Systems, methods, and apparatus for ultrasound examination

Abstract

The invention relates to a system, method and apparatus for ultrasound examination. Couplers and chucks are described. The chuck is configured to secure an article when the wafer is subjected to an inspection process. The chuck has a plurality of vacuum regions. Some of the vacuum regions hold the wafer in place while the other vacuum regions draw the couplant from the edge surface of the wafer. The coupler is used to inspect defects of a surface and a sub-surface of a wafer and includes a sensing device, which may be a transducer. One or more couplant inlet couplings are disposed on the second portion of the coupler, the couplant inlet couplings providing couplant to a portion of the wafer inspected by the sensing device. A plurality of vacuum inlet couplings are disposed on the third portion of the coupler. At least one of the vacuum inlet couplings provides suction through the recessed portion of the lower surface of the coupler to remove the coupling agent outside the portion of the wafer inspected by the sensing device.

Description

[0001] This application is a divisional application of the Chinese patent application entitled “Systems, methods and devices for ultrasonic examination” filed on June 4, 2021 and application number 201980080504.X. Background Art

[0002] Scanning acoustic microscopes are used in the semiconductor industry to nondestructively inspect bonded wafer pairs, wafer pairs, strips, singulated packages, and various microelectronic sample types to inspect defects inside the sample, typically at internal interfaces. These defects can be air-type defects. Ultrasonic inspection at frequencies greater than about 500 kHz requires a couplant so that the ultrasound propagates from the ultrasonic transducer to the sample and back again. Water is a suitable couplant because it has ideal attenuation properties and is readily available in semiconductor facilities in the form of deionized (DI) water or reverse osmosis (RO) water, or both. The wafer or sample being inspected can be held in place by a chuck.

[0003] Where water bath and "bubbler" systems are used, a large amount of water is present on the surface and edges of the sample during and after inspection, allowing water to flow or wick between the wafers or into any channels or cavities present.

[0004] Therefore, since water is commonly used as a couplant, it is desirable to limit water contact during inspection so that water does not enter the interior of the wafer, and to accelerate the drying time. This also applies to any fluid or liquid or couplant used, as excess couplant may have similar detrimental effects on the wafer being inspected. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figures 1A-1C An embodiment of a coupler according to the present disclosure is shown.

[0006] Figure 2A-2C Another embodiment of a coupler according to the present disclosure is shown.

[0007] Figures 3A-3C An embodiment of a wafer support and suction inlet according to an embodiment of the present disclosure is shown.

[0008] Figure 4 An embodiment of a two-part chuck according to the present disclosure is shown.

[0009] Figure 5 A basic cross-sectional view is shown showing the lumen used for suction.

[0010] Fig. 6A and 6B An embodiment is shown that includes a plurality of vacuum generators.

[0011] Fig. 7A and 7B An embodiment of a passageway for removing excess fluid is shown.

[0012] Figures 8A-8F An embodiment of a chuck having a lift off portion is shown.

[0013] Fig. 9 A flow chart of one embodiment is shown that uses an embodiment of a coupler with an embodiment of a chuck.

[0014] Fig.10 A flow chart for implementing an embodiment of the present disclosure is shown.

[0015] Fig.11 A flow chart is shown for pumping fluid from the edge of a bonded wafer pair according to embodiments described herein.

[0016] Fig.12 A representation of raster scanning and movement is shown.

[0017] Fig. 12A Shows Fig.12 Magnified view of the area marked 12A in FIG.

[0018] Fig.13 A flow chart for controlling positioning of a coupler according to embodiments described herein is shown.

[0019] Fig.14 A flow chart for removing a coupling agent from a surface of an article according to embodiments described herein is shown.

[0020] Fig.15 A flow chart for removing a coupling agent from a surface of an article according to another embodiment described herein is shown. DETAILED DESCRIPTION

[0021] The various methods, systems, devices, and apparatus described herein generally provide for minimization of degradation of bonded wafer pairs, wafer pairs, bonded semiconductor wafers, strips, singulated packages, and various microelectronic sample types (referred to herein as bonded wafers, bonded wafer pairs, wafers, articles, etc.) due to water or other couplant contact during ultrasonic inspection.

[0022] As described herein, ultrasonic inspection may be performed using (one or more) ultrasonic sensors to inspect the surface and / or one or more subsurface layers of an item or sample for flaws, defects, or other undesirable characteristics. Ultrasonic sensors utilize a fluid or couplant that may adversely affect the performance of the item if it is absorbed or wicked into the item being inspected. Using the inspection techniques described herein, a liquid or couplant is deposited on the upper surface of a bonded wafer pair or sample or other item being inspected.

[0023] While liquid is beneficial in providing a medium for the ultrasonic sensing device, it is detrimental if the liquid is absorbed by or exposed to any portion or surface or edge of the bonded wafer pair. The absorption or exposure may occur by the coupling agent deposited on the upper surface of the bonded wafer pair during the ultrasonic inspection process flowing over the edge of the bonded wafer pair and being absorbed or wicked into one or more layers of the bonded wafer pair from the peripheral edge and / or flowing under the bonded wafer pair and being absorbed by the lower or bottom surface of the bonded wafer pair or entering the bonded wafer pair through holes in the lower or bottom surface of the bonded wafer pair. In addition, excess fluid on the upper surface of the bonded wafer pair is undesirable.

[0024] The present disclosure relates to a dedicated coupler and a dedicated wafer chuck. The dedicated coupler and the dedicated wafer chuck can be used alone or together with each other.

[0025] The coupler can be used with any suitable surface of an article such as a bonded wafer pair (hereinafter referred to as a wafer) to scan and / or inspect the surface for defects, flaws, or other characteristics. The chuck can be used to support the wafer or other article or object in a desired manner, which may include wicking fluid or water from the surface. As described herein, the coupler and chuck can be used together to scan and / or inspect the wafer held by the chuck.

[0026] Excess fluid or couplant may be removed from the upper surface of the wafer by one or more suction vacuums provided on the coupler. Excess fluid or couplant that flows over the upper surface of the wafer may be removed from the peripheral edge of the wafer by a vacuum provided in the chuck.

[0027] One embodiment of the present disclosure relates to a coupler, which includes a sensing device disposed on a first portion of the coupler, the sensing device may be a transducer or any suitable device having a piezoelectric element or a similar device. The sensing device is configured to perform sensing of multiple inspection areas of a wafer. One or more coupling agent inlet couplings are disposed on a second portion of the coupler, the coupling agent inlet couplings being configured to provide coupling agent to a portion of the wafer being inspected by the sensing device. A plurality of vacuum inlet couplings are disposed on a third portion of the coupler. At least one of the vacuum inlet couplings is configured to provide suction through a recessed portion of a lower surface of the coupler to remove coupling agent outside the portion of the wafer being inspected, the portion of the wafer being inspected being the area currently being sensed by the sensing device.

[0028] Another embodiment relates to an inspection system that includes two sensing devices, each sensing device is disposed in an associated coupler. A first sensing device, which can be, for example, a transducer, is disposed on a first portion of the first coupler, the first sensing device being configured to perform sensing of an inspection area of ​​a wafer associated with the first sensing device. One or more couplant inlet couplings are disposed on a second portion of the first coupler, the couplant inlet couplings being configured to provide a volume of couplant to a portion of the wafer being inspected by the first sensing device. One or more vacuum inlet couplings are disposed on a third portion of the first coupler, at least one of the vacuum inlet couplings being configured to provide suction through a recessed portion of a lower surface of the first coupler to remove couplant outside of the portion of the wafer being inspected by the first sensing device.

[0029] A second sensing device (transducer) is disposed on a first portion of the second coupler, the second sensing device being configured to perform sensing of an inspection region of the wafer associated with the second sensing device. A second one or more couplant inlet couplings are disposed on a second portion of the second coupler, the second couplant inlet couplings being configured to provide couplant to a portion of the wafer being inspected by the second sensing device. A second one or more vacuum inlet couplings are disposed on a third portion of the second coupler, at least one of the second vacuum inlet couplings being configured to provide suction through a recessed portion of a lower surface of the second coupler to remove couplant outside of the portion of the wafer being inspected by the second sensing device.

[0030] Yet another embodiment of the present disclosure relates to an apparatus comprising a first section configured to support an article, such as a wafer, using one or more first vacuum inlets applied to a surface of the article or wafer, in contact or not with the article. A second section is configured to create an annular ring around the perimeter of the article (wafer) and to use one or more associated annular vacuum inlets to collect coupling agent from an edge portion of the article. Typically, the suction force of the one or more associated vacuum inlets to draw the coupling agent from the edge of the article (wafer, bonded wafer pair) exceeds the wicking force of the coupling agent on the article. The first section (flat) may include multiple areas, each area having an associated vacuum inlet applied to a surface of the article or wafer.

[0031] Yet another embodiment of the present disclosure relates to a method for fixing a wafer by positioning an article on a first surface of a chuck and sucking at least a first portion of the article on the first surface of the chuck using one or more vacuum inlets applied to the surface of the article, and then sucking at least a second portion of the article on an annular ring of the chuck using one or more annular vacuum inlets disposed on the chuck.

[0032] Additionally, multiple vacuum inlets and annular vacuum inlets applied to the surface may be operated independently of one another to provide selective suction control to one or more associated vacuum inlets.

[0033] Typically, before being ultrasonically inspected, the bonded wafer pair is placed on some form of wafer chuck to hold it in place during scans that can reach speeds of up to 1.5 m / s (1500 mm / s). These chucks can be made of materials such as ceramic, stainless steel, or anodized aluminum, and typically include a form of surface vacuum to hold the wafer in place. Bonded wafer pairs typically come in five to six standard sizes, such as 2", 4", 5", 6", 8", and 12", with 6", 8", and 12" being the most common. While these are standard sizes, any suitable size is within the embodiments described herein. Thus, a wafer chuck may have different surface vacuum areas for wafers of different sizes. For example, one chuck may support wafer sizes from 4" to 8", while a different chuck may support wafer sizes of 8" and 12". In addition, a wafer chuck may be modified to secure a warped wafer. Next, a fluid or coupling agent, such as water, deionized water, reverse osmosis water, or other suitable coupling agent, is introduced between the sensing device (which may be an ultrasonic transducer) and the wafer sample. This may be accomplished by immersing the wafer and chuck in a water bath, using a "bubbler" to create a waterfall of water from the transducer location down to the sample, or using a water coupler to create a pressurized water film between the transducer face and the sample surface.

[0034] The sample is inspected by performing a raster scan over the wafer surface and emitting ultrasonic pulses at specific locations to produce reflections from the sample at each (x, y) location. These reflection signals are evaluated to produce an image of each interface, which can be analyzed to find defects in the entire wafer area or in specific semiconductor device areas.

[0035] For bonded device wafers, such as backside illuminated (BSI), CMOS (complementary metal oxide semiconductor), and MEMS (microelectromechanical systems) wafers, there may be openings to the interior of the bonded wafer pair that may allow water or coupling agent to enter. Such water ingress may cause changes in the material properties of the interior of the bonded wafer pair, or result in contamination of the cavities in the bonded wafer pair. In some cases, there are holes in the bottom of the bottom wafer that may be very difficult to dry if water enters from the holes upward and into the internal device cavities.

[0036] In other cases, a spongy material may be present near the edge of the wafers, and water may wick between the two wafers and be absorbed by the material, changing its ultrasonic properties. This may result in brightness variations in the resulting image, which may lead to false or missed failure results. In other cases, there may be a channel leading to the edge of the wafer pair into which water may wick, exposing the device or device seals to water.

[0037] like Figures 1A-1C and Figure 2A-2C As shown, a coupler that can be used with a suitable fluid or liquid (such as water or other suitable coupling agent) has two fluid inlets, four vacuum inlets, and a recessed area for suction on the bottom or lower surface of the coupler. The fluid can be, for example, water, which can be at any temperature. The water can be between about 15 degrees Celsius and 25 degrees Celsius. The water can also be heated water with a temperature between about 30 degrees Celsius and 45 degrees Celsius. The fluid can also be deionized water, reverse osmosis water, or other suitable fluid. Figure 1C and 2C Two configurations of the lower surface of the coupler are shown.

[0038] like Figure 1A and 1B As shown, the coupler 100 includes four vacuum inlets 102, 104, 106 and 108. Two fluid or couplant inlets 112 and 114 are also shown. The sensing device support 110 is used to provide support for a sensing device 140, such as a transducer or a suitable scanning device 140, with a coupling 107 thereon. The coupler 100 has an upper surface 116. When the process starts, the coupler is initially at a first height above the surface. It is lowered to a distance above the surface suitable for scanning / inspection (operating distance).

[0039] The scanning / inspection distance can be between about 0.05 mm and 50 mm above the wafer surface (Z-axis dimension), and can also be between about 0.1 mm and 30 mm above the wafer surface (Z-axis dimension). The distance can also be between 0.7 mm and 1 mm. This scanning distance allows efficient couplant deposition and ultrasonic scanning. The coupler performing the scanning / inspection operation typically maintains this distance during the process. It can be raised when the desired surface scan / inspection is completed. The data obtained from the sensing device can be used to generate a summary or report, or provided in virtually any desired format, such as a chart, graph, etc. This can be generated by a computer processor, memory, and peripheral devices. The data can be output as a curve of a bonded wafer pair or article, indicating quality or other parameters.

[0040] Figure 1CThe lower surface 118 of the coupler 100 is shown. The lower or bottom surface 118 of the coupler 100 has recessed portions 120 (a) and (b), which are shown as being generally oval. The recessed portions 120 (a) and (b) can be used as channels to provide a suction path so that the couplant or fluid can be removed or suctioned from the area below the coupler 100. The sensing device or transducer 140 is capable of sensing the surface of an item such as a bonded wafer. The sensed data can be accumulated and / or stored and / or transmitted.

[0041] Figure 1C A bottom view of a two-slot coupler 100 is shown, illustrating the aperture 122 and the slots, or vacuum regions 120 ( a ) and 120 ( b ).

[0042] The hole or opening or port or orifice 122 provides a path for the couplant to flow from the couplant inlet to the surface being inspected, and the hole 122 also provides an opening for at least a portion of the sensing device to perform surface and sub-surface ultrasonic scanning of the item using the couplant as a medium. Thus, the hole 122 provides a path for the couplant, such as water, to flow out and create a pressurized film and a port for the sensor device to perform ultrasonic scanning.

[0043] As described herein, scanning may utilize a sensing device or scanning device that is suitable for inspecting and / or sensing flaws, defects, contours, and other properties on the surface and / or sub-surface (i.e., portions of the item that are below the surface and not visible to the naked eye) of an item such as a bonded wafer pair, a wafer, etc. The sensing / scanning device may include a transducer, or any ultrasonic device, or piezoelectric element, or ultrasonic sensing device, an associated housing, and / or sensing device capable of performing sensing in a fluid environment (e.g., an immersion environment).

[0044] Water, liquid, fluid or couplant flows from the inlet couplings 112, 114, through the associated openings 115 associated with the inlet 114 (at Figure 2A 122 to flow out onto the surface under inspection. The inlet 112 also has a similar opening, which is not visible in the figure shown, but is opposite to the opening 115.

[0045] The size of the hole 122 is determined by the desired flow rate of the couplant and the desired aperture of the sensor for performing ultrasonic scanning / inspection. Thus, the size of the hole or opening 122 is a design choice.

[0046] Also shown are two slots 120(a) and (b) which are utilized by the vacuum inlet and can in fact be considered part of the vacuum inlet, providing an area in which fluid or couplant or water is drawn from the surface outside the area under inspection. The positioning of the slots or channels 120(a) and 120(b) is determined by the desired manner of removing fluid, liquid or couplant outside the area being inspected or scanned or inspected by the sensing device. The area outside inspection includes areas from which the sensing device is not currently acquiring sensed data. The scanning area includes areas that are currently being evaluated by the sensing device. Fluid not utilized by the sensing device is outside the sensing area.

[0047] Fluid or couplant not needed for ultrasonic scanning (outside the location of the wafer being inspected by the sensing device) can be aspirated by actuating the vacuum inlet to pull the undesired couplant from the surface, which is facilitated by the use of slots 120(a) and 120(b). Thus, slots 120(a) and 120(b) are channels through which the vacuum inlet uses to aspirate fluid or couplant from the surface of the bonded wafer pair or article. The size and shape of these slots (generally, 120) are based on the desired suction properties and can be modified for a particular desired scanning / inspection process.

[0048] Figure 2A and 2B Shown as Figure 1A and 1B Another embodiment 200 of the coupler 100 is shown. Figure 2A and 2B The components shown in FIG. include Figure 1A and 1B Elements similar to those shown in .

[0049] Figure 2C The lower surface 118 is shown having a port or orifice or hole 122 for a sensing component of the sensing device 140. The lower surface 118 also has a recessed portion 223, which can be used as a channel to provide a suction path so that the coupling agent can be removed or suctioned from the area below the coupler 200. The sensing device or transducer 140 is capable of sensing flaws, defects, or other properties of surfaces and / or sub-surfaces, such as the surfaces or sub-surfaces of a bonded wafer pair or other item. As shown by the lower surface 118 of the coupler 200, the recessed portion 223 can be generally circular. Thus, Figure 2C A bottom view of a circular slot coupler 200 is shown showing the hole 122 for the couplant (eg, water) to flow out and form a pressurized film and the slot 223 where the fluid or couplant or water is drawn back.

[0050] The aperture 122 also provides a path for ultrasonic waves to propagate from the sensor to the surface of the inspected article or wafer or bonded wafer pair and back to the sensor.

[0051] The size of the recessed portion 223 can be set to accommodate the desired suction properties. The size of the portion 223 can be determined by the flow rate and force of the vacuum inlets 102, 112, 106 and 108, as described herein. Figure 1A -C and Figure 2A-2C Similar to the discussion herein, coupling agent not used to perform the sensing function / scanning function / inspection function may be wicked away through the hole 122 .

[0052] about Figures 1A-1C and Figure 2A-2C , two fluid or couplant inlets 112, 114 send fluid or liquid (e.g., water) or other couplant below the sensing surface of the sensing device (e.g., the transducer face above the orifice 122) and out of the orifice 122 at the bottom to form a couplant between the bottom of the water coupler (100, 200) and the surface of the sample ( Figures 1A-1C or Figure 2A-2C The sample surface is not shown in the figure) to produce a pressurized film of coupling agent (such as water) between. It will be apparent to those skilled in the art that the dimensions used herein are based in part on the specific application of the disclosed embodiments.

[0053] The dimensions may vary based on different applications and are not critical to the concepts disclosed herein. The four vacuum inlets 102, 104, 106 and 108 are connected to a recessed area (respectively 120(a), (b), 223, 224) on the bottom 118 of the coupler (100, 200) outside the inspection area. Figure 1C , 2C ) so that the couplant (e.g., water) is removed once the couplant is outside the inspection area of ​​the sensing device (e.g., transducer or ultrasonic device, which can be any device with a piezoelectric element) on the surface and / or sub-surface. These recessed areas (120(a)(b), 223) can vary in design.

[0054] The coupler (100, 200) is such that a couplant, such as water, is present in the inspection area while the surface is being inspected by a sensing device (e.g., a transducer), but substantially no couplant is visible to the naked eye or discernible by touch on the surface of the article (e.g., a wafer) after the inspection area has been inspected.

[0055] Although this article has been about Figures 1A-1C and Figure 2A-2CA coupler (100, 200) is described, but embodiments of the present disclosure also include that a chuck can be used to provide suction to the edge or side of an item such as a wafer, a bonded wafer pair, or the like. The suction can be achieved by utilizing a chuck having a suction chamber that draws a coupling agent or liquid from the perimeter or edge of an item such as a wafer. A chuck as described herein can be used with or without the coupler (100, 200) described herein. As described herein, a coupler can be used with or without a chuck. In fact, a chuck according to the present disclosure can be used to remove excess fluid or coupling agent from the edge of any suitable inspection surface and / or item (e.g., a sample or wafer). Thus, a chuck can be used to collect and / or remove fluid that may wick around the edge of an item and between areas of an item, resulting in potential water ingress, such as fluid that wicks between wafers or under a bottom wafer.

[0056] As described above in this article, the process of inspecting the wafer utilizes a coupling agent such as water. This means that the wafer may be in brief contact with the water along the edge of the sample (eg, the perimeter edge), resulting in water ingress.

[0057] Thus, another embodiment of the present disclosure is directed to a wafer chuck having a suction ring around the edge or perimeter of the chuck. For example, a chuck designed for 200 mm / 300 mm wafers may be used, although the principles disclosed herein are also applicable to chucks designed to support a variety of wafer diameters. The central portion is the chuck face, which has a ring for 200 mm wafer support and a ring for 300 mm wafer support, with the respective wafers being held below the vacuum inlet.

[0058] There is also an external suction ring to remove any liquid, such as couplant or water, that contacts the edge of the bonded wafer pair or wafer sample before the couplant can wick between or under the bonded wafer pair or wafer sample, as shown in FIG. Figure 3A To achieve this, the magnitude of the suction force in the outer ring exceeds the magnitude of the wicking force. This means that excess or residual fluid, couplant or water will be drawn away from the wafer edge surface rather than flowing undesirably into the wafer.

[0059] Specifically, Figure 3A A top view of a wafer chuck 300 is shown having an outer support ring 302 enclosing an inner or first vacuum ring region 308 for 200 mm wafers and an outer or second vacuum ring region 310 for 300 mm wafers. These vacuum ring regions 308 and 310 are used to hold a wafer, bonded wafer pair, or other item in a flat position on the surface of the chuck 300. Also shown are the vacuum inlets ( Figure 3A302 and 310). The edge suction feature is implemented by providing edge suction around the perimeter of the border or support ring 302 as shown by portion 304, which is used to suction couplant, water or other fluids flowing over the edge of a wafer, bonded wafer pair or other item being inspected and secured to the chuck 300.

[0060] Figure 3B Shows Figure 3A 3. A top view of a wafer chuck 300 with an outer boundary or support ring 302 having a 300 mm bonded wafer sample 320 in place. A vacuum inlet 312 is also shown.

[0061] Figure 3C A bottom view of a wafer chuck 300 having a lower or bottom surface 330 is shown, with an outer support ring 302, multiple wafer holding vacuum inlets and three water outlets are shown. The number and configuration of the outlets and inlets can vary. Three water outlets 306, 307 and 309 are shown as examples only. Vacuum inlets 312, 322, 332, 342, 344 and 348 are shown.

[0062] Figure 4 One embodiment is shown for creating a suction ring around an edge or rim (e.g., perimeter) of a wafer support chuck. This is accomplished by providing a vacuum inlet to draw water or coupling agent from the edge or perimeter of an article or wafer. One way to achieve the desired vacuum inlet on the edge of an article such as a wafer is by creating a cavity that can be connected to the vacuum inlet. Specifically, Figure 4 An exploded view of a chuck 300 having two parts (350, 380) is shown, including an upper section (350) that supports the wafer and a lower section (380) that creates an annular cavity for an outer water pumping ring, which can be an annular vacuum. Ports 362, 364, 368 and 370 and an outer ring structure 302 are also shown.

[0063] When the upper section 350 is inserted onto the lower section 380, the ports 362 and 368 in the upper section 350 and the lower section 380 are aligned, respectively. Similarly, ports 364 and 370 are also aligned with each other. These ports provide suction to the flat surface of the wafer fixed on the chuck 300.

[0064] therefore, Figure 4 An upper plate 350 and a lower section 380 are shown, with the upper plate 350 supporting the wafer ( Figure 4300) and allows the wafer to be held, the lower section 380 supports the upper plate 350 and creates an annular cavity for sucking water or couplant from the edge. Thus, when the section 350 is inserted into the section 380, a cavity is formed in which the vacuum can remove liquid or couplant from the edge of the wafer, bonded wafer pair or other item secured to the chuck 300.

[0065] Figure 5 A cross-sectional view 500 is shown, which illustrates the annulus. Figure 5 , an outer boundary or support ring 302 and a bonded wafer 320 are shown. Also shown are a water or couplant annular suction chamber 304 and wafer suction chambers 562(a)...562(n) for forming a suction ring as described herein, where "n" is any suitable number. As described herein, the suction chambers (generally, 562) provide suction to hold the wafer in a desired position on the wafer chuck. The annular suction chamber 304 provides suction for couplant or water that has flowed over the edge of the bonded wafer 320 so that it is sucked away before being absorbed along the edge surface of the bonded wafer 320 or entering the bonded wafer 320.

[0066] Fig. 6A and 6B An embodiment is shown that includes a plurality of vacuum generators. Fig. 6A and 6B The couplers 100(a) and 100(b) shown in FIG. 1 can be used with a chuck ( Fig. 6A and 6B 660) is used to hold or secure the wafer during inspection. As will be apparent to one of ordinary skill in the art, any suitable chuck may be used. As will be apparent to one of ordinary skill in the art, the wafer 660 may be drawn into the Figure 5 The surface of the chuck is shown to hold the wafer 660.

[0067] Although Fig. 6A and 6B Two couplers 100 (a) and 100 (b) are shown, but embodiments of the present disclosure are that any appropriate number of couplers can be used. For example, a third coupler can be used in combination with the two couplers shown. In addition, a fourth or any additional number of couplers can be used to form a second pair of couplers or some number of couplers of the second configuration, rather than an even number of couplers. The number of couplers is based on the desired system setup, and the illustration of two couplers is for discussion purposes only. The couplers may also have additional connectors (e.g., tubes), or connectors or tubes that can be connected to other couplers. These additional couplers can be connected to one or more vacuum generators depending on the design configuration of the system.

[0068] Once held in the desired position on the chuck (which may include applying suction to various portions of the chuck to hold the wafer), the scan / inspection is performed. As described herein, the chuck is adapted to hold the wafer 660 and may provide an annular vacuum within the chamber to draw excess couplant from the edge of the wafer 660.

[0069] Fig. 6A and 6B The embodiment shown is one in which one or more vacuum inlets of the coupler are not in (near) an operating position. The operating position is typically between about 0.05 mm and 60 mm relative to the wafer surface on the Z axis, preferably between about 0.1 mm and 30 mm relative to the wafer surface on the Z axis. Thus, the operating position is above a portion of the wafer being inspected. The suction of the vacuum inlet in the operating position with the wafer surface will not be affected or impacted. A vacuum port or inlet that is not in the operating position with respect to the wafer surface will not have any suction, and the coupler may lose suction with respect to other vacuum inlets.

[0070] By associating a separate vacuum generator with each vacuum inlet, the vacuum inlet close to the wafer surface (operating position) maintains vacuum. The vacuum generator associated with the vacuum inlet not in the operating position of the wafer surface can be "turned off" and then restored to "turned on" when the vacuum inlet not in the operating position of the wafer surface is again brought into the operating position of the wafer surface.

[0071] Fig. 6A An embodiment is shown with two couplers 100(a) and 100(b) positioned so that all fluid nozzles and vacuum inlets are positioned in an operational position relative to the surface of a bonded wafer pair or wafer, typically between about 0.05 mm and 60 mm, preferably between about 0.1 mm and 30 mm above a portion of the wafer being inspected. This operational position of the coupler allows a component of the coupler (typically the lower surface) to interact with the surface of the bonded wafer pair or wafer, causing couplant to be deposited on the surface and the vacuum inlet to draw the couplant from the surface. These operations are performed when the coupler is positioned in the operational position.

[0072] Figure 6B An edge portion of the wafer is shown being scanned such that some of the fluid nozzles and some of the vacuum inlets are not in an operating position at the wafer surface. Thus, some of the nozzles and some of the vacuum inlets are not in a position to deposit couplant on the surface or to draw couplant from the surface, respectively.

[0073] like Fig. 6AAs shown, wafer 660 can be inspected by couplers 100 (a) and 100 (b). Although two couplers 100 (a) and 100 (b) are shown, any suitable number of couplers can be used. Although couplers 100 (a) and 100 (b) are similar, coupler 100 (a) is described in detail. Coupler 100 (a) has associated vacuum inlet nozzles 102 (a), 104 (a), 106 (a) and 108 (a). Fluid inlets 112 (a) and 114 (a) are also shown. Orifice 110 (a) is shown, which is used to position a scanner or transducer or other equipment that can be used to scan the surface of the bonded wafer pair. Connector 605 is connected to vacuum inlet nozzle 102 (a), and connector 609 is connected to vacuum inlet nozzle 104 (a). The connectors or connectors (605, 609, 611, 635, 637, 641, 615, 619, 621, 625, 627 and 643) are typically tubes or conduits. These tubes can be made of plastic, PVC (polyvinyl chloride) or other suitable materials to operatively connect the vacuum generator to the vacuum inlet. The tubes can be flexible, bendable, and capable of maintaining a vacuum without leaking fluid, gas or otherwise preventing suction force or fluid transmission. Similar tubes or connectors can be used to connect the coupling agent or fluid inlet coupling to a coupling agent source (not shown). Connectors or connectors 605 and 609 can be combined to connector 611. Connector 611 is coupled to vacuum generator 652. Vacuum inlets 106 (a) and 108 (a) are coupled to connectors 635 and 637, which can be hoses or plastic pipes. Connections 635 and 637 may be combined into a connection or tube 641 that is operatively coupled to a vacuum generator 658 .

[0074] Alternatively, a single vacuum generator can be used to control any suitable number of vacuum inlets. Therefore, the number of vacuum generators is a design choice based on the system configuration. In fact, one embodiment is eight vacuum generators, each vacuum generator connected to a vacuum inlet.

[0075] Coupler 100(b) has components similar to those described with respect to coupler 100(a). Coupler 100(b) has associated vacuum inlet nozzles 102(b), 104(b), 106(b), and 108(b). Fluid inlets 112(b) and 114(b) are also shown. Orifice 110(b) is shown for positioning a scanner or transducer or other device that can be used to scan the surface of the wafer. Connector or connector 615 is connected to vacuum inlet nozzle 102(b), and connector or connector 619 is connected to vacuum inlet nozzle 104(b). Connectors 615 and 619 can be combined to connector 621.

[0076] Alternatively, as shown herein, the connector can be connected to a dedicated vacuum generator separately. Therefore, each vacuum inlet (102, 104, 106 and 108) can have an associated vacuum generator. However, as shown, connector 621 is coupled to vacuum generator 654. Vacuum inlets 106 (b) and 108 (b) are coupled to connectors 625 and 627, respectively, which can be hoses or plastic pipes. Connectors 625 and 627 can be combined into connectors or tubes 643, which are operatively coupled to vacuum generator 656.

[0077] The vacuum generators 652, 654, 656, and 658 may be operatively coupled to a processing unit 651. The processing unit 651 may include a central processing unit (CPU) 653 operatively coupled to a memory or storage unit or module 655 bi-directionally.

[0078] The central processing unit (CPU) 651 has sufficient processing power to access data from the memory or storage unit or module 655 to operate the vacuum generators 652, 654, 656 and 658. The memory or storage unit 655 is typically a suitable electronic storage device configured to access locally and / or remotely stored program code. The electronic storage device or other suitable storage medium can be a non-transitory computer-readable medium configured to store instructions that, when executed, perform the desired functions. The electronic storage device of the module 655 can be a RAM, ROM, EEPROM, DRAM, thumb drive, disk or other suitable medium for storing program code.

[0079] Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes but is not limited to RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by the computer 310.

[0080] The vacuum generators 652, 654, 656, and 658 can be configured to operate individually and / or collectively based on instructions or commands from the controller 651. Alternatively, the control of the vacuum generators can be manual control, automatic control, or a combination of manual and automatic control. Although four vacuum generators are shown, any suitable number can be used as an embodiment of the present disclosure. As described herein, the individual control of each vacuum generator enables the vacuum inlet to be selectively operated.

[0081] In fact, Figure 6BIt is shown that during wafer inspection or scanning, there are inspection areas and time periods of the wafer that are enhanced by selective control of the vacuum inlet and the fluid inlet. As shown, the coupler 100 (a) with vacuum inlets 106 (a) and 108 (a) and a portion of the fluid inlet 114 (a) are located outside the surface of the wafer 660. Similarly, some of the vacuum inlets (106 (b), 108 (b)) of the coupler 100 (b) are not in an operating position on the wafer surface 660. This can be considered to be "off" the wafer because the coupler or some portion of the coupler is not in contact with the wafer surface.

[0082] In order to improve the scanning and / or inspection process, separate control of the vacuum inlets is provided by selectively operating vacuum generators associated with vacuum inlets that may not be in an operating position relative to the wafer surface 660. Some of the vacuum inlets (106(a), 108(a)) are located away from the edge of the wafer surface, which causes the associated vacuum generators to change their operating states. Therefore, when a portion of the coupler is not close to the surface, the vacuum generator associated with the vacuum inlet away from the surface is turned off. The position can be sensed by a scanner or transducer. Therefore, the operating state of the vacuum generator is a function of the position of the associated one or more vacuum inlet couplings. The vacuum generators operatively coupled to one or more associated vacuum ports can be individually operated by a controller or computer 651. As has been described above Fig. 6A Describes Figure 6B other parts of the device.

[0083] Alternatively, the vacuum generators (652, 654, 656, 658) may be associated with selected ones of the inlets (102(a) and (b), 104(a) and (b), 106(a) and (b), 108(a) and (b)). Such an embodiment may include one or more vacuum generators operatively coupled to the inlets such that a particular vacuum generator controls a particular inlet or a single vacuum generator controls two or more inlets. For example, when some of the vacuum inlets are positioned away from the wafer surface in the x, y plane, those vacuum inlets on the wafer surface in the x, y plane will maintain suction on the wafer surface because those "open" inlets are controlled by other vacuum generators.

[0084] Fig. 7A and 7B An embodiment of a pass to remove excess fluid is shown. Fig. 7A and 7B The process shown is described using the surface of a wafer 660. The wafer may be held or secured in place by a chuck as described herein and scanned / inspected by a coupler(s) as described herein. Fig.12A further description of the movement of the coupler pair relative to the surface being inspected or tested is provided.

[0085] like Fig. 7A As shown, wafer surface 660 is shown as a circular surface, although any shape of surface may be used. Surface 660 has a set of scan paths, which include path 702 for one coupler 100 (b) and path 704 for another coupler 100 (a). Paths 702 and 704 are separated by a linear distance 706 along the y-axis of surface 660. Distance 706 can be defined as a raster scan distance (p(n)). Coupler 100 (a) traverses along the scan path shown as 704. Coupler 100 (b) traverses along the scan path shown as 702. Other scan paths, inspection areas are shown as paths 708 and 710. Path 708 is located at a distance 711 from path 704 along the Y-axis. Paths 708 and 710 are separated by a distance 712 along the Y-axis.

[0086] Figure 7B Couplers 100(a) and 100(b) are shown being scanned / inspected along paths 708, 710, respectively. The scanning / inspection process is similar to the scanning / inspection of other portions of the wafer. The next area of ​​the wafer after paths 708, 710 is shown by path 724, which is a distance 722 along the Y axis. (The distances in the figures are not shown to scale).

[0087] like Fig. 7A and 7B As shown, couplers 100(a) and 100(b) can be configured to scan / inspect substantially parallel paths on a wafer held by a chuck, as described herein. The scan / inspection area is subject to the introduction of fluid during the inspection process, but the presence of fluid may not be desired outside of the area of ​​the wafer that is directly or currently being inspected.

[0088] Couplers 100(a) and 100(b) can repeatedly scan an area that has recently been inspected to draw fluid or water used during the inspection process. This is achieved by positioning one or more couplers so that after the scanning / inspection operation, the (one or more) couplers traverse the path to draw fluid from the wafer surface. Specifically, after coupler 100(a) scans scan path 704, coupler (100(a)) can repeat scan path 704 at the same speed without depositing coupling agent. The repeated strokes of coupler 100(a) on scan path 704 are performed without depositing any coupling agent or liquid, and the vacuum inlet is actuated to draw the surface along scan path 704. Therefore, the stroke is performed without actuating the sensing device or fluid inlet but utilizing the vacuum inlet to draw fluid from the surface.

[0089] Alternatively, the stroke path can be repeated with the fluid at a lower speed. That is, the scan path will be repeated with the fluid deposited, aspirated, and at a slower speed.

[0090] Fig. 8A and 8B An embodiment of a chuck having a lift-off portion is shown. The chuck can be used to support or secure an item, such as a bonded wafer pair, a wafer, or other item suitable for support. Figures 8A-8F The illustrated embodiment shows a substantially circular chuck, but the outer perimeter may be any suitable shape or have any suitable perimeter. A substantially circular perimeter is used for discussion purposes only.

[0091] Fig. 8A Wafer chuck 300 is shown having vacuum inlets 822(a)...(f) in outer region 310 and vacuum inlets 820(a)...(c) in inner region 308. Although a few vacuum inlets are shown, any suitable number may be used. Wafer chuck 300 has portion 870, which includes portions 872, 874, and 876.

[0092] When suction is applied to a wafer (wafer not shown) mounted or supported by the chuck 300, the wafer is held in place on the chuck 300. Using the portion 870 that does not include a vacuum inlet, a wafer can be picked up or removed from the chuck 300, as well as placed on the chuck 300. Using this embodiment with a cut-out portion 870 allows a wafer to be placed on or removed from the surface of the chuck when suction has been "turned off". In addition, the outer support ring 310 can include multiple sections. One or more of these sections can be raised or lowered vertically to allow removal of a bonded wafer pair.

[0093] Figure 8B Wafer chuck 300 is shown having vacuum inlets 823(a)...(f) in outer region 310 and vacuum inlets 821(a)...(c) in inner region 308. Although a number of vacuum inlets are shown, any suitable number may be used. Wafer chuck 300 has portions 880(a) and (b) configured for item removal. Use of this embodiment with cut-out portions (840 and 842) allows a wafer to be placed on or removed from the surface of the chuck when suction has been "turned off". Similar elements have been described above with respect to Fig. 8A Region 880(a) includes 842, which is a portion of ring 302 having a smaller portion for facilitating the removal of an object or wafer. Region 880(b) includes 840, which is a portion of ring 302 having a smaller portion for facilitating the removal of an object or wafer. Figure 8BAs shown, two regions 880 (a) and (b) provide areas of reduced or lower suction for removing wafers.

[0094] Figure 8C Ring 302 is shown having a portion 834 having a cavity 836. Ring 302 also includes a vacuum passage path, generally 838.

[0095] Fig.8D Another view of the ring 302, vacuum chamber 836, and vacuum cutout 840 is shown.

[0096] Fig. 8E Ring 302 is shown having a cavity 832 that provides a location for a chamber (shown herein as 836).

[0097] Fig.8F An embodiment of a chuck having a ring 302 is shown. Fig.8F The other elements have been described earlier in this article.

[0098] Fig. 9 and 10 11 and 11 describe methods or processes 900, 1000, 1100, respectively, to operate a device to inspect and / or scan ("inspect / scan") a bonded wafer pair or at least a portion of a wafer, a surface and / or at least a portion, a sub-surface or an internal layer of a bonded wafer pair or a wafer (methods 900, 1000), and to secure an item such as a wafer to a chuck (method 1100). These methods or processes 900, 1000, and 1100 can be described in terms of steps resulting from the execution of instructions stored on a computer-readable medium. The execution of the instructions can be used to control associated devices or components of the devices.

[0099] These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device create a device for implementing the functions / actions specified in one or more boxes of the flowchart and / or block diagram. These computer program instructions can also be stored in a computer-readable medium, which can guide the computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable medium produce a manufactured article including an instruction device, which implements the functions / actions specified in one or more boxes of the flowchart and / or block diagram.

[0100] The computer program instructions may also be loaded onto a computer or other programmable data processing device (shown herein as processor 651) so that a series of operational steps are performed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide a process for implementing the functions / actions specified in one or more boxes of the flowchart and / or block diagram.

[0101] The computer readable medium may be a non-transitory computer readable medium or any suitable medium that stores instructions in an electronic memory and is executed by a processor accessing the instructions. These types of electronic storage devices and electronic memory may be RAM (random access memory), ROM (read only memory), EEPROM. For example, instructions may be stored in the memory 655 and executed by the CPU 653, as described herein. Fig. 6A and Figure 6B shown.

[0102] The present embodiment is described below with reference to flowchart illustrations and / or block diagrams of methods, devices, systems, and computer program products according to the embodiments. It will be understood that each block of the flowchart illustrations and / or block diagrams and combinations of blocks in the flowchart illustrations and / or block diagrams can be implemented by computer program instructions.

[0103] Fig. 9 An embodiment of a method 900 for using a coupler in conjunction with a chuck is shown. Fig. 9 As shown, a method 900 is described for operating a chuck and a coupler to mount a wafer, perform a scanning or inspection operation, and remove a wafer from the chuck.

[0104] The wafer is mounted on a chuck (904) and a coupler device, typically having two coupler units, is positioned slightly above the wafer area. This area above the wafer is the initial position for starting a scanning / inspection operation. This initial position on the wafer can be defined as an "initial position" which is typically between about 0.05 mm and 60 mm, preferably between about 0.1 mm and 30 mm (906) from the wafer surface being scanned / inspected. This distance from the bonded wafer pair or wafer surface is referred to herein as the operating distance. Therefore, the scanner, sensor or transducer is positioned to obtain optimal scanning / inspection of the wafer surface, sub-surface, internal layer and / or intermediate layer. Therefore, although the above distance range is optimal, other distances from the wafer surface are also embodiments of the present disclosure.

[0105] The coupler device, which typically has two couplers, performs an inspection / scanning operation (912) by applying a coupling agent and suction. The inspection / scanning operation starts from a first initial position (P (1) ) proceed to the second area P 2, up to any number of locations (P(N), where "N" is any suitable number, or locations on the wafer, which are locations on the wafer). The locations can be defined by "X", "Y" coordinate pairs.

[0106] During the inspection / scan operation, suction may be applied to the bonded wafer pair or portion(s) of the wafer that is either the previous inspection / scan area or the current inspection area, but outside the sensor perimeter. The suction step is a process by which the vacuum inlet is allowed to remove excess fluid or couplant by suctioning the fluid or couplant from the surface of the wafer as the coupler(s) are moved over the surface of the wafer.

[0107] When checking / scanning the first area (P 1 )(912) after which the coupler is moved to a second position, which may be any subsequent position on the wafer surface (P 2 To P N )(918). A determination is made as to whether any portion of the coupler is located off the wafer in the X or Y plane, since the coupler is approximately 0.05 mm to 60 mm from the surface in the Z plane (924). If not, then "No" (926) means to continue the inspection / scanning operation (912) by applying fluid and suction to the wafer surface at the location of the coupler.

[0108] If a portion of the coupler is "off" the wafer surface in the X or Y plane, then "yes" (928) indicates that the suction of one or more vacuum inlets is controlled (930). This control can be achieved by turning the associated vacuum generator to the "off" state while maintaining suction at other vacuum inlets.

[0109] Alternatively, if a portion of the coupler is not in an operational position along the X or Y axis position, the vacuum inlet(s) in the X-plane or Y-plane position away from the surface has limited suction force. However, other vacuum inlets controlled by different vacuum generators will provide suction to the inlets in an operational position relative to the wafer surface.

[0110] In one embodiment, the various vacuum generators may be selectively controlled to provide vacuum suction to selected vacuum inlets based on the location of the vacuum inlets. Thus, it is selectable whether the vacuum generator associated with any vacuum inlet actually turns off suction on the associated vacuum inlet when the vacuum inlet is not on the surface in the X or Y plane of the surface.

[0111] A determination is made as to whether additional areas of the wafer are to be inspected / scanned (940). If so, a "yes" (942) indicates that the inspection / scan is performed by positioning the coupler at the desired location (906).

[0112] If no other areas of the wafer are to be scanned / inspected, then "No" (944) indicates that the coupler is moved away from the wafer in the Z plane so that another wafer can be inspected (950).

[0113] Fig.10 A method 1000 of implementing an embodiment of the present disclosure is shown. Scan paths or inspection areas are identified (1004). These scan paths or inspection paths are generally areas that one or more couplers will traverse during a scan or inspection swath. An inspection / scanning operation of a first scan path(s) / inspection area(s) is performed at a first speed (1006). The inspection scan generally utilizes the application of fluid and aspiration to aspirate fluid outside of the inspection area or scan range being inspected by the scanner or transducer, as described herein.

[0114] The area scanned by the coupler can be identified and re-scanned by the coupler (1008). This re-scanning process utilizes suction with or without the application of fluid. The re-scanning can be performed to remove residual fluid present on the wafer surface and is performed at a second speed. The second speed can be the same speed as the first speed, or different, or less than the first speed, or greater than the first speed.

[0115] Alternatively, line 1007 shows that the aspiration stroke may be skipped and the determination made after an inspection scan using fluid and aspiration (1010).

[0116] A determination is made as to whether sufficient fluid has been removed (1010). This determination is made whether there was an aspiration stroke (1008) or no aspiration stroke (1007, from 1006). If sufficient fluid has not been removed, a "no" (1012) means to scan the area again to aspirate fluid.

[0117] If it is determined that sufficient fluid has been removed, then "yes" (1014) indicates that other scan path(s) / inspection area(s) are identified (1016). These scan path(s) / inspection area(s) may be other inspection areas on the wafer.

[0118] The one or more couplers are positioned so that the one or more couplers scan / inspect the wafer surface in other wafer regions (1018). Scanning / inspection of other path(s) / region(s) of the wafer surface is performed by the one or more couplers (1020). Similar to the previous scan (1006), this scan / inspection is performed by applying fluid and suction.

[0119] A second or repeated scan of the second (other) area may be performed (1024). This repeated scan may be performed with or without fluid and is used to wick away excess or residual fluid or couplant or liquid from the wafer surface. During this second or repeated scan, the speed of the coupler may be the same or different than the inspection scan procedure.

[0120] For example, there are various operating embodiments. One embodiment (without fluid) is to perform a second stroke of the same path. This second stroke can be performed at the same speed as the previous stroke, and fluid deposition is not activated. Therefore, the coupler does not deposit fluid, but uses suction capabilities to remove excess fluid.

[0121] Another embodiment (with fluid) is that the coupler performs a second stroke over the previously scanned path and deposits fluid. This stroke is performed at a slower speed than the initial stroke. The slower speed allows the vacuum inlet to suck away excess fluid because the vacuum inlet is exposed to a portion of the surface for a longer period of time.

[0122] Alternatively, the second or repeat aspiration scan (1024) may be skipped (1022), and a determination (1026) may be made whether the fluid, couplant, or water has been sufficiently removed without performing the aspiration scan (1022).

[0123] Based on the results of sensing the amount of residual fluid or couplant or water on the wafer surface (1026), the suction scan (1024) may be repeated when the fluid or water or couplant is not sufficiently removed (1034).

[0124] If the fluid, water or couplant has been sufficiently removed (1030), then a determination is made as to whether there are additional areas of the wafer to be inspected or examined (1044). If so, then a "yes" (1042) indicates that additional scan path(s) / inspection area(s) of the wafer are performed (1016). From there, additional areas of the wafer are inspected / scanned (1016), as described above.

[0125] If the wafer has no additional areas to inspect (1046), then inspection of another wafer may be initiated (1050).

[0126] Fig.11 A series of steps or instructions 1100 are shown for controlling the operation of a support device, such as a chuck. As described herein, a chuck can be used to hold a wafer that is inspected and / or scanned by a coupler. In practice, the use of a chuck with a cavity to draw excess coupling agent has a complementary relationship to a coupler that performs a suction scan to draw excess coupling agent from a wafer surface. An article, such as a wafer, is positioned on a first surface of a support device, such as a chuck (1104). The article can be positioned on a flat surface of the device so that the article can be held in a desired position.

[0127] Suction is applied to a first portion of the device (1106). The suction is typically applied by controlling one or more vacuums (1108(a) ... (n), where "n" is any suitable number). Suction may be applied to the underside of the device at designated or selected areas to hold an item (e.g., a wafer) in a fixed position on the device or chuck. As described herein, the application of suction may be controlled by controlling one or more vacuum generators that generate a suction force on an associated vacuum inlet or inlets.

[0128] A vacuum force or suction may be applied to a second portion of the device (e.g., chuck) to secure the item in a different mode (1112). The suction may be generated around the perimeter of the wafer through a vacuum inlet on a ring around the wafer or bonded wafer pair. The additional suction may be applied through the vacuum inlet in cooperation with one or more vacuum generators (1108), the second vacuum may be a suction force to pull fluid that has flowed over the edge of the bonded wafer pair and would otherwise be absorbed by entering the edge portion of the bonded wafer pair or wafer. The edge vacuum force pulls or sucks the overflowing fluid from the edge of the bonded wafer pair or wafer.

[0129] This control of the vacuum (1106, 1108, 1112) may use any combination of vacuum inlets and vacuum generators to produce the desired suction on some portion of the article or wafer. This may include surface (1106) and annular (1112) vacuum forces.

[0130] A fluid, such as water or other suitable couplant, is deposited on at least a portion of the article (1116). This deposition of the fluid or couplant is typically performed as part of a scanning or inspection function. The fluid or couplant is used in conjunction with the scanner to identify flaws or defective areas on or within the article (e.g., a bonded wafer pair or a subsurface of a wafer). At least some of the fluid or couplant is drawn from the edge by a vacuum, which may be located in a cavity of a support device (1118).

[0131] A determination is made as to whether additional fluid is to be deposited on an item, such as a wafer (1120). If so, a "yes" (1124) indicates that the fluid or couplant is deposited on the item (1116). If it is determined (1120) that no additional fluid is to be deposited, a "no" (1126) indicates that the item is removed from the support device (1130).

[0132] Fig.12 A representation of the coupler scanning and movement is shown at 1200. This may include in area P (n) raster scan on the other area P (N) Scan on.

[0133] like Fig.12 As shown, a representation 1200 of a surface 660 of an article, such as a wafer or a bonded wafer pair, has a first coupler 1230 (1)…(4) The grid lines or scan paths and the second coupler 1240 (1)…(4) Although for each coupler 1230 (1)…(4) , 1240 (1)…(4) Four grid lines or paths are shown, but any suitable number of grid paths or scan paths or lines is within the scope of the present disclosure.

[0134] Typically, each grid line or scan path 1230, 1240 has multiple collection locations. For example, scan line 1230 (1) There are a plurality of collection locations 1280(a)...(n), where "n" is any suitable number. These grid regions are the subject of inspection by a sensing device as described herein.

[0135] The grid lines or scan paths are separated by a distance p (n) 1252. The first coupler will scan or traverse the scan path 1230 (1)…(4) , and the second coupler will scan or traverse path 1240 (1)…(4) , each grid path or scan path is separated by a distance p relative to the Y axis (n) As described herein, a pump-only stroke may or may not be used, depending on the volume of fluid or couplant detected or sensed on the wafer surface.

[0136] When the first coupler completes the scan path 1230 (4) When the second coupler completes the scan path 1240 (4) The first coupler will move or change its position or "jump" a distance P (N) 1254, as shown in 1232. The second coupler will also move or jump a distance P (N) 1254, as indicated at 1242. Thus, the first coupler is positioned on the portion of the article or wafer surface 660 at the next p above the last scan path of the second coupler. (n) The new scan path starts at position 1240 (4) Add p (n) 1252. Thus, the entire surface area of ​​the article or bonded wafer pair 660 is scanned by the first coupler or the second coupler. Additional scans may be performed without applying fluid and utilizing suction as desired. Also, additional scans may be performed at a lower speed with fluid as desired. Another embodiment is that additional scans may be performed at a lower speed without fluid.

[0137] The use of suction scanning is described herein, whether performed at a slower speed, a faster speed, with or without the application of fluid, or at any permutation of speed and application of fluid. The embodiments described herein may use any combination of suction, speed of the coupler, and application of couplant to optimally perform a scanning procedure of the surface of an article such that the article does not suffer surface defects and / or sub-surface defects due to exposure to fluids introduced and used during the scanning process.

[0138] Often it is convenient to perform a pump scan on the iterations before jumping 1254. Thus, Fig.12 As shown, the scanning path 1230 (4) and 1240 (4) Perform a suction scan on the

[0139] Fig.13 A flow chart 1300 is shown for controlling positioning of a pair of couplers according to embodiments described herein. Fig.13 The description of the invention describes two couplers being positioned; however, the use of positioning any number of couplers will be substantially similar. A first coupler performs a first scan or inspection path (1304). A second coupler performs a first scan or inspection path (1306). A determination is made as to whether the coupler is operating over a particular region of the article (1308). The region may be considered to be p (N) , which is to "jump" or move P (N) The scanning area of ​​the first set of couplers before going to another area.

[0140] If the coupler is still in the scanning area (p (n) ), then "yes" (1310) means that the couplers continue to scan / check the area of ​​their respective paths.

[0141] When the coupler has completed the scan of the area (which can be considered as p (N) ), "No" (1314) indicates that the first coupler and the second coupler can be moved to another position to scan / inspect another area of ​​the article or wafer (1318). The other area position can be considered to be relative to the Y axis P (N) The location of the place.

[0142] Then, the first coupler (1320) and the second coupler (1324) begin a scanning / inspection process at the second region. After each scan (e.g., a raster scan), as described herein, a determination is made as to whether the region is within the current scan region (1308). Thus, when in a region (e.g., p (n) ) is completed, the coupler is moved. The process is then continued until the desired surface has been scanned / inspected.

[0143] Fig.14A flow chart 1400 is shown for removing a coupling agent, such as water or other suitable fluid, from a surface of a bonded wafer in accordance with embodiments described herein. An inspection is performed on an article (e.g., a surface of a bonded wafer pair) (1404). The inspection includes deposition of coupling agent, sensing the surface and / or sub-surface of the article, and aspirating the coupling agent from areas where the coupling agent is not used by the sensor to perform sensing. A determination is made as to whether there is another area that is desired to be sensed by the sensing device (1408). If there is an additional area to be scanned or sensed, then "yes" (1410) indicates determining whether there is additional coupling agent on the surface (1412). If there is additional coupling agent on the surface, then "yes" (1416) indicates performing another stroke of the coupler (1418). This stroke of the coupler can be performed with aspiration and without depositing additional coupling agent.

[0144] Alternatively, the trip (1418) may include deposition of the coupling agent and an aspiration process. The coupler is moved to a subsequent (second, third, etc.) zone (1420). Once identified (1426) in the subsequent zone, the inspection (1404) is continued.

[0145] If there is no additional or undesired coupling agent (1412), then "no" (1422) indicates that the move to the subsequent region (1420) is complete.

[0146] Referring back to determining if there is an additional area to scan (1408), when there is another area to scan on the upper portion of the surface, "no" (1428) indicates determining if there is excess fluid on the surface (1430). If so, "yes" (1432) indicates performing another stroke (1444). This stroke (1414) may be a suction stroke only, which is used to suction excess fluid from the surface. If it is determined that there is no excess fluid on the wafer surface, "no" (1458) indicates that the coupler may be moved away from the surface of the article (1460).

[0147] Fig.15 A flow chart 1500 is shown for removing coupling agent from a surface of an item such as a bonded wafer pair, wafer, or other item. Fig.15 Another embodiment described herein is shown. An article, such as a bonded wafer pair or wafer, is placed on a chuck or other suitable mounting device (1504). A coupler (e.g., a coupler described herein) is positioned in an operating position relative to a surface of the article (1506). The operating position is typically between about 0.05 mm and 45 mm above the surface of the article in the Z plane. Preferably, the operating position is between about 0.1 mm and 15 mm above the surface of the article in the Z plane. The operating distance is a distance sufficient to deposit the couplant, inspect the surface, and aspirate the couplant from the surface of the article.

[0148] Once in the desired operating position relative to the surface of the article, inspection / scanning of the surface is performed by applying and aspirating a fluid (eg, couplant) (1510).

[0149] A determination is made as to whether another (subsequent) portion of the article is desired to be scanned (1514). If so, a "yes" (1522) indicates that another scan path is performed on the most proximal region of the article (1526). This scan path may be performed using suction without depositing fluid. Following the suction path (1530), an inspection / scan is performed on the subsequent region (1506).

[0150] If it is determined that there is no subsequent portion of the article desired to be inspected / scanned (1514), then a "no" (1516) indicates that the article is removed from the chuck (1520).

[0151] Various embodiments are described, which may include combinations of embodiments.

[0152] One embodiment is directed to a coupler comprising: a sensing device disposed on a first portion of the coupler, the sensing device being configured to perform sensing of multiple inspection areas of an article; one or more couplant inlet couplings disposed on a second portion of the coupler, the couplant inlet couplings being configured to provide couplant to the portion of the article inspected by the sensing device; and one or more vacuum inlet couplings disposed on a third portion of the coupler, at least one of the one or more vacuum inlet couplings being configured to provide suction through a recessed portion of a lower surface of the coupler to remove at least a portion of the couplant outside of the location of the article inspected by the sensing device.

[0153] Another embodiment is directed to the above coupler, and further includes one or more vacuum generators, each vacuum generator operatively coupled to an associated one or more of the vacuum inlet couplings.

[0154] Yet another embodiment is directed to the above coupler wherein the operating state of the vacuum generator is a function of the position of the associated one or more vacuum inlet couplings.

[0155] Yet another embodiment is directed to the above coupler, wherein the lower portion of the coupler is positioned between about 0.1 millimeters and about 50 millimeters above the upper surface of the article.

[0156] Yet another embodiment is directed to the above coupler, wherein the one or more couplant inlet couplings provide couplant to a location beneath the sensing portion of the sensor to create a pressurized film of couplant between the sensing portion of the sensor and the portion of the article under inspection.

[0157] Yet another embodiment is directed to the above coupler, wherein the coupling agent is selected from the group consisting of water, deionized water, and reverse osmosis water.

[0158] Yet another embodiment is directed to the above coupler, wherein the couplant is water having a temperature between 30 degrees Celsius and 45 degrees Celsius.

[0159] Yet another embodiment is directed to the above coupler, wherein the sensing device accumulates inspection data during the sensing and provides the accumulated inspection data to a processor.

[0160] Yet another embodiment relates to an inspection system, comprising: a first sensing device disposed on a first portion of a first coupler, the first sensing device being configured to perform sensing of an inspection area of ​​an article associated with the first sensing device; a first set of one or more couplant inlet couplings disposed on a second portion of the first coupler, the first set of couplant inlet couplings being configured to provide couplant to a portion of the article inspected by the first sensing device; a first set of one or more vacuum inlet couplings disposed on a third portion of the first coupler, at least one of the first set of vacuum inlet couplings being configured to provide suction through a recessed portion of a lower surface of the first coupler to remove couplant from the article inspected by the first sensing device. a second sensing device disposed on the first portion of the second coupler, the second sensing device being configured to perform sensing of an inspection area of ​​the article associated with the second sensing device; a second set of one or more coupling agent inlet couplings disposed on the second portion of the second coupler, the second set of coupling agent inlet couplings being configured to provide coupling agent to the portion of the article inspected by the second sensing device; a second set of one or more vacuum inlet couplings disposed on the third portion of the second coupler, at least one of the second set of vacuum inlet couplings being configured to provide suction through a recessed portion of a lower surface of the second coupler to remove coupling agent outside the portion of the article inspected by the second sensing device.

[0161] Yet another embodiment is directed to the above inspection system, further comprising one or more vacuum generators, each vacuum generator operatively coupled to an associated set of vacuum inlet couplings.

[0162] Yet another embodiment is directed to the inspection system described above, wherein the operational state of the vacuum generator is a function of the position of the associated set of vacuum inlet couplings.

[0163] Yet another embodiment is directed to the above inspection system, wherein the first coupler and the second coupler are positioned at first and second locations on the article, respectively, and the first and second couplers inspect associated portions of the article and the first and second couplers extract couplant from the article.

[0164] Yet another embodiment is directed to the inspection system described above, wherein the first and second couplers are positioned at third and fourth locations on the wafer, respectively.

[0165] Yet another embodiment relates to a method utilizing two couplers, comprising: positioning a first coupler at a first position above an upper surface of an article; positioning a second coupler at a second position above the upper surface of the article; dispensing coupling agent from one or more of the first coupler and the second coupler onto a portion of the upper surface of the article; scanning a portion of the article by controlling the positioning of the first and second couplers; and aspirating at least a portion of the coupling agent from the upper surface of the article based on the positioning of the first and second couplers.

[0166] Yet another embodiment is directed to the method utilizing two couplers, further comprising: accumulating inspection data from the scanning step; and processing the accumulated inspection data.

[0167] Yet another embodiment relates to the method utilizing two couplers, further comprising: identifying a previously scanned portion of the article; and positioning the first and second couplers to traverse the previously scanned portion of the upper surface of the article while actuating one or more vacuums.

[0168] Yet another embodiment is directed to the method utilizing two couplers, further comprising: traversing the previously scanned portion of the article at substantially the same rate as the scanning.

[0169] Yet another embodiment is directed to the method utilizing two couplers, further comprising: depositing a couplant on the article; and traversing the previously scanned portion of the article at a slower rate than the scanning.

[0170] Yet another embodiment relates to the method utilizing two couplers, further comprising: positioning the first coupler at a third position of the article; positioning the second coupler at a fourth position of the article; dispensing the coupling agent from one or more of the first coupler and the second coupler to associated portions of the article based on the third position and the fourth position; scanning associated portions of the article by controlling the positioning of the first and second couplers; and extracting at least a portion of the coupling agent from the article based on the positioning of the first and second couplers; the third position is an area between the second position and the fourth position, which is an uninspected area of ​​the article.

[0171] Yet another embodiment is directed to the method utilizing two couplers wherein the third location is between approximately 30 and 70 millimeters from the first location along the Y-axis of the article.

[0172] Yet another embodiment is directed to the method utilizing two couplers, wherein the first and second couplers are positioned between approximately 0.1 mm and 50 mm above the upper surface of the article.

[0173] Yet another embodiment relates to a method of utilizing a coupler, comprising: positioning the coupler at a first position above an upper surface of an article; dispensing couplant from one or more couplant inlet couplings onto a portion of the upper surface of the article; scanning a portion of the article by controlling the positioning of the coupler; and aspirating at least a portion of the couplant from the upper surface of the article based on the positioning of the coupler.

[0174] Yet another embodiment is directed to a method of utilizing a coupler, further comprising: accumulating inspection data from the scanning step; and processing the accumulated inspection data.

[0175] Yet another embodiment relates to a method utilizing a coupler, further comprising: identifying a previously scanned portion of the article; and positioning the coupler to traverse the previously scanned portion of the upper surface of the article while actuating one or more vacuums of the coupler.

[0176] Yet another embodiment is directed to a method utilizing a coupler, further comprising: traversing the previously scanned portion of the article at substantially the same rate as the scanning; and aspirating at least a portion of the couplant from the upper surface of the article.

[0177] Yet another embodiment is directed to a method utilizing a coupler, further comprising: depositing a coupling agent on the article; traversing the previously scanned portion of the article at a slower rate than the scanning; and aspirating at least a portion of the coupling agent from the upper surface of the article.

[0178] Yet another embodiment relates to a chuck device comprising: a first section configured to support at least a portion of an article; one or more first vacuum inlets disposed in one or more areas of the first section; a second section configured to create an annular ring around a perimeter of the article; and one or more second vacuum inlets disposed in the annular ring configured to provide suction along the perimeter of the article.

[0179] Yet another embodiment is directed to the chuck apparatus described above, wherein the first section comprises two or more regions, each region of the first section having one or more associated first vacuum inlets of the one or more first vacuum inlets.

[0180] Yet another embodiment is directed to the above chuck apparatus, wherein the second section includes a structural ring member having a cavity therein.

[0181] Yet another embodiment is directed to the chuck apparatus described above, wherein a suction force of the one or more second vacuum inlets exceeds a wicking force of the couplant on the article.

[0182] Yet another embodiment is directed to the above-described chuck apparatus, further comprising one or more vacuum generators configured to control an operational state of one or more of the one or more second vacuum inlets.

[0183] Yet another embodiment is directed to the above-described chuck apparatus, further comprising one or more vacuum generators configured to control an operational state of one or more of the one or more first vacuum inlets.

[0184] Yet another embodiment is directed to the above chuck apparatus, wherein each of the first vacuum inlets operates independently of each of the second vacuum inlets.

[0185] Yet another embodiment is directed to the above chuck apparatus, wherein the first section has a size suitable for supporting multiple bonded wafer diameters.

[0186] Yet another embodiment is directed to the chuck apparatus described above, wherein the one or more regions include a different portion than the first vacuum inlet.

[0187] Yet another embodiment is directed to the chuck apparatus described above, wherein the first vacuum inlet is configured to apply suction to a surface of the article to inhibit warping of the article.

[0188] Yet another embodiment relates to another embodiment of a chuck device for securing an article, comprising: a first section configured to support the article; a second section configured to create a circumferential ring around the perimeter of the article; and one or more vacuum inlets disposed in the annular ring configured to provide suction along the perimeter of the article.

[0189] Yet another embodiment is directed to the above-described chuck apparatus for securing an article, wherein the suction along the perimeter of the article inhibits couplant from entering into an edge portion of the article or underneath the article.

[0190] Yet another embodiment is directed to the chuck apparatus for securing an article described above, wherein the second section includes a structural ring member having a cavity therein.

[0191] Yet another embodiment is directed to the chuck apparatus for securing an article as described above, wherein a suction force of the one or more vacuum inlets exceeds a wicking force of the couplant on the article.

[0192] Yet another embodiment relates to the above-described chuck apparatus for securing an article, wherein a suction force of the one or more vacuum inlets inhibits the coupling agent from entering an edge surface of the article.

[0193] Another embodiment is directed to a method of utilizing a chuck, the method comprising: positioning an article on a first surface of the chuck; utilizing one or more first vacuum inlets to draw at least a first portion of the article on the first surface of the chuck; utilizing one or more second vacuum inlets to draw at least a second portion of the article on at least a portion of an annular ring of the chuck; depositing a coupling agent on at least a portion of an upper surface of the article; and drawing at least a portion of the coupling agent from an edge portion of the article using the one or more second vacuum inlets.

[0194] The above method of using a chuck, wherein the first portion of the object is a flat surface, and wherein the second portion of the object is an annular surface.

[0195] The method of using a chuck further includes: independently operating the first vacuum inlet and the second vacuum inlet.

[0196] The above method of using a chuck further includes: providing a portion of the first surface of the chuck, wherein the portion provides an area different from the suction area.

[0197] In the above method of using a chuck, the object is a wafer.

[0198] The above method using a chuck, wherein the second vacuum inlet provides a suction force that exceeds the wicking force.

[0199] The above-mentioned systems, devices, methods, processes, etc. can be implemented in hardware, software, or any combination of these suitable for a specific application. Hardware can include general-purpose computers and / or special computing devices. This includes implementation in one or more microprocessors, microcontrollers, embedded microcontrollers, programmable digital signal processors, or other programmable devices or processing circuits together with internal and / or external memory. This can also or alternatively include one or more application-specific integrated circuits, programmable gate arrays, programmable array logic components, or any other one or more devices that can be configured to process electronic signals. It will also be understood that the implementation of the above-mentioned process or device can include using a structured programming language such as C, an object-oriented programming language such as C++, or any other high-level or low-level programming language (including assembly language, hardware description language, and database programming language and technology) that can be stored, compiled, or interpreted to run on one of the above devices and processors, heterogeneous combinations of processor architectures, or combinations of different hardware and software. Computer executable code created. In another embodiment, the method can be implemented in a system that performs its steps, and can be distributed on the device in a variety of ways. At the same time, processing can be distributed on devices such as the various systems described above, or all functions can be integrated into dedicated stand-alone devices or other hardware. In another embodiment, the means for performing the steps associated with the above process may include any of the above hardware and / or software. All such permutations and combinations are intended to fall within the scope of the present disclosure.

[0200] Although the present disclosure allows for many different forms of embodiments, specific embodiments are shown in the drawings and described in detail, it should be understood that the present disclosure should be considered as an example of the principles and is not intended to be limited to the specific embodiments shown and described. In the specification, the same reference numerals may be used to describe the same, similar or corresponding parts in several views of the drawings.

[0201] In this document, relational terms such as first and second, top and bottom, etc. may be used only to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions. The term "include" and its tense derivatives, "comprise" and its tense derivatives, "have" and its tense derivatives, or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device including a series of elements includes not only those elements, but may also include other elements that are not explicitly listed or inherent to such a process, method, article, or device. An element preceded by "includes..." does not exclude the presence of additional identical elements in the process, method, article, or device including the element without more constraints.

[0202] References throughout this document to "one embodiment," "certain embodiments," "embodiments," "implementation(s)," "aspect(s)," or similar terms mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of these phrases in various places in this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments without limitation.

[0203] The term "or" as used herein should be interpreted as inclusive or meaning any one or any combination. Thus, "A, B or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition occur only when the combination of elements, functions, steps or actions are inherently mutually exclusive in some way. Moreover, grammatical conjunctions are intended to express any and all disjunctive and conjunctive combinations of the connected clauses, sentences, words, etc., unless otherwise specified or clear from the context. Therefore, the term "or" should generally be understood to mean "and / or" and the like.

[0204] All documents mentioned herein are hereby incorporated by reference in their entirety. Unless expressly stated otherwise or clear from the context, references to items in the singular should be understood to include items in the plural and vice versa.

[0205] Unless otherwise stated, the description of numerical ranges herein is not intended to be restrictive, but refers to any and all values ​​falling within the range individually, and each individual value in such a range is incorporated into the specification as if it were individually described herein. When accompanied by numerical values, words "about", "roughly", etc. should be interpreted as indicating deviations that will be understood by those of ordinary skill in the art, so as to operate satisfactorily for the intended purpose. The range of values ​​and / or numerical values ​​provided herein is only as an example, and does not constitute a limitation on the scope of the embodiments. The use of any and all examples or exemplary language ("for example", "such as", etc.) provided herein is only intended to better illustrate the embodiments, without imposing limitations on the scope of the embodiments. The language in the specification should not be interpreted as indicating that any unclaimed element is necessary for the implementation of the embodiments.

[0206] For simplicity and clarity of illustration, reference numerals may be repeated in the figures to indicate corresponding or similar elements. Many details are set forth to provide an understanding of the embodiments described herein. The embodiments may be implemented without these details. In other cases, well-known methods, processes, and components are not described in detail to avoid obscuring the described embodiments. This description should not be considered as a limitation on the scope of the embodiments described herein.

[0207] In the following description, it should be understood that terms such as "first", "second", "top", "bottom", "up", "down", "above", "below", etc. are words of convenience and should not be construed as limiting terms.

[0208] It will be appreciated that the apparatus, systems, and methods described above are set forth by way of example and not limitation. In the absence of explicit indications to the contrary, the disclosed steps may be modified, supplemented, omitted, and / or reordered without departing from the scope of the present disclosure. Many variations, additions, omissions, and other modifications will be apparent to one of ordinary skill in the art. Additionally, the order or presentation of the method steps in the above description and accompanying drawings is not intended to require such an order in which the recited steps are performed, unless a particular order is expressly required or is clear from the context.

[0209] The method steps of the embodiments described herein are intended to include any suitable method for performing such method steps consistent with the patentability of the attached claims, unless a different meaning is explicitly provided or a different meaning is clearly seen from the context. Thus, for example, performing step X includes any suitable method for causing another party (e.g., a remote user, a remote processing resource (e.g., a server or cloud computer) or a machine) to perform step X. Similarly, performing steps X, Y, and Z may include any method for directing or controlling any combination of such other individuals or resources to perform steps X, Y, and Z to obtain the benefits of such steps. Therefore, unless a different meaning is explicitly provided or a different meaning is clearly understood from the context, the method steps of the embodiments described herein are intended to include any suitable method for causing one or more other parties or entities to perform these steps consistent with the patentability of the attached claims. Such parties or entities do not need to be under the guidance or control of any other parties or entities, and do not need to be located within a specific jurisdiction.

[0210] It should also be understood that the above methods are provided as examples. In the absence of explicit contrary indications, the disclosed steps may be modified, supplemented, omitted and / or reordered without departing from the scope of the present disclosure.

[0211] It should be understood that the above-described methods and systems are described by way of example and not limitation. Many variations, additions, omissions, and other modifications will be apparent to those of ordinary skill in the art. In addition, unless a particular order is expressly required or is clear from the context, the order or presentation of the method steps in the above description and accompanying drawings is not intended to require such order in which the described steps are performed. Therefore, although specific embodiments have been shown and described, it will be apparent to those skilled in the art that various changes and modifications may be made in form and detail without departing from the scope of the present disclosure, and such changes and modifications are intended to form a part of the present disclosure as defined by the appended claims, which will be interpreted in the broadest sense permitted by law.

[0212] Various representative embodiments described in detail herein have been presented by way of example and not limitation. Those skilled in the art will appreciate that various changes may be made in the form and details of the described embodiments to yield equivalent embodiments that remain within the scope of the appended claims.

Claims

1. A device comprising: a first section configured to support at least a portion of an article; one or more first vacuum inlets disposed in one or more regions of the first section; a second section configured to create an annular ring around the perimeter of the article; as well as One or more second vacuum inlets disposed in the annular ring are configured to provide suction along the perimeter of the article.

2. The device according to claim 1, wherein: The first section includes two or more regions, each region of the first section having one or more associated first vacuum inlets of the one or more first vacuum inlets.

3. The device of claim 1, wherein: The second section includes a structural ring member having a cavity therein.

4. The device of claim 1, wherein: The suction force of the one or more second vacuum inlets exceeds the wicking force of the couplant on the article.

5. The apparatus of claim 1, further comprising one or more vacuum generators configured to control an operational state of one or more of the one or more second vacuum inlets.

6. The apparatus of claim 1, further comprising one or more vacuum generators configured to control an operational state of one or more of the one or more first vacuum inlets.

7. The device of claim 1, wherein: Each of the first vacuum inlets operates independently of each of the second vacuum inlets.

8. The device of claim 1, wherein: The first section has dimensions suitable for supporting multiple bonded wafer diameters.

9. The device of claim 1, wherein: The one or more regions include a portion different from the first vacuum inlet.

10. The device of claim 1, wherein: The first vacuum inlet is configured to apply suction to a surface of the article to inhibit warping of the article.

11. A device comprising: a first section configured to support an article; a second section configured to create a perimeter ring around the perimeter of the article; as well as One or more vacuum inlets disposed in the annular ring are configured to provide suction along the perimeter of the article.

12. The device of claim 11, wherein: The suction along the perimeter of the article inhibits couplant from entering into edge portions of the article or underneath the article.

13. The device of claim 11, wherein: The second section includes a structural ring member having a cavity therein.

14. The device of claim 11, wherein: The suction force of the one or more vacuum inlets exceeds the wicking force of the couplant on the article.

15. The apparatus of claim 11, wherein: The suction force of the one or more vacuum inlets inhibits the couplant from entering the edge surface of the article.

16. A method comprising: positioning an article on a first surface of the chuck; suctioning at least a first portion of the article on the first surface of the chuck using one or more first vacuum inlets; suctioning at least a second portion of the article on at least a portion of the annular ring of the chuck using one or more second vacuum inlets; depositing a coupling agent on at least a portion of the upper surface of the article; as well as At least a portion of the couplant is drawn from an edge portion of the article using the one or more second vacuum inlets.

17. The method of claim 16, wherein: The first portion of the article is a planar surface, and wherein the second portion of the article is an annular surface.

18. The method of claim 16, further comprising: The first vacuum inlet and the second vacuum inlet are operated independently.

19. The method of claim 16, further comprising: A portion of the first surface of the chuck is provided, the portion providing an area different from the suction area.

20. The method of claim 16, wherein: The object is a wafer.

21. The method of claim 16, wherein: The second vacuum inlet provides a suction force that exceeds the wicking force.

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