Filter molding
By using carriers and molded materials to form structures with predefined apertures and pitches in optical filter manufacturing, the problems of existing optical filter manufacturing complexity and unclear edges are solved, and the measurement accuracy and manufacturing of spectrometer equipment are improved. efficiency.
Patent Information
- Application Number
- CN202380042321.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-12-14
- Filing Date
- 2023-05-23
- Publication Date
- 2025-01-03
AI Technical Summary
The existing optical filter manufacturing methods are complex and expensive, resulting in large workloads of fixing and quality inspection of micro filters, and unclear edges of the filter lead to undesirable optical effects such as transmission, reflection and scattering, which affect measurement accuracy.
Using a method, by providing a layer of filter material, cutting into filters, and picking and placing these segments on the carrier, the structure with predefined apertures and pitches is molded using moldable materials to form a molded filter assembly and cut into optical filter units to avoid undesired optical effects.
Improve the accuracy and accuracy of spectroscopic measurements, reduce the risk of error measurements, realize efficient manufacturing and mass production of spectrometer equipment, avoid undesired optical effects, especially transmission, reflection and scattering, suitable for compact spectrometer equipment .
Smart Images
Figure CN119255905A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for manufacturing at least one optical filter unit, which can preferably be configured to facilitate optical detection of electromagnetic radiation in an optical detector, which can preferably be included in a spectrometer device. In addition, the present invention relates to an optical detector for optical detection of electromagnetic radiation and to a spectrometer device. This method and device can be generally used in various fields of optical sensing and detection technology, such as in professional environments, such as equipment for medical and physiological diagnosis and research and equipment for quality control, and in various other scientific research fields. Additional applications are possible, such as in consumer electronics and household appliances, particularly in portable and handheld devices. However, even more applications are also feasible. Background Art
[0002] Optical detectors usually respond to electromagnetic radiation within a specific wavelength range depending on the material composition of the detector. In order to limit the spectral response to the desired wavelength range, optical bandpass filters, especially optical narrow bandpass filters, which can be based on optical interference, are used. The characteristic of optical bandpass filters is to optically block unwanted wavelength ranges, thereby limiting the bandwidth of the desired wavelength range. In order to obtain different wavelength ranges, different optical bandpass filters are typically required.
[0003] However, the known methods for making optical filters show various disadvantages. In particular, the material layer used for the optical filter is cut into a plurality of micro filters, which for example have an area of about 0.5 mm × 0.5 mm. Subsequently, each filter must be mechanically fixed with good accuracy so as to be arranged together with a small optical system with a narrow extension range. Here, picking up and placing a plurality of filters of micro filters is complicated and expensive in batch production, especially due to the required high workload and long processing time of this manufacturing step. Similarly, quality inspection (for example checking the correct positioning of these individually mechanically fixed and arranged micro filters) also requires high workload and long processing time.
[0004] Further, due to the cutting of the material layer into multiple filters of tiny filters, the single optical filter usually does not exhibit a clear edge, but rather shows a broken edge. However, the broken edge typically results in an optically unusable area, such as a low and unclear aperture, which is prone to cause undesirable optical effects, such as transmission, reflection and / or scattering of light, especially outside the desired wavelength range.
[0005] Problem to be solved
[0006] It is therefore desirable to provide methods and apparatus which at least substantially avoid the disadvantages of known methods and apparatuses. In particular, it is desirable to have a method for manufacturing at least one optical filter unit which can suppress such adverse effects when assembling microfilters. Summary of the invention
[0007] This problem is solved by a method for producing at least one optical filter unit, by an optical detector and by a spectrometer device, which method, the optical detector and the spectrometer device have the features of the independent claims. Advantageous embodiments are listed in the dependent claims and in the entire description, which can be implemented individually or in any arbitrary combination.
[0008] As used herein, the terms "having", "including" or "comprising" or any arbitrary grammatical variant thereof are used in a non-exclusive manner. Thus, these terms may refer to the absence of additional features in the entity described in this context in addition to the features introduced by these terms, or the presence of one or more additional features. As an example, the expressions "A has B", "A includes B" and "A contains B" may refer to the absence of other elements in A in addition to B (i.e., A consists only and solely of B), or the presence of one or more additional elements in entity A in addition to B (such as element C, elements C and D or even additional elements).
[0009] Further, it should be noted that the terms "at least one", "one or more", or similar expressions indicating that a feature or element may occur once or more than once are typically used only once when introducing the corresponding feature or element. In most cases, when referring to the corresponding feature or element, the expression "at least one" or "one or more" is not repeated, although in fact the corresponding feature or element may occur once or more than once.
[0010] Further, as used herein, the terms "preferably", "more preferably", "particularly", "more particularly", "specifically", "more specifically" or similar terms are used in conjunction with optional features without limiting the possibilities of alternatives. Therefore, the features introduced by these terms are optional features and are not intended to limit the scope of the claims in any way. As the skilled person will recognize, the present invention can be implemented by using alternative features. Similarly, the features introduced by "in an embodiment of the present invention" or similar expressions are intended to be optional features, without any limitation on alternative embodiments of the present invention, without any limitation on the scope of the present invention, and without any limitation on the possibility of combining the features introduced in this manner with other optional or non-optional features of the present invention.
[0011] In a first aspect, the present invention relates to a method for manufacturing at least one optical filter unit for a spectrometer device. The method may also be referred to as a "manufacturing method". The method includes the following method steps that may be performed in a given order. However, different orders are also possible. Further, one, more than one or even all method steps may be performed once or repeatedly. In addition, these method steps may be performed successively, or alternatively, two or more method steps may be performed in a timely overlapping manner or even in parallel. The method may further include unlisted additional method steps.
[0012] The method comprises the following steps:
[0013] a) providing at least one layer of filter material;
[0014] b) producing individual filters by singulating the filter material layer into filters;
[0015] c) providing a carrier;
[0016] d) picking up the individual filters and placing them on the carrier;
[0017] e) at least partially molding at least one moldable material onto the carrier with the individual filters, thereby producing at least one molded structure having a predefined pore size and a predefined pitch between the individual filters;
[0018] f) removing the carrier to produce a molded filter assembly; and
[0019] g) singulating the molded filter assembly into the at least one optical filter unit.
[0020] The optical filter unit may specifically be configured for facilitating optical detection performed by a spectrometer device and, therefore, the optical filter unit may be manufactured to be integrable into a spectrometer device.In particular, the optical filter unit may be manufactured for the purpose of being part of a spectrometer device.
[0021] As used herein, the term "spectrometer device" is a broad term and will be given its ordinary and conventional meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a device for obtaining at least one item of spectral information about at least one object by using electromagnetic radiation. Specifically, for one or more different wavelengths of electromagnetic radiation, the at least one item of spectral information may refer to at least one optical characteristic or optically measurable characteristic determined as a function of wavelength. More specifically, the at least one item of spectral information may relate to at least one characteristic that characterizes at least one of transmission, absorption, reflection, and emission of at least one object. The at least one optical characteristic may be determined for one or more wavelengths of electromagnetic radiation.
[0022] As used herein, the term "filter material" is a broad term and has its ordinary and usual meaning to those of ordinary skill in the art, and is not limited to a special or customized meaning. The term may specifically refer to, but is not limited to, sheets and / or panels of coherent materials having optical filtering properties. In particular, the filter material may be configured to reflect and / or block electromagnetic radiation (i.e., light) of an unwanted wavelength range from being transmitted through the material.
[0023] As used herein, the term "singularization" is a broad term and will be given its ordinary and conventional meaning to one of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, the process of separating a coherent material into a plurality of separate individual portions. In particular, the layer of filter material may be singulated into individual filters by separating and / or breaking the coherent filter material into a plurality of separate individual filters.
[0024] In particular, in particular in step b), the individual filters may be singulated to have at least one predefined size. Thus, the individual filters singulated (e.g. separated) from the filter material layer may have at least one predefined size, such as a predefined form and / or shape. As an example, the individual filters may be singulated, e.g. into rectangular or triangular pieces having a predefined width and length.
[0025] In particular, in particular in step b), the individual filters may be singulated by using at least one singulation method. As an example, the at least one singulation method may be selected from at least one of the following: mechanical slicing, such as sawing and / or cutting; laser slicing; plasma slicing; scribing and breaking. Therefore, the singulation process may also be referred to as slicing and / or scribing.
[0026] As used herein, the term "carrier" is a broad term and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a solid and / or rigid structure, specifically a planar structure, configured to provide mechanical support. The carrier may specifically be or may include a substrate material, such as glass and / or epoxy resin. Other materials (e.g., plastic materials) are possible.
[0027] Providing the carrier in step c) may further include producing the carrier by laminating a foil on a carrier material layer. Therefore, in particular, step c) may further include laminating a foil (such as a carrier foil) to a carrier layer material (i.e., including a substrate material), and thereby producing a carrier. The carrier material may be provided in the form of at least one wafer and a panel. Additionally or alternatively, the foil (i.e., the carrier foil) may include at least one release material. The release material of the carrier foil may be specifically configured to achieve non-destructive separation of the carrier from the molded structure when the carrier is removed in step f).
[0028] Step d) includes performing a pick and place process, wherein a single filter is picked up and then placed on a carrier. As used herein, the term "pick and place" is a broad term, and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to special or custom meanings. The term specifically may refer to, but is not limited to, an automated process of taking a component from one position, moving the component at another position and positioning it there. In particular, the pick and place process may be or may include disposing of at least one component in the following manner: transferring the component from one position to another position (such as transferring to a position individually assigned to this specific component). Therefore, step d) may include transferring a single filter from a pick position to a position specifically assigned to a single filter disposed of on the carrier. The pick and place process may be particularly performed automatically by one or more of a robot (such as an industrial robot) and a surface mounting technology (SMT) component placement system.
[0029] In step d), at least two individual filters may be placed on the carrier. Specifically, in step d), at least three separate individual filters may be placed on the carrier. More specifically, in step d) of the manufacturing method, a plurality of individual filters may be placed on the carrier. In particular, placing these two, three or even more individual filters in step d) may be performed by iteratively performing a pick and place process as described above or as further outlined below.
[0030] In particular, the individual filters may be placed on a carrier, in particular on a carrier foil, in a predefined arrangement and with a predefined distance between the individual filters. Additionally or alternatively, each individual filter may be arranged at a predefined position on a carrier, in particular on a carrier foil.
[0031] In step e), at least one molded structure, such as a support structure, is produced by at least partially molding at least one moldable material onto a carrier with the individual filters, i.e. onto a carrier on which the individual filters are placed. In particular, the molded structure can be molded onto the carrier such that the molded structure mechanically stabilizes the individual filters, i.e. provides support by at least partially forming a form-fitting enclosure around at least a portion of each of the individual filters.
[0032] As used herein, the term "molding" is a broad term and will be given its ordinary and conventional meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, the process of transferring and shaping a ductile and curable material into a desired shape and / or configuration. Molding may be performed specifically by using a molding cavity and / or mold, such as in one or more of an injection molding process and a compression molding process, and / or by free forming, such as in a selective melting process, thereby producing a molded structure having a predefined aperture and a predefined pitch between individual filters. Specifically, the molded structure may exhibit a predefined aperture after solidification, i.e., when the moldable material (such as a ductile material) has been transformed into a solidified and / or hardened state.
[0033] As used herein, the term "predefined aperture" is a broad term and will be given its ordinary and conventional meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a width and depth of an opening formed by the molded structure (i.e., formed around the individual filters), the width and the depth corresponding to a previously determined and / or previously set width and depth. When the manufacturing method is started, the previously determined and / or previously set width and depth may be provided, for example, in a lookup table or the like. As an example, in the case where molding is performed using an injection molding process, the predefined and / or desired aperture of the molding structure is reflected and / or present in the shape of the molding cavity, for example taking into account material shrinkage characteristics.
[0034] As used herein, the term "predefined pitch" is a broad term and will be given its ordinary and conventional meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a distance between openings in a molded structure formed around adjacent individual filters, which distance corresponds to a previously determined and / or previously set distance. When the manufacturing method is initiated, the previously determined and / or previously set distance may be provided, for example, in a lookup table or the like. As an example, in the case of molding performed using an injection molding process, the predefined and / or desired pitch of the molded structure is reflected and / or present in the shape of the molding cavity, for example taking into account material shrinkage characteristics.
[0035] In particular, the molding process can be selected from at least one of the following: cavity molding; for example, injection molding and / or compression molding; selective melting, such as selective laser melting; and core-exposed molding, such as transfer molding, for example in combination with dynamic clamping. Thus, as an example, molding can be or can include an injection molding process and / or a compression molding process. Wherein, as an example, a mold and / or a cavity can be provided that at least partially encloses the space to be occupied by the moldable material, and the moldable material can then be transferred to the mold and / or cavity. Additionally or alternatively, molding can be or can include, for example, a selective laser melting process performed in the following manner: filling the space to be occupied by the moldable material with particles and / or granules of unmelted moldable material and then selectively melting individual moldable material particles or granules so as to melt together and form a molded structure. Additionally or alternatively, molding may be or may include an exposed core packaging process, as known, for example, from typical IC packaging and / or flip chip production, which is optionally enhanced by dynamically clamping a counter carrier to the moldable material, for example for compaction purposes.
[0036] Between steps f) and g), the method may comprise the following further step:
[0037] h) Molding at least one moldable material onto the side of the filters previously covered by the carrier, thereby producing at least one second molded structure having a predefined pore size and a predefined pitch between the individual filters.
[0038] Thus, the method may include performing double-sided molding. In particular, the second molded structure may be a mirror image of the first molded structure, i.e., the one or more apertures of the second molded structure may be equal to the one or more apertures of the first molded structure within manufacturing tolerances. Alternatively, at least one of the one or more apertures of the second molded structure may be intentionally different from the one or more apertures of the first molded structure.
[0039] As an example, the method may specifically include the following further step before step h):
[0040] i) Turning over the molded structure with the individual filters as produced in step e).
[0041] Thus, the method may include inverting a first molded structure having a single filter at least partially arranged therein before producing a second molded structure, ie rotating the first molded structure and the filter by ±180° around at least one axis within a tolerance of ±1°.
[0042] The molded structure, in particular one or more of the first and second molded structures, may be configured to at least one of block and absorb electromagnetic radiation having a wavelength λ of 300nm≤λ≤10μm. Specifically, the molded structure may be configured to at least one of block and absorb electromagnetic radiation having a wavelength λ of 500nm≤λ≤6μm. More specifically, for example, in the case where the envisioned detector material (such as the material of the detector pixel) includes PbSe, the molded structure, in particular one or more of the first and second molded structures, may be configured to at least one of block and absorb electromagnetic radiation having a wavelength λ of 1μm≤λ≤5μm. More specifically, for example, in the case where the envisioned detector material (such as the material of the detector pixel) includes PbS, the molded structure, in particular one or more of the first and second molded structures, may be configured to at least one of block and absorb electromagnetic radiation having a wavelength of 1μm≤λ≤3μm. As an example, outside the above ranges, the molded structure can be configured to block electromagnetic radiation with a radiation blocking level of at least OD2, specifically at least OD3, more specifically at least OD4.
[0043] At least one molded structure, in particular two molded structures, can at least partially enclose and / or cover a single filter. In particular, the at least one molded structure, in particular two molded structures together and / or jointly, can cover potentially jagged and / or cracked, for example broken edges of a single filter.
[0044] In another aspect, the present invention relates to an optical detector for optically detecting electromagnetic radiation within a predefined wavelength range of interest. The optical detector comprises at least one detector pixel and at least one optical filter unit, the at least one optical filter unit being manufactured as described elsewhere in this document (i.e. as outlined above or described in further detail below). Thus, in particular, with regard to the definition of terms, reference may be made to the description of the method for manufacturing the at least one optical filter unit, in particular the description of the manufacturing method.
[0045] In another aspect, the present invention relates to a spectrometer device. The spectrometer device comprises:
[0046] - at least one optical detector according to any of the preceding claims relating to optical detectors; and
[0047] - at least one evaluation device configured to generate at least one item of spectral information from at least one detector signal generated by the at least one optical detector from the incident radiation.
[0048] The method and the device described have considerable advantages over the prior art. Thus, in particular, the method and the device may allow reducing the risk of erroneous measurements by improving the accuracy and precision of spectroscopic measurements. In particular, the method and the device may improve the measurement accuracy by avoiding undesired optical effects such as transmission, reflection and / or scattering of light, i.e. outside the desired wavelength range, for example by one or more molded structures at least partially surrounding the individual filters.
[0049] Further, the method and apparatus can achieve a more efficient and resource-saving manufacturing of spectrometer equipment. As an example, the method and apparatus (e.g., the molding process applied, i.e., a combination of selective molding, core-exposed molding, and double-sided molding) can be advantageous by allowing mechanical fixation of filters and providing subassemblies (especially for facilitating further processing). Further, the method and apparatus (e.g., the molding process applied and / or its combination) can be particularly advantageous by allowing only the broken filter edge of the optical filter to be covered without covering a considerable portion of the filter surface and by allowing a defined clear aperture to be provided to multiple filters, preferably to each filter. In addition, the method and apparatus can avoid the passage of light that does not have the desired wavelength, especially due to transmission, reflection, and / or scattering at the broken filter edge. In addition, the method and apparatus can be suitable for batch production. In addition, the optical filter unit manufactured according to the method as described herein can achieve a smaller, more compactly constructed spectrometer equipment.
[0050] Summarizing and without excluding further possible embodiments, the following embodiments may be envisaged:
[0051] Embodiment 1. A method for manufacturing at least one optical filter unit for a spectrometer device, the method comprising:
[0052] a) providing at least one layer of filter material;
[0053] b) producing individual filters by singulating the filter material layer into filters;
[0054] c) providing a carrier;
[0055] d) picking up the individual filters and placing them on the carrier;
[0056] e) at least partially molding at least one moldable material onto the carrier with the individual filters, thereby producing at least one molded structure having a predefined pore size and a predefined pitch between the individual filters;
[0057] f) removing the carrier to produce a molded filter assembly; and
[0058] g) singulating the molded filter assembly into the at least one optical filter unit.
[0059] Embodiment 2. The method according to the above embodiment, wherein, specifically in step b), the individual filters are singulated into pieces having at least one predefined size.
[0060] Embodiment 3. The method according to any one of the preceding embodiments, wherein, specifically in step b), the individual filters are singulated by using at least one singulation method.
[0061] Embodiment 4. The method according to the preceding embodiment, wherein the at least one singulation method is selected from at least one of the following: mechanical slicing, such as sawing and / or cutting; laser slicing; plasma slicing; scribing and breaking.
[0062] Embodiment 5. The method according to any of the preceding embodiments, wherein step c) comprises producing the carrier by laminating a foil onto a layer of carrier material.
[0063] Embodiment 6. The method according to the preceding embodiment, wherein the foil comprises at least one release material configured to achieve non-destructive separation of the carrier from the molding structure when the carrier is removed in step f).
[0064] Embodiment 7. The method according to any one of the two preceding embodiments, wherein the carrier material is provided in the form of at least one of a wafer and a panel.
[0065] Embodiment 8. The method according to any of the preceding embodiments, wherein, in step d), at least two, particularly at least three, more particularly a plurality of individual filters are placed on the carrier.
[0066] Embodiment 9. The method according to any of the preceding embodiments, wherein the individual filters are placed on the carrier, in particular on the carrier foil, in a predefined arrangement and with a predefined distance between the individual filters.
[0067] Embodiment 10 The method according to any of the preceding embodiments, wherein each individual filter is arranged at a predefined position on the carrier, in particular on the carrier foil.
[0068] Embodiment 11. A method according to any of the preceding embodiments, wherein the molding process is selected from at least one of the following: cavity molding; such as injection molding and / or compression molding; selective melting, such as selective laser melting; and core molding, such as transfer molding, for example combined with dynamic clamping.
[0069] Embodiment 12. The method according to any one of the preceding embodiments, wherein between steps f) and g), the method further comprises:
[0070] h) Molding at least one moldable material onto the side of the filters previously covered by the carrier, thereby producing at least one second molded structure having a predefined pore size and a predefined pitch between the individual filters.
[0071] Embodiment 13. The method according to the previous embodiment, wherein, before step h), the method further comprises:
[0072] i) Turning over the molded structure with the individual filters as produced in step e).
[0073] Embodiment 14. A method according to any one of the preceding embodiments, wherein the molded structure is configured to at least one of block and absorb electromagnetic radiation having a wavelength λ of 300nm≤λ≤10μm, specifically 500nm≤λ≤6μm, more specifically 1μm≤λ≤5μm, more specifically 1μm≤λ≤3μm.
[0074] Embodiment 15. The method according to any of the preceding embodiments, wherein the at least one molding structure, in particular the two molding structures, at least partially encloses the individual filters.
[0075] Embodiment 16 The method according to the preceding embodiment, wherein the at least one molding structure, in particular the two molding structures together and / or jointly, covers potentially jagged and / or cracked, for example broken edges of the individual filters.
[0076] Embodiment 17. An optical detector for optically detecting electromagnetic radiation within a predefined wavelength range of interest, the optical detector comprising:
[0077] - at least one detector pixel; and
[0078] - At least one optical filter unit manufactured according to any of the preceding embodiments.
[0079] Embodiment 18. A spectrometer device, the spectrometer device comprising
[0080] - at least one optical detector according to any of the preceding embodiments relating to optical detectors; and
[0081] - at least one evaluation device configured to generate at least one item of spectral information from at least one detector signal generated by the at least one optical detector from the incident radiation. BRIEF DESCRIPTION OF THE DRAWINGS
[0082] Other optional features and embodiments are preferably disclosed in more detail in the subsequent description of the embodiments in conjunction with the dependent claims. Wherein, as the skilled person will recognize, the corresponding optional features can be implemented in an independent manner and in any arbitrary feasible combination. The scope of the present invention is not limited by the preferred embodiments. The embodiments are schematically depicted in the accompanying drawings. Wherein, the same reference numerals in these drawings represent the same or functionally equivalent elements.
[0083] In the attached picture:
[0084] Figure 1 shows a schematic representation of an embodiment of a spectrometer device comprising an optical detector having an optical filter unit;
[0085] 2a and 2b show different flow charts of a method for manufacturing at least one optical filter unit for a spectrometer device; and
[0086] 3a to 3c show different embodiments of an optical filter unit in a perspective view ( FIG. 3a ) and in a cross-sectional view ( FIGS. 3b and 3c );
[0087] Figures 4 to 7 Different schematic representations of different steps of a method for producing at least one optical filter unit for a spectrometer device are shown. DETAILED DESCRIPTION
[0088] exist Figure 1 In , a schematic representation of an embodiment of a spectrometer device 110 is shown, the spectrometer device 110 comprising an optical detector 112, wherein the optical detector comprises an optical filter unit 114. In addition to the optical detector 112, the spectrometer device 110 also comprises at least one evaluation device 116, which is configured to generate at least one item of spectral information from at least one detector signal generated by the at least one optical detector 112 from the incident radiation. Figure 1, incident radiation and its direction are schematically shown by arrows. As an example, the spectrometer device 110 may include a housing 118, which at least partially encloses an optical detector 112 having an optical filter unit 114. In addition to the optical filter unit 114, the optical detector 112 configured for optical detection of electromagnetic radiation in a predefined wavelength range of interest also includes at least one detector pixel 120.
[0089] The optical filter unit 114 can be manufactured by a method for manufacturing an optical filter unit 114 for a spectrometer device 110, namely by a manufacturing method 122. A flow chart of the method for manufacturing an optical filter unit 114 for a spectrometer device 110 is shown in Fig. 2a.
[0090] The manufacturing method 122 includes at least the following steps:
[0091] a) (indicated by reference numeral 124) providing at least one layer of filter material 126;
[0092] b) (indicated by reference numeral 128) producing individual filters 130 by singulating the filter material layer 126 into filters;
[0093] c) (indicated by reference numeral 132) providing a carrier 134;
[0094] d) (indicated by reference numeral 136) picking up individual filters 130 and placing them on a carrier 134;
[0095] e) (indicated by reference numeral 138) at least partially molding at least one moldable material onto the carrier 134 having the individual filters 130, thereby producing at least one molded structure 140 having a predefined pore size and a predefined pitch between the individual filters 130;
[0096] f) removing the carrier 134 (indicated by reference numeral 142) to produce a molded filter assembly 144; and
[0097] g) (indicated by reference numeral 146 ) singulating the molded filter assembly 144 into at least one optical filter unit 114 .
[0098] As an example, the manufacturing method 122 may further include a step h) (indicated by reference numeral 148): molding at least one moldable material onto the side of the filter 130 previously covered by the carrier 134, thereby producing at least one second molded structure 140 having a predefined aperture and a predefined pitch between individual filters 130. Step h) may specifically be performed between steps f) and g). Further, the manufacturing method 122 may include a step i) (indicated by reference numeral 150): flipping the molded structure 140 with individual filters 130 as produced in step e) 138. Step i) may specifically be performed before step h). A flow chart of a method for manufacturing an optical filter unit 114 for a spectrometer device 110 is shown in FIG. 2 b , the method comprising steps h) 148 and i) 150.
[0099] 3a, 3b and 3c illustrate different embodiments of an optical filter unit 114 manufactured by performing the manufacturing method 122. The optical filter unit 114 comprises individual filters 130 within at least one molding structure 140. In particular, a predefined aperture, such as a predefined opening on each individual filter 130, is formed by the at least one molding structure 140. Further, the at least one molding structure 140 also ensures a predefined pitch, such as a predefined distance, between the individual filters 130.
[0100] Figure 4 FIG. 8 to FIG. 8 show different schematic representations of steps of a method for producing at least one optical filter unit 114 for a spectrometer device 110 , ie a production method 122 .
[0101] As an example, Figure 4 The execution of step b) is shown exemplarily, wherein individual filters 130 are produced by singulating the filter material layer 126. In particular, the filter material layer 126 may be singulated into predefined sizes by mechanical dicing, laser dicing, scribing or any other singulation method (ie as described above). Figure 4 In FIG. 1 , dashed lines represent singulation paths, such as cutting lines and / or slicing lines.
[0102] Further, the carrier 134 provided in step c) may, for example, comprise a foil 152, such as a carrier foil, laminated on a carrier material layer 154, the foil comprising, for example, at least one release material. Such a carrier 134 (i.e. produced by laminating a foil 152 on a carrier material layer 154) is exemplarily shown in Figure 5 middle.
[0103] Figure 6The molded filter assembly 144 produced in step f) is exemplarily shown in a top plan view. Specifically, in the subsequent step g), the molded filter assembly 144 can then be singulated into a plurality of optical filter units 114. For example, Figure 6 The molded filter assembly 144 exemplarily shown in FIG. 1 is singulated into six optical filter units 114. One such optical filter unit 114 is arranged parallel to Figure 6 The cross-sectional view of the top plan view is shown as an example. Figure 7 Wherein, as an example, "d" may refer to the distance between the centers of adjacent filters 130, "x" may refer to the horizontal distance between the edges of adjacent filters 130, and "y" may refer to the vertical distance between the edges of adjacent filters 130, "A" may refer to the inner area of the filter 130, and "F" may refer to the area of the filter 130 including the edge.
[0104] Specifically, in the optical filter unit 114, the edges of the filters 130 may be at least partially covered by the molding structure 140. In particular, at least one molding structure 140 may cover potentially jagged and / or cracked edges, such as broken edges, of individual filters 130.
[0105] List of Reference Numerals
[0106] 110 Spectrometer equipment
[0107] 112 Optical detector
[0108] 114 Optical filter unit
[0109] 116 Evaluation Equipment
[0110] 118 Housing
[0111] 120 detector pixels
[0112] 122 Manufacturing method
[0113] 124 Step a)
[0114] 126 filter material layer
[0115] 128 Step b)
[0116] 130 Filter
[0117] 132 Step c)
[0118] 134 Carrier
[0119] 136 Step d)
[0120] 138 Step e)
[0121] 140 Molded Structure
[0122] 142 Step f)
[0123] 144 Molded filter components
[0124] 146 Step g)
[0125] 148 Step h)
[0126] 150 Step i)
[0127] 152 Foil
[0128] 154 Carrier material
Claims
1. A method for manufacturing an optical filter unit (114) for a spectrometer device (110), the method comprising: a) providing at least one layer (126) of filter material; b) producing individual filters (130) by singulating the filter material layer (126) into filters (130); c) providing a carrier (134); d) picking up the individual filters (130) and placing them on the carrier (134); e) at least partially molding at least one moldable material onto the carrier (134) having the individual filters (130), thereby producing at least one molded structure (140) having a predefined pore size and a predefined pitch between the individual filters (130); f) removing the carrier (134) to produce a molded filter assembly (144); and g) singulating the molded filter assembly (144) into at least one optical filter unit (114).
2. The method according to the preceding claim, wherein: The individual filters (130) are singulated to have at least one predefined dimension.
3. A method according to any one of the preceding claims, wherein: The individual filters (130) are singulated using at least one singulation method.
4. The method according to the preceding claim, wherein: The at least one singulation method is selected from at least one of the following: mechanical dicing, such as sawing and / or cutting; laser dicing; plasma dicing; scribing and breaking.
5. A method according to any one of the preceding claims, wherein: Step c) comprises producing the carrier (134) by laminating a foil (152) onto a layer (154) of carrier material.
6. The method according to the preceding claim, wherein: The foil (152) includes at least one release material configured to achieve non-destructive separation of the carrier (134) from the molded structure (140) when the carrier (134) is removed in step f).
7. A method according to any one of the preceding claims, wherein: The individual filters (130) are placed on the carrier (134) in a predefined arrangement and with a predefined distance between the individual filters (130).
8. A method according to any one of the preceding claims, wherein: The molding process is selected from at least one of: cavity molding; such as injection molding and / or compression molding; selective melting, such as selective laser melting; and open core molding, such as transfer molding, for example in combination with dynamic clamping.
9. A method according to any one of the preceding claims, wherein: Between steps f) and g), the method further comprises: h) molding at least one moldable material onto the side of the filters (130) previously covered by the carrier (134), thereby producing at least one second molded structure (140) having a predefined aperture and a predefined pitch between the individual filters (130).
10. The method according to the preceding claim, wherein: Before step h), the method further comprises: i) Turning over the molded structure ( 140 ) with the individual filters ( 130 ) produced in step e).
11. A method according to any one of the preceding claims, wherein: The molded structure (140) is configured to at least one of block and absorb electromagnetic radiation having a wavelength λ of 300 nm ≤ λ ≤ 10 μm.
12. A method according to any one of the preceding claims, wherein: The at least one molding structure (140) at least partially encloses the individual filters (130).
13. The method according to the preceding claim, wherein: The at least one molding structure (140) covers potentially jagged and / or cracked edges of the individual filters (130).
14. An optical detector (112) for optically detecting electromagnetic radiation within a predefined wavelength range of interest, the optical detector (112) comprising: - at least one detector pixel (120); as well as - At least one optical filter unit (114) manufactured according to any of the preceding claims.
15. A spectrometer device (110), the spectrometer device comprising: - at least one optical detector (112) according to the preceding claim; as well as - at least one evaluation device (116) configured to generate at least one item of spectral information from at least one detector signal generated by the at least one optical detector (112) from incident radiation.