Ceramic package base assembly plate and cutting method

Abstract

The present invention relates to the technical field of electronic component packaging, and discloses a ceramic packaging base composite board and a slitting method. The composite board includes a first ceramic layer and a second ceramic layer stacked from bottom to top, the first ceramic layer includes a first upper surface and a first lower surface arranged in a vertical direction, the second ceramic layer includes a second upper surface and a second lower surface arranged in a vertical direction, and the first upper surface and the second lower surface are bonded together; the first upper surface is provided with electroplating mainstream wiring, electroplating branch wiring, and electroplating auxiliary wiring; the width of the electroplating mainstream wiring is W1, and the width of the electroplating branch wiring is W2, W1>W2. The beneficial effects of the present invention are: reducing the potential difference in different areas of the composite board, making the thickness of the electroplating layer in the composite board uniform, and after being divided to form a single ceramic packaging base, the product has good consistency and stability, and avoids thermal stress concentration cracking during the sealing of the ceramic packaging base.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component packaging, in particular to a ceramic packaging base assembly plate and a cutting method. Background Art

[0002] Ceramic package bases are commonly used to package electronic components such as quartz crystals and semiconductor chips. The packaged components (such as semiconductor devices, temperature-compensated oscillators (TCXOs), tuning fork resonators, thermistor resonators, etc.) are widely used in various electronic devices.

[0003] In the preparation process of ceramic package base, processing is usually carried out on a larger ceramic green film strip to obtain the required structure and metal layer of each layer of ceramic substrate. The ceramic green film strips are then stacked, sintered and electroplated to obtain a ceramic package base combination plate containing multiple ceramic package bases. Subsequently, the combination plate only needs to be divided to obtain a single ceramic package base.

[0004] As the size of electronic devices becomes smaller and smaller, electronic components and corresponding ceramic package bases are also developing towards miniaturization, resulting in the influence of the thickness difference of the electroplating layer on the ceramic package base on the welding performance of the electrode pattern being amplified. Therefore, it is necessary to effectively improve the thickness uniformity of the electroplating layer on the ceramic package base to ensure the welding reliability of the ceramic package base.

[0005] The width of the electroplating wiring structure in the traditional ceramic package base combination board is the same, and the electroplating wiring is directly connected to the auxiliary wiring for electroplating at the edge of the combination board, so that during electroplating, the potential difference in different areas of the combination board is large, resulting in a high difference in the thickness of the electroplating layer in different areas. When it is divided to form a single ceramic package base, the consistency of each ceramic package base is poor. When some package bases are subsequently sealed at a certain sealing power, there is a risk of cracking the base porcelain body due to thermal stress concentration, and the product stability is poor. Summary of the Invention

[0006] The purpose of the present invention is to provide a ceramic package base assembly board and a segmentation method. By rationally designing the structure of the electroplating wiring, the potential difference in different areas of the assembly board is reduced, the thickness of the electroplating layer in the assembly board is made uniform, and after segmentation to form individual ceramic package bases, the product has good consistency and stability, avoiding thermal stress concentration cracking during the sealing and welding of the ceramic package base.

[0007] To achieve the above-mentioned object, the present invention provides a ceramic package base assembly board, comprising a first ceramic layer and a second ceramic layer stacked from bottom to top, wherein the first ceramic layer comprises a first upper surface and a first lower surface arranged in a vertical direction, and the second ceramic layer comprises a second upper surface and a second lower surface arranged in a vertical direction, wherein the first upper surface and the first lower surface are arranged opposite to each other;

[0008] The first upper surface is provided with electroplating main wiring, electroplating branch wiring, and electroplating auxiliary wiring;

[0009] The electroplating auxiliary wiring is provided along the edge of the first upper surface, and the electroplating main wiring is provided inside the electroplating auxiliary wiring, which is staggered along the first direction and the second direction. The electroplating main wiring divides the first upper surface into multiple sub-areas, and each sub-area is provided with the electroplating tributary wiring. The electroplating main wiring is connected to the electroplating tributary wiring, and both ends of the electroplating main wiring are connected to the electroplating auxiliary wiring.

[0010] The first lower surface is provided with a welding terminal, and the welding terminal is connected to the electroplating main wiring through the electroplating branch wiring;

[0011] The width of the electroplating main wiring is W1, and the width of the electroplating branch wiring is W2, where W1>W2.

[0012] Furthermore, 1.3≤(W1-W2) / W2≤1.9.

[0013] Furthermore, the resistance of the electroplated main wiring is R1, the resistance of the electroplated branch wiring is R2, and 0.5≤(R2-R1) / R2≤0.8.

[0014] Furthermore, the first ceramic layer is provided with a first through hole in a vertical direction, a first conductor is embedded in the first through hole, and the electroplated branch wiring is connected to the welding terminal through the first conductor.

[0015] Furthermore, a welding electrode is provided on the second upper surface, a second through hole is opened in the vertical direction of the second ceramic layer, a second conductor is provided in the second through hole, an amplification part is provided on the electroplated tributary wiring, one end of the second conductor is connected to the amplification part, and the other end is connected to the welding electrode.

[0016] Furthermore, the first lower surface is provided with a plurality of welding terminals, and the plurality of welding terminals are respectively connected to the electroplating main wiring through different electroplating branch wirings.

[0017] Furthermore, there are base areas corresponding one to one with the package base units, and in a single base area, the entire structure of at most one electroplating tributary wiring is arranged on the first upper surface of the base area, and the two ends of the other electroplating tributary wirings in a single base area extend into two adjacent base areas respectively, or / and one end is located in the base area, and the other end extends to the edge area of ​​the base area adjacent to and close to the auxiliary wiring for electroplating.

[0018] Furthermore, the first ceramic layer is provided with a plated hole.

[0019] The present invention also provides a method for cutting a ceramic package base assembly plate, based on any of the above-mentioned ceramic package base assembly plates, comprising the following steps:

[0020] The ceramic package base assembly board is electroplated, a cutting line is set along the outline of the package base unit on the ceramic package base assembly board, and a cutting groove is set on the first ceramic layer and the second ceramic layer along the cutting line, and the cutting groove divides the ceramic package base assembly board into a plurality of the package base units.

[0021] Furthermore, the welding terminal is provided at the bottom of the package base unit, and at most only one of the multiple welding terminals is connected to the electroplating main wiring through the electroplating branch wiring.

[0022] Compared with the prior art, the ceramic packaging base combination board and cutting method according to the embodiment of the present invention have the following beneficial effects: electroplating main wiring, electroplating auxiliary wiring and electroplating branch wiring are arranged on the first upper surface, and the electroplating main wiring is staggered along the first direction and the second direction to divide the first upper surface into multiple sub-areas, each sub-area is provided with electroplating auxiliary wiring, and the width of the electroplating main wiring is greater than the width of the electroplating branch wiring, the electroplating main wiring is connected to the electroplating branch wiring and the electroplating auxiliary wiring respectively, and the welding terminal is connected through the electroplating branch wiring and the electroplating main wiring. By rationally designing the structure of the electroplating wiring, an electroplating current flow path of "electroplating auxiliary wiring-electroplating main wiring-electroplating branch wiring-welding terminal" is formed in each area of ​​the combination board, which effectively reduces the potential difference in different areas of the combination board, makes the thickness of the electroplating layer in the combination board uniform, and after cutting to form a single ceramic packaging base, the product has good consistency and stability, avoiding thermal stress concentration cracking during the sealing of the ceramic packaging base. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 2 is a schematic structural diagram of the first upper surface of the ceramic package base assembly board according to an embodiment of the present invention;

[0024] Figure 2This is a schematic structural diagram of the first ceramic layer of the ceramic package base assembly board according to an embodiment of the present invention after being divided along the annular dividing line;

[0025] Figure 3 2 is a schematic structural diagram of the first lower surface of the ceramic package base assembly board according to an embodiment of the present invention;

[0026] Figure 4 2 is a schematic structural diagram of a ceramic package base assembly board according to an embodiment of the present invention;

[0027] Figure 5 2 is a schematic structural diagram of the second upper surface of the ceramic package base assembly board according to an embodiment of the present invention;

[0028] Figure 6 2 is a schematic structural diagram of the second lower surface of the ceramic package base assembly board according to an embodiment of the present invention;

[0029] Figure 7 1 is a schematic structural diagram of a package base unit of a ceramic package base assembly board according to an embodiment of the present invention;

[0030] Figure 8 1 is a schematic structural diagram of a first upper surface and a first lower surface within a package base unit of a ceramic package base assembly board according to an embodiment of the present invention;

[0031] Figure 9 1 is a schematic structural diagram of a second upper surface and a second lower surface within a package base unit of a ceramic package base assembly board according to an embodiment of the present invention;

[0032] Figure 10 This is a distribution diagram of sub-areas on the first upper surface of the ceramic package base assembly board according to an embodiment of the present invention.

[0033] In the figure, 1, first ceramic layer; 11, first upper surface; 110, sub-region; 111, electroplating main wiring; 112, electroplating tributary wiring; 1221, amplification portion; 113, electroplating auxiliary wiring; 114, plated hole; 12, first lower surface; 121, welding terminal; 13, first through hole;

[0034] 2. Second ceramic layer; 20. Second through hole; 21. Second upper surface; 211. Welding electrode; 22. Second lower surface; 23. Second conductor;

[0035] 3. Annular slitting line; 31. Product area; 32. Annular peripheral area;

[0036] 4. Branch cutting line; 5. Package base unit; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0037] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0038] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "inside", "outside", etc. used in the present invention to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the devices and elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0039] In describing the present invention, it should be understood that the terms "first," "second," etc., are used to describe various types of information, but such information should not be limited to these terms. These terms are merely used to distinguish information of the same type from one another. For example, "first" information could also be referred to as "second" information, and similarly, "second" information could also be referred to as "first" information without departing from the scope of the present invention.

[0040] See Figures 1 to 10 The preferred embodiment of the present invention is a ceramic package base assembly board, which includes a first ceramic layer 1 and a second ceramic layer 2 stacked from bottom to top. The materials of the first ceramic layer 1 and the second ceramic layer 2 are aluminum oxide or aluminum nitride. The first ceramic layer 1 includes a first upper surface 11 and a first lower surface 12 arranged in a vertical direction, and the second ceramic layer includes a second upper surface 21 and a second lower surface 22 arranged in a vertical direction. The first upper surface 11 and the second lower surface 22 are arranged in a laminated manner. For ease of description, refer to Figure 1 , define the length direction of the combined board as the first direction X, the width direction as the second direction Y, and the first direction X and the second direction Y are perpendicular.

[0041] In order to facilitate the reasonable arrangement of the electroplating wiring in the combined board, reduce the potential difference between the various regions in the combined board, and maintain the consistency and stability of the subsequent segmentation to form a single ceramic package base product, in the present invention, the first upper surface 11 is provided with an electroplating main wiring 111, an electroplating branch wiring 112, and an electroplating auxiliary wiring 113; specifically, refer to Figure 1 、 Figure 2 The edge of the first upper surface 11 is provided with an electroplating auxiliary wiring 113, and the electroplating auxiliary wiring 113 is provided with electroplating main wiring 111 staggered along the first direction X and the second direction Y. Since the electroplating main wiring 111 is staggered, refer to Figure 10The main plating wiring 111 divides the first upper surface 11 into a plurality of sub-areas 110. Each sub-area 110 is provided with a tributary plating wiring 112. Both ends of the main plating wiring 111 are connected to the auxiliary plating wiring 113. Furthermore, in some embodiments, in order to facilitate the electrical connection between the combined board and an external plating device (such as a plating rack), a guide plated hole 114 is provided in the first ceramic layer 1. Figure 3 The first lower surface 12 is provided with a welding terminal 121, and the welding terminal 121 is connected to the electroplating main wiring 111 through the electroplating branch wiring 112. In order to facilitate the design of the width of the electroplating main wiring 111 and the electroplating branch wiring 112, and considering the overall structural strength of the combined board, the width of the electroplating main wiring 111 is W1, and the width of the electroplating branch wiring 112 is W2, W1>W2.

[0042] The above design enables a plating current flow path of "electroplating auxiliary wiring 113-electroplating main wiring 111-electroplating branch wiring 112-welding terminal 121" to be formed in each area of ​​the combined board, effectively reducing the potential difference between different areas of the combined board, and improving the consistency of the thickness of the electroplating layer on the combined board. When the combined board is divided to form multiple ceramic packaging bases, the consistency and stability of the ceramic packaging base products are guaranteed, and thermal stress concentration cracking during the sealing of the ceramic packaging base is avoided.

[0043] Furthermore, when the width W1 of the electroplated mainstream wiring 111 is greater than the width W2 of the electroplated branch wiring 112, in order to further improve the consistency of the thickness of the electroplating layer of the composite board, it is necessary to satisfy 1.3≤(W1-W2) / W2≤1.9. Specifically, when (W1-W2) / W2<1.3, the difference between the resistance of the electroplated mainstream wiring 111 and the resistance of the electroplated branch wiring 112 is small, and the effect of reducing the potential difference between different areas of the composite board becomes worse; when (W1-W2) / W2>1.9, the difference between the resistance of the electroplated mainstream wiring 111 and the resistance of the electroplated branch wiring 112 is too large, and the heat generation difference between the electroplated mainstream wiring 111 and the electroplated branch wiring 112 is large, which in turn causes the risk of thermal stress concentration.

[0044] Furthermore, in order to facilitate the setting of the resistance R1 of the electroplating main wiring 111 and the resistance R2 of the electroplating tributary wiring 112 and improve the setting accuracy of the resistance, in this embodiment, the resistance R1 and the resistance R2 must satisfy 0.5≤(R2-R1) / R2≤0.8. Among them, when (R2-R1) / R2<0.5, the difference between the resistance of the electroplating main wiring 111 and the resistance of the electroplating tributary wiring 112 is small, and the effect of reducing the potential difference between different areas of the composite board becomes poor; when (R2-R1) / R2>0.5, the difference between the resistance R1 of the electroplating main wiring 111 and the resistance R2 of the electroplating tributary wiring 112 is too large, and the heat generation difference between the electroplating main wiring 111 and the electroplating tributary wiring 112 is large, resulting in thermal stress concentration at the electroplating main wiring 111.

[0045] Furthermore, in some embodiments, in order to facilitate the connection of the welding terminal 121 with the electroplating main wiring 111 through the electroplating branch wiring 112, see Figure 1 The first ceramic layer 1 is provided with a first through hole 13 in the vertical direction, and a first conductor (not shown in the figure) is embedded in the first through hole 13. The electroplated branch wiring 112 is connected to the welding terminal 121 through the first conductor. At this time, one end of the first conductor is connected to the welding terminal 121, and the other end is connected to the electroplated branch wiring 112.

[0046] Furthermore, the second upper surface 21 is provided with a welding electrode 211, which can be used for welding electronic components such as chips. In order to connect the welding terminal 121 and the welding electrode 211, refer to Figure 5 、 Figure 6 The second ceramic layer 2 is provided with a second through hole 20 in the vertical direction, and a second conductor 23 is disposed in the second through hole 20. Furthermore, to ensure that the second conductor 23 is in full contact with the electroplated tributary wiring 112, an amplifying portion 1221 corresponding to the second conductor 23 is provided on the electroplated tributary wiring 112. One end of the second conductor 23 is connected to the amplifying portion 1221, and the other end is connected to the welding electrode 211. Furthermore, the width W3 of the amplifying portion 1221 is greater than the width W2 of the tributary wiring.

[0047] Furthermore, since the ceramic base package assembly board can be divided into multiple package base units, in order to arrange the wiring of each package base unit, in this embodiment, the first lower surface is provided with multiple solder terminals, and each of these solder terminals is connected to the electroplating main line through a different electroplating branch line. At the same time, the ceramic base package assembly board is provided with a base area corresponding to each package base unit (i.e., corresponding to the package base unit 5). In a single base area, at most one electroplating branch line has its entire structure arranged on the first upper surface of the base area. Figure 1 、 Figure 8(a) The two ends of other electroplating branch wirings in a single base area extend into two adjacent base areas respectively, or / and one end is located in the base area and the other end extends to the edge area of ​​the base area adjacent to and close to the auxiliary wiring for electroplating.

[0048] Furthermore, to protect the conductive layers of welding terminal 121 and welding electrode 211 from environmental influences, a plating layer is applied to the surfaces of welding electrode 211 and welding terminal 121. The plating layer is made of nickel or gold. Furthermore, welding terminal 121, welding electrode 211, plated main wiring 111, plated branch wiring 112, first conductor 23, and second conductor 23 are made of tungsten or molybdenum, reducing costs while providing excellent conductivity.

[0049] The above-mentioned ceramic package base assembly plate needs to be further cut to form individual ceramic package bases. Therefore, the present invention also provides a method for cutting the ceramic package base assembly plate, based on any of the above-mentioned ceramic package base assembly plates, comprising the following steps:

[0050] The ceramic package base assembly board is electroplated, a cutting line is set along the outline of the package base unit on the ceramic package base assembly board, and a cutting groove is set on the first ceramic layer and the second ceramic layer along the cutting line, and the cutting groove divides the ceramic package base assembly board into a plurality of the package base units.

[0051] It can be divided into the following steps:

[0052] S1. The ceramic package base assembly plate is electroplated, an annular cutting line 3 is provided on the ceramic package base assembly plate, and main cutting grooves are provided along the annular cutting line 3 for the first ceramic layer 1 and the second ceramic layer 2. The main cutting grooves divide the ceramic package base assembly plate into a product area 31 and an annular peripheral area 32.

[0053] S2. Branch cutting lines 4 are arranged at intervals along the first direction X and the second direction Y in the product area 31, and branch cutting grooves are arranged in the first ceramic layer 1 and the second ceramic layer 2 along the branch cutting lines 4, so as to evenly divide the product area 31 into multiple packaging base units 5.

[0054] In step S2, branch cutting grooves are provided on the first lower surface 12 and the second upper surface 21, and the depth of the branch cutting grooves is slightly smaller than the thickness of the first ceramic layer 1 and the second ceramic layer 2, so that a small force can be applied to separate the adjacent package base units 5.

[0055] Furthermore, in this embodiment, a ceramic package base assembly plate can be cut into 9 package base units 5, and the number can be adjusted accordingly according to actual production needs. The structure of the package base unit 5 is as follows: Figure 7 As shown, FIG7( a ) is a top view of the package base unit 5 , and FIG7( b ) is a bottom view of the package base unit 5 . Figure 8 8(a) is a schematic structural diagram of the first upper surface 11 in the package base unit 5, and 8(b) is a schematic structural diagram of the first lower surface 12 in the package base unit 5. Figure 9 9(a) is a schematic diagram of the structure of the second lower surface 22 in the package base unit 5, and 9(b) is a schematic diagram of the structure of the second upper surface 21 in the package base unit 5. Figure 7 、 Figure 8 As can be seen, the package base unit 5 has multiple soldering terminals 121 at the bottom and an equal number of soldering electrodes 211 at the top, positioned correspondingly to the soldering terminals 121. Each soldering terminal 121 corresponds to a corresponding electroplating branch wiring 112. Because the multiple soldering terminals 121 in the package base unit 5 must be electrically isolated from each other, at most one of the multiple soldering terminals 121 is connected to the electroplating main wiring 111 via the electroplating branch wiring 112. The electroplating branch wirings 112 connected to the remaining soldering terminals 121 are not connected to the electroplating main wiring 111. The soldering terminals 121 and the soldering electrodes 211 are electrically connected via the amplifying portion 1221 and the second conductor 23 on the electroplating branch wiring 112. In this embodiment, there are four soldering terminals 121, but this number can be adjusted based on actual design requirements.

[0056] If more than one soldering terminal 121 is connected to the electroplated branch wiring 112 and the electroplated main wiring 111, that is, the soldering terminals 121 are electrically connected, then after slitting, additional processing steps are required to remove part of the wiring structure to achieve electrical insulation, increasing production costs and process complexity. Therefore, the package base unit 5 obtained by the present invention avoids further processing after the package base unit 5 is slit, improving production efficiency while reducing production costs.

[0057] In summary, the embodiment of the present invention provides a ceramic package base assembly plate and a slitting method, wherein a plating main wiring 111, a plating auxiliary wiring 113 and a plating tributary wiring 112 are arranged on the first upper surface 11, and the plating main wiring 111 is staggered along the first direction X and the second direction Y, and the first upper surface 11 is divided into a plurality of sub-areas 110, each sub-area 110 is provided with a plating auxiliary wiring 113, and the width of the plating main wiring 111 is greater than the width of the plating tributary wiring 112, and the plating main wiring 111 is respectively connected to the plating tributary wiring 112 and the plating auxiliary wiring 113. The welding terminal 121 is connected through the electroplating branch wiring 112 and the electroplating main wiring 111. By rationally designing the structure of the electroplating wiring, an electroplating current flow path of "electroplating auxiliary wiring 113-electroplating main wiring 111-electroplating branch wiring 112-welding terminal 121" is formed in each area of ​​the combined board, which effectively reduces the potential difference in different areas of the combined board, makes the thickness of the electroplating layer in the combined board uniform, and after being divided to form a single ceramic package base, the product has good consistency and stability, avoiding thermal stress concentration cracking during the sealing of the ceramic package base.

[0058] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A ceramic package base assembly board, characterized in that: The invention comprises a first ceramic layer and a second ceramic layer stacked from bottom to top, wherein the first ceramic layer comprises a first upper surface and a first lower surface arranged in a vertical direction, the second ceramic layer comprises a second upper surface and a second lower surface arranged in a vertical direction, and the first upper surface and the second lower surface are bonded to each other; The first upper surface is provided with electroplating main wiring, electroplating branch wiring, and electroplating auxiliary wiring; The electroplating auxiliary wiring is provided along the edge of the first upper surface, and the electroplating main wiring is provided inside the electroplating auxiliary wiring, which is staggered along the first direction and the second direction. The electroplating main wiring divides the first upper surface into a plurality of sub-areas, and each sub-area is provided with the electroplating tributary wiring. The electroplating main wiring is connected to the electroplating tributary wiring, and both ends of the electroplating main wiring are connected to the electroplating auxiliary wiring. The first lower surface is provided with a welding terminal, and the welding terminal is connected to the electroplating main wiring through the electroplating branch wiring; The width of the electroplating main wiring is W1, and the width of the electroplating branch wiring is W2, W1>W2; The resistance of the electroplated main wiring is R1, the resistance of the electroplated branch wiring is R2, and 0.5≤(R2-R1) / R2≤0.

8.

2. The ceramic package base assembly board according to claim 1, wherein: 1.3≤(W1-W2) / W2≤1.

9.

3. The ceramic package base assembly board according to claim 1, wherein: The first ceramic layer is provided with a first through hole in a vertical direction. A first conductor is embedded in the first through hole. The electroplated branch wiring is connected to the welding terminal through the first conductor.

4. The ceramic package base assembly board according to claim 1, wherein: A welding electrode is provided on the second upper surface, a second through hole is opened in the vertical direction on the second ceramic layer, a second conductor is provided in the second through hole, an amplification part is provided on the electroplated tributary wiring, one end of the second conductor is connected to the amplification part, and the other end is connected to the welding electrode.

5. The ceramic package base assembly board according to claim 1, wherein: The first lower surface is provided with a plurality of welding terminals, and the plurality of welding terminals are respectively connected to the electroplating main flow wiring through different electroplating branch flow wirings.

6. The ceramic package base assembly board according to claim 5, characterized in that: There are base areas corresponding one to one with the package base units. In a single base area, the entire structure of at most one electroplating branch wiring is arranged on the first upper surface of the base area. The two ends of the other electroplating branch wirings in a single base area extend into two adjacent base areas respectively, or / and one end is located in the base area, and the other end extends to the edge area of ​​the base area adjacent to and close to the electroplating auxiliary wiring.

7. The ceramic package base assembly board according to claim 1, wherein: The first ceramic layer is provided with a plated hole.

8. A method for cutting a ceramic package base assembly plate, based on the ceramic package base assembly plate according to any one of claims 1 to 7, characterized in that: The following steps are involved: The ceramic package base assembly board is electroplated, a cutting line is set along the outline of the package base unit on the ceramic package base assembly board, and a cutting groove is set on the first ceramic layer and the second ceramic layer along the cutting line, and the cutting groove divides the ceramic package base assembly board into a plurality of the package base units.

9. The method for cutting a ceramic package base assembly plate according to claim 8, wherein: A plurality of welding terminals are provided at the bottom of the package base unit, and at most only one of the plurality of welding terminals is connected to the electroplating main flow wiring through the electroplating branch flow wiring.

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