Photosensitive component and preparation method thereof, camera module and electronic equipment

Abstract

The invention relates to a photosensitive component, a preparation method thereof, a camera module and electronic equipment. The photosensitive component comprises a circuit board; the photosensitive element is connected with the circuit board; the first adhesive layer is arranged on the circuit board; the first adhesive layer supports the supporting piece, and the supporting piece is located on the light path of the photosensitive element. According to the photosensitive assembly, the supporting piece is supported through the first adhesive layer, and miniaturization of the camera module is facilitated.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to a photosensitive component and a preparation method thereof, a camera module and an electronic equipment. Background Art

[0002] Camera modules are increasingly used in electronic devices. For example, both virtual reality devices and augmented reality devices need to obtain real-world information through camera modules, such as user gestures, eye movements, blinking, facial expressions, etc. In order to make electronic devices easier for users to wear, miniaturization is required.

[0003] The camera module usually includes a lens, a lens holder, a circuit board, and a photosensitive chip. The lens holder includes a bearing part and a supporting side wall. The bearing part is used to bear the lens. The supporting side wall is connected to the circuit board, and the bearing part is kept above the photosensitive chip through the support of the supporting side wall. In order to ensure the structural strength of the lens holder and meet the requirements of the molding process, the lens holder needs to have a certain wall thickness, which affects the miniaturization of the camera module. Summary of the invention

[0004] Based on the above problems, the present application provides a photosensitive component and a preparation method thereof, a camera module and an electronic device, wherein the supporting member is supported by a glue layer to achieve miniaturization of the camera module.

[0005] An embodiment of the present application provides a photosensitive component, including: a circuit board; a photosensitive element connected to the circuit board; a first adhesive layer arranged on the circuit board; a support member, the first adhesive layer supports the support member, and the support member is located on the optical path of the photosensitive element.

[0006] According to some embodiments of the present application, the thickness of the first adhesive layer is 0.1-0.8 mm.

[0007] According to some embodiments of the present application, the support member includes a bearing member, and the first adhesive layer supports the bearing member.

[0008] According to some embodiments of the present application, the carrier is provided with an avoidance structure, and the avoidance structure is used to avoid electronic components on the circuit board.

[0009] According to some embodiments of the present application, the carrier includes: a carrier body, provided with a light-through hole, wherein the light-through hole is located on the optical path of the photosensitive element; and a first baffle plate, arranged on the carrier body, wherein the first baffle plate is located outside the light-through hole.

[0010] According to some embodiments of the present application, the surface of the first baffle contacting the first adhesive layer is an inclined surface.

[0011] According to some embodiments of the present application, the carrier includes: a carrier body, provided with a light-through hole, wherein the light-through hole is located on the optical path of the photosensitive element; and a second baffle plate, arranged on the carrier body, wherein the second baffle plate is located at the outer periphery of the carrier body.

[0012] According to some embodiments of the present application, the surface of the second baffle contacting the first adhesive layer is an inclined surface.

[0013] According to some embodiments of the present application, the carrier includes: a carrier body, provided with a light-through hole, wherein the light-through hole is located on the optical path of the photosensitive element; and an extension portion, wherein the extension portion is located outside the light-through hole.

[0014] According to some embodiments of the present application, the support member further includes a first color filter, which is disposed on the carrier member and is located on an optical path of the photosensitive element.

[0015] According to some embodiments of the present application, the thickness of the carrier is 0.08-0.2 mm.

[0016] According to some embodiments of the present application, the carrier is provided with a first air outlet.

[0017] According to some embodiments of the present application, the first adhesive layer is provided with a second air outlet.

[0018] According to some embodiments of the present application, the support member includes a second color filter, and the first glue layer supports the second color filter.

[0019] According to some embodiments of the present application, the photosensitive component also includes a gold wire, one end of the gold wire is connected to the circuit board, the other end of the gold wire is connected to the photosensitive element, and the thickness of the first glue layer is greater than the height of the gold wire.

[0020] According to some embodiments of the present application, the circuit board is provided with a photosensitive element slot, and the photosensitive element is arranged in the photosensitive element slot; or the circuit board is provided with a photosensitive element hole, and the photosensitive element is arranged in the photosensitive element hole.

[0021] According to some embodiments of the present application, at least some of the electronic components on the circuit board are arranged on a side of the circuit board away from the first adhesive layer.

[0022] According to some embodiments of the present application, the photosensitive element includes a non-photosensitive area, and the photosensitive component also includes a second adhesive layer, the second adhesive layer is arranged in the non-photosensitive area, and the second adhesive layer contacts the support member.

[0023] An embodiment of the present application provides a method for preparing a photosensitive component, comprising:

[0024] Preparing a photosensitive component preform, including:

[0025] Electrically connect the photosensitive element to the circuit board;

[0026] Dispensing glue on the circuit board, or dispensing glue on the support preform, bonding the support preform to the circuit board, and positioning the support on the optical path of the photosensitive element;

[0027] Curing the glue between the support member preform and the circuit board into a first glue layer;

[0028] The photosensitive component preform is cut to obtain the photosensitive component.

[0029] According to some embodiments of the present application, the dispensing of glue on the circuit board or the dispensing of glue on the support member preform includes: forming a second air outlet hole in the dispensed glue.

[0030] According to some embodiments of the present application, the support member preform includes:

[0031] Supports;

[0032] A support portion connected to the support member, the support portion being provided with a third air outlet;

[0033] Wherein, when the support member preform is bonded to the circuit board, the support portion abuts against the circuit board;

[0034] The cutting of the photosensitive component preform includes: cutting off the supporting portion.

[0035] According to some embodiments of the present application, a gap is formed between the dispensed glue and the supporting portion.

[0036] According to some embodiments of the present application, bonding the support member preform to the circuit board includes: supporting the support member preform by a support jig; and removing the support jig after the glue between the support member preform and the circuit board is cured.

[0037] An embodiment of the present application provides a camera module including: the photosensitive component as described above; and a lens disposed on the support member.

[0038] An embodiment of the present application provides an electronic device, comprising the camera module as described above.

[0039] The support member of the photosensitive component of the present application does not need to be provided with a supporting side wall. The first adhesive layer is used for bonding the circuit board and the support member, and for supporting the support member, which is beneficial to reducing the height of the photosensitive component and realizing the miniaturization of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without exceeding the scope of protection required by the present application.

[0041] Figure 1 is a schematic diagram of an existing camera module;

[0042] Figure 2 is a schematic diagram of a camera module according to an embodiment of the present application;

[0043] Figure 3 is a schematic diagram of a carrier according to an embodiment of the present application;

[0044] Figure 4 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0045] Figure 5 is a schematic diagram of a carrier according to an embodiment of the present application;

[0046] Figure 6 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0047] Figure 7 is a schematic diagram of a carrier according to an embodiment of the present application;

[0048] Figure 8 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0049] Fig. 9 This is a schematic diagram of cutting a photosensitive component according to an embodiment of the present application;

[0050] Fig.10 is a schematic diagram of a carrier according to an embodiment of the present application;

[0051] Fig.11 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0052] Fig.12 is a schematic diagram of a camera module according to an embodiment of the present application;

[0053] Fig.13 This is a schematic diagram of cutting a photosensitive component according to an embodiment of the present application;

[0054] Fig.14 This is a schematic diagram of cutting a photosensitive component according to an embodiment of the present application;

[0055] Fig.15 is a schematic diagram of a photosensitive component with a gold wire according to an embodiment of the present application;

[0056] Fig.16 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0057] Fig.17 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0058] Fig.18 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0059] Fig.19 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0060] Fig. 20 is a schematic diagram of the photosensitive area and the non-photosensitive area of ​​an embodiment of the present application;

[0061] Fig.21 is a schematic diagram of a photosensitive component according to an embodiment of the present application;

[0062] Fig. 22 It is a schematic diagram of the preparation process of the photosensitive component of the embodiment of the present application;

[0063] Fig.23 is a schematic diagram of bubbles generated in an embodiment of the present application;

[0064] Fig.24 This is a schematic diagram of the first air outlet in the embodiment of the present application;

[0065] Fig.25 This is an exploded view of a photosensitive component preform in an embodiment of the present application;

[0066] Fig.26 This is a schematic diagram of a support prefabricated part according to an embodiment of the present application;

[0067] Fig. 27 This is an exploded view of a photosensitive component preform in an embodiment of the present application;

[0068] Fig.28 This is a schematic diagram of a support prefabricated part according to an embodiment of the present application;

[0069] Fig.29 This is a schematic diagram of setting a gap between the glue and the support part in the embodiment of the present application;

[0070] Fig.30 is a schematic diagram of a support fixture used in an embodiment of the present application;

[0071] Fig.31 It is a schematic diagram of an electronic device according to an embodiment of the present application;

[0072] Fig.32 It is a schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0073] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0074] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0075] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0076] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is lower in level than the second feature.

[0077] In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and examples of materials provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0078] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application.

[0079] like Figure 1 As shown, the existing camera module 100' includes a circuit board 1', a photosensitive chip 2', an electronic component 3', a lens holder 4', a filter 5' and a lens 6', wherein the photosensitive chip 2' and the electronic component 3' are arranged on the circuit board 1', the supporting side wall 41' of the lens holder 4' is bonded to the circuit board 1', and the filter 5' and the lens 6' are arranged on the lens holder 4'. Due to the structural strength requirements and molding process requirements of the lens holder 4', it is difficult to further reduce the wall thickness of the lens holder 4', which affects the miniaturization of the camera module.

[0080] like Figure 2 As shown, an embodiment of the present application provides a camera module 100, which includes a photosensitive component 10 and a lens 20. The lens 20 can be an existing lens. The lens 20 includes at least one lens, and the lens 20 is arranged on the photosensitive component 10.

[0081] The photosensitive assembly 10 includes a circuit board 1, a photosensitive element 2, a first adhesive layer 4 and a support member 5. At least one electronic element 3 is arranged on the circuit board 1.

[0082] The photosensitive element 2 is electrically connected to the circuit board 1. Optionally, the photosensitive element 2 is a photosensitive chip. The photosensitive element 2 is arranged on the front side of the circuit board 1. Figure 2 The top surface of the circuit board 1.

[0083] The first adhesive layer 4 is arranged on the circuit board 1, and the first adhesive layer 4 is formed by curing glue. The support member 5 is arranged on the first adhesive layer 4, and the support member 5 is located on the optical path of the photosensitive element 2. The first adhesive layer 4 supports the support member 5. The lens 20 is arranged on the support member 5, and the lens 20 is located on the optical path of the photosensitive element 2. The first adhesive layer 4 is located between the circuit board 1 and the support member 5, and the first adhesive layer 4 plays a bonding role for the circuit board 1 and the support member 5. The support member 5 does not need to be provided with a supporting side wall 41' of a traditional lens holder, and the first adhesive layer 4 supports the support member 5, and the circuit board 1, the first adhesive layer 4 and the support member 5 form a space for accommodating the photosensitive element 2. The thickness of the first adhesive layer 4 is set according to demand to reduce the height of the photosensitive component 10 and realize the miniaturization of the camera module 100. The thickness in this embodiment refers to the dimension in the vertical direction in the figure.

[0084] In some embodiments, the thickness of the first adhesive layer 4 is 0.1 to 0.8 mm. For example, the thickness of the first adhesive layer 4 is 0.1 mm, 0.15 mm, 0.5 mm or 0.8 mm. In the camera module with the same function, the first adhesive layer 4 of this embodiment is not limited by the molding process, and the thickness of the first adhesive layer 4 can be set to be less than the thickness of the supporting side wall 41' of the traditional lens holder to reduce the height of the photosensitive component 10.

[0085] like Figure 2 and Figure 3 As shown, in some embodiments, the support member 5 includes a carrier 51, the carrier 51 is located above the first adhesive layer 4, and the first adhesive layer 4 supports the carrier 51. The lens 20 is disposed on the carrier 51, for example, the lens 20 and the carrier 51 are bonded by glue. The carrier 51 is provided with a light hole 511, and the light hole 511 is located on the optical path of the photosensitive element 2. External light passes through the lens 20 and passes through the light hole 511 to be incident on the photosensitive element 2.

[0086] like Figure 3 and Figure 4 As shown, in some embodiments, the carrier 51 is provided with an avoidance structure 512, and at least part of the electronic components 3 on the circuit board 1 enters the avoidance structure 512, and the avoidance structure 512 is used to avoid the electronic components 3 on the circuit board 1, so as to further reduce the height of the photosensitive component 10. For example, the avoidance structure 512 is an avoidance groove provided on the bottom surface of the carrier 51, or the avoidance structure 512 is an avoidance hole penetrating the carrier 51.

[0087] like Figure 5 and Figure 6As shown, in some embodiments, the carrier 51 includes: a carrier body 513 and a first baffle 514. The light hole 511 is provided in the carrier body 513, and the light hole 511 is located on the optical path of the photosensitive element 2. The first baffle 514 is provided on the bottom surface of the carrier body 513, and the first baffle 514 is located outside the light hole 511. The first baffle 514 is integrally formed with the carrier body 513. Optionally, the first baffle 514 is generally in a closed loop structure, and the first baffle 514 is coaxially arranged with the light hole 511. When the carrier 51 is bonded to the circuit board 1, the first baffle 514 squeezes the glue between the carrier 51 and the circuit board 1 from the inside, and the first baffle 514 acts as a glue barrier to prevent the glue from contaminating the photosensitive element 2. The glue between the carrier 51 and the circuit board 1 is cured to form a first glue layer 4, and the first baffle 514 is in contact with the first glue layer 4.

[0088] Optionally, the surface of the first baffle plate 514 that contacts the first adhesive layer 4 is an inclined surface, so as to facilitate the first baffle plate 514 to squeeze the glue.

[0089] like Figure 7 and Figure 8 As shown, in some embodiments, the carrier 51 includes: a carrier body 513 and a second baffle 515. The second baffle 515 is disposed on the bottom surface of the carrier body 513, and the second baffle 515 is located at the outer periphery of the carrier body 513. The second baffle 515 and the carrier body 513 are integrally formed. When the carrier 51 is bonded to the circuit board 1, the second baffle 515 squeezes the glue between the carrier 51 and the circuit board 1 from the outside, so that the glue can better fill the gap between the carrier 51 and the circuit board 1. The glue between the carrier 51 and the circuit board 1 is cured to form a first glue layer 4, and the second baffle 515 is in contact with the first glue layer 4. The second baffle 515 can also increase the contact area between the carrier 51 and the first glue layer 4, so that the carrier 51 and the first glue layer 4 are more firmly bonded.

[0090] Optionally, the surface of the second baffle plate 515 in contact with the first adhesive layer 4 is an inclined surface, so as to facilitate the second baffle plate 515 to squeeze the glue.

[0091] like Fig. 9 As shown, according to the need, after the glue between the carrier 51 and the circuit board 1 is cured, Fig. 9 The middle dotted line cuts off the second baffle 515 to further reduce the size of the photosensitive component 10. Optionally, the second baffle 515 can be partially cut off according to needs.

[0092] Optionally, the carrier 51 includes: a carrier body 513 , a first baffle 514 and a second baffle 515 .

[0093] like Fig.10As shown, in some embodiments, the carrier 51 includes a carrier body 513 and an extension 516, the light hole 511 is provided in the carrier body 513, the extension 516 is provided at the bottom of the carrier body 513, and the extension 516 is located outside the light hole 511. Optionally, the extension 516 is integrally formed with the carrier body 513. Providing the extension 516 on the carrier body 513 can reduce the amount of glue filled between the carrier 51 and the circuit board 1, and can also improve the structural strength of the carrier 51. The extension 516 can also reduce the cavity space between the carrier 51, the first adhesive layer 4 and the circuit board. The smaller the cavity space, the less dust in the cavity, and the possibility of the presence of black spots in the camera module 100 is reduced.

[0094] like Figure 2 As shown, in some embodiments, the support member 5 further includes a first color filter 52, which is disposed in the light hole 511 of the carrier 51 and is located on the optical path of the photosensitive element 2. The first color filter 52 can be used to filter out interfering light.

[0095] In some embodiments, the color filter is integrated into the lens 20, and the carrier 51 supports the lens 20. Since the color filter does not need to be arranged in the light-through hole 511 of the carrier 51, the thickness of the carrier 51 can be further reduced. Optionally, the thickness of the carrier is 0.08 to 0.2 mm. For example, the thickness of the carrier is 0.08 mm, 0.1 mm, 0.15 mm, or 0.2 mm.

[0096] like Fig.11 and Fig.12 As shown, in some embodiments, the support member 5 includes a second color filter 53, and the first glue layer 4 contacts the second color filter 53 to support the second color filter 53. The lens 20 is on the second color filter 53. The support member 5 does not include the carrier 51, which reduces the cost of the photosensitive component 10. Since the second color filter 53 is made of transparent material, during the preparation process of the photosensitive component 10, the wall thickness of the glue between the second color filter 53 and the circuit board 1 can be observed through the second color filter 53, which is conducive to quality monitoring.

[0097] like Fig.13 As shown, in some embodiments, the photosensitive component 10 is prepared by using the second color filter 53 as a monomer. The second color filter 53 is bonded to the circuit board 1, and after the glue is cured to obtain the first glue layer 4, the photosensitive component preform is cut according to the required size to obtain the photosensitive component 10. Fig.13 The dashed line is the cutting line.

[0098] like Fig.14As shown, in some embodiments, the photosensitive component 10 is prepared with a second color filter preform 530. The second color filter preform 530 can be cut into a plurality of second color filters 53. The second color filter preform 530 is bonded to the circuit board 1, and after the glue is cured to obtain the first glue layer 4, the photosensitive component is cut off to obtain the photosensitive component 10. Fig.14 The middle dotted line is a cutting line. The second color filter preform 530 can be cut into a plurality of second color filters 53 , thereby improving the production efficiency of the photosensitive component 10 .

[0099] like Fig.15 As shown, in some embodiments, the photosensitive component 10 further includes a gold wire 6. The photosensitive element 2 is disposed on the top surface of the circuit board 1, one end of the gold wire 6 is connected to the circuit board 1, and the other end of the gold wire 6 is connected to the photosensitive element 2, so as to electrically connect the photosensitive element 2 to the circuit board 1. The thickness of the first adhesive layer 4 is greater than the height of the gold wire 6, and the first adhesive layer 4 protects the gold wire 6.

[0100] like Fig.16 As shown, in some embodiments, the circuit board 1 is provided with a photosensitive element slot 11. For example, the photosensitive element slot 11 is provided on the front side of the circuit board 1, and the photosensitive element 2 is provided in the photosensitive element slot 11 to reduce the height of the photosensitive component 10.

[0101] like Fig.17 As shown, in some embodiments, the circuit board 1 is provided with a photosensitive element hole 12, the photosensitive element hole 12 passes through the circuit board 1, and the photosensitive element 2 is arranged in the photosensitive element hole 12. A back plate 71 is arranged on the back of the circuit board 1, and the back plate 71 is made of metal material, such as a steel plate, which plays a role in improving structural strength and heat dissipation. The photosensitive element 2 is arranged on the back plate 71. In this embodiment, the bottom surface of the circuit board 1 is the back surface.

[0102] like Fig.18 As shown, in some embodiments, at least part of the electronic components 3 on the circuit board 1 are arranged on the side of the circuit board 1 away from the first adhesive layer 4, that is, at least part of the electronic components 3 are arranged on the back of the circuit board 1 to reduce the horizontal size of the photosensitive component. A molding part 72 is also arranged on the back of the circuit board 1, and the molding part 72 and the circuit board 1 are integrally molded with the circuit board 1 through a mold. The molding part 72 covers at least part of the electronic components 3 to protect the electronic components 3.

[0103] like Fig.19 As shown, in some embodiments, at least part of the electronic components 3 on the circuit board 1 are arranged on the back of the circuit board 1. A protective shell 73 is also arranged on the back of the circuit board 1. The protective shell 73 is made of metal, such as copper alloy. The protective shell 73 covers at least part of the electronic components 3 to protect the electronic components 3. The protective shell 73 also plays an electromagnetic shielding effect.

[0104] like Fig. 20and Fig.21 As shown, in some embodiments, the photosensitive element 2 includes a photosensitive area 21 and a non-photosensitive area 22, the photosensitive area 21 is an area where the photosensitive element 2 receives light, and the non-photosensitive area 22 is located outside the photosensitive area 21. The photosensitive component 10 also includes a second glue layer 8, which is disposed on the non-photosensitive area 22, and the second glue layer 8 contacts the support member 5 to support the support member 5. The second glue layer 8 is formed by curing the glue.

[0105] For example, the second adhesive layer 8 is in contact with the carrier 51. When the thickness of the carrier 51 is small, the structural strength of the carrier 51 is poor. The first adhesive layer 4 and the second adhesive layer 8 jointly support the carrier 51 to improve the bearing capacity of the photosensitive component 10. During preparation, glue is dispensed on the circuit board 1 and the non-photosensitive area 22. The glue between the carrier 51 and the circuit board 1 is cured to form the first adhesive layer 4, and the glue between the carrier 51 and the non-photosensitive area 22 is cured to form the second adhesive layer 8.

[0106] like Fig. 22 As shown, an embodiment of the present application provides a method for preparing a photosensitive component 10, comprising:

[0107] S1. Preparing a photosensitive component preform, including:

[0108] S11, attaching the electronic component 3 to the circuit board 1, the position of the electronic component 3 is set according to the requirements, the electronic component 3 can be set on the front side of the circuit board 1, and the electronic component 3 can also be set on the back side of the circuit board 1;

[0109] S12, electrically connecting the photosensitive element 2 to the circuit board 1, for example, placing the photosensitive element 2 on the front side of the circuit board 1, and connecting the photosensitive element 2 to the circuit board 1 through a gold wire;

[0110] S13, dispensing glue on the circuit board 1, or dispensing glue on the support member preform 50, for example, applying glue 40 on the circuit board 1 by a glue dispenser;

[0111] The support preform 50 is bonded to the circuit board 1, and the support preform 50 is cut to obtain the support 5. When the support preform 50 is bonded to the circuit board 1, the support 5 is ensured to be located on the optical path of the photosensitive element 2; S14, the glue 40 between the support preform 50 and the circuit board 1 is solidified into a first glue layer 4, for example, the glue 40 is heated to solidify the glue 40;

[0112] The support member preform 50 is provided with a support portion 501. During the preparation of the photosensitive component 10, for example, glue is dispensed on the circuit board 1 to bond the support member preform 50 to the circuit board 1. The support member preform 50 squeezes the glue 40 from above, and the support portion 501 abuts against the circuit board 1. Since the glue 40 has not yet solidified, the support portion 501 supports the support member 5. The support member preform 50 is cut to obtain the support member 5 after the support portion 501 is cut. For example, the support member preform 50 can be cut into a plurality of support members 5 to improve the production efficiency of the photosensitive component 10.

[0113] Optionally, the preparation steps of the photosensitive component preform can be adjusted in order as needed. For example, the support preform 50 can be bonded to the circuit board 1 first, and then the photosensitive element 2 can be electrically connected to the circuit board 1.

[0114] S2. Cut the photosensitive component preform according to the set size to obtain the photosensitive component 10.

[0115] like Fig.23 As shown, bubbles 200 may be generated at the corners of the contact position between the support preform 50 and the glue 40, which affects the bonding reliability and leads to poor appearance after cutting. In the process of the glue 40 curing into the first glue layer 4, the bubbles 200 may expand, affecting the performance of the first glue layer 4, and the bubbles 200 may also cause the glue to explode, causing the glue to contaminate the photosensitive element 2.

[0116] like Fig.24 and Fig.25 As shown, in some embodiments, a first vent hole 502 is provided on the support preform 50 , and the first vent hole 502 passes through the upper and lower surfaces of the support preform 50 , so that the cavity between the support preform 50 and the circuit board 1 is connected to the outside.

[0117] Optionally, there are multiple first air outlet holes 502, and the positions of the first air outlet holes 502 are set according to requirements. For example, glue is dispensed on the circuit board 1, and the pattern of the glue 40 on the circuit board 1 is roughly in a "mouth" shape. The support member preform 50 is placed on the glue 40, and the first air outlet hole 502 is located between the glue 40 and the support part 501.

[0118] Optionally, after the support portion 501 is cut off, the first air outlet 502 is retained on the support member 5 , for example, the first air outlet 502 is retained on the carrier 51 . In another optional embodiment, the first air outlet 502 is not retained on the carrier 51 . Fig.25 The dotted line in FIG. 5 is the cutting line of the support member preform 50 .

[0119] like Fig.25As shown, in some embodiments, the support member preform 50 is roughly rectangular, one side of the circuit board 1 is connected to a flexible board 13 (FPC), and one side of the support member preform 50 with the flexible board 13 and the side of the circuit board 1 close to the flexible board 13 are inconvenient to cut. The edge of the support member preform 50 close to the flexible board 13 is not provided with a support portion 501, and the support portions 501 are provided at the other three edges of the support member preform 50, and the support portions 501 may also be provided between adjacent support members 5.

[0120] In step S13, dispensing glue on the circuit board 1 or dispensing glue on the support member preform 50 includes: forming a second air outlet 41 in the dispensed glue 40. Optionally, the second air outlet 41 is provided at a portion of the glue 40 close to the flexible board 13. The second air outlet 41 is provided so that the cavity between the support member preform 50, the circuit board 1 and the glue 40 is connected to the outside.

[0121] The glue 40 is cured to form a first glue layer 4 , and a second air outlet 41 is retained in the first glue layer 4 .

[0122] like Fig.26 As shown, in some embodiments, a hollow structure is provided in the support portion 501 of the support member preform 50, and the hollow structure serves as the third air outlet 503. Optionally, the support portion 501 includes legs 5011, for example, four legs 5011 are respectively located at the four corners of the support member preform 50, and the hollow structure between adjacent legs 5011 is the third air outlet 503. The third air outlet 503 and the second air outlet 41 cooperate to avoid bubbles 200 from appearing at the edge of the glue 40 when the support member preform 50 is bonded to the circuit board 1. In step S2, cutting the photosensitive component preform includes cutting off the support portion 501 to obtain the support member 5.

[0123] Optionally, the support portion 501 may also include at least three legs 5011 , and the positions of the legs 5011 may be set according to requirements.

[0124] like Fig. 27 and Fig.28 As shown, in some embodiments, the legs 5011 of the support portion 501 include a first support leg 5012 and at least two second support legs 5013. For example, the first support leg 5012 is located on the side of the support member preform 50 close to the flexible board 13, and the second support leg 5013 is located on the side of the support member preform 50 away from the flexible board 13. The hollow structure between the first support leg 5012 and the second support leg 5013 and the hollow structure between adjacent second support legs 5013 can be used for gas outlet.

[0125] Optionally, the first support leg 5012 corresponds to the second air outlet 41. When the support preform 50 is bonded to the circuit board 1, the first support leg 5012 is located in the second air outlet 41 to reduce the size of the support preform 50. The first support leg 5012 can be a trapezoidal block, and the cross-sectional area gradually decreases from top to bottom to ensure that there is a gap between the first support leg 5012 and the hole wall of the second air outlet 41, so that the cavity between the support preform 50 and the circuit board 1 and the glue 40 is connected to the outside. Fig.29 As shown, in some embodiments, the size of the support member preform 50 is appropriately increased, and when the support member preform 50 is bonded to the circuit board 1, a gap is formed between the dispensed glue 40 and the support portion 501 to reduce the contact between the glue 40 and the support portion 501 and reduce the possibility of bubbles generated at the edge of the glue 40.

[0126] like Fig.30 As shown, in some embodiments, in step S13, the support member preform 50 is bonded to the circuit board 1, including: supporting the support member preform 50 by a supporting fixture 300 to prevent the support member preform 50 from excessively squeezing the glue.

[0127] For example, the support jig 300 includes a support jig body 301 and pillars 302. The circuit board 1 is placed on the support jig body 301. The pillars 302 pass through the circuit board 1. When the support preform 50 is bonded to the circuit board 1, the support preform 50 abuts against the pillars 302. After the glue between the support preform 50 and the circuit board 1 is cured, the support jig 300 is removed.

[0128] like Fig.31 and Fig.32 As shown, an embodiment of the present application provides an electronic device 400, and the electronic device 400 includes the camera module 100 as described above. Optionally, the electronic device of this embodiment can be a mobile phone, a tablet computer, a wearable device, a television, a vehicle, a monitoring device, etc., and this application is not limited to this. The camera module 100 cooperates with the electronic device to realize the image acquisition and reproduction function of the target object. The number and position of the camera module 100 are set according to the needs.

[0129] The embodiments of the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core ideas of the present application. Therefore, changes or deformations made by those skilled in the art based on the ideas of the present application, the specific implementation methods and the scope of application of the present application, all belong to the scope of protection of the present application. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

1. A photosensitive component, characterized in that: include: Circuit board; A photosensitive element connected to the circuit board; A first adhesive layer is disposed on the circuit board; A supporting member, wherein the first adhesive layer supports the supporting member, and the supporting member is located on the optical path of the photosensitive element.

2. The photosensitive component according to claim 1, characterized in that: The thickness of the first adhesive layer is 0.1-0.8 mm.

3. The photosensitive component according to claim 1, characterized in that: The supporting member includes a bearing member, and the first adhesive layer supports the bearing member.

4. The photosensitive component according to claim 3, characterized in that: The carrier is provided with an avoidance structure, and the avoidance structure is used to avoid the electronic components on the circuit board.

5. The photosensitive component according to claim 3, characterized in that: The bearing member comprises: The carrier body is provided with a light-through hole, and the light-through hole is located on the light path of the photosensitive element; and The first baffle is disposed on the carrier body, and the first baffle is located outside the light-through hole.

6. The photosensitive component according to claim 5, characterized in that: The surface of the first baffle contacting the first adhesive layer is an inclined surface.

7. The photosensitive component according to claim 3, characterized in that: The bearing member comprises: The carrier body is provided with a light-through hole, and the light-through hole is located on the light path of the photosensitive element; and The second baffle is arranged on the carrier body, and the second baffle is located at the outer periphery of the carrier body.

8. The photosensitive component according to claim 7, characterized in that: The surface of the second baffle contacting the first adhesive layer is an inclined surface.

9. The photosensitive component according to claim 3, characterized in that: The bearing member comprises: The carrier body is provided with a light-through hole, and the light-through hole is located on the light path of the photosensitive element; and An extension portion is located outside the light-through hole.

10. The photosensitive component according to claim 3, characterized in that: The supporting member further comprises a first color filter, which is arranged on the supporting member and is located on the optical path of the photosensitive element.

11. The photosensitive component according to claim 3, characterized in that: The thickness of the bearing member is 0.08-0.2 mm.

12. The photosensitive component according to claim 3, characterized in that: The bearing member is provided with a first air outlet.

13. The photosensitive component according to claim 1, characterized in that: The first adhesive layer is provided with a second air outlet.

14. The photosensitive component according to claim 1, characterized in that: The supporting member includes a second color filter, and the first glue layer supports the second color filter.

15. The photosensitive component according to claim 1, characterized in that: It also includes a gold wire, one end of which is connected to the circuit board, and the other end of which is connected to the photosensitive element, and the thickness of the first glue layer is greater than the height of the gold wire.

16. The photosensitive component according to claim 1, characterized in that: The circuit board is provided with a photosensitive element slot, and the photosensitive element is arranged in the photosensitive element slot; or The circuit board is provided with a photosensitive element hole, and the photosensitive element is arranged in the photosensitive element hole.

17. The photosensitive component according to claim 1, characterized in that: At least part of the electronic components on the circuit board are arranged on the side of the circuit board away from the first adhesive layer.

18. The photosensitive component according to any one of claims 1 to 17, characterized in that: The photosensitive element includes a non-photosensitive area, and the photosensitive component also includes a second adhesive layer, the second adhesive layer is arranged in the non-photosensitive area, and the second adhesive layer contacts the supporting member.

19. A method for preparing a photosensitive component, characterized in that: include: Preparing a photosensitive component preform, including: Electrically connect the photosensitive element to the circuit board; Dispensing glue on the circuit board, or dispensing glue on the support preform, bonding the support preform to the circuit board, and positioning the support on the optical path of the photosensitive element; Curing the glue between the support member preform and the circuit board into a first glue layer; The photosensitive component preform is cut to obtain the photosensitive component.

20. The method for preparing a photosensitive component according to claim 19, characterized in that: The dispensing of glue on the circuit board or the preformed support member includes: forming a second air outlet in the dispensed glue.

21. The method for preparing a photosensitive component according to claim 20, characterized in that: The prefabricated support parts include: Supports; A support portion connected to the support member, the support portion being provided with a third air outlet; Wherein, when the support member preform is bonded to the circuit board, the support portion abuts against the circuit board; The cutting of the photosensitive component preform includes: cutting off the supporting portion.

22. The method for preparing a photosensitive component according to claim 21, characterized in that: A gap is formed between the dispensed glue and the supporting portion.

23. The method for preparing a photosensitive component according to claim 20, characterized in that: The bonding of the support member preform to the circuit board includes: supporting the support member preform by a supporting jig; After the glue between the support member preform and the circuit board is cured, the support jig is removed.

24. A camera module, characterized in that: include: The photosensitive component according to any one of claims 1 to 18; The lens is arranged on the supporting member.

25. An electronic device, characterized in that: Including the camera module as described in claim 24.

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