Tool for assembling magnetic reed switch on semiconductor flow switch sensor

By designing semiconductor flow switch sensors to assemble reed switch tooling, the fixing part and clamping part ensure the axis position of the reed switch and the adjustment depth of the adjusting part, the stability and accuracy problems during the assembly process are solved, and the product quality is improved Manufacturing efficiency.

CN119260337APending Publication Date: 2025-01-07AEROTECH BEIJING
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Patent Information

Application Number
CN202411521225.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-29
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

During the assembly process of existing semiconductor flow switch sensors, the installation of reed switches is unstable and has poor accuracy, resulting in trip point errors and affecting product quality and manufacturing efficiency.

Method used

Design a semiconductor flow switch sensor to be equipped with a reed switch tool, including a fixing part, a clamping part and an adjusting part, which ensures the axis position of the reed switch through a clamping shell fixing, jaw clamping and positioning mechanism, and is controlled by an adjustment knob and drive. The mechanism adjusts the depth of the reed switch to ensure the coaxiality and stability of the mounting holes.

Benefits of technology

It improves the stability and accuracy of the mounting holes of reed switches and flow switch sensors, prevents the reed switch from shifting during the glue filling process, ensures the accuracy of position adjustment, and improves the production efficiency and product quality of semiconductor sensors.

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Abstract

The invention discloses a tool for assembling a magnetic reed switch on a semiconductor flow switch sensor, and relates to the technical field of semiconductor part processing, and the tool comprises a fixing part which comprises a clamping shell and is clamped on a shell of the flow switch sensor through the clamping shell; the clamping and grabbing part comprises a clamping jaw and a positioning mechanism, the clamping jaw is used for clamping and fixing the magnetic reed switch, and the magnetic reed switch is located on the axis of the mounting hole through the positioning mechanism; and the adjusting part comprises an adjusting knob and a driving mechanism, and the adjusting knob is connected with the clamping and grabbing part through the driving mechanism, so that the clamping and grabbing part is driven to move in the axis direction of the mounting hole by rotating the adjusting knob, and the depth of the magnetic reed switch extending into the mounting hole is adjusted. Compared with the prior art, the tool provided by the invention not only ensures that the coaxiality of the magnetic reed switch and the mounting hole is relatively high, but also the magnetic reed switch has good stability, and meanwhile, the depth of the magnetic reed switch extending into the mounting hole can be adjusted, so that the magnetic reed switch can be kept at an accurate position in the mounting hole.
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Description

Technical Field

[0001] The invention relates to the technical field of semiconductor parts processing, in particular to a semiconductor flow switch sensor assembly magnetic reed switch tool. Background Art

[0002] Semiconductor sensor is a new type of semiconductor device, whose main function is to convert non-electrical signals into electrical signals. Semiconductor sensor can realize the mutual conversion between physical quantities such as electricity, light, temperature, displacement, pressure, etc., and is easy to realize integration and multifunctionality. It is widely used in automated detection systems. In the production process of semiconductor sensors, the assembly link is particularly related to the quality of the final product. The flow switch sensor (Flow Switch Sensor) in its semiconductor sensor is a device used to monitor the flow of liquid, air or other gaseous media through a pipeline, system or loop, and is composed of a flow sensitive element and a switch control device. The specific steps for installing the reed switch to the flow switch sensor in the existing production process are as follows:

[0003] 1. Insert: Insert the reed switch into the mounting hole of the flow switch sensor;

[0004] 2. Adjust the position: manually adjust the coaxiality and axial position of the mounting hole of the flow switch sensor and the reed switch, and the gap between the mounting hole of the flow switch sensor and the outer circumference of the reed switch should be kept within 1mm;

[0005] 3. Glue filling: drip glue into the gap between the mounting hole of the switch sensor and the outer circumference of the reed switch;

[0006] 4. Maintain: Maintain the relative position of the switch sensor mounting hole and the reed switch until the glue dries and solidifies.

[0007] However, the adjustment and maintenance status in the above installation process are all achieved manually, so the coaxiality of the adjustment will be poor in the entire assembly process, and the stability in the relative state maintenance will be poor. The reed switch potting will be skewed, resulting in the flow switch sensor tripping point error being different from the set value. At the same time, during the glue pouring process, the reed switch is affected by the buoyancy of the liquid glue, causing the reed switch to shift, which will also cause the flow switch sensor tripping point error being different from the set value, resulting in inaccurate position adjustment, resulting in the reed switch being unable to adjust the switch of the flow switch sensor, which not only affects the efficiency of semiconductor sensor manufacturing, but also greatly affects the reliability of the final product quality.

[0008] Therefore, how to improve the stability and accuracy of the mounting hole assembly of the reed switch and the flow switch sensor is a technical problem that technicians in this field currently need to solve. Summary of the invention

[0009] The object of the present invention is to provide a semiconductor flow switch sensor assembly reed switch tooling for improving the stability and accuracy of the assembly of the reed switch and the mounting hole of the flow switch sensor.

[0010] In order to achieve the above object, the present invention provides the following technical solutions:

[0011] A semiconductor flow switch sensor assembly reed switch tool, used to install the reed switch in the installation hole of the flow switch sensor, comprising:

[0012] The fixing part includes a clamping shell, and is clamped on the housing of the flow switch sensor through the clamping shell;

[0013] A clamping portion, comprising a clamping claw and a positioning mechanism, wherein the clamping claw is used to clamp and fix the reed switch, and the reed switch is located on the axis of the mounting hole through the positioning mechanism;

[0014] The adjusting part includes an adjusting knob and a driving mechanism. The adjusting knob is connected to the clamping part through the driving mechanism, so that the clamping part is driven to move along the axial direction of the mounting hole by rotating the adjusting knob to adjust the depth of the reed switch extending into the mounting hole.

[0015] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the clamping part also includes a clamping base and a compression spring, the clamping includes a first clamp and a second clamp, the clamping base is provided with a sliding shaft, the first clamp and the second clamp are both connected to the sliding shaft, and at least one of the first clamp and the second clamp can be slidably installed on the sliding shaft, the compression spring is sleeved on the sliding shaft, one end of the compression spring abuts against the clamping base, and the other end of the compression spring abuts against a slidable one of the first clamp and the second clamp, so that the first clamp and the second clamp can press each other to clamp the reed switch.

[0016] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the clamping portion is also provided with a guide block connected to the clamping base, and the guide block is provided with a guide hole, and the first clamp and the second clamp both pass through the guide hole, and the guide hole extends along the sliding direction of the first clamp and the second clamp.

[0017] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the positioning mechanism is configured as a clamping ring clamped on the cylindrical surface of the reed switch, a part of the clamping ring is located on the first clamp, another part of the clamping ring is located on the second clamp, and the center of the clamping ring is located on the axis of the mounting hole.

[0018] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the fixing portion includes a clamping shell, a side surface of the clamping shell is provided with a snap-in entrance so that the clamping shell can be nested into the housing of the flow switch sensor through the snap-in entrance, and one end of the clamping shell is provided with a through hole so that the reed switch can extend into the mounting hole through the through hole.

[0019] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, a lower card plate is provided at the end of the clamping shell corresponding to the through hole, and a button is provided at the end of the clamping shell with the through hole, the button is connected to the lower card plate through a push rod, and a tension spring is sleeved on the push rod, the tension spring is connected to the lower card plate, the button pushes the lower card plate to move through the push rod, and the tension spring undergoes elastic deformation to press the lower card plate tightly against the housing of the flow switch sensor.

[0020] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the button is also provided with a conical push block, and the conical push block is located between the first clamp and the second clamp, and when the button moves, the conical push block is used to push the first clamp and the second clamp apart.

[0021] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the driving mechanism includes a threaded adjusting screw and a nut, the nut is connected to the clamping shell, one end of the adjusting screw extends along the axial direction of the mounting hole and is connected to the clamping base, and the other end of the adjusting screw is connected to the adjusting knob.

[0022] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the adjustment part further includes a guide rail, the guide rail is provided with a guide rail groove extending along the axial direction of the adjustment screw, the clamping base is provided with a slider slidably matched with the guide rail groove, the slider extends along the extension direction of the guide rail and is connected to the guide block,

[0023] Optionally, in the above-mentioned semiconductor flow switch sensor assembly reed switch tooling, the adjustment part is also provided with a locking rod, one end of the locking rod is connected to the button, the other end of the locking rod is provided with a locking section, and the adjustment knob is provided with a locking gear, when the button pushes the lower clamping plate to move, the button pushes the locking rod to move so that the locking section extends into the tooth groove of the locking gear.

[0024] When the semiconductor flow switch sensor provided by the present invention is assembled with the reed switch tooling and used, it is fixed to the outer shell of the sensor by clamping the clamping shell of the fixing part, and the reed switch is clamped and fixed by the clamping part. The clamping part makes the fixed reed switch located on the axis of the mounting hole of the sensor, and the adjusting knob of the adjusting part can be rotated to drive the clamping part to move along the axis direction of the mounting hole, thereby realizing the adjustment of the depth of the reed switch extending into the mounting hole. Compared with the working process in the prior art in which the staff manually inserts the reed switch into the mounting hole of the flow switch sensor and injects glue to cool it, the semiconductor flow switch sensor assembly reed switch tool provided by the present invention not only ensures that the reed switch is located on the axis of the mounting hole through the fixing part and the clamping part, and ensures that the coaxiality of the reed switch and the mounting hole is high, but also the reed switch located in the mounting hole has good stability during the entire installation process, and the displacement of the reed switch is prevented during the glue injection process. At the same time, the depth of the reed switch inserted into the mounting hole can be adjusted through the adjustment part, so that the reed switch is inserted to a prefabricated point that meets the manufacturing requirements. Therefore, the semiconductor flow switch sensor assembly reed switch tool provided by the present invention enables the reed switch to maintain a precise position in the mounting hole, thereby ensuring the operation of the reed switch regulating the flow switch sensor, improving the production efficiency of semiconductor sensors, and significantly improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0026] Figure 1 A schematic diagram of the structure of a reed switch tooling for assembling a semiconductor flow switch sensor disclosed in an embodiment of the present invention;

[0027] Figure 2 for Figure 1 A partial enlarged view of middle A;

[0028] Figure 3 A schematic diagram of the clamping jaws disclosed in an embodiment of the present invention being pushed open;

[0029] Figure 4 A cross-sectional schematic diagram of a semiconductor flow switch sensor disclosed in an embodiment of the present invention assembled with a reed switch tool;

[0030] Figure 5 It is a schematic diagram of the lower clamping plate being pushed open by the push rod according to the embodiment of the present invention;

[0031] Figure 6 A schematic top view of a semiconductor flow switch sensor according to an embodiment of the present invention assembled with a reed switch tool;

[0032] Figure 7 for Figure 6 Cross-sectional view of BB.

[0033] Reference numerals:

[0034] 100 is a fixing part, 110 is a clamping shell, 120 is a button, 121 is a push rod, 122 is a conical push block, 130 is a lower clamping plate, 131 is a storage slot, 132 is a sealing gasket, and 140 is a tension spring;

[0035] 200 is a clamping part, 210 is a clamping base, 211 is a sliding shaft, 212 is a slider, 220 is a compression spring, 230 is a first clamping part, 240 is a second clamping part, 250 is a guide block, 251 is a guide hole, 260 is a clamping ring,

[0036] 300 is an adjusting part, 310 is an adjusting knob, 311 is a locking gear, 320 is an adjusting screw, 330 is a nut, 340 is a guide rail, 341 is a guide rail groove, 350 is a locking rod, and 351 is a locking section;

[0037] 10 is a flow switch sensor;

[0038] 20 is a reed switch. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0040] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0042] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] The core of the present invention is to provide a semiconductor flow switch sensor assembly reed switch tooling for improving the stability and accuracy of the assembly of the mounting hole of the reed switch and the flow switch sensor.

[0045] like Figure 1As shown, an embodiment of the present invention discloses a semiconductor flow switch sensor assembly reed switch tooling, through which the semiconductor flow switch sensor assembly reed switch tooling provided by the embodiment of the present invention is used to assemble the reed switch 20 into the mounting hole of the flow switch sensor 10, including a fixing portion 100, a clamping portion 200 and an adjusting portion 300. Among them, the fixing part 100 is provided with a clamping shell 110, which is clamped to the outer shell of the flow switch sensor 10 through the clamping shell 110, so that the semiconductor flow switch sensor assembly reed switch tooling provided in this embodiment is stably fixed on the flow switch sensor 10, and the reed switch 20 is clamped and fixed by the clamping claws of the clamping part 200, so that the reed switch 20 can always maintain good stability during the entire assembly process, and avoid large displacement and shaking of the reed switch 20 during the assembly process. In addition, the positioning mechanism of the clamping part 200 can make the reed switch 20 located on the axis of the mounting hole, ensuring that the reed switch 20 and the mounting hole have good coaxiality, so that the reed switch 20 and the inner wall of the mounting hole maintain a uniform gap, thereby improving the uniformity of the glue injection and the accuracy of the position of the reed switch 20. At the same time, the semiconductor flow switch sensor assembly reed switch tool provided in this embodiment is also provided with an adjustment part 300 having an adjustment knob 310 and a driving mechanism. The adjustment knob 310 is connected to the clamping part 200 through the driving mechanism. When the adjustment knob 310 is turned, the clamping part 200 is driven by the driving mechanism to move along the axial direction of the mounting hole, thereby adjusting the depth of the reed switch 20 fastened to the clamping part 200 extending into the mounting hole, so as to ensure that the insertion depth of the reed switch 20 can meet the assembly requirements. Therefore, in the entire assembly process of the reed switch 20 and the mounting hole of the flow switch sensor 10, the semiconductor flow switch sensor assembly reed switch tool provided in this embodiment realizes that the reed switch 20 has a high precision position in the mounting hole, ensures the normal operation of the reed switch 20 adjusting the switch of the flow switch sensor 10, and improves the quality and qualified rate of product manufacturing.

[0046] like Figure 2 and Figure 3As shown, the clamping part 200 also includes a clamping base 210 and a compression spring 220, and the clamping includes a first clamping 230 and a second clamping 240. The clamping base 210 is also provided with a sliding shaft 211, and the first clamping 230 and the second clamping 240 are both connected to the sliding shaft 211, and at least one of the first clamping 230 and the second clamping 240 is slidably mounted on the sliding shaft 211, and the compression spring 220 is sleeved on the sliding shaft 211, and one end of the compression spring 220 abuts on the clamping base 210, and the other end of the compression spring 220 abuts on the slidable one of the first clamping 230 and the second clamping 240, so that the first clamping 230 and the second clamping 240 are pressed against each other by the elastic force of the compression spring 220, so as to clamp and fix the magnetic reed switch 20. In a specific embodiment, the first clamp 230 and the second clamp 240 can be slidably connected to the sliding shaft 211, so that the first clamp 230 and the second clamp 240 can move closer or farther, and the first clamp 230 and the second clamp 240 are respectively arranged with a compression spring 220, and the two compression springs 220 provide elastic pressure at the same time, further improving the clamping force of the first clamp 230 and the second clamp 240, and improving the stability of the clamping claws clamping the reed switch 20.

[0047] In addition, the clamping portion 200 is also provided with a guide block 250, which is fixedly connected to the clamping base 210, and the guide block 250 is provided with a guide hole 251, and the first clamping claw 230 and the second clamping claw 240 extend through the guide hole 251 toward the mounting hole of the flow switch sensor 10, and the guide hole 251 extends along the sliding direction of the first clamping claw 230 and the second clamping claw 240, so that during the sliding process of the first clamping claw 230 and the second clamping claw 240, the guide hole 251 plays a guiding role, ensuring that the sliding of the first clamping claw 230 and the second clamping claw 240 has good stability and smoothness, which is conducive to improving the efficiency of the first clamping claw 230 and the second clamping claw 240 clamping and fixing the reed switch 20, as well as the separate disassembly work. In a specific embodiment, a key slot is provided in the clamp base 210, and a key block is provided in the first clamp 230 and the second clamp 240. The first clamp 230 and the second clamp 240 are respectively slidably installed in the key slot through the key block. The key slot extends along the moving direction of the first clamp 230 and the second clamp 240, so that the first clamp 230 and the second clamp 240 slide along the key slot to clamp or separate each other. In addition, during the process of pressing and separating the first clamp 230 and the second clamp 240, the key block cooperates with the key slot to avoid the problem of unstable depth of the reed switch 20 inserted into the installation hole when the first clamp 230 and the second clamp 240 rotate around the sliding shaft 211, further improving the stability of the clamping of the reed switch 20. Alternatively, a long square hole is provided in the clamp base 210, and the first clamp 230 and the second clamp 240 are square rods that match the square hole. The square rods are slidably installed in the square hole, which can also achieve the above effect.

[0048] like Figure 3 As shown, the positioning mechanism is configured as a clamping ring 260 clamped on the cylindrical surface of the reed switch 20, a portion of the clamping ring 260 is located on the first clamping claw 230, and the other portion of the clamping ring is arranged on the second clamping claw 240, and when the semiconductor flow switch sensor assembly reed switch tooling provided in this embodiment is fixed to the flow switch sensor 10 through the fixing portion 100, the center of the clamping ring 260 is located on the axis of the mounting hole, so that when the reed switch 20 is clamped and fixed by the clamping ring 260, the reed switch 20 is on the axis of the mounting hole, achieving good coaxiality between the reed switch 20 and the mounting hole.

[0049] like Figure 1As shown, a clamping inlet is provided on one side of the clamping shell 110, so that when the semiconductor flow switch sensor assembly magnetic reed switch tool provided in this embodiment is installed with the flow switch sensor 10, the clamping shell 110 is inserted into the outer shell of the flow switch sensor 10 through the clamping inlet, so that the clamping shell 110 is clamped on the flow switch sensor 10. A through hole is provided at one end of the clamping shell 110 that fits the mounting hole of the flow switch sensor 10, and the magnetic reed switch 20 extends into the mounting hole of the flow switch sensor 10 through the through hole.

[0050] like Figure 4 and Figure 5 As shown, in another specific embodiment, the clamping shell 110 is provided with a through hole and a button 120 is provided, and a lower card plate 130 is provided at the end corresponding to the through hole. The button 120 is connected to the lower card plate 130 through a push rod 121, and the push rod 121 is also sleeved with a tension spring 140, and the tension spring 140 is connected to the lower card plate 130, so that pressing the button 120 pushes the lower card plate 130 to move and insert the clamping shell 110 into the flow switch sensor 10. When the lower card plate 130 is attached to the outer shell of the flow switch sensor 10, the stretched tension spring 140 undergoes elastic deformation, and the tension spring 140 applies elastic tension to the lower card plate 130, so that the lower card plate 130 is pressed tightly against the outer shell of the flow switch sensor 10, thereby referring to Figure 1 The clamping shell 110 is clamped and fixed to the outer shell of the flow switch sensor 10 by means of the tension spring 140 and the lower clamping plate 130, thereby ensuring the stability of the clamping connection between the clamping shell 110 and the flow switch sensor 10 and preventing the reed switch 20 from deviating and shaking in the mounting hole of the flow switch sensor 10 during the assembly process.

[0051] At the same time, in the process of pouring glue into the gap between the reed switch 20 and the mounting hole of the switch sensor, in order to prevent a large amount of glue in the mounting hole from leaking out from the lower card plate 130, the lower card plate 130 provided in this embodiment is provided with a storage groove 131 on the side facing the mounting hole, and excess glue can be stored through the storage groove 131. In addition, a sealing gasket 132 is also laid on the side facing the mounting hole of the lower card plate 130, and the sealing gasket 132 surrounds the periphery of the storage groove 131. Therefore, the storage groove 131 and the sealing gasket 132 prevent the glue from leaking out, thereby ensuring the reliability of the bonding and fixation of the reed switch 20.

[0052] like Figure 6 and Figure 7As shown, the button 120 is also provided with a conical push block 122, and the conical push block 122 is located between the first clamping claw 230 and the second clamping claw 240. Therefore, when the push button 120 is pushed, the conical push block 122 connected to the push button 120 moves toward the gap between the first clamping claw 230 and the second clamping claw 240. As the conical push block 122 continues to move downward, the first clamping claw 230 and the second clamping claw 240 are pushed apart, thereby facilitating the placement of the reed switch 20 in the clamping ring 260, or facilitating the quick removal of the reed switch 20 from the clamping ring 260, thereby improving the efficiency of tooling installation and use.

[0053] like Figure 4 and Figure 5 As shown, the driving mechanism includes an adjusting screw 320 and a nut 330 that cooperate with each other through threads. The nut 330 is fixedly connected to the clamping shell 110. One end of the adjusting screw 320 extends along the axial direction of the mounting hole and is connected to the clamping base 210. The other end of the adjusting screw 320 is connected to the adjusting knob 310. By rotating the adjusting knob 310, the adjusting screw 320 that cooperates with the nut 330 can move up and down along the axial direction of the mounting hole, driving the clamping base 210 connected to the adjusting screw 320 to move, thereby completing the driving of the driving mechanism.

[0054] like Figure 3 As shown, the adjustment part also includes a guide rail 340, and the guide rail 340 is provided with a guide rail groove 341, which extends along the axial direction of the adjusting screw 320, and a slider 212 is arranged on the clamping base 210, and the slider 212 is slidably installed in the guide rail groove 341, and at the same time, the slider 212 is extended along the extension direction of the guide rail groove 341 and connected to the guide block 250, so that the guide block 250 is connected to the clamping base 210 through the slider 212, so that the guide rail groove 341 of the guide rail 340 cooperates with the slider 212 of the clamping base 210, so that the guide rail groove 341 guides the slider 212, thereby ensuring that the adjusting knob 310 drives the clamping base 210 through the driving mechanism to smoothly and steadily move up and down along the axial direction of the mounting hole of the flow switch sensor 10.

[0055] Furthermore, during the installation and use of the semiconductor flow switch sensor assembly reed switch tooling and the flow switch sensor 10 provided in the present embodiment, when the staff presses the button 120 with one hand and holds the clamping shell 110 with the other hand, the hand may accidentally touch the adjusting knob 310 or the adjusting screw 320 to move the clamping base 210, or the clamping base 210 may be forced to move downward during the pressing process, which will cause the insertion depth of the reed switch 20 clamped in the clamping ring 260 into the mounting hole of the flow switch sensor 10 to change, resulting in the problem of not meeting the assembly requirements. To this end, the adjustment part 300 in the magnetic reed switch tooling of the semiconductor flow switch sensor provided in this embodiment is also provided with a locking rod 350, one end of the locking rod 350 is connected to the button 120, and the other end of the locking rod 350 is provided with a locking section 351, and the adjusting knob 310 is provided with a locking gear 311, so that while the lower clamping plate 130 is pushed to move by the adjusting knob 310, the adjusting knob 310 also pushes the locking rod 350 to move, so that the locking section 351 at one end of the locking rod 350 extends into the tooth groove of the locking gear 311, thereby locking the locking gear 311, preventing the adjustment screw 320 connected to the adjusting knob 310 from rotating, ensuring the stability of the insertion depth of the magnetic reed switch 20 fixed in the clamping ring 260, and improving the accuracy of the position of the magnetic reed switch 20 in the mounting hole of the flow switch sensor 10.

[0056] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0057] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A semiconductor flow switch sensor assembly reed switch tool, characterized in that: Used to install a reed switch (20) in a mounting hole of a flow switch sensor (10), comprising: The fixing part (100) comprises a clamping shell (110) and is clamped on the housing of the flow switch sensor (10) through the clamping shell (110); A clamping portion (200) comprises a clamping claw and a positioning mechanism, wherein the clamping claw is used to clamp and fix the reed switch (20), and the positioning mechanism enables the reed switch (20) to be located on the axis of the mounting hole; The adjusting portion (300) comprises an adjusting knob (310) and a driving mechanism, wherein the adjusting knob (310) is connected to the clamping portion (200) via the driving mechanism so that the adjusting knob (310) is rotated to drive the clamping portion (200) to move along the axis direction of the mounting hole, thereby adjusting the depth of the reed switch (20) extending into the mounting hole.

2. The semiconductor flow switch sensor assembly reed switch tooling according to claim 1, characterized in that: The clamping portion (200) further comprises a clamping base (210) and a compression spring (220), wherein the clamping comprises a first clamping (230) and a second clamping (240), wherein the clamping base (210) is provided with a sliding shaft (211), wherein the first clamping (230) and the second clamping (240) are both connected to the sliding shaft (211), and at least one of the first clamping (230) and the second clamping (240) is slidably mounted on the sliding shaft (211), wherein the compression spring (220) is sleeved on the sliding shaft (211), wherein one end of the compression spring (220) abuts against the clamping base (210), and the other end of the compression spring (220) abuts against one of the first clamping (230) and the second clamping (240) that is slidable, so that the first clamping (230) and the second clamping (240) can press each other and clamp the reed switch (20).

3. The semiconductor flow switch sensor assembly reed switch tooling according to claim 2, characterized in that: The clamping portion (200) is further provided with a guide block (250) connected to the clamping base (210), and a guide hole (251) is provided on the guide block (250), and the first clamping grip (230) and the second clamping grip (240) both pass through the guide hole (251), and the guide hole (251) extends along the sliding direction of the first clamping grip (230) and the second clamping grip (240).

4. The semiconductor flow switch sensor assembly reed switch tooling according to claim 3, characterized in that: The positioning mechanism is configured as a clamping ring (260) clamped on the cylindrical surface of the reed switch (20), a portion of the clamping ring (260) is located on the first clamping grip (230), another portion of the clamping ring (260) is located on the second clamping grip (240), and the center of the clamping ring (260) is located on the axis of the mounting hole.

5. The semiconductor flow switch sensor assembly reed switch tooling according to claim 2, characterized in that: A snap-in entrance is provided on one side of the clamping shell (110) so that the clamping shell (110) can be nested in the housing of the flow switch sensor (10) through the snap-in entrance, and a through hole is provided on one end of the clamping shell (110) so that the reed switch (20) can extend into the mounting hole through the through hole.

6. The semiconductor flow switch sensor assembly reed switch tooling according to claim 5, characterized in that: A lower card plate (130) is provided at one end of the clamping shell (110) corresponding to the through hole, and a button (120) is provided at one end of the clamping shell (110) where the through hole is opened. The button (120) is connected to the lower card plate (130) through a push rod (121), and a tension spring (140) is sleeved on the push rod (121). The tension spring (140) is connected to the lower card plate (130). The button (120) pushes the lower card plate (130) to move through the push rod (121), and the tension spring (140) undergoes elastic deformation so that the lower card plate (130) is pressed against the housing of the flow switch sensor (10).

7. The semiconductor flow switch sensor assembly reed switch tooling according to claim 6, characterized in that: The button (120) is also provided with a conical push block (122), and the conical push block (122) is located between the first clamping grip (230) and the second clamping grip (240). When the button (120) moves, the conical push block (122) is used to push the first clamping grip (230) and the second clamping grip (240) to be separated.

8. The semiconductor flow switch sensor assembly reed switch tooling according to claim 4, characterized in that: The driving mechanism comprises an adjusting screw (320) and a nut (330) which are threadedly matched, wherein the nut (330) is connected to the clamping shell (110), one end of the adjusting screw (320) extends along the axial direction of the mounting hole and is connected to the clamping base (210), and the other end of the adjusting screw (320) is connected to the adjusting knob (310).

9. The semiconductor flow switch sensor assembly reed switch tooling according to claim 8, characterized in that: The adjusting portion (300) further comprises a guide rail (340), wherein the guide rail (340) is provided with a guide rail groove (341) extending along the axial direction of the adjusting screw (320), and the clamping base (210) is provided with a slider (212) slidably matched with the guide rail groove (341), and the slider (212) extends along the extension direction of the guide rail (340) and is connected to the guide block (250).

10. The semiconductor flow switch sensor assembly reed switch tooling according to claim 6, characterized in that: The adjusting portion (300) is further provided with a locking rod (350), one end of which is connected to the button (120), and the other end of which is provided with a locking section (351). The adjusting knob (310) is provided with a locking gear (311). When the button (120) pushes the lower clamping plate (130) to move, the button (120) pushes the locking rod (350) to move, so that the locking section (351) extends into the tooth groove of the locking gear (311).