Ultrathin high-flux electrocaloric refrigeration device and construction method thereof
By performing weak alkaline chemical treatment of ferroelectric polymer materials and multi-layer capacitive structure design, combined with flowing liquid metal, the heat dissipation problem of microelectronic devices is solved, efficient hot and cold separation and high throughput refrigeration are achieved, and miniaturization is provided. , efficient and environmentally friendly thermal management solutions.
Patent Information
- Application Number
- CN202411138915.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-01-07
AI Technical Summary
The heat dissipation problems of microelectronic devices are becoming increasingly prominent. Traditional air-cooled radiators are difficult to meet the needs of miniaturization and high heat dissipation efficiency. In addition, vapor compression refrigeration technology has problems such as high cost, low refrigeration performance and environmental pollution. It is difficult to achieve high efficiency in existing thermal management solutions. Separation of hot and cold and stable heat dissipation.
Use ferroelectric polymer materials for weak alkaline chemical treatment, build multi-layer capacitance structure and high-throughput thermal switch, combine with flowing liquid metal, design ultra-thin high-throughput electric card refrigeration devices, and drive ferroelectric polymer film generation through electric field Thermal effect of electric cards achieves hot and cold separation and efficient refrigeration.
It realizes rapid thermal conductivity and efficient hot and cold separation of ultra-thin high-throughput refrigeration devices, no noise during operation, low energy consumption, can effectively manage the heat of microelectronic devices, and provide high cooling density and large electric card temperature difference.
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Figure CN119268164A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of active heat pump and microelectronic thermal management, and relates to alkaline chemical treatment of ferroelectric polymer materials, construction of ferroelectric polymer films with multilayer capacitor structures, and design and construction method of heat pump devices with high-throughput thermal switches. Background Art
[0002] In recent decades, with the rapid development of electronic technology, the integration and power consumption of microelectronic devices have increased, and the heat generated by them has increased exponentially. The heat dissipation problem of microelectronic chips has become increasingly prominent and has gradually become one of the main challenges in this field. Traditional air-cooled heat sinks are difficult to meet the miniaturization and high heat dissipation efficiency requirements of electronic equipment. Vapor compression refrigeration technology (such as air conditioners, refrigerators, etc.) has now reached its thermodynamic limit and is difficult to miniaturize to meet the thermal management requirements of microelectronic equipment. In addition, vapor compression refrigeration technology also faces many insurmountable disadvantages, such as high cost, low refrigeration performance coefficient, COP less than 3, environmental pollution, etc. It is worth noting that microfluidic thermal switch technology can be effectively applied to the thermal management of microelectronic devices. Through the flow of liquid, heat is circulated and transported on high-heat electronic devices to achieve the purpose of cooling. However, the temperature of the liquid in the microfluidic tube will gradually be heated and reduce the cooling effect. At the same time, the overheated liquid medium will cause the cooling efficiency to be unstable, which seriously reduces the heat dissipation effect. Therefore, there is an urgent need for a new thermal management solution that combines microfluidic thermal switches and ensures the efficient operation of electronic devices.
[0003] With the continuous advancement of scientific researchers, solid-state refrigeration technology has made continuous progress. Solid-state refrigeration technology has received widespread attention due to its fast refrigeration response and the absence of greenhouse effect such as harmful gases such as hydrofluorocarbons. This refrigeration technology that can achieve efficient thermal management is expected to replace the traditional vapor compression refrigeration system. At the same time, solid-state thermal management devices have the characteristics of small size and simple structure, which can be more easily integrated into electronic equipment systems and is one of the ways to ensure the efficient operation of electronic equipment. Among all card effect refrigeration technologies, spring card refrigeration and magnetic card refrigeration require huge external equipment to introduce force fields and magnetic fields, so it is difficult to integrate them into microelectronic devices. Electrocaloric effect (ECE) refrigeration technology, which is driven only by electric fields, has the advantages of small size, environmental protection and high efficiency, and has important application prospects in the temperature regulation of microelectronic devices. Cooling devices based on the electrocaloric effect are widely praised for their high refrigeration coefficient of performance (COP), fast response and lightweight, and their feasibility of application. The electrocaloric effect has great application prospects in the thermal management of microelectronic devices. Recently, a large number of research papers on thermal management of electric cards have greatly promoted the progress of base materials and thermal management devices, and brought the practicality of future thermal management systems to a new level. Constructing electrocaloric ferroelectric polymers into multilayer capacitors and combining them with microfluidic thermal switches can achieve efficient hot and cold separation and ultra-thin high-throughput refrigeration devices, providing a high refrigeration density solution to the thermal failure and heat concentration problems of microelectronic products. Summary of the invention
[0004] The present invention aims at the problems of thermal failure and malfunction of current microelectronic products and the large size and low cooling efficiency of existing heat dissipation devices. The present invention prepares an ultra-thin high-flux electric card cooling device, including alkaline chemical treatment of ferroelectric polymer materials, ferroelectric polymer films with multilayer capacitor structures, and a heat pump device design and construction method for a high-flux thermal switch.
[0005] The technical solution of the present invention is to treat ferroelectric polymers [P(VDF-TrFE), P(VDF-TrFE-CFE), P(VDF-TrFE-CTFE), etc.] with weak alkalinity [(C\H9N, NaOH, C6H 15 The electrocaloric effect film is prepared by chemically modifying the ferroelectric polymer by removing Cl from the main chain to form C=C to enhance the electrocaloric effect; the ferroelectric polymer chemically modified by weak alkali is cleaned; deionized water, acetone, acetic acid and ethanol are used for cyclic cleaning; the ferroelectric polymer is dissolved in an organic solvent (dimethyl sulfoxide, N,N-dimethylformamide, acetone dimethyl sulfoxide, butanone, etc.); a multilayer electrocaloric effect film is prepared by spin coating, scraping coating, etc.; metal electrodes such as gold, copper and silver are evaporated on the upper and lower surfaces of the electrocaloric effect film to form a multilayer capacitor structure.
[0006] The present invention discloses an ultra-thin high-throughput electrocaloric refrigeration device, which includes a graphene sheet from the top layer, a liquid metal heat conduction driven by a micropump for rapid heat extraction from the circulation, a heat conduction for a circulating heat switch, an insulating tape, a ferroelectric polymer film for electric field insulation protection of ferroelectric polymers, an electrocaloric effect, a ferroelectric polymer film for generating electrocaloric effect circulation and refrigeration, an uncirculated hollow insulation layer for thermal disconnection and insulation, and a circulating heat-conducting liquid metal for thermal connection and thermal closure conduction. The metal electrodes on the surface of the ferroelectric polymer film are connected by fine silver wires, which are welded and sealed with hot melt adhesive after being led out from the side port. The electrocaloric effect ferroelectric polymer film is a multilayer capacitor polymer film stack treated with weak alkali chemistry.
[0007] The invention discloses an ultra-thin high-throughput electric card refrigeration device, which is prepared by chemically modifying the ferroelectric polymer with a weak base, evaporating metal electrodes such as gold, copper, and silver on the surface, and hot pressing to form a multilayer capacitor structure. , and a high-throughput refrigeration device using flowing liquid metal as a thermal switch. The following steps are included:
[0008] 1) Treat ferroelectric polymers [P(VDF-TrFE), P(VDF-TrFE-CFE), P(VDF-TrFE-CTFE), etc.] with weak alkalinity [(C3H9N, NaOH, C6H 15 N, KOH Si(OH)4, NH3·H2O, etc.)] chemically modified, removing Cl on its main chain to form C=C, wherein the molar ratio of the ferroelectric polymer and the weak alkaline chemical reagent is 0.5-4:1 mol, the reaction time is 0.1-24h, and the treatment temperature is 0-100°C.
[0009] 2) The ferroelectric polymer modified by weak base chemical treatment is cleaned by using 10-200 mL of deionized water, 10-200 mL of acetone, 10-200 mL of acetic acid with a concentration of 1-20 wt % and 10-200 mL of ethanol for 3-10 cycles of cleaning.
[0010] 3) dissolving the ferroelectric polymer in an organic solvent (dimethyl sulfoxide, N,N-dimethylformamide, acetone dimethyl sulfoxide, butanone, etc.) to prepare a solution with a concentration of 3 to 15 wt%, and preparing an electrocaloric effect film with a thickness of 25 to 100 μm by spin coating, scraping coating, etc., and preparing a multilayer electrocaloric effect film with a thickness of 0.5 to 2 mm by hot pressing.
[0011] 4) Metal electrodes such as gold, copper, and silver are evaporated on the upper and lower surfaces of the electrocaloric thermal effect film to form a multilayer capacitor structure with 5 to 50 layers.
[0012] 5) A micro pump is used to promote the circulation of liquid metal to construct a high-throughput electro-caloric refrigeration device. The thermal conductivity of the liquid metal at night is 30 to 60 W / (m·K).
[0013] The beneficial effects of the present invention are as follows: the present invention provides an ultra-thin high-flux electric card refrigeration device, which uses a circulating liquid metal cycle to form a thermal switch, so that the electric card refrigeration device can quickly conduct heat and achieve high-flux refrigeration during operation, without noise during operation, and with very little energy consumption. The high-flux electric card refrigeration device is mainly designed and constructed from the following aspects: ferroelectric polymers [P(VDF-TrFE), P(VDF-TrFE-CFE), P(VDF-TrFE-CTFE), etc.] are subjected to weak alkalinity [(C3H9N, NaOH, C6H 15N, KOH Si(OH)4, NH3·H2O, etc.)] chemically modified, de-Cl on its main chain to form C=C to enhance the electrocaloric effect, wash the ferroelectric polymer chemically modified with weak alkali, use (deionized water, acetone, acetic acid and ethanol) for cyclic washing, dissolve the ferroelectric polymer in an organic solvent (dimethyl sulfoxide, N,N-dimethylformamide, acetone dimethyl sulfoxide, butanone, etc.), use spin coating, scraping method and other methods to prepare electrocaloric thermal effect film, evaporate gold, copper, silver and other metal electrodes on the upper and lower surfaces of the electrocaloric thermal effect film, hot press to form a multilayer capacitor structure, and the circulating liquid metal cycle is used as a thermal switch to construct a high-throughput electrocaloric refrigeration device. Prove the effect of liquid metal thermal switch and hot and cold separation effect. High-throughput refrigeration and large electrocaloric temperature difference are achieved. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of an ultra-thin high-throughput electric card refrigeration device of the present invention.
[0015] Figure 2 Separate the cooling and heat dissipation effects of high-throughput electrical card devices.
[0016] Figure 3 The temperature-time curve of the hot end of the high-flux electrocardiogram device
[0017] Figure 4 The temperature-time curve of the cold end of the high-flux electric card device
[0018] Figure 5 The heating flux time curve of the hot end of the high-flux electric card device
[0019] Figure 6 The cooling flux-time curve of the cold end of the high-flux electric card device DETAILED DESCRIPTION
[0020] The present invention will be further described below in conjunction with the accompanying drawings.
[0021] See attached Figure 1The present invention discloses an ultra-thin high-throughput electrocaloric refrigeration device comprising a high thermal conductivity graphene channel and a liquid metal circulation, wherein the graphene channel on the top layer is used for rapid extraction of circulating heat, the circulating liquid metal is used for thermal switches, insulating tapes, multi-layer ferroelectric polymer films for electric field insulation protection, and electrocaloric thermal effect, which are used to generate electrocaloric thermal effect circulation and refrigeration, a thermal disconnection insulation layer of the non-circulating liquid metal, which is used for thermal disconnection and upward heat conduction, and a thermal closing path of the circulating liquid metal, which is used for thermal closing and downward conduction of cooling capacity. A thin silver wire is introduced on the surface of the electrocaloric thermal effect ferroelectric polymer film to apply an electrocaloric electric field. The multi-layer ferroelectric polymer film is a ferroelectric polymer [P(VDF-TrFE), P(VDF-TrFE-CFE), P(VDF-TrFE-CTFE), etc.] subjected to weak alkalinity [(C3H9N, NaOH, C6H 15 N, KOH Si(OH)4, NH3·H2O, etc.) after chemical treatment.
[0022] Construction method: A top-down construction method is adopted. First, liquid metal is introduced into the high thermal conductivity graphene flow channel and pushed by a micropump circulation for thermal conductivity switching. The upper and lower surfaces of the electrocaloric effect ferroelectric polymer of the multilayer capacitor structure are pasted with thin insulating tape for insulation protection of applying an electric field. The multilayer capacitor ferroelectric polymer is embedded in the graphene channel, and thermal conductive silicone grease is used for thermal conductivity bonding on the upper and lower surfaces.
[0023] The ultra-thin high-throughput electric card refrigeration device and its construction method of the present invention are composed of four parts, including weak alkaline chemical modification and cleaning of ferroelectric polymers, vapor deposition of gold, copper, silver and other metal electrodes on the upper and lower surfaces of the electric card thermal effect film, hot pressing to form a multilayer capacitor structure, and liquid metal flowing inside the graphene channel to form a thermal conductive switch to control the hot and cold separation of the electric card. The device design and preparation method.
[0024] The preparation method thereof is:
[0025] 1. Weakly alkaline chemical modification and cleaning of ferroelectric polymers.
[0026] Ferroelectric polymers [P(VDF-TrFE), P(VDF-TrFE-CFE), P(VDF-TrFE-CTFE, etc.] were subjected to weak alkaline [(C3H9N, NaOH, C6H 15The invention discloses a method for preparing a ferroelectric polymer by chemically modifying the ferroelectric polymer by using a ferroelectric polymer (N, KOH Si(OH)4, NH3·H2O, etc.), removing Cl from the main chain to form C=C, wherein the molar ratio of the ferroelectric polymer to the weakly alkaline chemical reagent is 0.5-4:1 mol, the reaction time is 0.1-24 h, the treatment temperature is 0-100° C., and the ferroelectric polymer chemically modified with the weakly alkaline is cleaned by using 10-200 mL of deionized water, 10-200 mL of acetone, 10-200 mL of acetic acid with a concentration of 1-20 wt % and 10-200 mL of ethanol for 3-10 cycles of cleaning.
[0027] 2. Metal electrodes such as gold, copper, and silver are deposited on the upper and lower surfaces of the electrocaloric thermal effect film.
[0028] The ferroelectric polymer modified by weak base chemical treatment is dissolved in an organic solvent (dimethyl sulfoxide, N,N-dimethylformamide, acetone dimethyl sulfoxide, butanone, etc.) to prepare a solution with a concentration of 3-15wt%, and the electrocaloric effect film is prepared by spin coating, scraping, etc. The upper and lower surfaces of the electrocaloric effect film are evaporated with metal electrodes such as gold, copper, and silver.
[0029] 3. Hot pressing to form a multi-layer capacitor structure.
[0030] The multilayer capacitor structure is formed by hot pressing at 50-120°C for 0.2-2h, with 5-50 layers and a thickness of 0.5-2mm.
[0031] 4. Design and preparation method of a device for controlling hot and cold separation of electric cards by circulating liquid metal inside a graphene channel to form a thermal switch.
[0032] Liquid metal is introduced into the high thermal conductivity graphene channel, and a micropump is used to push the liquid metal to flow as a thermal switch. The upper and lower surfaces of the multilayer capacitor structure electrocaloric ferroelectric polymer film are pasted with thin insulating tape for insulation protection of applying an electric field. Multilayer electrocaloric ferroelectric polymers are embedded in the middle of the graphene channel and bonded with thermal conductive silicone grease. Fine silver wires are introduced into the surface of the ferroelectric polymer film to apply an electrocaloric electric field.
[0033] Test content:
[0034] 1. Separation effect of cooling and heat dissipation of high-throughput electric card devices.
[0035] 2. Temperature-time curve of the hot end of the device during operation.
[0036] 3. Temperature-time curve of the cold end of the device during operation.
[0037] 4. Heating flux-time curve of the hot end of the high-flux electric card device.
[0038] 5. Refrigeration flux-time curve of the cold end of a high-flux electrocardioid device.
[0039] Data Analysis:
[0040] Attached Figure 2 Separation of cooling and heat dissipation for high-throughput electrical card devices.
[0041] From the attached Figure 2 It can be seen that after liquid metal flows inside the graphene channel as a thermal conductivity switch, the thermal conductivity direction of the multi-layer electrocaloric thermal effect film can be efficiently controlled, achieving hot and cold separation and high-throughput refrigeration effects.
[0042] Attached Figure 3 This is the temperature-time curve of the hot end of the high-flux electrocardiogram device.
[0043] From the attached Figure 3 It can be seen that the temperature of the hot end of the electrocardiogram device rises by 5K and reaches temperature equilibrium. This is because the multi-layer electrocardiogram thermal effect film can generate an adiabatic temperature difference of 6K in each cycle. The liquid metal thermal conductivity switch is used to transfer heat upward in each cycle. The operating frequency of the device is 0.25Hz.
[0044] Attached Figure 4 This is the temperature-time curve of the cold end of the high-flux electric card device.
[0045] From the attached Figure 4 It can be seen that the temperature of the hot end of the electrocardioid device drops by 4K and reaches temperature equilibrium. This is because the multi-layer electrocardioid thermal effect film can produce an adiabatic temperature difference of 6K in each cycle. The liquid metal thermal conductivity switch is used to transmit cold air downward in each cycle. The operating frequency of the device is 0.25Hz.
[0046] Attached Figure 5 This is the heating flux-time curve of the hot end of the high-flux electric card device.
[0047] From the attached Figure 5 It can be seen that the electric card device pumps a lot of heat upward, and the heat density is greater than 2W.
[0048] Attached Figure 6 This is the cooling flux-time curve of the cold end of the high-flux electric card device.
[0049] From the attached Figure 6 It can be seen that the electric card device pumps a large amount of cooling capacity downward, and the cooling density is greater than 2W.
Claims
1. An ultra-thin high-throughput electric card refrigeration device and a construction method thereof, characterized in that include: The ferroelectric polymers [P(VDF-TrFE), P(VDF-TrFE-CFE), P(VDF-TrFE-CTFE), etc.] were treated with weak alkaline [(C3H9N, NaOH, C6H 15 N, KOH Si(OH)4, NH3·H2O, etc.)] chemical modification is carried out to remove Cl from its main chain to form C=C to enhance the electrocaloric effect, wherein the molar ratio of the ferroelectric polymer and the weak alkaline chemical reagent is 0.5-4:1 mol, the reaction time is 0.1-24h, and the treatment temperature is 0-100°C.
2. An ultra-thin high-throughput electric card refrigeration device and a construction method thereof, characterized in that include: The ferroelectric polymer treated with weak alkali is cleaned by using 10-200 mL of deionized water, 10-200 mL of acetone, 10-200 mL of acetic acid with a concentration of 1-20 wt% and 10-200 mL of ethanol for 3-10 cycles of cleaning.
3. An ultra-thin high-throughput electric card refrigeration device and a construction method thereof, characterized in that include: Electrocaloric effect film with multilayer capacitor structure. Ferroelectric polymer is dissolved in organic solvent (dimethyl sulfoxide, N,N-dimethylformamide, acetone dimethyl sulfoxide, butanone, etc.) to prepare a solution with a concentration of 3 to 15 wt%, and an electrocaloric effect film with a thickness of 25 to 100 μm is prepared by spin coating, scraping, etc.
4. An ultra-thin high-throughput electric card refrigeration device and a construction method thereof, characterized in that include: The upper and lower surfaces of the electrocaloric thermal effect film are evaporated with metal electrodes such as gold, copper, and silver, and hot pressed at 50 to 120°C for 0.2 to 2 hours to form a multilayer capacitor structure with 5 to 50 layers and a thickness of 0.5 to 2 mm.
5. An ultra-thin high-throughput electric card refrigeration device and a construction method thereof, characterized in that Includes: Liquid The construction of the metal circulation thermal switch includes the graphene channel from the top layer for the rapid extraction of circulating heat, the liquid metal driven by the micro pump for flow and thermal switch, the insulating tape for the electric field insulation protection of the ferroelectric polymer, the ferroelectric polymer film with multilayer capacitor structure for the generation of electrocaloric thermal effect circulation and refrigeration, the thermal disconnection of the non-circulating liquid metal for the thermal disconnection and heat dissipation upward conduction, and the thermal closure path of the circulating liquid metal for the thermal closure and refrigeration downward conduction. Thin silver wires are introduced on the side of the multilayer ferroelectric polymer to apply the electrocaloric electric field.
6. An ultra-thin high-throughput electric card refrigeration device and a construction method thereof, characterized in that include: Ultra-thin structure and high-throughput cooling density, the overall size of the device is 1 to 3 mm, and the cooling density reaches 2 to 6W.
7. The ultra-thin high-throughput electric card refrigeration device and the construction method thereof according to claim 1 are characterized by: After weak base chemical modification, ferroelectric polymers need to be purified using a polytetrafluoroethylene filter membrane with a pore size of 0.1 to 1 μm.
8. The ultra-thin high-throughput electric card refrigeration device and the construction method thereof according to claim 2 are characterized by: During the cleaning process, 20-150W water bath ultrasound is used for 0.2-10 hours, and after washing, a centrifuge is used to collect the precipitate at 100-300rpm.
9. The ultra-thin high-throughput electric card refrigeration device and the construction method thereof according to claim 3 are characterized by: The preparation temperature of the electrocaloric thermal effect film is 40-120° C., followed by vacuum annealing for 2-100 hours.
10. The ultra-thin high-throughput electric card refrigeration device and the construction method thereof according to claim 5, characterized in that: The thermal conductivity of liquid metal is 30 to 60 W / (m·K).
11. A dot matrix precise space-time cooling device based on electrocaloric effect, characterized by The method is obtained by any one of claims 1 to 10.