Wafer production device carrier and working method thereof

Abstract

The invention belongs to the technical field of semiconductor devices, and particularly relates to a wafer production device carrier and a working method thereof. A wafer production device carrier comprises a plurality of pairs of supporting sheets which are located on the inner walls of the two sides of a box body and form a plurality of layers of wafer placing positions, and the supporting sheets and the inner walls of the box body are arranged in an up-and-down sliding mode; the plurality of adjusting and limiting assemblies respectively correspond to the corresponding wafer placing positions, and each adjusting and limiting assembly comprises a wafer plug connector and linkage mechanisms for supporting sheets, and the linkage mechanisms are located on the two sides of the wafer plug connector; wherein the wafers are inserted into or pulled out of the wafer placing positions, so that the wafer plug connectors move backwards or forwards, and the linkage mechanism is triggered to drive the supporting pieces above the wafer placing positions to adjust the layer gaps, so that the adjacent wafers are prevented from being polluted when the wafers are taken and placed; through the arrangement of the adjusting limiting assembly, the wafer can be pulled to move towards the interior of the box body in the process of putting the wafer into the box body, and the supporting sheet can be pushed to move upwards when the wafer is taken out, so that the adjacent wafer is prevented from being polluted.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor devices, and specifically relates to a device for processing semiconductor devices, and more particularly to a wafer production device carrier and a working method thereof. Background Art

[0002] Wafer boxes mainly play the role of placing and transporting wafers in semiconductor production. In order to simplify transportation and minimize the risk of contamination, chip manufacturers use wafer boxes to move and store wafers.

[0003] In order to increase the loading capacity, the partitions on the inner wall of the wafer box are set relatively tightly. When the wafers are stacked in the wafer box in sequence, when any wafer is taken or placed from the middle of the wafer box, the clamping device will touch other adjacent wafers above and below, causing contamination to other wafers.

[0004] Therefore, how to avoid contamination of other wafers when placing and taking wafers in a wafer box is a technical problem that urgently needs to be solved in this field.

[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0006] The embodiments of the present disclosure at least provide a wafer production device carrier and a working method thereof.

[0007] In a first aspect, an embodiment of the present disclosure provides a wafer production device carrier, comprising: Box body; A plurality of pairs of support sheets are located on the inner walls of both sides of the box body and form a plurality of layers of wafer placement positions, and the support sheets and the inner walls of the box body are arranged to slide up and down; A plurality of adjustment and limiting components respectively correspond to the corresponding wafer placement positions, and include: a wafer plug-in component, and a linkage mechanism for support sheets located on both sides of the wafer plug-in component; The wafer is inserted into or pulled out of the wafer placement position to move the wafer connector backward or forward, triggering the linkage mechanism to drive the support sheet above the wafer placement position to adjust the layer gap to avoid contamination of the adjacent wafers when the wafer is taken out and placed.

[0008] In an optional embodiment, the adjustment and limiting assembly includes: a positioning plate, which is horizontally arranged in the box body and vertically fixed to the inner plate side wall of the box body; The wafer connector is slidably disposed on the positioning plate; The two linkage mechanisms are respectively slidably arranged on both sides of the positioning plate, and the linkage mechanisms are linked with the wafer connector; When the wafer connector moves in a direction away from the inner plate, it is suitable for pushing the two linkage mechanisms to move away from each other.

[0009] In an optional embodiment, two parallel grooves are formed on the bottom wall of the positioning plate, one linkage mechanism corresponds to one parallel groove, and the linkage mechanism is slidably disposed in the parallel groove.

[0010] In an optional embodiment, the linkage mechanism includes: a limit bar, which is slidably disposed in the parallel groove; A positioning block, the positioning block being fixed to the outer end of the limiting strip; A push-up member, the push-up member is fixed to the upper end of the positioning block, and the push-up member and the limit strip are parallel to each other; A connecting rod, two ends of which are respectively hinged on the pushing component and the wafer plug-in component.

[0011] In an optional embodiment, the push-up member includes: a lifting block and a linkage plate, the lifting block is fixed to the upper end of the positioning block, and a slope is provided on a side of the lifting block close to the support plate; The linkage plate is fixed on the other side of the lifting block, and the interior of the linkage plate is hollow; Wherein, when the wafer plug-in moves horizontally toward the inner plate, it is suitable for driving the two linkage plates to move toward each other until the two linkage plates arranged opposite to each other are plugged into each other.

[0012] In an optional embodiment, a plurality of air holes are provided on the linkage plate, and a desiccant is placed inside the linkage plate.

[0013] In an optional embodiment, a limiting groove is provided on a side of the wafer connector close to the wafer, and the wafer is suitable for being inserted into the limiting groove; After the wafer is horizontally inserted into the limiting groove, the wafer connector moves horizontally toward the inner plate to pull the wafer into the box body.

[0014] In an optional embodiment, a side of the positioning block close to the wafer is provided with an arc surface, and the arc surface is suitable for fitting with the outer wall of the wafer.

[0015] In an optional embodiment, the box body is hollow and has an opening on one side, and the wafer is suitable for being inserted into the box body through the opening; Supporting plates are arranged on the inner walls of both sides of the box body, and every two supporting plates are arranged opposite to each other; An adjustment limit assembly is horizontally fixed to the inner plate side wall of the box body, one adjustment limit assembly corresponds to two support sheets, and the adjustment limit assembly is linked with the two support sheets; When placing the wafer, the wafer is horizontally inserted into the box body until it is limited by the wafer connector of the adjustable limit assembly; The wafer connector moves horizontally toward the inner plate to pull the wafer horizontally into the box body; When the wafer is taken out, the wafer connector moves outward, and the linkage mechanism of the regulating limit assembly moves horizontally toward the side wall of the box body to push the pair of support plates located above to move upward.

[0016] In an optional embodiment, the adjustment and limiting assembly includes: a positioning plate, which is horizontally arranged in the box body and vertically fixed to the inner plate side wall of the box body; A wafer connector, which is slidably disposed on the positioning plate; The two linkage mechanisms are respectively slidably arranged on both sides of the positioning plate, and the linkage mechanisms are linked with the wafer connector; When the wafer connector moves in a direction away from the inner plate, it is suitable for pushing the two linkage mechanisms to move away from each other.

[0017] In an optional embodiment, the linkage mechanism includes: a limit bar, which is slidably arranged on the lower bottom surface of the positioning plate; A positioning block, the positioning block being fixed to the outer end of the limiting strip; A push-up member, the push-up member is fixed to the upper end of the positioning block, and the push-up member and the limit strip are parallel to each other; A connecting rod, two ends of which are respectively hinged on the pushing component and the wafer plug-in component.

[0018] In a second aspect, the present disclosure also provides a working method of a wafer production device carrier, including: When placing the wafer, the wafer is horizontally inserted into the box body until it is limited by the wafer connector of the adjustable limit assembly; The wafer connector moves horizontally toward the inner plate to pull the wafer horizontally into the box body until the wafer contacts the positioning block; When the wafer is taken out, the wafer connector moves outward, and the linkage mechanism of the regulating limit assembly moves horizontally toward the side wall of the box body to push the pair of support plates located above to move upward.

[0019] The beneficial effect of the present invention is that the wafer production device carrier and the working method thereof of the present invention, by adjusting the setting of the limit assembly, the wafer is placed in the box body until it is limited by the wafer connector, and the wafer connector moves inward to pull the wafer into the box body. The traditional method of clamping the wafer or manually pushing the wafer into the box body is avoided. When taking the wafer, the wafer connector moves outward, and the linkage mechanism of the limit assembly is adjusted to move horizontally toward the side wall of the box body to push the pair of support plates located above to move upward, so as to avoid contamination of other adjacent wafers when the clamping device or manual clamping of the wafer.

[0020] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A three-dimensional diagram of a wafer production device carrier provided by an embodiment of the present disclosure; Figure 2 A three-dimensional diagram of an adjustable limit assembly in a box body provided in an embodiment of the present disclosure; Figure 3 A partial stereoscopic diagram of an adjustment and limiting assembly provided in an embodiment of the present disclosure; Figure 4 A top view of the box body and the adjustment and limiting assembly provided in an embodiment of the present disclosure; Figure 5 A front view of the box body and the adjustment and limiting assembly provided in an embodiment of the present disclosure; Figure 6 A schematic diagram of a wafer placement state provided in an embodiment of the present disclosure; Figure 7 A schematic diagram of a wafer removal state provided in an embodiment of the present disclosure; Figure 8 A schematic diagram of the two linkage plates provided in an embodiment of the present disclosure being plugged into each other.

[0024] In the figure: 1. Box body; 10. Inner plate; 11. Connecting rod; 2. Support sheet; 3. Adjust the limit assembly; 31. Positioning plate; 310. Parallel groove; 32. Wafer connector; 320. Limit groove; 33. Linkage mechanism; 34. Limit strip; 35. Positioning block; 36. Pushing member; 37. Connecting rod; 38. Lifting block; 39. Linkage plate. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0027] In this article, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0028] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0029] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0030] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0031] When the wafers are stacked in sequence in the wafer box, when any wafer is taken out from the middle of the wafer box, the clamping device will touch other adjacent wafers above and below, causing contamination to other wafers.

[0032] When placing the wafer, the traditional clamping device or manual insertion of the wafer into the box body will contaminate other adjacent wafers; when taking out the wafer, the distance between adjacent support plates in the box body is small, which is not conducive to the clamping device or manual insertion.

[0033] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0035] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0036] like Figures 1 to 7 As shown, some embodiments provide a wafer production device carrier, including: a box body 1; the interior of the box body 1 is hollow; an opening is provided on one side of the box body 1, and the wafer is suitable for being inserted into the box body 1 through the opening; an inner plate 10 is fixed on the side of the box body 1 away from the opening, and a plurality of through slots are provided on the inner plate 10, and a connecting rod 11 adapted to the adjustment limit assembly 3 is slidably provided in each of the through slots, and the connecting rod 11 is suitable for driving the wafer plug-in component 32 to move horizontally in the box body 1. A plurality of pairs of support sheets 2 are located on the inner walls of both sides of the box body 1, and form a plurality of layers of wafer placement positions, and the support sheets 2 and the inner wall of the box body 1 are arranged to slide up and down; a plurality of vertical slots are symmetrically provided on the side wall of the box body 1 along the vertical direction, and each vertical slot corresponds to a support sheet 2, and a convex block adapted to the vertical slot is fixed on the side wall of the support sheet 2, and the convex block is suitable for moving in the vertical slot. Several adjustment and limit assemblies 3 correspond to the corresponding wafer placement positions, and include: a wafer connector 32, and a linkage mechanism 33 for the support sheet 2 located on both sides of the wafer connector 32; wherein, when the wafer is inserted into or pulled out of the wafer placement position, the wafer connector 32 moves backward or forward, triggering the linkage mechanism 33 to drive the support sheet 2 above the wafer placement position to adjust the layer gap, so as to avoid contamination of adjacent wafers when taking and placing the wafer. By adjusting the setting of the limit assembly 3, the wafer is placed in the box body 1 until it is limited by the wafer connector 32, and the wafer connector 32 moves inward to pull the wafer into the box body 1. The traditional method of clamping the device or manually pushing the wafer into the box body 1 is avoided. When taking the wafer, the wafer connector 32 moves outward, and the linkage mechanism 33 of the limit assembly 3 is adjusted to move horizontally toward the side wall of the box body 1 to push the pair of support plates 2 located above to move upward to avoid contamination of other adjacent wafers when the clamping device or manual clamping of the wafer is performed.

[0037] Reference Figure 2 , the adjustment limit assembly 3 includes: a positioning plate 31, which is horizontally arranged in the box body 1 and vertically fixed to the side wall of the inner plate 10 of the box body 1; the wafer connector 32 is slidably arranged on the positioning plate 31; the wafer connector 32 is suitable for horizontal movement along the length direction of the positioning plate 31 to approach or move away from the inner plate 10. One end of the connecting rod 11 is fixed to the side wall of the wafer connector 32, and the connecting rod 11 is suitable for driving the wafer connector 32 to move horizontally. The two linkage mechanisms 33 are respectively slidably arranged on both sides of the positioning plate 31, and the linkage mechanism 33 is linked with the wafer connector 32. Among them, When the wafer connector 32 is located closest to the side wall of the inner plate 10, the two linkage mechanisms 33 abut against each other. The desiccant inside the abutting linkage mechanisms 33 is squeezed.

[0038] Reference Figure 6, the wafer connector 32 gradually moves away from the inner plate 10 until the connecting rod 37 and the wafer connector 32 are perpendicular to each other, and the wafer connector 32 pushes the two linkage mechanisms 33 to move to both sides, and the distance between the two linkage mechanisms 33 reaches the maximum value. At this time, the push-up member 36 is suitable for pushing a support sheet 2 located above to move it upward. Figure 6 In the figure, the wafer connector 32 with solid lines is in a state where the wafer connector 32 and the connecting rod 37 are perpendicular to each other.

[0039] Reference Figure 6 , when the wafer connector 32 continues to move away from the inner plate 10, until the distance between the wafer connector 32 and the inner plate 10 reaches the maximum distance; the wafer connector 32 is suitable for driving the two linkage mechanisms 33 to gradually move toward each other. In this state, the wafer is placed horizontally into the box body 1, until the wafer is inserted into the limiting groove 320, the wafer connector 32 is suitable for clamping the wafer, and after the wafer is limited by the wafer connector 32, the connecting rod 11 is pulled to make the wafer connector 32 move horizontally toward the inner plate 10. The wafer connector 32 is suitable for pulling the wafer to move horizontally into the box body 1 until the wafer is abutted by the positioning block 35. At this time, the positioning block 35 is suitable for limiting the wafer to prevent it from continuing to move toward the inner plate 10. As the wafer connector 32 continues to move toward the inner plate 10, the wafer detaches from the wafer connector 32. When the wafer connector 32 moves away from the inner plate 10, it is suitable for pushing the two linkage mechanisms 33 to move away from each other. Figure 6 In the figure, the wafer connector 32 with a dotted line is the state where the wafer connector 32 is at the farthest distance from the inner plate.

[0040] Optionally, the bottom wall of the positioning plate 31 is provided with two parallel grooves 310, one linkage mechanism 33 corresponds to one parallel groove 310, and the linkage mechanism 33 is slidably disposed in the parallel groove 310. The linkage mechanism 33 moves horizontally along the width direction of the positioning plate 31, and the wafer connector 32 moves horizontally along the length direction of the positioning plate 31.

[0041] Reference Figure 3 The linkage mechanism 33 includes: a limit bar 34, which is slidably arranged in the parallel groove 310; the two limit bars 34 are parallel to each other, and the two limit bars 34 are offset from each other. A positioning block 35, the positioning block 35 is fixed to the outer end of the limit bar 34; a push-up member 36, the push-up member 36 is fixed to the upper end of the positioning block 35, and the push-up member 36 and the limit bar 34 are parallel to each other; the push-up member 36 is arranged under the corresponding support sheet 2; a connecting rod 37, the two ends of the connecting rod 37 are respectively hinged to the push-up member 36 and the wafer connector 32.

[0042] Further, the lifting member 36 includes: a lifting block 38 and a linkage plate 39, wherein the lifting block 38 is fixed to the upper end of the positioning block 35, and a slope is provided on the side of the lifting block 38 close to the support sheet 2; when the positioning block 35 moves horizontally toward the direction of the support sheet 2, the slope is suitable for pushing the support sheet 2 to move upward. The linkage plate 39 is fixed to the other side of the lifting block 38, and the linkage plate 39 is hollow inside; wherein, when the wafer connector 32 moves horizontally toward the inner plate 10, it is suitable for driving the two linkage plates 39 to move toward each other until the two relatively arranged linkage plates 39 are plugged into each other. Further, the width of one linkage block 39 is smaller than that of another linkage plate 39, that is, when the two linkage plates 39 move toward each other, one linkage plate 39 is suitable for inserting into the inside of the other linkage plate 39.

[0043] Preferably, the linkage plate 39 is hollow inside and has a plurality of air holes on its outer wall, and a desiccant is placed inside the linkage plate 39. A left extrusion bar is provided inside the linkage plate 39 on the left, and a right extrusion bar is provided inside the linkage plate 39 on the right, and the left extrusion bar and the right extrusion bar are mutually offset. When the two linkage plates 39 move toward each other and are plugged into each other, the left extrusion bar is suitable for being inserted into the linkage plate 39 on the right, and the right extrusion bar is suitable for being inserted into the linkage plate 39 on the left, so as to squeeze the desiccant inside the linkage plate 39, and the desiccant is squeezed and crushed, which can increase the surface area of ​​the desiccant, thereby improving the drying effect.

[0044] Reference Figure 3 The wafer connector 32 has a limiting groove 320 on one side close to the wafer, and the wafer is suitable for being inserted into the limiting groove 320; after the wafer is inserted into the limiting groove 320, the wafer connector 32 is suitable for limiting the wafer, and when the wafer connector 32 moves toward the inner plate 10, it is suitable for pulling the wafer to be inserted into the box body 1. After the wafer is horizontally inserted into the limiting groove 320, the wafer connector 32 moves horizontally toward the inner plate 10 to pull the wafer to move into the box body 1.

[0045] Optionally, the positioning block 35 is provided with an arc surface on one side close to the wafer, and the arc surface is suitable for fitting with the outer wall of the wafer. The arc surface increases the contact area between the positioning block 35 and the wafer, so that the contact between the wafer and the positioning block 35 changes from line contact to surface contact, thereby avoiding damage to the wafer when it abuts against the positioning block 35.

[0046] Some embodiments provide a wafer production device carrier, including: A box body 1 is hollow and has an opening on one side, through which the wafer is suitable for being inserted into the box body 1; support plates 2 are arranged on the inner walls of the box body 1 on both sides for lifting, and every two support plates 2 are arranged opposite to each other; an adjustment limit assembly 3 is horizontally fixed on the side wall of the inner plate 10 of the box body 1, one adjustment limit assembly 3 corresponds to two support plates 2, and the adjustment limit assembly 3 is linked with the two support plates 2; wherein, when placing the wafer, the wafer is horizontally inserted into the box body 1 until it is limited by the wafer connector 32 of the adjustment limit assembly 3; the wafer connector 32 moves horizontally toward the inner plate 10 to pull the wafer to slide horizontally into the box body 1; when taking out the wafer, the wafer connector 32 moves outward, and the linkage mechanism 33 of the adjustment limit assembly 3 moves horizontally toward the side wall of the box body 1 to push the pair of support plates 2 located above to move upward.

[0047] Furthermore, the adjustment limit assembly 3 includes: a positioning plate 31, which is horizontally arranged in the box body 1 and vertically fixed to the side wall of the inner plate 10 of the box body 1; a wafer connector 32, which is slidably arranged on the positioning plate 31; the two linkage mechanisms 33 are respectively slidably arranged on both sides of the positioning plate 31, and the linkage mechanisms 33 are linked with the wafer connector 32; wherein, when the wafer connector 32 moves in a direction away from the inner plate 10, it is suitable for pushing the two linkage mechanisms 33 to move away from each other.

[0048] Furthermore, the linkage mechanism 33 includes: a limit bar 34, which is slidably arranged on the lower bottom surface of the positioning plate 31; a positioning block 35, which is fixed to the outer end of the limit bar 34; a push-up member 36, which is fixed to the upper end of the positioning block 35, and the push-up member 36 and the limit bar 34 are parallel to each other; a connecting rod 37, and the two ends of the connecting rod 37 are respectively hinged on the push-up member 36 and the wafer connector 32.

[0049] Some embodiments provide a method for operating a wafer production device carrier, including: When placing the wafer, the wafer is horizontally inserted into the box body 1 until it is limited by the wafer connector 32 of the adjustable limit assembly 3; The wafer connector 32 moves horizontally toward the inner plate 10 to pull the wafer horizontally into the box body 1 until the wafer contacts the positioning block 35; When the wafer is taken out, the wafer connector 32 moves outward, and the linkage mechanism 33 of the regulating limit assembly 3 moves horizontally toward the side wall of the box body 1 to push the pair of support plates 2 located above to move upward.

[0050] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0052] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0053] In the above discussion, unless otherwise stated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0054] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer production device carrier, characterized in that: include: Box body (1); A plurality of pairs of support plates (2) are located on the inner walls of both sides of the box body (1) and form a plurality of layers of wafer placement positions, wherein the support plates (2) and the inner walls of the box body (1) are arranged to slide up and down; A plurality of adjustment and limiting components (3) respectively correspond to corresponding wafer placement positions, and include: a wafer plug-in component (32), and linkage mechanisms (33) for support plates (2) located on both sides of the wafer plug-in component (32); The wafer is inserted into or removed from the wafer placement position, so that the wafer connector (32) moves backward or forward, triggering the linkage mechanism (33) to drive the support plate (2) above the wafer placement position to adjust the layer gap, so as to avoid contamination of wafers adjacent to the wafer being taken and placed.

2. The wafer production device carrier according to claim 1, characterized in that: The adjustment and limiting assembly (3) comprises: a positioning plate (31) which is horizontally arranged in the box body (1) and vertically fixed to the side wall of the inner plate (10) of the box body (1); The wafer plug-in component (32) is slidably arranged on the positioning plate (31); The two linkage mechanisms (33) are respectively slidably arranged on two sides of the positioning plate (31), and the linkage mechanisms (33) are linked with the wafer connector (32); When the wafer connector (32) moves in a direction away from the inner plate (10), it is suitable for pushing the two wafer connectors (32) to move away from each other.

3. The wafer production device carrier according to claim 2, characterized in that: The bottom wall of the positioning plate (31) is provided with two parallel grooves (310), one linkage mechanism (33) corresponds to one parallel groove (310), and the linkage mechanism (33) is slidably disposed in the parallel groove (310).

4. The wafer production device carrier according to claim 3, characterized in that: The linkage mechanism (33) comprises: a limiting bar (34) which is slidably disposed in the parallel groove (310); A positioning block (35), the positioning block (35) being fixed to the outer end of the limiting strip (34); A push-up member (36), wherein the push-up member (36) is fixed to the upper end of the positioning block (35), and the push-up member (36) and the limiting strip (34) are parallel to each other; A connecting rod (37), wherein two ends of the connecting rod (37) are respectively hinged on the pushing component (36) and the wafer plug-in component (32).

5. The wafer production device carrier according to claim 4, characterized in that: The push-up member (36) comprises: a lifting block (38) and a linkage plate (39); the lifting block (38) is fixed to the upper end of the positioning block (35), and a slope is provided on a side of the lifting block (38) close to the support plate (2); The linkage plate (39) is fixed on the other side of the lifting block (38), and the interior of the linkage plate (39) is hollow; When the wafer connector (32) moves horizontally toward the inner plate (10), it is suitable for driving the two linkage plates (39) to move toward each other until the two linkage plates (39) disposed opposite to each other are plugged into each other.

6. The wafer production device carrier according to claim 5, characterized in that: The linkage plate (39) is hollow inside and has a plurality of air holes on its outer wall. A desiccant is placed inside the linkage plate (39).

7. The wafer production device carrier according to claim 2, characterized in that: A limiting groove (320) is provided on a side of the wafer plug-in component (32) close to the wafer, and the wafer is suitable for being inserted into the limiting groove (320); After the wafer is horizontally inserted into the limiting groove (320), the wafer connector (32) moves horizontally toward the inner plate (10) to pull the wafer into the box body (1).

8. The wafer production device carrier as claimed in claim 4, characterized in that: A circular arc surface is provided on a side of the positioning block (35) close to the wafer, and the circular arc surface is suitable for fitting with the outer wall of the wafer.

9. A wafer production device carrier, characterized in that: include: A box body (1) is hollow and has an opening on one side, and a wafer is suitable for being inserted into the box body (1) through the opening; Support plates (2) are arranged on the inner walls of both sides of the box body (1) in a lifting manner, and every two of the support plates (2) are arranged opposite to each other; An adjusting limit assembly (3) is horizontally fixed to the side wall of the inner plate (10) of the box body (1), one adjusting limit assembly (3) corresponds to two support sheets (2), and the adjusting limit assembly (3) is linked to the two support sheets (2); When placing a wafer, the wafer is horizontally inserted into the box body (1) until it is limited by the wafer connector (32) of the adjustable limit assembly (3); The wafer connector (32) moves horizontally toward the inner plate (10) to pull the wafer to slide horizontally into the box body (1); When the wafer is taken out, the wafer connector (32) moves outwards, and the linkage mechanism (33) of the regulating limit assembly (3) moves horizontally toward the side wall of the box body (1), so as to push the pair of support plates (2) located above to move upwards.

10. The wafer production device carrier according to claim 9, characterized in that: The adjustment and limiting assembly (3) comprises: a positioning plate (31) which is horizontally arranged in the box body (1) and vertically fixed to the side wall of the inner plate (10) of the box body (1); A wafer connector (32) which is slidably disposed on the positioning plate (31); The two linkage mechanisms (33) are respectively slidably arranged on two sides of the positioning plate (31), and the linkage mechanisms (33) are linked with the wafer connector (32); When the wafer connector (32) moves in a direction away from the inner plate (10), it is suitable for pushing the two wafer connectors (32) to move away from each other.

11. The wafer production device carrier according to claim 10, characterized in that: The linkage mechanism (33) comprises: a limit bar (34) which is slidably arranged on the lower surface of the positioning plate (31); A positioning block (35), the positioning block (35) being fixed to the outer end of the limiting strip (34); A push-up member (36), wherein the push-up member (36) is fixed to the upper end of the positioning block (35), and the push-up member (36) and the limiting strip (34) are parallel to each other; A connecting rod (37), wherein two ends of the connecting rod (37) are respectively hinged on the pushing component (36) and the wafer plug-in component (32).

12. A method for operating a wafer production device carrier, using the wafer production device carrier according to any one of claims 1-8 or 9-11, characterized in that: include: When placing the wafer, the wafer is horizontally inserted into the box body (1) until it is limited by the wafer plug-in component (32) of the adjustable limit assembly (3); The wafer connector (32) moves horizontally toward the inner plate (10) to pull the wafer horizontally into the box body (1) until the wafer abuts against the positioning block (35); When the wafer is taken out, the wafer connector (32) moves outwards, and the linkage mechanism (33) of the regulating limit assembly (3) moves horizontally toward the side wall of the box body (1), so as to push the pair of support plates (2) located above to move upwards.

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