Modulator fault positioning method and device, computer equipment and storage medium

Abstract

The invention relates to a modulator fault positioning method and device, computer equipment and a storage medium. The method comprises the following steps: controlling optical frequency domain reflection equipment, and emitting first light to a modulator to be measured to obtain reflection spectrum data of the modulator to be measured; determining a fault area in the modulator to be detected according to the reflection spectrum data; controlling the laser to emit second light to the fault area of the modulator to be tested; controlling the light emission microscopic equipment to collect an irradiation image of the fault area under the second light; and determining a fault position in the fault area according to the illumination image. By adopting the method, the fault area in the modulator to be detected can be roughly determined through the optical frequency domain reflection equipment, and then the fault position in the modulator to be detected can be accurately determined through the optical emission microscopic equipment, so that the accuracy and the positioning efficiency of fault positioning in the modulator to be detected are improved.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a modulator fault location method, device, computer equipment and storage medium. Background Art

[0002] As the core device in space optical communication links, high-performance electro-optic modulators play an extremely important role in digital communication links and analog microwave photonic links. Electro-optic modulators based on lithium niobate materials are currently the most widely used modulation devices. Traditional lithium niobate devices are based on bulk lithium niobate substrates. Their waveguide structures are manufactured by Ti ion diffusion or proton exchange. The refractive index difference between the waveguide core and cladding is small, and the device size is large, making it difficult to achieve high integration. This problem is solved by the integrated photonic technology based on thin-film lithium niobate on insulators. Thanks to the high refractive index difference waveguide structure, thin-film lithium niobate modulators retain the huge advantages of lithium niobate materials in optical transmission, electro-optics, acousto-optics, nonlinear effects, etc., while having higher performance and smaller size than traditional bulk lithium niobate devices.

[0003] Thin-film lithium niobate modulators are composed of multiple components such as lithium niobate waveguides, optical fibers, and metal leads. Their manufacturing process has an important impact on the performance and stability of the modulator. Microscopic defects in the manufacturing process of chips and packaging may cause the modulator to degrade in performance or even fail after experiencing external stress. At present, research institutions at home and abroad have conducted a lot of research on improving the performance of thin-film lithium niobate modulators, but very little research on reliability. How to quickly characterize the defect location and characteristics of thin-film lithium niobate modulators and clarify their failure mechanisms are important for improving device reliability.

[0004] In conventional technology, a focused ion beam scanning electron microscope (FIB-SEM) is usually used to locate faults in lithium niobate modulators. Although this method can detect faults in lithium niobate modulators, it is time-consuming. Summary of the invention

[0005] Based on this, it is necessary to provide a modulator fault location method, device, computer equipment and storage medium that can improve the fault location efficiency in response to the above technical problems.

[0006] In a first aspect, the present application provides a modulator fault location method, comprising:

[0007] Controlling the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtaining reflection spectrum data of the modulator to be tested;

[0008] Determine the fault area in the modulator to be tested according to the reflection spectrum data;

[0009] Controlling the laser to emit a second light beam toward a faulty area of ​​the modulator to be tested;

[0010] Controlling the light emission microscope to collect an illumination image of the fault area under the second light;

[0011] According to the irradiated image, the fault position in the fault area is determined.

[0012] In one embodiment, determining a fault area in a modulator to be tested based on reflectance spectrum data includes:

[0013] Acquire standard spectrum data of the standard modulator under the first light;

[0014] According to the difference between the reflected spectrum data and the standard spectrum data, the fault area in the modulator to be tested is determined.

[0015] In one embodiment, determining the fault area in the modulator to be tested according to the difference between the reflected spectrum data and the standard spectrum data includes:

[0016] Determine the difference between the reflectance of the reflection spectrum data and the reflectance of the standard spectrum data at the same irradiation distance;

[0017] According to the difference, the abnormal irradiation distance is determined from each irradiation distance;

[0018] Based on the abnormal irradiation distance, the fault area in the modulator under test is determined.

[0019] In one embodiment, determining a fault location in a fault area according to an irradiated image includes:

[0020] The fault location in the fault area is determined based on the brightness of the pixels in the illuminated image.

[0021] In one embodiment, determining the fault location in the fault area according to the brightness of the pixel in the illumination image includes:

[0022] Determine the laser bright spot position according to the brightness of the pixel in the irradiated image;

[0023] The position of the laser bright spot is regarded as the fault position in the fault area.

[0024] In one embodiment, the irradiation frequency of the first light and the second light is the same.

[0025] In a second aspect, the present application also provides a modulator fault location device, comprising:

[0026] A data acquisition module, used for controlling the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtaining the reflection spectrum data of the modulator to be tested;

[0027] A region determination module, used to determine a fault region in the modulator to be tested according to the reflection spectrum data;

[0028] A laser control module, used for controlling the laser to emit a second light beam toward a faulty area of ​​the modulator to be tested;

[0029] An image acquisition module, used for image-controlling the light emission microscope to acquire an illumination image of the fault area under the second light;

[0030] The fault location module is used to determine the fault location in the fault area according to the irradiated image.

[0031] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0032] Controlling the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtaining reflection spectrum data of the modulator to be tested;

[0033] Determine the fault area in the modulator to be tested according to the reflection spectrum data;

[0034] Controlling the laser to emit a second light beam toward a faulty area of ​​the modulator to be tested;

[0035] Controlling the light emission microscope to collect an illumination image of the fault area under the second light;

[0036] According to the irradiated image, the fault position in the fault area is determined.

[0037] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the following steps are implemented:

[0038] Controlling the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtaining reflection spectrum data of the modulator to be tested;

[0039] Determine the fault area in the modulator to be tested according to the reflection spectrum data;

[0040] Controlling the laser to emit a second light beam toward a faulty area of ​​the modulator to be tested;

[0041] Controlling the light emission microscope to collect an illumination image of the fault area under the second light;

[0042] According to the irradiated image, the fault position in the fault area is determined.

[0043] In a fifth aspect, the present application further provides a computer program product, including a computer program, which implements the following steps when executed by a processor:

[0044] Controlling the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtaining reflection spectrum data of the modulator to be tested;

[0045] Determine the fault area in the modulator to be tested according to the reflection spectrum data;

[0046] Controlling the laser to emit a second light beam toward a faulty area of ​​the modulator to be tested;

[0047] Controlling the light emission microscope to collect an illumination image of the fault area under the second light;

[0048] According to the irradiated image, the fault position in the fault area is determined.

[0049] The above modulator fault location method, device, computer equipment and storage medium control the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtain the reflection spectrum data of the modulator to be tested; determine the fault area in the modulator to be tested based on the reflection spectrum data; control the laser to emit a second light beam to the fault area of ​​the modulator to be tested; control the light emission microscope to collect the illumination image of the fault area under the second light beam; and determine the fault position in the fault area based on the illumination image. The present application roughly determines the fault area in the modulator to be tested by using the optical frequency domain reflection device, and then accurately determines the fault position in the modulator to be tested by using the light emission microscope, thereby improving the accuracy and efficiency of fault location in the modulator to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0051] FIG1 is an application environment diagram of a modulator fault location method provided by this embodiment;

[0052] FIG2 is a schematic flow chart of a first modulator fault location method provided in this embodiment;

[0053] FIG3 is a schematic diagram of the structure of a modulator to be tested provided by this embodiment;

[0054] FIG4 is a connection diagram of an optical frequency domain reflectometer and a modulator to be tested provided by this embodiment;

[0055] FIG5 is a connection diagram of a light emission microscope device and a modulator to be tested provided in this embodiment;

[0056] FIG6 is a structural block diagram of a modulator fault locating device provided in this embodiment;

[0057] FIG. 7 is a diagram showing the internal structure of a computer device provided in this embodiment. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0059] The modulator fault location method provided in the embodiment of the present application can be applied in the application environment as shown in FIG1 . The computer device 100 controls the optical frequency domain reflection device 101 to emit a first light beam to the modulator 103 to be tested, and obtains the reflection spectrum data of the modulator to be tested; determines the fault area in the modulator to be tested according to the reflection spectrum data; controls the laser 104 to emit a second light beam to the fault area of ​​the modulator to be tested; controls the light emission microscope device 105 to collect the illumination image of the fault area under the second light beam; and determines the fault position in the fault area according to the illumination image. Among them, the optical frequency domain reflection device 101 includes a laser source 102, and the laser source 102 can emit a first light beam to the modulator 103 to be tested. The laser 104 can emit a second light beam to the modulator 103 to be tested, and the light emission microscope device 105 can collect the illumination image in the modulator 103 to be tested.

[0060] In an exemplary embodiment, as shown in FIG2 , a modulator fault location method is provided, which is described by taking the method applied to the computer device 100 in FIG1 as an example, and includes the following steps 201 to 205. Among them:

[0061] Step 201 : Control an optical frequency domain reflectometer to emit a first light beam to a modulator to be tested, and obtain reflectance spectrum data of the modulator to be tested.

[0062] The modulator to be tested may be a modulator to be tested for failure, and the modulator may be a thin-film lithium niobate modulator. Exemplarily, as shown in FIG3 , the schematic diagram of the structure of the modulator to be tested is a thin-film lithium niobate modulator, in which the yellow part is metal "gold", the dark blue part is a lithium niobate substrate, based on the lithium niobate substrate (the dark blue part in the figure), the waveguide structure is a lithium niobate waveguide (the light blue part in the figure), and the cladding includes silicon dioxide (the light gray part in the figure) and silicon (the dark gray part in the figure).

[0063] Among them, the optical frequency domain reflection device can be a device for roughly detecting the area where there is a fault inside the modulator to be tested. Exemplarily, such as a device using the optical frequency domain reflection (OFDR) technology. The first light can be a light of a preset wavelength, such as a laser light with a wavelength of 1550nm. The reflection spectrum data can be a spectrum reflected by each area in the modulator to be tested under the irradiation of the first light. Exemplarily, as shown in FIG4, the connection diagram of the optical frequency domain reflection device and the modulator to be tested, the steady-state power supply in the figure provides power support for the modulator to be tested, and the laser source in the optical frequency domain reflection device (the light source output end 1550 shown in the figure) is connected to the modulator to be tested, and the first light is emitted to the modulator to be tested; wherein, the laser source and the modulator to be tested are connected through a first optical fiber (optical fiber in the figure), an optical fiber adapter (flange) and a second optical fiber (the optical fiber incident end of the device in the figure).

[0064] Specifically, the computer device controls the laser source to-be-tested modulator in the optical frequency domain reflectometer to emit the first light, and the optical frequency domain reflectometer receives the optical fiber reflected by the to-be-tested modulator to form reflection spectrum data.

[0065] It should be noted that before controlling the optical frequency domain reflection device to emit the first light to the modulator to be tested, the optical frequency domain reflection device needs to be cleaned and calibrated, that is, fill in the preset center wavelength and the preset wavelength range according to the modulator to be tested, connect the calibration fiber to the optical frequency domain reflection device, and disconnect the calibration fiber according to the prompt of the optical frequency domain reflection device to complete the calibration. After the calibration is completed, connect the first optical fiber to the laser source in the optical frequency domain reflection device, connect the second optical fiber to the modulator to be tested, connect the first optical fiber to the second optical fiber through the optical fiber adapter, and ensure that the optical fiber end faces of the first optical fiber and the second optical fiber are clean and the interface matches (FC / APC).

[0066] Step 202: determining the fault area in the modulator to be tested according to the reflection spectrum data.

[0067] The fault area may be an area where abnormal data in the reflection spectrum data corresponds to the modulator to be tested.

[0068] Specifically, the difference between the reflected spectrum data and the standard spectrum data is determined, and the area in the modulator to be tested corresponding to the reflected spectrum data having the difference is used as the fault area in the modulator to be tested.

[0069] Step 203: Control the laser to emit a second light beam toward the fault area of ​​the modulator to be tested.

[0070] The irradiation frequency of the first light and the second light is the same.

[0071] Specifically, for each fault area, the computer device controls the laser to increase the bias current and emits a second light beam to the fault area of ​​the modulator to be tested. At this time, if there is a fault in the fault area of ​​the modulator to be tested, a bright spot will appear.

[0072] Step 204 , controlling the light emission microscope to collect an illumination image of the fault area under the second light.

[0073] Among them, the light emission microscope device can be a device for accurately determining whether there is a fault location in the fault area of ​​the modulator to be tested. Exemplarily, the light emission microscope device can be a micro-light microscope (Emission Microscope, EMMI). Exemplarily, as shown in FIG5, the light emission microscope device and the modulator to be tested are connected in a diagram, in which the voltage-stabilized power supply provides a bias voltage and current to the modulator to be tested, and the "1550nm light source" is a laser, and the laser emits a second light into the modulator to be tested. At the same time, the light emission microscope device collects the irradiation image in the modulator to be tested (micro-light microscope in the figure).

[0074] Specifically, the computer device controls the light emission microscope device to collect an image of each fault area under the second light, and uses the image as an illumination image. When there is a fault position in the fault area, there will be a bright spot in the illumination image.

[0075] It should be noted that before controlling the light emission microscope to collect the illumination image of the fault area under the second light, the modulator to be tested needs to be fixed on the antistatic box with antistatic tape to prevent the modulator to be tested from moving during wiring or probe station puncture. The modulator to be tested should be placed in the middle of the sample stage in the light emission microscope as much as possible. In this implementation, the light emission microscope can confirm whether it is placed horizontally. After adjusting the position of the modulator to be tested, since the modulator to be tested has pins, the stabilized power supply can be directly connected with a test line. In this embodiment, the corresponding lens magnification (such as "5X", i.e. 50 times) can be selected according to the size of the modulator to be tested, and the preset scanning direction, speed, voltage and current limit can be set.

[0076] Step 205: determine the fault location in the fault area according to the irradiated image.

[0077] Specifically, the computer device may determine the bright spot position in the irradiated image, and use the bright spot position as the fault position in the fault area.

[0078] The above modulator fault location method controls the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtains the reflection spectrum data of the modulator to be tested; determines the fault area in the modulator to be tested based on the reflection spectrum data; controls the laser to emit a second light beam to the fault area of ​​the modulator to be tested; controls the light emission microscope to collect the illumination image of the fault area under the second light beam; and determines the fault position in the fault area based on the illumination image. The present application roughly determines the fault area in the modulator to be tested by using the optical frequency domain reflection device, and then accurately determines the fault position in the modulator to be tested by using the light emission microscope, thereby improving the accuracy and efficiency of fault location in the modulator to be tested.

[0079] In some embodiments, determining a faulty area in the modulator to be tested based on reflected spectral data includes: acquiring standard spectral data of a standard modulator under a first light; and determining the faulty area in the modulator to be tested based on a difference between the reflected spectral data and the standard spectral data.

[0080] The standard modulator may be a modulator without any fault defect.

[0081] Specifically, the laser source in the optical frequency domain reflection device is controlled to emit a first light beam to the standard modulator, standard spectrum data of the standard modulator under the first light beam is obtained, and the fault area in the modulator to be tested is determined according to the difference between the reflection spectrum data and the standard spectrum data.

[0082] In some embodiments, a faulty area in the modulator to be tested is determined based on the difference between the reflected spectral data and the standard spectral data, including: determining the difference between the reflectivity of the reflected spectral data and the reflectivity of the standard spectral data at the same irradiation distance; determining an abnormal irradiation distance from each irradiation distance based on the difference; and determining the faulty area in the modulator to be tested based on the abnormal irradiation distance.

[0083] Specifically, for each irradiation distance, the difference between the reflectivity of the reflected spectrum data and the reflectivity of the standard spectrum data at the same irradiation distance is determined, and the reflectivity corresponding to the difference greater than the difference threshold is determined, and the irradiation distance corresponding to the reflectivity is taken as the abnormal irradiation distance, and the irradiation area corresponding to all abnormal irradiation distances is determined, and the irradiation area is determined to be the fault area in the modulator to be tested.

[0084] In this embodiment, the fault area in the modulator to be tested can be determined only by the difference between the reflected spectrum data and the standard spectrum data, thereby improving the accuracy and efficiency of determining the fault area.

[0085] In some embodiments, determining the fault position in the fault area according to the illumination image includes: determining the fault position in the fault area according to the brightness of pixels in the illumination image.

[0086] One optional implementation method may be to determine the pixel brightness of each pixel in the illuminated image, and use the position corresponding to the pixel with the highest pixel brightness (or the position corresponding to the pixel with brightness higher than a preset brightness threshold) as the fault position in the fault area.

[0087] Another optional implementation method may be to determine the fault position in the fault area based on the brightness of the pixels in the irradiated image, including: determining the laser bright spot position based on the brightness of the pixels in the irradiated image; and using the laser bright spot position as the fault position in the fault area.

[0088] Specifically, the pixel brightness of each pixel in the irradiated image is determined, and the position corresponding to the pixel with a brightness higher than a preset threshold is used as the laser bright spot position, and the laser bright spot position is used as the fault position in the fault area.

[0089] In this embodiment, the fault position in the fault area is determined by detecting the brightness of the pixels in the irradiated image. The operation is convenient and the efficiency of fault position determination is improved. At the same time, the fault position can be determined more accurately from the fault area, thereby improving the accuracy of fault position determination.

[0090] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0091] Based on the same inventive concept, the embodiment of the present application also provides a modulator fault location device for implementing the modulator fault location method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more modulator fault location device embodiments provided below can refer to the limitations of the modulator fault location method above, and will not be repeated here.

[0092] In an exemplary embodiment, as shown in FIG6 , a modulator fault location device is provided, comprising: a data acquisition module 10, a region determination module 11, a laser control module 12, an image acquisition module 13 and a fault location module 14, wherein:

[0093] The data acquisition module 10 is used to control the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtain the reflection spectrum data of the modulator to be tested;

[0094] The region determination module 11 is used to determine the fault region in the modulator to be tested according to the reflection spectrum data;

[0095] A laser control module 12, used for controlling the laser to emit a second light beam toward the fault area of ​​the modulator to be tested;

[0096] An image acquisition module 13, used for image-controlling the light emission microscope to acquire an illumination image of the fault area under the second light;

[0097] The fault location module 14 is used to determine the fault location in the fault area according to the irradiated image.

[0098] In one embodiment, the region determination module 11 in FIG. 6 is further used to obtain standard spectrum data of the standard modulator under the first light; and determine the fault region in the modulator to be tested according to the difference between the reflected spectrum data and the standard spectrum data.

[0099] In one embodiment, the area determination module 11 in Figure 6 is also used to determine the difference between the reflectivity of the reflection spectrum data and the reflectivity of the standard spectrum data at the same illumination distance; based on the difference, determine the abnormal illumination distance from each illumination distance; based on the abnormal illumination distance, determine the fault area in the modulator to be tested.

[0100] In one embodiment, the fault location module 14 in FIG. 6 is further configured to determine the fault location in the fault area according to the brightness of the pixels in the illumination image.

[0101] In one embodiment, the fault location module 14 in FIG. 6 is further used to determine the laser bright spot position according to the brightness of the pixel points in the irradiated image; and use the laser bright spot position as the fault position in the fault area.

[0102] Each module in the above modulator fault location device can be implemented in whole or in part by software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute operations corresponding to each module.

[0103] In an exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be shown in FIG7. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. The processor, the memory and the input / output interface are connected via a system bus, and the communication interface is connected to the system bus via the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, a modulator fault location method is implemented.

[0104] In an exemplary embodiment, a computer device is provided, which may be a terminal. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit, and an input device. The processor, the memory, and the input / output interface are connected via a system bus, and the communication interface, the display unit, and the input device are connected to the system bus via the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner may be implemented through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, a modulator fault location method is implemented. The display unit of the computer device is used to form a visually visible picture, which may be a display screen, a projection device, or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device shell, or an external keyboard, touchpad or mouse.

[0105] Those skilled in the art will understand that the structure shown in FIG. 7 is merely a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0106] In one embodiment, a computer device is further provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above method embodiments when executing the computer program.

[0107] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0108] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0109] It should be noted that the data involved in this application (including but not limited to data used for analysis, stored data, displayed data, etc.) are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0110] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0111] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0112] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A modulator fault location method, characterized in that: The method comprises: Controlling the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtaining reflection spectrum data of the modulator to be tested; Determining a fault area in the modulator to be tested according to the reflection spectrum data; Controlling the laser to emit a second light beam toward the fault area of ​​the modulator to be tested; Controlling a light emission microscope to collect an illumination image of the fault area under the second light; A fault position in the fault area is determined according to the irradiated image.

2. The method according to claim 1, characterized in that The step of determining the fault area in the modulator to be tested according to the reflection spectrum data comprises: Acquiring standard spectrum data of a standard modulator under the first light; According to the difference between the reflection spectrum data and the standard spectrum data, a fault area in the modulator to be tested is determined.

3. The method according to claim 2, characterized in that The step of determining the fault area in the modulator to be tested according to the difference between the reflection spectrum data and the standard spectrum data comprises: Determine the difference between the reflectivity of the reflection spectrum data and the reflectivity of the standard spectrum data at the same irradiation distance; determining an abnormal irradiation distance from each irradiation distance according to the difference; A fault area in the modulator to be tested is determined according to the abnormal irradiation distance.

4. The method according to claim 1, characterized in that: The step of determining the fault position in the fault area according to the irradiated image comprises: The fault position in the fault area is determined according to the brightness of the pixels in the illumination image.

5. The method according to claim 4, characterized in that The determining the fault position in the fault area according to the brightness of the pixels in the illumination image includes: Determining the laser bright spot position according to the brightness of the pixel points in the irradiated image; The laser bright spot position is used as the fault position in the fault area.

6. The method according to any one of claims 1 to 5, characterized in that: The first light and the second light have the same irradiation frequency.

7. A modulator fault location device, characterized in that: The device comprises: A data acquisition module, used for controlling the optical frequency domain reflection device to emit a first light beam to the modulator to be tested, and obtaining the reflection spectrum data of the modulator to be tested; A region determination module, used for determining a fault region in the modulator to be tested according to the reflection spectrum data; A laser control module, used for controlling the laser to emit a second light beam toward the fault area of ​​the modulator to be tested; An image acquisition module, used for image-controlling a light emission microscope to acquire an illumination image of the fault area under the second light; A fault location module is used to determine the fault location in the fault area according to the irradiated image.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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