Mainboard detection contact position determination method and device, equipment and storage medium

Abstract

The invention discloses a mainboard detection contact position determination method and apparatus, an electronic device and a storage medium. The method comprises the steps of extracting design coordinates of a to-be-tested contact and a position identification point on a mainboard design drawing; constructing a mapping relation matrix between the design coordinates of the position identification points and the world coordinates of the position identification points on the physical mainboard by taking the position identification points as a reference; determining a to-be-tested contact to be tested at present according to an item to be tested, and acquiring a design coordinate of the to-be-tested contact; and according to the mapping relation matrix and the design coordinate of the to-be-tested contact, determining the world coordinate of the to-be-tested contact on the physical mainboard. According to the method for determining the position of the mainboard detection contact, the positioning precision of the to-be-detected contact is improved, and automatic execution of an electric signal test of a notebook computer mainboard is achieved.

Description

Technical Field

[0001] Embodiments of the present application relate to motherboard detection technology, and more particularly to a method and device for determining the position of motherboard detection contacts, an electronic device, and a storage medium. Background Art

[0002] As the core component of the entire device, the motherboard of a laptop carries the communication and data transmission between all hardware. The electrical signal detection of the motherboard plays a vital role in ensuring the normal operation of the motherboard and preventing potential failures. In the current development of laptops, electrical signal monitoring is mainly done manually by using an oscilloscope carbon rod to touch the motherboard contacts to be tested, which has high labor costs.

[0003] The existing robot automatic electrical signal detection method mainly relies on the vision and hand-eye calibration of 2D or 3D cameras to determine the detection position, which generally has large errors: 2D photography has distortion, camera internal parameter calibration has errors, and hand-eye calibration has errors, resulting in errors that accumulate to more than 1mm; 3D design digital model physical objects have errors, resulting in registration errors, and 3D camera imaging itself has distortion and other deformations that will introduce errors, and the final cumulative error exceeds 2mm. The existing robot automatic electrical signal detection method cannot accurately locate smaller contacts to be tested.

[0004] Therefore, when using robots to automatically perform electrical signal detection, how to accurately locate the contact position as small as 0.5mm is the main technical difficulty at present. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a device, an electronic device, and a storage medium, which can at least solve the aforementioned technical problems.

[0006] According to a first aspect of an embodiment of the present application, a method is provided, a method for determining a mainboard detection contact position, comprising:

[0007] Extract the design coordinates of the contact points to be tested and the position identification points on the mainboard design drawing;

[0008] Taking the position identification point as a reference, a mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard is constructed;

[0009] According to the items to be tested, determine the contact points to be tested currently, and obtain the design coordinates of the contact points to be tested;

[0010] According to the mapping relationship matrix and the design coordinates of the contact to be tested, the world coordinates of the contact to be tested on the physical mainboard are determined.

[0011] In some exemplary embodiments, the step of constructing a mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard based on the position identification point includes:

[0012] Fix the motherboard to be tested, teach the motherboard to be tested through the robotic arm, and obtain the world coordinates of the position identification point set;

[0013] A coordinate mapping relationship matrix is ​​constructed based on the design coordinates of the position identification points and the world coordinates of the position identification point set obtained through teaching.

[0014] In some exemplary embodiments, constructing a coordinate mapping relationship matrix according to the design coordinates of the position identification points and the world coordinates of the position identification point set obtained by teaching includes:

[0015] According to the design coordinates of the position identification points and the world coordinates of the position identification point set obtained by teaching, a coordinate mapping relationship matrix equation is constructed;

[0016] Constructing a mean square error expression for the label mapping relationship matrix equation;

[0017] Determine the coordinate mapping relationship matrix parameters through the mean square error expression;

[0018] The design coordinates and world coordinates of the position identification point set are brought in to obtain the coordinate mapping relationship matrix.

[0019] In some exemplary embodiments, determining the coordinate mapping relationship matrix parameters through the mean square error expression includes: determining the parameters that satisfy the condition that the mean square error expression reaches a minimum value as the coordinate mapping relationship matrix parameters.

[0020] In some exemplary embodiments, the method further includes: sending the world coordinates of the contact to be tested on the physical mainboard to a robotic arm, and performing an electrical signal test on the contact to be tested.

[0021] In some exemplary embodiments, the method further includes: establishing a database of design coordinates of contacts to be tested.

[0022] In some exemplary embodiments, the acquiring the design coordinates of the contact to be tested includes: querying a database of design coordinates of the contact to be tested to acquire the design coordinates of the contact to be tested.

[0023] According to a second aspect of an embodiment of the present application, there is provided a device for determining a mainboard detection contact position, comprising:

[0024] An information extraction module is used to extract the design coordinates of the contact points to be tested and the position identification points on the mainboard design drawing;

[0025] A matrix construction module is used to construct a mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard based on the position identification point;

[0026] A first determination module is used to determine the contact to be tested currently to be tested according to the items to be tested, and obtain the design coordinates of the contact to be tested;

[0027] The second determination module is used to determine the world coordinates of the contact to be tested on the physical mainboard according to the mapping relationship matrix and the design coordinates of the contact to be tested.

[0028] According to a third aspect of an embodiment of the present application, there is provided an electronic device comprising a processor and a memory for storing processor executable instructions, wherein the processor is configured to execute the steps of the above method when calling the executable instructions in the memory.

[0029] According to a third aspect of an embodiment of the present application, a computer-readable storage medium is provided, wherein a computer program is stored in the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0030] The method and device for determining the position of the motherboard detection contacts, the electronic device, and the storage medium described in the present application first obtain the design file of the laptop motherboard, and extract the design coordinates of the contacts to be tested from the design file, and then use the position identification point as a reference to construct a mapping relationship matrix equation from the design coordinates to the coordinates of the physical motherboard to be tested, and then by constructing the MSE error expression and optimizing it to the minimum, solve the various parameters of the mapping relationship matrix. After obtaining the mapping relationship matrix, when automatically testing the electrical signal, according to the honey to be tested, query the established database to obtain the design coordinates of the test contacts, and then calculate the world coordinates of the contacts to be tested on the physical motherboard according to the mapping relationship matrix, and finally send the world coordinates of the contacts to be tested to the robotic arm for testing. The present application can accurately position the contact to be tested to within 0.5mm, solves the problem of positioning accuracy of the contacts to be tested when automatically detecting electrical signals, and realizes the automated execution of electrical signal testing of the laptop motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1A schematic diagram of the process flow of a method for determining the position of a mainboard detection contact point according to an embodiment of the present application is shown;

[0033] Figure 2 A mainboard design diagram of an embodiment of the present application is shown;

[0034] Figure 3 A schematic diagram of the structure of a physical motherboard to be tested in an embodiment of the present application is shown;

[0035] Figure 4 A schematic diagram showing the actual position of the contacts to be tested on a physical motherboard according to an embodiment of the present application is shown;

[0036] Figure 5 A schematic diagram of the process flow of a method for determining the position of a mainboard detection contact point according to Embodiment 2 of the present application is shown;

[0037] Figure 6 A schematic diagram showing the structure of a device for determining a plate detection contact point position according to an embodiment of the present application is shown;

[0038] Figure 7 A schematic diagram of the structure of an electronic device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0039] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0040] The essence of the technical solution of the embodiment of the present application is explained in detail below with reference to the accompanying drawings.

[0041] Figure 1 FIG. 1 shows a schematic flow chart of a method for determining the position of a mainboard detection contact point according to Embodiment 1 of the present application. Figure 1 As shown, the method for determining the position of the mainboard detection contact point in the embodiment of the present application includes the following steps:

[0042] Step 101: extracting the design coordinates of the contact points to be tested and the position identification (mark) points on the mainboard design drawing;

[0043] In an optional embodiment, first obtain a notebook computer motherboard layout diagram, such as Figure 2 As shown, Figure 2 The mainboard design diagram of the embodiment of the present application is analyzed to extract the design coordinates of the contacts and mark points to be tested;

[0044] In an optional embodiment, the design coordinates of the mark point set are:

[0045]

[0046] In formula (1), x1, y1 are the design coordinates of the first mark point in the mark point set. There are n mark points in the mark point set. n ,y n It is the design coordinate of the nth mark point in the mark point set.

[0047] In an optional embodiment, the method further includes: establishing a database of design coordinates of contacts to be tested.

[0048] Step 102: Taking the position identification point as a reference, constructing a mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard;

[0049] In an optional embodiment, the method of constructing a mapping relationship matrix between the design coordinates of the position identification points and the world coordinates of the position identification points on the physical motherboard based on the position identification points includes: fixing the motherboard to be tested, teaching the motherboard to be tested through a robotic arm, and obtaining the world coordinates of the position identification point set; and constructing a coordinate mapping relationship matrix based on the design coordinates of the position identification points and the world coordinates of the position identification point set obtained through teaching. Figure 3 This is a schematic diagram of the structure of the physical motherboard to be tested in the embodiment of the present application. Figure 3 For example, in an optional embodiment, the world coordinates corresponding to the position recognition (mark) point set obtained by robot arm teaching are:

[0050]

[0051] In formula (2), x′1, y′1 are the world coordinates of the first mark point in the mark point set. There are n mark points in the mark point set. n , y′ n The world coordinates of the nth mark point in the mark point set.

[0052] In an optional embodiment, constructing a coordinate mapping relationship matrix according to the design coordinates of the position identification point and the world coordinates of the position identification point set obtained by teaching includes: constructing a coordinate mapping relationship matrix equation according to the design coordinates of the position identification point and the world coordinates of the position identification point set obtained by teaching:

[0053]

[0054] Among them, formula (3) is the mapping relationship matrix between two groups of points in the constructed plane, and formula (3) is expanded into a linear equation system as shown in formula (4):

[0055]

[0056] Substituting the coordinates into the deformation equation (5) we get:

[0057]

[0058] make:

[0059]

[0060] Then we get:

[0061] Y=Ap........................(7)

[0062] A mean square error expression is constructed for the coordinate mapping relationship matrix equation, and the coordinate mapping relationship matrix parameters are determined through the mean square error expression; wherein, determining the coordinate mapping relationship matrix parameters through the mean square error expression includes: determining the parameters that satisfy the condition that the mean square error expression reaches the minimum value as the coordinate mapping relationship matrix parameters.

[0063] Specifically, for the constructed matrix equation, the MSE error is constructed, and the formula is:

[0064] min p =||Ap-Y|| 2 .....................................(8)

[0065] Among them, formula (8) is the MSE error expression of the matrix equation constructed in (2), and the condition for formula (8) to satisfy the minimum value is (9):

[0066] A T Ap=A T Y........................................(9)

[0067] Then the coordinate mapping relationship matrix parameter p is obtained:

[0068] p=(A T A) -1 A T Y......................................(10)

[0069] Substitute the design coordinates and world coordinates of the mark point set into equation (10), determine the coordinate mapping relationship matrix parameter p, and obtain the coordinate mapping relationship matrix M.

[0070] Step 103: determining the contact to be tested currently to be tested according to the items to be tested, and obtaining the design coordinates of the contact to be tested;

[0071] In an optional embodiment, the obtaining of the design coordinates of the contact to be tested includes: querying a database of design coordinates of the contact to be tested to obtain the design coordinates of the contact to be tested.

[0072] Step 104: determining the world coordinates of the contact to be tested on the physical motherboard according to the mapping relationship matrix and the design coordinates of the contact to be tested;

[0073] In an optional embodiment, the design coordinates of the contact to be tested are obtained according to the established database, and then the world coordinates of the contact to be tested on the physical motherboard can be calculated according to formula (3).

[0074] Figure 4 Schematic diagram of the actual position of the contacts to be tested on the physical motherboard according to the embodiment of the present application, wherein Figure 4 for Figure 3 The enlarged structure of the box area 1, where 6, 7, and 8 are three contacts to be tested.

[0075] Finally, the world coordinates of the contact to be tested on the physical mainboard are sent to the robotic arm, and the electrical signal test is performed on the contact to be tested by the robotic arm.

[0076] Figure 5 Schematic diagram of the process flow of the method for determining the position of the mainboard detection contact point according to the second embodiment of the present application. Figure 5 As shown, the method for determining the position of the mainboard detection contact point in the embodiment of the present application includes the following steps:

[0077] Step 501: Analyze the layout diagram of the notebook computer motherboard and extract the design coordinates of the contact points and mark points to be tested:

[0078] Step 502: Establishing a database of design coordinates of contacts to be tested;

[0079] Step 503: fix the mainboard to be tested, and use a robot arm to teach it, and obtain the world coordinates of the mark point set;

[0080] Step 504: input the design coordinates of the mark point set and the world coordinates obtained by teaching, and construct a mapping relationship matrix;

[0081] Step 505: construct a mapping relationship matrix MSE error, obtain an expression to be optimized, optimize the expression, and obtain an optimal matrix;

[0082] Step 506: query the design coordinate database of the contact to be tested established in step 402 according to the item to obtain the design coordinates of the contact to be tested;

[0083] Step 507: determining the world coordinates of the contact to be tested according to the mapping relationship matrix and the design coordinates of the contact to be tested;

[0084] Step 508: Send the world coordinates of the contact to be tested to the robot arm, and perform an electrical signal test on the contact to be tested.

[0085] The numbers in the above step numbers are only for illustration and do not represent the execution order. The method for determining the position of the motherboard detection contact point described in the second embodiment of the present application can refer to the following. Figure 5 According to the logic shown, step 502 is executed after step 501, but the order of step 501 and step 503 is not limited, that is, extracting the design coordinates of the contact points and mark points to be tested and obtaining the world coordinates of the position mark point set can be performed simultaneously or sequentially. Step 506 is not necessarily after step 503, step 504, and step 505. After the design coordinate database of the contact points to be tested is established in step 502, step 506 can be executed at any time to query the design coordinates of the contact points to be tested.

[0086] The method for determining the position of the motherboard detection contacts described in the present application first obtains the layout design drawing and design document of the notebook computer motherboard, and extracts the design coordinates of the contacts to be tested from the design document, and then uses the mark point as a reference to construct a mapping relationship matrix equation from the design coordinates to the coordinates of the physical motherboard to be tested, and then by constructing the MSE error expression and optimizing it to the minimum, the various parameters of the mapping relationship matrix are solved. After obtaining the mapping relationship matrix, when the electrical signal is automatically tested, the established database is queried to obtain the design coordinates of the test contacts according to the item to be tested, and then the world coordinates of the contacts to be tested on the physical motherboard are calculated according to the mapping relationship matrix, and finally the world coordinates of the contacts to be tested are sent to the robot arm for testing. The present application can accurately position the test contacts to within 0.5 mm, solves the problem of positioning accuracy of the contacts to be tested, and realizes the automated execution of the electrical signal test of the notebook computer motherboard.

[0087] Figure 6 Schematic diagram of the structure of the mainboard detection contact position determination device according to an embodiment of the present application. Figure 6 As shown, the mainboard detection contact position determination device of the embodiment of the present application includes: an information extraction module 61, a matrix construction module 62, a first determination module 63, and a second determination module 64, wherein:

[0088] An information extraction module 61 is used to extract the design coordinates of the contact points to be tested and the position identification points on the mainboard design drawing;

[0089] In an optional embodiment, firstly, a design drawing of a notebook computer motherboard is obtained and analyzed to extract the design coordinates of the contacts to be tested and the mark points therein.

[0090] In an optional embodiment, the device further includes a database module 66 for establishing a database of design coordinates of contacts to be tested.

[0091] A matrix construction module 62 is used to construct a mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard based on the position identification point;

[0092] In an optional embodiment, the matrix construction module 62 is used to: fix the motherboard to be tested, teach the motherboard to be tested through a mechanical arm, and obtain the world coordinates of the position identification point set; and construct a coordinate mapping relationship matrix according to the design coordinates of the position identification points and the world coordinates of the position identification point set obtained by teaching. Specifically, the matrix construction module 62 constructs a coordinate mapping relationship matrix equation according to the design coordinates of the position identification points and the world coordinates of the position identification point set obtained by teaching.

[0093] In an optional embodiment, the matrix construction module 62 is further used to: construct a mean square error expression for the mark mapping relationship matrix equation, and determine the coordinate mapping relationship matrix parameters through the mean square error expression; specifically, the matrix construction module 62 determines the parameters that satisfy the minimum value condition of the mean square error expression as the coordinate mapping relationship matrix parameters. Finally, the mark point set coordinates are substituted to obtain the coordinate mapping relationship matrix.

[0094] A first determination module 63 is used to determine the contact to be tested currently to be tested according to the items to be tested, and obtain the design coordinates of the contact to be tested;

[0095] In an optional embodiment, the first determining module 63 is used to query the design coordinate database of the contact to be tested to obtain the design coordinates of the contact to be tested.

[0096] The second determination module 64 is used to determine the world coordinates of the contact to be tested on the physical motherboard according to the mapping relationship matrix and the design coordinates of the contact to be tested.

[0097] In an optional embodiment, the second determination module 64 is used to obtain the design coordinates of the contact to be tested according to the established database, and then calculate the world coordinates of the contact to be tested on the physical motherboard according to the coordinate mapping relationship matrix equation.

[0098] In an optional embodiment, the device further includes a testing module 65 for sending the world coordinates of the contact to be tested on the physical mainboard to a robotic arm, and performing an electrical signal test on the contact to be tested through the robotic arm.

[0099] In the embodiment of the present application, the information extraction module 61, the matrix construction module 62, the first determination module 63, the second determination module 64, the test module 65, the database module 66, etc. can be implemented by one or more central processing units (CPU, Central Processing Unit), graphics processing units (GPU, Graphics Processing Unit), application specific integrated circuits (ASIC, Application Specific Integrated Circuit), DSP, programmable logic devices (PLD, Programmable Logic Device), complex programmable logic devices (CPLD, Complex Programmable Logic Device), field programmable gate arrays (FPGA, Field-Programmable Gate Array), general-purpose processors, controllers, microcontrollers (MCU, Micro Controller Unit), microprocessors (Microprocessors), or other electronic components.

[0100] In an optional embodiment, Figure 6 The specific manner in which each module in the illustrated mainboard detection contact position determination device performs operations has been described in detail in the embodiment of the method, and will not be elaborated on here.

[0101] An embodiment of the present application also discloses an electronic device, including a processor and a memory for storing processor executable instructions, wherein the processor is configured to execute the steps of the above-mentioned method for determining the position of the motherboard detection contact when calling the executable instructions in the memory. Figure 7 Schematic diagram of the structure of the electronic device according to the embodiment of the present application. Figure 7 As shown, the electronic device 800 supports multi-screen output, and the electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0102] The processing component 802 generally controls the overall operation of the electronic device 800, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0103] The memory 804 is configured to store various types of data to support operations on the device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0104] The power component 806 provides power to the various components of the electronic device 800. The power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.

[0105] The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and the rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0106] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), and when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 804 or sent via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0107] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0108] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the electronic device 800. For example, the sensor assembly 814 can detect the open / closed state of the device 800, the relative positioning of components, such as the display and keypad of the electronic device 800, and the sensor assembly 814 can also detect the position change of the electronic device 800 or a component of the electronic device 800, the presence or absence of contact between the user and the electronic device 800, the orientation or acceleration / deceleration of the electronic device 800, and the temperature change of the electronic device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0109] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as Wi-Fi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0110] In an exemplary embodiment, the electronic device 800 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to execute the steps of the mainboard detection contact position determination method of the above-mentioned embodiment.

[0111] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, and the above instructions can be executed by a processor 820 of an electronic device 800 to complete the steps of the method for determining the position of the mainboard detection contact of the above embodiment. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0112] The embodiment of the present application also describes a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of the method for determining the position of the motherboard detection contact of the embodiment are implemented.

[0113] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present invention, the size of the sequence number of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. The above-mentioned sequence numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments.

[0114] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0115] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or do not exist.

[0116] The modules described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0117] The above is only an embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for determining the position of a mainboard detection contact, characterized in that: The method comprises: Extract the design coordinates of the contact points to be tested and the position identification points on the mainboard design drawing; Taking the position identification point as a reference, a mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard is constructed; According to the items to be tested, determine the contact points to be tested currently, and obtain the design coordinates of the contact points to be tested; According to the mapping relationship matrix and the design coordinates of the contact to be tested, the world coordinates of the contact to be tested on the physical mainboard are determined.

2. The method for determining the position of the mainboard detection contact according to claim 1, characterized in that: The mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard is constructed based on the position identification point, including: Fix the motherboard to be tested, teach the motherboard to be tested through the robotic arm, and obtain the world coordinates of the position identification point set; A coordinate mapping relationship matrix is ​​constructed based on the design coordinates of the position identification points and the world coordinates of the position identification point set obtained through teaching.

3. The method for determining the position of the mainboard detection contact according to claim 2, characterized in that: The step of constructing a coordinate mapping relationship matrix according to the design coordinates of the position identification points and the world coordinates of the position identification point set obtained through teaching comprises: According to the design coordinates of the position identification points and the world coordinates of the position identification point set obtained by teaching, a coordinate mapping relationship matrix equation is constructed; Constructing a mean square error expression for the label mapping relationship matrix equation; Determine the coordinate mapping relationship matrix parameters through the mean square error expression; The design coordinates and world coordinates of the position identification point set are brought in to obtain the coordinate mapping relationship matrix.

4. The method for determining the position of the mainboard detection contact according to claim 3, characterized in that: Determining the coordinate mapping relationship matrix parameters through the mean square error expression includes: determining the parameters that satisfy the condition that the mean square error expression reaches a minimum value as the coordinate mapping relationship matrix parameters.

5. The method for determining the position of the mainboard detection contact according to claim 1, characterized in that: The method further comprises: sending the world coordinates of the contact to be tested on the physical mainboard to a mechanical arm, and performing an electrical signal test on the contact to be tested.

6. The method for determining the position of the mainboard detection contact according to claim 1, characterized in that: The method further comprises: establishing a contact design coordinate database to be tested.

7. The method for determining the position of the mainboard detection contact according to claim 6, characterized in that: The obtaining of the design coordinates of the contact to be tested includes: querying the design coordinates database of the contact to be tested to obtain the design coordinates of the contact to be tested.

8. A device for determining the position of a mainboard detection contact, characterized in that: The device comprises: An information extraction module is used to extract the design coordinates of the contact points to be tested and the position identification points on the mainboard design drawing; A matrix construction module is used to construct a mapping relationship matrix between the design coordinates of the position identification point and the world coordinates of the position identification point on the physical mainboard based on the position identification point; A first determination module is used to determine the contact to be tested currently to be tested according to the items to be tested, and obtain the design coordinates of the contact to be tested; The second determination module is used to determine the world coordinates of the contact to be tested on the physical mainboard according to the mapping relationship matrix and the design coordinates of the contact to be tested.

9. An electronic device comprising a processor and a memory for storing instructions executable by the processor, characterized in that: The processor is configured to execute the steps of the method according to any one of claims 1 to 7 when calling the executable instructions in the memory.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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