Manufacturing method of plane integrated design power adapter

Abstract

The invention relates to the technical field of power adapters, in particular to a manufacturing method of a planar integrated design power adapter. Compared with the prior art, the manufacturing method of the plane integrated design power adapter has the advantages that the PCB side plate can be protected through the arrangement of the sheath, the protection performance of the power adapter can be greatly improved, the PCB main board is provided with the insertion hole site matched with the PCB side plate, the PCB side plate can be conveniently assembled on the PCB main board, and the production efficiency is improved. The PCB mainboard, the PCB side plate, the magnetic core and the sheath adopt an integrated design concept, all parts of the power adapter are integrated on a plane, and all the parts are tightly connected together through a precise manufacturing process to form a whole. According to the design mode, the size of the power adapter is reduced, the structure is simplified, the manufacturing cost is reduced, and the radiating fins are assembled with the PCB side plate and the PCB main board, so that the radiating fins can be ensured to keep a stable radiating effect in the running process of equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of power adapters, and in particular to a method for manufacturing a power adapter with a planar integrated design. Background Art

[0002] With the rapid development of electronic technology, electronic devices play an increasingly important role in people's daily lives. Among them, power adapters are indispensable accessories for electronic devices. The optimization of their performance and design is of great significance to improving user experience and meeting market demand. Power adapters are power supply conversion devices for small portable electronic devices and electronic appliances. Their main purpose is to provide stable and reliable power for electronic devices. It can convert unstable mains electricity into stable low-voltage direct current to meet the power needs of electronic devices.

[0003] In the existing power adapter design, a split structure is usually adopted, that is, the power adapter is composed of multiple independent components, which are connected by connecting wires or connectors. Although this design method guarantees the functionality and reliability of the power adapter to a certain extent, it also brings problems such as large size, complex structure, and high manufacturing cost. In addition, since the power adapter will generate a certain amount of heat during operation, and the traditional heat dissipation method often cannot effectively dissipate the heat, the temperature of the power adapter is too high during operation, affecting its performance and life. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the present invention provides a method for manufacturing a flat integrated power adapter, which has the advantages of simple structure and solves the problems of bulky size, complex structure, poor heat dissipation effect, etc.

[0006] (II) Technical solution

[0007] To achieve the above object, the present invention provides the following technical solution: a method for manufacturing a flat integrated power adapter, comprising the following steps:

[0008] 1) PCB motherboard patch: Use solder to solder the capacitor to the PCB motherboard. When soldering the capacitor, you need to distinguish the positive and negative poles;

[0009] 2) Assemble the magnetic core: Apply epoxy glue on the functional surface and inner groove of the E-chip magnetic core, then install the PCB motherboard into the E-chip magnetic core, and apply thermal conductive glue on the center column of the E-chip magnetic core. Install the I-chip magnetic core and fix it with a clip, then use a heating gun to bake the thermal conductive glue for 1.5 hours to fix it;

[0010] 3) PCB side panel patch: Use solder to solder the capacitor to the PCB side panel. The capacitor must be installed in place for soldering;

[0011] 4) Installation of the sheath: Insert the welded PCB side panel into the card position inside the sheath. The PCB side panel needs to be plugged into place when inserted;

[0012] 5) Welding the ground wire: Place the sheath with the PCB side plate plugged in on the welding station, and use a welding gun to weld the ground wire on the PCB side plate;

[0013] 6) Assembly of main board and side board: insert the PCB side board into the plug-in hole on the PCB main board, and then use a welding gun to weld the junction between the PCB side board and the PCB main board;

[0014] 7) Assemble the heat sink: First, insert the first heat sink into the hole of the PCB main board and fasten it, then insert the second heat sink into the hole of the PCB side plate and fasten it, and finally insert the third heat sink into the hole of the PCB main board and fasten it;

[0015] Preferably, the soldering points of the capacitor components in step 1) and step 3) need to be smooth and full, and attention needs to be paid to the position of the soldering iron in step 1) and step 3) to prevent problems such as adjacent components falling off or soldering.

[0016] Preferably, the epoxy glue needs to be applied evenly in step 2), and the I-piece magnetic core needs to correspond to the E-piece magnetic core up and down. The baking temperature of the heating gun at the thermal conductive soft glue in step 2) is 120°C.

[0017] Preferably, when inserting the PCB side panel into the sheath in step 4), it is necessary to align the plug-in portion of the PCB side panel with the mounting position of the sheath.

[0018] Preferably, when welding the ground wire in step 5), the contact area needs to be cleaned carefully to ensure that there is no grease, dust, oxide layer or other contaminants on the surface of the welding position of the PCB side plate.

[0019] Preferably, in the step 6), a plurality of soldering points need to be set when soldering the interface between the PCB side plate and the PCB main plate, and soldering is performed one by one starting from one end.

[0020] Preferably, when assembling the plurality of heat sinks with the PCB side panels and the PCB main board in step 7), it is necessary to ensure that the heat sinks and the side panels have an ideal contact area and tightness.

[0021] (III) Beneficial effects

[0022] Compared with the prior art, the present invention provides a method for manufacturing a flat integrated power adapter, which has the following features:

[0023] Beneficial effects:

[0024] The manufacturing method of the power adapter with a flat integrated design can protect the PCB side panel by setting a sheath, which can greatly improve the protection performance of the power adapter. The PCB main board is provided with a plug-in hole that matches the PCB side panel, which can facilitate the assembly of the PCB side panel to the PCB main board. The PCB main board, PCB side panel, magnetic core and sheath adopt an integrated design concept, integrating various components of the power adapter on a plane, and connecting various components tightly together through a precise manufacturing process to form a whole. This design method not only reduces the volume of the power adapter, simplifies the structure, and reduces the manufacturing cost, but also greatly improves the heat dissipation performance of the power adapter by assembling multiple heat sinks with the PCB side panel and the PCB main board. DETAILED DESCRIPTION

[0025] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for control such as a computer.

[0027] A method for manufacturing a flat integrated power adapter comprises the following steps:

[0028] 1) PCB motherboard patch: Use solder to solder the capacitor to the PCB motherboard. When soldering the capacitor, you need to distinguish the positive and negative poles;

[0029] 2) Assemble the magnetic core: Apply epoxy glue on the functional surface and inner groove of the E-chip magnetic core, then install the PCB motherboard into the E-chip magnetic core, and apply thermal conductive glue on the center column of the E-chip magnetic core. Install the I-chip magnetic core and fix it with a clip, then use a heating gun to bake the thermal conductive glue for 1.5 hours to fix it;

[0030] 3) PCB side panel patch: Use solder to solder the capacitor to the PCB side panel. The capacitor must be installed in place for soldering;

[0031] 4) Installation of the sheath: Insert the welded PCB side panel into the card position inside the sheath. The PCB side panel needs to be plugged into place when inserted;

[0032] 5) Welding the ground wire: Place the sheath with the PCB side plate plugged in on the welding station, and use a welding gun to weld the ground wire on the PCB side plate;

[0033] 6) Assembly of main board and side board: insert the PCB side board into the plug-in hole on the PCB main board, and then use a welding gun to weld the junction between the PCB side board and the PCB main board;

[0034] 7) Assemble the heat sink: First, insert the first heat sink into the hole of the PCB main board and fasten it, then insert the second heat sink into the hole of the PCB side plate and fasten it, and finally insert the third heat sink into the hole of the PCB main board and fasten it;

[0035] The solder joints of the capacitors in steps 1) and 3) must be smooth and full. In steps 1) and 3), the soldering iron position must be noted to prevent problems such as adjacent components falling off or soldering. Paying attention to the soldering iron position can ensure that solder joints are formed only where needed, avoiding excessive solder or insufficient soldering. This can improve the quality and reliability of solder joints and reduce failures caused by poor soldering.

[0036] In step 2), the epoxy glue needs to be applied evenly, and the I-piece magnetic core needs to correspond to the E-piece magnetic core up and down. The heating gun in step 2) bakes the thermal conductive soft glue at a temperature of 120°C. Setting the baking temperature at 120°C can ensure that the thermal conductive soft glue will not be damaged by excessive temperature during the heating process. The appropriate temperature helps the thermal conductive soft glue to be evenly heated and softened, so that it can better fill the gaps between PCB boards or other components, thereby enhancing the heat conduction efficiency.

[0037] When inserting the PCB side panel into the sheath in step 4), it is necessary to align the plug-in part of the PCB side panel with the mounting position of the sheath. Aligning the plug-in part and the mounting position can ensure that the connection between the PCB side panel and the sheath is tight and stable, avoiding the problem of loose connection due to misalignment or deviation. Accurate alignment can reduce the friction and extrusion of the PCB side panel during the insertion process, thereby reducing the risk of damage to the PCB side panel.

[0038] When soldering the ground wire in step 5), the contact area needs to be carefully cleaned to ensure that there is no grease, dust, oxide layer and other dirt on the surface of the soldering position of the PCB side plate. A clean contact area can ensure good contact and adhesion between the solder and the PCB side plate. Without the interference of dirt, the solder joint can form a uniform and tight connection, thereby enhancing the mechanical strength and electrical performance of the soldering. Dirt such as grease, dust and oxide layer will increase the contact resistance and affect the transmission efficiency of the current. After cleaning these dirt, the contact resistance is reduced, and the current can pass more smoothly, reducing heat and energy loss.

[0039] In step 6), multiple soldering points need to be set when soldering the interface between the PCB side plate and the PCB main board. When soldering, soldering is performed one by one from one end. Multiple soldering points can provide more electrical connection points, enhancing the stability and reliability of the electrical connection. This helps to ensure that the PCB board will not fail due to electrical connection problems during operation. Soldering one by one from one end helps to control the stress distribution during the welding process. Soldering stress is one of the main factors that cause deformation and cracking of welded parts. Through orderly welding, the accumulation of welding stress can be reduced.

[0040] When assembling multiple heat sinks with the PCB side panels and the PCB main board in step 7), it is necessary to ensure that the heat sinks and the side panels have an ideal contact area and tightness. The ideal contact area can ensure that the heat sink absorbs heat from the PCB side panels and the main board more effectively. The tight connection can reduce looseness or displacement caused by vibration or movement, ensuring that the heat sink maintains a stable heat dissipation effect during the operation of the equipment.

[0041] Typical case: A method for manufacturing a flat integrated power adapter, comprising the following steps:

[0042] 1) PCB motherboard patch: Use solder to solder the capacitor to the PCB motherboard. When soldering the capacitor, you need to distinguish the positive and negative poles;

[0043] 2) Assemble the magnetic core: Apply epoxy glue on the functional surface and inner groove of the E-chip magnetic core, then install the PCB motherboard into the E-chip magnetic core, and apply thermal conductive glue on the center column of the E-chip magnetic core. Install the I-chip magnetic core and fix it with a clip, then use a heating gun to bake the thermal conductive glue for 1.5 hours to fix it;

[0044] 3) PCB side panel patch: Use solder to solder the capacitor to the PCB side panel. The capacitor must be installed in place for soldering;

[0045] 4) Installation of the sheath: Insert the welded PCB side panel into the card position inside the sheath. The PCB side panel needs to be plugged into place when inserted;

[0046] 5) Welding the ground wire: Place the sheath with the PCB side plate plugged in on the welding station, and use a welding gun to weld the ground wire on the PCB side plate;

[0047] 6) Assembly of main board and side board: insert the PCB side board into the plug-in hole on the PCB main board, and then use a welding gun to weld the junction between the PCB side board and the PCB main board;

[0048] 7) Assemble the heat sink: First, insert the first heat sink into the hole of the PCB main board and fasten it, then insert the second heat sink into the hole of the PCB side plate and fasten it, and finally insert the third heat sink into the hole of the PCB main board and fasten it;

[0049] The solder joints of the capacitors in steps 1) and 3) must be smooth and full. In steps 1) and 3), the soldering iron position must be noted to prevent problems such as adjacent components falling off or soldering. Paying attention to the soldering iron position can ensure that solder joints are formed only where needed, avoiding excessive solder or insufficient soldering. This can improve the quality and reliability of solder joints and reduce failures caused by poor soldering.

[0050] In step 2), the epoxy glue needs to be applied evenly, and the I-piece magnetic core needs to correspond to the E-piece magnetic core up and down. The heating gun in step 2) bakes the thermal conductive soft glue at a temperature of 120°C. Setting the baking temperature at 120°C can ensure that the thermal conductive soft glue will not be damaged by excessive temperature during the heating process. The appropriate temperature helps the thermal conductive soft glue to be evenly heated and softened, so that it can better fill the gaps between PCB boards or other components, thereby enhancing the heat conduction efficiency.

[0051] When inserting the PCB side panel into the sheath in step 4), it is necessary to align the plug-in part of the PCB side panel with the mounting position of the sheath. Aligning the plug-in part and the mounting position can ensure that the connection between the PCB side panel and the sheath is tight and stable, avoiding the problem of loose connection due to misalignment or deviation. Accurate alignment can reduce the friction and extrusion of the PCB side panel during the insertion process, thereby reducing the risk of damage to the PCB side panel.

[0052] When soldering the ground wire in step 5), the contact area needs to be carefully cleaned to ensure that there is no grease, dust, oxide layer and other dirt on the surface of the soldering position of the PCB side plate. A clean contact area can ensure good contact and adhesion between the solder and the PCB side plate. Without the interference of dirt, the solder joint can form a uniform and tight connection, thereby enhancing the mechanical strength and electrical performance of the soldering. Dirt such as grease, dust and oxide layer will increase the contact resistance and affect the transmission efficiency of the current. After cleaning these dirt, the contact resistance is reduced, and the current can pass more smoothly, reducing heat and energy loss.

[0053] In step 6), multiple soldering points need to be set when soldering the interface between the PCB side plate and the PCB main board. When soldering, soldering is performed one by one from one end. Multiple soldering points can provide more electrical connection points, enhancing the stability and reliability of the electrical connection. This helps to ensure that the PCB board will not fail due to electrical connection problems during operation. Soldering one by one from one end helps to control the stress distribution during the welding process. Soldering stress is one of the main factors that cause deformation and cracking of welded parts. Through orderly welding, the accumulation of welding stress can be reduced.

[0054] When assembling multiple heat sinks with the PCB side panels and the PCB main board in step 7), it is necessary to ensure that the heat sinks and the side panels have an ideal contact area and tightness. The ideal contact area can ensure that the heat sink absorbs heat from the PCB side panels and the main board more effectively. The tight connection can reduce looseness or displacement caused by vibration or movement, ensuring that the heat sink maintains a stable heat dissipation effect during the operation of the equipment.

[0055] In summary, the manufacturing method of the flat-plane integrated design power adapter, the manufacturing method of the flat-plane integrated design power adapter, can protect the PCB side panel through the setting of the sheath, which can greatly improve the protection performance of the power adapter, and the PCB main board is provided with plug-in holes that are compatible with the PCB side panel, which can facilitate the assembly of the PCB side panel to the PCB main board. The PCB main board, PCB side panel, magnetic core and sheath adopt an integrated design concept, integrating the various components of the power adapter on a plane, and connecting the various components tightly together through precise manufacturing processes to form a whole. This design method not only reduces the size of the power adapter, simplifies the structure, and reduces the manufacturing cost, but also greatly improves the heat dissipation performance of the power adapter by assembling multiple heat sinks with the PCB side panel and the PCB main board.

[0056] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise one" do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for manufacturing a flat integrated power adapter, characterized in that: The following steps are involved: 1) PCB motherboard patch: Use solder to solder the capacitor to the PCB motherboard. When soldering the capacitor, you need to distinguish the positive and negative poles; 2) Assemble the magnetic core: Apply epoxy glue on the functional surface and inner groove of the E-chip magnetic core, then install the PCB motherboard into the E-chip magnetic core, and apply thermal conductive glue on the center column of the E-chip magnetic core. Install the I-chip magnetic core and fix it with a clip, then use a heating gun to bake the thermal conductive glue for 1.5 hours to fix it; 3) PCB side panel patch: Use solder to solder the capacitor to the PCB side panel. The capacitor must be installed in place for soldering; 4) Installation of the sheath: Insert the welded PCB side panel into the card position inside the sheath. The PCB side panel needs to be plugged into place when inserted; 5) Welding the ground wire: Place the sheath with the PCB side plate plugged in on the welding station, and use a welding gun to weld the ground wire on the PCB side plate; 6) Assembly of main board and side board: insert the PCB side board into the plug-in hole on the PCB main board, and then use a welding gun to weld the junction between the PCB side board and the PCB main board; 7) Assemble the heat sink: First, insert the first heat sink into the hole of the PCB main board and fasten it firmly. Then, insert the second heat sink into the hole of the PCB side panel and fasten it firmly. Finally, insert the third heat sink into the hole of the PCB main board and fasten it firmly.

2. The method for manufacturing a flat integrated power adapter according to claim 1, characterized in that: The soldering points of the capacitor components in step 1) and step 3) need to be smooth and full, and attention needs to be paid to the position of the soldering iron in step 1) and step 3) to prevent problems such as adjacent components falling off or soldering.

3. The method for manufacturing a flat integrated power adapter according to claim 1, characterized in that: In the step 2), the epoxy glue needs to be applied evenly, and the I-piece magnetic core needs to correspond to the E-piece magnetic core up and down. The baking temperature of the heating gun at the thermal conductive soft glue in the step 2) is 120°C.

4. The method for manufacturing a flat integrated power adapter according to claim 1, characterized in that: When inserting the PCB side plate into the sheath in step 4), the plug-in portion of the PCB side plate needs to be aligned with the installation position of the sheath.

5. The method for manufacturing a flat integrated power adapter according to claim 1, characterized in that: When soldering the ground wire in step 5), the contact area needs to be cleaned carefully to ensure that there is no grease, dust, oxide layer or other contaminants on the surface of the soldering position of the PCB side plate.

6. The method for manufacturing a flat integrated power adapter according to claim 1, characterized in that: In the step 6), when welding the interface between the PCB side plate and the PCB main board, multiple soldering points need to be set, and soldering is performed one by one starting from one end.

7. The method for manufacturing a flat integrated power adapter according to claim 1, characterized in that: When assembling the plurality of heat sinks with the PCB side panels and the PCB main board in step 7), it is necessary to ensure that the heat sinks and the side panels have an ideal contact area and tightness.