Semiconductor silicon wafer positioning and material taking device and method

Abstract

The present invention relates to the field of wafer conveying technology, and in particular to a semiconductor silicon wafer positioning and material taking device and method, comprising two slide rail devices symmetrically distributed front and back and used for transmission; and also comprising a supporting device, the supporting device being connected between the two slide rail devices, the supporting device comprising a supporting ring plate arranged between the two slide rail devices, and the supporting ring plate being connected with a plurality of circumferentially evenly distributed placement mechanisms. The supporting device used in the present invention cooperates with the clamping device, and can fine-tune the position of the semiconductor silicon wafer after movement during the clamping process, further improving the accuracy of the position of the semiconductor silicon wafer after movement, ensuring the accuracy of the alignment between the suction head on the manipulator and the semiconductor silicon wafer, and improving the success rate of semiconductor silicon wafer material taking.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer conveying, and in particular to a semiconductor silicon wafer positioning and material taking device and method. Background Art

[0002] Semiconductor silicon wafers are extremely important basic materials in the semiconductor industry and are widely used in the manufacture of various electronic components such as integrated circuits, sensors, solar cells, etc.

[0003] The manufacturing process of semiconductor silicon wafers mainly includes the steps of crystal growth, cutting, grinding and polishing, cleaning and testing. Semiconductor silicon wafers usually need to be positioned and picked up when performing a step. Positioning and picking up includes material transportation, positioning and picking up. Existing semiconductor silicon wafers usually place the semiconductor silicon wafers on a circular placement plate when being transported, and then the circular placement plate is clamped by the existing clamping claws, and then the clamping claws are driven to move by the telescopic push rod. The clamping claws clamp the circular placement plate and move it to the desired position, and finally the moved semiconductor silicon wafer is clamped and limited by the clamping plate. However, the size of the circular placement plate used cannot be changed, and only a single semiconductor silicon wafer can be transported and moved, and the position of the semiconductor silicon wafer after being moved cannot be corrected. There is a phenomenon that the position of the semiconductor silicon wafer after moving deviates, resulting in a deviation in the alignment between the suction head and the semiconductor silicon wafer during the material picking process, which reduces the success rate of semiconductor silicon wafer picking up. Summary of the invention

[0004] Based on this, it is necessary to provide a semiconductor silicon wafer positioning and material collection device and method, aiming to solve the problems caused by the existing technology when moving and positioning semiconductor silicon wafers.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme to achieve: a semiconductor silicon wafer positioning and material taking device, including: two slide rail devices symmetrically distributed front and back and used for transmission.

[0006] It also includes a supporting device, which is connected between the two slide rail devices. The supporting device includes a supporting ring plate arranged between the two slide rail devices, and a plurality of circumferentially evenly distributed placement mechanisms are connected to the supporting ring plate. A plurality of circumferentially evenly distributed fine-tuning circular holes are opened on the upper end of the supporting ring plate, and the upper end of the fine-tuning circular hole is a trumpet-shaped structure. An adjustment mechanism is arranged on the outer side of the supporting ring plate, and two positioning mechanisms symmetrically distributed along the axis of the supporting ring plate are connected to the outer ring surface of the supporting ring plate, and the two positioning mechanisms are respectively connected to the two slide rail devices.

[0007] The adjustment mechanism includes a rotating ring arranged on the outer periphery of the supporting ring plate, the rotating ring is provided with a plurality of rectangular through holes evenly distributed in the circumferential direction, two guide plates symmetrically distributed up and down are provided between two adjacent rectangular through holes, an inclined waist-shaped through hole is provided in the middle of the guide plate, the guide plate is fixedly connected to the inner ring surface of the rotating ring, and the side of the guide plate away from the rotating ring slides and abuts against the outer side wall of the supporting ring plate, and a positioning branch chain is provided in any one of the rectangular through holes.

[0008] It also includes a clamping device, which is connected to two slide rail devices at the same time. The clamping device includes hydraulic push rods respectively connected to the two slide rail devices. The upper ends of the two hydraulic push rods are jointly equipped with a clamping ring through two Z-shaped plates. The lower end of the clamping ring is equipped with multiple circumferentially evenly distributed positioning rods. The positions of the multiple positioning rods correspond one-to-one to the positions of the multiple fine-tuning circular holes. The clamping ring is connected to multiple circumferentially evenly distributed clamping mechanisms.

[0009] According to an embodiment of the present invention, the slide rail device comprises a guide frame, a slide rail plate is installed in the guide frame, a sliding block is slidably connected to the slide rail plate, and a positioning mechanism is arranged in the guide frame.

[0010] According to an embodiment of the present invention, the positioning mechanism comprises an adjusting screw threadedly connected to the right frame wall of the guide frame, and the left end of the adjusting screw is rotatably connected to a limiting block located in the guide frame.

[0011] According to an embodiment of the present invention, the adjustment mechanism also includes four fixed plates distributed in a rectangular shape and installed on the outer ring surface of the supporting ring plate. The fixed plates are located in the corresponding rectangular through holes. One end of the fixed plate away from the supporting ring plate passes through and is rotatably connected to a limiting column. The limiting column is located on the outside of the rotating ring and is tightly attached to the outer ring surface of the rotating ring.

[0012] According to an embodiment of the present invention, the placement mechanism includes a first opening opened on the inner ring surface of the supporting ring plate, a placement block is slidably connected in the first opening, a sliding plate is installed at one end of the placement block away from the axis of the supporting ring plate, and the end of the sliding plate away from the axis of the supporting ring plate slides through the supporting ring plate and is installed with a columnar rod in a vertical state, and the upper and lower ends of the columnar rod are respectively located in the corresponding two waist-shaped through holes.

[0013] According to an embodiment of the present invention, the placement mechanism also includes a cylindrical groove opened at the upper end of the placement block, a cylindrical rod is slidably connected in the cylindrical groove, and a return spring is installed between the lower end of the cylindrical rod and the bottom wall of the cylindrical groove.

[0014] According to an embodiment of the present invention, the calibration mechanism includes an I-plate installed on the outer ring surface of the supporting ring plate, a rectangular frame is slidably sleeved on the I-plate, a strip rod is slidably penetrated through the middle section of the I-plate, the strip rod is fixedly connected to the inner wall of the rectangular frame, and the inner end surfaces of the left and right side walls of the rectangular frame are both equipped with connecting springs sleeved on the strip rod, the connecting spring is fixedly connected to the I-plate, and connecting columns are symmetrically installed between one end of the rectangular frame away from the supporting ring plate and the sliding block.

[0015] According to an embodiment of the present invention, the clamping mechanism includes a second opening provided on the inner ring surface of the clamping ring, a lower pressure plate is slidably connected in the second opening, a strip plate is installed at one end of the lower pressure plate away from the axis of the clamping ring, and the end of the strip plate away from the lower pressure plate slides through the clamping ring, a plurality of evenly distributed positioning holes are provided on the strip plate, and a positioning column in a vertical state is inserted into the clamping ring, and the positioning column is plugged into and matched with any one of the positioning holes.

[0016] According to an embodiment of the present invention, the positioning branch chain includes an arc-shaped plate installed in the corresponding rectangular through hole, and a stepped locking rod is slidably passed through the middle of the arc-shaped plate, and a telescopic spring is installed between the middle section of the locking rod and the outer arc surface of the arc-shaped plate. A plurality of circumferentially evenly distributed locking countersunk holes are opened on the outer ring surface of the supporting ring plate near the locking rod, and any one of the locking countersunk holes is plugged into and matched with the locking rod.

[0017] In addition, the present invention also provides a method for positioning and picking semiconductor silicon wafers, which specifically includes the following steps: S1: installing two slide rail devices on the semiconductor silicon wafer transmission path, and the two slide rail devices connect the supporting ring plates to the working position through two calibration mechanisms.

[0018] S2: According to the size of the semiconductor silicon wafer, the support range of the multiple placement mechanisms is adjusted by the adjustment mechanism, and then the downward pressing range of the multiple clamping mechanisms is adjusted in turn.

[0019] S3: The processed semiconductor silicon wafers are transported to a plurality of adjusted placement mechanisms through existing loading equipment, and the supporting ring plate drives the semiconductor silicon wafers to move to the semiconductor silicon wafer picking position through two slide rail devices.

[0020] S4: Start the two hydraulic push rods, which drive the multiple calibration rods on the clamping ring to move downward through the two Z-shaped plates and cooperate with the multiple corresponding fine-tuning circular holes to achieve precise positioning of the supporting ring plate. At the same time, the clamping ring drives the multiple clamping mechanisms to move downward and clamp and limit the placement mechanism after movement.

[0021] S5: taking out the multiple monomers on the semiconductor silicon wafer in sequence by using the existing manipulator until all the multiple monomers on the semiconductor silicon wafer are taken out, and the positioning and taking out of the semiconductor silicon wafer is completed.

[0022] In summary, the present invention includes the following beneficial effects: 1. The supporting device and the clamping device used in the present invention can be adjusted accordingly according to the size of the semiconductor silicon wafer to be transported, and can realize the function of transporting semiconductor silicon wafers of different sizes within a certain range, thereby effectively improving the applicability of the positioning and material taking equipment.

[0023] 2. The supporting device used in the present invention can perform annular limiting on the semiconductor silicon wafer, effectively avoiding the semiconductor silicon wafer from being offset during transportation, and further avoiding the semiconductor silicon wafer from being relatively displaced with the supporting device during transportation stop, thereby improving the accuracy of the position of the semiconductor silicon wafer after movement.

[0024] 3. The supporting device and the clamping device used in the present invention cooperate to fine-tune the position of the semiconductor silicon wafer after movement during the clamping process, further improving the accuracy of the position of the semiconductor silicon wafer after movement, ensuring the accuracy of the alignment of the suction head on the robot and the semiconductor silicon wafer, and improving the success rate of semiconductor silicon wafer material extraction. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0026] Figure 1 A schematic diagram of the three-dimensional structure of the present invention from a first viewing angle is shown.

[0027] Figure 2 A schematic diagram of the second viewing angle stereoscopic structure of the present invention is shown.

[0028] Figure 3 A front view of the present invention is shown.

[0029] Figure 4 A left side view of the present invention is shown.

[0030] Figure 5 Shows Figure 3 Sectional view of AA.

[0031] Figure 6 Shows Figure 3 Cross-sectional view of BB.

[0032] Figure 7 Shows Figure 6 Magnified view of the middle N region.

[0033] Figure 8 Shows Figure 4 Cross-sectional view of CC.

[0034] Fig. 9 Shows Figure 8 Magnified view of area D in the middle.

[0035] Fig.10 A schematic structural diagram of the supporting device of the present invention is shown.

[0036] Fig.11 The schematic diagram of the structure of the supporting ring plate, the first opening, the fine-tuning circular hole and the locking countersunk hole of the invention is shown.

[0037] Fig.12 The schematic diagram of the structure of the clamping device of the present invention is shown.

[0038] The above drawings include the following reference numerals: 1. slide rail device; 11. guide frame; 12. slide rail plate; 13. slide block; 14. positioning mechanism; 141. adjusting screw; 142. limit block; 2. supporting device; 21. supporting ring plate; 22. placing mechanism; 221. first opening; 222. placing block; 223. slide plate; 224. columnar rod; 225. cylindrical groove; 226. cylindrical rod; 227. reset spring; 23. fine-tuning circular hole; 24. adjusting mechanism; 241. rotating ring; 242. rectangular through hole; 243. guide plate; 244. waist-shaped through hole hole; 245, positioning branch chain; 2451, arc plate; 2452, positioning rod; 2453, telescopic spring; 2454, positioning countersunk hole; 246, fixed plate; 247, limiting column; 25, calibration mechanism; 251, I-shaped plate; 252, rectangular frame; 253, strip rod; 254, connecting spring; 255, connecting column; 3, clamping device; 31, hydraulic push rod; 32, Z-shaped plate; 33, clamping ring; 34, calibration rod; 35, clamping mechanism; 351, second opening; 352, lower pressure plate; 353, strip plate; 354, positioning column; 355, positioning hole. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0040] See also Figure 1-Figure 4 A semiconductor silicon wafer positioning and material removal device includes two slide rail devices 1 that are symmetrically distributed front and back and used for transmission. The slide rail device 1 includes a guide frame 11, a slide rail plate 12 is installed in the guide frame 11, a sliding block 13 is slidably connected to the slide rail plate 12, and a positioning mechanism 14 is arranged in the guide frame 11.

[0041] During specific operation, initially, the two guide frames 11 are fixed on the moving path of the semiconductor silicon wafer by existing bolts, and the two sliding blocks 13 are existing electric sliding blocks, which are connected to an existing power supply.

[0042] See also Figure 1 and Figure 8 The positioning mechanism 14 includes an adjusting screw 141 threadedly connected to the right frame wall of the guide frame 11 , and the left end of the adjusting screw 141 is rotatably connected to a limiting block 142 located in the guide frame 11 .

[0043] During specific operation, the two adjusting screws 141 are rotated in sequence according to the position of the moving end point of the semiconductor silicon wafer. The two adjusting screws 141 drive the two limit blocks 142 to move to the required positions. The two limit blocks 142 block the moving distance of the two sliding blocks 13, thereby avoiding the deviation between the position of the sliding block 13 after movement and the actual required position, thereby realizing the function of accurately positioning the moving position of the sliding block 13.

[0044] See also Figure 1 and Figure 2 The semiconductor silicon wafer positioning and material taking equipment also includes a supporting device 2, which is connected between the two slide rail devices 1. The supporting device 2 includes a supporting ring plate 21 arranged between the two slide rail devices 1, and the supporting ring plate 21 is connected to a plurality of circumferentially evenly distributed placement mechanisms 22, and an adjustment mechanism 24 is arranged on the outer side of the supporting ring plate 21. Two calibration mechanisms 25 symmetrically distributed along the axis of the supporting ring plate 21 are connected to the outer ring surface of the supporting ring plate 21, and the two calibration mechanisms 25 are respectively connected to the two sliding blocks 13.

[0045] See also Figure 1 , Figure 6 and Fig.10 The adjusting mechanism 24 comprises a rotating ring 241 arranged on the outer periphery of the supporting ring plate 21, a plurality of rectangular through holes 242 evenly distributed in the circumferential direction are provided on the rotating ring 241, two guide plates 243 symmetrically distributed up and down are provided between two adjacent rectangular through holes 242, a waist-shaped through hole 244 in an inclined state is provided in the middle of the guide plate 243, the guide plate 243 is fixedly connected to the inner ring surface of the rotating ring 241, any one of the rectangular through holes 242 is provided with a positioning branch chain 245, the positioning branch chain 245 comprises an arc plate 2451 installed in the corresponding rectangular through hole 242, and a stepped positioning rod 2452 is slidably penetrated and connected in the middle of the arc plate 2451.

[0046] See also Figure 1 , Figure 6 and Fig.10The adjustment mechanism 24 also includes four fixed plates 246 distributed in a rectangular shape and installed on the outer ring surface of the supporting ring plate 21. The fixed plates 246 are located in the corresponding rectangular through holes 242. One end of the fixed plates 246 away from the supporting ring plate 21 passes through and is rotatably connected to a limiting column 247. The limiting column 247 is located on the outside of the rotating ring 241 and is tightly attached to the outer ring surface of the rotating ring 241.

[0047] During specific operation, initially, the positioning rod 2452 is pushed according to the size of the semiconductor silicon wafer being transmitted. The positioning rod 2452 drives the rotating ring 241 to rotate on the inner side of multiple limiting pillars 247 at the same time. The multiple limiting pillars 247 have the function of annular limiting for the rotating ring 241 to avoid lateral displacement of the rotating ring 241. The rotating rotating ring 241 adjusts the placement range composed of multiple placement mechanisms 22 through multiple guide plates 243 to match it with the size of the semiconductor silicon wafer.

[0048] See also Figure 1 , Figure 6 , Fig.10 and Fig.11 The placement mechanism 22 includes a first opening 221 opened on the inner ring surface of the supporting ring plate 21, and a placement block 222 is slidably connected in the first opening 221. A sliding plate 223 is installed at one end of the placement block 222 away from the axis of the supporting ring plate 21. The end of the sliding plate 223 away from the axis of the supporting ring plate 21 slides through the supporting ring plate 21 and is installed with a columnar rod 224 in a vertical state. The upper and lower ends of the columnar rod 224 are respectively located in the corresponding two waist-shaped through holes 244.

[0049] During specific operation, while the rotating ring 241 rotates, the rotating ring 241 pushes the corresponding columnar rods 224 through the waist-shaped through holes 244 on the multiple guide plates 243, and the multiple columnar rods 224 are forced to drive the multiple sliding plates 223 to move, and the multiple sliding plates 223 drive the multiple placement blocks 222 to move in the corresponding first openings 221 until the placement range formed by the multiple moved placement blocks 222 matches the size of the semiconductor silicon wafer.

[0050] See also Fig.10 and Fig.11 A telescopic spring 2453 is installed between the middle section of the locking rod 2452 and the outer arc surface of the arc plate 2451, and a plurality of circumferentially evenly distributed locking countersunk holes 2454 are opened on the outer ring surface of the supporting ring plate 21 near the locking rod 2452, and any one of the locking countersunk holes 2454 is plugged into and matched with the locking rod 2452.

[0051] During specific operation, the telescopic spring 2453 is always in a stretched state during the rotation of the rotating ring 241. After multiple moved placement blocks 222 move to the desired positions, the locking rod 2452 moves to the opening end of the corresponding locking countersunk hole 2454, and then the clamping of the locking rod 2452 is released. The telescopic spring 2453 in the stretched state is reset and drives the locking rod 2452 to be inserted into the corresponding locking countersunk hole 2454, thereby limiting the rotating ring 241 through the arc plate 2451, thereby realizing the function of limiting multiple adjusted placement mechanisms 22.

[0052] See also Figure 1 and Fig. 9 The placement mechanism 22 also includes a cylindrical groove 225 opened at the upper end of the placement block 222, a cylindrical rod 226 is slidably connected in the cylindrical groove 225, and a return spring 227 is installed between the lower end of the cylindrical rod 226 and the bottom wall of the cylindrical groove 225.

[0053] During specific operation, after multiple placement blocks 222 are positioned, the semiconductor silicon wafer to be moved is placed on the multiple placement blocks 222 through existing loading equipment, and the corresponding cylindrical rods 226 on the multiple placement blocks 222 limit the semiconductor silicon wafer to avoid positional deviation during the movement of the semiconductor silicon wafer, thereby improving the accuracy of the position of the semiconductor silicon wafer after movement.

[0054] See also Figure 1 , Figure 2 , Figure 5 and Fig.12 The semiconductor silicon wafer positioning and material taking equipment also includes a clamping device 3, which is connected to two slide rail devices 1 at the same time. The clamping device 3 includes hydraulic push rods 31 respectively connected to the two slide rail devices 1. The upper ends of the two hydraulic push rods 31 are jointly installed with a clamping ring 33 through two Z-shaped plates 32. The lower end of the clamping ring 33 is installed with multiple circumferentially evenly distributed calibration rods 34. The positions of the multiple calibration rods 34 correspond one by one to the positions of the multiple fine-tuning circular holes 23. The clamping ring 33 is connected with multiple circumferentially evenly distributed clamping mechanisms 35.

[0055] See also Figure 1 , Figure 5 , Fig. 9 and Fig.12The clamping mechanism 35 includes a second opening 351 opened on the inner ring surface of the clamping ring 33, and a lower pressure plate 352 is slidably connected in the second opening 351. A strip plate 353 is installed at the end of the lower pressure plate 352 away from the axis of the clamping ring 33, and the end of the strip plate 353 away from the lower pressure plate 352 slides through the clamping ring 33. A plurality of evenly distributed positioning holes 355 are opened on the strip plate 353, and a vertical positioning column 354 is inserted into the clamping ring 33, and the positioning column 354 is plugged into and matched with any one of the positioning holes 355.

[0056] During specific operation, the two hydraulic push rods 31 are initially connected to the existing hydraulic pump outside, and the two hydraulic push rods 31 are in the maximum stroke state. The two hydraulic push rods 31 drive the clamping ring 33 to the highest position in the working process through the two Z-type plates 32. Then, according to the size of the semiconductor silicon wafer, multiple strip plates 353 are slid in sequence, and the strip plates 353 drive the lower pressure plate 352 to move in the second opening 351. When the lower pressure plate 352 moves to the required position, the positioning column 354 is passed through the clamping ring 33 and inserted into the corresponding positioning hole 355, thereby limiting the lower pressure plate 352, further realizing the function of limiting the lower pressure plate 352.

[0057] See also Figure 1 , Figure 5 , Figure 6 and Figure 7 The calibration mechanism 25 includes an I-shaped plate 251 installed on the outer ring surface of the supporting ring plate 21, a rectangular frame 252 is slidably sleeved on the I-shaped plate 251, a strip rod 253 is slidably penetrated through the middle section of the I-shaped plate 251, the strip rod 253 is fixedly connected to the inner wall of the rectangular frame 252, and the inner end surfaces of the left and right side walls of the rectangular frame 252 are both installed with connecting springs 254 sleeved on the strip rod 253, the connecting spring 254 is fixedly connected to the I-shaped plate 251, and connecting columns 255 are symmetrically installed between the end of the rectangular frame 252 away from the supporting ring plate 21 and the sliding block 13.

[0058] See also Fig.11 The upper end of the supporting ring plate 21 is provided with a plurality of fine-tuning circular holes 23 evenly distributed in the circumferential direction, and the upper end of the fine-tuning circular hole 23 is a trumpet-shaped structure.

[0059] During specific operation, after the multiple lower pressure plates 352 are limited in position, the two sliding blocks 13 are started, and the two sliding blocks 13 respectively drive the two rectangular frames 252 to move through the two connecting columns 255, and the two rectangular frames 252 drive the two I-shaped plates 251 to move through the two strip rods 253, and the two I-shaped plates 251 drive the supporting ring plate 21 to move, and the supporting ring plate 21 drives the semiconductor silicon wafer to move directly below the clamping ring 33 through the multiple placement mechanisms 22, and then the two hydraulic push rods 31 are started, and the two hydraulic push rods 31 drive the clamping ring 33 to move downward through the two Z-shaped plates 32, and the clamping ring 33 drives the multiple calibration rods 34 to move downward and plug into the corresponding fine-tuning holes 23, and the trumpet-shaped structure on the fine-tuning holes 23 guides the calibration rods 34. In the process of plugging and matching the calibration rod 34 with the multiple fine-tuning circular holes 23, the function of further fine-tuning the supporting ring plate 21 is realized, further ensuring the accuracy of the position of the supporting ring plate 21 after the semiconductor silicon wafer is moved by the multiple placement mechanisms 22. There is a gap between the I-plate 251 and the rectangular frame 252, which provides conditions for the fine-tuning of the supporting ring plate 21. At the same time, the clamping ring 33 drives the multiple lower pressure plates 352 to move downward through the multiple strip plates 353. The multiple lower pressure plates 352 press down the corresponding cylindrical rods 226 and cooperate with the corresponding placement blocks 222 to realize the function of clamping and limiting the semiconductor silicon wafer. The multiple monomers on the semiconductor silicon wafer are taken out one by one through the existing manipulator until all the multiple monomers on the semiconductor silicon wafer are taken out, and the positioning and material taking of the semiconductor silicon wafer is completed.

[0060] In addition, the present invention also provides a method for positioning and picking semiconductor silicon wafers, which specifically includes the following steps: S1: installing two slide rail devices 1 on the semiconductor silicon wafer transmission path, and the two slide rail devices 1 connect the supporting ring plate 21 to the working position through two calibration mechanisms 25.

[0061] S2: According to the size of the semiconductor silicon wafer, the support range of the plurality of placement mechanisms 22 is adjusted by the adjustment mechanism 24, and then the downward pressing range of the plurality of clamping mechanisms 35 is adjusted in turn.

[0062] S3: The processed semiconductor silicon wafers are transported to a plurality of adjusted placement mechanisms 22 through existing loading equipment, and the supporting ring plate 21 drives the semiconductor silicon wafers to move to the semiconductor silicon wafer taking position through two slide rail devices 1.

[0063] S4: Start the two hydraulic push rods 31. The two hydraulic push rods 31 drive the multiple calibration rods 34 on the clamping ring 33 to move downward through the two Z-shaped plates 32 and cooperate with the multiple corresponding fine-tuning circular holes 23 to achieve precise positioning of the supporting ring plate 21. At the same time, the clamping ring 33 drives the multiple clamping mechanisms 35 to move downward and clamp and limit the placement mechanism 22 after movement.

[0064] S5: taking out the multiple monomers on the semiconductor silicon wafer in sequence by using the existing manipulator until all the multiple monomers on the semiconductor silicon wafer are taken out, and the positioning and taking out of the semiconductor silicon wafer is completed.

[0065] In the description of the embodiments of the present invention, it should be noted that the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "top", "bottom", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0066] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor silicon wafer positioning and material taking device, characterized in that: It comprises two slide rail devices (1) which are symmetrically distributed front and back and used for transmission; A supporting device (2) is connected between the two slide rail devices (1), the supporting device (2) comprises a supporting ring plate (21) arranged between the two slide rail devices (1), a plurality of circumferentially evenly distributed placement mechanisms (22) are connected to the supporting ring plate (21), a plurality of circumferentially evenly distributed fine-tuning circular holes (23) are opened at the upper end of the supporting ring plate (21), an adjustment mechanism (24) is arranged on the outer side of the supporting ring plate (21), and two alignment mechanisms (25) symmetrically distributed along the axis of the supporting ring plate (21) are connected to the outer ring surface of the supporting ring plate (21), and the two alignment mechanisms (25) are respectively connected to the two slide rail devices (1); The adjustment mechanism (24) comprises a rotating ring (241) arranged on the outer periphery of the supporting ring plate (21); a plurality of rectangular through holes (242) evenly distributed in the circumferential direction are provided on the rotating ring (241); two guide plates (243) symmetrically distributed up and down are provided between two adjacent rectangular through holes (242); a waist-shaped through hole (244) in an inclined state is provided in the middle of the guide plate (243); the guide plate (243) is fixedly connected to the inner ring surface of the rotating ring (241); and a positioning branch chain (245) is provided in any one of the rectangular through holes (242); A clamping device (3) is connected to the two slide rail devices (1) at the same time, the clamping device (3) comprises hydraulic push rods (31) respectively connected to the two slide rail devices (1), the upper ends of the two hydraulic push rods (31) are jointly mounted with a clamping ring (33) through two Z-shaped plates (32), the lower end of the clamping ring (33) is mounted with a plurality of circumferentially evenly distributed calibration rods (34), and the clamping ring (33) is connected with a plurality of circumferentially evenly distributed clamping mechanisms (35); The adjustment mechanism (24) further comprises four fixing plates (246) distributed in a rectangular shape and mounted on the outer annular surface of the supporting ring plate (21); the fixing plates (246) are located in the corresponding rectangular through holes (242); one end of the fixing plates (246) away from the supporting ring plate (21) passes through and is rotatably connected to a limiting column (247); the limiting column (247) is located outside the rotating ring (241) and is in close contact with the outer annular surface of the rotating ring (241); The placement mechanism (22) comprises a first opening (221) provided on the inner annular surface of the supporting ring plate (21), a placement block (222) being slidably connected in the first opening (221), a sliding plate (223) being installed at one end of the placement block (222) away from the axis of the supporting ring plate (21), the sliding plate (223) being slidably passed through the supporting ring plate (21) at one end away from the axis of the supporting ring plate (21) and being installed with a columnar rod (224) in a vertical state, the upper and lower ends of the columnar rod (224) being respectively located in two corresponding waist-shaped through holes (244); The placement mechanism (22) further comprises a cylindrical groove (225) provided at the upper end of the placement block (222), a cylindrical rod (226) being slidably connected in the cylindrical groove (225), and a return spring (227) being installed between the lower end of the cylindrical rod (226) and the bottom wall of the cylindrical groove (225); The positioning branch chain (245) comprises an arc-shaped plate (2451) installed in the corresponding rectangular through hole (242); a stepped locking rod (2452) is slidably penetrated through the middle of the arc-shaped plate (2451); a telescopic spring (2453) is installed between the middle section of the locking rod (2452) and the outer arc surface of the arc-shaped plate (2451); a plurality of circumferentially evenly distributed locking countersunk holes (2454) are provided on the outer ring surface of the supporting ring plate (21) near the locking rod (2452); any one of the locking countersunk holes (2454) is plugged into and matched with the locking rod (2452).

2. The semiconductor silicon wafer positioning and material taking device according to claim 1, characterized in that: The slide rail device (1) comprises a guide frame (11), a slide rail plate (12) is installed in the guide frame (11), a sliding block (13) is slidably connected to the slide rail plate (12), two positioning mechanisms (25) are respectively connected to the two sliding blocks (13), and a positioning mechanism (14) is arranged in the guide frame (11).

3. The semiconductor silicon wafer positioning and material taking device according to claim 2, characterized in that: The positioning mechanism (14) comprises an adjusting screw (141) threadedly connected to the right frame wall of the guide frame (11), and the left end of the adjusting screw (141) is rotatably connected to a limiting block (142) located in the guide frame (11).

4. The semiconductor silicon wafer positioning and material taking device according to claim 1, characterized in that: The calibration mechanism (25) comprises an I-shaped plate (251) mounted on the outer ring surface of the supporting ring plate (21); a rectangular frame (252) is slidably sleeved on the I-shaped plate (251); a strip rod (253) is slidably penetrated through the middle section of the I-shaped plate (251); the strip rod (253) is fixedly connected to the inner wall of the rectangular frame (252); connecting springs (254) sleeved on the strip rod (253) are mounted on the inner end surfaces of the left and right side walls of the rectangular frame (252); the connecting springs (254) are fixedly connected to the I-shaped plate (251); and connecting columns (255) are symmetrically mounted between one end of the rectangular frame (252) away from the supporting ring plate (21) and the sliding block (13).

5. The semiconductor silicon wafer positioning and material taking device according to claim 1, characterized in that: The clamping mechanism (35) includes a second opening (351) provided on the inner annular surface of the clamping ring (33), a lower pressure plate (352) being slidably connected in the second opening (351), a strip plate (353) being installed at one end of the lower pressure plate (352) away from the axis of the clamping ring (33), the end of the strip plate (353) away from the lower pressure plate (352) slides through the clamping ring (33), a plurality of evenly distributed positioning holes (355) are provided on the strip plate (353), a vertical positioning column (354) is plugged into any one of the positioning holes (355), and the positioning column (354) is plugged into and matched with any one of the positioning holes (355).

6. A method for positioning and retrieving a semiconductor silicon wafer, which is accomplished by using the semiconductor silicon wafer positioning and retrieving device as claimed in claim 1, and specifically comprises the following steps: S1: installing two slide rail devices (1) on a semiconductor silicon wafer conveying path, and connecting the two slide rail devices (1) to a supporting ring plate (21) at a working position via two alignment mechanisms (25); S2: According to the size of the semiconductor silicon wafer, the support range of the plurality of placement mechanisms (22) is adjusted by the adjustment mechanism (24), and then the downward pressing range of the plurality of pressing mechanisms (35) is adjusted in turn; S3: The processed semiconductor silicon wafers are transported to a plurality of adjusted placement mechanisms (22) through existing loading equipment, and the supporting ring plate (21) drives the semiconductor silicon wafers to move to the semiconductor silicon wafer taking position through two slide rail devices (1); S4: Start the two hydraulic push rods (31), which drive the multiple calibration rods (34) on the clamping ring (33) to move downward through the two Z-shaped plates (32) and cooperate with the multiple corresponding fine-tuning circular holes (23) to achieve accurate positioning of the supporting ring plate (21). At the same time, the clamping ring (33) drives the multiple clamping mechanisms (35) to move downward and clamp and limit the placement mechanism (22) after the movement; S5: taking out the multiple monomers on the semiconductor silicon wafer in sequence by using the existing manipulator until all the multiple monomers on the semiconductor silicon wafer are taken out, and the positioning and taking out of the semiconductor silicon wafer is completed.

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