High-isolation electromagnetic shielding device for probe station test system

Abstract

The invention discloses a high-isolation electromagnetic shielding device for a probe station test system, which relates to the technical field of probe station test systems and comprises a shielding cover arranged on a probe station. A mounting seat is arranged in the shielding case, and a probe for testing a wafer is arranged on the mounting seat; a position adjusting mechanism for adjusting the position of the probe is arranged between the shielding case and the mounting seat; the position adjusting mechanism comprises a front-back adjusting mechanism which is arranged between the shielding cover and the mounting seat; the front-back adjusting mechanism is used for adjusting the probe front and back; an up-down adjusting mechanism and a rotation adjusting mechanism. According to the invention, the position adjusting mechanism and the probe are arranged in the shielding cover, so that the shielding cover integrally forms a relatively sealed structure without influencing the position adjustment of the probe, the electromagnetic shielding degree can be effectively improved, the accuracy of the probe result of the wafer probe test is improved, and the test efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of probe station testing systems, and in particular to a high-isolation electromagnetic shielding device for a probe station testing system. Background Art

[0002] Wafer on-wafer testing is a test method that must be adopted in the semiconductor manufacturing industry. The probe station test system is one of the important equipment for semiconductor device testing, mainly used for wafer-level testing. This system allows users to test the electrical performance of a single bare chip directly on the wafer without packaging it into a finished product first. This is crucial for early detection of problems, improving yields, and optimizing production processes.

[0003] In the prior art, since the test signal is easily interfered by the external wireless electromagnetic signal and thus causes deviation in the test result, in order to further improve the accuracy of the test result, it is necessary to install a shielding mechanism on the probe station during the test.

[0004] However, the above-mentioned probe station shielding mechanism still has the following defects during use:

[0005] In the process of using probes to test wafers, in order to adjust the position of the probes to accurately test different points, it is usually necessary to leave a certain gap between the shielding cover of the probe station and the probe testing equipment; although this design provides the necessary avoidance space for the movement of the probes, it also destroys the complete closed state of the shielding cover, thereby reducing the electromagnetic sealing performance of the system and ultimately affecting the overall shielding effect. Summary of the invention

[0006] In order to overcome the above technical problems, the purpose of the present invention is to provide a high-isolation electromagnetic shielding device for a probe station test system, which is used to solve the problem proposed in the above background technology that the gaps set on the existing shielding cover to provide avoidance space for the probe test position affect the electromagnetic shielding effect.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] A high-isolation electromagnetic shielding device for a probe station test system, comprising a shielding cover arranged on the probe station; a mounting seat is arranged inside the shielding cover, and a probe for testing a wafer is arranged on the mounting seat; a position adjustment mechanism for adjusting the position of the probe is arranged between the shielding cover and the mounting seat; the position adjustment mechanism comprises:

[0009] A front-to-back adjustment mechanism, the front-to-back adjustment mechanism is arranged between the shielding cover and the mounting seat; the front-to-back adjustment mechanism is used to adjust the probe front-to-back;

[0010] An up-down adjustment mechanism, which is arranged on the mounting seat; the up-down adjustment mechanism is used to adjust the probe up-down;

[0011] And a rotation adjustment mechanism, which is arranged on the probe station and is used to drive the wafer to rotate along its center so as to adjust the position between the probe and the test point on the wafer.

[0012] Preferably, the front-rear adjustment mechanism comprises a first mounting plate and an external threaded sleeve; the first mounting plate is mounted on the inner wall of the shielding cover, the external threaded sleeve is threadedly connected to the first mounting plate, one end of the external threaded sleeve is rotatably connected to the mounting seat along its axis, and the other end of the external threaded sleeve extends to the outside of the shielding cover;

[0013] A first telescopic rod is arranged between the first mounting plate and the mounting seat, and a first compression spring is arranged on the first telescopic rod.

[0014] Preferably, the up and down adjustment mechanism includes a mounting block, a threaded rod, a first guide mechanism and a plurality of ball bearings; the mounting block is slidably connected to the mounting seat, the threaded rod is coaxially threadedly inserted into the external threaded sleeve, a first guide hole is provided on the mounting block, one end of the threaded rod is inserted into the first guide hole, a second guide hole is provided on the mounting seat, and the first guide hole is connected to the second guide hole, a plurality of the ball bearings are arranged in the first guide hole and the second guide hole, and adjacent ball bearings are in conflict with each other; the first guide mechanism is arranged between the mounting block and the mounting seat, and the first guide mechanism is used to provide guidance for the movement of the ball bearings when the mounting block is away from the mounting seat.

[0015] Preferably, the first guide mechanism comprises a second compression spring and at least three second telescopic rods; the second telescopic rods are arranged between the mounting block and the mounting seat, and the at least three second telescopic rods are arranged at equal intervals along the circumference of the axis of the second guide hole;

[0016] A groove is arranged on the side wall of the second telescopic rod; when the second telescopic rod contacts the ball, the groove is matched with the ball.

[0017] Preferably, a slide rail is provided on the mounting seat, and the direction of the slide rail is parallel to the up and down movement direction of the mounting seat; a third telescopic rod is provided on the first mounting plate, and the output end of the third telescopic rod is connected to the slide rail.

[0018] Preferably, the rotation adjustment mechanism includes a carrier plate and a motor; the carrier plate is rotatably connected to the probe station along its axis, the carrier plate is arranged inside the shielding cover, and the wafer is placed on the carrier plate, the probe station is installed with a motor, and the output end of the motor is coaxially connected to the carrier plate.

[0019] Preferably, a through hole is formed at the top of the shielding cover; the through hole is used to provide a dislocation space for microscope observation.

[0020] Preferably, a first shielding mechanism is provided on the shielding cover, and the first shielding mechanism is used to shield the through hole; while the first shielding mechanism maintains the electromagnetic shielding state unchanged, a microscope is allowed to extend through the through hole into the shielding cover to observe the wafer testing state.

[0021] Preferably, the first shielding mechanism includes a metal filter and a tension control mechanism, the metal filter is a flexible structure, and the tension control mechanism is arranged between the metal filter and the shielding cover; when the microscope moves upward and separates from the metal filter, the tension control mechanism is used to drive the metal filter to restore its state.

[0022] Preferably, the tension control mechanism comprises a plurality of rotating blocks and connecting ropes; the plurality of rotating blocks are rotatably connected to the shielding cover, each of the connecting ropes is spirally wound around the rotating block, and both ends of the connecting ropes are connected to the metal filter; a torsion spring is provided between the shielding cover and each of the rotating blocks; when the microscope is separated from the metal filter, the torsion spring is used to drive the metal filter to automatically reset;

[0023] A second mounting plate is arranged on the rotating block, and a guide wheel is rotatably connected between the rotating block and the shielding cover; the guide wheel is used to provide guidance for the movement of the connecting rope.

[0024] Beneficial effects of the present invention:

[0025] 1. By arranging the position adjustment mechanism and the probe inside the shielding cover, the shielding cover as a whole forms a relatively sealed structure without affecting the position adjustment of the probe, which can effectively improve the electromagnetic shielding degree, improve the accuracy of the wafer probe test probe results, and improve the test efficiency;

[0026] 2. By setting the front and back adjustment mechanism, the up and down adjustment mechanism and the rotation adjustment mechanism, the position of the probe is adjusted, so that the position of the probe can be adjusted by rotating the external threaded sleeve and the threaded rod exposed on the outside of the shielding cover, so that the electromagnetic shielding effect of the shielding cover is improved without affecting the adjustment of the probe position;

[0027] 3. By setting up the first shielding mechanism, an isolation structure for the through hole on the shielding cover is formed, so that the overall electromagnetic shielding effect of the shielding cover is further improved without affecting the microscope's observation of the wafer to be tested position, thereby improving the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be further described below in conjunction with the accompanying drawings.

[0029] Figure 1It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the overall partially cutaway three-dimensional structure of the present invention;

[0031] Figure 3 It is a schematic diagram of a three-dimensional enlarged structure of the mounting seat of the present invention;

[0032] Figure 4 It is a partially cutaway three-dimensional enlarged structural schematic diagram of the position adjustment mechanism of the present invention;

[0033] Figure 5 It is a partially cutaway three-dimensional enlarged structural schematic diagram of the position adjustment mechanism of the present invention;

[0034] Figure 6 It is a three-dimensional enlarged structural diagram of the front and rear adjustment mechanism distribution structure of the present invention;

[0035] Figure 7 It is a three-dimensional enlarged structural schematic diagram of the first mounting plate of the present invention;

[0036] Figure 8 It is a three-dimensional enlarged structural schematic diagram of the first shielding mechanism of the present invention;

[0037] Fig. 9 It is a three-dimensional enlarged structural schematic diagram of the first shielding mechanism of the present invention after a part of the second mounting plate is removed.

[0038] In the figure: 1. probe station; 2. shielding cover; 3. mounting seat; 4. probe; 5. position adjustment mechanism; 51. front and rear adjustment mechanism; 511. first mounting plate; 512. external threaded sleeve; 513. first telescopic rod; 514. first compression spring; 52. up and down adjustment mechanism; 521. mounting block; 522. threaded rod; 523. first guide hole; 524. second guide hole; 525. ball bearing; 526. second telescopic rod; 527. second compression spring; 528. slide rail; 529. third telescopic rod; 53. rotation adjustment mechanism; 531. loading plate; 532. motor; 6. through hole; 7. first shielding mechanism; 71. metal filter; 72. tension control mechanism; 721. second mounting plate; 722. rotating block; 723. connecting rope; 724. guide wheel. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] like Figure 1-9 As shown, a high isolation electromagnetic shielding device for a probe station test system, such as Figure 1-3 As shown, it includes a shielding cover 2 arranged on a probe station 1; a mounting seat 3 is arranged in the shielding cover 2, and a probe 4 for testing a wafer is arranged on the mounting seat 3; a position adjustment mechanism 5 for adjusting the position of the probe 4 is arranged between the shielding cover 2 and the mounting seat 3; the position adjustment mechanism 5 includes: a front-to-back adjustment mechanism 51, the front-to-back adjustment mechanism 51 is arranged between the shielding cover 2 and the mounting seat 3; the front-to-back adjustment mechanism 51 is used to adjust the probe 4 front-to-back; an up-and-down adjustment mechanism 52, the up-and-down adjustment mechanism 52 is arranged on the mounting seat 3; the up-and-down adjustment mechanism 52 is used to adjust the probe 4 up and down; and a rotation adjustment mechanism 53, the rotation adjustment mechanism 53 is arranged on the probe station 1, and the rotation adjustment mechanism 53 is used to drive the wafer to rotate along its center of a circle to adjust the position between the probe 4 and the test point on the wafer.

[0041] It should be noted that, by arranging the position adjustment mechanism 5 for adjusting the position of the probe 4 inside the shielding cover 2, the gap on the shielding cover 2 is reduced without affecting the position adjustment of the probe 4, so that the shielding cover 2 forms a relatively sealed structure as a whole, which can effectively improve the electromagnetic shielding degree, improve the accuracy of the wafer probe test probe result, and improve the test efficiency;

[0042] During specific use, first place the wafer on the probe station 1, and then cover the shielding cover 2 on the wafer. Signal connectors are provided on both sides of the shielding cover 2, and the test probe 4 is connected to the external test instrument through the signal connector; it can be understood that the test instrument is a prior art, which is not drawn in the figure and will not be described in detail; at this time, the shielding cover 2 is tightly connected to the probe station 1 and electrically connected at the same time; then the front and rear positions of the probe 4 are adjusted by the front and rear adjustment mechanism 51, and the wafer is driven to rotate and adjust the position by the rotation adjustment mechanism 53. When the probe 4 and the wafer test position are aligned up and down, the up and down adjustment mechanism 52 is used to make the probe 4 and the contacts of the wafer to be tested in good contact with each other, and the wafer electrical test is performed.

[0043] like Figure 3-5 As shown, the front-rear adjustment mechanism 51 includes a first mounting plate 511 and an external threaded sleeve 512; the first mounting plate 511 is installed on the inner wall of the shielding cover 2, the external threaded sleeve 512 is threadedly connected to the first mounting plate 511, one end of the external threaded sleeve 512 is rotatably connected to the mounting seat 3 along its axis, and the other end of the external threaded sleeve 512 extends to the outside of the shielding cover 2; a first telescopic rod 513 is arranged between the first mounting plate 511 and the mounting seat 3, and a first compression spring 514 is arranged on the first telescopic rod 513.

[0044] It should be noted that when it is necessary to push the probe 4 to move forward and backward to adjust the position of the probe 4, the external threaded sleeve 512 is rotated to drive the external threaded sleeve 512 to move along its axis, and then under the guidance of the first telescopic rod 513, the mounting seat 3 and the first mounting plate 511 are driven to move closer or farther away, thereby achieving the purpose of adjusting the front and rear position of the probe 4 on the mounting seat 3; in the process of movement of the external threaded sleeve 512, the first compression spring 514 is used in cooperation to achieve a moving pulling force or pressure between the first mounting plate 511 and the external threaded sleeve 512, thereby improving the tightness of the threaded connection between the first mounting plate 511 and the external threaded sleeve 512, thereby improving the adjustment accuracy.

[0045] like Figure 3-6 As shown, the up and down adjustment mechanism 52 includes a mounting block 521, a threaded rod 522, a first guide mechanism and a plurality of balls 525; the mounting block 521 is slidably connected to the mounting seat 3, the threaded rod 522 is coaxially threadedly inserted into the external threaded sleeve 512, a first guide hole 523 is provided on the mounting block 521, one end of the threaded rod 522 is inserted into the first guide hole 523, a second guide hole 524 is provided on the mounting seat 3, and the first guide hole 523 is connected to the second guide hole 524, a plurality of balls 525 are arranged in the first guide hole 523 and the second guide hole 524, and adjacent balls 525 are in conflict with each other; the first guide mechanism is arranged between the mounting block 521 and the mounting seat 3, and the first guide mechanism is used to provide guidance for the movement of the balls 525 when the mounting block 521 is away from the mounting seat 3.

[0046] It should be noted that when it is necessary to drive the mounting seat 3 to rise and fall to adjust the vertical distance between the probe 4 and the wafer, at this time, by rotating the threaded rod 522, the threaded rod 522 is driven to move inward or outward of the external threaded sleeve 512, thereby driving the ball 525 to move, and under the cooperation of the first guide hole 523, the second guide hole 524 and the plurality of balls 525, the force direction is changed, and then under the guidance of the first guide mechanism, the mounting seat 3 is driven to rise and fall, so as to achieve the purpose of adjusting the vertical distance between the probe 4 and the wafer; it can be understood that the first guide hole 523 is an L-shaped circular hole structure, and the L-shaped structure The bending part is an arc-shaped structure, and the aperture of the L-shaped circular hole structure is the same as the diameter of the ball 525, so that the ball 525 can only move radially along the first guide hole 523; and the second guide hole 524 is a vertical hole structure with the same aperture as the first guide hole 523. When the top of the mounting block 521 is in close contact with the mounting seat 3, the first guide hole 523 and the second guide hole 524 are fully adapted and connected; when the mounting seat 3 is away from the mounting block 521, the first guide structure provides guidance for the lifting and lowering of the mounting seat 3, and limits the movable direction of the ball 525, thereby ensuring the stability of driving the mounting seat 3 to move up and down.

[0047] like Figure 3-7As shown, the first guide mechanism includes a second compression spring 527 and at least three second telescopic rods 526; the second telescopic rods 526 are arranged between the mounting block 521 and the mounting seat 3, and at least three second telescopic rods 526 are arranged at equal intervals along the circumference of the axis of the second guide hole 524; a groove is arranged on the side wall of the second telescopic rod 526; when the second telescopic rod 526 conflicts with the ball 525, the groove is matched with the ball 525; a slide rail 528 is arranged on the mounting seat 3, and the direction of the slide rail 528 is parallel to the up and down movement direction of the mounting seat 3; a third telescopic rod 529 is arranged on the first mounting plate 511, and the output end of the third telescopic rod 529 is connected to the slide rail 528.

[0048] It should be noted that when the mounting seat 3 and the mounting block 521 are away from each other, the thrust of the ball 525 between the mounting seat 3 and the mounting block 521 causes the second telescopic rod 526 to be stretched under force, and at this time, the second compression spring 527 is stretched under force, and the ball 525 between the second telescopic rod 526 is guided and restricted by the groove, and the stretched second compression spring 527 forms a reverse pressure on the ball 525, thereby ensuring good contact between the multiple balls 525 and ensuring the stability of the up and down movement of the mounting seat 3; in the process of the up and down movement of the mounting seat 3, through the arrangement of the slide rail 528 and the third telescopic rod 529, the stability of the up and down movement of the mounting seat 3 is further improved without affecting the driving of the mounting seat 3 to move forward and backward.

[0049] like Figure 1-2 As shown, it can be understood that the present application does not limit the specific structure and installation method of the rotation adjustment mechanism 53, and only a feasible specific scheme is provided below; the rotation adjustment mechanism 53 includes a carrier plate 531 and a motor 532; the carrier plate 531 is rotatably connected to the probe station 1 along its axis, the carrier plate 531 is arranged inside the shielding cover 2, and the wafer is placed on the carrier plate 531, and a motor 532 is installed on the probe station 1, and the output end of the motor 532 is coaxially connected to the carrier plate 531.

[0050] It should be noted that the motor 532 drives the carrier plate 531 to rotate, thereby driving the wafer on the carrier plate 531 to rotate along its center, that is, when the front and rear positions of the probe 4 are adjusted by the front and rear adjustment mechanism 51 so that the end of the probe 4 and the contact point position of the wafer under test are on the same circumference, the wafer is driven to rotate by the carrier plate 531 so that the contact point position of the wafer under test is aligned with the probe 4, and then the probe 4 is driven down by the up and down adjustment mechanism 52 so that the probe 4 and the contact point position of the wafer under test are in good contact for testing.

[0051] like Figure 1-2As shown, a through hole 6 is opened at the top of the shielding cover 2; the through hole 6 is used to provide a dislocation space for microscope observation; a first shielding mechanism 7 is provided on the shielding cover 2, and the first shielding mechanism 7 is used to shield the through hole 6; when the first shielding mechanism 7 keeps the electromagnetic shielding state unchanged, the microscope is allowed to pass through the through hole 6 and extend into the shielding cover 2 to observe the wafer testing state.

[0052] It should be noted that, since microscopic observation is required during the wafer testing process, a through hole 6 needs to be opened on the top of the shielding cover 2. Since the setting of the through hole 6 will affect the overall electromagnetic shielding effect of the shielding cover 2, a first shielding mechanism 7 is provided to ensure the overall electromagnetic shielding effect of the shielding cover 2 while not affecting the microscope passing through the through hole 6 to enter the shielding cover 2 for observation. It can be understood that the microscope is a prior art technology and is not shown in the figure and will not be described in detail.

[0053] like Figure 1-2 and Figure 8 As shown, the first shielding mechanism 7 includes a metal filter 71 and a tension control mechanism 72. The metal filter 71 is a flexible structure, and the tension control mechanism 72 is arranged between the metal filter 71 and the shielding cover 2; when the microscope moves upward and separates from the metal filter 71, the tension control mechanism 72 is used to drive the metal filter 71 to return to its original state; it can be understood that the metal filter 71 always maintains good electrical contact with the shielding cover 2.

[0054] It should be noted that, by arranging a movable metal filter 71 structure on the through hole 6, when the microscope is extended into the through hole 6, the lens part of the microscope pushes the metal filter 71 to move, so that with the cooperation of the through hole 6, the metal filter 71 is squeezed to form a structure similar to an inverted conical road cone. At this time, the aperture of the metal filter 71 does not change, and the metal filter 71 cooperates with the shielding cover 2 to form an internal and external isolation structure to improve the overall electromagnetic shielding effect; and after completing the wafer test, when the microscope is moved away from the metal filter 71, the tension control mechanism 72 can drive the metal filter 71 to automatically reset to a flat state.

[0055] like Figure 8-9 As shown, the tension control mechanism 72 includes a plurality of rotating blocks 722 and a connecting rope 723; the plurality of rotating blocks 722 are rotatably connected to the shielding cover 2, each connecting rope 723 is spirally wound around the rotating block 722, and both ends of the connecting rope 723 are connected to the metal filter 71; a torsion spring is arranged between the shielding cover 2 and each rotating block 722; when the microscope is separated from the metal filter 71, the torsion spring is used to drive the metal filter 71 to automatically reset; a second mounting plate 721 is arranged on the rotating block 722, and a guide wheel 724 is rotatably connected between the rotating block 722 and the shielding cover 2; the guide wheel 724 is used to provide guidance for the movement of the connecting rope 723.

[0056] It should be noted that when the microscope pushes the metal filter 71 to deform, the multiple connecting ropes 723 on the circumference of the metal filter 71 are forced to move with the cooperation of the guide wheel 724, allowing the metal filter 71 to deform to adapt to the shape of the microscope lens, and at this time the torsion spring is compressed; during the movement of the connecting rope 723, since the multiple connecting ropes 723 are arranged at equal intervals on the circumference of the metal filter 71, the force on the circumference of the metal filter 71 is uniform, which can reduce the wrinkling phenomenon at the contact position between the metal filter 71 and the microscope lens, and reduce the impact on microscope observation; when the test is completed, when the microscope is separated from the metal filter 71, the connecting rope 723 is reset by the torsion spring, that is, the metal filter 71 is pulled to restore to a flat state; it can be understood that since the position of the wafer to be tested is smaller than the filter hole diameter of the metal filter 71, the microscope observes the position of the wafer to be tested, and the setting of the metal filter 71 does not affect the normal observation and use of the microscope.

[0057] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction and a specific direction structure and operation, and therefore, cannot be understood as a limitation on the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0058] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A high-isolation electromagnetic shielding device for a probe station test system, comprising a shielding cover (2) arranged on a probe station (1); characterized in that: A mounting seat (3) is arranged inside the shielding cover (2), and a probe (4) for testing a wafer is arranged on the mounting seat (3); a position adjustment mechanism (5) is arranged between the shielding cover (2) and the mounting seat (3); the position adjustment mechanism (5) comprises: A front-to-back adjustment mechanism (51), the front-to-back adjustment mechanism (51) being arranged between the shielding cover (2) and the mounting seat (3); the front-to-back adjustment mechanism (51) being used for adjusting the probe (4) front-to-back; An up-down adjustment mechanism (52), the up-down adjustment mechanism (52) being arranged on the mounting seat (3); the up-down adjustment mechanism (52) being used for adjusting the probe (4) up-down; And a rotation adjustment mechanism (53), wherein the rotation adjustment mechanism (53) is arranged on the probe platform (1), and the rotation adjustment mechanism (53) is used to drive the wafer to rotate along its center so as to adjust the position between the probe (4) and the test point on the wafer.

2. A high isolation electromagnetic shielding device for a probe station test system according to claim 1, characterized in that: The front-rear adjustment mechanism (51) comprises a first mounting plate (511) and an externally threaded sleeve (512); the first mounting plate (511) is mounted on the inner wall of the shielding cover (2); the externally threaded sleeve (512) is threadedly connected to the first mounting plate (511); one end of the externally threaded sleeve (512) is rotatably connected to the mounting seat (3) along its axis; and the other end of the externally threaded sleeve (512) extends to the outside of the shielding cover (2); A first telescopic rod (513) is arranged between the first mounting plate (511) and the mounting seat (3), and a first compression spring (514) is arranged on the first telescopic rod (513).

3. A high isolation electromagnetic shielding device for a probe station test system according to claim 2, characterized in that: The up-and-down adjustment mechanism (52) comprises a mounting block (521), a threaded rod (522), a first guide mechanism and a plurality of balls (525); the mounting block (521) is slidably connected to the mounting seat (3); the threaded rod (522) is coaxially threadedly plugged into the external threaded sleeve (512); a first guide hole (523) is provided on the mounting block (521); one end of the threaded rod (522) is plugged into the first guide hole (523); a second guide hole (523) is provided on the mounting seat (3); The first guide hole (523) is connected to the second guide hole (524), and the plurality of balls (525) are arranged in the first guide hole (523) and the second guide hole (524), and adjacent balls (525) are in contact with each other; the first guide mechanism is arranged between the mounting block (521) and the mounting seat (3), and the first guide mechanism is used to provide guidance for the movement of the balls (525) when the mounting block (521) and the mounting seat (3) are away from each other.

4. A high isolation electromagnetic shielding device for a probe station test system according to claim 3, characterized in that: The first guide mechanism comprises a second compression spring (527) and at least three second telescopic rods (526); the second telescopic rods (526) are arranged between the mounting block (521) and the mounting seat (3), and the at least three second telescopic rods (526) are arranged at equal intervals along the circumference of the axis of the second guide hole (524); A groove is provided on the side wall of the second telescopic rod (526); when the second telescopic rod (526) contacts the ball (525), the groove is matched with the ball (525).

5. A high isolation electromagnetic shielding device for a probe station test system according to claim 4, characterized in that: The mounting seat (3) is provided with a slide rail (528), the direction of the slide rail (528) being parallel to the up and down movement direction of the mounting seat (3); the first mounting plate (511) is provided with a third telescopic rod (529), the output end of the third telescopic rod (529) being connected to the slide rail (528).

6. A high isolation electromagnetic shielding device for a probe station test system according to claim 1, characterized in that: The rotation adjustment mechanism (53) comprises a carrier plate (531) and a motor (532); the carrier plate (531) is rotatably connected to the probe platform (1) along its axis, the carrier plate (531) is arranged inside the shielding cover (2), and the wafer is placed on the carrier plate (531); the motor (532) is installed on the probe platform (1), and the output end of the motor (532) is coaxially connected to the carrier plate (531).

7. A high isolation electromagnetic shielding device for a probe station test system according to claim 1, characterized in that: A through hole (6) is provided at the top of the shielding cover (2); the through hole (6) is used to provide a dislocation space for microscope observation.

8. A high isolation electromagnetic shielding device for a probe station test system according to claim 7, characterized in that: The shielding cover (2) is provided with a first shielding mechanism (7), which is used to shield the through hole (6); when the first shielding mechanism (7) keeps the battery shielding state unchanged, a microscope is allowed to pass through the through hole (6) and extend into the shielding cover (2) to observe the wafer test state.

9. A high isolation electromagnetic shielding device for a probe station test system according to claim 8, characterized in that: The first shielding mechanism (7) comprises a metal filter (71) and a tension control mechanism (72); the metal filter (71) is a flexible structure; the tension control mechanism (72) is arranged between the metal filter (71) and the shielding cover (2); when the microscope moves upward and separates from the metal filter (71), the tension control mechanism (72) is used to drive the metal filter (71) to return to a state.

10. A high isolation electromagnetic shielding device for a probe station test system according to claim 9, characterized in that: The tension control mechanism (72) comprises a plurality of rotating blocks (722) and a connecting rope (723); the plurality of rotating blocks (722) are rotatably connected to the shielding cover (2), each of the connecting ropes (723) is spirally wound around the rotating block (722), and both ends of the connecting rope (723) are connected to the metal filter (71); a torsion spring is provided between the shielding cover (2) and each of the rotating blocks (722); when the microscope is separated from the metal filter (71), the torsion spring is used to drive the metal filter (71) to automatically reset; A second mounting plate (721) is provided on the rotating block (722), and a guide wheel (724) is rotatably connected between the rotating block (722) and the shielding cover (2); the guide wheel (724) is used to provide guidance for the movement of the connecting rope (723).

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