Package having clip directly connected to strip-shaped electrical connection element extending along mounting base

Abstract

An electronic device includes a mounting base, a strip-shaped electrical connection element, and a package mounted on the mounting base, the package including a carrier, an electronic component mounted on the carrier, an encapsulation material at least partially encapsulating the carrier and the electronic component, and a clip connected to an upper major surface of the electronic component, and an encapsulation material partially encapsulating the clip such that an exposed surface of the clip is in direct electrical connection with the strip-shaped electrical connection element such that the strip-shaped electrical connection element extends along at least a portion of the mounting base for conducting electricity from or to the clip, the strip-shaped electrical connection element is electrically connected directly horizontally on the exposed surface of the clip.

Description

Technical Field

[0001] Various embodiments generally relate to an electronic device and a method of manufacturing an electronic device. Background Art

[0002] A package may refer to an encapsulated electronic component having electrical connections extending out of the encapsulation material and mounted to an electronic peripheral, such as a printed circuit board.

[0003] Packaging cost is an important driver for the industry. Related to this are performance, size and reliability. Different packaging solutions are diverse and must meet the needs of the application. In particular, overheating of the package during operation may reduce the reliability and performance of the package. Summary of the invention

[0004] It may be desirable to provide an electronic device having high electrical performance and thermal reliability.

[0005] According to an exemplary embodiment, an electronic device is provided, which includes a mounting base, a strip-shaped electrical connection element, and a package mounted on the mounting base, the package including a carrier, an electronic component mounted on the carrier, an encapsulation material at least partially encapsulating the carrier and the electronic component, and a clip connected to the upper main surface of the electronic component, wherein the strip-shaped electrical connection element is directly electrically connected to the top of the clip so as to extend along at least a portion of the mounting base for conducting electricity from or to the clip.

[0006] According to another exemplary embodiment, a method for manufacturing an electronic device is provided, wherein the method includes forming a package by mounting an electronic component on a carrier, at least partially encapsulating the carrier and the electronic component with an encapsulation material, and connecting a clip to an upper main surface of the electronic component, mounting the package on a mounting base, and electrically connecting a strip-shaped electrical connection element directly on top of the clip so as to extend along at least a portion of the mounting base for conducting electricity from or to the clip.

[0007] According to an exemplary embodiment, an electronic device is composed of a mounting base and a package mounted thereon, wherein the package is connected by a strip-shaped electrical connection element. The package may include a carrier and an electronic component mounted thereon, wherein an encapsulation material encapsulates the carrier and the electronic component. A clip is connected to the top side of the electronic component. Advantageously, the strip-shaped electrical connection element can be directly electrically coupled (i.e., without an electronic component in between) on the top of the clip. The coupling can be implemented so that the strip-shaped electrical connection element extends along the mounting base and at least in a section vertically spaced apart relative to the mounting base, for conducting electricity from the clip and / or conducting electricity to the clip. It has been found that the configuration of the direct connection between the top-side package clip and the strip-shaped electrical connection element extending along the mounting base described provides excellent temperature, thereby allowing the electronic device to be operated at a higher power level. Surprisingly, the thermal reliability and power performance of the described configuration can even be better than using a block connector on the top of the clip. Therefore, a package-based electronic device with excellent electrical and thermal reliability and excellent performance can be obtained, which can even be used for high current power applications. In cases where moderate cooling is sufficient, a separate heat sink may even be dispensed with.

[0008] Description of Further Exemplary Embodiments

[0009] In the following, further exemplary embodiments of the electronic device and the method will be explained.

[0010] In the context of the present application, the term "electronic device" may particularly denote a device comprising at least one package mounted on a mounting base and electrically interconnected by at least one strip-shaped electrical connection element. Optionally, the electronic device may include one or more additional electronic components. For example, the electronic device may be a motor controller for an electric motor, may include an electric motor with a motor controller, or may be an electric vehicle with such an electric motor or motor controller.

[0011] In the context of the present application, the term "mounting base" may particularly denote a support on which a package may be mounted. For example, such a mounting base may be a printed circuit board (PCB), or another preferably plate-shaped electronic board.

[0012] In the context of the present application, the term "package" may particularly denote an arrangement that may include electronic components mounted on a carrier, wherein the carrier may include or consist of a single component, a plurality of components joined via an encapsulation or other package components, or a subassembly of the carrier. The components of the package may be at least partially encapsulated by an encapsulation material. It is also possible that one or more clips as conductive interconnects may be implemented in the package, for example for electrically coupling the electronic component to the carrier and / or to an electronic peripheral. Furthermore, the clips may be at least partially encapsulated.

[0013] In the context of the present application, the term "electronic component" may particularly include semiconductor chips (particularly power semiconductor chips), active electronic devices (such as transistors), passive electronic devices (such as capacitors or inductors or ohmic resistors), sensors (such as microphones, light sensors or gas sensors), luminous, semiconductor-based devices (such as light-emitting diodes (LEDs) or lasers), actuators (such as loudspeakers) and micro-electromechanical systems (MEMS). In particular, the electronic component may be a semiconductor chip having at least one integrated circuit element (such as a diode or a transistor) in its surface portion. The electronic component may be a bare die or may have been packaged or encapsulated. The semiconductor chip implemented according to the exemplary embodiment may be formed, for example, with silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0014] In the context of the present application, the term "carrier" may particularly refer to a support structure (which may be at least partially conductive) that serves as a mechanical support for the electronic components to be mounted thereon, and that may also contribute to the electrical interconnection between the electronic components and the periphery of the package. In other words, the carrier may perform both a mechanical support function and an electrical connection function. The carrier may include or consist of a single component, a plurality of components joined via an encapsulation or other package components, or a subassembly of the carrier. When the carrier forms part of a lead frame, the carrier may be or may include a die pad.

[0015] In the context of the present application, the term "encapsulation material" may particularly denote a substantially electrically insulating material surrounding at least a portion of the electronic component and at least a portion of the carrier to provide mechanical protection, electrical insulation and optionally a contribution to heat dissipation during operation. In particular, the encapsulation material may be a molding compound. The molding compound may comprise a matrix of a flowable and hardenable material and filler particles embedded therein. For example, the filler particles may be used to adjust the properties of the molded component, in particular to enhance thermal conductivity.

[0016] In the context of the present application, the term "clip" may particularly denote an electrically conductive plate structure for connection to an electronic component and optionally also to a carrier. More specifically, the clip may be a three-dimensionally curved plate-type connecting element having two flat sections for connection to the upper main surface of a corresponding electronic component. The upper main surface of the clip may be connected to a carrier.

[0017] In the context of the present application, the term "strip-shaped electrical connection element" may particularly denote an elongated or long element that may be at least partially made of a conductive material. The size of the strip-shaped electrical connection element in one direction or extension may be greater than the size in a direction or extension perpendicular to the maximum dimension. For example, the maximum dimension may be at least three times or at least five times the size in the vertical direction or extension. For example, the strip-shaped electrical connection element may extend straight, for example when implemented as a metal strip. However, the strip-shaped electrical connection element may also be curved, for example when implemented as a cable. The extension of the strip-shaped electrical connection element may be substantially or completely horizontal. For example, the strip-shaped electrical connection element may extend substantially or completely parallel to the main surface of the mounting base with its maximum dimension, and the mounting base may be plate-shaped. When the strip-shaped electrical connection element is in a straight configuration, the ratio between the length of the strip-shaped electrical connection element in a plane perpendicular to the length direction and the maximum diameter may be at least 3, in particular at least 5, for example at least 10.

[0018] In the context of the present application, the term "connecting the strip-shaped electrical connection element directly on top of the clip so as to extend along at least a portion of the mounting base for conducting electricity from or to the clip" may particularly mean that the strip-shaped electrical connection element may be electrically coupled to the clip without other intermediate electronic components between the strip-shaped electrical connection element and the clip. For example, the strip-shaped electrical connection element may be directly connected to the clip by soldering, sintering, conductive glue or by a direct metal-metal connection (e.g. formed by a hybrid connection). Thus, either no material at all (e.g. in the case of a hybrid connection) or only a conductive connection medium (e.g. a solder structure, a sintering paste or a conductive glue) may be arranged between the clip and the strip-shaped electrical connection element. The direct connection between the clip and the strip-shaped electrical connection element may be achieved such that the strip-shaped electrical connection element extends completely or substantially along the extension of the mounting base, for example completely or substantially horizontally instead of vertically.

[0019] In one embodiment, the strip-shaped electrical connection element is electrically connected horizontally directly to the clip. Thus, the strip-shaped electrical connection element can extend horizontally from at least a portion of the clip and along at least a portion of the clip, at least in the connection area between the strip-shaped electrical connection element and the clip, and optionally also horizontally along the mounting base. Thus, the strip-shaped electrical connection element can extend horizontally or at least substantially horizontally forward directly from the connection area with the clip. This design is in contrast to a block connector that protrudes vertically from the clip. The thermal reliability and power performance of the electronic device can be greatly enhanced by the direct horizontal connection of the strip-shaped connection element extending from the clip.

[0020] In one embodiment, the strip-shaped electrical connection element is electrically connected to the clip via one of the group consisting of a solder connection, a sintering connection and a glue connection. More generally, the strip-shaped electrical connection element may be electrically connected to the clip directly and only via a conductive connection structure (i.e., solder, sintering or conductive glue). However, no additional electronic components may be provided between the strip-shaped electrical connection element and the clip in order to maintain a short electrical path and efficient heat dissipation.

[0021] In one embodiment, the strip-shaped electrical connection element comprises a cable and / or a metal sheet (eg a metal ribbon).

[0022] In one embodiment, the strip-shaped electrical connection element comprises or consists of a cable. Such a cable may have a conductive core surrounded by an electrically insulating sheath. Alternatively, the cable may consist of conductive wires or filaments. Such a cable may extend substantially horizontally along the mounting base, or may be bent in at least one section of the mounting base.

[0023] In one embodiment, the strip-shaped electrical connection element comprises a metal sheet, such as a metal strip. Such a metal sheet may be flat or planar. The metal sheet may extend horizontally. For example, the metal sheet may be a metal strip or a metal plate. Optionally, the metal sheet may be provided with an electrically insulating structure. Very high currents may be transmitted in a low-ohmic manner via the metal sheet. The planar geometry of the metal sheet is fully compatible with a direct horizontal electrical connection to the planar top main surface of the clip.

[0024] In one embodiment, the electronic device includes a cable electrically connected to the metal sheet. The connection between the cable and the metal sheet can be direct (i.e., no electronic components in between) or indirect (i.e., with additional electronic components, such as a block connector in between). Thus, even the cable-to-metal sheet connection can extend laterally or completely along the surface of the mounting base to provide electrical coupling of the top side of the clip.

[0025] In one embodiment, the electronic device comprises a conductive block connector electrically connecting the cable to the metal sheet, the conductive block connector electrically connecting the cable to the metal sheet, for example by means of a thread. The block connector is arranged to be spatially separated from the package. In the context of the present application, the term "block connector" may particularly denote a solid (and preferably bulky) conductive block for electrically connecting the package to the electronic environment via a strip-shaped connecting element. In particular, the block connector may be a three-dimensional body, whose volume is larger than the volume of the package (i.e., the package body including the carrier, the electronic components, the encapsulation material and the clip), in particular, whose volume is at least three times the volume of the package. Such a block connector may be configured for high current applications, such as those that may occur in power semiconductor technology. In particular, the block connector may consist only of conductive material, in particular metal material.

[0026] In one embodiment, the conductive block connector is mounted on and extends vertically from the mounting base. Thus, the conductive block connector can be arranged to be spatially separated from the package. Both the package and the conductive block connector can be mounted on the same, preferably flat, mounting base and can extend horizontally from the same vertical base.

[0027] In one embodiment, the conductive block connector is a metal block, in particular a cylindrical metal block. The conductive block connector may include fastening means for fastening sheets and / or cables thereon and / or therein. For example, such fastening tasks may be performed using fastening elements that operate together with the conductive block connector for fastening. For example, such fastening elements may be, for example, screws, bolts or nails.

[0028] In one embodiment, the cable is directly electrically connected to the metal sheet, for example, by means of a thread. Thus, the mentioned connection can be established by screwing a screw into a recess of a conductive block connector having an internal thread.

[0029] In one embodiment, the electronic device comprises at least one additional package having the above-mentioned features mounted on the mounting base, for example two additional packages or five additional packages, and at least one additional strip-shaped electrical connection element, the at least one additional strip-shaped electrical connection element being directly electrically connected to the top of at least one additional clip of the at least one additional package so as to extend along at least a portion of the mounting base for conducting electricity from or to the at least one additional clip. This embodiment is Figures 3 to 8. Thus, in particular, three packages or six packages can be mounted on the same mounting base. All of the packages can be mounted on the same mounting base, wherein there is a direct connection between the respective clips and the respective strip-shaped electrical connection elements. Three such packages on the mounting base can form three half-bridges, each half-bridge corresponding to a respective phase of the three-phase motor. Six such packages on the mounting base can form six half-bridges, making it possible to connect the half-bridges of the three-phase motor in parallel. The described configuration allows to perform motor control with excellent cooling performance, thus enabling the motor to be operated at high power levels.

[0030] In one embodiment, the electronic device comprises an electric motor electrically coupled to the package, for example to the strip-shaped electrical connection element. For example, the package connected as described above can be coupled to the motor in a low-ohmic manner without the risk of hot spots. Such a motor can be implemented in an electric car, which can be an example of an electronic device according to an exemplary embodiment.

[0031] In one embodiment, the encapsulation material only partially encapsulates the clip, so that the exposed surface of the clip is directly electrically connected to the strip-shaped electrical connection element. Thus, the clip can be partially encapsulated and partially exposed. The exposed portion of the upper main surface of the clip can be used partially for direct connection to the strip-shaped electrical connection element and partially for cooling. Therefore, the exposed portion of the clip that is not directly connected to the strip-shaped electrical connection element can be used to efficiently dissipate the heat generated by the electronic components during operation of the electronic device. In embodiments with moderate power requirements, this configuration can even be suitable for sufficient cooling without the need for additional cooling structures or heat sinks.

[0032] In one embodiment, the electronic device comprises a cooling structure, which can also be denoted as a heat sink. In particular, such a cooling structure can comprise a base body having a plurality of cooling fins extending therefrom. However, other embodiments are also possible, such as a liquid cooling structure for cooling using a liquid coolant such as water. For example, the cooling structure can be arranged directly on the strip-shaped electrical connection element. The cooling structure can also be arranged at least partially directly on the exposed surface of the clip. These measures can achieve efficient cooling.

[0033] In one embodiment, the electronic device comprises an electrically insulating thermal interface material (TIM) between the cooling structure on the one hand and the strip-shaped electrical connection element and / or the clip on the other hand. The cooling structure or heat sink may be a heat sink, which may be made of a highly thermally conductive material such as copper or aluminum, and which may be attached to the exposed surface of the clip and / or the strip-shaped electrical connection element via a thermal interface material (TIM). The thermal interface material may be electrically insulating and thermally conductive to facilitate electrical protection and thermal coupling.

[0034] In one embodiment, the electronic device includes a protective structure, which clamps the package body and the strip-shaped electrical connection element together to protect the strip-shaped electrical connection element from being torn off. When the strip-shaped electrical connection element (which may be a tiny structure, such as a cable) is directly connected (for example, by welding) to the exposed metal surface of the clip, there may be a risk that the strip-shaped electrical connection element is torn off unexpectedly, which may damage and lose the electrical function of the electronic device. In order to reliably prevent this situation, the protective structure may clamp the package body and the strip-shaped electrical connection element together, so that the risk of being torn off unexpectedly can be reduced or completely eliminated. Advantageously, the protective structure may have a connecting plate for pressing the strip-shaped electrical connection element and the package body together, and may have a leg connected to the connecting plate for connecting the protective structure to the mounting base.

[0035] In one embodiment, the method comprises electrically connecting the strip-shaped electrical connection element so as to extend horizontally directly from the clip. According to such a preferred embodiment, the strip-shaped electrical connection element can extend completely horizontally and parallel to the mounting base at least in its end section of connection extending from the clip. This can achieve a compact design and a short electrical connection path in the vertical direction, thereby achieving low electrical losses. In a preferred embodiment, the strip-shaped electrical connection element extends substantially or completely horizontally along its entire extension and extends substantially or completely parallel to the mounting base.

[0036] In one embodiment, the method comprises electrically connecting the strip-shaped electrical connection element to the clip by one of the group consisting of welding, sintering and gluing. For example, welding can be accomplished by a solder structure, such as a solder bump or a diffusion solder film on the clip and / or the strip-shaped electrical connection element. Sintering can be performed using a sintering paste applied between the clip and the strip-shaped electrical connection element. For example, a conductive glue including conductive particles in an adhesive matrix can be arranged between the clip and the strip-shaped electrical connection element to establish a conductive glue connection. However, the clip and the strip-shaped electrical connection element can also be connected to each other by a direct metal-metal connection, such as by a hybrid connection (e.g. as a copper-copper interface).

[0037] In one embodiment, the electronic components are semiconductor dies, in particular identical semiconductor dies. Preferably, both electronic components can be transistor chips. In one embodiment, each of the semiconductor dies comprises an integrated transistor, in particular a field effect transistor. More specifically, each semiconductor die can comprise a metal oxide semiconductor field effect transistor (MOSFET).

[0038] In one embodiment, the electronic component is configured and connected to provide a half-bridge function. In the context of the present application, the term "half-bridge" can particularly refer to a circuit consisting of an upper transistor switch ("high side") and a lower transistor switch ("low side"). For example, the transistor can be a MOSFET, i.e. a metal oxide semiconductor field effect transistor. The transistor can be connected in a common source and common gate arrangement. By applying a corresponding voltage waveform at each of the control (especially gate) terminals, the two transistor switches can be turned on and off complementary to each other (especially with non-overlapping dead time). The desired result can be a square wave voltage at the midpoint of the switch between a first potential (such as a DC bus voltage) and a second potential (such as ground). The two transistors can be interconnected by interconnecting their connection terminals (especially source terminals and drain terminals) so that a switch based on two transistors with a diode characteristic achieved can be obtained. The mentioned half-bridge configuration can be used as such or alone, or can be combined with one or more additional half-bridges (or other circuits) to achieve more complex electrical functions. For example, two such half-bridges can form a full bridge. The inverter can also be constructed based on a half-bridge.

[0039] In one embodiment, the carrier comprises a lead frame or a thermally conductive and electrically insulating sheet covered with an electrically conductive layer on two opposite main surfaces. For example, such a carrier can be a lead frame type structure (e.g. made of copper). In another embodiment, the carrier (instead of being implemented as a metal plate section of a lead frame as described above) comprises a stack consisting of a central electrically insulating and thermally conductive layer (e.g. a ceramic layer) covered with a corresponding electrically conductive layer (e.g. a copper layer or an aluminum layer, wherein the corresponding electrically conductive layer can be a continuous or patterned layer) on two opposite main surfaces. In particular, the carrier can be implemented as a direct copper bonding (DCB) substrate, a direct aluminum bonding (DAB) substrate, an active metal brazing (AMB) substrate or an insulated metal substrate (IMS: Insulated Metal Substrate).

[0040] In one embodiment, the corresponding electronic component is configured as a power semiconductor chip. Therefore, the electronic component (e.g., a semiconductor chip) can be used for power applications in, for example, the automotive field, and can, for example, have at least one integrated insulated gate bipolar transistor (IGBT) and / or at least one transistor of another type (e.g., MOSFET, JFET, etc.) and / or at least one integrated diode. Such an integrated circuit element can, for example, be made with silicon technology or based on a wide bandgap semiconductor (e.g., silicon carbide). The semiconductor power chip may include one or more field effect transistors, diodes, inverter circuits, half bridges, full bridges, drivers, logic circuits, other devices, etc.

[0041] In one embodiment, the respective electronic component experiences a vertical current flow. The package architecture according to an exemplary embodiment is particularly suitable for high power applications in which a vertical current flow is desired, i.e. a current flow in a direction perpendicular to two opposite main surfaces of the electronic component, one of which is used for mounting the electronic component on the carrier.

[0042] As a substrate or wafer forming the basis of the electronic component, a semiconductor substrate, preferably a silicon substrate, can be used. Alternatively, a silicon oxide or another insulator substrate can be provided. A germanium substrate or a III-V semiconductor material can also be implemented. For example, exemplary embodiments can be implemented with gallium nitride or silicon carbide technology.

[0043] For the encapsulation material, a molding compound may be used. Such a molding compound may be provided with filler particles, for example by enhancing thermal conductivity. Possibly, the encapsulation material is a plastic-like material or a ceramic material which may be aided by encapsulation material additives such as filler particles, additional resins or other materials may be used.

[0044] In addition, exemplary embodiments may utilize standard semiconductor processing techniques, such as appropriate etching techniques (including isotropic and anisotropic etching techniques, in particular plasma etching, dry etching, wet etching), patterning techniques (which may involve photolithography masks), deposition techniques (such as chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), sputtering, etc.).

[0045] The above and other objects, features and advantages will become apparent from the following description and appended claims taken in conjunction with the accompanying drawings in which like parts or elements are designated by like reference numerals. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings, which are included to provide a further understanding of exemplary embodiments and constitute a part of this specification, illustrate exemplary embodiments.

[0047] In the attached picture:

[0048] Figure 1 A three-dimensional exploded view of components of a package of an electronic device according to an exemplary embodiment is shown.

[0049] Figure 2 A cross-sectional view of an electronic device according to an exemplary embodiment is shown.

[0050] Figure 3 A top view of an electronic device according to an exemplary embodiment is shown.

[0051] Figure 4 A top view of an electronic device according to another exemplary embodiment is shown.

[0052] Figure 5 A top view of an electronic device according to another exemplary embodiment is shown.

[0053] Figure 6 A top view of an electronic device according to another exemplary embodiment is shown.

[0054] Figure 7 A top view of an electronic device according to another exemplary embodiment is shown.

[0055] Figure 8 A top view of an electronic device according to another exemplary embodiment is shown.

[0056] Fig. 9 A top view of a cooling structure and thermal interface material of an electronic device according to an exemplary embodiment is shown.

[0057] Fig.10 A top view of an electronic device having a cooling structure and a thermal interface material according to an exemplary embodiment is shown.

[0058] Fig.11 A cross-sectional view of an electronic device having a protection structure according to another exemplary embodiment is shown.

[0059] Fig.12 A top view of an electronic device having a protection structure according to another exemplary embodiment is shown. DETAILED DESCRIPTION

[0060] The illustrations in the drawings are schematic and not to scale.

[0061] Before the exemplary embodiments will be described in more detail with reference to the accompanying drawings, some general considerations will be outlined based on the exemplary embodiments that have been developed.

[0062] According to an exemplary embodiment, an electronic device (for example, implemented as a motor control device) is provided, which includes a mounting base (for example, a PCB) located on the bottom side. The package can be assembled to the mounting base, for example, it can be configured as a surface mounting device. The package can include an at least partially conductive carrier (for example, a chip carrier, such as a lead frame structure), and two or more electronic components (preferably field effect transistor semiconductor chips) are mounted on the carrier. The encapsulation material (for example, a molding compound) partially or completely encapsulates the carrier and the electronic components for electrical and mechanical protection of the electronic components. A clip that can be a structured and / or curved metal plate or can include two or more such structures can be connected to the top side of the electronic component so as to be at least partially exposed outside the encapsulation material. Advantageously, a strip-shaped electrical connection element (for example, a cable, a metal strip, etc.) is directly electrically connected (for example, welded) on the top of the clip. Therefore, the strip-shaped electrical connection element that can carry current can be arranged to extend along the mounting base or a portion thereof. It has been proven that this configuration has excellent characteristics in terms of thermal performance and can therefore operate with very high electrical power. Alternatively, the corresponding electronic device can be operated with the same power, but with a reduced cooling effort.A combination of both approaches is also possible.

[0063] More specifically, the package may be configured as a surface mounted device (SMD) half bridge (resulting from the corresponding connection of two electronic components configured as transistor semiconductor chips). Such a package may be equipped with a solderable top side clip for direct phase node cable connection. The direct connection may be established between an exposed clip on the top side of the package and a cable or other type of strip-shaped electrical connection element. The extension of the strip-shaped electrical connection element may be more horizontal than vertical, preferably substantially or completely horizontal.

[0064] Preferably, the package can be configured with electronic components that form an integrated half-bridge with vertical current. For example, the corresponding component can be a semiconductor chip having a drain terminal on one main surface and a source terminal and a gate terminal on the opposite other main surface. The electronic device according to the exemplary embodiment can be configured according to a low-power drive application. The exemplary embodiment can improve system efficiency, such as improving the system efficiency of a motor inverter. In addition, the electronic device according to an exemplary embodiment can increase power density. In particular, the package and phase node connection in the electronic device can allow the vertical current in the package to be managed when the system output power is significantly increased (for example, up to 30% compared to conventional methods). Therefore, the heat sink can be omitted in some embodiments to reduce the manufacturing workload and reduce the size of the electronic device. In particular, higher output power can increase power density. Through this increase, efficiency and improvement of thermal reliability and a smaller mounting base (such as a PCB) can be made possible, which can further reduce the space consumption and manufacturing workload of the electronic device. Lower losses can make the MOSFET operating temperature lower during operation of the electronic device. In battery-powered systems, such as electric vehicles, lower power losses may also result in longer battery life.

[0065] According to an exemplary embodiment, a surface mount device type half-bridge package can be provided with an exposed and weldable phase node. The connection can be achieved by directly welded cables or by welded metal sheets, which can be attached to the phase node cables via surface mount device type block connectors. For example, this configuration can be used for a brushed DC configuration of a single half-bridge. Exemplary embodiments of brushless single-phase DC motors (e.g., in an H-bridge configuration) can also be used. This can enable better placement of DC bus capacitors with reduced loop inductance (see reference numeral 198 below).

[0066] Figure 1 A three-dimensional exploded view of components of package 100 of electronic device 150 is shown according to an exemplary embodiment. Figure 2 1 shows a corresponding cross-sectional view of an electronic device 150 having such a package 100 according to an exemplary embodiment. Figure 2 The electronic device 150 shown in FIG. 1 is used to control a motor of an electric vehicle, for example (see FIG. Figure 3 A portion of a motor controller (reference numeral 162 in the figure).

[0067] The electronic device 150 shown includes a plate-like mounting base 152, which can be, for example, a printed circuit board (PCB). The mounting base 152 is electrically and mechanically connected to the package body 100, which is surface-mounted on the mounting base 152. A horizontally extending strip-shaped electrical connection element 154 is mounted on the top of the package body 100 and extends at least partially parallel to the horizontal mounting plane of the mounting base 152. For example, the strip-shaped electrical connection element 154 can include or be composed of a cable 156 and / or a metal sheet 158.

[0068] The package 100 shown includes a lead frame type carrier 102. In other words, the carrier 102 may be a structured copper plate. Figure 2 The solder bumps 180 (or other conductive connection structures) establish a mechanical connection and electrical coupling between the carrier 102 exposed at the bottom side of the package body 100 and the pads (not shown) on the top of the mounting base 152 .

[0069] Two thin electronic components 104 are mounted on the carrier 102 by soldering, see Figure 1 and Figure 2 104 is a semiconductor power chip having a monolithically integrated field effect transistor. More specifically, the electronic component 104 may be a MOSFET chip, one arranged in a top-side manner and the other arranged in a bottom-side manner. Each of the electronic components 104 may have a main surface with a drain terminal 170 and another main surface opposite to the gate terminal 172 and the source terminal 174. In one of the electronic components 104, the drain terminal 170 is oriented upward to face away from the carrier 102, wherein the gate terminal 172 and the source terminal 174 are oriented downward to face the carrier 102. In another of the electronic components 104, the drain terminal 170 is oriented downward to face the carrier 102, wherein the gate terminal 172 and the source terminal 174 are oriented upward to face away from the carrier 102. Thus, the electronic component 104 is configured as a field effect transistor chip and may have a drain terminal 170 on one main surface and a source terminal 174 and a gate terminal 172 on the other main surface. Current may flow vertically through the respective electronic component 104. Two electronic components 104 may be interconnected to form a half bridge. The electronic component 104 may be implemented as two identical semiconductor dies, but may also be implemented as semiconductor dies with different characteristics.

[0070] Furthermore, the package 100 comprises a clip 110 connected (e.g. by soldering) to the electronic component 104 and the upper main surface of the carrier 102, see solder structure 184 (which may be replaced by other conductive connection structures). The clip 110 may be a plate-shaped (and, for example, three-dimensionally curved) metal member configured to contact the terminals of the electronic component 104 at the upper main surface of the electronic component 104, and configured to contact the metal surface of the upper side of the carrier 102. More specifically, the clip 110 shown has a horizontal plate section 176 coupled to the upper main surface of the electronic component 104. Furthermore, the clip 110 shown has a vertical section 178 connected (e.g. integrally connected) to the horizontal plate section 176 for establishing an electrical connection with the carrier 102.

[0071] The encapsulation material 106, which is implemented here as a molding compound, partially encapsulates the carrier 102 and encapsulates the electronic component 104. Furthermore, the encapsulation material 106 partially encapsulates the clip 110 in such a way that the upper main surface of the clip 110 remains exposed relative to the encapsulation material 106. The exposed surface of the clip 110 is directly electrically connected to the strip-shaped electrical connection element 154 via the solder structure 186.

[0072] Thus, the strip-shaped electrical connection element 154 is electrically connected directly to the top of the exposed clip 110 through the solder structure 186 (which may be replaced by another conductive connection structure), so that the strip-shaped electrical connection element 154 extends for conducting electricity from the clip 110 along the mounting base 152. Figure 1 and Figure 2 , the strip-shaped electrical connection element 154 extends horizontally and is parallel to the horizontal plane of the plate-shaped mounting base 152. In particular, the strip-shaped electrical connection element 154 is electrically connected directly and horizontally to the clip 110. As shown in the figure, the encapsulation material 106 only partially encapsulates the clip 110 and only partially encapsulates the carrier 102. In contrast, the encapsulation material 106 completely encapsulates the electronic component 104. Therefore, the electronic component 104 is mechanically and electrically protected from impacts from the environment. The carrier 102 is exposed to establish an electrical connection with the mounting base 152 and for bottom-side cooling. The clip 110 is exposed to establish an electrical connection with the strip-shaped electrical connection element 154 and for top-side cooling.

[0073] Excellent thermal reliability can be achieved by exposing the upper major surface of clip 110 outside encapsulation material 106 and directly connecting horizontally with strip-shaped electrical connection elements 154. Therefore, electronic device 150 can operate at higher power and / or can reduce cooling workload (e.g., by optionally omitting a heat sink).

[0074] Any of the conductive connection structures described above with reference to reference numerals 180, 182, 184, 186 may be, for example, a solder connection, a sintering connection, and / or a conductive glue connection. Alternatively, when the corresponding conductive members are connected to each other by a direct metal-to-metal connection technique, such as by a hybrid connection, the conductive connection structures described above with reference to reference numerals 180, 182, 184, 186 may also be omitted.

[0075] Figure 3 A top view of an electronic device 150 is shown according to an exemplary embodiment.

[0076] according to Figure 3 , three packages 100 may be mounted on a mounting base 152, which may be a PCB. Each of the packages 100 may be, for example, as described above with reference to Figure 1 and Figure 2 From each of the packages 100, a corresponding strip-shaped electrical connection element 154, implemented here as a cable 156, extends directly from the solder connection to the exposed clip 110 along the mounting base 152 (e.g. horizontally). The three strip-shaped electrical connection elements 154 can be connected to the motor 162. The three half bridges provided by the three packages 100 can correspond to the three phases of the three-phase motor 162. Therefore, Figure 3 The electrical connections U1, V1, W1 shown in the figure relate to a three-phase node connection. Each of the three packages 100 is connected to two DC power terminals 188, 190 on the mounting base 152, and the two DC power terminals 188, 190 can be connected to the positive pole ("+") and negative pole ("-") of a DC power source such as a battery (not shown), respectively, for supplying power to the motor 162. In addition, one or more passive components 198 (such as capacitors) can also be surface mounted on the mounting base 152.

[0077] therefore, Figure 3 A PCB type mounting base 152 is shown with a scalable half bridge type package 100 having exposed clips 110 directly soldered with cable type strip electrical connection elements 154. Thus, a half bridge with solderable exposed phase node pads and directly soldered cables can be provided.

[0078] Figure 4 A top view of an electronic device 150 is shown according to another exemplary embodiment.

[0079] Figure 4 Examples and Figure 3 The embodiments of Figure 4, the strip-shaped electrical connection element 154 is implemented as a strip-shaped metal sheet 158 ​​coupled to a block connector 160. In addition, a corresponding cable 156 is provided, which is electrically connected to the assigned metal sheet 158. The coupling can be achieved by a corresponding conductive block connector 160, which is surface-mounted on the mounting base 152 to protrude vertically from the mounting base 152. Each corresponding block connector 160 electrically connects the corresponding cable 156 to the assigned metal sheet 158. For example, this can be achieved by screwing a screw (not shown) into a recess having an internal thread of the corresponding conductive block connector 160. The height of each block connector 160 can be significantly greater than the height of the corresponding package 100. Preferably, each block connector 160 can be implemented as a large cylindrical metal block that is separately arranged from the package 100.

[0080] in short, Figure 4 An embodiment provides a PCB type mounting base 152 with an expandable half-bridge type package 100, which has an exposed clip 110 directly soldered to a copper sheet type strip electrical connection element 154 that can be screwed into a block connector 160. Therefore, a half bridge with solderable exposed phase node pads and directly soldered metal sheets 158 can be provided. The metal sheets 158 can be attached to the corresponding phase node cables 156 via an SMD (surface mount device) type block connector 160. This can reduce the mechanical stress applied to the electronic device 150 and its component parts. In particular, the cable 156 can be reliably prevented from being accidentally torn off, which makes the electronic device 150 more robust.

[0081] Figure 5 A top view of an electronic device 150 is shown according to another exemplary embodiment.

[0082] Figure 5 Examples and Figure 3 The embodiments of Figure 5 , the strip-shaped electrical connection element 154 is implemented as a strip-shaped metal sheet 158. The cable 156 can be directly soldered to the metal sheet 158.

[0083] therefore, Figure 5 A PCB type mounting base 152 is shown with an expandable half-bridge type package 100 having exposed clips 110 directly soldered with metal sheet type strip electrical connection elements 154. Thus, a half bridge with solderable exposed phase node pads and directly soldered metal sheets 158 can be provided. The metal sheets 158 can be directly connected to the corresponding phase node cables. This can be done without the need for SMD (surface mount device) type block connectors, which makes the electronic device 150 more compact.

[0084] Figure 6 A top view of an electronic device 150 is shown according to another exemplary embodiment.

[0085] Figure 6 Examples and Figure 3 The embodiments of Figure 6 ,refer to Figure 3 Six packages 100 of the type described are surface mounted on mounting base 152 instead of three. Each of the electrical connections U1, V1, W1 is coupled to two packages 100. Thus, Figure 6 The embodiment is used for parallel connection of half bridges.

[0086] Figure 7 A top view of an electronic device 150 is shown according to another exemplary embodiment.

[0087] Figure 7 Examples and Figure 4 The embodiments of Figure 7 ,refer to Figure 4 Six packages 100 of the type described are surface mounted on mounting base 152 instead of three. Each of the electrical connections U1, V1, W1 is coupled to two packages 100. Thus, Figure 7 The embodiment is used for parallel connection of half bridges. Each half bridge is provided with solderable exposed phase node pads and soldered copper tabs 158, which are attached to the allocated phase node cables 156 via corresponding SMD connectors 160, and the phase node cables 156 can be directly soldered cables. This embodiment can help reduce mechanical stress.

[0088] Figure 8 A top view of an electronic device 150 is shown according to another exemplary embodiment.

[0089] Figure 8 Examples and Figure 5 The embodiments of Figure 8 ,refer to Figure 5 Six packages 100 of the type described are surface mounted on mounting base 152 instead of three. Each of the electrical connections U1, V1, W1 is coupled to two packages 100. Thus, Figure 8 The embodiment is used for parallel connection of half bridges.

[0090] Fig. 9 A top view of a cooling structure 114 and a thermal interface material 166 of an electronic device 150 is shown in accordance with an exemplary embodiment. Fig.10A top view of an electronic device 150 having such a cooling structure 114 and such a thermal interface material 166 is shown according to an exemplary embodiment.

[0091] exist Fig. 9 The cooling structure 114 shown separately in FIG. 1 may be configured, for example, with a plate-like base having a plurality of cooling fins extending therefrom. Fig. 9 An electrically insulating thermal interface material (TIM) 166 , shown separately in FIG. 1 , may be disposed between the cooling structure 114 and the corresponding package body 100 for providing dielectric protection and thermal coupling.

[0092] Reference now Fig.10 , the thermal interface material 166 can be directly arranged on the strip-shaped electrical connection element 154 and on the exposed clip 110. The cooling structure 114 can be attached to the thermal interface material 166 to provide a thermal coupling path from the strip-shaped electrical connection element 154 and the clip 110 through the thermal interface material 166 to the cooling structure 114. This ensures excellent thermal performance of the electronic device 150. The cooling structure 114 together with the exposed main surface of the carrier 102 can provide a heat sink for efficient double-sided cooling.

[0093] An arrangement having a cooling structure 114 and a thermal interface material 166 may be provided for Figures 1 to 8 Any one of the embodiments and may also be provided to Fig.10 and Fig.11 An embodiment of (wherein the cooling structure 114 and the thermal interface material 166 can be disposed on top of the protective structure 164).

[0094] In an alternative embodiment where compactness is a priority, the cooling structure 114 and thermal interface material 166 may also be omitted.

[0095] Fig.11 A cross-sectional view of an electronic device 150 having a protection structure 164 according to another exemplary embodiment is shown.

[0096] Fig.11 The package 100 is shown with a strip-shaped electrical connection element 154, which can be implemented as a cable 156 connected directly by soldering (or alternatively as a metal strip, Fig.11150). In particular, when the cable 156 is used, there may be a risk that the cable 156 is torn off the package 100 when the electronic device 150 is operated under harsh conditions. In order to improve the mechanical integrity of the electronic device 150, a protective structure 164 can be provided to clamp the package 100 and the strip-shaped electrical connection element 154 together. This can protect the strip-shaped electrical connection element 154 from being torn off. For example, the mechanical protective structure 164 can be implemented as a busbar made of copper, for example. More generally, the protective structure 164 can be made of metal or ceramic. In one embodiment, the protective structure 154 can be fixed to the mounting base 152, although this is optional.

[0097] Fig.11 Embodiments of the present invention provide a half-bridge based electronic device 150 with exposed phase node pads that can be soldered and an external protection clip for protecting directly soldered cables 156 to increase mechanical stability.

[0098] Fig.12 A top view of an electronic device 150 with a protective structure 164 is shown according to another exemplary embodiment. Fig.12 The embodiment corresponds to Figure 3 1, however, the cable 156 directly connected to the clip 110 is protected by a solder structure 186 having a protective structure 164, which may be, for example, as described in reference Fig.11 Implemented as described.

[0099] It should be noted that the term "comprising" does not exclude other elements or features, and "one" or "an" does not exclude a plurality. In addition, elements described in association with different embodiments may also be combined. It should also be noted that the reference numerals should not be interpreted as limiting the scope of the claims. In addition, the scope of the present application is not intended to be limited to the specific embodiments of the processes, machines, manufactures, material compositions, devices, methods and steps described in the specification. Therefore, the appended claims are intended to include these processes, machines, manufactures, material compositions, devices, methods or steps within their scope.

Claims

1. An electronic device (150), comprising: ● Mounting base (152); ● Strip-shaped electrical connection element (154); as well as ● A package (100) mounted on the mounting base (152), comprising: O Carrier (102); O an electronic component (104) mounted on the carrier (102); O an encapsulation material (106) at least partially encapsulating the carrier (102) and the electronic component (104); and O a clip (110) connected to an upper major surface of the electronic component (104); O wherein the encapsulating material (106) partially encapsulates the clip (110) so that an exposed surface of the clip (106) is directly electrically connected to the strip-shaped electrical connection element (154), so that the strip-shaped electrical connection element (154) extends along at least a portion of the mounting base (152) for conducting electricity from or to the clip (110); ● The strip-shaped electrical connection element (154) is electrically connected directly and horizontally to the exposed surface of the clip (110).

2. The electronic device (150) according to claim 1, wherein: The strip-shaped electrical connection element (154) is electrically connected to the clip (110) by one of the group consisting of a solder connection, a sintering connection and a gluing connection.

3. The electronic device (150) according to claim 1 or 2, wherein: The strip-shaped electrical connection element (154) includes a cable (156) or consists of a cable (156).

4. The electronic device (150) according to any one of claims 1 to 3, wherein: The strip-shaped electrical connection element (154) comprises a metal sheet (158), such as a metal strip.

5. The electronic device (150) according to claim 4, wherein: The electronic device (150) includes a cable (156) electrically connected to the metal sheet (158).

6. The electronic device (150) according to claim 5, wherein: The electronic device (150) includes a conductive block connector (160) that electrically connects the cable (156) to the metal sheet (158). The conductive block connector (160) electrically connects the cable (156) to the metal sheet (158) by, for example, threading.

7. The electronic device (150) according to claim 6, wherein: The conductive block connector (160) is mounted on the mounting base (152) and extends vertically from the mounting base (152).

8. The electronic device (150) according to claim 6 or 7, wherein: The conductive block connector (160) is a metal block, in particular a cylindrical metal block.

9. The electronic device (150) according to claim 5, wherein: The cable (156) is directly electrically connected to the metal sheet (158), for example, directly electrically connected to the metal sheet (158) by means of threads.

10. The electronic device (150) according to any one of claims 1 to 9, wherein: The electronic device (150) comprises: at least one further package (100) according to any one of claims 1 to 9 mounted on the mounting base (152), for example two further packages (100) or five further packages (100); and At least one additional strip-shaped electrical connection element (154) is directly electrically connected to the top of at least one additional clip (110) of the at least one additional package (100) so as to extend along at least a portion of the mounting base (152) for conducting electricity from or to the at least one additional clip (110).

11. The electronic device (150) according to any one of claims 1 to 10, wherein: The electronic device (150) includes a motor (162) electrically coupled to the package (100), for example, a motor (162) electrically coupled to the strip-shaped electrical connection element (154).

12. The electronic device (150) according to any one of claims 1 to 11, wherein: The electronic device (150) comprises a cooling structure (114), which has, for example, a base body with a plurality of cooling fins extending therefrom, and is arranged directly on the strip-shaped electrical connection element (154) and / or on the clip (110).

13. The electronic device (150) according to claim 12, wherein: The electronic device (150) comprises an electrically insulating thermal interface material (166) between the cooling structure (114) on the one hand and the strip-shaped electrical connection element (154) and / or the clip (110) on the other hand.

14. The electronic device (150) according to any one of claims 1 to 13, wherein: The electronic device (150) comprises a protection structure (164) for clamping the package (100) and the strip-shaped electrical connection element (154) together to protect the strip-shaped electrical connection element (154) from being torn off.

15. The electronic device (150) according to any one of claims 1 to 14, wherein: The electronic device (150) includes at least one of the following features: The electronic components (104) are semiconductor dies, such as identical semiconductor dies; Each of the electronic components (104) comprises an integrated transistor, such as a field effect transistor; The electronic components (104) are configured and connected to provide a half-bridge function; The clip (110) is connected to the upper major surface of the carrier (102).

16. A method of manufacturing an electronic device (150), the method comprising: ● The package (100) is formed by: O Mounting the electronic component (104) on the carrier (102); O at least partially encapsulating the carrier (102) and the electronic component (104) by an encapsulation material (106); and O attaching a clip (110) to an upper major surface of the electronic component (104); ● Mounting the package (100) on a mounting base (152); ● Partially encapsulating the clip (110) such that a top surface of the clip (110) is exposed; as well as ● directly electrically connecting a strip-shaped electrical connection element (154) to the top surface of the clip (110), so as to extend along at least a portion of the mounting base (152) so as to extend directly horizontally from the clip (110) for conducting electricity from or to the clip (110).

17. The method according to claim 16, wherein: The method includes electrically connecting the strip-shaped electrical connection element (154) to the clip (110) by one of the group consisting of welding, sintering and gluing.

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