Circuit board detection method and system based on industrial CT

By decomposing the three-dimensional model of the circuit board into multiple units to be inspected and inspected at an appropriate proportion, the detection problem caused by solder joint density is solved, and the high accuracy and efficiency of the circuit board CT scan is achieved.

CN119269550AActive Publication Date: 2025-01-07QUANZHOU INST OF INFORMATION ENG
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Patent Information

Application Number
CN202411783404.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-06
Publication Date
2025-01-07
Estimated Expiration
2044-12-06

AI Technical Summary

Technical Problem

The number of solder joints on the circuit board is difficult to quickly and accurately locate and detect defects in three-dimensional models, especially defects that are blocked by other solder joints are difficult to be directly discovered.

Method used

The three-dimensional model of the circuit board is obtained through industrial CT scan and decompose it into multiple units to be inspected according to the BOM information. Each unit includes at least one component, scaled to a proportion suitable for user visual inspection for external form and internal sections. Cut inspection to ensure careful observation and inspection of the solder joint structure.

Benefits of technology

It improves the accuracy of the circuit board CT scanning three-dimensional model detection, can effectively identify defects in solder joints such as virtual soldering and insufficient solder filling, and analyzes complex three-dimensional models through process, improving detection efficiency and accuracy.

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Abstract

The invention relates to the technical field of circuit board detection, in particular to a circuit board detection method and system based on industrial CT. According to the technical scheme, industrial CT scanning is carried out on the to-be-tested circuit board, and a three-dimensional model of the to-be-tested circuit board is obtained; the three-dimensional model is decomposed into a plurality of to-be-detected units according to information recorded by a BOM table of the to-be-detected circuit board, structures represented by the to-be-detected units at least comprise welding spot structures, and each to-be-detected unit is zoomed to a target proportion suitable for visual inspection of a user; performing external form detection and / or internal sectioning detection on the structure represented by each to-be-detected unit under the target proportion to obtain a component detection result of each to-be-detected unit; and inputting the detection results of all the components into the detection columns of the corresponding components in the BOM table to obtain the CT detection result of the circuit board to be detected. According to the technical scheme, the problem that the number of welding spots on the circuit board is dense and detection is not easy is effectively solved, and the accuracy of circuit board CT scanning three-dimensional model detection is improved.
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Citation Information

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