Infiltration type cooling system and heat conduction device thereof

Abstract

The invention discloses an infiltrating type cooling system and a heat conduction device thereof. The infiltrating type cooling system comprises a working tank, a device to be cooled and the heat conduction device. The working tank is provided with a liquid area and a steam area. The liquid area is suitable for containing a liquid-phase working fluid. At least one part of the to-be-cooled device is located in the steam area. The heat conduction device comprises a heat conduction piece and a boiling assisting structure. The heat conduction piece is provided with a first section and a second section, the first section is located in the liquid state area, and the second section is connected with at least one part of the device to be cooled. The boiling assisting structure is located in the first section.

Description

Technical Field

[0001] The present invention relates to an immersion cooling system, in particular to an immersion cooling system with a heat conduction device; the present invention also relates to a heat conduction device, in particular to a heat conduction device used in an immersion cooling system. Background Art

[0002] In the existing immersion cooling system, the entire component to be cooled is usually immersed in the working fluid to effectively cool the component to be cooled. Summary of the invention

[0003] However, the components to be cooled may have other configurations and designs, which may even result in the components to be cooled not being completely located in the working fluid. In this case, since the components to be cooled cannot contact the working fluid, the components to be cooled cannot be effectively cooled and dissipated, thereby affecting the original working performance and service life of the components to be cooled.

[0004] In view of this, some embodiments provide an immersion cooling system, which includes a working tank, a device to be cooled, and a heat conduction device. The working tank has a liquid zone and a vapor zone. The liquid zone is suitable for accommodating a liquid-phase working fluid. At least a portion of the device to be cooled is located in the vapor zone. The heat conduction device includes a heat conduction member and a boiling aid structure. The heat conduction member has a first section and a second section, the first section is located in the liquid zone, and the second section is connected to the at least a portion of the device to be cooled. The boiling aid structure is located in the first section.

[0005] In addition, some embodiments provide a heat conduction device for an immersion cooling system, wherein the immersion cooling system has a liquid region, a vapor region, and a device to be cooled, and at least a portion of the device to be cooled is located in the vapor region. The heat conduction device includes a heat conduction member and a boiling aid structure. The heat conduction member has a first section and a second section, wherein the first section is located in the liquid region, and the second section is suitable for connecting to the at least a portion of the device to be cooled. The boiling aid structure is located in the first section.

[0006] In addition, some embodiments provide a heat conduction device, which includes a heat conduction member and a boiling aid structure. The heat conduction member is suitable for accommodating a heat conduction fluid and has a first section and a second section. The second section is away from the first section and is suitable for connecting to a device to be cooled. The boiling aid structure is connected to the first section. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1A Schematic diagram of the structure of the immersion cooling system in a first viewing angle (YZ plane) in some embodiments;

[0008] Figure 1B for Figure 1AAn immersion cooling system, a schematic diagram of the structure of a partial area A at a first viewing angle (YZ plane);

[0009] Figure 1C for Figure 1A An immersion cooling system, a schematic structural diagram of a partial area A thereof at a second viewing angle (XZ plane);

[0010] Figure 2 Schematic diagram of the internal structure of a heat pipe in some embodiments;

[0011] Figure 3A Schematic diagram of a boiling-assisting structure at a first viewing angle (YZ plane) in some embodiments;

[0012] Figure 3B Schematic diagram of a boiling-assisting structure at a first viewing angle (YZ plane) in some embodiments;

[0013] Figure 3C Schematic diagram of a boiling-assisting structure at a first viewing angle (YZ plane) in some embodiments;

[0014] Figure 4A A schematic diagram of the structure of an immersion cooling system at a second viewing angle (XZ plane) in some embodiments;

[0015] Figure 4B A schematic diagram of the structure of an immersion cooling system at a second viewing angle (XZ plane) in some embodiments;

[0016] Figure 4C A schematic diagram of the structure of an immersion cooling system at a second viewing angle (XZ plane) in some embodiments;

[0017] Figure 4D A schematic diagram of the structure of an immersion cooling system at a second viewing angle (XZ plane) in some embodiments;

[0018] Figure 4E A schematic diagram of the structure of an immersion cooling system at a second viewing angle (XZ plane) in some embodiments;

[0019] Figure 5 A schematic diagram of the structure of an immersion cooling system at a second viewing angle (XZ plane) in some embodiments;

[0020] Figure 6 Schematic diagram of the structure of the immersion cooling system in a first viewing angle (YZ plane) in some embodiments;

[0021] Fig. 7A For some embodiments, the immersion cooling system Figure 6 A schematic diagram of the structure of a partial area B at a first viewing angle (YZ plane);

[0022] Figure 7Bfor Fig. 7A An immersion cooling system, a schematic structural diagram of a partial area B thereof at a second viewing angle (XZ plane);

[0023] Figure 8 For some embodiments, the immersion cooling system Figure 6 A schematic diagram of the structure of a partial area B at a first viewing angle (YZ plane);

[0024] Fig. 9 For some embodiments, the immersion cooling system Figure 6 A schematic diagram of the structure of a partial area B at a first viewing angle (YZ plane);

[0025] Fig.10 For some embodiments, the immersion cooling system Figure 6 A schematic diagram of the structure of a partial area B at a first viewing angle (YZ plane);

[0026] Fig.11 For some embodiments, the immersion cooling system Figure 6 A schematic diagram of the structure of a partial area B at a first viewing angle (YZ plane);

[0027] Fig.12 For some embodiments, the immersion cooling system Figure 6 A schematic structural diagram of a partial area B at a second viewing angle (XZ plane);

[0028] Fig.13A Schematic diagram of the structure of a partial area A of the immersion cooling system at a first viewing angle (YZ plane) in some embodiments;

[0029] Fig. 13B for Fig.13A Schematic diagram of the structure of the immersion cooling system in the second perspective (XZ plane).

[0030] Explanation of symbols

[0031] 1,1': Heat conduction device

[0032] 10,10': Heat conducting parts

[0033] 100: Heat pipe

[0034] 101: Heat conduction channel

[0035] 102: Heat transfer fluid

[0036] 103: Heat conducting plate

[0037] 11,11': Thermal conductive auxiliary parts

[0038] 12,12': Heat sink

[0039] 13,13': Evaporation plate

[0040] 130,130': first evaporation plate

[0041] 131, 131': Second evaporation plate

[0042] 14,14': Boiling aid structure

[0043] 140, 140': first boiling aid structure

[0044] 141, 141': Second boiling-aiding structure

[0045] 142,142': The third boiling aid structure

[0046] 2: Immersion cooling system

[0047] 20: Work slot

[0048] 200: Working tank body

[0049] 201:Liquid working fluid

[0050] 202: Bubbles

[0051] 203,203': Droplets

[0052] 21,21': Cooling device

[0053] 210,210': bearing seat

[0054] 211:Substrate

[0055] 212:Fixer

[0056] 213,213': Heat source

[0057] 22,22': Heat exchange device

[0058] 220: Condenser / First Condenser

[0059] 220': Condenser

[0060] 221, 221': flow guide / first flow guide

[0061] 222: Second condenser

[0062] 223: Second guide member

[0063] 224: First condenser

[0064] 225: Condensate pump

[0065] 226: Second condenser

[0066] 227:Heat exchanger

[0067] 228: The third condenser

[0068] A: Some areas

[0069] A1: First section

[0070] A2: Second section

[0071] B: Part of the area

[0072] D1: Direction of gravity

[0073] D2: First direction

[0074] D3: Second direction

[0075] I1, I2: diversion inlet

[0076] L: Liquid zone

[0077] L0, L0', L0": Length of boiling aid structure

[0078] L1: Length of heat conducting part

[0079] L10: length of the first heat conducting member

[0080] L11: Length of the second heat conducting member

[0081] L2: protruding length

[0082] O1, O2: diversion outlet

[0083] S:Thickness

[0084] S0, S1, S2: Main surface

[0085] S3: Side 1

[0086] S4: Side 2

[0087] T0: device temperature

[0088] T1: Top temperature

[0089] T2: bottom temperature

[0090] T3: Boiling structure temperature

[0091] T4: Fluid temperature

[0092] V: Steam Zone

[0093] W0: Boiling aid structure width

[0094] W1, W1': Width of heat conducting element

[0095] W2, W2': Exit width

[0096] X: X-axis of the coordinate

[0097] Y: Y axis of the coordinate

[0098] Z: Z axis of the coordinate DETAILED DESCRIPTION

[0099] Please refer to Figure 1A and Figure 1C , Figure 1A Schematic diagram of the structure of the immersion cooling system 2 at a first viewing angle (YZ plane) in some embodiments; Figure 1C for Figure 1A A schematic diagram of the structure of the immersion cooling system 2, wherein a partial area A thereof is viewed from a second viewing angle (XZ plane). Figure 1A , an immersion cooling system 2 comprises a working tank 20, a device to be cooled 21 and a heat conducting device 1. The working tank 20 has a working tank body 200, and the working tank body 200 has a liquid region L and a vapor region V. The liquid region L is used to accommodate a liquid working fluid 201, and the liquid working fluid 201 has a fluid temperature T4 (see Figure 1C , which will be described in detail later). The vapor zone V is used to accommodate the gas phase working fluid. The device to be cooled 21 is located in the working tank body 200, and at least a portion of the device to be cooled 21 (for example, its heat source 213, as shown in FIG. 2 ) is Figure 1C , which will be described in detail later) is located in the vapor zone V. In other words, the device to be cooled 21 is entirely or partially located in the vapor zone V, and the remaining portion of the device to be cooled 21 not located in the vapor zone V (e.g., a portion of the support base 210, which will be described in detail later) is located in the liquid zone L, for example. The at least one portion of the device to be cooled 21 has a device temperature T0 (see Figure 1C ), and the device temperature T0 (e.g., 40°C to 100°C, e.g., 100°C) is substantially higher than the fluid temperature T4 (e.g., 40°C to 60°C, e.g., 60°C). In some embodiments, there is a temperature difference between the device temperature T0 and the fluid temperature T4, such as, but not limited to, 5°C to 40°C, 5°C to 35°C, 5°C to 30°C, 5°C to 25°C, 5°C to 20°C, 5°C to 15°C, 5°C to 10°C, 5°C to 8°C, 3°C to 5°C, 1°C to 5°C, or 1°C to 3°C.

[0100] In some embodiments, the heat conducting device 1 comprises a heat conducting element 10 and a boiling aid structure 14. The heat conducting element 10 can be any material having a heat conducting function, such as metal, alloy or a combination thereof.

[0101] For example, please refer to Figure 1A and Figure 1C The heat conducting member 10 has a first section A1 and a second section A2 (see Figure 1C), and the first section A1 is far from the second section A2. The first section A1 and the second section A2 may be local areas of the heat conducting member 10. For example, the heat conducting member 10 has a first end and a second end opposite to each other, and the first section A1 may be the first end of the heat conducting member 10 (for example Figure 1C The second section A2 may be the second end of the heat conducting member 10 (eg, Figure 1C The first section A1 of the heat conducting member 10 is located in the liquid region L (see Figure 1A ). Therefore, the first section A1 of the heat conducting member 10 can perform heat exchange with the liquid-phase working fluid 201 in the liquid region L.

[0102] The above-mentioned liquid-phase working fluid 201 (or liquid-phase heat transfer fluid) can be a non-conductive working fluid. Under normal circumstances (for example, when the temperature is lower than the boiling point of the working fluid), the working fluid is a liquid (i.e., the liquid-phase working fluid 201); and the boiling point of the working fluid is lower than or slightly equal to the temperature of the first section A1 of the heat-conducting element 10. The boiling point of the working fluid is, for example, but not limited to, 40°C to 70°C, 40°C to 65°C, 40°C to 60°C, or 40°C to 55°C. In some embodiments, the boiling point of the working fluid can be lower than 40°C. Therefore, when the first section A1 of the heat-conducting element 10 (or a portion of the first section A1) is immersed in the liquid-phase working fluid 201, the liquid-phase working fluid 201 will quickly reach its critical boiling point due to absorbing the heat of the first section A1 of the heat-conducting element 10, and then vaporize into a gas-phase working fluid, and generate bubbles 202.

[0103] exist Figure 1A and Figure 1C The second section A2 of the heat conducting member 10 is connected to the at least one portion of the device to be cooled 21 (i.e., the portion of the device to be cooled 21 located in the steam zone V, for example Figure 1C The heat source 213 in the heat conductor 10 will be described in detail later). Therefore, the second section A2 of the heat conductor 10 can exchange heat with the at least part of the device to be cooled 21. When thermal equilibrium is reached, the temperature of the second section A2 of the heat conductor 10 can be close to the device temperature T0 of the at least part of the device to be cooled 21. Since the device temperature T0 is higher than the fluid temperature T4, the heat from the at least part of the device to be cooled 21 can be guided from the vapor zone V to the liquid zone L with a lower temperature through the heat conductor 10, and the at least part of the device to be cooled 21 can dissipate heat effectively and quickly. Based on this, even if the at least part of the device to be cooled 21 is located in the vapor zone V and cannot directly contact the liquid working fluid 201, the at least part of the device to be cooled 21 can dissipate heat effectively and quickly. Therefore, it can be avoided to affect and reduce the working efficiency and service life of the at least part of the device to be cooled 21.

[0104] Please continue to refer to Figure 1A and Figure 1C In some embodiments, the device to be cooled 21 includes a substrate 211, a heat source 213 (see Figure 1C ) and a fixing member 212. The substrate 211 may be various plates, such as but not limited to a printed circuit board. The heat source 213 is permanently or removably located on the substrate 211. The heat source 213 may be various elements with heat dissipation requirements, such as but not limited to chips and their components. The fixing member 212 has a first end and a second end relative to each other, the first end is connected to (such as directly contacting) the substrate 211, and the second end is connected to (such as directly contacting) the heat conductive member 10 (or connected to the heat conductive auxiliary member 11 connected to the heat conductive member 10, which will be described in detail later), so that the heat conductive member 10 (or the heat conductive auxiliary member 11) is connected to (such as directly contacting) the heat source 213. The fixing member 212 may be various elements or components with a fixing function, such as but not limited to bolts, screws, spring screws or latches (and their nuts, gaskets or washers). Thus, the heat source 213 can be firmly disposed between the substrate 211 and the heat conducting member 10 (or the heat conducting auxiliary member 11) by disposing the fixing member 212. Therefore, the heat source 213 and the substrate 211 and / or the heat conducting member 10 (or the heat conducting auxiliary member 11) can have better heat transfer performance.

[0105] Please refer to Figure 1C In some embodiments, the heat conducting device 1 further comprises a heat conducting auxiliary member 11. The heat conducting auxiliary member 11 has two opposite sides, for example Figure 1C The first surface S3 and the second surface S4 shown. The first surface S3 of the heat-conducting auxiliary component 11 is connected to (for example, fixed to by a fixing component 212) the second section A2 of the heat-conducting component 10 (for example, the second section A2 of the heat-conducting pipe 100, which will be described in detail later), and the second surface S4 of the heat-conducting auxiliary component 11 is connected to (for example, directly covered by a fixing component 212) the device to be cooled 21 (for example, at least a part of the device to be cooled 21, such as the heat source 213). The material of the heat-conducting auxiliary component 11 can be various materials with heat-conducting function, such as but not limited to metals, alloys or combinations thereof, such as copper plates or copper sheets. Therefore, by setting the heat-conducting auxiliary component 11, the at least a part of the device to be cooled 21 (for example, the heat source 213) and the heat-conducting component 10 can have better heat transfer performance.

[0106] Please continue to refer to Figure 1CIn some embodiments, the device to be cooled 21 further includes one or more supporting seats 210, and one or more substrates 211 may be respectively located on each supporting seat 210. The substrate 211 is permanently or detachably fixed to the supporting seat 210 (for example, by the fixing member 212), so that the heat source 213 can be firmly arranged between the supporting seat 210, the substrate 211 and the heat conducting member 10 (or the heat conducting auxiliary member 11). The supporting seat 210 may be various racks or cabinets, and a plurality of racks may form a cabinet. For example, in Figure 1C The device to be cooled 21 includes a support base 210 and the support base 210 is a rack. Therefore, the immersion cooling system 2 can be used as a rack-type servo system, for example.

[0107] Alternatively, please refer to Figure 5 , Figure 5 FIG. 2 is a schematic diagram of the structure of the immersion cooling system 2 at a second viewing angle (XZ plane) in some embodiments. Figure 5 The immersion cooling system 2 further includes a plurality of devices to be cooled 21, 21', each of which can be configured with reference to the aforementioned implementation of the device to be cooled 21, which will not be described in detail here. In addition, the device to be cooled 21 can further include a support seat 210, and the device to be cooled 21' can further include a support seat 210', each of which can be, for example, a rack. Therefore, the immersion cooling system 2 of some embodiments can be used as a cabinet-type servo system that accommodates a plurality of racks (i.e., support seats 210, 210').

[0108] In addition, Figure 1C and Figure 5 Each device to be cooled 21, 21' may have a thickness S (eg Figure 1C The thickness S in the X direction). Each device to be cooled 21, 21' may have the same or different thickness S. For example, each thickness S may be 48.26 centimeters (cm, i.e., 19 inches). The thickness S of each device to be cooled 21, 21' may also have different sizes depending on the specifications of the components (e.g., servers) to be installed. For example, the thickness S may be a multiple of 4.445 cm, such as but not limited to 1U (i.e., 4.445 cm), 2U (i.e., 2×4.445 cm; 8.89 cm), 3U (i.e., 3×4.445 cm; 13.335 cm) or 4U (i.e., 4×4.445 cm; 17.78 cm). Thus, the above-mentioned working slot 20 may be provided with system-level devices to be cooled 21, 21' (e.g., servers) or system assembly-level devices to be cooled 21, 21' (e.g., server assembly) with different thicknesses S in response to various specification requirements.

[0109] The implementation of the heat conducting element 10 is further described as follows.

[0110] In some embodiments, the heat conducting member 10 includes one or more heat conducting pipes 100. Figure 1A , Figure 1C and Figure 2 , Figure 2 Schematic diagram of the internal structure of the heat pipe 100 in some embodiments. Figure 1A and Figure 1C The heat conducting member 10 includes one or more heat conducting pipes 100, for example, a plurality of heat conducting pipes 100. Each heat conducting pipe 100 has a first section A1 and a second section A2, and the first section A1 is far from the second section A2. Figure 2 , each heat-conducting pipe 100 is suitable for accommodating a heat-conducting fluid 102 so that the heat-conducting fluid 102 flows inside the heat-conducting pipe 100. The heat-conducting fluid 102 can be any fluid having a heat-conducting function, such as but not limited to water. In some embodiments, each heat-conducting pipe 100 has one or more heat-conducting channels 101. Each heat-conducting fluid 102 is suitable for being heated so that the temperature of the heat-conducting fluid 102 is higher than the boiling point of the heat-conducting fluid 102, and a gas-phase fluid can be formed. The heat-conducting channel 101 and the channel space formed by it are suitable for accommodating and guiding the gas-phase fluid.

[0111] For example, in Figure 2 The heat pipe 100 can be any heat pipe (heat pipe, or heat conduit), and the heat transfer fluid 102 can be placed outside the heat transfer channel 101. Figure 2 The at least one portion of the device to be cooled 21 (e.g., the heat source 213, see Figure 1C ), therefore, the top temperature T1 of the heat pipe 100 (seen in Figure 1C , such as 40°C to 77°C, such as 77°C) can be equivalent to (i.e., slightly equal to or lower than) the device temperature T0 (e.g., 40°C to 100°C, such as 100°C). In addition, the boiling point of the heat transfer fluid 102 can be slightly equal to or lower than the device temperature T0. Therefore, the heat transfer fluid 102 at the top of the heat pipe 100 can be quickly vaporized and form a gas phase fluid at the top of the heat pipe 100. Since the gas phase fluid can flow in the heat pipe 100, it can take heat away from the top of the heat pipe 100. For example, the gas phase fluid can flow along Figure 2The heat-conducting fluid 102 flows in the heat-conducting channel 101 and the channel space formed by it in the first direction D2 (for example, the gravity direction D1), and then converges with the heat-conducting fluid 102 located at the bottom end of the heat-conducting pipe 100, and then condenses into the heat-conducting fluid 102. The heat-conducting fluid 102 located at the bottom end of the heat-conducting pipe 100 can then flow outside the heat-conducting channel 101 along a direction opposite to the first direction D2 (for example, the second direction D3). Therefore, the heat-conducting fluid 102 and its gas-phase fluid can continuously circulate inside the heat-conducting pipe 100, and cool the gas-phase fluid and the heat-conducting fluid 102 located at the top end of the heat-conducting pipe 100. Based on this, through the arrangement of the heat-conducting pipe 100 and its heat-conducting fluid 102, the heat-conducting pipe 100 and the at least a portion of the device to be cooled 21 connected thereto can be cooled more effectively and quickly.

[0112] Please refer to Figure 1C According to some embodiments, the bottom end of the heat pipe 100 (eg, near Figure 2 The heat pipe 100 has a bottom temperature T2 at one end of the -Z direction, and the top temperature T1 of the heat pipe 100 (equivalent to the temperature of the second section A2 of the heat pipe 100) may be slightly equal to or greater than the bottom temperature T2 (equivalent to the temperature of the first section A1 of the heat pipe 100). For example, there is a temperature difference between the top temperature T1 and the bottom temperature T2, and the temperature difference may be, but is not limited to, 0°C to 5°C, 0°C to 4°C, 0°C to 3°C, 0°C to 2°C, 0°C to 1°C, 1°C to 3°C, or 1°C to 2°C. For example, when the device temperature T0 of the at least a portion of the device to be cooled 21 is, for example, 40°C to 100°C (e.g., 100°C), the top temperature T1 of the heat pipe 100 may be 40°C to 77°C (e.g., 77°C), and the bottom temperature T2 may be 40°C to 75°C (e.g., 75°C). From the temperature difference data, it can be seen that the heat in the second section A2 of the heat pipe 100 (such as the top end of the heat pipe 100) can indeed be transferred to the first section A1 of the heat pipe 100 (such as the bottom end of the heat pipe 100) through the heat pipe 100.

[0113] In addition, each heat pipe 100 can adjust the boiling point of the heat transfer fluid 102 contained therein by controlling its internal pressure. For example, when the heat transfer fluid 102 is water (whose normal boiling point (i.e., boiling point below one atmosphere) is 100° C.), the boiling point of the water can be made slightly equal to or lower than the at least one portion of the device 21 to be cooled (e.g., the heat source 213, see Figure 1C ) of the device temperature T0 (see Figure 1C). The heat transfer fluid 102 can be rapidly vaporized at a temperature lower than its normal boiling point (e.g., 70°C) by absorbing the heat of at least a portion of the device to be cooled 21, and can be used to rapidly cool at least a portion of the device to be cooled 21 connected to the heat pipe 100. In other words, in some embodiments, even if the heat transfer fluid 102 is not replaced, the internal pressure of the heat pipe 100 and its corresponding boiling point can be adjusted, so that at least a portion of the device to be cooled 21 with different device temperatures T0 can be cooled by the same heat transfer fluid 102.

[0114] In some embodiments, the heat conducting element 10 includes a vapor chamber 103, or the heat conducting element 10 may include both a heat conducting pipe 100 and a vapor chamber 103. Fig.13A and Fig. 13B , Fig.13A Schematic diagram of the structure of a partial area A of the immersion cooling system 2 at a first viewing angle (YZ plane) in some embodiments. Fig. 13B for Fig.13A A schematic diagram of the structure of the immersion cooling system 2 at a second viewing angle (XZ plane). Fig.13A and Fig. 13B The heat conducting member 10 includes one or more heat conducting plates 103. Each heat conducting plate 103 has a first section A1 and a second section A2, wherein the first section A1 is away from the second section A2. Each heat conducting plate 103 has a main surface S0, wherein the second section A2 of the main surface S0 is in thermal contact (e.g., through the heat conducting auxiliary member 11) with the at least one portion of the device to be cooled 21 (i.e., the portion of the device to be cooled 21 located in the vapor zone V; e.g., the heat source 213, see Fig. 13B ). Each heat conducting plate 103 is suitable for accommodating a heat conducting fluid 102 so that the heat conducting fluid 102 flows inside the heat conducting plate 103. The internal structure of the heat conducting plate 103 and the implementation of the heat conducting fluid 102 can refer to the internal structure of the heat conducting pipe 100 and the implementation of the heat conducting fluid 102, which will not be described in detail here. Based on this, by setting the heat conducting plate 103 (and the heat conducting pipe 100) and the heat conducting fluid 102, the heat conducting plate 103 and the at least a portion of the device 21 to be cooled connected thereto can be cooled more effectively and quickly.

[0115] The implementation of the boiling aid structure 14 is further described as follows.

[0116] In some embodiments, the boiling aid structure 14 is located in the first section A1 of the heat conducting member 10. Figure 1C and FIG. 4A to FIG. 4E , FIG. 4A to FIG. 4E The following are schematic diagrams of the structure of the immersion cooling system 2 in the second viewing angle (XZ plane) in some embodiments. Figure 4CThe boiling aid structure 14 may fully cover (i.e. surround) or partially cover the first section A1. For example, the third boiling aid structure 142 may fully and directly cover the first section A1. Figure 1C , Figure 4A , Figure 4B , Figure 4D and Figure 4E The boiling-assisting structure 14 may be disposed on other elements connected to the first section A1 and located in the first section A1. For example, the first boiling-assisting structure 140 and / or the second boiling-assisting structure 141 may be disposed on the first evaporation plate 130 and / or the second evaporation plate 131. The boiling-assisting structure 14 (for example, the first boiling-assisting structure 140, the second boiling-assisting structure 141 and the third boiling-assisting structure 142) may be a mesh (see Figure 3A , to be described later), metal particles (found in Figure 3B , to be described later), fins (found in Figure 3C , to be described later) or a combination of two or three of the above. Through the boiling-boosting structure 14 directly or indirectly located on the first section A1, the liquid-phase working fluid 201 will further heterogeneously nucleate (or heterogeneous nucleation) at the heterogeneous interface (e.g., between the liquid surface and the solid surface) between the liquid-phase working fluid 201 (liquid) and the boiling-boosting structure 14 (e.g., solid) when flowing through the boiling-boosting structure 14 and form bubbles 202 (i.e., gas-phase working fluid). The more bubbles 202 are formed, the more latent heat and heat are removed from the liquid-phase working fluid 201, so the liquid-phase working fluid 201 can be better cooled, and the first section A1 of the heat-conducting element 10 can be cooled more effectively.

[0117] For example, see Figure 3A , Figure 3A Schematic diagram of the boiling aid structure 14 in the first viewing angle (YZ plane) in some embodiments. It should be noted that: Figure 3A Only the first boiling-assisting structure 140 is illustrated, and the present invention is not limited to these embodiments; instead, other boiling-assisting structures 14 (such as the second boiling-assisting structure 141 and the third boiling-assisting structure 142, see Figure 4A and Figure 4D ) may also have the same or similar embodiments. The above-mentioned boiling aid structure 14 (for example Figure 3AThe first boiling aid structure 140) may include one or more layers of meshes, without limitation; for example, it may be four to five layers of meshes. The mesh opening and mesh number (i.e., the number of meshes per unit area) of the meshes are not limited, and may be configured according to various requirements. The material of the mesh may be metal, alloy, or a combination thereof, also without limitation. Thus, by setting the meshes, more rough surfaces and voids may be created on the heterogeneous interface of the first section A1. Therefore, the liquid-phase working fluid 201 may form more heterogeneous interfaces on the rough surfaces and voids, which is more conducive to heterogeneous nucleation and the formation of more bubbles 202.

[0118] For another example, please refer to Figure 3B , Figure 3B Schematic diagram of the boiling aid structure 14 in the first viewing angle (YZ plane) in some embodiments. It should be noted that: Figure 3B Only the first boiling-assisting structure 140 is illustrated, and the present invention is not limited to these embodiments; instead, other boiling-assisting structures 14 (such as the second boiling-assisting structure 141 and the third boiling-assisting structure 142, see Figure 4A and Figure 4D ) may also have the same or similar embodiments. The above-mentioned boiling aid structure 14 (for example Figure 3B The first boiling aid structure 140) may include metal particles. The particle size and particle size distribution of the metal particles are not limited, and can be configured according to various requirements; and the particle sizes of each metal particle can be substantially the same or different from each other, which is also not limited. The material of the metal particles can be metal, alloy or a combination thereof, which is not limited; for example, copper, sintered copper. Therefore, by setting the metal particles, more rough surfaces and gaps can be created on the heterogeneous interface of the first section A1. Therefore, the liquid-phase working fluid 201 can form more heterogeneous interfaces on the rough surfaces and gaps, which is more conducive to heterogeneous nucleation and the formation of more bubbles 202.

[0119] For another example, please refer to Figure 3C , Figure 3C Schematic diagram of the boiling aid structure 14 in the first viewing angle (YZ plane) in some embodiments. It should be noted that: Figure 3C Only the first boiling-assisting structure 140 is illustrated, and the present invention is not limited to these embodiments; instead, other boiling-assisting structures 14 (such as the second boiling-assisting structure 141 and the third boiling-assisting structure 142, see Figure 4A and Figure 4D ) may also have the same or similar embodiments. The above-mentioned boiling aid structure 14 (for example Figure 3C The first boiling aid structure 140 may include one or more fins, for example, an array of fins. The length of the fin (e.g. Figure 3C The size in the Z direction), thickness (such as Figure 3C Y-direction size) and height (such as Figure 3C The dimensions in the X direction are not limited, and can be configured according to various needs; and the length, thickness and height of each fin can be substantially the same or different from each other, and there is no limit. The pitch between each fin is also not limited. The material of the fin can be metal, alloy or a combination thereof, and there is no limit. Thus, by setting the fins, more rough surfaces and gaps can be created on the heterogeneous interface of the first section A1. Therefore, the liquid working fluid 201 can form more heterogeneous interfaces on the rough surfaces and gaps, which is more conducive to heterogeneous nucleation and the formation of more bubbles 202.

[0120] Please refer again Figure 4C In some embodiments, the boiling aid structure 14 is a third boiling aid structure 142, and the third boiling aid structure 142 is fully and directly covered on the first section A1. Figure 4C The boiling-assisting structure length L0" in the Z direction refers to the distance between the top and bottom ends of the third boiling-assisting structure 142. The portion of the heat pipe 100 immersed in the liquid working fluid 201 is Figure 4C The heat conducting member has a length L1 in the Z direction, and the heat conducting member length L1 is the sum of the first heat conducting member length L10 and the second heat conducting member length L11. Figure 4C As shown, the first heat-conducting member length L10 refers to the distance from the liquid surface of the liquid working fluid 201 to the top of the boiling-boosting structure 14 (for example, the third boiling-boosting structure 142), and the second heat-conducting member length L11 refers to the distance from the top of the boiling-boosting structure 14 (for example, the third boiling-boosting structure 142) to the bottom of the first section A1 of the heat-conducting member 10 (for example, the heat-conducting pipe 100). In some embodiments, the boiling-boosting structure length L0" is slightly equal to or less than the second heat-conducting member length L11. In some embodiments, the boiling-boosting structure length L0" is slightly equal to or greater than the heat-conducting member length L1. Therefore, by setting the boiling-boosting structure 14 (for example, the third boiling-boosting structure 142), the cooling and heat dissipation efficiency of the first section A1 of the heat-conducting member 10 can be increased.

[0121] In some embodiments, the immersion cooling system 2 further comprises a boiler plate 13 (eg Figure 1C The first evaporation plate 130 (to be described later) or multiple evaporation plates 13 (such as Figure 4A The first evaporation plate 130 and the second evaporation plate 131 are described later), and each evaporation plate 13 can be located on the first section A1 of the heat conducting member 10 .

[0122] For example, see Figures 1A to 1C and FIG. 4A to FIG. 4E , Figure 1B For Figure 1AThe immersion cooling system 2 is a schematic diagram of a structure of a partial area A at a first viewing angle (YZ plane). The immersion cooling system 2 also includes an evaporation plate 13 (such as Figures 1A to 1C The first evaporation plate 130, or Figure 4B The evaporation plate 13 (for example, the first evaporation plate 130 or the second evaporation plate 131) is located on the first section A1 of the heat conducting member 10. Figures 1A to 1C According to some embodiments, the first evaporation plate 130 may have a main surface S1 (the main surface S1 is, for example, a surface of the first evaporation plate 130 away from the heat conducting member 10 ), and the boiling-assisting structure 14 may be a first boiling-assisting structure 140 , which is located on the main surface S1 . Figure 4B According to some embodiments, the second evaporation plate 131 may have a main surface S2 (the main surface S2 is, for example, the surface of the second evaporation plate 131 away from the heat-conducting member 10), and the boiling-boosting structure 14 may be a second boiling-boosting structure 141, and the second boiling-boosting structure 141 is located on the main surface S2. The boiling-boosting structure 14 (for example, the first boiling-boosting structure 140 or the second boiling-boosting structure 141) may be, but not limited to, a grid, metal particles, fins, or a combination of two or three of the above; the specific embodiments of the boiling-boosting structure 14 can be referred to above and will not be described in detail here. Therefore, the first section A1 of the heat-conducting member 10 can also be effectively cooled by boiling-boosting structures 14 with different configurations.

[0123] Please refer to Figure 1C , the boiling-boosting structure 14 (e.g., the first boiling-boosting structure 140) has a boiling-boosting structure temperature T3, which is slightly equal to or less than the bottom temperature T2 of the heat-conducting member 10, and the boiling-boosting structure temperature T3 is slightly equal to or greater than the fluid temperature T4 of the liquid-phase working fluid 201. In some embodiments, when the device temperature T0 of the at least a portion of the device to be cooled 21 is, for example, 40°C to 100°C (e.g., 100°C), the bottom temperature T2 of the heat-conducting member 10 may be 40°C to 75°C (e.g., 75°C), the boiling-boosting structure temperature T3 may be 40°C to 70°C (e.g., 70°C), and the fluid temperature T4 of the liquid-phase working fluid 201 may be, for example, 40°C to 60°C (e.g., 60°C). From the temperature difference data, it can be seen that the heat of the first section A1 of the heat-conducting pipe 100 can indeed be transferred to the boiling-boosting structure 14, and further transferred to the liquid-phase working fluid 201, thereby achieving cooling and heat dissipation effects.

[0124] In some embodiments, the geometric shape of each evaporation plate 13 (such as the first evaporation plate 130 and / or the second evaporation plate 131) can be adjusted according to different heat dissipation or design requirements. Figure 1B and Figure 1C The first evaporation plate 130 is arranged in a direction away from the heat conducting member 10 (eg Figure 1B-Z direction and / or Y direction) protrudes from the heat conducting member 10 (also visible in Figure 1C );exist Figure 4B , the second evaporation plate 131 may have the same configuration as the first evaporation plate 130, which will not be described in detail here. Therefore, by selectively increasing the area of ​​the first evaporation plate 130 (and / or the second evaporation plate 131) in any direction, the first boiling-boiling structure 140 (and / or the second boiling-boiling structure 141) may be arranged on the first evaporation plate 130 (and / or the second evaporation plate 131) over a larger area. Therefore, the cooling and heat dissipation performance of the heat-conducting element 10 may depend on the surface area of ​​the boiling-boiling structure 14 located on the evaporation plate 13 (for example, the first boiling-boiling structure 140 of the first evaporation plate 130), and may no longer be limited to the boiling-boiling structure 14 (for example, the first boiling-boiling structure 140 of the first evaporation plate 130) that is in direct contact with the heat-conducting element 10. Figure 4C Therefore, the cooling and heat dissipation performance of the first section A1 of the heat conducting member 10 can be further increased by the evaporation plate 13 and the boiling-assisting structure 14 located on the evaporation plate 13.

[0125] For example, see Figure 1B The first boiling aid structure 140 is Figure 1B The Y direction has a boiling-assisting structure width W0, and the heat-conducting member 10 (such as the heat-conducting pipe 100) is integrally formed at Figure 1B The Y direction has a heat conducting member width W1, and the boiling aid structure width W0 is greater than the heat conducting member width W1. For another example, please refer to Fig.13A The heat conducting member 10 (such as the heat conducting plate 103) is integrally formed at Fig.13A The Y direction has a heat conducting member width W1', and the boiling aid structure width W0 is greater than the heat conducting member width W1'. Figure 1B and Fig.13A The first evaporation plate 130 protruding from the heat conducting member 10 (in the Y direction) can further increase the cooling and heat dissipation performance of the first section A1 of the heat conducting member 10. Similarly, the second evaporation plate 131 can be configured with reference to the above-mentioned embodiment of the first evaporation plate 130, which will not be described in detail here; therefore, the second evaporation plate 131 protruding from the heat conducting member 10 can also increase the cooling and heat dissipation performance of the first section A1 of the heat conducting member 10.

[0126] For another example, please refer to Figure 1C ,by Figure 1C Taking the first evaporation plate 130 as an example, the first boiling aid structure 140 is Figure 1C The boiling-assisting structure 14 (for example, the first boiling-assisting structure 140) has a boiling-assisting structure length L0 in the Z direction, and the boiling-assisting structure length L0 is the protruding length L2 (that is, the boiling-assisting structure 14 (for example, the first boiling-assisting structure 140) is Figure 1CThe length L0 of the boiling aid structure may be equal to or greater than the length L11 of the second heat conducting member. In some embodiments, the boiling aid structure length L0 may be equal to or greater than the length L11 of the second heat conducting member. In some embodiments, the boiling aid structure length L0 may be equal to or greater than the length L1 of the heat conducting member. Based on this, by extending the boiling aid structure in another direction (e.g. Figure 1C The first evaporation plate 130 protruding from the heat conducting member 10 (in the Z direction) can further increase the cooling and heat dissipation performance of the first section A1 of the heat conducting member 10. Similarly, the second evaporation plate 131 can be configured with reference to the above-mentioned embodiment of the first evaporation plate 130, which will not be described in detail here; therefore, the second evaporation plate 131 protruding from the heat conducting member 10 can also further increase the cooling and heat dissipation performance of the first section A1 of the heat conducting member 10.

[0127] In addition, please refer to Figure 1B and Figure 4A In some embodiments, the boiling-assisting structures 14 (such as the first boiling-assisting structure 140 and the second boiling-assisting structure 141) of each evaporation plate 13 may have boiling-assisting structure widths W0 that are the same as or different from each other (see Figure 1B ; W0 'not shown), may also have the same or different boiling-aid structure lengths L0, L0 '(see Figure 4A ), which is not limited here. For example, Figure 4A , the first boiling-boiling-assist structure 140 has a boiling-boiling-assist structure length L0, the second boiling-boiling-assist structure 141 has a boiling-boiling-assist structure length L0', and the boiling-boiling-assist structure length L0' of the second boiling-boiling-assist structure 141 is greater than the boiling-boiling-assist structure length L0 of the first boiling-boiling-assist structure 140. In addition, the configuration of the first boiling-boiling-assist structure 140 (with its first evaporation plate 130) and the second boiling-boiling-assist structure 141 (with its second evaporation plate 131) can be configured with reference to the implementation forms of the aforementioned boiling-boiling-assist structures 14 (with its evaporation plate 13), which will not be described in detail here. Therefore, by synchronously setting the first boiling-boiling-assist structure 140 (with its first evaporation plate 130) and the second boiling-boiling-assist structure 141 (with its second evaporation plate 131), the first section A1 (see Figure 1C ) cooling and heat dissipation performance.

[0128] In some embodiments, please refer to Figure 4A and Figure 4D The immersion cooling system 2 includes a plurality of evaporation plates 13 (eg Figure 4A and Figure 4D Each evaporation plate 13 (for example, the first evaporation plate 130 and the second evaporation plate 131) is located opposite to each other on the first section A1 of the heat conducting member 10. Figure 4AAccording to some embodiments, the boiling-boiling structure 14 may be a first boiling-boiling structure 140 and a second boiling-boiling structure 141, and the boiling-boiling structure 14 is located at both the first evaporation plate 130 and the second evaporation plate 131 (for example, the first boiling-boiling structure 140 is located at the main surface S1 of the first evaporation plate 130, and the second boiling-boiling structure 141 is located at the main surface S2 of the second evaporation plate 131). Figure 4D According to some embodiments, the boiling-boosting structure 14 may be a first boiling-boosting structure 140, a second boiling-boosting structure 141, and a third boiling-boosting structure 142. A portion of the boiling-boosting structure 14 is located on the first evaporation plate 130 and the second evaporation plate 131, and another portion of the boiling-boosting structure 14 also directly covers the first section A1 of the heat-conducting member 10 (for example, the first boiling-boosting structure 140 is located on the main surface S1 of the first evaporation plate 130, the second boiling-boosting structure 141 is located on the main surface S2 of the second evaporation plate 131, and the third boiling-boosting structure 142 directly covers the first section A1 of the heat-conducting member 10). Each boiling-boosting structure 14 (for example, the first boiling-boosting structure 140, the second boiling-boosting structure 141, and the third boiling-boosting structure 142) may be independently, but not limited to, a mesh, metal particles, fins, or a combination of two or three of the above; the specific embodiments of each boiling-boosting structure 14 may refer to the above, and will not be described in detail here.

[0129] Please refer to Figure 4E The heat conducting device 1 further comprises a heat sink 12. The heat sink 12 is independently located on a side of the heat conducting member 10 away from the device to be cooled 21; Figure 4E The heat sink 12 is located in the second section A2 of the heat conducting member 10, and the second section A2 is a side away from the at least one portion of the device to be cooled 21. The heat sink 12 can be any element with a heat conducting function, such as one or more fins. The length of each fin (e.g. Figure 4E The size in the Z direction), thickness (such as Figure 4E Y-direction size) and height (such as Figure 4E The dimensions in the X direction are not limited, and can be configured according to various requirements; and the length, thickness and height of each fin can be substantially the same or different from each other, which is also not limited. The spacing between each fin is also not limited. Even the overall arrangement length of multiple fins is not limited; for example, Figure 4E , multiple fins along Figure 4E The Z direction is arranged to have an overall length, and the overall length can be slightly equal to the length of the heat conduction auxiliary member 11. Figure 4E The length in the Z direction. The material of each fin can be metal, alloy or a combination thereof, without limitation. Therefore, by providing the heat sink 12, the heat conducting element 10 can have more heat dissipation area in contact with its environment, so as to increase the cooling and heat dissipation efficiency of the heat conducting element 10.

[0130] Please refer to Figure 5In some embodiments, the immersion cooling system 2 may include a plurality of devices to be cooled 21, 21', at least a portion of the device to be cooled 21 is provided with a heat conducting device 1, and at least a portion of the device to be cooled 21' is provided with a heat conducting device 1'. The heat conducting device 1 may include a heat conducting member 10 and a boiling aid structure 14 (or even an evaporation plate 13, a heat conducting auxiliary member 11 and / or a heat dissipating member 12 (see Figure 4E ), the heat conducting device 1' may include a heat conducting member 10' and a boiling aid structure 14' (or even an evaporation plate 13', a heat conducting auxiliary member 11' and / or a heat dissipating member 12' (see Figure 5 )). The implementation of the heat conducting member 10, 10', the boiling aid structure 14, 14' (e.g., the first boiling aid structure 140, 140', the second boiling aid structure 141' and the third boiling aid structure 142'), the evaporation plate 13, 13' (e.g., the first evaporation plate 130, 130' and the second evaporation plate 131'), the heat conducting auxiliary member 11, 11' and / or the heat dissipation member 12' can refer to the above description, and will not be described in detail here. Therefore, the at least a portion of the device to be cooled 21, 21' located in the vapor zone V can be cooled more effectively and synchronously, thereby improving the overall cooling and heat dissipation efficiency of the immersion cooling system 2 per unit time.

[0131] In some embodiments, the immersion cooling system 2 further includes a heat exchange device 22, and the heat exchange device 22 is located in the vapor zone V. For example, please refer to Figure 1A , the heat exchange device 22 includes a condenser 220, and the condenser 220 is located in the vapor zone V (for example, above the liquid surface of the liquid-phase working fluid 201). The condenser 220 is supplied with a cooling fluid (not shown), and the condenser 220 and its cooling fluid may have a temperature lower than that of the vapor-phase working fluid, for example, a temperature lower than the dew point or boiling point of the working fluid. Therefore, when the vapor-phase working fluid contacts the condenser 220, the vapor-phase working fluid exchanges heat with the condenser 220. The vapor-phase working fluid is cooled and condensed into droplets 203 of the liquid-phase working fluid 201, and returns to the liquid zone L to continue to be used to cool the at least a portion of the device to be cooled 21 located in the vapor zone V (for example, the heat source 213, see Figure 1C Thus, by repeatedly recycling the liquid working fluid 201, it is possible to avoid unnecessary increase in the usage of the liquid working fluid 201, thereby improving the cooling and heat dissipation performance that can be provided by each unit of the liquid working fluid 201.

[0132] Please continue to refer to Figure 1A In some embodiments, the heat exchange device 22 further includes a condensate pump 225 and a heat exchanger 227. The condensate pump 225 and the heat exchanger 227 are independently located inside or outside the working tank 20, and are not limited. Figure 1A, both the condenser pump 225 and the heat exchanger 227 are located outside the working tank 20, and only the condenser 220 is located inside the working tank 20 (for example, in the steam zone V). The condenser pump 225 can be any device with a pressurizing function, without limitation. The first end of the condenser pump 225 (for example, through the first condenser pipe 224) is connected to the first end of the condenser 220, the second end of the condenser pump 225 (for example, through the second condenser pipe 226) is connected to the first end of the heat exchanger 227, and the second end of the heat exchanger 227 (for example, through the third condenser pipe 228) is connected to the second end of the condenser 220. The materials of the first condenser pipe 224, the second condenser pipe 226 and the third condenser pipe 228 can be independently metal, alloy, ceramic, plastic, rubber or a combination thereof, without limitation. Thus, the condensation loop formed by the condenser 220, the condensation pump 225 and the heat exchanger 227 can cool the condensed fluid (with a higher temperature) from the condenser 220 to a temperature lower than the dew point or boiling point of the working fluid, and then pump it back to the condenser 220 to condense the gas phase working fluid. Therefore, the liquid phase working fluid 201 in the working tank 20 can be recycled to continue to be used to cool the at least a portion of the device to be cooled 21 located in the vapor zone V (for example, the heat source 213, see Figure 1C ).

[0133] In some embodiments, the heat exchange device 22 further includes a guide member 221, and the guide member 221 corresponds to and is adjacent to the condenser 220. Figure 6 , Figure 6 FIG. 2 is a schematic diagram of the structure of the immersion cooling system 2 in a first viewing angle (YZ plane) in some embodiments. Figure 6 The guide member 221 is located between the condenser 220 and the at least one portion of the device to be cooled 21 (for example, the heat source 213, see Figure 7B , which will be described later) to receive the liquid droplets 203 condensed by the condenser 220. In addition, through the guide member 221, the liquid droplets 203 can be guided to a specific position (for example, but not limited to, above the at least one portion of the device to be cooled 21). Therefore, by guiding the liquid droplets 203 to the vicinity of the at least one portion of the device to be cooled 21, the liquid droplets 203 can be used to cool the at least one portion of the device to be cooled 21 more effectively. Based on this, the cooling and heat dissipation performance that the liquid phase working fluid 201 can provide per unit time can be increased.

[0134] For example, see Figure 6 , Fig. 7A , Figure 7B and Figure 8 , Fig. 7A and Figure 8 For some embodiments, the immersion cooling system 2 is as follows Figure 6 A schematic diagram of the structure of a partial area B at a first viewing angle (YZ plane); Figure 7B For some embodiments, the immersion cooling system 2 is as follows Figure 6 A schematic diagram of the structure of a partial area B at a second viewing angle (XZ plane). Figure 6 and Fig. 7A The flow guide 221 may have one or more flow guide inlets I1 (eg Figure 6 A flow inlet I1, or for example Fig. 7A Multiple flow inlets I1) and one or more flow outlets O1 (e.g. Figure 6 A guide outlet O1, or for example Fig. 7A The plurality of guide outlets O1 are provided. Each guide inlet I1 corresponds to and is disposed adjacent to the condenser 220 to receive the liquid droplets 203 condensed by the condenser 220. Each guide outlet O1 is not higher than the guide inlet I1 and is adjacent to the at least one portion of the device to be cooled 21 (for example, but not limited to, above the at least one portion of the device to be cooled 21) to guide the liquid droplets 203 to a specific position outside the guide member 221. The guide inlet I1 and the guide outlet O1 can be independently openings of various shapes, such as a long strip channel opening (such as Figure 6 The diversion outlet O1), the funnel-shaped channel outlet (such as Figure 7B The flow inlet I1) or circular opening (such as Fig. 7A and Figure 7B In some embodiments, the plurality of diversion outlets O1 may be arranged as a diversion outlet O1 of various shapes, such as an inclined diversion outlet O1 (such as Figure 8 The guide outlets O1 are inclined in a clockwise direction as a whole. Therefore, by adjusting the guide outlets O1 of different arrangement shapes, the droplets 203 passing through the guide outlets O1 can have different guiding, gathering and / or dripping effects. For example, by adjusting the configuration space density of the guide outlets O1, different total dripping amounts of the droplets 203 can be provided. For another example, by adjusting the configuration height position of the guide outlets O1, different dripping heights and / or dripping time differences of the droplets 203 can be provided. Based on this, various cooling and heat dissipation requirements can be met by adjusting the configuration of the guide outlets O1.

[0135] For another example, please refer to Fig. 7A and Fig.11 , Fig.11 For some embodiments, the immersion cooling system 2 is as follows Figure 6 A schematic diagram of the structure of a partial area B at the first viewing angle (YZ plane). Fig. 7A and Fig.11 The plurality of guide outlets O1 may be arranged corresponding to and adjacent to the at least one portion of the device to be cooled 21, and the plurality of guide outlets O1 as a whole may have an outlet width W2 (see Fig. 7A ) or outlet width W2' (see Fig.11 ), the outlet width W2, W2' may be slightly equal to or greater than the heat conducting member width W1 (see Fig. 7A and Fig.11 ). For example, in Fig. 7A , the outlet width W2 of the guide outlet O1 is greater than the width W1 of the heat conducting member. Therefore, the liquid droplets 203 flowing out of the guide outlets O1 can be used to cool the heat conducting member 10 and the device to be cooled 21 adjacent to the heat conducting member 10 at the same time. Fig.11 The outlet width W2' of the guide outlet O1 is slightly equal to the width W1 of the heat conducting member. Therefore, the liquid droplets 203 flowing out of the guide outlets O1 can be used to centrally cool the heat conducting member 10. Based on this, various cooling and heat dissipation requirements can be met by adjusting the configuration of the guide outlets O1.

[0136] In some embodiments, the heat exchange device 22 further includes a plurality of flow guides (eg Fig. 9 The first guide member 221 and the second guide member 223 are described later), and each guide member is respectively disposed corresponding to and adjacent to the condenser 220. Fig. 9 and Fig.10 , Fig. 9 and Fig.10 In some embodiments, the immersion cooling system 2 is as follows Figure 6 A schematic diagram of the structure of a partial area B at a first viewing angle (YZ plane). Fig. 9 and Fig.10 The first guide member 221 (which may have a guide inlet I1 and a guide outlet O1) and the second guide member 223 (which may have a guide inlet I2 and a guide outlet O2) are respectively located in the condenser (eg Fig. 9 The first condenser 220; or for example Fig.10 The first condenser 220 and the second condenser 222) and the at least a portion of the device to be cooled 21 (for example, the heat source 213, see Figure 7B ), and each guide member (such as the first guide member 221 and the second guide member 223) can correspond to the same condenser (such as Fig. 9 The first condenser 220) or the corresponding condensers (eg Fig.10The first guide member 221 corresponds to the first condenser 220, and the second guide member 223 corresponds to the second condenser 222). In addition, the above-mentioned guide inlet I2 and guide outlet O2 can also be configured with reference to the implementation of the guide inlet I1 and guide outlet O1 as mentioned above, which will not be described in detail here. Thus, each guide member (such as the first guide member 221 and the second guide member 223) can receive the droplets 203 condensed from the corresponding first condenser 220 and the second condenser 222. Therefore, multiple guide members 221, 223 and corresponding condensers 220, 222 can be configured or arranged in multiple identical or different spatial dimensions (for example, configured or arranged in Fig. 9 Z direction and / or Fig.12 In the X direction, in some embodiments, a plurality of guide members 221, 223 (and corresponding condensers 220, 222) may be arranged in the Z direction, and a plurality of guide members 221, 223 (and corresponding condensers 220, 222) may also be arranged in the X direction. Based on this, in some embodiments, the droplets 203 may be more widely guided to a plurality of specific positions (for example, but not limited to, a plurality of upper positions of at least a portion of a plurality of devices to be cooled 21, which will be described in detail later). Therefore, the droplets 203 may be used to cool at least a portion of a plurality of densely packed devices to be cooled 21 at the same time, so the cooling and heat dissipation performance that the liquid working fluid 201 and its droplets 203 can provide per unit time may be increased.

[0137] Please refer to Figure 5 and Fig.12 , Fig.12 For some embodiments, the immersion cooling system 2 is as follows Figure 6 A schematic diagram of the structure of a partial area B at a second viewing angle (XZ plane). Figure 5 and Fig.12 The immersion cooling system 2 may include a plurality of devices to be cooled 21, 21', and each device to be cooled 21, 21' may be configured with reference to the aforementioned implementation of the devices to be cooled 21, 21', which will not be described in detail herein. In addition, the device to be cooled 21 may have a corresponding heat exchange device 22 and a flow guide 221 thereof, and the device to be cooled 21' may also have a corresponding heat exchange device 22' and a flow guide 221' thereof. The flow guide 221 is located between the condenser 220 and at least a portion of the device to be cooled 21 (e.g., the heat source 213), and the flow guide 221' is also located between the condenser 220' and at least a portion of the device to be cooled 21' (e.g., the heat source 213'), and each flow guide 221, 221' may correspond to the same condenser 220 (see Figure 5 ) or respectively corresponding to the respective condensers 220, 220' (see Fig.12). Thus, the guide member 221 (and / or the guide member 221') can receive the droplets 203 (and / or the droplets 203') condensed from the corresponding condenser 220 (and / or the condenser 220'). Therefore, multiple guide members 221, 221' and corresponding condensers 220, 220' can be configured for at least a portion of more different devices 21, 21' to be cooled (e.g., heat sources 213, 213') at the same time, and can more widely and effectively guide the droplets 203, 203' to multiple specific locations (e.g., at least a portion of the corresponding devices 21, 21' to be cooled, such as heat sources 213, 213'). Therefore, the droplets 203, 203' can be used to cool at least a portion (such as heat sources 213, 213') of multiple and densely packed devices 21, 21' to be cooled simultaneously, so the cooling and heat dissipation performance provided by the liquid working fluid 201 and its droplets 203, 203' per unit time can be increased.

[0138] In summary, in some embodiments, even if at least a portion of the device to be cooled (e.g., a heat source) is located in the vapor zone (rather than in the liquid zone containing the liquid-phase working fluid), the heat of at least a portion of the device to be cooled can be directed to the liquid zone with a lower temperature by connecting a section (e.g., the second section) of the heat-conducting member, and then assisted by another section (e.g., the first section) of the heat-conducting member located in the liquid zone, and the heat of at least a portion of the device to be cooled can be effectively cooled. In addition, in some embodiments, the boiling-assisting structure can be arranged in the other section (e.g., the first section) of the heat-conducting member located in the liquid zone, and the liquid-phase working fluid can further heterogeneously nucleate on the rough surface or gap of the boiling-assisting structure and form bubbles (i.e., gas-phase working fluid). Therefore, the liquid-phase working fluid and its bubbles can remove more heat from the heat-conducting member and the boiling-assisting structure in a shorter time. As a result, the portion of the device to be cooled located in the vapor zone can be effectively cooled, and the original working performance and service life of the device to be cooled can be avoided from being affected.

[0139] Although the present invention is disclosed in conjunction with the above embodiments, they are not intended to limit the present invention. Anyone familiar with similar techniques may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be based on the definition of the attached claims.

Claims

1. An immersion cooling system, characterized in that: The immersion cooling system comprises: A working tank having a vapor region and a liquid region suitable for containing a liquid phase working fluid; a device to be cooled, at least a portion of which is located in the steam zone; and The heat conducting device comprises: a heat conducting member having a first section located in the liquid region and a second section connected to the at least a portion of the device to be cooled; and The boiling-assisting structure is located in the first section.

2. The immersion cooling system according to claim 1, wherein: The heat conducting member includes one or more heat conducting pipes, each of which is suitable for accommodating a heat conducting fluid so that the heat conducting fluid flows inside the heat conducting pipe.

3. The immersion cooling system according to claim 1, wherein: The heat conducting member comprises a heat conducting plate having a main surface connected to the device to be cooled, and the heat conducting plate is suitable for accommodating a heat conducting fluid so that the heat conducting fluid flows inside the heat conducting plate.

4. The immersion cooling system according to claim 1, wherein: The liquid-phase working fluid has a fluid temperature, and the device to be cooled has a device temperature, and the device temperature is higher than the fluid temperature.

5. The immersion cooling system according to claim 1, further comprising one or more evaporation plates, each of the evaporation plates being located on the first section and each of the evaporation plates protruding from the heat conductive member along one or more directions away from the heat conductive member, wherein: The boiling-assisting structure is located on at least one of the evaporation plates, and each of the boiling-assisting structures independently comprises at least one of a mesh, metal particles, and fins.

6. The immersion cooling system according to claim 1, further comprising one or more evaporation plates, each of which is located on the first section and protrudes from the heat conductive member along one or more directions away from the heat conductive member, wherein: The boiling-assisting structure is located on at least one of the evaporation plates and covers the first section entirely or partially, and each boiling-assisting structure independently comprises at least one of a mesh, metal particles and fins.

7. The immersion cooling system according to claim 1, wherein: The boiling-assisting structure covers the first section entirely or partially, and the boiling-assisting structure includes at least one of a mesh, metal particles, and fins.

8. The immersion cooling system according to claim 1, further comprising a heat exchange device, wherein the heat exchange device comprises: a condenser located in the vapor zone; Condensate pumps; and The heat exchanger includes a first end of the condensate pump connected to a first end of the condenser, a second end of the condensate pump connected to a first end of the heat exchanger, and a second end of the heat exchanger connected to a second end of the condenser.

9. The immersion cooling system according to claim 8, wherein: The heat exchange device further comprises a flow guide, wherein the flow guide has: a flow inlet adjacent to the condenser; and The flow guide outlet is no higher than the flow guide inlet and is adjacent to the at least a portion of the device to be cooled.

10. The immersion cooling system according to claim 1, wherein: The heat conducting device further comprises a heat sink, and the heat sink is located on a side of the heat conducting member away from the at least a portion of the device to be cooled.

11. The immersion cooling system according to claim 1, wherein: The heat conducting device further includes a heat conducting auxiliary member, wherein the heat conducting auxiliary member has a first surface and a second surface, wherein the first surface is connected to the second section, and the second surface directly contacts the at least a portion of the device to be cooled.

12. The immersion cooling system according to claim 11, wherein: The device to be cooled comprises: substrate; a heat source located on the substrate; and A fixing member, wherein a first end of the fixing member is connected to the substrate, and a second end of the fixing member is connected to the heat conduction auxiliary member, so that the second surface of the heat conduction auxiliary member covers the heat source.

13. The immersion cooling system according to claim 12, wherein: The device to be cooled further comprises a supporting seat, and the substrate is located on the supporting seat.

14. A heat conduction device for an immersion cooling system, the immersion cooling system having a liquid area, a vapor area and a device to be cooled, characterized in that: At least a portion of the device to be cooled is located in the steam zone, and the heat conduction device comprises: a heat conducting member having a first section located in the liquid region and a second section suitable for connecting to the at least a portion of the device to be cooled; and The boiling-assisting structure is located in the first section.

15. The heat conduction device according to claim 14, wherein: The heat conducting member includes one or more heat conducting pipes, each of which is suitable for accommodating a heat conducting fluid so that the heat conducting fluid flows inside the heat conducting pipe.

16. The heat conduction device according to claim 14, wherein: The heat conducting member comprises a heat conducting plate having a main surface connected to the device to be cooled, and the heat conducting plate is suitable for accommodating a heat conducting fluid so that the heat conducting fluid flows inside the heat conducting plate.

17. The heat conduction device according to claim 14, wherein: The liquid region is suitable for accommodating a liquid-phase working fluid, the liquid-phase working fluid has a fluid temperature, and the device to be cooled has a device temperature, which is higher than the fluid temperature.

18. The heat conducting device according to claim 14, further comprising one or more evaporation plates, each of the evaporation plates being located on the first section and each of the evaporation plates protruding from the heat conducting member along one or more directions away from the heat conducting member, wherein: The boiling-assisting structure is located on at least one of the evaporation plates, and each of the boiling-assisting structures independently comprises at least one of a mesh, metal particles, and fins.

19. The heat conducting device according to claim 14, further comprising one or more evaporation plates, each of the evaporation plates being located on the first section and each of the evaporation plates protruding from the heat conducting member along one or more directions away from the heat conducting member, wherein: The boiling-assisting structure is located on at least one of the evaporation plates and covers the first section entirely or partially, and each boiling-assisting structure independently comprises at least one of a mesh, metal particles and fins.

20. The heat conduction device according to claim 14, wherein: The boiling-assisting structure covers the first section entirely or partially, and the boiling-assisting structure includes at least one of a mesh, metal particles, and fins.

21. A heat conduction device, characterized in that: The heat conducting device comprises: A heat conducting member, adapted to contain a heat conducting fluid, wherein the heat conducting member comprises: first section; and a second section, which is far away from the first section and is suitable for connecting to a device to be cooled; and The boiling-assisting structure is connected to the first section.

22. The heat conduction device according to claim 21, further comprising one or more evaporation plates, each of the evaporation plates being located on the first section, wherein: The boiling-assisting structure is located on at least one of the evaporation plates, and each of the boiling-assisting structures independently comprises at least one of a mesh, metal particles, and fins.

23. The heat conduction device according to claim 21, further comprising one or more evaporation plates, each of the evaporation plates being located on the first section, wherein: The boiling-assisting structure is located on at least one of the evaporation plates and covers the first section entirely or partially, and each boiling-assisting structure independently comprises at least one of a mesh, metal particles and fins.

24. The heat conduction device according to claim 21, wherein: The boiling-assisting structure covers the first section entirely or partially, and the boiling-assisting structure includes at least one of a mesh, metal particles, and fins. 25 . The heat conducting device according to claim 21 , further comprising a heat conducting auxiliary component and a fixing component, wherein the heat conducting auxiliary component has a first surface and a second surface, and the fixing component is configured to fix the first surface to the second section and make the second surface directly contact the device to be cooled.

26. The heat conduction device according to claim 21, wherein: The heat conducting member comprises at least one of one or more heat conducting pipes and a heat conducting plate; Wherein, each of the heat-conducting tubes is suitable for accommodating the heat-conducting fluid, so that the heat-conducting fluid flows inside each of the heat-conducting tubes; The heat conducting plate has a main surface connected to the device to be cooled, and the heat conducting plate is suitable for accommodating the heat conducting fluid so that the heat conducting fluid flows inside the heat conducting plate.

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