Grinding device and grinding method

Abstract

The application provides a grinding device and a grinding method, and belongs to the technical field of device grinding. The device comprises a support, a driving module installed on the support, a grinding tool connected with the driving module, the driving module being used for driving the grinding tool to grind a surface to be ground of a device to be ground, a bearing member used for placing the device to be ground, and a liquid container arranged in the support, the bearing member being arranged in the liquid container, and a liquid medium being arranged in the liquid container and used for bearing the bearing member; wherein the driving module can drive the bearing member to move up and down in the liquid container, so as to adjust the grinding force of the grinding tool on the device to be ground. The application can flexibly adjust the grinding force during the grinding process, and improve the applicability of the grinding device.

Description

Technical Field

[0001] The present application relates to the field of device grinding technology, and in particular to a grinding device and a grinding method. Background Art

[0002] Grinding is a precision machining method used to improve the surface quality and shape accuracy of a workpiece. Device grinding involves the relative motion of a grinding device and the workpiece under pressure to achieve a precise surface finish. This method can be used to machine a variety of metal and non-metallic materials. In the manufacture or maintenance of mechanical equipment, before a specific area on an object's surface is tightly connected or sealed to another object or component, it is often necessary to grind the sealing surface of the sealed object to ensure the seal is accurate. Examples include grinding the sealing surfaces of valve discs and valve seats, and grinding the sealing surfaces of flange assembly steps.

[0003] At present, the grinding process is mainly divided into manual grinding and automatic grinding (also known as mechanical grinding). With the development of social industrial technology and the needs of special working scenarios (such as grinding in a radioactive environment, super hardened alloy grinding, etc.), automatic grinding has gradually replaced manual grinding in a wider range of fields. However, the automatic grinding method of the related art usually grinds the grinding tool and the workpiece to be ground in a relatively fixed manner. At this time, if the surface to be ground of the workpiece to be ground is a plane, it can be ground normally, but if the surface to be ground of the workpiece to be ground is a special plane such as a conical surface or a spherical surface, the grinding force cannot be adaptively adjusted, thereby affecting the grinding effect of special planes such as conical surfaces and spherical surfaces. Therefore, how to provide a grinding device that can flexibly adjust the grinding force of special planes such as conical surfaces and spherical surfaces during the grinding process has become a technical problem that needs to be solved urgently. Summary of the Invention

[0004] The main purpose of the embodiments of the present application is to propose a grinding device and a grinding method, which can flexibly adjust the grinding force of special planes such as conical surfaces and spherical surfaces during the grinding process, thereby improving the applicability of the grinding device.

[0005] To achieve the above objectives, a first aspect of an embodiment of the present application provides a grinding device, comprising:

[0006] Bracket;

[0007] A driving module is installed on the bracket;

[0008] A grinding tool connected to the driving module, wherein the driving module is used to drive the grinding tool to grind the surface of the workpiece to be ground;

[0009] a carrier for placing the workpiece to be ground; and

[0010] a liquid container, disposed in the bracket, the carrier being disposed in the liquid container, and the liquid container containing a liquid medium for supporting the carrier;

[0011] The driving module can drive the carrier to move up and down in the liquid container to adjust the grinding force of the grinding tool on the workpiece to be ground.

[0012] In some embodiments, the central symmetry axis of the grinding tool, the central symmetry axis of the carrier, and the central symmetry axis of the workpiece to be ground are on the same straight line.

[0013] In some embodiments, the grinding device further comprises:

[0014] a liquid level detection component, configured to detect changes in the liquid level in the liquid container and output a control signal;

[0015] The driving module is in communication with the controller and can drive the carrier to move according to the control signal.

[0016] In some embodiments, the liquid level detection component includes:

[0017] a liquid level sensor, mounted on the bracket and extending into the liquid container, for detecting changes in the liquid level; and

[0018] The controller is in communication with the liquid level sensor and is used to calculate the magnitude of the grinding force according to the liquid level change data of the liquid level sensor and output the control signal.

[0019] In some embodiments, the grinding device further comprises:

[0020] a water inlet control valve, communicatively connected to the controller, the water inlet control valve being used to control the flow rate of the liquid medium injected into the liquid container; and

[0021] A drainage control valve is communicatively connected to the controller, and the drainage control valve is used to control the flow rate of the liquid medium discharged from the liquid container.

[0022] In some embodiments, the carrier is marked with scales, and different scales correspond to different grinding forces.

[0023] In some embodiments, the outer surface of the carrier is spherical or hemispherical.

[0024] In some embodiments, when the surface to be ground of the workpiece to be ground is a conical surface or a spherical surface, the grinding head of the grinding tool is adapted to the surface to be ground of the workpiece to be ground.

[0025] In some embodiments, the workpiece to be ground can abut against an inner wall of the carrier to fix the workpiece to be ground.

[0026] To achieve the above-mentioned object, a second aspect of the embodiments of the present application provides a grinding method, which is applied to the grinding device as described in any embodiment of the first aspect above, and the method includes:

[0027] Install the workpiece to be ground into the carrier;

[0028] Using a driving module to drive the carrier to move to a preset position in the liquid container;

[0029] The driving module drives the grinding tool to grind the surface to be ground of the workpiece to be ground.

[0030] In some embodiments, the driving module drives the grinding tool to grind the surface to be ground of the workpiece to be ground, specifically including:

[0031] The driving module drives the grinding tool to rotate around a first rotation direction by a first rotation angle, and drives the grinding tool to grind the workpiece in a forward direction;

[0032] The driving module drives the grinding tool to rotate around a second rotation direction by a second rotation angle, and drives the grinding tool to reversely grind the workpiece to be ground;

[0033] The first rotation direction and the second rotation direction are opposite to each other, and the first rotation angle is smaller than the second rotation angle.

[0034] The present application proposes a grinding device and a grinding method. By arranging a carrier in a liquid container, the present application can utilize buoyancy loading to achieve contact between the grinding tool and the workpiece to be ground placed in the carrier, and the driving module can drive the carrier to move up and down in the liquid container, thereby changing the volume of the displaced liquid. Since the buoyancy of the workpiece to be ground is positively correlated with the volume of the displaced liquid, the buoyancy of the workpiece to be ground can be changed. Since the grinding force of the workpiece to be ground is equal to the difference between the buoyancy and the gravity, and the gravity of the workpiece to be ground is constant, the grinding force of the workpiece to be ground is changed, thereby achieving flexible adjustment of the grinding force during the grinding process. Therefore, compared to the related art of grinding the grinding tool and the workpiece to be ground in a relatively fixed manner, the present application utilizes the buoyancy of the liquid to achieve grinding of dimensional changes of special planes such as conical surfaces and spherical surfaces, and can flexibly adjust the grinding force during the grinding process, thereby improving the applicability of the grinding device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 1 is a schematic cross-sectional view of a grinding device provided in an embodiment of the present application;

[0036] Figure 2 1 is a schematic diagram of a partial cross-sectional structure of a grinding device provided in an embodiment of the present application;

[0037] Figure 3 is another schematic cross-sectional view of a grinding device provided in an embodiment of the present application;

[0038] Figure 4 It is a flow chart of a grinding method provided in an embodiment of the present application.

[0039] Reference numerals:

[0040] 110 - bracket, 120 - carrier, 130 - liquid container, 140 - grinding tool, 150 - drive module, 160 - workpiece to be ground, 170 - liquid medium, 180 - liquid level sensor, 190 - controller, 191 - water inlet control valve, 192 - drainage control valve. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0042] It should be noted that although the device schematics illustrate functional module divisions and the flowcharts illustrate logical sequences, in certain circumstances, the steps shown or described may be performed in a sequence that differs from the module divisions in the device or the sequence in the flowcharts. The terms "first," "second," and so on, in the specification, claims, and drawings, are used to distinguish similar items and are not necessarily used to describe a specific sequence or precedence.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0044] Before further explaining the embodiments of the present application in detail, the nouns and terms involved in the embodiments of the present application are explained. The nouns and terms involved in the embodiments of the present application are subject to the following interpretations:

[0045] Grinding is a precision machining method used to improve the surface quality and shape accuracy of a workpiece. Grinding uses a grinding tool and abrasive to remove a very thin layer of metal from the workpiece surface. This machining method can be used on a variety of metal and non-metal materials to produce planes, internal and external cylindrical surfaces, conical surfaces, convex and concave spherical surfaces, threads, tooth surfaces, and other surfaces.

[0046] Device grinding: This refers to the process of finishing the surface of a workpiece by moving the grinding device relative to the workpiece under a certain pressure. This method can be used to process a variety of metal and non-metal materials.

[0047] Grinding force, also known as grinding load, refers to the force exerted by the grinding tool (such as a grinding wheel or grinding disc) on the workpiece during the grinding process. The magnitude and distribution of this force significantly influences the grinding effect and machining quality. Excessive grinding force may result in poor machining results, while excessive grinding force may cause overheating, wear, or damage to the workpiece surface. Therefore, precise control of grinding force is crucial during the grinding process to achieve optimal machining results.

[0048] Rigid loading: This means the contact force between the grinding tool and the workpiece is rigid, meaning the grinding tool does not significantly deform or move when subjected to external forces. This loading method is typically used for grinding processes requiring high precision and high rigidity, such as precision grinding and ultra-precision grinding. While rigid loading provides stable grinding force and helps ensure machining accuracy, it places high demands on the rigidity of both the grinding tool and the workpiece, and can easily generate significant vibration and noise.

[0049] Semi-rigid loading: This means the contact force between the grinding tool and the workpiece exhibits a certain degree of elasticity. This means the grinding tool will deform or displace to a certain degree when subjected to external forces. This loading method is typically used for grinding processes that require a certain degree of elasticity, such as flexible grinding and creep-feed grinding. Semi-rigid loading can reduce vibration and noise during grinding, improving processing quality and efficiency. However, the grinding force stability is relatively poor.

[0050] Self-centering: This refers to the technology that allows the grinding tool to automatically adjust its position during the grinding process to maintain alignment with the center of the workpiece. This technology can effectively avoid eccentricity during the grinding process and further improve the accuracy and quality of the grinding.

[0051] In the manufacture or maintenance of mechanical equipment, before a specific area on the surface of an object is tightly connected or sealed with other objects or components, the sealing surface of the sealed object can usually be ground to ensure the accuracy of the seal. For example, the sealing surface of the valve disc and valve seat of the valve is ground, and the sealing surface of the assembly step of the flange is ground.

[0052] At present, the grinding process is mainly divided into manual grinding and automatic grinding (also known as mechanical grinding). With the development of social industrial technology and the needs of special working scenarios (such as grinding in radioactive environments, super-hardened alloy grinding, etc.), automatic grinding has gradually replaced manual grinding in a wider range of fields. However, the automatic grinding method of the related art usually grinds the grinding tool and the workpiece to be ground in a relatively fixed manner, and most of the automatic grinding processes are concentrated on plane grinding. The development of related grinding processes for other spatial shapes such as conical surfaces and spherical surfaces is still imperfect, and it is impossible to adaptively adjust the grinding force for the dimensional changes of special planes such as conical surfaces and spherical surfaces. Therefore, how to provide a grinding device that can flexibly adjust the grinding force during the grinding process has become a technical problem that needs to be solved urgently.

[0053] Based on this, the embodiments of the present application provide a grinding device and a grinding method, which can flexibly adjust the grinding force during the grinding process to improve the applicability of the grinding device.

[0054] The grinding method provided in the embodiments of the present application can be applied to a terminal, can be applied to a server, and can also be software running in a terminal or a server. In some embodiments, the terminal can be a smart phone, a tablet computer, a laptop computer, a desktop computer, etc.; the server can be configured as an independent physical server, or as a server cluster or distributed system composed of multiple physical servers, or as a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDNs), and big data and artificial intelligence platforms; the software can be an application that implements the grinding method, etc., but is not limited to the above forms.

[0055] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld devices or portable devices, tablet devices, multi-processor systems, microprocessor-based systems, set-top boxes, programmable consumer electronic devices, network personal computers (PCs), minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0056] See also Figure 1 , Figure 1 1 is a schematic cross-sectional view of a grinding device according to an embodiment of the present invention. The grinding device 100 may include: a bracket 110, a carrier 120, a liquid container 130, a grinding tool 140 and a driving module 150. Figure 1 The specific structure of the grinding device 100 is introduced in detail.

[0057] The driving module 150 is mounted on the bracket 110;

[0058] The grinding tool 140 is connected to the driving module 150, and the driving module 150 is used to drive the grinding tool 140 to grind the surface to be ground of the grinding object 160;

[0059] The carrier 120 is used to place the workpiece 160 to be ground; and

[0060] The liquid container 130 is disposed in the bracket 110 , the carrier 120 is disposed in the liquid container 130 , and the liquid container 130 contains a liquid medium 170 for supporting the carrier 120 ;

[0061] The driving module 150 can drive the carrier 120 to move up and down in the liquid container 130 to adjust the grinding force of the grinding tool 140 on the object to be ground 160. The following is a detailed description of each component:

[0062] Specifically, the support 110 is a structure that supports or secures the components or devices included in the grinding apparatus. The support 110 can be connected to the grinding tool 140 and the drive module 150 to ensure that the grinding tool 140 and the drive module 150 can function properly. The present application does not specifically limit the structure, material, or shape of the support 110.

[0063] The grinding tool 140 is a tool used to grind, polish or file the surface of the workpiece 160. The grinding tool 140 generally includes a grinding wheel, a grinding wheel or a grinding belt, and is used to process the surface of workpieces of different shapes and sizes. The grinding tool 140 can be determined according to the geometric shape of the sealing surface of the workpiece 160. Figure 1 As shown, in one embodiment, the grinding tool 140 may include a conical head. In practical applications, since the grinding tool 140 is usually used to process the conical surface in a manner similar to turning a cylindrical bar, a cylindrical section (such as Figure 1 In order to ensure the strength of the grinding tool 140 for grinding the conical surface, a square is shown in the figure. In addition, the cylinder can also be removed according to actual application requirements, which is not limited here.

[0064] The driving module 150 refers to a structure that provides power and motion control functions for the grinding tool 140. The driving module 150 can provide the grinding tool 140 with a rotation speed and a rotation mode to drive the grinding tool 140 to perform a grinding operation. The driving module 150 of the present application includes a driving motor, which can be used to drive the grinding tool 140 to grind the surface to be ground of the grinding piece 160. Of course, in other embodiments, the driving module 150 may include a cylinder and a transmission assembly, and the cylinder converts linear motion into rotational motion through the transmission assembly, and the transmission assembly may be a gear rack structure. The driving module 150 can drive the supporting member 120 to move up and down in the liquid container 130, change the influence of buoyancy on the supporting member 120, and thus better adjust the grinding force of the grinding tool 140 on the grinding piece 160.

[0065] The carrier 120 is a structure used to hold the workpiece 160 to be ground. Unlike the grinding processes used in related arts (such as manual, lever, or spring loading), this application uses a buoyancy loading method. Furthermore, since mechanical parts are typically made of metal, which has a high density and is difficult to float in the liquid medium 170, this application has designed a carrier 120 specifically to support the workpiece 160 to be ground, so that the workpiece 160 can float in the liquid medium 170. The carrier 120 can be made of a material with good buoyancy and a certain mechanical strength, such as polystyrene (foam) or plastic, and the carrier 120 has a regular shape.

[0066] Specifically, the supporting member 120 can be a hollow sphere, hemisphere, cube, cylinder or other central axis symmetrical structure that can carry the workpiece to be ground 160, and the size requirement of the supporting member 120 is to be able to place the workpiece to be ground 160, which is not specifically limited here. Preferably, the outer surface of the supporting member 120 can be spherical or hemispherical, because under this structure, the plane projection of the supporting member 120 in the liquid medium 170 is a circle, and the force is uniform. Moreover, when the supporting member 120 is immersed in the liquid medium 170, it will rotate around the axis perpendicular to the liquid surface, which can reduce the grinding resistance, improve the stability of the grinding, and effectively improve the anti-interference ability of the grinding device. In addition, because the outer surface of the supporting member 120 is a sphere or a hemisphere, when the workpiece to be ground 160 is placed at an angle, the position correction can also be automatically performed to improve the anti-interference ability and stability of the grinding device. The specific working principle is as follows:

[0067] After the carrier 120 is placed in the liquid medium 170 and the workpiece 160 is placed on the carrier 120, since the liquid medium 170 is provided in the liquid container 130, the buoyancy of the workpiece 160 can be calculated according to the Archimedes principle and the following formula 1:

[0068] F f =ρgV (Formula 1)

[0069] In Formula 1, F f represents the buoyancy of the workpiece 160 to be ground, ρ is the liquid density of the liquid medium 170, g is the acceleration due to gravity, and V is the volume of the liquid displaced after the workpiece 160 to be ground is placed in the carrier 120 (that is, the volume of the displaced liquid can be converted into the volume of the liquid immersed in the carrier 120 after the workpiece 160 to be ground is placed in the carrier 120).

[0070] The force analysis of the workpiece 160 shows that the calculation process of the grinding force of the workpiece 160 is as shown in the following formula 2:

[0071] F=F f -G=ρgV-mg (Formula 2)

[0072] In formula 2, F represents the grinding force of the workpiece 160 to be ground, F f represents the buoyancy of the workpiece 160 to be ground, G represents the gravity of the workpiece 160 to be ground, and m represents the mass of the workpiece 160 to be ground. The mass of the supporting member 120 can be ignored due to its special structure. However, if it cannot be ignored, the weight of the supporting member 120 can be further subtracted to improve the accuracy of the grinding force calculation.

[0073] In the present application, the driving module 150 drives the carrier 120 to move up and down in the liquid container 130, thereby changing the volume of the displaced liquid medium 170. Since the buoyancy of the workpiece to be ground 160 is positively correlated with the volume of the displaced liquid, the buoyancy of the workpiece to be ground 160 can be changed. Since the grinding force of the workpiece to be ground 160 is equal to the difference between the buoyancy and the gravity, and the gravity of the workpiece to be ground 160 is constant, the grinding force of the workpiece to be ground 160 is changed, thereby realizing flexible adjustment of the grinding force during the grinding process.

[0074] In one embodiment of the present application, when grinding the workpiece 160, the central symmetry axis of the grinding tool 140, the central symmetry axis of the carrier 120 and the central symmetry axis of the workpiece 160 coincide with each other. Subsequently, when the carrier 120 with the workpiece 160 placed thereon is placed in the liquid container 130, the buoyancy, grinding force and gravity acting on the workpiece 160 are on the same straight line, thereby achieving a self-centering effect of the grinding tool 140, the carrier 120 and the workpiece 160.

[0075] It should be noted that a spatially shaped sealing surface refers to a specific area on the surface of an object with a complex geometry that is used to tightly connect or seal with other objects or components, such as the valve disc and valve seat sealing surfaces of a valve. Many prior grinding processes require complex pre-processing such as centering and alignment before grinding spatially shaped sealing surfaces. This is time-consuming and labor-intensive, making maintenance work more difficult for operators. The present application uses buoyancy loading to achieve quantitative control of the grinding force. That is, by placing the carrier 120 containing the workpiece 160 to be ground in the liquid container 130, the carrier 120 will be more closely fitted to the abrasive 140 due to the buoyancy it experiences. This buoyancy can align the central symmetry axes of the abrasive 140, the carrier 120, and the workpiece 160 to be ground on the same straight line, thereby ensuring that the workpiece 160 to be ground and the carrier 120 float in the liquid medium 170 and are only subjected to vertical forces, with no forces in other directions, thus forming a self-centering effect. In this way, even if lateral forces occur due to special occasional situations such as travel vibrations and collisions, the centering effect can be quickly restored due to the spatial geometric structure (conical surface, spherical surface, etc.) and position of the contact between the workpiece 160 to be ground and the abrasive 140.

[0076] Furthermore, to maintain self-centering, the carrier 120 of the present application does not come into contact with the edge of the liquid container 130 containing the liquid medium 170 or any other equipment during the grinding process. Regarding the liquid medium 170, the present application requires that the selected liquid medium 170 be able to levitate the entire carrier 120 containing the workpiece 160 to be ground, so that the grinding force can be adjusted later through buoyancy.

[0077] It should be noted that, since the workpiece 160 to be ground in the present application is generally a structure symmetrical about the central axis, that is, it can be a structure obtained by rotating one circle around the central axis of symmetry, such as Figure 1 As shown, the workpiece 160 to be ground is a valve disc structure with a central axis symmetry. Because the central axis of the mold, the central axis of symmetry of the carrier 120, and the central axis of symmetry of the workpiece 160 coincide during grinding, the workpiece 160 is only subject to downward gravity and upward buoyancy. Therefore, a force analysis of the workpiece 160 shows that the grinding force calculation process for the workpiece 160 is as shown in the above formula 2. Furthermore, the carrier 120 designed in this application can hold the workpiece 160 therein.

[0078] In one embodiment of the present application, the liquid container 130 can be a regular shape such as a rectangular parallelepiped or vertical cylinder, which facilitates determining the cross-sectional area of ​​the liquid container 130 and thus facilitating calculation of the liquid level change. Furthermore, since the maximum cross-section of the liquid container 130 is larger than the maximum cross-section of the carrier 120, the carrier 120 can be better positioned. Furthermore, the liquid container 130 can also be an irregularly shaped structure, meaning that the current liquid level change can be calculated using experimental data, which is not a limitation here.

[0079] It should be noted that the present application can change the liquid density of the liquid medium 170 by replacing the liquid medium 170, thereby changing the buoyancy. In other words, the liquid medium 170 can be adjusted according to actual needs, which is not limited here. However, in order to ensure the efficiency of grinding adjustment, the liquid medium 170 is generally not replaced during a single grinding.

[0080] In one embodiment of the present application, the outer surface of the carrier 120 can be spherical or hemispherical. Since each time the workpiece 160 to be ground is placed in the carrier 120, there may be slight changes in relative position. Therefore, the carrier 120 of the present application can have identical internal and external structures, and the internal and external structures can be equidistant from each other. This can prevent the effect of changes in the relative position of the workpiece 160 to be ground and the carrier 120 on the self-centering effect. Furthermore, because the carrier 120 is a centrally symmetrical structure, it can avoid the generation of eccentricity or force components caused by structural irregularities, thereby ensuring the self-centering effect of the grinding device.

[0081] For example, the carrier 120 can be a half-spherical shape with equal wall thickness (i.e., the inner structure surface of the carrier 120 abutting the to-be-ground part 160 and the outer structure surface of the carrier 120 contacting the liquid medium 170 are both half-spherical shapes and the distance between the two structure surfaces is equal), or the carrier 120 can be a spherical shape with equal wall thickness (i.e., the carrier 120 includes an opening for placing the to-be-ground part 160 and the grinding tool 140, and after the to-be-ground part 160 and the grinding tool 140 are placed, the opening is closed for grinding), which is not limited herein.

[0082] It should be noted that the to-be-ground part 160 can abut the inner wall of the carrier 120 to fix the to-be-ground part 160. Since the carrier 120 is usually made of a material with a rough surface, after the to-be-ground part 160 abuts the inner wall of the carrier 120, a large friction force is generated between the to-be-ground part 160 and the carrier 120, thereby avoiding the influence of unstable shaking of the to-be-ground part 160 on the grinding effect during the grinding process of the to-be-ground part 160 by the grinding tool 140.

[0083] It should be noted that if the size or weight of the to-be-ground part 160 is too small, the friction force between the to-be-ground part 160 and the carrier 120 will decrease, which will affect the grinding effect. At this time, the to-be-ground part 160 can be selected to be added with a counterweight, or a size-matching installation groove can be made on the carrier 120 to increase the friction force between the to-be-ground part 160 and the carrier 120. The principle of placing the counterweight is to increase the weight of the to-be-ground part 160, and the specific placement position can be determined according to the form of the counterweight. For example, if a ring-shaped counterweight block is used for weight increase, the ring-shaped counterweight block can be placed on the upper part of the to-be-ground part 160 (and attention should be paid to not blocking the to-be-ground surface); if a three-jaw chuck type counterweight is used, the to-be-ground part 160 can be clamped from the lower part of the to-be-ground part 160 and then placed in the carrier 120 as a whole. It should be noted that the added counterweight can be centrally symmetric, so that the central symmetric axis of the counterweight in the direction of gravity coincides with the central symmetric axis of the to-be-ground part 160 during grinding of the to-be-ground part 160. In addition, the size-matching installation groove can also be used to place the to-be-ground part 160, for example, a size-matching installation groove can be dug on the carrier 120 according to the size of the to-be-ground part 160, and then the to-be-ground part 160 can be placed in the installation groove to increase the contact area between the carrier 120 and the to-be-ground part 160 and achieve interference fit. In this way, the to-be-ground part 160 and the carrier 120 can be more tightly attached, thereby avoiding relative movement between the carrier 120 and the to-be-ground part 160 and improving the stability of grinding.

[0084] It should be noted that during the grinding process, the friction force between the to-be-ground part 160 and the carrier 120 is greater than the friction force between the carrier 120 and the liquid medium 170, and is also greater than the friction force between the grinding tool 140 and the to-be-ground part 160.

[0085] In some embodiments, when the surface to be ground of the workpiece 160 is a conical surface or a spherical surface, the grinding head of the grinding tool 140 is adapted to the surface to be ground of the workpiece 160. It should be noted that the meaning of adaptation is that when the surface to be ground is a conical surface, the longitudinal cross-section of the grinding head of the grinding tool 140 is conical, and when the surface to be ground is a spherical surface, the longitudinal cross-section of the grinding head of the grinding tool 140 is arc-shaped, wherein the longitudinal cross-section is a cross-section along the length direction of the rod of the grinding tool 140. It can be seen from this that the present application can flexibly adjust the longitudinal cross-section shape of the grinding head of the grinding tool 140 according to the geometric shape of the surface to be ground of the workpiece 160 to achieve grinding of special planes such as conical surfaces and spherical surfaces.

[0086] In some embodiments, the driving module 150 of the present application further includes a lifting motor connected to the grinding tool 140. The lifting motor is a motor device for controlling the lifting of the grinding tool 140. The lifting motor can control the grinding tool 140 to move up and down according to the received signal, thereby adjusting the grinding force of the grinding tool 140 on the grinding object 160.

[0087] In some embodiments, as Figure 1 As shown, the grinding device of the present application also includes:

[0088] The liquid level detection component is used to detect the change of the liquid level in the liquid container 130 and output a control signal.

[0089] It should be noted that the liquid level detection component refers to a device that detects the liquid level height of the liquid medium 170 in the liquid container 130. In other words, the present application can use the liquid level detection component to detect the changes in the grinding force applied to the workpiece 160 in real time, thereby achieving real-time detection of the grinding force during the grinding process.

[0090] It should be noted that grinding force plays a vital role in ensuring the quality of grinding and quantifying the grinding process, but the relevant technology cannot accurately and in real time detect the change of grinding force (also known as grinding load) during the grinding process. The present application sets the carrier 120 in the liquid container 130, grinds the grinding member 160 by buoyancy loading, and can detect the change of grinding force in real time according to the liquid level change data, flexibly adjust the grinding force of the grinding tool 140 on the grinding member 160, and can achieve accurate and real-time detection of grinding force. In addition, since the relevant technology usually adopts a rigid or semi-rigid grinding force loading method, it is easy to have insufficient anti-interference ability and stability during the grinding process. The present application is based on a buoyancy loading type grinding device, which can achieve self-centering grinding of dimensional changes of special planes such as conical surfaces and spherical surfaces, improve the anti-interference ability and stability of the grinding process, and can flexibly adjust the grinding force during the grinding process, thereby improving the applicability of the grinding device.

[0091] See also Figure 2 , Figure 2 1 is a partial cross-sectional structural diagram of a grinding device provided in an embodiment of the present application. The carrier 120 of the present application may be marked with scales, and different scales correspond to different grinding forces.

[0092] It should be noted that the liquid level detection function of the liquid level detection component can also be implemented by the carrier 120, that is, the liquid level detection component can determine the liquid level change data by the operator visually observing the liquid level scale, so that the driving module 150 can adjust the grinding force of the grinding tool 140 on the workpiece to be ground 160 according to the liquid level change data. Since the liquid level scale (i.e., the contour scale) can be drawn on the carrier 120, and different liquid level scales can correspond to different grinding forces, at this time, the grinding force corresponding to the current workpiece to be ground 160 can be directly and quickly determined based on the liquid level scale immersed in the liquid. The present application determines the change in volume of the carrier 120 when it is immersed in the liquid by the liquid level scale. Although the determination speed is fast, in order to meet the needs of visual observation, there will be a certain line width between the drawn liquid level scales. Therefore, in actual applications, the contour lines cannot be drawn very densely, so the liquid level information it provides is stepped.

[0093] In the above embodiment, the present application can obtain the liquid level change data by visually observing the scale on the carrier 120, or can obtain the liquid level change data by automatic detection by the liquid level sensor 180, so as to control the driving module 150 to adjust the grinding force of the grinding tool 140 on the grinding piece 160 according to the liquid level change data.

[0094] It should be noted that no matter which method is used to achieve liquid level detection, the corresponding relationship between the volume of displaced liquid, liquid level change and grinding force can be obtained through theoretical calculation or experimental methods.

[0095] In some embodiments, see Figure 3 , Figure 3 This is another cross-sectional structural diagram of the grinding device provided in the embodiment of the present application. Figure 1 and Figure 3 As shown, the liquid level detection component of the present application may specifically include:

[0096] a liquid level sensor 180 mounted on the bracket 110 and extending into the liquid container 130 for detecting changes in the liquid level; and

[0097] The controller 190 is in communication with the liquid level sensor 180 and is used to calculate the magnitude of the grinding force according to the liquid level change data of the liquid level sensor 180 and output a control signal.

[0098] It should be noted that the drive module 150 is communicatively connected with the controller 190 and can drive the carrier 120 to move according to the control signal. The drive module 150 can be a servo motor, and the controller 190 can receive signals from devices such as a terminal or server externally provided in the present application to accurately set the control parameters of the servo motor, thereby achieving accurate grinding of the grinding tool 140 on the grinding piece 160. Among them, the servo motor is a motor that can accurately control position, speed and acceleration. The servo motor has the characteristics of high precision, high speed, high responsiveness and high stability, and can maintain a stable position and speed during high-speed movement, and achieve accurate position and speed control. The servo motor also has the advantages of small size, light weight, high efficiency and long life. In addition, the drive module 150 of the present application can also be an AC asynchronous motor, a permanent magnet synchronous motor, etc., which are not limited here.

[0099] Among them, the liquid level sensor 180 can be a non-contact liquid level sensor (such as a laser liquid level sensor, an ultrasonic liquid level sensor, etc.), and the non-contact liquid level sensor uses optical principles or ultrasonic reflection principles to measure the liquid height without direct contact with the liquid medium 170. The liquid sensor can also be other contact sensors, which are not limited here. In this way, after determining the current liquid level change height, the liquid level change height can be multiplied by the horizontal cross-sectional area of ​​the liquid container 130 to obtain the volume of the displaced liquid. The detection accuracy of this method is high and is only limited by the detection accuracy of the liquid level sensor 180, so it can better achieve an accuracy of 0.01 mm. In addition, by using the liquid level sensor 180 for liquid level detection, liquid level information in the form of continuous information can be obtained.

[0100] In the above embodiment, the present application uses buoyancy loading and utilizes a liquid level detection component to detect the liquid level of the liquid medium 170, so as to quickly determine the current grinding force of the workpiece 160 to be ground, thereby achieving flexible adjustment of the grinding force.

[0101] It should be noted that the controller 190 of the present application can determine the first grinding force of the grinding tool 140 on the workpiece 160 to be ground based on the detected liquid level change data, and adjust the grinding force of the grinding tool 140 on the workpiece 160 to be ground based on the comparison result of the first grinding force and the preset grinding force.

[0102] The liquid level change data refers to the difference between the liquid level when the workpiece 160 is placed in the carrier 120 and the liquid level when the carrier 120 is not placed. The controller 190 can determine the volume of liquid displaced by the grinding tool 140 when the workpiece 160 is being ground based on the detected liquid level change data and the corresponding cross-sectional area of ​​the carrier 120, and determine the first grinding force of the grinding tool 140 on the workpiece 160 based on the aforementioned formulas 1 and 2. The preset grinding force refers to the magnitude of the grinding force currently required for grinding the workpiece 160. Furthermore, the controller 190 can adjust the grinding force of the grinding tool 140 on the workpiece 160 based on a comparison between the first grinding force and the preset grinding force. For example, if the first grinding force is less than the preset grinding force, the grinding tool 140 can be adjusted to increase the grinding force on the workpiece 160; if the first grinding force is less than the preset grinding force, the grinding tool 140 can be adjusted to decrease the grinding force on the workpiece 160.

[0103] In some embodiments, the present application can adjust the grinding force of the grinding tool 140 on the workpiece 160 by changing the size of the carrier 120 so that the volume of the carrier 120 immersed in the liquid changes. This is because the height of the grinding tool 140 is fixed, and the grinding tool 140 and the workpiece 160 are in contact with each other during the grinding process. At this time, if the carrier 120 is reduced, the volume of the liquid displaced is reduced, the buoyancy is reduced, and the grinding force of the grinding tool 140 on the workpiece 160 will be reduced.

[0104] In other embodiments, the present application can adjust the grinding force of the abrasive tool 140 on the workpiece 160 by changing the density of the liquid medium 170. For example, by increasing the density of the liquid medium 170, the buoyancy increases, and the contact between the abrasive tool 140 and the workpiece 160 becomes closer, that is, the grinding force of the abrasive tool 140 on the workpiece 160 increases.

[0105] In some embodiments, the polishing device provided herein further includes an image acquisition component, which is configured to, when the liquid level detection component is implemented by the carrier 120, obtain in real time the liquid level scale of the carrier 120 currently submerged in the liquid medium 170. The image acquisition component may be an underwater camera. For example, in situations where the water is deep or turbid, the underwater camera can be used to observe the scale line. The underwater camera can transmit the underwater image to the controller 190 on the surface of the water. The controller 190 can then analyze the image to accurately obtain the current position of the liquid level scale, thereby determining the current liquid level change data. For another example, the image acquisition component may be a laser rangefinder, which can emit a laser beam and measure the time and speed of the laser beam's underwater propagation to determine the position of the underwater object. Specifically, the present invention can adjust the angle of the laser beam so that the emitted laser beam can illuminate the liquid level scale on the surface of the carrier 120. The data on the laser rangefinder can then be read to obtain the accurate liquid level scale, thereby determining the current liquid level change data.

[0106] It should be noted that the liquid level change data of the present application can provide operators with quantitative process parameters to facilitate the control of grinding quality, and can also provide data support and feedback signals for the expansion of automation functions.

[0107] In some embodiments, the present application also has a large space for expanding automated functions, that is, the grinding force determined based on the collected liquid level change data can be combined with the added functional components to achieve real-time automatic adjustment of the grinding force. Among them, the functional component can be a lifting motor, so that by adjusting the height of the grinding tool 140, the volume of the carrier 120 immersed in the liquid can be changed, thereby adjusting the grinding force of the grinding tool 140 on the grinding object 160. Specifically, the controller 190 can also send a lifting adjustment signal to the driving module 150 based on the comparison result of the first grinding force and the preset grinding force, and the driving module 150 can adjust the lifting of the grinding tool 140 according to the lifting adjustment signal to adjust the grinding force of the grinding tool 140 on the grinding object 160. For example, if the first grinding force is less than the preset grinding force, the controller 190 sends a lifting adjustment signal to the lifting motor to adjust the grinding tool 140 to descend, so as to adjust the grinding tool 140 to descend toward the workpiece to be ground 160, so that the volume of the supporting member 120 immersed in the liquid changes, thereby increasing the degree of grinding between the grinding tool 140 and the workpiece to be ground 160 during the grinding process, that is, increasing the grinding force of the grinding tool 140 on the workpiece to be ground 160.

[0108] In some embodiments, as Figure 3 As shown, the grinding device also includes:

[0109] A water inlet control valve 191 is in communication with the controller 190 and is used to control the flow rate of the liquid medium 170 injected into the liquid container 130; and

[0110] The drainage control valve 192 is in communication with the controller 190 , and is used to control the flow rate of the liquid medium 170 discharged from the liquid container 130 .

[0111] It should be noted that the functional components of the present application can also be a water inlet control valve 191 and a water discharge control valve 192. In this way, the controller 190 is also used to control the valve states of the water inlet control valve 191 and the water discharge control valve 192 according to the comparison result of the first grinding force and the preset grinding force, and adjust the total capacity of the liquid medium 170 in the liquid container 130 according to the valve state to adjust the grinding force of the grinding tool 140 on the workpiece 160 to be ground. It is understood that the valve state can represent the degree of opening of the water inlet control valve 191 and the water discharge control valve 192. For example, if the valve state of the water inlet control valve 191 indicates full opening, and the valve state of the water discharge control valve indicates closed, then the volume of the liquid medium 170 injected into the liquid container 130 increases rapidly. Since the height of the grinding tool 140 is fixed, the grinding tool 140 will block the upward movement of the carrier 120, increasing the volume of liquid displaced by the carrier 120, thereby increasing the degree of grinding between the grinding tool 140 and the workpiece 160 during the grinding process, that is, increasing the grinding force of the grinding tool 140 on the workpiece 160. Therefore, the present application can adjust the total amount of liquid contained in the liquid container 130 by controlling the valve opening and closing states of the water inlet control valve 191 and the water discharge control valve 192, that is, controlling the volume difference of the liquid medium 170 injected into and discharged from the liquid container 130, thereby achieving real-time automatic adjustment of the grinding force of the grinding tool 140.

[0112] It should be noted that the present application can also set corresponding functional components according to other methods of adjusting the grinding force, which will not be repeated here.

[0113] The grinding device provided by the present application provides a grinding process that can be applied to sealing surfaces of spatial geometric shapes such as conical surfaces and spherical surfaces, which can meet the needs of grinding scenarios that cannot be met by related technologies. Through the combination of the carrier 120, the liquid container 130, the liquid medium 170 and the grinding tool 140, the buoyancy loading method can be used to provide grinding force for the workpiece to be ground 160, so that the grinding force can be accurately set according to the grinding requirements, thereby improving the anti-interference ability and stability during the grinding process. Because the spatial axisymmetric geometry of the workpiece to be ground 160 and the carrier 120 can achieve a self-centering effect between the grinding tool 140 and the workpiece to be ground 160, avoiding the complex pre-processes such as centering and alignment in related technologies. The grinding process is simple and does not require high maintenance skills and maintenance experience from the operator. In addition, the present application detects the changes in liquid level through a liquid level detection component, which can realize real-time detection of the grinding force during the grinding process.

[0114] In some embodiments, see Figure 4 , Figure 4 This is a flow chart of a grinding method provided by an embodiment of the present application. The grinding method may include but is not limited to steps S410 to S430. Figure 4 These three steps are introduced in detail.

[0115] Step S410 , installing the workpiece 160 to be polished into the carrier 120 ;

[0116] Step S420 , utilizing the driving module 150 to drive the carrier 120 to move to a preset position in the liquid container 130 ;

[0117] In step S430 , the driving module 150 drives the grinding tool 140 to grind the surface to be ground of the grinding object 160 .

[0118] In some embodiments, in step S410 to step S430, Figure 3 According to the grinding device of the above embodiment, after the driving module 150 is started, the driving module 150 drives the carrier 120 to move to a preset position in the liquid container 130, and drives the grinding tool 140 to grind the surface to be ground of the grinding workpiece 160. At the same time, the liquid level detection component can detect the liquid level of the liquid medium 170 and obtain liquid level change data. The liquid level change data is sent to the controller 190. Furthermore, the controller 190 can calculate the magnitude of the grinding force based on the liquid level change data and output a control signal to the driving module 150, so that the driving module 150 can drive the carrier 120 to move according to the grinding force in the received control signal to adjust the grinding force of the grinding tool 140 on the grinding workpiece 160.

[0119] It should be noted that, before the present application begins grinding the surface of the workpiece 160, the drive module 150 can be used to drive the carrier 120 to move to a preset position within the liquid container 130 to adjust the grinding force of the grinding tool 140 on the workpiece 160. This preset position indicates that the grinding force of the grinding tool 140 on the workpiece 160 can be the desired grinding force. The carrier 120 may be moved to the preset position in the liquid container 130 by increasing or decreasing the volume of the liquid medium 170 supporting the carrier 120 in the liquid container 130, thereby driving the carrier 120 to move to the preset position in the liquid container 130; or the driving module 150 may drive the grinding tool 140 to move away from or toward the workpiece 160 to be ground, i.e., adjusting the height of the grinding tool 140, thereby driving the carrier 120 to move to the preset position in the liquid container 130; or, changing the size of the carrier 120 to change the volume of the carrier 120 immersed in the liquid, thereby driving the carrier 120 to move to the preset position in the liquid container 130; or, changing the density of the liquid medium 170, i.e., different densities of the liquid medium 170 exert different buoyancy on the carrier 120 and the workpiece 160, thereby changing the volume of the carrier 120 immersed in the liquid, thereby driving the carrier 120 to move to the preset position in the liquid container 130. The above are not specifically limited herein.

[0120] It should be noted that when the driving module 150 of the present application drives the grinding tool 140 to rotate, the carrier 120 and the workpiece to be ground 160 will rotate accordingly. However, due to the gravity of the carrier 120 and the workpiece to be ground 160 themselves, their rotation is not synchronized with the rotation of the grinding tool 140. In this way, the present application can usually adopt a forward and reverse alternating method to generate relative motion between the workpiece to be ground 160 and the grinding tool 140, thereby achieving grinding of the workpiece to be ground 160. Among them, because the friction between the workpiece to be ground 160 (such as a metal valve flap) and the carrier 120 (such as foam) is very large, there is no relative motion (or a small relative motion, but it is negligible) between the carrier 120 and the workpiece to be ground 160.

[0121] It is understandable that, because during the grinding process, the workpiece 160 to be ground will rotate along with the rotation of the grinding tool 140, and because the friction between the carrier 120 and the workpiece 160 to be ground is very large, the carrier 120 will also move along with the rotation of the grinding tool 140 (because there is nothing to prevent the rotation of the carrier 120). However, since the buoyancy loading mode adopted in this application is not fixed, the conventional unidirectional rotation mode will cause the workpiece 160 to be ground (including the carrier 120) to rotate along with the grinding tool 140, which will produce a large inertia and eccentric force, thereby making it impossible to perform the grinding problem. Therefore, there needs to be friction between the grinding tool 140 and the workpiece 160 to produce relative motion, thereby achieving the grinding of the workpiece 160 to be ground. Based on this, the present application can achieve grinding by adopting a reciprocating rotation method of the grinding tool 140 in a forward and reverse rotation, that is, when the grinding tool 140 is reversed, the carrier 120 has inertia and will maintain the previous motion, so that relative motion is generated between the grinding tool 140 and the workpiece 160 to be ground. In this way, the alternating forward and reverse rotation of the grinding tool 140 will cause an angular difference between the forward rotation and the reverse rotation of the workpiece 160 to be ground (including the carrier 120). For example, the method for rotating the grinding tool 140 in a forward and reverse manner can be: the grinding tool 140 first rotates forward (i.e., clockwise) 60 degrees (60°), then reverses (i.e., counterclockwise) by 30°, and repeats the above two rotation operations to achieve the forward and reverse alternation. In this way, the workpiece 160 to be ground (including the carrier 120) and the grinding tool 140 can maintain relative motion, and the grinding tool 140 can achieve relative clockwise rotation by alternating forward rotation of a large degree and reverse rotation of a small degree. After a period of time, the workpiece 160 to be ground (including the carrier 120) can rotate one circle, and so on. For another example, the method for rotating the grinding tool 140 in a forward and reverse manner can also be: the grinding tool 140 first reverses 60°, then rotates forward 30°, and repeats the above two rotation operations to achieve the forward and reverse alternation. In this way, the grinding tool 140 can achieve relative counterclockwise rotation by alternating between a large counterclockwise rotation and a small forward rotation. Alternatively, the alternating forward and reverse rotation of the grinding tool 140 can be repeated by first rotating the grinding tool 140 forward two times (i.e., 720°) and then counterclockwise one time (i.e., 360°). This application does not limit the specific rotation method or degree of rotation of the alternating forward and reverse rotation of the grinding tool 140.

[0122] In some embodiments, the step of the driving module 150 driving the grinding tool 140 to grind the surface to be ground of the grinding member 160 may specifically include:

[0123] The driving module 150 drives the grinding tool 140 to rotate around the first rotation direction by a first rotation angle, and drives the grinding tool 140 to grind the workpiece 160 in a forward direction;

[0124] The driving module 150 drives the abrasive tool 140 to rotate around the second rotation direction by a second rotation angle, and drives the abrasive tool 140 to grind the workpiece 160 in a reverse direction;

[0125] The first rotation direction and the second rotation direction are opposite directions, and the first rotation angle is less than the second rotation angle.

[0126] In the above embodiment, the controller 190 can determine the first grinding force of the abrasive tool 140 on the workpiece 160 according to the liquid level change data, and the calculation process of the first grinding force has been described in detail in the above embodiment, which will not be repeated. Further, the controller 190 can adjust the grinding force of the abrasive tool 140 on the workpiece 160 according to the comparison result of the first grinding force and the preset grinding force. Further, after the grinding force on the workpiece 160 is determined, the driving module 150 can drive the abrasive tool 140 to rotate around the first rotation direction by a first rotation angle, and drive the abrasive tool 140 to grind the workpiece 160 in a forward direction. After a first time interval, the driving module 150 drives the abrasive tool 140 to rotate around the second rotation direction by a second rotation angle, and drives the abrasive tool 140 to grind the workpiece 160 in a reverse direction. After a second time interval, the driving module 150 repeats the above steps, that is, drives the abrasive tool 140 to rotate around the first rotation direction by a first rotation angle again, and drives the abrasive tool 140 to grind the workpiece in a forward direction. The first time interval can be calculated by the rotation speed of the abrasive tool 140 and the first rotation angle, and the second time interval can be calculated by the rotation speed of the abrasive tool 140 and the second rotation angle.

[0127] It should be noted that the first rotation direction and the second rotation direction are opposite directions, and the forward grinding and the reverse grinding are relative concepts, that is, the forward and reverse driving of the abrasive tool 140 are also relative, which only means that the two rotation modes are in different directions, and is not a specific limitation of the direction, and the forward direction represents the overall rotation direction of the abrasive tool 140 after the positive and negative rotation angles are offset. The first rotation direction can be clockwise or counterclockwise, and the second rotation direction can also be clockwise or counterclockwise, and the first rotation direction and the second rotation direction are opposite directions, so as to realize the alternating rotation mode of positive and negative rotation in the above embodiment.

[0128] It should be noted that the first rotation angle is smaller than the second rotation angle, so that during the process of achieving alternating forward and reverse rotation, the grinding tool 140 will rotate and move in the first rotation direction as a whole after the angles of the forward and reverse rotations cancel each other out, thereby grinding the surface to be ground of the grinding member 160 through the change in relative position. For example, the first rotation direction is forward, the second rotation direction is reverse, the first rotation angle is 60°, and the second rotation angle is 30°. In this way, the grinding tool 140 can first rotate forward 60°, then reverse 30°, and repeat the above two rotation operations to achieve alternating forward and reverse rotation. In this way, the grinding tool 140 can achieve overall forward rotation by alternating a large degree of forward rotation and a small degree of reverse rotation.

[0129] The grinding method provided in the embodiment of the present application can utilize buoyancy loading to achieve contact between the grinding tool 140 and the workpiece 160 to be ground placed in the carrier 120, and can detect the change of the liquid level in the liquid container 130 through the liquid level sensor 180, thereby realizing real-time detection of the grinding force during the grinding process. The controller 190 calculates the magnitude of the grinding force based on the liquid level change data of the liquid level sensor 180 and outputs a control signal to the drive module 150. Furthermore, the drive module 150 can drive the carrier 120 to move up and down in the liquid container 130 according to the received control signal, thereby changing the volume of the displaced liquid. Since the buoyancy of the workpiece 160 is positively correlated with the volume of the displaced liquid, the buoyancy of the workpiece 160 can be changed. Since the grinding force of the workpiece 160 is equal to the difference between the buoyancy and the gravity, and the gravity of the workpiece 160 is constant, the grinding force of the workpiece 160 can be changed, thereby realizing flexible adjustment of the grinding force during the grinding process. In this way, the present application can achieve flexible grinding force output during the grinding process through quantitative control of the grinding force. Compared with the grinding device and grinding method adopted in the related technology, the present application can make significant improvements in maintenance quality, maintenance cost, maintenance efficiency and personnel exposure dose, and flexibly adjust the grinding force during the grinding process, thereby improving the applicability of the grinding device.

[0130] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but are not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and essence of the present invention should be within the scope of the present invention.

Claims

1. A grinding device, characterized in that: include: Bracket; A driving module is installed on the bracket; A grinding tool connected to the driving module, wherein the driving module is used to drive the grinding tool to grind the surface of the workpiece to be ground; A carrier, used for placing the workpiece to be ground; a liquid container, disposed in the bracket, the carrier being disposed in the liquid container, and the liquid container containing a liquid medium for supporting the carrier; as well as a liquid level detection component for detecting changes in the liquid level in the liquid container and outputting a control signal; wherein the liquid level detection component comprises: a liquid level sensor mounted on the bracket and extending into the liquid container for detecting changes in the liquid level; and a controller, the controller being in communication with the liquid level sensor and for calculating the magnitude of the grinding force based on liquid level change data from the liquid level sensor and outputting the control signal; The driving module is in communication with the controller and can drive the carrier to move up and down in the liquid container according to the control signal to adjust the grinding force of the grinding tool on the workpiece to be ground.

2. The grinding device according to claim 1, characterized in that The central symmetry axis of the grinding tool, the central symmetry axis of the carrier, and the central symmetry axis of the workpiece to be ground are on the same straight line.

3. The grinding device according to claim 1, characterized in that The grinding device also includes: a water inlet control valve, communicatively connected to the controller, the water inlet control valve being used to control the flow rate of the liquid medium injected into the liquid container; and a drainage control valve, communicatively connected to the controller, the drainage control valve being used to control the flow rate of the liquid medium discharged from the liquid container; The controller is used to control the valve openings of the water inlet control valve and the drain control valve.

4. The grinding device according to any one of claims 1 to 3, characterized in that The carrier is marked with scales, and different scales correspond to different grinding forces.

5. The grinding device according to any one of claims 1 to 3, characterized in that The outer surface of the supporting component is spherical or hemispherical.

6. The grinding device according to any one of claims 1 to 3, characterized in that When the surface to be ground of the workpiece to be ground is a conical surface or a spherical surface, the grinding head of the grinding tool is adapted to the surface to be ground of the workpiece to be ground.

7. The grinding device according to any one of claims 1 to 3, characterized in that The workpiece to be ground can abut against the inner wall of the carrier to fix the workpiece to be ground.

8. A grinding method, characterized in that: Applied to the grinding device according to any one of claims 1 to 7, the method comprises: Install the workpiece to be ground into the carrier; Using a driving module to drive the carrier to move to a preset position in the liquid container; The driving module drives the grinding tool to grind the surface to be ground of the workpiece to be ground.

9. The method according to claim 8, characterized in that The driving module drives the grinding tool to grind the surface to be ground of the workpiece to be ground, specifically including: The driving module drives the grinding tool to rotate along a first rotation direction and a first rotation angle, and drives the grinding tool to grind the workpiece in a forward direction; The driving module drives the grinding tool to rotate along a second rotation direction by a second rotation angle, and drives the grinding tool to reversely grind the workpiece to be ground; The first rotation direction and the second rotation direction are opposite to each other, and the first rotation angle is smaller than the second rotation angle.

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