing at 180°C for 2 hours to obtain the impregnated magnetic core material.

[0094] Application Examples 3 to 10

[0095] Application Examples 3 to 10 respectively provide a magnetic core impregnation process, which differs from Application Example 2 only in that the impregnation liquid is the solvent-free magnetic material impregnation liquid provided in Examples 3 to 10, and the other steps and parameters are the same as those in Application Example 2.

[0096] Comparative application example 1

[0097] Comparative Application Example 1 provides a magnetic core impregnation process, which specifically includes the following steps:

[0098] The annular magnetic core sample was completely immersed in the impregnation liquid (the impregnation liquid provided in Comparative Example 1), placed in a negative pressure environment of -0.09 MPa for 30 minutes, then taken out, air-dried for 1 hour, and then placed in an oven for baking and curing. The specific curing process was curing at 80°C for 1 hour, curing at 120°C for 1 hour, curing at 150°C for 1 hour, and then curing at 180°C for 2 hours to obtain the impregnated magnetic core material.

[0099] Performance Testing

[0100] The tensile properties of the impregnated annular magnetic cores obtained in the test application examples 1 to 10 and the comparative application example 1 were tested in accordance with the national standard "YS_T 1010-2014 Determination of the ring tensile strength of sintered metal porous materials"; wherein the outer diameter of the annular magnetic core is 26.7 mm, the inner diameter is 14.9 mm, and the height is 11.1 mm, and the breaking force of the annular magnetic core is recorded.

[0101] The specific test results are shown in Table 1.

[0102] Table 1

[0103] Breaking force(N) Application Example 1 1519 Application Example 2 1470 Application Example 3 1764 Application Example 4 1185.8 Application Example 5 1332.8 Application Example 6 1372 Application Example 7 1323 Application Example 8 1254.4 Application Example 9 1087.8 Application Example 10 1362.2 Comparative application example 1 686

[0104] As can be seen from Table 1, the solvent-free magnetic material impregnation solution provided by the present invention can effectively improve the tensile properties of the magnetic material by adding a specific amount of active diluent to compound with epoxy resin and curing agent without adding solvent.

[0105] Compared with the magnetic core impregnation liquid provided in comparative example 1, under the same area, the annular magnetic core material impregnated with the solvent-free magnetic material impregnation liquid provided by the present invention has a greater breaking force of 1087.8 to 1764N; the material has a higher ring tensile strength and is safer and more environmentally friendly.

[0106] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A solvent-free magnetic material impregnation liquid, characterized in that: The solvent-free magnetic material impregnation solution comprises 100 parts of epoxy resin composition and 10 to 150 parts of curing agent in parts by weight; The epoxy resin composition comprises 100 parts of epoxy resin and 5 to 45 parts of epoxy reactive diluent in parts by weight.

2. The solvent-free magnetic material impregnation liquid according to claim 1, characterized in that: The epoxy reactive diluent includes a first reactive diluent and / or a second reactive diluent; The molecular structure of the first reactive diluent contains phenyl and / or cycloalkyl; The number of epoxy groups in the molecular structure of the second reactive diluent is ≥3, and / or the molecular structure of the second reactive diluent has a long fatty chain structure; Preferably, the epoxy reactive diluent includes a first reactive diluent and a second reactive diluent, and the mass ratio of the first reactive diluent to the second reactive diluent is 1:(0.5-3), and more preferably 1:(0.8-2.6).

3. The solvent-free magnetic material impregnation liquid according to claim 2, characterized in that: The first reactive diluent includes at least one of phenyl glycidyl ether, benzyl glycidyl ether, o-cresyl glycidyl ether, 3,4-epoxycyclohexyl methacrylate or 1,2-cyclohexanediol diglycidyl ether.

4. The solvent-free magnetic material impregnation liquid according to claim 2 or 3, characterized in that: The second reactive diluent includes reactive diluent A and / or reactive diluent B; the number of epoxy groups in the molecular structure of the reactive diluent A is ≥3; the molecular structure of the reactive diluent B has a long fatty chain structure; Preferably, the reactive diluent A comprises at least one of trimethylolpropane triglycidyl ether, glycerol triglycidyl ether or pentaerythritol tetraglycidyl ether; Preferably, the active diluent B includes at least one of polypropylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, and C6-C20 alkyl glycidyl ether.

5. The solvent-free magnetic material impregnation liquid according to any one of claims 1 to 4, characterized in that: The epoxy resin includes liquid epoxy resin; Preferably, the epoxy resin includes at least one of bisphenol A epoxy resin, novolac epoxy resin, and alicyclic epoxy resin.

6. The solvent-free magnetic material impregnation liquid according to any one of claims 1 to 5, characterized in that: The curing agent includes at least one of an aromatic amine curing agent, an acid anhydride curing agent or an imidazole curing agent.

7. The solvent-free magnetic material impregnation liquid according to any one of claims 1 to 6, characterized in that: The solvent-free magnetic material impregnation solution further comprises 0.01 to 5 parts of an auxiliary agent in parts by weight; Preferably, the auxiliary agent includes at least one of a defoaming agent, a leveling agent or a penetrant.

8. A method for preparing a solvent-free magnetic material impregnation solution according to any one of claims 1 to 7, characterized in that: The preparation method comprises the following steps: Evenly mixing the epoxy resin composition and the curing agent to obtain the solvent-free magnetic material impregnation solution; Preferably, the mixed material further comprises an auxiliary agent; Preferably, the preparation method of the epoxy resin composition comprises: mixing an epoxy resin and an epoxy reactive diluent to obtain the epoxy resin composition; Preferably, the temperature at which the epoxy resin and the epoxy reactive diluent are mixed is 25-60°C.

9. A magnetic material infiltration process, characterized in that: The magnetic material infiltration process comprises: Mixing the magnetic material with the impregnation liquid and solidifying the mixture to obtain the impregnated magnetic material; The impregnation liquid comprises the solvent-free magnetic material impregnation liquid according to any one of claims 1 to 7.

10. The magnetic material infiltration process according to claim 9, characterized in that: The mixing method includes immersing the magnetic material in the impregnation liquid for mixing, and / or dripping the impregnation liquid onto the surface of the magnetic material for infiltration mixing; Preferably, the mixing pressure is -0.01 to -0.1 MPa, and the mixing time is 5 to 180 min; Preferably, the mixing further comprises a step of standing; Preferably, the standing time is 1 to 60 minutes; Preferably, the curing comprises a first curing and a second curing performed sequentially; Preferably, the first curing temperature is 100-140°C and the time is 0.5-2h; Preferably, the second curing temperature is 160-200°C and the time is 1-5h; Preferably, a third curing is further included between the first curing and the second curing; Preferably, the third curing is performed at a temperature of 130 to 170° C. and for a time of 0.5 to 2 hours.