Metal die cutting method, die cutting system, electronic equipment and computer program product
By automatically analyzing and determining die-cut parameters of multiple defect types, the problem in the prior art that can only be analyzed for specific defect types is solved, and efficient die-cutting of non-ferrous metals is achieved, reducing the possibility of cutting errors.
Patent Information
- Application Number
- CN202411195644.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-01-07
AI Technical Summary
Existing non-ferrous metal die-cutting solutions cannot be analyzed and judged for a variety of defect types, resulting in cumbersome cutting process and prone to errors.
By obtaining the product information data and defect data of the semi-finished product, drawing a scatter plot, constructing preset die cutting parameters and preset die cutting sizes of various defect types, automatically dividing and comparing pre-cut areas, determining the target pre-cut areas, and sending to die-cutting process equipment.
Automatic analysis and judgment of various defect types is realized, manual errors are reduced, and the accuracy and efficiency of cutting are improved.
Smart Images
Figure CN119272481A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of automatic processing technology, and in particular to a metal die-cutting method, a metal die-cutting system, an electronic device, a computer-readable storage medium and a computer program product. Background Art
[0002] In the non-ferrous metal rolling industry, die-cutting is the process of cutting materials into finished products according to specific sizes and shapes to meet specific design and specification requirements. Since the surface quality directly affects the performance and appearance of the final product, non-ferrous metal die-cut products often have very high requirements for the metal surface quality. For products with different uses, they have different requirements for the number and distribution of surface quality defects of the metal in the die-cutting area.
[0003] The existing non-ferrous metal die-cutting scheme design is generally completed with the help of die-cutting design software for specific types of surface quality defects, and it is impossible to analyze and judge multiple types of defects. The analyst collects a certain type of metal surface quality defect data generated by a specific detection device and specifies a candidate die-cutting area. Then, according to the die-cutting surface quality defect judgment standard corresponding to the product, the surface quality defect distribution in the candidate die-cutting area is judged. If the judgment result is qualified, the analyst will copy down the judgment result and the die-cutting area location and send it to the next process to complete the die-cutting.
[0004] Therefore, there is an urgent need for a technical solution that can analyze and determine various defect types and automatically determine the cutting area. Summary of the invention
[0005] The purpose of the embodiments of the present invention is to provide a metal die-cutting method, a metal die-cutting system, an electronic device, a computer-readable storage medium and a computer program product. The die-cutting method can partially or completely solve the problems that the existing technical solutions can only analyze and determine a specific type of defect, and the manual miscopying or omission of the target pre-cutting area makes the cutting process cumbersome and easily leads to cutting errors.
[0006] In order to achieve the above-mentioned purpose, an embodiment of the present invention provides a metal die-cutting method, which includes: obtaining product information data and defect data of a semi-finished product to draw a scatter plot corresponding to the semi-finished product, wherein the defect data includes defect type, defect position and defect size; constructing preset die-cutting parameters and preset die-cutting sizes for multiple defect types; determining the preset die-cutting parameters corresponding to the defect type of the semi-finished product according to the defect type of the semi-finished product; dividing the scatter plot into one or more first pre-cutting areas according to the preset die-cutting size; obtaining the die-cutting parameters of each first pre-cutting area, and comparing them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area among the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area; and obtaining the position information of the target pre-cutting area according to the target pre-cutting area, and sending it to the die-cutting process equipment.
[0007] Optionally, the die-cutting parameters of each defect type among the multiple defect types include preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density, and the step of obtaining the die-cutting parameters of each first pre-cutting area and comparing them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area in the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area includes: obtaining the spatial distribution parameters, defect size, total number of defects and defect density of each first pre-cutting area, and comparing them with the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area in the one or more first pre-cutting areas that meets the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density as the target pre-cutting area.
[0008] Optionally, before executing the step of dividing the scatter diagram into one or more first pre-cutting areas according to the preset die-cutting size, the die-cutting method further includes: determining an area in the scatter diagram that does not satisfy the preset spatial distribution parameters as a pre-cutting avoidance area.
[0009] Optionally, the die-cutting method also includes: dividing the scatter plot of the area outside the pre-cutting avoidance area into one or more second pre-cutting areas according to the preset die-cutting size; and obtaining the defect size, the total number of defects and the defect density of the second pre-cutting area, and comparing them with the preset defect size, the total number of preset defects and the preset defect density corresponding to the defect type of the semi-finished product, and determining the second pre-cutting area in the one or more second pre-cutting areas that meets the preset defect size, the total number of preset defects and the preset defect density as the target pre-cutting area.
[0010] Optionally, before executing the step of obtaining the position information of the target pre-cutting area according to the target pre-cutting area and sending it to the die-cutting process equipment, the die-cutting method also includes: judging whether there are new defects in the target pre-cutting area; if there are new defects in the target pre-cutting area, loopingly executing the steps before determining the target pre-cutting area until a new target pre-cutting area is obtained when there are no new defects; and obtaining the position information of the new target pre-cutting area according to the new target pre-cutting area, and sending it to the die-cutting process equipment.
[0011] Correspondingly, the present invention also provides a metal die-cutting system, which includes: a first acquisition module, used to acquire product information data and defect data of a semi-finished product to draw a scatter plot corresponding to the semi-finished product, wherein the defect data includes defect type, defect position and defect size; a setting module, used to construct preset die-cutting parameters and preset die-cutting sizes for multiple defect types; a first determination module, used to determine the preset die-cutting parameters corresponding to the defect type of the semi-finished product according to the defect type of the semi-finished product; a first division module, used to divide the scatter plot into one or more first pre-cutting areas according to the preset die-cutting size; a second determination module, used to acquire the die-cutting parameters of each first pre-cutting area, and compare them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determine the first pre-cutting area in the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area; and a second acquisition module, used to acquire the position information of the target pre-cutting area according to the target pre-cutting area, and send it to the die-cutting process equipment.
[0012] Optionally, the die-cutting parameters of each defect type among the multiple defect types include preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density. The second determination module is used to obtain the die-cutting parameters of each first pre-cutting area, and compare them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determine the first pre-cutting area in the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area. It includes: obtaining the spatial distribution parameters, defect size, total number of defects and defect density of each first pre-cutting area, and comparing them with the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area in the one or more first pre-cutting areas that meets the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density as the target pre-cutting area.
[0013] Optionally, the die-cutting system also includes: a fourth determination module, which is used to determine the area in the scatter diagram that does not meet the preset spatial distribution parameters as a pre-cutting avoidance area before executing the step of dividing the scatter diagram into one or more first pre-cutting areas according to the preset die-cutting size.
[0014] Optionally, the die-cutting system also includes: a second division module, used to divide the scatter plot of the area outside the pre-cutting avoidance area into one or more second pre-cutting areas according to the preset die-cutting size; and a fourth determination module, used to obtain the defect size, the total number of defects and the defect density of the second pre-cutting area, and compare them with the preset defect size, the total number of preset defects and the preset defect density corresponding to the defect type of the semi-finished product, and determine the second pre-cutting area in the one or more second pre-cutting areas that meets the preset defect size, the total number of preset defects and the preset defect density as the target pre-cutting area.
[0015] Optionally, the die-cutting system also includes: a judgment module, used to judge whether the target pre-cutting area has new defects before executing the step of determining the target pre-cutting area as the target die-cutting product; a loop module, used to loop the steps before determining the target pre-cutting area if there are new defects in the target pre-cutting area, until a new target pre-cutting area is obtained when there are no new defects; a third acquisition module, used to obtain the position information of the new target pre-cutting area based on the new target pre-cutting area, and send it to the die-cutting process equipment.
[0016] On the other hand, the present invention also provides an electronic device, comprising: a processor, and a memory communicatively connected to the processor; the memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory to implement the metal die-cutting method as described.
[0017] On the other hand, the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the metal die-cutting method as described above.
[0018] In yet another aspect, the present invention further provides a computer program product, comprising a computer program, which implements the metal die-cutting method as described above when executed by a processor.
[0019] Through the above technical scheme, product information data and defect data of the semi-finished product are obtained to draw a scatter plot corresponding to the semi-finished product, wherein the defect data includes defect type, defect position and defect size; preset die-cutting parameters and preset die-cutting sizes of multiple defect types are constructed; the preset die-cutting parameters corresponding to the defect type of the semi-finished product are determined according to the defect type of the semi-finished product; the scatter plot is divided into one or more first pre-cutting areas according to the preset die-cutting size; the die-cutting parameters of each first pre-cutting area are obtained, and compared with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and the first pre-cutting area that meets the preset die-cutting parameters among the one or more first pre-cutting areas is determined as the target pre-cutting area; and the position information of the target pre-cutting area is obtained according to the target pre-cutting area, and sent to the die-cutting process equipment.
[0020] The present invention first constructs preset die-cutting parameters and preset die-cutting sizes for a variety of defect types, and matches the corresponding preset die-cutting parameters by judging the defect type of the current semi-finished product; divides the scatter plot corresponding to the semi-finished product into a plurality of pre-cutting areas according to the preset die-cutting size, and compares the die-cutting parameters in the pre-cutting area with the matched preset die-cutting parameters; determines the pre-cutting area whose die-cutting parameters meet the preset die-cutting parameters as the target pre-cutting area, and finally obtains the position information of the target pre-cutting area and sends it to the die-cutting process equipment to facilitate the processing of subsequent processes. The embodiment of the present invention can be applicable to the analysis and determination of a variety of defect types by constructing preset die-cutting parameters for a variety of defects, and the embodiment of the present invention can automatically determine the target pre-cutting area, thereby reducing the possibility of miscopying or missing copying during manual transcription, and reducing the problem of cutting errors.
[0021] Other features and advantages of the embodiments of the present invention will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings are used to provide a further understanding of the embodiments of the present invention and constitute a part of the specification. Together with the following specific implementations, they are used to explain the embodiments of the present invention, but do not constitute a limitation on the embodiments of the present invention. In the accompanying drawings:
[0023] Figure 1 is a flow chart of a metal die cutting method provided by a first embodiment of the present invention;
[0024] Figure 2 is an overall framework diagram of a die-cutting method provided by a second embodiment of the present invention;
[0025] Figure 3 The fourth embodiment of the present invention provides a metal die-cutting system structure diagram. DETAILED DESCRIPTION
[0026] The specific implementation of the embodiment of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the embodiment of the present invention, and is not used to limit the embodiment of the present invention.
[0027] like Figure 1 The flowchart of the metal die cutting method provided by the first embodiment of the present invention is a metal die cutting method, which includes the following steps S10-S15.
[0028] S10. Obtain product information data and defect data of the semi-finished product to draw a scatter plot corresponding to the semi-finished product.
[0029] The defect data includes defect type, defect location and defect size.
[0030] In some embodiments, the die-cutting method provided by the present invention is mainly applicable to die-cutting in the metal rolling industry, especially in the field of non-ferrous metals. It should be noted that the semi-finished product in this application refers to a semi-finished product to be cut that contains defects.
[0031] First, the basic information of each semi-finished product and various surface quality defect detection data are collected and stored in a unified manner using data ETL (Extract, Transform and Load) technology. Among them, product information data includes, for example, the product number of the semi-finished product (each semi-finished product corresponds to a product number), specifications (such as the specific size of the semi-finished product, such as width and thickness), and alloy type. The defect data is based on the semi-finished product number, and may specifically include defect type, defect location, and defect size. The defect location is the position of each defect in the length and width direction of the semi-finished product surface, and the defect size is the length, width, and area of each defect.
[0032] Secondly, based on the information data and defect data of the semi-finished products, the semi-finished products that require die-cutting solutions are drawn into corresponding scatter plots through existing technical means, and the position information of surface defects on the metal surface is displayed, thereby showing the spatial distribution of surface quality defects.
[0033] The horizontal axis of the scatter plot indicates the width of the semi-finished product, and the vertical axis indicates the length of the semi-finished product. Each point in the figure represents a surface defect, and different types of defects are represented by different colors. For example, defect types can be divided into pores and non-pores (including but not limited to these two types of defects). Non-pore defects can be specifically divided into defects such as bumps, black spots, and oil lines; pore defects can be divided into multiple different levels according to the pore size.
[0034] The embodiment of the present invention plots the semi-finished product into a corresponding scatter plot, which can intuitively determine the type and location of the defect, so as to avoid defective areas that do not meet the requirements during subsequent cutting, thereby reducing the unqualified rate of the product.
[0035] S11. Construct preset die-cutting parameters and preset die-cutting dimensions for various defect types.
[0036] In some embodiments, for different user requirements, preset die-cutting parameters and preset die-cutting sizes (such as the specific size of the product you want to cut in the end) of various defect types can be set in advance according to user requirements, that is, the corresponding die-cutting rules need to be maintained for the finished product specifications and surface quality requirements proposed by the customer. For example, for the preset die-cutting parameters corresponding to the defect type of hole defects, the corresponding level can be set according to the size of the hole; for non-hole defects, the maximum length and maximum width that the defect cannot exceed can be set. The preset die-cutting size can be set to different sizes of length and width to provide selection for products of various specifications.
[0037] The embodiment of the present invention constructs preset die-cutting parameters and preset die-cutting dimensions for various defect types, and can match different preset die-cutting parameters for subsequent products with different defect types, so as to realize the judgment and analysis of processing various surface type defects.
[0038] S12. Determine preset die-cutting parameters corresponding to the defect type of the semi-finished product according to the defect type of the semi-finished product.
[0039] In some embodiments, when the defect type of the semi-finished product is known, the preset die-cutting parameters and preset die-cutting dimensions corresponding to the defect type can be matched from step S11. For example, for a defect type of hole, the preset die-cutting parameters corresponding to the hole defect are matched accordingly.
[0040] S13, dividing the scatter diagram into one or more first pre-cut areas according to the preset die-cutting size.
[0041] In some embodiments, a preset die-cutting size is selected according to actual needs. For example, if the specification of the semi-finished product is 1000 meters × 2000 meters, the preset die-cutting size is selected as 100 meters × 150 meters (the preset die-cutting size can also be multiple sizes of multiple shapes), and the semi-finished product is divided according to the specification size to obtain multiple first pre-cutting areas, or a first pre-cutting area is obtained when the preset die-cutting size is the same as the size of the semi-finished product. Among them, the first pre-cutting area represents the area of the semi-finished product that is expected to enter the next cutting process flow, and the first pre-cutting area can be marked with a solid line.
[0042] S14, obtaining the die-cutting parameters of each first pre-cutting area, and comparing them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area among the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area.
[0043] In some embodiments, the existing machine learning model can be used to identify the die-cutting parameters of each pre-cut, and compared with the preset die-cutting parameters corresponding to the defect type of the semi-finished product obtained in the above step S12, that is, the die-cutting parameters of each first pre-cut area are compared with the preset die-cutting parameters. The first pre-cut area that meets the preset die-cutting parameters is determined as the target pre-cut area.
[0044] S15, acquiring position information of the target pre-cutting area according to the target pre-cutting area, and sending the position information to the die-cutting process equipment.
[0045] In some embodiments, the target pre-cut area obtained is the area that meets the customer's requirements. Cutting within this area can ensure that the die-cut product is qualified. Therefore, after determining the target pre-cut area, the semi-finished product is transferred to the next cutting process for cutting. Therefore, after determining the target pre-cut area, the position information of the pre-cut area can be obtained by existing technical means, and the obtained information is sent to the die-cutting process equipment. The entire process does not require manual determination of the target pre-cut area and its position information, reducing the risk of manual omissions and errors.
[0046] Furthermore, the die-cutting parameters of each defect type among the multiple defect types include a preset spatial distribution parameter, a preset defect size, a preset total number of defects and a preset defect density.
[0047] The method of obtaining the die-cutting parameters of each first pre-cutting area, comparing the obtained die-cutting parameters with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area in the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area includes: obtaining the spatial distribution parameters, defect size, total number of defects and defect density of each first pre-cutting area, and comparing the obtained die-cutting parameters with the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area in the one or more first pre-cutting areas that meets the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density as the target pre-cutting area.
[0048] In some embodiments, different users have different requirements for products, so preset die-cutting parameters for various defect types can be constructed according to user requirements, that is, corresponding die-cutting rules can be set. For example, set the rule name and type: [Customer Name 1][Defect Type 1], [Customer Name 1][Defect Type 2]... [Customer Name n][Defect Type m], etc. Different customers have different surface quality requirements for die-cut products of different specifications, so the basic information of the judgment rule includes the customer name and the width, thickness specifications and other requirements of the finished product, which are used to preliminarily delineate the candidate die-cutting area. At the same time, according to the customer's requirements for the total number, density, dense distribution and other types of defects on the surface of the die-cut product, the corresponding judgment standard data is maintained in the database to determine whether the candidate die-cutting area is qualified.
[0049] The preset die-cutting dimensions can be set to: die-cutting length of 100 meters, die-cutting width of 150 meters; die-cutting length of 200 meters, die-cutting width of 150 meters, and other dimensions.
[0050] Set the preset spatial distribution parameters corresponding to each rule name and type, and the preset spatial distribution parameters may also include continuous distribution and density distribution. Taking the hole defect type as an example, the continuous distribution parameter is to prohibit the continuous appearance of 200 or more defects of the same type; the preset defect density is the maximum number of defects allowed per unit area (such as per square centimeter) is 200.
[0051] Preset defect size requirements: For example, for hole defects, the maximum level of defect size cannot exceed 2000 nanometers. The total number of preset defects can be that the total number of defects in the first pre-cut area cannot exceed 2000. The preset density distribution is that the number of defects of the same type in the first pre-cut area shall not exceed 1500. The above preset die-cutting parameters can be set according to actual needs, and the embodiments of the present invention do not impose specific restrictions.
[0052] The spatial distribution parameters, defect size, total number of defects and defect density in each first pre-cutting area are obtained, and the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density are compared one by one with the selected hole defect type. When all die-cutting parameters of the first pre-cutting area meet the preset die-cutting parameters, the first pre-cutting area is determined to be the target pre-cutting area. For example, when the number of spatial distributions is less than or equal to the set number of spatial distributions, the size of all defects is less than or equal to the preset defect size, the total number of defects is less than or equal to the preset total number of defects and the defect density is less than or equal to the preset defect density, it is determined that the first pre-cutting area meets the actual requirements and is determined to be the target pre-cutting area. On the contrary, when the above-mentioned die-cutting parameters of a first pre-cutting area do not meet any one or more of the preset die-cutting parameters, the first pre-cutting area is determined to be an unqualified area, and it is not cut or automatically placed in the unqualified area after cutting.
[0053] Taking into account the large amount of data processed for spatial distribution parameters, in order to improve judgment efficiency, the second embodiment of the present invention also provides a die-cutting method. The difference between this die-cutting method and the above embodiment is that before dividing the first pre-cutting area, the areas in the scatter diagram that do not meet the preset spatial parameters are first screened out.
[0054] Furthermore, before executing the step of dividing the scatter diagram into one or more first pre-cutting areas according to the preset die-cutting size, the die-cutting method further includes: determining the area in the scatter diagram that does not meet the preset spatial distribution parameters as a pre-cutting avoidance area.
[0055] In some embodiments, a machine learning model, such as a density clustering method using DBSCAN, is used in combination with the requirements of preset spatial distribution parameters to identify continuous and dense areas of defects on the surface of semi-finished products that do not meet preset spatial distribution parameters (specifically including continuous distribution and dense distribution). The identified continuous and dense areas of defects are marked in the form of red boxes to avoid these areas, otherwise the die-cutting area will be unqualified.
[0056] Furthermore, the die-cutting method also includes: dividing the scatter plot of the area outside the pre-cutting avoidance area into one or more second pre-cutting areas according to the preset die-cutting size; and obtaining the defect size, the total number of defects and the defect density of the second pre-cutting area, and comparing them with the preset defect size, the total number of preset defects and the preset defect density corresponding to the defect type of the semi-finished product, and determining the second pre-cutting area in the one or more second pre-cutting areas that meets the preset defect size, the total number of preset defects and the preset defect density as the target pre-cutting area.
[0057] In some embodiments, after determining the pre-cut avoidance area, the scatter diagram of the area outside the pre-cut avoidance area is further divided into one or more second pre-cut areas according to a preset die-cutting size. The cutting method is the same as that in the above embodiment and will not be repeated here.
[0058] Since the embodiment of the present invention first screens the areas that do not meet the preset spatial distribution parameters, it is necessary to further determine whether the second pre-cutting area meets the preset defect size, the total number of preset defects and the preset defect density. When these requirements are met, the second cutting area is determined as the target cutting area.
[0059] The third embodiment of the present invention also takes into account that after the target pre-cutting area is determined, the next process flow must be entered. New defects may appear in this process. Therefore, in order to ensure the qualified rate of the final die-cutting product, before the actual cutting, it is further determined whether there are new defects in the target pre-cutting area.
[0060] Furthermore, before executing the step of obtaining the position information of the target pre-cutting area according to the target pre-cutting area and sending it to the die-cutting process equipment, the die-cutting method also includes: judging whether there are new defects in the target pre-cutting area; if there are new defects in the target pre-cutting area, loopingly executing the steps before determining the target pre-cutting area until a new target pre-cutting area is obtained when there are no new defects; and obtaining the position information of the new target pre-cutting area according to the new target pre-cutting area, and sending it to the die-cutting process equipment.
[0061] In some embodiments, the embodiment of the present invention further determines whether there are new defects in the target pre-cutting area. If there are scratches or temporary modifications to the cutting scheme before cutting, resulting in the number of surface defects that cannot be cut according to the original die-cutting scheme, the reasons for the modification and the location of the new surface defects will be sent back to the die-cutting place. According to the actual situation, the steps before determining the target pre-cutting area are repeated until a new target pre-cutting area is obtained when there are no new defects. Then the required die-cutting scheme is selected, and the position of the die-cutting area is marked in the scatter plot. After obtaining the die-cutting scheme with a qualified judgment result, the existing die-cutting scheme can be stored in the database, and the finished product number corresponding to the scheme and the die-cutting position information on the semi-finished product are sent to the next process to start die-cutting production. At the same time, the system uses the surface defect data in the die-cutting area to generate a finished product surface quality report for finished product delivery. Finally, the position information of the target pre-cutting area (such as the coordinate information of the boundary of the target pre-cutting area) is sent to the next die-cutting process equipment, so that the die-cutting process equipment performs cutting processing according to the position information of the target pre-cutting area. The present invention does not make specific restrictions on the subsequent cutting processing and will not be elaborated.
[0062] The cutting system can also judge the surface quality defects within the area according to the judgment criteria of the selected die-cutting scheme and give the judgment result. If the judgment result is qualified, the die-cutting scheme can be saved and sent to the subsequent process for production. After the judgment is completed, the system lists the values of various indicators in the area in a table, so as to clearly display the surface quality of the area. If there is an indicator item that is judged to be unqualified, the indicator will be highlighted. At the same time, a corresponding die-cutting area surface quality defect report is automatically generated, which contains a detailed list of surface quality defects and the actual values of each surface defect judgment indicator corresponding to the die-cutting scheme, which can be used for reference by factories and customers. Figure 2 It is an overall framework diagram of the die-cutting method provided by the second embodiment of the present invention.
[0063] The present invention simultaneously determines multiple types of surface defects of metals during die-cutting scheme design, and generates a surface quality report of the finished product while completing the die-cutting scheme design and issuing a production plan, thereby better meeting customers' quality requirements for die-cut finished products.
[0064] The present invention is mainly aimed at the die-cutting design in the non-ferrous metal rolling production, and realizes efficient and accurate die-cutting design. The main advantages include the following:
[0065] 1. Visual display of metal surface quality defects: Visually display multiple types of surface defects on the metal surface in a scatter plot.
[0066] 2. Die-cutting area determination: After determining the candidate die-cutting area, determine the area according to the corresponding customer standards.
[0067] 3. Die-cutting plan issuance and finished product report generation. For a die-cutting area that is judged to be qualified, it can be saved and sent to the next process to start the finished product die-cutting production. At the same time, the surface quality defect report of the corresponding finished product is generated in the system.
[0068] 4. Secondary design and judgment for unexpected situations. If the semi-finished product encounters unexpected situations such as scratches during transportation, or if the temporary plan changes and the originally determined die-cutting area cannot meet the die-cutting requirements, it will be returned for secondary die-cutting design and judgment.
[0069] The present invention replaces manual transcription and orders by sending the die-cutting plan via a computer, thus avoiding problems such as transcription errors that may be caused by manual transcription. At the same time, the time consumption for issuing is reduced from ten minutes manually to seconds, which greatly shortens the time interval from die-cutting design to the start of production and improves overall production efficiency.
[0070] The present invention first constructs preset die-cutting parameters and preset die-cutting sizes for a variety of defect types, and matches the corresponding preset die-cutting parameters by judging the defect type of the current semi-finished product; divides the scatter plot corresponding to the semi-finished product into a plurality of pre-cutting areas according to the preset die-cutting size, and compares the die-cutting parameters in the pre-cutting area with the matched preset die-cutting parameters; determines the pre-cutting area whose die-cutting parameters meet the preset die-cutting parameters as the target pre-cutting area, and finally cuts the target pre-cutting area to obtain the target die-cutting product. The embodiment of the present invention can be applicable to the analysis and determination of a variety of defect types by constructing preset die-cutting parameters for a variety of defects, and the embodiment of the present invention can automatically determine the target pre-cutting area, thereby avoiding the problem that the cutting process is cumbersome and easy to cause cutting errors due to miscopying or missing the target pre-cutting area during manual transcription.
[0071] like Figure 3 The fourth embodiment of the present invention provides a structural diagram of a metal die-cutting system. The die-cutting system 40 includes: a first acquisition module 401, which is used to acquire product information data and defect data of a semi-finished product to draw a scatter plot corresponding to the semi-finished product, wherein the defect data includes defect type, defect position and defect size; a setting module 402, which is used to construct preset die-cutting parameters and preset die-cutting sizes for multiple defect types; a first determination module 403, which is used to determine the preset die-cutting parameters corresponding to the defect type of the semi-finished product according to the defect type of the semi-finished product; a first division module 404, which is used to divide the scatter plot into one or more first pre-cutting areas according to the preset die-cutting size; a second determination module 405, which is used to acquire the die-cutting parameters of each first pre-cutting area, and compare them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determine the first pre-cutting area in the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area; and a second acquisition module 406, which is used to acquire the position information of the target pre-cutting area according to the target pre-cutting area, and send it to the die-cutting process equipment.
[0072] The principle and technical effect of the metal die-cutting system provided in the embodiment of the present invention are the same as those in the above embodiment and will not be described in detail here.
[0073] Furthermore, the die-cutting parameters of each defect type among the multiple defect types include preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density. The second determination module is used to obtain the die-cutting parameters of each first pre-cutting area, and compare them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determine the first pre-cutting area in the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area. It includes: obtaining the spatial distribution parameters, defect size, total number of defects and defect density of each first pre-cutting area, and comparing them with the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area in the one or more first pre-cutting areas that meets the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density as the target pre-cutting area.
[0074] Furthermore, the die-cutting system also includes: a third determination module, which is used to determine the area in the scatter diagram that does not meet the preset spatial distribution parameters as a pre-cutting avoidance area before executing the division of the scatter diagram into one or more first pre-cutting areas according to the preset die-cutting size.
[0075] Furthermore, the die-cutting system also includes: a second division module, used to divide the scatter plot of the area outside the pre-cutting avoidance area into one or more second pre-cutting areas according to the preset die-cutting size; and a fourth determination module, used to obtain the defect size, the total number of defects and the defect density of the second pre-cutting area, and compare them with the preset defect size, the total number of preset defects and the preset defect density corresponding to the defect type of the semi-finished product, and determine the second pre-cutting area in the one or more second pre-cutting areas that meets the preset defect size, the total number of preset defects and the preset defect density as the target pre-cutting area.
[0076] Furthermore, the die-cutting system also includes: a judgment module, which is used to judge whether the target pre-cutting area has new defects before executing the step of determining the target pre-cutting area as the target die-cutting product; a loop module, which is used to loop the steps before determining the target pre-cutting area if there are new defects in the target pre-cutting area, until a new target pre-cutting area is obtained when there are no new defects; a third acquisition module, which is used to obtain the position information of the new target pre-cutting area based on the new target pre-cutting area, and send it to the die-cutting process equipment.
[0077] The fifth embodiment of the present invention also provides an electronic device, comprising: a processor, and a memory communicatively connected to the processor; the memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory to implement the metal die-cutting method as described.
[0078] A sixth embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the metal die-cutting method as described above.
[0079] The seventh embodiment of the present invention further provides a computer program product, including a computer program, which implements the metal die-cutting method as described above when executed by a processor.
[0080] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.
[0081] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.
[0082] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.
[0083] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.
[0084] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.
[0085] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.
[0086] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.
[0087] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of further restrictions, the elements defined by the sentence "including one or more" do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.
[0088] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.
Claims
1. A metal die cutting method, characterized in that: The die-cutting method comprises: Acquire product information data and defect data of a semi-finished product to draw a scatter plot corresponding to the semi-finished product, wherein the defect data includes defect type, defect location, and defect size; Establish preset die-cutting parameters and preset die-cutting dimensions for various defect types; Determining preset die-cutting parameters corresponding to the defect type of the semi-finished product according to the defect type of the semi-finished product; Dividing the scatter diagram into one or more first pre-cut areas according to the preset die-cutting size; Obtaining die-cutting parameters of each first pre-cutting area, and comparing them with preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area among the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area; and The position information of the target pre-cutting area is obtained according to the target pre-cutting area, and sent to the die-cutting process equipment.
2. The die-cutting method according to claim 1, characterized in that: The die-cutting parameters of each defect type in the plurality of defect types include a preset spatial distribution parameter, a preset defect size, a preset total number of defects and a preset defect density, The step of obtaining the die-cutting parameters of each first pre-cutting area and comparing them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determining the first pre-cutting area in the one or more first pre-cutting areas that meets the preset die-cutting parameters as the target pre-cutting area includes: The spatial distribution parameters, defect size, total number of defects and defect density of each first pre-cutting area are obtained, and compared with the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density corresponding to the defect type of the semi-finished product, and the first pre-cutting area that meets the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density among the one or more first pre-cutting areas is determined as the target pre-cutting area.
3. The die-cutting method according to claim 2, characterized in that: Before executing the step of dividing the scatter diagram into one or more first pre-cut areas according to the preset die-cutting size, the die-cutting method further includes: The area in the scatter plot that does not satisfy the preset spatial distribution parameter is determined as a pre-cut avoidance area.
4. The die-cutting method according to claim 3, characterized in that: The die-cutting method further comprises: Dividing the scatter plot of the area outside the pre-cut avoidance area into one or more second pre-cut areas according to the preset die-cutting size; and The defect size, the total number of defects and the defect density of the second pre-cutting area are obtained, and compared with the preset defect size, the total number of preset defects and the preset defect density corresponding to the defect type of the semi-finished product, and the second pre-cutting area that meets the preset defect size, the total number of preset defects and the preset defect density among the one or more second pre-cutting areas is determined as the target pre-cutting area.
5. The die-cutting method according to claim 1, characterized in that: Before executing the step of acquiring the position information of the target pre-cutting area according to the target pre-cutting area and sending it to the die-cutting process equipment, the die-cutting method further includes: Determining whether there are new defects in the target pre-cutting area; In the case where there are new defects in the target pre-cutting area, the steps before determining the target pre-cutting area are executed cyclically until a new target pre-cutting area is obtained when there are no new defects; and The position information of the new target pre-cutting area is obtained according to the new target pre-cutting area, and sent to the die-cutting process equipment.
6. A metal die cutting system, characterized in that: The die-cutting system comprises: A first acquisition module is used to acquire product information data and defect data of a semi-finished product to draw a scatter plot corresponding to the semi-finished product, wherein the defect data includes defect type, defect location and defect size; Setting module, used to build preset die-cutting parameters and preset die-cutting dimensions for various defect types; A first determination module, configured to determine, according to the defect type of the semi-finished product, a preset die-cutting parameter corresponding to the defect type of the semi-finished product; A first division module, used for dividing the scatter diagram into one or more first pre-cut areas according to the preset die-cutting size; A second determination module is used to obtain the die-cutting parameters of each first pre-cutting area, and compare them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determine the first pre-cutting area that meets the preset die-cutting parameters among the one or more first pre-cutting areas as the target pre-cutting area; and The second acquisition module is used to acquire the position information of the target pre-cutting area according to the target pre-cutting area, and send it to the die-cutting process equipment.
7. The die-cutting system according to claim 6, characterized in that: The die-cutting parameters of each defect type in the plurality of defect types include a preset spatial distribution parameter, a preset defect size, a preset total number of defects and a preset defect density, The second determination module is used to obtain the die-cutting parameters of each first pre-cutting area, and compare them with the preset die-cutting parameters corresponding to the defect type of the semi-finished product, and determine the first pre-cutting area that meets the preset die-cutting parameters among the one or more first pre-cutting areas as the target pre-cutting area, including: The spatial distribution parameters, defect size, total number of defects and defect density of each first pre-cutting area are obtained, and compared with the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density corresponding to the defect type of the semi-finished product, and the first pre-cutting area that meets the preset spatial distribution parameters, preset defect size, total number of preset defects and preset defect density among the one or more first pre-cutting areas is determined as the target pre-cutting area.
8. The die-cutting system according to claim 7, characterized in that: The die-cutting system also includes: a third determination module, which is used to determine the area in the scatter diagram that does not meet the preset spatial distribution parameters as a pre-cut avoidance area before executing the step of dividing the scatter diagram into one or more first pre-cut areas according to the preset die-cutting size.
9. The die-cutting system according to claim 8, characterized in that: The die-cutting system also includes: A second division module is used to divide the scatter diagram of the area outside the pre-cut avoidance area into one or more second pre-cut areas according to the preset die-cutting size; and The fourth determination module is used to obtain the defect size, the total number of defects and the defect density of the second pre-cutting area, and compare them with the preset defect size, the total number of preset defects and the preset defect density corresponding to the defect type of the semi-finished product, and determine the second pre-cutting area in the one or more second pre-cutting areas that meets the preset defect size, the total number of preset defects and the preset defect density as the target pre-cutting area.
10. The die-cutting system according to claim 6, characterized in that: The die-cutting system also includes: A judging module, used for judging whether there is a new defect in the target pre-cutting area before executing the step of determining the target pre-cutting area as a target die-cutting product; A loop module, used for looping the steps before determining the target pre-cutting area when there are new defects in the target pre-cutting area, until a new target pre-cutting area is obtained when there are no new defects; The third acquisition module is used to acquire the position information of the new target pre-cutting area according to the new target pre-cutting area, and send it to the die-cutting process equipment.
11. An electronic device, characterized in that: include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the metal die-cutting method according to any one of claims 1 to 5.
12. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the metal die-cutting method according to any one of claims 1 to 5.
13. A computer program product, characterized in that The invention comprises a computer program, which, when executed by a processor, implements the metal die cutting method according to any one of claims 1 to 5.