Memory bank installation positioning device and positioning method

Abstract

The invention belongs to the technical field of memory bank mounting and positioning, and discloses a memory bank mounting and positioning device and method.The memory bank mounting and positioning device comprises a first positioning bin, the middle of the first positioning bin is movably sleeved with a guide rod, and the side, close to the guide rod, of an inner cavity of the first positioning bin is fixedly connected with a clamping spring; a fixing plate is fixedly connected to the sides, close to the center of the first positioning bin, of the clamping springs, a spring assembly is fixedly connected to the top end of an inner cavity of the fixing plate, a lifting plate is fixedly connected to the bottom end of the spring assembly, and an eraser is fixedly connected to the side, close to the center of the first positioning bin, of the lifting plate. And mounting plates are fixedly connected to the left side and the right side of the lifting plate. The tension of the spring assembly drives the eraser to move downwards, so that the oxide layer at the bottom of the memory bank is wiped through the up-down movement of the eraser, the bottom of the memory bank does not need to be wiped by using an external eraser, and the operation is simple and convenient.

Description

Technical Field

[0001] The invention belongs to the technical field of memory bar installation and positioning, and specifically relates to a memory bar installation and positioning device and a positioning method. Background Art

[0002] The memory stick is one of the main hardware components of a computer host. During installation, the memory stick often needs to be inserted into the slot of the motherboard and fixed by a positioning device so that the user can use the computer. However, during long-term use, the part of the memory stick that contacts the motherboard slot will produce oxides. These oxides will cause the motherboard to be unable to store memory data, which will affect the use of the memory stick. Therefore, the user is required to pull out the memory stick and then use an eraser to evenly wipe the bottom of the memory stick. However, since the memory stick is long, it is more troublesome to wipe it, and the user also needs to prepare an eraser extra, which is extremely inconvenient. Summary of the invention

[0003] The object of the present invention is to provide a memory module installation and positioning device and positioning method to solve the problems raised in the above background technology.

[0004] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a memory stick installation and positioning device and a positioning method, comprising a positioning bin one, a guide rod movably sleeved in the middle of the positioning bin one, a clamping spring fixedly connected to a side of an inner cavity of the positioning bin one close to the guide rod, a fixing plate fixedly connected to a side of the clamping spring close to the center of the positioning bin one, a spring assembly fixedly connected to a top end of the inner cavity of the fixing plate, a lifting plate fixedly connected to a side of the lifting plate close to the center of the positioning bin one, an eraser fixedly connected to a side of the lifting plate close to the center of the positioning bin one, mounting plates fixedly connected to the left and right sides of the lifting plate, a movable telescopic rod fixedly connected to a side of the mounting plate close to the center of the positioning bin one, and a lifting ring fixedly connected to the top end of the mounting plate.

[0005] Preferably, a movable plate is provided at the bottom of the inner cavity of the positioning bin, a heat conducting plate is fixedly connected to one side of the movable plate close to the center of the positioning bin, a heat conducting sheet is fixedly connected to one side of the heat conducting plate close to the center of the positioning bin, a heat dissipation plate is fixedly connected to the top of the heat conducting plate, and a heat dissipation sheet is fixedly connected to one side of the heat dissipation plate away from the center of the positioning bin.

[0006] Preferably, the left and right sides of the positioning bin one are fixedly connected with threaded tubes, the inner cavity of the threaded tubes is engaged with a movable threaded rod, the front side of the movable threaded rod is movably sleeved with a fixed bin, the inner cavity of the fixed bin is provided with positioning bin two, positioning bin three, and positioning bin four, the top end of the fixed plate is fixedly connected with a threaded ring, the inner cavity of the threaded ring is engaged with a limiting threaded rod.

[0007] Preferably, damping sleeves are fixedly installed on both the front and rear sides of the positioning bin 1, the guide rod is movably sleeved in the inner cavity of the damping sleeve, and the positioning bin 1 is rectangular.

[0008] Preferably, the spring assembly consists of a damping telescopic rod and a spring, the damping telescopic rod is located at the center of the spring cavity, and the fixing plate and the lifting plate are both L-shaped.

[0009] Preferably, the guide rod, the clamping spring and the damping sleeve are provided in plurality, the movable plate is fixedly connected to the positioning chamber through the guide rod and the clamping spring, and the inner cavity of the heat conducting plate is communicated with the inner cavity of the heat dissipating plate.

[0010] Preferably, there are a plurality of said threaded tubes, which are respectively fixedly connected on the left and right sides of positioning bin one, positioning bin two, positioning bin three and positioning bin four; there are two said movable threaded rods, which are respectively movably connected on the left and right sides of the inner cavity of positioning bin one; said positioning bin one and positioning bin four are meshed with the movable threaded rod on the right side through threaded tubes and movably sleeved on the surface of the movable threaded rod on the left side; said positioning bin two and positioning bin three are meshed with the movable threaded rod on the left side through threaded tubes and movably sleeved on the surface of the movable threaded rod on the right side.

[0011] Preferably, both the front and rear sides of the fixed bin are fixedly connected with a bottom plate, and the inner cavity of the bottom plate is engaged with mounting bolts.

[0012] A positioning method for a memory bar installation positioning device, wherein the memory bar is placed in the middle of an inner cavity of a positioning bin and contacts a heat conducting sheet, and at this time, the tension of a clamping spring drives a moving plate to move to one side of the center of the positioning bin, thereby clamping the memory bar through the heat conducting sheet, and the heat conducting sheet is displaced according to the size of the memory bar, and when most of the memory bar is located at the center of the inner cavity of the positioning bin, a limiting threaded rod is rotated, and the limiting threaded rod is engaged with a threaded ring, so that the limiting threaded rod moves to the center of the positioning bin, and moves to the top of the positioning bin, contacts the top of the memory bar, and presses the memory bar;

[0013] Then, the movable threaded rod is rotated to mesh with the threaded tube, thereby adjusting the distance between the positioning chamber 1 and the positioning chamber 4, and then the movable threaded rod is rotated to drive the distance adjustment between the positioning chamber 2 and the positioning chamber 3, thereby adjusting the positions of the positioning chamber 1, the positioning chamber 2, the positioning chamber 3, and the positioning chamber 4, and then the memory stick is aligned with the motherboard slot, and the positioning chamber 1 is pressed, and multiple memory sticks are pressed into the motherboard slot at the same time, and the mounting bolts are screwed through the bottom plate into the threaded holes of the motherboard to fix the positioning chamber 1;

[0014] Then, during use, the heat generated by the memory module can be transferred to the cooling water in the inner cavity of the heat conducting plate through the heat conducting sheet. The density of hot cooling water is lower than that of cold cooling water, so it can float above the heat conducting plate. The hot cooling water enters the inner cavity of the heat sink, and then the heat of the hot cooling water is transferred to the air through the heat sink. At this time, the wind generated by the cooling fan of the host blows on the surface of the heat sink, thereby cooling the cooling water in the inner cavity of the heat sink.

[0015] Then, when the memory stick is used for a long time, an oxide layer is generated on the part that contacts the motherboard slot. At this time, the limiting threaded rod is turned to make the limiting threaded rod leave the top of the center of the positioning chamber 1. Then the user pulls the memory stick upward so that the bottom of the memory stick is located between the two erasers, and then pulls the lifting ring up and down, thereby driving the eraser to wipe the oxide layer at the bottom of the memory stick.

[0016] The beneficial effects of the present invention are as follows:

[0017] 1. The present invention locates the portion of the bottom of the memory stick that contacts the motherboard slot between the erasers. At this time, the tension of the clamping spring drives the fixing plate to move toward the center of an inner cavity of the positioning chamber, and the fixing plate is positioned and guided by the guide rod, and the elasticity of the clamping spring enables the eraser to be displaced, thereby closely contacting memory sticks of different specifications, and then the eraser is driven to move upward by pulling the lifting ring up and down, thereby driving the lifting plate to move upward, and then the lifting ring is released, so that the tension of the spring assembly drives the eraser to move downward, thereby wiping the oxide layer at the bottom of the memory stick by the up and down movement of the eraser, thereby no longer needing to use an external eraser to wipe the bottom of the memory stick, which is simple and convenient.

[0018] 2. After the memory stick is inserted into the inner cavity of the positioning chamber 1, the present invention allows the heat conductive sheet and the memory stick to fit tightly, and then the heat generated by the memory stick during operation is transferred to the cooling water inside the heat conductive plate through the heat conductive sheet, so that part of the cooling water becomes hot, and the density of the hot cooling water is lower than that of the cooling water with a lower temperature, so that the hot cooling water floats above the cooling water with a lower temperature, and thus enters the inner cavity of the heat sink, and then the heat of the cooling water is transferred to the air through the heat sink, and then the heat dissipation fan generates wind to blow to the heat sink, so that the cooling water in the inner cavity of the heat sink is cooled, thereby achieving that when the positioning chamber 1 is used to install and position the memory stick, the memory stick can also be cooled by wind, thereby avoiding overheating of the memory stick during use.

[0019] 3. The present invention drives the threaded tube meshing with the movable threaded rod to move along the movable threaded rod by rotating the movable threaded rod, and then drives the adjustment of the spacing between the positioning chamber 1 and the positioning chamber 4 and the change of the spacing between the positioning chamber 2 and the positioning chamber 3 by the movable threaded rod, so that the spacing between the positioning chamber 1, the positioning chamber 2, the positioning chamber 3 and the positioning chamber 4 can be suitable for different motherboard slots, and by rotating the limiting threaded rod, the limiting threaded rod is moved to the top of the memory stick, so that the top of the memory stick is limited by the limiting threaded rod, and then the fixed chamber is pressed downward, so that four memory sticks are inserted into the motherboard slots at the same time, which is more convenient to operate and no longer needs to be installed one by one, thereby improving the convenience during installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the connection of the structural positioning chamber of the present invention;

[0022] Figure 3 This is a schematic diagram of the connection of the guide rod of the structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the connection of the structural damping sleeve of the present invention;

[0024] Figure 5 This is a schematic diagram of the threaded pipe connection structure of the present invention;

[0025] Figure 6 It is a schematic diagram of the connection of the limit threaded rod of the structure of the present invention.

[0026] In the figure: 1. Positioning chamber 1; 2. Guide rod; 3. Clamping spring; 4. Damping sleeve; 5. Fixed plate; 6. Spring assembly; 7. Lifting plate; 8. Eraser; 9. Mounting plate; 10. Movable telescopic rod; 11. Lifting ring; 12. Moving plate; 13. Heat conducting plate; 14. Heat conducting sheet; 15. Limiting threaded rod; 16. Heat dissipation plate; 17. Heat dissipation sheet; 18. Positioning chamber 2; 19. Positioning chamber 3; 20. Positioning chamber 4; 21. Threaded pipe; 22. Moving threaded rod; 23. Fixed chamber; 24. Threaded ring; 25. Bottom plate; 26. Mounting bolts. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] like Figures 1 to 6As shown, an embodiment of the present invention provides a memory stick installation and positioning device, including a positioning bin 1, a guide rod 2 is movably sleeved in the middle of the positioning bin 1, a clamping spring 3 is fixedly connected to one side of the inner cavity of the positioning bin 1 near the guide rod 2, a fixing plate 5 is fixedly connected to one side of the clamping spring 3 near the center of the positioning bin 1, a spring assembly 6 is fixedly connected to the top of the inner cavity of the fixing plate 5, a lifting plate 7 is fixedly connected to the bottom end of the spring assembly 6, an eraser 8 is fixedly connected to one side of the lifting plate 7 near the center of the positioning bin 1, mounting plates 9 are fixedly connected to the left and right sides of the lifting plate 7, a movable telescopic rod 10 is fixedly connected to one side of the mounting plate 9 near the center of the positioning bin 1, and a lifting ring 11 is fixedly connected to the top of the mounting plate 9;

[0029] The working principle and beneficial effects of the above technical solution are as follows: the part of the bottom of the memory stick that contacts the motherboard slot is located between the erasers 8, and at this time, the fixing plate 5 is driven to move toward the center of the inner cavity of the positioning chamber 1 by the tension of the clamping spring 3, and the fixing plate 5 is positioned and guided by the guide rod 2, and the elasticity of the clamping spring 3 is made so that the eraser 8 can be displaced, thereby making close contact with memory sticks of different specifications, and then the eraser 8 is driven to move upward by pulling the lifting ring 11 up and down, thereby driving the lifting plate 7 to move upward, and then the lifting ring 11 is released, so that the tension of the spring assembly 6 drives the eraser 8 to move downward, so that the oxide layer at the bottom of the memory stick is wiped by the up and down movement of the eraser 8, so that there is no need to use an external eraser 8 to wipe the bottom of the memory stick, which is simple and convenient.

[0030] like Figure 2 As shown, in one embodiment, a movable plate 12 is provided at the bottom of the inner cavity of the positioning chamber 1, a heat conducting plate 13 is fixedly connected to one side of the movable plate 12 close to the center of the positioning chamber 1, a heat conducting sheet 14 is fixedly connected to one side of the heat conducting plate 13 close to the center of the positioning chamber 1, a heat dissipating plate 16 is fixedly connected to the top of the heat conducting plate 13, and a heat dissipating sheet 17 is fixedly connected to one side of the heat dissipating plate 16 away from the center of the positioning chamber 1;

[0031] The working principle and beneficial effects of the above technical solution are as follows: after the memory stick is inserted into the inner cavity of the positioning chamber 1, the heat conductive sheet 14 and the memory stick can fit tightly, and then the heat generated by the memory stick during operation is transferred to the cooling water inside the heat conductive plate 13 through the heat conductive sheet 14, so that part of the cooling water becomes hot, and the density of the hot cooling water is lower than that of the cooling water with a lower temperature, so that the hot cooling water floats above the cooling water with a lower temperature, and thus enters the inner cavity of the heat sink 16, and then the heat of the cooling water is transferred to the air through the heat sink 17, and then the heat dissipation fan generates wind to blow to the heat sink 17, so that the cooling water in the inner cavity of the heat sink 16 is cooled, thereby achieving that when the positioning chamber 1 is used to install and position the memory stick, the memory stick can also be cooled by wind, thereby avoiding overheating of the memory stick during use.

[0032] like Figure 2 As shown, in one embodiment, both left and right sides of the positioning bin 1 are fixedly connected with threaded tubes 21, the inner cavity of the threaded tube 21 is meshed with a movable threaded rod 22, the front side of the movable threaded rod 22 is movably sleeved with a fixed bin 23, the inner cavity of the fixed bin 23 is provided with a positioning bin 2 18, a positioning bin 3 19, and a positioning bin 4 20, the top of the fixed plate 5 is fixedly connected with a threaded ring 24, the inner cavity of the threaded ring 24 is meshed with a limited threaded rod 15;

[0033] The working principle and beneficial effects of the above technical scheme are as follows: by rotating the movable threaded rod 22, the threaded tube 21 engaged therewith is driven to move along the movable threaded rod 22, and then the spacing adjustment of the positioning bin 1 and the positioning bin 4 20 and the spacing change of the positioning bin 2 18 and the positioning bin 3 19 are driven by the movable threaded rod 22, so that the spacing of the positioning bin 1, the positioning bin 2 18, the positioning bin 3 19 and the positioning bin 4 20 can be adapted to different motherboard slots, and by rotating the limiting threaded rod 15, the limiting threaded rod 15 is moved to the top of the memory stick, so that the top of the memory stick is limited by the limiting threaded rod 15, and then the fixed bin 23 is pressed downward, so that the four memory sticks are inserted into the motherboard slot at the same time, which is more convenient to operate and no longer needs to be installed one by one, thereby improving the convenience during installation.

[0034] like Figure 2 As shown, in one embodiment, damping sleeves 4 are fixedly installed on both the front and rear sides of the positioning chamber 1, the guide rod 2 is movably sleeved in the inner cavity of the damping sleeve 4, and the positioning chamber 1 is rectangular;

[0035] The working principle and beneficial effects of the above technical solution are as follows: when the fixing plate 5 moves, the fixing plate 5 can be positioned and guided by the guide rod 2, and the setting of the damping sleeve 4 prevents the fixing plate 5 from shaking.

[0036] like Figure 5As shown, in one embodiment, the spring assembly 6 is composed of a damping telescopic rod and a spring, the damping telescopic rod is located at the center of the spring cavity, and the fixed plate 5 and the lifting plate 7 are both L-shaped;

[0037] The working principle and beneficial effects of the above technical solution are as follows: through the setting of the spring, when the lifting plate 7 is pulled upward by the user through the lifting ring 11, it drives the eraser 8 to wipe the bottom of the memory stick for the first time and compress the spring. When the lifting ring 11 is released, the eraser 8 can be driven downward by the tension of the spring to wipe the bottom of the memory stick for the second time, thereby achieving the goal of only pulling upward and through the tension of the spring assembly 6, so that the user only needs to pull the lifting ring 11 upward to wipe the bottom of the memory stick twice, and then the lifting plate 7 is positioned and guided by the damping telescopic rod to prevent it from deflecting.

[0038] like Figure 2 As shown, in one embodiment, a plurality of guide rods 2, clamping springs 3, and damping sleeves 4 are provided, the movable plate 12 is fixedly connected to the positioning chamber 1 through the guide rods 2 and the clamping springs 3, and the inner cavity of the heat conducting plate 13 and the heat dissipating plate 16 is connected;

[0039] The working principle and beneficial effects of the above technical solution are as follows: the movable plate 12 is fixedly connected to the positioning bin 1 through the guide rod 2 and the clamping spring 3, so that the elasticity of the guide rod 2 and the clamping spring 3 can enable the heat conductive sheet 14 to clamp memory sticks of different specifications, and then the inner cavity of the heat conductive plate 13 and the heat sink 16 are connected, so that the hotter cooling water in the inner cavity of the heat conductive plate 13 can float to the inner cavity of the heat sink 16.

[0040] like Figure 2 As shown, in one embodiment, there are a plurality of threaded tubes 21, which are respectively fixedly connected to the left and right sides of the positioning chamber 1, the positioning chamber 2, the positioning chamber 3, the positioning chamber 4, the positioning chamber 20, and a total of two movable threaded rods 22, which are respectively movably connected to the left and right sides of the inner cavity of the positioning chamber 1. The positioning chamber 1 and the positioning chamber 4, the positioning chamber 20, are meshed with the right movable threaded rod 22 through the threaded tubes 21 and are movably sleeved on the surface of the left movable threaded rod 22. The positioning chamber 2, the positioning chamber 3, the positioning chamber 18, the positioning chamber 3, the positioning chamber 19, the threaded tubes 21 and the left movable threaded rod 22 and are movably sleeved on the surface of the right movable threaded rod 22.

[0041] The working principle and beneficial effects of the above technical solution are: by rotating the movable threaded rod 22 on the right side of the positioning bin 1, the spacing between the positioning bin 1 and the positioning bin 4 20 is adjusted; by rotating the movable threaded rod 22 on the left side of the positioning bin 1, the spacing between the positioning bin 2 18 and the positioning bin 3 19 is adjusted, thereby enabling the spacing between the positioning bin 1, the positioning bin 2 18, the positioning bin 3 19, and the positioning bin 4 20 to be adjusted, so as to be suitable for motherboard slots of different specifications.

[0042] like Figure 1 As shown, in one embodiment, both the front and rear sides of the fixed bin 23 are fixedly connected with a bottom plate 25, and the inner cavity of the bottom plate 25 is engaged with a mounting bolt 26;

[0043] The working principle and beneficial effects of the above technical solution are as follows: by setting the bottom plate 25 and the mounting bolts 26, the fixing chamber 23 can be installed so that the bolts 26 are screwed into the threaded holes of the mainboard to fix the fixing chamber 23, thereby fixing the memory stick in the inner cavity of the positioning chamber 1.

[0044] like Figures 1 to 6 As shown, the embodiment of the present invention provides a positioning method for a memory bar installation positioning device, wherein the memory bar is placed in the middle of the inner cavity of the positioning chamber 1 and contacts the heat conductive sheet 14, and at this time, the tension of the clamping spring 3 drives the movable plate 12 to move to one side of the center of the positioning chamber 1, so that the memory bar is clamped by the heat conductive sheet 14, and the heat conductive sheet 14 is displaced according to the size of the memory bar. When most of the memory bar is located at the center of the inner cavity of the positioning chamber 1, the limiting threaded rod 15 is rotated, and the limiting threaded rod 15 is engaged with the threaded ring 24, so that the limiting threaded rod 15 moves to the center of the positioning chamber 1, and moves to the top of the positioning chamber 1, contacts the top of the memory bar, and presses the memory bar.

[0045] Then, the movable threaded rod 22 is rotated to mesh with the threaded tube 21, thereby adjusting the distance between the positioning chamber 1 and the positioning chamber 4 20, and then the movable threaded rod 22 is rotated to drive the distance adjustment between the positioning chamber 2 18 and the positioning chamber 3 19, thereby adjusting the positions of the positioning chamber 1, the positioning chamber 2 18, the positioning chamber 3 19, and the positioning chamber 4 20, and then the memory stick is aligned with the motherboard slot, and the positioning chamber 1 is pressed, and multiple memory sticks are pressed into the motherboard slot at the same time, and the mounting bolts 26 are screwed into the threaded holes of the motherboard through the bottom plate 25 to fix the positioning chamber 1;

[0046] Then, during use, the heat generated by the memory stick can be transferred to the cooling water in the inner cavity of the heat conducting plate 13 through the heat conducting sheet 14. The hot cooling water has a lower density than the cold cooling water, so it can float above the heat conducting plate 13. The hot cooling water enters the inner cavity of the heat sink 16, and then the heat of the hot cooling water is transferred to the air through the heat sink 17. At this time, the wind generated by the heat dissipation fan of the host blows on the surface of the heat sink 17, thereby cooling the cooling water in the inner cavity of the heat sink 16.

[0047] Then, when the memory stick is used for a long time, an oxide layer is generated on the part that contacts the motherboard slot. At this time, the limiting threaded rod 15 is twisted to make the limiting threaded rod 15 leave the top of the center of the positioning chamber 1. Then the user pulls the memory stick upward so that the bottom of the memory stick is located between the two erasers 8, and then pulls the lifting ring 11 up and down, thereby driving the eraser 8 to wipe the oxide layer at the bottom of the memory stick.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A memory stick installation and positioning device, comprising a positioning compartment 1 (1), characterized in that: The middle part of the positioning bin (1) is movably sleeved with a guide rod (2); a clamping spring (3) is fixedly connected to a side of the inner cavity of the positioning bin (1) close to the guide rod (2); a fixing plate (5) is fixedly connected to a side of the clamping spring (3) close to the center of the positioning bin (1); a spring assembly (6) is fixedly connected to the top of the inner cavity of the fixing plate (5); a lifting plate (7) is fixedly connected to a bottom end of the spring assembly (6); an eraser (8) is fixedly connected to a side of the lifting plate (7) close to the center of the positioning bin (1); both left and right sides of the lifting plate (7) are fixedly connected to mounting plates (9); a movable telescopic rod (10) is fixedly connected to a side of the mounting plate (9) close to the center of the positioning bin (1); and a lifting ring (11) is fixedly connected to the top of the mounting plate (9).

2. A memory module installation and positioning device according to claim 1, characterized in that: A movable plate (12) is provided at the bottom of the inner cavity of the positioning bin one (1); a heat conducting plate (13) is fixedly connected to one side of the movable plate (12) close to the center of the positioning bin one (1); a heat conducting sheet (14) is fixedly connected to one side of the heat conducting plate (13) close to the center of the positioning bin one (1); a heat dissipation plate (16) is fixedly connected to the top of the heat conducting plate (13); and a heat dissipation sheet (17) is fixedly connected to one side of the heat dissipation plate (16) away from the center of the positioning bin one (1).

3. The memory module installation and positioning device according to claim 1, characterized in that: The left and right sides of the positioning bin one (1) are fixedly connected with threaded tubes (21), the inner cavity of the threaded tube (21) is meshed with a movable threaded rod (22), the front side of the movable threaded rod (22) is movably sleeved with a fixed bin (23), the inner cavity of the fixed bin (23) is provided with positioning bin two (18), positioning bin three (19), and positioning bin four (20), the top end of the fixed plate (5) is fixedly connected with a threaded ring (24), the inner cavity of the threaded ring (24) is meshed with a limiting threaded rod (15).

4. The memory module installation and positioning device according to claim 1, characterized in that: The front and rear sides of the positioning bin 1 (1) are both fixedly mounted with damping sleeves (4), the guide rod (2) is movably sleeved in the inner cavity of the damping sleeve (4), and the positioning bin 1 (1) is rectangular.

5. The memory module installation and positioning device according to claim 1, characterized in that: The spring assembly (6) is composed of a damping telescopic rod and a spring, the damping telescopic rod is located at the center of the spring inner cavity, and the fixing plate (5) and the lifting plate (7) are both L-shaped.

6. The memory module installation and positioning device according to claim 2, characterized in that: The guide rod (2), the clamping spring (3), and the damping sleeve (4) are provided in plurality; the movable plate (12) is fixedly connected to the positioning chamber (1) via the guide rod (2) and the clamping spring (3); and the inner cavity of the heat conducting plate (13) and the heat dissipating plate (16) is connected.

7. The memory module installation and positioning device according to claim 3, characterized in that: There are a plurality of threaded tubes (21), which are respectively fixedly connected to the left and right sides of the positioning chamber 1 (1), the positioning chamber 2 (18), the positioning chamber 3 (19), and the positioning chamber 4 (20). There are two movable threaded rods (22), which are respectively movably connected to the left and right sides of the inner cavity of the positioning chamber 1 (1). The positioning chamber 1 (1) and the positioning chamber 4 (20) are meshed with the movable threaded rod (22) on the right side through the threaded tubes (21) and are movably sleeved on the surface of the movable threaded rod (22) on the left side. The positioning chamber 2 (18) and the positioning chamber 3 (19) are meshed with the movable threaded rod (22) on the left side through the threaded tubes (21) and are movably sleeved on the surface of the movable threaded rod (22) on the right side.

8. The memory module installation and positioning device according to claim 3, characterized in that: The front and rear sides of the fixed bin (23) are both fixedly connected with a bottom plate (25), and the inner cavity of the bottom plate (25) is engaged with a mounting bolt (26).

9. A method for positioning a memory module installation positioning device, characterized in that: The memory stick is placed in the middle of the inner cavity of the positioning chamber (1) and is in contact with the heat conductive sheet (14). At this time, the tension of the clamping spring (3) drives the movable plate (12) to move to one side of the center of the positioning chamber (1), thereby clamping the memory stick through the heat conductive sheet (14), and the heat conductive sheet (14) is displaced according to the size of the memory stick. When most of the memory stick is located at the center of the inner cavity of the positioning chamber (1), the limiting threaded rod (15) is rotated, and the limiting threaded rod (15) is engaged with the threaded ring (24), so that the limiting threaded rod (15) moves toward the center of the positioning chamber (1), and moves to the top of the positioning chamber (1), contacts the top of the memory stick, and presses the memory stick; Then, the movable threaded rod (22) is rotated to mesh with the threaded tube (21), thereby adjusting the spacing between the positioning chamber 1 (1) and the positioning chamber 4 (20), and then the movable threaded rod (22) is rotated to drive the spacing between the positioning chamber 2 (18) and the positioning chamber 3 (19) to adjust the positions of the positioning chamber 1 (1), the positioning chamber 2 (18), the positioning chamber 3 (19), and the positioning chamber 4 (20), and then the memory stick is aligned with the motherboard slot, and the positioning chamber 1 (1) is pressed, and multiple memory sticks are pressed into the motherboard slot at the same time, and the mounting bolts (26) are passed through the bottom plate (25) and screwed into the threaded holes of the motherboard to fix the positioning chamber 1 (1); Then, during use, the heat generated by the memory stick can be transferred to the cooling water in the inner cavity of the heat conducting plate (13) through the heat conducting sheet (14), and the hot cooling water has a lower density than the cold cooling water, so it can float above the heat conducting plate (13), and the hot cooling water enters the inner cavity of the heat sink (16), and then the heat of the hot cooling water is transferred to the air through the heat sink (17), and at this time, the wind generated by the heat sink fan of the host blows on the surface of the heat sink (17), thereby cooling the cooling water in the inner cavity of the heat sink (16); Then, when the memory stick is used for a long time, an oxide layer is generated on the part in contact with the motherboard slot. At this time, the limiting threaded rod (15) is twisted to make the limiting threaded rod (15) leave the center of the positioning chamber (1). Then, the user pulls up the memory stick so that the bottom of the memory stick is located between the two erasers (8). Then, the lifting ring (11) is pulled up and down, thereby driving the eraser (8) to wipe the oxide layer on the bottom of the memory stick.

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