Automatic character resistance welding method

Abstract

The invention discloses an automatic character resistance welding method, and belongs to the technical field of printed circuit board manufacturing. The automatic character resistance welding method comprises the following steps: step 1, entering a WI P storage location; step 2, AGV transfer; step 3, cleaning and coarsening the PCB; step 4, printing a solder mask layer; step 5, exposing; 6, removing the printing ink; step 7, carrying out AVI inspection; 8, spraying characters; step 9, automatically collecting the plates; and 10, AGV transfer is carried out. Through a series of automatic steps of automatic scanning, cleaning and roughening treatment, solder mask printing, exposure, ink treatment, AVI inspection, character spraying and the like, automation and standardization of the production process are achieved, the production efficiency, the product quality and the consistency are improved, the labor cost and the material loss are reduced, meanwhile, real-time monitoring and data recording are achieved, and the production efficiency is improved. The safety of a production site is enhanced, the processing flow of the PCB is comprehensively optimized, and the production efficiency and the quality are promoted to be remarkably improved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to an automatic solder resist character method. Background Art

[0002] Solder mask character processing refers to the process of forming characters or logos in specific areas by coating solder mask on the surface of PCB during the manufacturing process of printed circuit boards. Its purpose is to form specific characters on the surface of PCB for marking, identification or guiding subsequent operations on the circuit board.

[0003] In the prior art, the technical process of PCB solder mask character processing is still in a manual operation state. However, manual operation is easily interfered by human factors, resulting in fluctuations in product quality. In addition, the operation speed is slow and cannot meet high-output requirements, limiting the improvement of overall production efficiency. Summary of the invention

[0004] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an automatic solder mask character method, which can realize the intelligent and automated manufacturing and production of PCB solder mask character processing flow and improve production efficiency.

[0005] According to some embodiments of the present invention, the automatic solder mask character method includes: step 1: placing a PCB board into a WIP warehouse;

[0006] Step 2: AGV takes out the PCB board from the WIP warehouse, transports the PCB board to the automatic board placement station, and scans the PCB board;

[0007] Step 3: Clean and roughen the PCB board;

[0008] Step 4: Scan the PCB board and print the solder mask on the PCB board according to the system preset formula requirements;

[0009] Step 5: Scan the PCB board and expose the pattern on the PCB board according to the system preset recipe requirements;

[0010] Step 6: Scan the PCB board and remove the unexposed ink on the PCB board according to the system preset formula requirements, and retain the exposed ink pattern;

[0011] Step 7: Scan the PCB board, prepare AVI inspection data according to the system preset formula requirements, and check the AVI inspection data with the appearance of the PCB board;

[0012] Step 8: Scan the PCB board and spray the pre-designed characters on the surface of the PCB board according to the system preset formula requirements;

[0013] Step 9: Scan the PCB board and automatically collect the PCB board according to the system preset formula requirements;

[0014] Step 10: The AGV takes the PCB board from the transport pallet and transports the PCB board to the WIP storage location.

[0015] The automatic solder mask character method according to the embodiment of the present invention has at least the following beneficial effects: by placing the PCB board in the WIP storage position, AGV taking the board to the automatic workstation for scanning, cleaning, printing, exposure, ink processing, AVI inspection, character spraying and automatic board collection and a series of other steps, the automation and standardization of the production process are realized, the production efficiency, product quality and consistency are improved, the labor cost and material loss are reduced, and at the same time, real-time monitoring and data recording are realized, the safety of the production site is enhanced, the processing flow of the PCB board is comprehensively optimized, and a significant improvement in production efficiency and quality is promoted.

[0016] According to some embodiments of the present invention, in step 2, after the PCB board is scanned, the side order of the PCB board is confirmed, and when the side order of the PCB board is wrong, the PCB board is turned over.

[0017] According to some embodiments of the present invention, in step 3, the PCB board is pre-treated before being cleaned and roughened.

[0018] According to some embodiments of the present invention, in step 4, a pre-drying treatment is performed after the solder mask is printed on the PCB board according to the recipe requirements preset by the system.

[0019] According to some embodiments of the present invention, in step 4, when the printing process of the PCB boards is abnormal, the PCB boards in the pre-processing line and the post-processing line are temporarily stored.

[0020] According to some embodiments of the present invention, in step 5, the exposed PCB board is left to stand.

[0021] According to some embodiments of the present invention, in step 7, when AVI confirms that the quality of the PCB board is abnormal, the corresponding PCB board is temporarily stored.

[0022] According to some embodiments of the present invention, in step 8, a crawler conveyor mechanism is used to convey the PCB board on which character printing is completed, so as to facilitate inspection and buffering of the PCB board.

[0023] According to some embodiments of the present invention, in step 8, the sprayed PCB board is baked to solidify the ink on the surface of the PCB board.

[0024] According to some embodiments of the present invention, in step 2 and step 10, when PCB boards are transported by AGV, the logistics and information flows are bound and recorded in the system, and are automatically compared with the batch ID in the system simultaneously.

[0025] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0027] Figure 1 It is a schematic flow chart of an automatic solder mask character method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0029] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0032] refer to Figure 1 An automatic solder mask character method according to an embodiment of the present invention is described.

[0033] like Figure 1 As shown, the automatic solder mask character method according to some embodiments of the present invention includes:

[0034] Step 1: Place the PCB board into the WIP warehouse;

[0035] Step 2: AGV takes out the PCB board from the WIP warehouse, transports the PCB board to the automatic board placement station, and scans the PCB board;

[0036] Step 3: Clean and roughen the PCB board;

[0037] Step 4: Scan the PCB board and print the solder mask on the PCB board according to the system preset formula requirements;

[0038] Step 5: Scan the PCB board and expose the pattern on the PCB board according to the system preset recipe requirements;

[0039] Step 6: Scan the PCB board and remove the unexposed ink on the PCB board according to the system preset formula requirements, and retain the exposed ink pattern;

[0040] Step 7: Scan the PCB board, prepare AVI inspection data according to the system preset formula requirements, and check the AVI inspection data with the appearance of the PCB board;

[0041] Step 8: Scan the PCB board and spray the pre-designed characters on the surface of the PCB board according to the system preset formula requirements;

[0042] Step 9: Scan the PCB board and automatically collect the PCB board according to the system preset formula requirements;

[0043] Step 10: The AGV takes the PCB board from the transport pallet and transports the PCB board to the WIP storage location.

[0044] like Figure 1 As shown, the PCB solder mask character processing technology process adopts an automatic solder mask character method, which includes steps such as WIP storage location, AGV transfer, cleaning and roughening, printing solder mask, exposure, ink removal, AVI inspection, spraying characters, automatic board collection, AGV transfer, etc. By placing the PCB board in the WIP storage location, AGV taking the board to the automatic station for scanning, cleaning, printing, exposure, ink treatment, AVI inspection, character spraying, and automatic board collection, etc., the automation and standardization of the production process are realized, the production efficiency, product quality and consistency are improved, the labor cost and material loss are reduced, and real-time monitoring and data recording are realized at the same time, the safety of the production site is enhanced, the processing flow of the PCB board is fully optimized, and a significant improvement in production efficiency and quality is promoted.

[0045] Specifically, through the automated process of picking, processing, testing and placing boards, it is possible to reduce manual operation time, reduce production cycle and improve production capacity. Through a series of automated steps such as automatic scanning, cleaning, roughening, printing solder mask, exposure, ink treatment, AVI inspection, character spraying, etc., it is possible to ensure that each PCB board is strictly standardized, reduce human operation errors, and improve product quality and consistency. Through the generation and verification of AVI inspection data and other scanning steps, the production data of each PCB board can be recorded for traceability and quality management. The system's preset formula requirements help ensure the accurate use of materials in the steps of printing, exposure, ink treatment, etc. on the PCB board, reduce waste and loss, and improve resource utilization efficiency. Completing most of the production process through AGV and automated equipment can save human resources and allow personnel to focus on higher-value work tasks.

[0046] The automatic solder mask character method is described below with a specific embodiment.

[0047] S1: Temporarily store the PCB boards from the previous process in the WIP storage location.

[0048] S2: Obtain and bind the logistics and information flow of the PCB board, enter the logistics and information flow of the PCB board, compare the entered logistics and information flow with the batch ID, and use an automatic guided vehicle to transport the PCB board to ensure that the correct batch of materials enters the production process.

[0049] The PCB board is output to the input end of the board placing mechanism, and the board placing mechanism receives the workstation signal that the PCB board is in place. The board placing mechanism reports the workstation status of the board placing mechanism to the system according to the workstation signal, and requests corresponding information actions from the system according to the reported workstation status. The system verifies the equipment status and the first recipe. After completing the verification of the equipment status and the first recipe, the system issues a production instruction to the board placing mechanism, and the board placing mechanism transfers the PCB board to the first scanning mechanism in sequence according to the production instruction.

[0050] The first scanning mechanism is used to scan the identification codes on the PCB board in turn and obtain the corresponding product information, and the corresponding product information is reported, where the product information includes model, batch, number of grippers, employee ID and equipment code. Then the feedback system calls the AGV to move the empty pallet away and move a full pallet again to realize circular production.

[0051] S3: Confirm the face order of the PCB board. When the face order of the PCB board is correct, the PCB board is directly output to the next process. When the face order of the PCB board is wrong, the PCB board is flipped over to ensure that the PCB board can be correctly positioned during the manufacturing and assembly process.

[0052] The system issues the product information corresponding to the second formula and PCB board, where the product information includes model, lot number, production quantity, board length, board width, board thickness and formula number, confirms the second formula, and performs line clearing operation when the second formula needs to be modified. After manually modifying the parameters of the second formula, the modification information of the second formula is reported to the system;

[0053] The PCB board is transferred to the cleaning and roughening mechanism, and the cleaning and roughening mechanism is used to clean and roughen the copper surface of the PCB board in turn to ensure good bonding between the copper surface and the solder mask ink.

[0054] S4: The PCB board is transferred to the second scanning mechanism, and the second scanning mechanism is used to scan the identification code on the PCB board in turn and report it to the system. The system sends the third formula to the printing mechanism according to the corresponding product information. The printing mechanism confirms the third formula, and the printing mechanism prints the first side of the PCB board. After the printing of the first side is completed, the PCB board is turned over, and the printing mechanism prints the second side of the PCB board.

[0055] The system sends the fourth formula to the pre-baking mechanism according to the corresponding product information, and the pre-baking mechanism pre-dries the solder mask of the PCB board according to the fourth formula, wherein the fourth formula includes temperature and time parameters.

[0056] After the pre-drying of the solder mask of the PCB board is completed, the transportation status of the PCB board is confirmed. When the PCB boards are piled up, the surplus PCB boards are taken out of the production line by the delivery and collection mechanism. Specifically, the delivery and collection mechanism is a circular plug-in delivery and collection connection.

[0057] S5: Transfer to the third scanning mechanism, use the third scanning mechanism to scan the identification code on the PCB board in sequence and report to the system, the system sends the fifth recipe to the exposure mechanism according to the corresponding product information, the exposure mechanism exposes the graphics on the PCB board in sequence according to the fifth recipe, and uses the flip mechanism to keep the exposed PCB board still.

[0058] Confirm the orientation of the PCB board. When the orientation of the PCB board is wrong, turn the PCB board over to ensure that the PCB board can be correctly positioned during the manufacturing and assembly process.

[0059] S6: The PCB board is transferred to the fourth scanning mechanism, and the identification code on the PCB board is scanned by the fourth scanning mechanism in sequence and reported to the system. The system sends the sixth formula to the developing mechanism according to the corresponding product information. The developing mechanism removes the unexposed ink on the PCB board in sequence according to the sixth formula to retain the required ink pattern;

[0060] S7: The PCB board is transferred to the fifth scanning mechanism, and the fifth scanning mechanism is used to scan the identification code on the PCB board in turn and report it to the system. The system sends the inspection data to the appearance inspection agency according to the corresponding product information. The appearance inspection agency checks the appearance of the PCB board according to the inspection data to ensure that the PCB board product meets the specification requirements and quality standards;

[0061] Confirm the transportation status of PCB boards. When PCB boards are piled up, use a temporary storage mechanism to temporarily store the surplus PCB boards.

[0062] S8: The PCB board is transferred to the sixth scanning mechanism, and the identification code on the PCB board is scanned by the sixth scanning mechanism in sequence and reported to the system. The system sends the seventh formula to the character printing mechanism according to the corresponding product information, and the character printing mechanism sprays the preset characters on the PCB board according to the seventh formula;

[0063] The crawler conveyor mechanism is used to transport the PCB boards in sequence, so as to facilitate the inspection of the PCB boards that have been sprayed. When the upper and lower processes of the crawler conveyor mechanism are abnormal, the crawler conveyor mechanism can be used as a buffer area to cache the PCB boards.

[0064] The PCB board is transferred to the post-baking mechanism, and the ink on the surface of the PCB board is cured in sequence by the post-baking mechanism.

[0065] S9: The PCB board is transferred to the seventh scanning mechanism, and the seventh scanning mechanism is used to scan the identification code on the PCB board in turn and report it to the system. The system issues the eighth formula to the equipment for production, and the equipment receives the product information. The human-machine interface of the equipment displays the eighth formula issued by the system and the function of issuing product information: model, lot number, production quantity, and PNL ID.

[0066] S10: Obtain and bind the logistics and information flow of the PCB board, enter the logistics and information flow of the PCB board, compare the entered logistics and information flow with the batch ID, identify mixed materials and mixed batches, and use an automatic guided vehicle to transport the outer packaging products into the WIP warehouse to achieve real-time monitoring of product location and storage status.

[0067] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An automatic solder mask character method, characterized in that: include: Step 1: Place the PCB board into the WIP warehouse; Step 2: AGV takes out the PCB board from the WIP warehouse, transports the PCB board to the automatic board placement station, and scans the PCB board; Step 3: Clean and roughen the PCB board; Step 4: Scan the PCB board and print the solder mask on the PCB board according to the system preset formula requirements; Step 5: Scan the PCB board and expose the pattern on the PCB board according to the system preset recipe requirements; Step 6: Scan the PCB board and remove the unexposed ink on the PCB board according to the system preset formula requirements, and retain the exposed ink pattern; Step 7: Scan the PCB board, prepare AVI inspection data according to the system preset formula requirements, and check the AVI inspection data with the appearance of the PCB board; Step 8: Scan the PCB board and spray the pre-designed characters on the surface of the PCB board according to the system preset formula requirements; Step 9: Scan the PCB board and automatically collect the PCB board according to the system preset formula requirements; Step 10: The AGV takes the PCB board from the transport pallet and transports the PCB board to the WIP storage location.

2. The automatic solder mask character method according to claim 1, characterized in that: In step 2, after the PCB board is scanned, the side of the PCB board is confirmed. When the side of the PCB board is wrong, the PCB board is turned over.

3. The automatic solder mask character method according to claim 1, characterized in that: In step 3, the PCB board is pre-treated before being cleaned and roughened.

4. The automatic solder mask character method according to claim 1, characterized in that: In step 4, according to the system preset formula requirements, the solder mask is printed on the PCB board and then pre-dried.

5. The automatic solder mask character method according to claim 1, characterized in that: In step 4, when the printing process of the PCB boards is abnormal, the PCB boards in the pre-processing line and the post-processing line are temporarily stored.

6. The automatic solder mask character method according to claim 1, characterized in that: In step 5, the exposed PCB board is left to stand.

7. The automatic solder mask character method according to claim 1, characterized in that: In the case of not receiving 7, when AVI confirms that the quality of the PCB board is abnormal, the corresponding PCB board will be temporarily stored.

8. The automatic solder mask character method according to claim 1, characterized in that: In step 8, a crawler conveyor mechanism is used to convey the PCB board on which character printing is completed, so as to facilitate inspection and buffering of the PCB board.

9. The automatic solder mask character method according to claim 1, characterized in that: In step 8, the sprayed PCB board is baked to solidify the ink on the surface of the PCB board.

10. The automatic solder mask character method according to claim 1, characterized in that: In step 2 and step 10, when AGV is used to transport PCB boards, the logistics and information flows are bound and recorded in the system, and automatically compared with the batch ID in the system.

Images