Preparation method of flexible conductive yarn sheet

Abstract

The invention provides a preparation method of a flexible conductive yarn sheet, and relates to the technical field of conductive materials. The invention relates to a preparation method of a flexible conductive yarn weaving sheet. The preparation method comprises the following steps: (1) base cloth pretreatment: weaving one of cotton, polyester or nylon into base cloth; cleaning, shrinking and drying the base cloth to remove impurities and moisture, and keeping the size of the base cloth; (2) implanting conductive wires: directly implanting metal wires into the base cloth according to a conductive circuit diagram; (3) bonding treatment: coating a bonding agent at the joint of the base cloth implanted with the conductive silk threads and the conductive silk threads; and (4) post-treatment: scraping redundant adhesive, and carrying out hot-pressing treatment. According to the preparation method of the flexible conductive yarn sheet, the defects of a traditional conductive material are effectively overcome, a new way is opened up for application of the conductive material in the high-end field, and the preparation method has important technical value and application prospects.

Description

Technical Field

[0001] The present invention relates to the field of conductive material technology, and specifically to a method for preparing a flexible conductive woven wire sheet that achieves high flexibility, high durability, and high-precision sensing through innovative structural design and material selection, and is particularly suitable for the field of medical artificial intelligence sensing. Background Art

[0002] With the rapid development of modern science and technology, conductive materials are increasingly used in various fields, especially in high-tech fields such as medical, artificial intelligence and wearable devices, and the performance requirements for conductive materials are becoming more and more stringent. Although traditional metal conductive cloth has basic conductive functions, it has significant limitations in practical applications. In the process of cutting and pasting such cloth onto the base cloth to form a wire sheet, the internal structure of the material is often destroyed due to process limitations, resulting in problems such as poor resistance to bending and rubbing. Once subjected to external forces, such as frequent bending or rubbing, its resistance value will increase significantly, and even break in severe cases, greatly limiting its service life and scope of application.

[0003] Based on this, the present invention provides a method for preparing a flexible conductive woven wire sheet. Summary of the invention

[0004] The purpose of the present invention is to provide a method for preparing a flexible conductive woven wire sheet, which retains the excellent conductive properties of the metal material through the selection of an adhesive, and also greatly enhances the flexibility, bending resistance and rubbing resistance of the conductive circuit through the supporting effect of the base cloth.

[0005] In one aspect, the present invention provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: Weaving one of cotton, polyester or nylon into a base fabric; washing, shrinking and drying the base fabric to remove impurities and moisture and maintain the size of the base fabric; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive and directly implanted into the base fabric according to the conductive circuit diagram; (3) Post-processing: Subsequently, an adhesive is applied to the junction between the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to a heat pressing treatment.

[0006] By cleaning, impurities on the base fabric are removed to ensure the cleanliness of the base fabric surface, which is conducive to the close bonding of the subsequent adhesive and the base fabric. Shrinkage treatment can reduce the dimensional changes of the base fabric during subsequent processing and use, maintain its stability, and thus indirectly improve the flexibility of the conductive circuit. Drying not only removes moisture from the base fabric, but also makes it flat by ironing, reducing the stress concentration points inside the base fabric, making the base fabric less likely to break when subjected to external forces, thereby enhancing the bending resistance and rubbing resistance of the conductive circuit.

[0007] Using a metal wire containing at least 90% silver by weight, silver has excellent conductivity and ductility, so that the conductive line has good flexibility while maintaining high conductivity. In addition, the corrosion resistance of silver also helps to improve the durability of the conductive line.

[0008] The metal wire is coated with adhesive on its surface and then embedded in the base cloth. The adhesive not only enhances the bonding force between the metal wire and the base cloth, but also acts as a buffer, reducing the direct stress of the metal wire when subjected to external force, thereby improving the bending and rubbing resistance of the conductive circuit.

[0009] Adhesive is applied again at the junction of the metal wire and the base fabric, and the excess portion is scraped off, which further enhances the bonding strength between the metal wire and the base fabric while avoiding hardening and embrittlement that may be caused by excessive adhesive, thereby helping to maintain the flexibility of the conductive line.

[0010] The hot pressing process fully solidifies the adhesive through high temperature and high pressure to form a strong bonding layer. This step not only strengthens the bonding force between the metal wire and the base fabric, but also makes the microstructure of the base fabric and the metal wire more dense through hot pressing, reduces internal defects, and thus improves the bending resistance and rubbing resistance of the conductive line.

[0011] Furthermore, the shrinkage treatment step includes soaking the base fabric in water at 45-55° C. for 30-40 minutes, then drying it at 140-150° C., and ironing the base fabric flat after drying.

[0012] Furthermore, the metal wire comprises at least 90% by weight of silver.

[0013] Furthermore, the adhesive comprises the following materials in parts by weight: 20-32 parts of modified methacrylate, 10-16 parts of modified epoxy resin, 2-3 parts of silane coupling agent, 4-5 parts of curing agent and 0.5-1 part of inorganic filler.

[0014] Modified methacrylate and modified epoxy resin have good adhesion and toughness, can effectively combine the metal wire with the base fabric, and provide a certain buffering effect when subjected to external force, thereby enhancing the flexibility of the conductive line.

[0015] As a tackifier, the silane coupling agent can improve the interfacial bonding strength between the adhesive and the metal wire and the base fabric, and further improve the bending resistance and rubbing resistance of the conductive circuit.

[0016] Toluene diisocyanate and diphenylmethane diisocyanate as curing agents ensure that the adhesive can cure quickly under high temperature and pressure to form a stable bonding layer.

[0017] The addition of inorganic fillers such as silicon carbide, graphite and nanosilver not only improves the mechanical properties of the adhesive, but also reduces the voids and defects inside the adhesive through its microstructural filling effect, and further enhances the bending and rubbing resistance of the conductive circuit.

[0018] Furthermore, the preparation method of the modified epoxy resin includes: uniformly mixing the epoxy resin with ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved and stirring for reaction, the reaction temperature is 38-42°C, the reaction time is 5-7h, and after the reaction is completed, the product is washed 3-5 times with deionized water to obtain the modified epoxy resin.

[0019] Furthermore, the weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:(20-30):(15-20):(0.3-0.5).

[0020] Furthermore, the silane coupling agent includes at least one of γ-(2,3-epoxypropyloxy)propyltrimethoxysilane and γ-aminopropyltriethoxysilane.

[0021] Furthermore, the curing agent includes toluene diisocyanate and / or diphenylmethane diisocyanate.

[0022] Furthermore, the inorganic filler includes silicon carbide, graphite and nanosilver in a weight ratio of (2-4): (1-2): (0.5-1).

[0023] Furthermore, the hot pressing treatment step includes: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 130-150° C. and the pressure to 20-26 MPa.

[0024] The beneficial effects of the present invention are: The present invention is a flexible conductive woven wire sheet, which aims to completely solve the defects of traditional conductive cloth sheets and significantly improve the comprehensive performance of the product through innovative structural design and material selection. Specifically, the present invention directly implants metal wires into the base fabric, rather than using the traditional cutting and pasting method, thereby realizing the integrated combination of the conductive circuit and the base fabric. This design not only retains the excellent conductive properties of the metal material, but also greatly enhances the flexibility, bending resistance and rubbing resistance of the conductive circuit through the supporting role of the base fabric.

[0025] In terms of technical implementation, the present invention preferably uses well-made metal wires, especially metal silver wires, as the conductive core material. Metallic silver is known for its excellent conductivity, good ductility and antibacterial properties, and is an ideal conductive and skin-friendly material. By precisely implanting the metal silver wire into the base fabric, a stable and reliable conductive sensing circuit can be formed, which not only ensures efficient signal transmission, but also because of its good skin-friendliness, the conductive woven wire sheet can directly contact the human body, providing a comfortable and safe user experience.

[0026] The flexible conductive woven wire sheet of the present invention has shown broad application prospects in the field of medical artificial intelligence sensing due to its unique performance advantages. Its precise sensing capability and excellent durability enable the material to be applied to various high-end products such as medical equipment and smart wearable devices, achieving more accurate and reliable data collection and transmission, and improving the overall product intelligence level and user experience. At the same time, the antibacterial properties of metallic silver also provide a strong guarantee for the hygienic safety of medical products.

[0027] The formula of the adhesive in the present invention first uses modified methacrylate as the main flexible component, which can give the conductive circuit good flexibility and bending resistance, and it has good adhesion to a variety of materials, can firmly bond metal wires and base fabrics, and ensure that the conductive circuit is not easy to fall off or break when subjected to external forces. Epoxy resin has the characteristics of high strength and high hardness, and the modified epoxy resin can improve its flexibility and processing performance while maintaining these advantages. In the adhesive, the modified epoxy resin is used as a reinforcing phase to improve the bending resistance and rubbing resistance of the conductive circuit, and prevent cracks or breaks from occurring during repeated bending or rubbing. Epoxy resin also has good chemical resistance, can resist the erosion of chemical substances such as acids and alkalis, and protect the conductive circuit from stable operation in complex environments. The various components in the adhesive formula work together to enhance the flexibility, bending resistance and rubbing resistance of the conductive circuit through synergistic effects.

[0028] In the present invention, the inorganic filler is selected from silicon carbide, graphite and nano silver compound, wherein silicon carbide is a high hardness, high strength material, and its addition can significantly improve the mechanical strength of the adhesive, including tensile strength, flexural strength and wear resistance. This helps to reduce the deformation or breakage of the base fabric and the metal wire when the conductive circuit is subjected to external force, such as bending or rubbing, thereby enhancing the bending resistance and rubbing resistance of the conductive circuit. And the silicon carbide particles play a role in dispersing stress in the adhesive. When the conductive circuit is subjected to external force, the stress can be transmitted and dispersed by the silicon carbide particles, reducing local stress concentration and avoiding cracks or fractures. Graphite has good lubricity and can form a lubricating layer in the adhesive to reduce the friction between the metal wire and the base fabric. This helps to reduce the wear and heat caused by friction when the conductive circuit is rubbed or bent, thereby protecting the conductive circuit from damage. The layered structure of graphite also gives it a certain flexibility, and adding it to the adhesive can increase the flexibility of the adhesive, thereby improving the flexibility of the conductive circuit. In addition, nanosilver has extremely high conductivity, and its addition can significantly improve the conductivity of the conductive circuit. Although this does not directly enhance flexibility, bending resistance or rubbing resistance, good conductivity helps to reduce the heat generated by excessive resistance, thereby protecting the conductive circuit from heat damage during long-term use or when high current passes. The small size effect and surface effect of nanosilver particles give it excellent dispersibility and bonding ability with the substrate. In the adhesive, the nanosilver particles can be evenly dispersed and tightly combined with the substrate to form a stable conductive network. This stable structure helps to improve the overall stability and durability of the conductive circuit, thereby indirectly enhancing its bending resistance and rubbing resistance. Silicon carbide, graphite and nanosilver are added to the adhesive as inorganic fillers, and through their unique physical and chemical properties, they work together to improve the flexibility, bending resistance and rubbing resistance of the conductive circuit; the synergistic effect of these inorganic fillers enables the conductive circuit to maintain high conductivity while also having excellent flexibility and durability. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a conductive circuit diagram of Example 1 of the present invention; Figure 2 This is a physical picture of the finished product of Example 1 of the present invention. DETAILED DESCRIPTION

[0030] The technical scheme of the present invention is described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention. It should be noted that the raw materials can be obtained commercially. Example

[0031] This embodiment provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: cotton is used as raw material to weave the base fabric; the base fabric is washed, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; wherein the shrinkage treatment step is to soak the base fabric in water at 50°C for 35 minutes, then dry it at 145°C, and iron the base fabric to make it smooth after drying; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive, and is directly implanted into the base fabric according to the conductive circuit diagram; wherein the metal wire contains 90% by weight of silver; (3) Post-processing: Subsequently, an adhesive is applied to the junction of the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to hot pressing treatment; wherein the hot pressing treatment step comprises: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 140°C and the pressure to 23 MPa; The adhesive comprises the following materials in parts by weight: 26 parts of modified methacrylate, 13 parts of modified epoxy resin, 2.5 parts of silane coupling agent, 4.5 parts of curing agent and 0.7 parts of inorganic filler; The modified methacrylate was purchased from Allnex Resins (China) Co., Ltd. with the brand name EP3700; The preparation method of the modified epoxy resin comprises: uniformly mixing epoxy resin E51 and ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved, and stirring for reaction, the reaction temperature is 40° C., the reaction time is 6 hours, and after the reaction is completed, the product is washed 5 times with deionized water to obtain the modified epoxy resin; the weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:25:17:0.4; The silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane and γ-aminopropyltriethoxysilane in a weight ratio of 1:1; the curing agent is toluene diisocyanate; and the inorganic filler includes silicon carbide, graphite and nanosilver in a weight ratio of 3:1.5:0.7.

[0032] The flexible conductive woven wire sheet prepared in this embodiment was tested and found to be resistant to bending, with the resistance increasing by less than 5% after being bent 100 times; and resistant to rubbing, with the resistance increasing by less than 5% after being rubbed 100 times. Example

[0033] This embodiment provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: polyester is used as raw material to weave the base fabric; the base fabric is washed, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; wherein the shrinkage treatment step is to soak the base fabric in water at 45°C for 30 minutes, then dry it at 140°C, and iron the base fabric flat after drying; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive, and is directly implanted into the base fabric according to the conductive circuit diagram; wherein the metal wire contains 90% by weight of silver; (3) Post-processing: Subsequently, an adhesive is applied to the junction of the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to hot pressing treatment; wherein the hot pressing treatment step comprises: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 130°C and the pressure to 20 MPa; The adhesive comprises the following materials in parts by weight: 20 parts of modified methacrylate, 10 parts of modified epoxy resin, 2 parts of silane coupling agent, 4 parts of curing agent and 0.5 parts of inorganic filler; The preparation method of the modified epoxy resin comprises: uniformly mixing epoxy resin E51 and ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved, and stirring for reaction, the reaction temperature is 38° C., the reaction time is 5 hours, and after the reaction is completed, the product is washed 3 times with deionized water to obtain the modified epoxy resin; the weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:20:15:0.3; The silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane; the curing agent is diphenylmethane diisocyanate; and the inorganic filler comprises silicon carbide, graphite and nano silver in a weight ratio of 2:1:0.5.

[0034] The flexible conductive woven wire sheet prepared in this embodiment was tested and found to be resistant to bending, with the resistance increasing by less than 5% after being bent 100 times; and resistant to rubbing, with the resistance increasing by less than 5% after being rubbed 100 times. Example

[0035] This embodiment provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: nylon is used as raw material to weave the base fabric; the base fabric is washed, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; wherein the shrinkage treatment step is to soak the base fabric in water at 55°C for 40 minutes, then dry it at 150°C, and iron the base fabric flat after drying; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive, and is directly implanted into the base fabric according to the conductive circuit diagram; wherein the metal wire contains 90% by weight of silver; (3) Post-processing: Subsequently, an adhesive is applied to the junction of the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to hot pressing treatment; wherein the hot pressing treatment step comprises: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 150°C and the pressure to 26 MPa; The adhesive comprises the following materials in parts by weight: 32 parts of modified methacrylate, 16 parts of modified epoxy resin, 3 parts of silane coupling agent, 5 parts of curing agent and 1 part of inorganic filler; The preparation method of the modified epoxy resin comprises: uniformly mixing epoxy resin E51 and ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved, and stirring for reaction, the reaction temperature is 42° C., the reaction time is 7 hours, and after the reaction is completed, the product is washed 5 times with deionized water to obtain the modified epoxy resin; the weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:30:20:0.5; The silane coupling agent is γ-aminopropyltriethoxysilane; the curing agent is toluene diisocyanate; and the inorganic filler includes silicon carbide, graphite and nano silver in a weight ratio of 4:2:1.

[0036] The flexible conductive woven wire sheet prepared in this embodiment was tested and found to be resistant to bending, with the resistance increasing by less than 5% after being bent 100 times; and resistant to rubbing, with the resistance increasing by less than 5% after being rubbed 100 times.

[0037] This comparative example provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: cotton is used as raw material to weave the base fabric; the base fabric is washed, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; wherein the shrinkage treatment step is to soak the base fabric in water at 50°C for 35 minutes, then dry it at 145°C, and iron the base fabric to make it smooth after drying; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive, and is directly implanted into the base fabric according to the conductive circuit diagram; wherein the metal wire contains 90% by weight of silver; (3) Post-processing: Subsequently, an adhesive is applied to the junction of the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to hot pressing treatment; wherein the hot pressing treatment step comprises: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 140°C and the pressure to 23 MPa; The adhesive comprises the following materials in parts by weight: 26 parts of modified methacrylate, 13 parts of epoxy resin E51, 2.5 parts of silane coupling agent, 4.5 parts of curing agent and 0.7 parts of inorganic filler; The modified methacrylate was purchased from Allnex Resins (China) Co., Ltd. with the brand name EP3700; The silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane and γ-aminopropyltriethoxysilane in a weight ratio of 1:1; the curing agent is toluene diisocyanate; and the inorganic filler includes silicon carbide, graphite and nanosilver in a weight ratio of 3:1.5:0.7.

[0038] The flexible conductive woven wire sheet prepared in this comparative example was tested. After being bent 100 times, the resistance increased by 10%; after being rubbed 100 times, the resistance increased by 12%.

[0039] This comparative example provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: cotton is used as raw material to weave the base fabric; the base fabric is washed, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; wherein the shrinkage treatment step is to soak the base fabric in water at 50°C for 35 minutes, then dry it at 145°C, and iron the base fabric to make it smooth after drying; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive, and is directly implanted into the base fabric according to the conductive circuit diagram; wherein the metal wire contains 90% by weight of silver; (3) Post-processing: Subsequently, an adhesive is applied to the junction of the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to hot pressing treatment; wherein the hot pressing treatment step comprises: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 140°C and the pressure to 23 MPa; The adhesive comprises the following materials in parts by weight: 26 parts of modified methacrylate, 13 parts of modified epoxy resin, 2.5 parts of silane coupling agent, 4.5 parts of curing agent and 0.7 parts of inorganic filler; The modified methacrylate was purchased from Allnex Resins (China) Co., Ltd. with the brand name EP3700; The preparation method of the modified epoxy resin comprises: uniformly mixing epoxy resin E51 and ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved, and stirring for reaction, the reaction temperature is 40° C., the reaction time is 6 hours, and after the reaction is completed, the product is washed 5 times with deionized water to obtain the modified epoxy resin; the weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:25:17:0.4; The silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane and γ-aminopropyltriethoxysilane in a weight ratio of 1:1; the curing agent is toluene diisocyanate; and the inorganic filler includes silicon carbide and graphite in a weight ratio of 3:1.5.

[0040] The flexible conductive woven wire sheet prepared in this comparative example was tested. After being bent 100 times, the resistance increased by 9%; after being rubbed 100 times, the resistance increased by 10%.

[0041] This comparative example provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: cotton is used as raw material to weave the base fabric; the base fabric is washed, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; wherein the shrinkage treatment step is to soak the base fabric in water at 50°C for 35 minutes, then dry it at 145°C, and iron the base fabric to make it smooth after drying; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive, and is directly implanted into the base fabric according to the conductive circuit diagram; wherein the metal wire contains 90% by weight of silver; (3) Post-processing: Subsequently, an adhesive is applied to the junction of the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to hot pressing treatment; wherein the hot pressing treatment step comprises: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 140°C and the pressure to 23 MPa; The adhesive comprises the following materials in parts by weight: 26 parts of modified methacrylate, 13 parts of modified epoxy resin, 2.5 parts of silane coupling agent, 4.5 parts of curing agent and 0.7 parts of inorganic filler; The modified methacrylate was purchased from Allnex Resins (China) Co., Ltd. with the brand name EP3700; The preparation method of the modified epoxy resin comprises: uniformly mixing epoxy resin E51 and ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved, and stirring for reaction, the reaction temperature is 40° C., the reaction time is 6 hours, and after the reaction is completed, the product is washed 5 times with deionized water to obtain the modified epoxy resin; the weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:25:17:0.4; The silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane and γ-aminopropyltriethoxysilane in a weight ratio of 1:1; the curing agent is toluene diisocyanate; and the inorganic filler includes silicon carbide and nanosilver in a weight ratio of 3:0.7.

[0042] The flexible conductive woven wire sheet prepared in this comparative example was tested. After being bent 100 times, the resistance increased by 11%; after being rubbed 100 times, the resistance increased by 12%.

[0043] This comparative example provides a method for preparing a flexible conductive woven wire sheet, the steps comprising: (1) Base fabric pretreatment: cotton is used as raw material to weave the base fabric; the base fabric is washed, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; wherein the shrinkage treatment step is to soak the base fabric in water at 50°C for 35 minutes, then dry it at 145°C, and iron the base fabric to make it smooth after drying; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive, and is directly implanted into the base fabric according to the conductive circuit diagram; wherein the metal wire contains 90% by weight of silver; (3) Post-processing: Subsequently, an adhesive is applied to the junction of the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to hot pressing treatment; wherein the hot pressing treatment step comprises: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to 140°C and the pressure to 23 MPa; The adhesive comprises the following materials in parts by weight: 13 parts of modified epoxy resin, 2.5 parts of silane coupling agent, 4.5 parts of curing agent and 0.7 parts of inorganic filler; The modified methacrylate was purchased from Allnex Resins (China) Co., Ltd. with the brand name EP3700; The preparation method of the modified epoxy resin comprises: uniformly mixing epoxy resin E51 and ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved, and stirring for reaction, the reaction temperature is 40° C., the reaction time is 6 hours, and after the reaction is completed, the product is washed 5 times with deionized water to obtain the modified epoxy resin; the weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:25:17:0.4; The silane coupling agent is γ-(2,3-epoxypropoxy)propyltrimethoxysilane and γ-aminopropyltriethoxysilane in a weight ratio of 1:1; the curing agent is toluene diisocyanate; and the inorganic filler includes silicon carbide, graphite and nanosilver in a weight ratio of 3:1.5:0.7.

[0044] The flexible conductive woven wire sheet prepared in this comparative example was tested. After being bent 100 times, the resistance increased by 12%; after being rubbed 100 times, the resistance increased by 14%.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Those skilled in the art should understand that the present invention can still be modified or replaced by equivalents. All technical solutions and improvements that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A method for preparing a flexible conductive woven wire sheet, characterized in that the steps include: (1) Base fabric pretreatment: weaving one of cotton, polyester or nylon into a base fabric; The base fabric is cleaned, shrunk, and dried to remove impurities and moisture and maintain the size of the base fabric; (2) Conductive wire implantation: The metal wire is immersed in an adhesive so that its surface is coated with a layer of adhesive and directly implanted into the base fabric according to the conductive circuit diagram; (3) Post-processing: Subsequently, an adhesive is applied to the junction between the metal wire and the base fabric, excess adhesive is scraped off, and the base fabric after the conductive wire is implanted is subjected to a heat pressing treatment.

2. The method for preparing a flexible conductive woven wire sheet according to claim 1, characterized in that: The shrinkage treatment step comprises soaking the base fabric in water at 45-55° C. for 30-40 minutes, then drying it at 140-150° C., and ironing the base fabric flat after drying.

3. The method for preparing a flexible conductive woven wire sheet according to claim 1, characterized in that: The metal wire comprises at least 90% by weight of silver.

4. The method for preparing a flexible conductive woven wire sheet according to claim 1, characterized in that: The adhesive comprises the following materials in parts by weight: 20-32 parts of modified methacrylate, 10-16 parts of modified epoxy resin, 2-3 parts of silane coupling agent, 4-5 parts of curing agent and 0.5-1 part of inorganic filler.

5. The method for preparing a flexible conductive woven wire sheet according to claim 4, characterized in that: The preparation method of the modified epoxy resin comprises: uniformly mixing the epoxy resin with ethyl acetate, adding dichloromethylsilane and dibutyltin dilaurate after the resin is dissolved and stirring for reaction, the reaction temperature is 38-42° C., the reaction time is 5-7 hours, and after the reaction is completed, the product is washed 3-5 times with deionized water to obtain the modified epoxy resin.

6. The method for preparing a flexible conductive woven wire sheet according to claim 5, characterized in that: The weight ratio of the epoxy resin, ethyl acetate, dichloromethylsilane and dibutyltin dilaurate is 100:(20-30):(15-20):(0.3-0.5).

7. The method for preparing a flexible conductive woven wire sheet according to claim 4, characterized in that: The silane coupling agent includes at least one of γ-(2,3-epoxypropyloxy)propyltrimethoxysilane and γ-aminopropyltriethoxysilane.

8. The method for preparing a flexible conductive woven wire sheet according to claim 4, characterized in that: The curing agent includes toluene diisocyanate and / or diphenylmethane diisocyanate.

9. The method for preparing a flexible conductive woven wire sheet according to claim 4, characterized in that: The inorganic filler comprises silicon carbide, graphite and nano silver in a weight ratio of (2-4): (1-2): (0.5-1).

10. The method for preparing a flexible conductive woven wire sheet according to claim 1, characterized in that: The hot pressing treatment step includes: placing the assembled sample on a workbench of a hot press, starting the hot press, and controlling the hot pressing temperature to be 130-150° C. and the pressure to be 20-26 MPa.

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