Power module and electrical product

Abstract

The embodiment of the invention provides a power module. The power module comprises a circuit substrate; a heating element provided on the circuit board; one end of each pin is arranged on the circuit substrate, and the other end of each pin extends towards the direction far away from the circuit substrate; and a pin connector provided on the circuit board so as to surround the pin, the pin connector having a first surface, a second surface, and a side surface connecting the first surface and the second surface, the first surface being in contact with the circuit board, and the second surface facing the first surface in the extension direction of the pin; the heating element, the side surface of the pin connector and at least one part of the circuit substrate are covered and sealed by thermosetting resin through a transfer molding process; wherein at least one part of the side surface of the pin connector is an inclined surface, and the inclined surface is close to the heating element side and extends towards the direction of the circuit substrate. Therefore, under the condition that the pins are not prevented from being inserted into the pin connector, fastening of the pins and the pin connector can be achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductors, and in particular to a power module and an electrical product. Background Art

[0002] Conventional semiconductor devices are formed as follows: power semiconductor elements are mounted on a circuit substrate. Power semiconductor devices, such as power modules, operate at high currents and high voltages. Other electronic components, such as pins, are also provided on the circuit substrate and are connected to the circuit substrate by welding. The electronic components are sealed on the circuit substrate by pouring thermosetting resin.

[0003] In the above-mentioned conventional structure, in order to more stably fix the pins soldered on the circuit board to the circuit board, a cylindrical pin connector is provided around the pins.

[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Summary of the invention

[0005] The inventors have discovered that, in the above-mentioned prior art, although a cylindrical pin connector with a certain thickness is disclosed, the size of the hole for inserting the pin in the cylindrical pin connector is difficult to manage. When the hole is narrow, the pin will be difficult to insert, and when the hole is too large, the pin cannot be effectively fixed.

[0006] To address the above problem, when pouring thermosetting resin for sealing, a concave-convex structure can be set on the outer wall of the tubular pin connector as an anti-slip structure, but the thermosetting resin cannot be completely filled in the concave-convex, resulting in the tubular pin connector being unable to effectively fix the pins.

[0007] In order to solve one of the above problems or other similar problems, an embodiment of the present application provides a power module and an electrical product.

[0008] According to a first aspect of an embodiment of the present application, a power module is provided, the power module comprising:

[0009] Circuit board;

[0010] A heating element, which is arranged on the circuit substrate;

[0011] A pin, one end of which is disposed on the circuit substrate and the other end of which extends in a direction away from the circuit substrate; and

[0012] A pin connector, which is arranged on the circuit substrate in a manner of surrounding the pin, the pin connector having a first surface, a second surface, and a side surface connecting the first surface and the second surface, the first surface abuts against the circuit substrate, and the second surface is opposite to the first surface in the extending direction of the pin;

[0013] The heating element, the side surface of the pin connector, and at least a portion of the circuit substrate are molded, covered and sealed by a thermosetting resin through a transfer molding process;

[0014] In the above embodiment, at least a portion of the side surface of the pin connector is an inclined surface, and the inclined surface is close to the heating element and extends toward the circuit substrate.

[0015] According to a second aspect of the embodiment of the present application, the other end of the pin extends in a direction away from the circuit substrate and perpendicular to the circuit substrate.

[0016] According to a third aspect of the embodiment of the present application, at least one protrusion is provided on the inclined surface of the pin connector.

[0017] According to a fourth aspect of the embodiment of the present application, at least one protrusion is provided on the side surface of the pin connector.

[0018] According to a fifth aspect of the embodiment of the present application, the inclined surface of the pin connector is formed on the entire side from the second surface to the first surface of the pin connector; the pin connector is trapezoidal in a cross section perpendicular to the circuit substrate.

[0019] According to a sixth aspect of the embodiments of the present application, the heating element is a power element.

[0020] According to the seventh aspect of the embodiment of the present application, the power element is an insulated gate bipolar transistor (IGBT), a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET) MOSFET, or a gallium nitride high electron mobility transistor (GaN High Electron Mobility Transistor, GaN HEMT).

[0021] According to an eighth aspect of the embodiment of the present application, the pin connector and the thermosetting resin molding are both made of resin. In the above embodiment, the highest melting point of the resin used in the thermosetting resin molding is not higher than the lowest melting point of the resin used in the pin connector;

[0022] In the above embodiment, the pin connector is integrally formed with at least a portion of the pin by resin.

[0023] According to a ninth aspect of the embodiment of the present application, the pin has a first diameter wrapped by the pin connector and a second diameter protruding from the pin connector, wherein the first diameter is larger than the second diameter.

[0024] According to a tenth aspect of the embodiment of the present application, the second surface of the thermosetting resin molding is formed to be consistent with the second surface of the pin connector, or the second surface of the thermosetting resin molding is lower than the second surface of the pin connector.

[0025] According to an eleventh aspect of the embodiment of the present application, the thermosetting resin is injection molded by a transfer molding process.

[0026] According to a twelfth aspect of the embodiments of the present application, there is provided an electrical product, comprising the power module described in any one of the first to eleventh aspects above.

[0027] The beneficial effect of the present application is that in a power module, by setting at least a portion of the side surface of the pin connector as an inclined surface, after the circuit substrate and the electronic components are sealed by pouring a thermosetting resin, heat is generated during the operation of the power module at a large current and a high voltage. The heat causes the thermosetting resin to expand, thereby generating pressure applied to the above-mentioned inclined surface of the pin connector, thereby enabling the pin connector to be fastened to the circuit substrate without hindering the insertion and removal of the pins in the pin connector.

[0028] With reference to the following description and accompanying drawings, the specific embodiments of the present application are disclosed in detail, indicating the way in which the principles of the present application can be adopted. It should be understood that the embodiments of the present application are not limited in scope. Within the scope of the spirit and clauses of the appended claims, the embodiments of the present application include many changes, modifications and equivalents.

[0029] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0030] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0032] Figure 1 is a schematic diagram of a power module according to an embodiment of the present application;

[0033] Figure 2 is a schematic diagram of a pin connector of a power module according to an embodiment of the present application;

[0034] Figure 3 It is a partial schematic diagram of a structure of a power module according to an embodiment of the present application;

[0035] Figure 4 is another schematic diagram of a pin connector of a power module according to an embodiment of the present application;

[0036] Figure 5 is another schematic diagram of the power module according to an embodiment of the present application;

[0037] Figure 6 is another schematic diagram of a pin connector of a power module according to an embodiment of the present application;

[0038] Figure 7 It is another schematic diagram of the structure of the power module of the embodiment of the present application. DETAILED DESCRIPTION

[0039] With reference to the accompanying drawings, the above and other features of the present application will become apparent through the following description. In the description and the accompanying drawings, specific embodiments of the present application are specifically disclosed, which show some embodiments in which the principles of the present application can be adopted. It should be understood that the present application is not limited to the described embodiments. On the contrary, the present application includes all modifications, variations and equivalents falling within the scope of the attached claims.

[0040] In the embodiments of the present application, the terms "first", "second", etc. are used to distinguish different elements in terms of title, but do not indicate the spatial arrangement or temporal order of these elements, etc., and these elements should not be limited by these terms. The term "and / or" includes any one and all combinations of one or more of the associated listed terms. The terms "comprising", "including", "having", etc. refer to the presence of the stated features, elements, components or components, but do not exclude the presence or addition of one or more other features, elements, components or components.

[0041] In the embodiments of the present application, the singular forms "a", "the", etc. may include plural forms and should be broadly understood as "a kind" or "a type" rather than being limited to the meaning of "one"; in addition, the term "said" should be understood to include both singular and plural forms, unless the context clearly indicates otherwise. In addition, the term "according to" should be understood as "at least in part according to...", and the term "based on" should be understood as "at least in part based on...", unless the context clearly indicates otherwise.

[0042] Example 1

[0043] The present application embodiment provides a power module, Figure 1 is a schematic diagram of a power module according to an embodiment of the present application; Figure 1 As shown, the power module 10 includes: a circuit substrate 1, a heating element 2, a pin 3 and a pin connector 4, and one end of the heating element 2 and the pin 3 is arranged on the circuit substrate 1, for example, by soldering on the circuit substrate 1 through solder 6, as shown in FIG. Figure 1 As shown, the other end of the pin 3 extends in a direction away from the circuit substrate 1 , and other circuit components can be soldered on the heating element 2 .

[0044] Figure 2 FIG. 1 is a schematic diagram of a pin connector of a power module according to an embodiment of the present application, showing a situation where pin 3 and pin connector 4 are combined together. Figure 2 As shown, the pin connector 4 has a first surface (the lower surface shown in the figure) 101, a second surface (the upper surface shown in the figure) 102, and a side surface 103 connecting the first surface 101 and the second surface 102.

[0045] like Figure 1 and Figure 2 As shown, the pin connector 4 is arranged on the circuit substrate 1 in a manner of surrounding the pins 3 and having its first surface 101 abutting against the circuit substrate 1 , and the second surface 102 is opposite to the first surface 101 in the extending direction of the pins 3 (the up-down direction shown in the figure).

[0046] In the embodiments of the present application, Figure 1 and Figure 2 As shown, the side surface 103 of the pin connector 4 connecting the first surface 101 and the second surface 102 is an inclined surface, but only a part of the side surface 103 may be an inclined surface, and the side surface is formed to face the heating element 2 and extend toward the circuit substrate 1.

[0047] In the embodiment of the present application, the heating element 2, the side surface 103 of the pin connector 4, and at least a portion of the circuit substrate 1 are covered and sealed by the thermosetting resin mold 5 through a transfer molding process. As a result, due to the heat generated by the heating element, the thermosetting resin mold 5 undergoes thermal expansion, generating pressure in a direction that presses the inclined surface of the pin connector against the substrate side, thereby preventing the pin connector from falling off.

[0048] Figure 3 It is a partial schematic diagram of a power module according to an embodiment of the present application, illustrating the working principle of the power module 10 .

[0049] In the embodiments of the present application, Figure 3 As shown, through Figure 1 and Figure 2 In the configuration of the power module 10, when the thermosetting resin mold 5 is cast using the transfer molding process, the inclined surface of the pin connector 4 can fit more closely with the thermosetting resin mold 5, thereby avoiding the instability caused by incomplete injection molding. When the power module 10 is operated at a high current and high voltage, heat is generated and transferred to the thermosetting resin mold 5, causing the thermosetting resin mold 5 to expand, thereby generating pressure applied to the side 103 of the pin connector 4, and the direction of the pressure is as follows: Figure 3 As shown by the solid arrow in the middle, the pressure is further used to compress the pin connector 4 so that it and the pins 3 are more stably fastened to the circuit substrate 1.

[0050] In some embodiments, Figures 1 to 3 As shown, the inclined surface of the pin connector 4 is formed on the entire side from the second surface 102 to the first surface 101 of the pin connector 4, that is, the side surface 103 of the pin connector 4 is formed as an inclined surface, as shown in FIG. Figure 1 and Figure 2 As shown, the pin connector 4 is trapezoidal in a cross section perpendicular to the circuit substrate 1. As a result, the inclined surface can be enlarged, so that when the thermosetting resin molding (such as transfer molding) expands due to heat, the pressure generated toward the substrate can be reliably captured, thereby preventing the pin connector from falling off.

[0051] In some embodiments, Figures 1 to 3 As shown, the other end of the pin 3 (the upper end shown in the figure) extends in a direction away from the circuit substrate 1 and perpendicular to it, but the pin 3 can also be set to be not perpendicular to the circuit substrate 1, for example, extending in a curved shape away from the circuit substrate 1, and the present application does not limit this. As a result, the flexibility of the pin setting is improved, and it is convenient to connect with the external terminal.

[0052] Figure 4FIG. 1 is another schematic diagram of the pin connector of the power module of the embodiment of the present application, showing the pin and the pin connector being combined together. Figure 4 As shown, in this example, a protrusion 104 is provided on the inclined surface of the pin connector, and the cross-sectional shape of the protrusion 104 is set to be a square, but the cross-sectional shape of the protrusion 104 can also be set to other shapes, such as a triangle, and the present application does not impose any limitation on this.

[0053] In the above embodiment, the convex portion 104 may be provided as one or more convex portions, and the present application does not impose any limitation thereto.

[0054] In the above embodiment, the convex portion 104 is preferably disposed at 1 / 2 of the inclined surface, or close to the middle, thereby avoiding interference with the injection of the thermosetting resin mold 5 .

[0055] By providing the convex portion 104 on the inclined surface, the pressure of the thermosetting resin mold 5 on the inclined surface, i.e., the side surface 103 in the above embodiment, can be further increased, thereby enabling the pin connector 4 and the pins 3 surrounded by it to be more stably fixed on the circuit substrate 1. Moreover, in the present application, only one convex portion 104 is required to be provided to obtain the effect of tightening the pin connector 4.

[0056] In the above embodiment, the convex portion 104 is provided on the inclined surface of the pin connector 4 as an example, but the present application is not limited thereto. In the case where a portion of the pin connector 4 is an inclined surface and the other portion is not an inclined surface, the convex portion 104 may also be provided on the non-inclined surface, or the convex portion 104 may be provided on both the inclined surface and the non-inclined surface. That is, the convex portion 104 is provided on the side surface of the pin connector 4. Thus, when the thermosetting resin molding (such as transfer molding) expands due to heat, the pressure generated toward the substrate can be reliably captured, thereby preventing the pin connector from falling off.

[0057] Figure 5 FIG. 1 is another schematic diagram of the power module of an embodiment of the present application. Figure 5 As shown, in some embodiments, the side surface 103 of the pin connector 4 can be configured to have a portion formed as an inclined surface 106 , that is, the side surface of the pin connector 4 consists of a side surface 105 perpendicular to the substrate 1 and an inclined surface 106 inclined to the substrate 1 .

[0058] like Figure 5 As shown, the starting position of the inclined surface 106 can be 1 / 2 of the height between the first surface 101 and the second surface 102, or 1 / 3 of the height from the second surface, and the present application does not impose any limitation on this.

[0059] Figure 6FIG. 1 is another schematic diagram of the pin connector of the power module of the embodiment of the present application. Figure 6 As shown, in some embodiments, a protrusion 104 is provided on the vertical side 105 of the pin connector 4 . Similarly, the embodiment of the present application does not limit the shape and number of the protrusion 104 provided on the vertical side 105 .

[0060] Furthermore, in order to avoid hindering the injection of the thermosetting resin mold 5 , the convex portion 104 is preferably provided at a position not close to the starting position of the inclined surface 106 .

[0061] By providing the protrusion 104 and the inclined surface 106, when the heating element 2 is working, the thermosetting resin molding 5 can generate pressure on the protrusion 104 and the inclined surface 106 due to thermal expansion, thereby more stably fixing the pin connector 4 and the pins 3 surrounded by the pin connector 4 on the circuit substrate 1.

[0062] In the above embodiment, the heating element 2 is a power element, and the power element can be an insulated gate bipolar transistor (IGBT), a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET), or a gallium nitride high electron mobility transistor (GaN HEMT), etc., which generates heat during operation, and the present application does not impose any restrictions on this.

[0063] In some embodiments, the pin connector 4 and the thermosetting resin mold 5 are both formed of resin, and the highest melting point of the resin forming the thermosetting resin mold 5 is not higher than the lowest melting point of the resin forming the pin connector 4. Thus, it is possible to avoid the resin of the pin connector 4 from being melted or deformed during the injection molding process of the thermosetting resin mold 5.

[0064] In some embodiments, the pin connector 4 wraps around a portion of the pin 3, such as Figures 1 to 6 As shown, the diameter (e.g., first diameter) of the portion of the pin 3 wrapped by the pin connector 4 is greater than the diameter (e.g., second diameter) of the portion not wrapped. That is, the pin 3 has a first diameter wrapped by the pin connector 4 and a second diameter protruding from the pin connector 4, and the first diameter is greater than the second diameter. Thus, when the pin is fixed to the pin connector by resin molding, the pin connector can firmly fix the pin.

[0065] In the above embodiment, the first diameter is larger than the second diameter. However, the pin 3 may also be configured to have the same upper and lower diameters, that is, the first diameter is equal to the second diameter. This is not limited in the present application.

[0066] Figure 7 It is another schematic diagram of the structure of the power module of the embodiment of the present application.

[0067] In some embodiments, Figure 5 As shown, the second surface 501 of the thermosetting resin molding 5 is formed to be consistent with the second surface 102 of the pin connector 4 (for example, both are located on the same plane), but the present application is not limited thereto. In some embodiments, as shown in FIG. Figure 7 As shown, the second surface 501 of the thermosetting resin molding 5 may also be arranged to be lower than the second surface 102 of the pin connector 4 .

[0068] In the above embodiment, if Figure 5 As shown, the second surface 501 of the thermosetting resin molding 5 is the upper surface of the thermosetting resin molding 5 and is a horizontal plane. Similarly, the second surface 102 of the pin connector 4 is also the horizontal upper surface of the pin connector 4. The two are maintained on the same horizontal plane. Therefore, when the pin is connected to an external device, the resin of the thermosetting resin molding (such as transfer molding) 5 will not hinder and can be reliably connected.

[0069] In the above embodiment, if Figure 7 As shown, the upper surface of the thermosetting resin molding 5 located on the outside is slightly lower than the upper surface of the pin connector located on the inside. Therefore, while ensuring the clamping effect on the pin connector 4, it is possible to further prevent the second surface 501 of the thermosetting resin molding 5 from being higher than the second surface 102 of the pin connector 4 after injection molding, thereby causing obstruction to the insertion and removal of the pin 3 in the pin connector 4.

[0070] In the above embodiment, the thermosetting resin mold 5 is preferably formed by injection molding through a transfer molding process, and transfer molding is a method of allowing molten resin to flow into a mold, fill the resin in the molding part, and thermally cure it, thereby facilitating molding.

[0071] In the power module 10 provided by the above-mentioned embodiment of the present application, at least a portion of the side surface of the pin connector 4 is formed as an inclined surface, and the inclined surface is formed at a position facing the heating element 2 on the circuit substrate 1. Therefore, when the power module 10 is working, the heat generated causes the thermosetting resin molding 5 to expand and exerts pressure on the inclined surface of the pin connector to press it, thereby enabling the pin connector 4 and the pins 3 wrapped therein to be more stably fixed on the circuit substrate 1.

[0072] In addition, the second surface 501 of the thermosetting resin molding 5 is set to be consistent with or slightly lower than the second surface 102 of the pin connector 4, thereby preventing the thermosetting resin molding 5 from hindering the insertion and removal of the pin 3 in the pin connector after injection molding is completed.

[0073] Example 2

[0074] The embodiment of the present application provides an electrical product, which has the power module 10 described in Embodiment 1.

[0075] In Embodiment 1, the structure of the power module has been described in detail, and its contents are incorporated here, and the description is omitted here.

[0076] In the embodiments of the present application, there is no restriction on the type of electrical products. All electrical products that can use power modules are included in the scope of the electrical products in the embodiments of the present application. For the specific composition and function of the electrical product, reference can be made to the relevant technology, and the description is omitted here.

[0077] It is worth noting that the above is only an exemplary description of the present application, but the present application is not limited thereto, and appropriate modifications can be made based on the above embodiments. In addition, the above is only an exemplary description of each component, but the present application is not limited thereto, and the specific content of each component can also refer to the relevant technology; in addition, it can also be added Figures 1 to 7 Parts not shown, or reduced Figures 1 to 7 One or more components in .

[0078] The present application is described above in conjunction with specific implementation methods, but it should be clear to those skilled in the art that these descriptions are exemplary and are not intended to limit the scope of protection of the present application. Those skilled in the art can make various modifications and variations to the present application based on the spirit and principles of the present application, and these modifications and variations are also within the scope of the present application.

[0079] The preferred embodiments of the present application are described above with reference to the accompanying drawings. Many features and advantages of these embodiments are clear from this detailed description, and therefore the appended claims are intended to cover all such features and advantages of these embodiments that fall within their true spirit and scope. In addition, since many modifications and changes are easily conceivable to those skilled in the art, the embodiments of the present application are not intended to be limited to the precise structures and operations illustrated and described, but all suitable modifications and equivalents that fall within their scope may be covered.

Claims

1. A power module, characterized in that: The power module comprises: Circuit board; A heating element, which is arranged on the circuit substrate; A pin, one end of which is disposed on the circuit substrate and the other end of which extends in a direction away from the circuit substrate; and A pin connector, which is arranged on the circuit substrate in a manner of surrounding the pin, the pin connector having a first surface, a second surface, and a side surface connecting the first surface and the second surface, the first surface abuts against the circuit substrate, and the second surface is opposite to the first surface in the extending direction of the pin; The heating element, the side surface of the pin connector, and at least a portion of the circuit substrate are molded, covered and sealed by a thermosetting resin through a transfer molding process; Wherein, at least a portion of the side surface of the pin connector is an inclined surface, and the inclined surface is formed to face the heating element and extend toward the circuit substrate.

2. The power module according to claim 1, characterized in that: The other end of the pin extends in a direction away from the circuit substrate and perpendicular to the circuit substrate.

3. The power module according to claim 1, characterized in that: At least one protrusion is disposed on the inclined surface of the pin connector.

4. The power module according to claim 1, characterized in that: At least one protrusion is disposed on the side surface of the pin connector.

5. The power module according to claim 1, characterized in that: The inclined surface of the pin connector is formed on the entire side surface from the second surface to the first surface of the pin connector; the pin connector is trapezoidal in a cross section perpendicular to the circuit substrate.

6. The power module according to claim 1, characterized in that: The heating element is a power element.

7. The power module according to claim 6, characterized in that: The power element is an insulated gate bipolar transistor (IGBT), a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET), or a gallium nitride high electron mobility transistor (GaN HEMT).

8. The power module according to claim 1, characterized in that: The pin connector and the thermosetting resin molding are both made of resin, wherein the highest melting point of the resin used in the thermosetting resin molding is not higher than the lowest melting point of the resin used in the pin connector; The pin connector is integrally molded with at least a portion of the pin by resin.

9. The power module according to claim 8, characterized in that: The pin has a first diameter wrapped by the pin connector and a second diameter protruding from the pin connector, wherein the first diameter is greater than the second diameter.

10. The power module according to claim 8, characterized in that: The second surface of the thermosetting resin mold is formed to be consistent with the second surface of the pin connector, or the second surface of the thermosetting resin mold is lower than the second surface of the pin connector.

11. The power module according to any one of claims 1 to 10, characterized in that: The thermosetting resin is injection molded by a transfer molding process.

12. An electrical product, characterized in that: The electrical product comprises the power module according to any one of claims 1-11.

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