Composite printed circuit board and manufacturing method thereof

Abstract

The invention provides a composite printed circuit board and a manufacturing method thereof, and relates to the field of printed circuits. The filling device for the Chinese patent medicine liquid in the anesthesia department comprises a plate body supporting mechanism, the plate body supporting mechanism comprises a top plate, a diathermanous layer is fixedly connected to the bottom end of the top plate, a heat conduction layer is fixedly connected to the bottom end of the diathermanous layer, and a plurality of first fixing rods and second fixing rods are fixedly connected to the outer side wall of the top plate through bolts. And one side of the first fixing rod and one side of the second fixing rod are fixedly connected with supporting rods. According to the invention, electrical connection between electronic components can be realized, electrical connection can be carried out through the electronic components, when a circuit pattern is damaged, the components can be used, and the circuit board also has a function of dissipating heat generated by operation of the circuit board, so that the service life of the circuit board is prolonged. The problem that a printed circuit board is easy to damage to affect use is solved, and heat generated by operation of the circuit board is better dissipated.

Description

Technical Field

[0001] The invention relates to the field of printed circuits, in particular to a composite printed circuit board and a manufacturing method thereof. Background Art

[0002] Printed Circuit Board (PCB) is an electronic component used for supporting and electrically connecting electronic components. PCB, the full name of which is Printed Circuit Board, is an indispensable basic component in the electronics industry. It forms a circuit pattern by etching or coating a conductive material on an insulating substrate according to a predetermined design, thereby achieving electrical connections between electronic components. This design not only makes the circuit more miniaturized and intuitive, but also greatly promotes mass production and optimizes electrical layout. PCB can be subdivided into single-sided, double-sided and multi-layer circuit boards. According to their different structures and functions, they are widely used in various electronic devices from electronic watches to giant computers.

[0003] Most of the existing printed circuit boards are directly etched or coated with conductive materials to form circuit patterns, thereby achieving electrical connections between electronic components. When used for a long time or when water vapor corrosion occurs, the printed circuit boards are often damaged. In addition, most of the existing printed circuit boards cannot dissipate the temperature generated during operation well. Long-term use can easily cause damage to the circuit boards. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a composite printed circuit board and a method for manufacturing the same. The present invention can realize electrical connection between electronic components and can perform electrical connection through electronic components. When the circuit pattern is damaged, the components can be used for simple overlapping and use. The present invention also has the function of dissipating the heat generated by the operation of the circuit board, thereby solving the problem that the printed circuit board is easily damaged and affects its use, and solving the problem of better dissipating the heat generated by the operation of the circuit board.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: A composite printed circuit board and a manufacturing method thereof, comprising a board support mechanism, wherein the board support mechanism comprises a top plate, a heat-transmitting layer is fixedly connected to the bottom end of the top plate, a heat-conducting layer is fixedly connected to the bottom end of the heat-transmitting layer, a plurality of first fixing rods and second fixing rods are fixedly connected to the outer wall of the top plate by bolts, one side of each of the first fixing rod and the second fixing rod is fixedly connected to a support rod, an electronic component mechanism is fixedly connected to the top end of the top plate, a transmission mechanism is provided on the side of the top end of the top plate away from the electronic component mechanism, a line fixing mechanism is provided on the side of the top end of the top plate away from the transmission mechanism, a temperature detection mechanism is provided on the outer wall of the top plate, and a heat dissipation mechanism is provided at the bottom end of the top plate.

[0008] S1: Cut the top plate, heat-transmitting layer and heat-conducting layer into production sizes, clean the surfaces of the top plate, heat-transmitting layer and heat-conducting layer with brushes to remove surface pollutants, glue the heat-transmitting layer and heat-conducting layer to the top plate in sequence, and then stick a dry film on the surface of the top plate to prepare for subsequent image transfer. Use an exposure device to expose the top plate with ultraviolet light to transfer the image of the top plate to the dry film. After exposure, develop, etch and remove the film on the top plate to complete the production of the inner layer plate.

[0009] Through the above technical solution, the printed circuit board can be supported more stably.

[0010] Preferably, the electronic component mechanism includes a voltage stabilizer, a plurality of voltage stabilizing terminals are fixedly connected to the top ends of two of the voltage stabilizers, a plurality of conductors are arranged on the side of the top end of the top plate away from the voltage stabilizers, two connection ports are arranged on one side of the plurality of conductors, the upper end surfaces of the connection ports are fixedly connected to connection terminals, and a sub-circuit control chip is arranged on one side of the connection ports, a circuit control chip is arranged on one side of the plurality of sub-circuit control chips, and a plurality of transmission circuit lines are fixedly connected to the outer walls of the circuit control chip and the sub-circuit control chip.

[0011] S2: Check the pads and pins on the top plate to ensure that they are not damaged or bent, determine the correct position and direction according to the circuit diagram or layout diagram, place the regulator, conductor, circuit control chip, sub-circuit control chip and connection port on the top plate in sequence using tweezers or desoldering tools, ensure that the components are aligned with the pads, heat the soldering station to reach the appropriate working temperature, use solder to heat the pads and pins to fully melt them, apply an appropriate amount of solder wire on the pads and pins to fully cover the pads and pins, wait for the soldering point to cool, and form a solid solder connection so that the electronic component mechanism can be fixed to the top plate;

[0012] Through the above technical solution, the printed circuit board can operate through electronic components when the circuit pattern is corroded, thereby preventing the circuit board from being damaged and the device from being unable to operate.

[0013] Preferably, the conduction mechanism comprises a transmission terminal, a plurality of transmission terminals are fixedly connected to a transmission rod on one side, a plurality of transmission rods are fixedly connected to a transmission block on one side, second transmission lines are fixedly connected to both sides of the top of the transmission block, and a plurality of first transmission lines are fixedly connected to the center of the transmission block, an analyzer is fixedly connected to one end of the plurality of second transmission lines away from the transmission block, and a fixed terminal is fixedly connected to one end of the plurality of first transmission lines away from the transmission block.

[0014] S3: Use solder to heat the pad and the pin to fully melt them, apply a proper amount of solder wire on the pad and the pin to fully cover the pad and the pin, wait for the soldering point to cool down, and form a solid soldering connection, solder the transmission terminal and the transmission block to the top plate, and then solder the first transmission line and the second transmission line to the transmission block, the analyzer and the fixed terminal in turn, so that the current information can be transmitted;

[0015] Through the above technical solution, current information can be transmitted.

[0016] Preferably, the line fixing mechanism includes a third fixing rod, one side of two of the third fixing rods are fixedly connected with an extension block, a connecting rod is fixedly connected between the two extension blocks and the two third fixing rods, one side of the connecting rod is penetrated by a buckle, and the inner walls of the plurality of buckles are clamped with the second transmission line.

[0017] S4: Fix the two third fixing rods on the top plate by bolts, fix the two connecting rods on the extension block and the third fixing rods respectively by welding, and fix the second transmission line by the buckles on the connecting rods, so that the device can stabilize the line;

[0018] Through the above technical solution, the lines can be fixed and will not be scattered.

[0019] Preferably, the temperature detection mechanism comprises a probe fixing frame, one side of the probe fixing frame is fixedly connected to a cross bar, a bottom end of the cross bar is fixedly connected to a plurality of temperature probes, and a bottom end of the probe fixing frame is fixedly connected to an analysis transmitter.

[0020] S5: Install the probe holder on the analysis transmitter, install multiple temperature probes on the probe holder in sequence, and when the operating temperature of the circuit board is detected by the temperature probe, the information is transmitted to the analysis transmitter through the connection line of the analysis transmitter for analysis and judgment;

[0021] Through the above technical solution, the device can detect the operating temperature of the circuit board.

[0022] Preferably, the heat dissipation mechanism includes a base plate, a plurality of fan ports are fixedly connected to the bottom end of the base plate, a plurality of cooling fans are rotatably connected to the inner side walls of the plurality of fan ports, a plurality of heat-conducting terminals are fixedly connected to the inner top surface of the base plate, and a heat-conducting coil is fixedly connected to the bottom ends of the plurality of heat-conducting terminals.

[0023] S6: The bottom plate is fixed to the heat-conducting layer by welding, the fan port connected to the bottom plate is connected to a power line, multiple power lines are electrically connected to the cooling fan, and the heat-conducting coil and the heat-conducting terminal are bolted to the bottom plate and the heat-conducting layer respectively, so that heat can be conducted;

[0024] Through the above technical solution, the device can dissipate the temperature of the circuit board.

[0025] Working principle: The device, by setting a top plate, a heat-transmitting layer and a heat-conducting layer, allows the heat of the circuit board to be transferred through the heat-transmitting layer and the heat-conducting layer, checks the pads and pins on the top plate to ensure that they are not damaged or bent, determines the correct position and direction according to the circuit diagram or layout diagram, places the voltage stabilizer, conductor, circuit control chip, sub-circuit control chip and connection port on the top plate in turn using tweezers or solder suckers, fixes them to the top plate through an electronic component mechanism, allows the circuit board to transmit information through the electronic component mechanism, welds the transmission terminal and the transmission block on the top plate, and then welds the first transmission line and the second transmission line to the transmission block, the analyzer and the fixed terminal in turn, allows the current information to be transmitted, and the two A third fixing rod is fixed on the top plate, and two connecting rods are respectively fixed on the extension block and the third fixing rod by welding. The second transmission line is fixed by the buckle on the connecting rod, so that the device can stabilize the line. The probe fixing frame is installed on the analysis transmitter, and multiple temperature probes are installed on the probe fixing frame in sequence. When the operating temperature of the circuit board is detected by the temperature probe, the information is transmitted to the analysis transmitter through the connecting line of the analysis transmitter for analysis and judgment. The bottom plate is fixed to the heat conductive layer by welding, and the fan port connected to the bottom plate is connected to the power cord. Multiple power cords are respectively connected to the heat dissipation fan by electric melting, and the heat conductive coil and the heat conductive terminal are bolted to the bottom plate and the heat conductive layer respectively, so that heat can be conducted.

[0026] (III) Beneficial effects

[0027] The present invention provides a composite printed circuit board and a method for manufacturing the same. The composite printed circuit board has the following beneficial effects:

[0028] 1. The present invention provides a composite printed circuit board and a method for manufacturing the same. When the circuit board is corroded and damaged, the present invention can be used by simply overlapping components to prevent the machine from being unable to operate and affecting work.

[0029] 2. The present invention provides a composite printed circuit board and a method for manufacturing the same. The present invention can fix the circuits inside the circuit board to prevent the circuits from being cluttered and affecting the operation of the circuit board.

[0030] 3. The present invention provides a composite printed circuit board and a method for manufacturing the same. The present invention can detect the operating heat of the circuit board and dissipate the heat of the circuit board in a timely manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the three-dimensional structure of the composite printed circuit board of the present invention;

[0032] Figure 2 It is a schematic diagram of a multi-angle three-dimensional structure of a composite printed circuit board of the present invention;

[0033] Figure 3 It is a schematic structural diagram of the conducting mechanism and the circuit fixing mechanism of the composite printed circuit board of the present invention;

[0034] Figure 4 It is a schematic diagram of the bottom structure of the composite printed circuit board of the present invention;

[0035] Figure 5 It is a schematic diagram of the heat dissipation mechanism structure of the composite printed circuit board of the present invention;

[0036] Figure 6 It is a schematic diagram of the top plate structure of the composite printed circuit board of the present invention.

[0037] Among them, 1. Plate support mechanism; 101. Top plate; 102. Heat-transmitting layer; 103. Heat-conducting layer; 104. First fixing rod; 105. Support rod; 106. Second fixing rod; 2. Electronic component mechanism; 201. Voltage stabilizer; 202. Voltage stabilizer terminal; 203. Conductor; 204. Circuit control chip; 205. Sub-circuit control chip; 206. Connection port; 207. Connection terminal; 208. Transmission circuit line; 3. Transmission mechanism; 301. Transmission terminal; 302. Transmission rod; 303. , transmission block; 304, first transmission line; 305, connecting terminal; 306, second transmission line; 307, analyzer; 4, line fixing mechanism; 401, second fixing rod; 402, extension block; 403, connecting rod; 404, buckle; 5, temperature detection mechanism; 501, probe fixing frame; 502, cross bar; 503, temperature probe; 504, analysis transmitter; 6, heat dissipation mechanism; 601, bottom plate; 602, fan port; 603, heat dissipation fan; 604, thermal conductive terminal; 605, thermal conductive coil. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. In the description of this application, it should be noted that the terms used here are only for describing specific implementations, and are not intended to limit the exemplary implementations according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and devices known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the techniques, methods and devices should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0039] Embodiment 1:

[0040] like Figure 1-6As shown, an embodiment of the present invention provides a composite printed circuit board and a manufacturing method thereof, comprising a board support mechanism 1, the board support mechanism 1 comprising a top plate 101, a heat-transmitting layer 102 is fixedly connected to the bottom end of the top plate 101, a heat-transmitting layer 103 is fixedly connected to the bottom end of the heat-transmitting layer 102, a plurality of first fixing rods 104 and second fixing rods 106 are fixedly connected to the outer wall of the top plate 101 by bolts, a support rod 105 is fixedly connected to one side of the first fixing rod 104 and the second fixing rod 106, an electronic component mechanism 2 is fixedly connected to the top of the top plate 101, a transmission mechanism 3 is arranged on the side of the top of the top plate 101 away from the electronic component mechanism 2, a line fixing mechanism 4 is arranged on the side of the top of the top plate 101 away from the transmission mechanism 3, a temperature detection mechanism 5 is arranged on the outer wall of the top plate 101, and a heat dissipation mechanism 6 is arranged at the bottom end of the top plate 101.

[0041] S1: Cut the top plate 101, the heat-transmitting layer 102 and the heat-conducting layer 103 into production sizes, clean the surfaces of the top plate 101, the heat-transmitting layer 102 and the heat-conducting layer 103 with brushes to remove surface pollutants, glue the heat-transmitting layer 102 and the heat-conducting layer 103 to the top plate 101 in sequence, and then stick a dry film on the surface of the top plate 101 to prepare for subsequent image transfer, use an exposure device to expose the top plate 101 with ultraviolet light, so as to transfer the image of the top plate 101 to the film, develop, etch and remove the film on the exposed top plate 101, and then complete the production of the inner layer board, so that the printed circuit board can be supported more stably.

[0042] Embodiment 2: The electronic component mechanism 2 includes a voltage stabilizer 201, and a plurality of voltage stabilizer terminals 202 are fixedly connected to the top ends of two voltage stabilizers 201, a plurality of conductors 203 are arranged on the side of the top end of the top plate 101 away from the voltage stabilizer 201, two connection ports 206 are arranged on one side of the plurality of conductors 203, the upper end surfaces of the connection ports 206 are fixedly connected to connection terminals 207, and a sub-circuit control chip 205 is arranged on one side of the connection ports 206, a circuit control chip 204 is arranged on one side of the plurality of sub-circuit control chips 205, and a plurality of transmission circuit lines 208 are fixedly connected to the outer walls of the circuit control chip 204 and the sub-circuit control chip 205.

[0043] S2: Check the pads and pins on the top plate 101 to ensure that they are not damaged or bent, determine the correct position and direction according to the circuit diagram or layout diagram, place the regulator 201, the conductor 203, the circuit control chip 204, the sub-circuit control chip 205 and the connection port 206 on the top plate 101 in sequence using tweezers or a solder sucker, ensure that the components are aligned with the pads, heat the soldering station to reach an appropriate working temperature, use solder to heat the pads and pins to fully melt them, apply an appropriate amount of solder wire on the pads and pins to fully cover the pads and pins, wait for the soldering points to cool, and form a solid solder connection, so that the electronic component mechanism 2 can be fixed to the top plate 101, so that the printed circuit board can operate through the electronic components when the circuit pattern is corroded, etc., to prevent the circuit board from being damaged and the device from being unable to operate.

[0044] Embodiment 3: The conduction mechanism 3 includes a transmission terminal 301, a transmission rod 302 is fixedly connected to one side of the multiple transmission terminals 301, a transmission block 303 is fixedly connected to one side of the multiple transmission rods 302, second transmission lines 306 are fixedly connected to both sides of the top of the transmission block 303, and a plurality of first transmission lines 304 are fixedly connected to the center position of the transmission block 303, an analyzer 307 is fixedly connected to one end of the multiple second transmission lines 306 away from the transmission block 303, and a fixed terminal 305 is fixedly connected to one end of the multiple first transmission lines 304 away from the transmission block 303.

[0045] S3: Use solder to heat the pads and pins to fully melt them, apply an appropriate amount of solder wire on the pads and pins to fully cover the pads and pins, wait for the soldering points to cool down, and form a solid soldering connection, solder the transmission terminal 301 and the transmission block 303 to the top plate 101, and then solder the first transmission line 304 and the second transmission line 306 to the transmission block 303, the analyzer 307 and the fixed terminal 305 in turn, so that the current information can be transmitted.

[0046] Embodiment 4: The line fixing mechanism 4 includes a third fixing rod 401, one side of the two third fixing rods 401 is fixedly connected with an extension block 402, a connecting rod 403 is fixedly connected between the two extension blocks 402 and the two third fixing rods 401, one side of the connecting rod 403 is penetrated by a buckle 404, and the inner walls of the multiple buckles 404 are clamped with the second transmission line 306.

[0047] S4: Fix the two third fixing rods 401 on the top plate 101 by bolts, fix the two connecting rods 403 on the extension block 402 and the third fixing rods 401 respectively by welding, and fix the second transmission line 306 by the buckle 404 on the connecting rod 403, so that the device can stabilize the line and the line can be fixed without being scattered.

[0048] Embodiment 5: The temperature detection mechanism 5 comprises a probe fixing frame 501 , a cross bar 502 is fixedly connected to one side of the probe fixing frame 501 , a plurality of temperature probes 503 are fixedly connected to the bottom end of the cross bar 502 , and an analysis transmitter 504 is fixedly connected to the bottom end of the probe fixing frame 501 .

[0049] S5: Install the probe holder 501 on the analysis transmitter 504, and install multiple temperature probes 503 on the probe holder 501 in sequence. When the operating temperature of the circuit board is detected by the temperature probe 503, the information is transmitted to the analysis transmitter 504 through the connecting line of the analysis transmitter 504 for analysis and evaluation, so that the device can detect the operating temperature of the circuit board.

[0050] Embodiment 6: The heat dissipation mechanism 6 includes a base plate 601, a plurality of fan ports 602 are fixedly connected to the bottom end of the base plate 601, a heat dissipation fan 603 is rotatably connected to the inner side walls of the plurality of fan ports 602, and a plurality of heat conductive terminals 604 are fixedly connected to the inner top surface of the base plate 601, a heat conductive coil 605 is fixedly connected to the bottom ends of the plurality of heat conductive terminals 604.

[0051] S6: Fix the bottom plate 601 to the heat-conducting layer 103 by welding, connect the fan port 602 connected to the bottom plate 601 to the power line, and the multiple power lines are electrically connected to the cooling fan 603 respectively. The heat-conducting coil 605 and the heat-conducting terminal 604 are bolted to the bottom plate 601 and the heat-conducting layer 103 respectively, so that the heat can be conducted, and the device can dissipate the temperature of the circuit board.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A composite printed circuit board, comprising a board support mechanism (1), characterized in that: The plate support mechanism (1) comprises a top plate (101), the bottom end of the top plate (101) is fixedly connected to a heat-transmitting layer (102), the bottom end of the heat-transmitting layer (102) is fixedly connected to a heat-conducting layer (103), the outer side wall of the top plate (101) is fixedly connected to a plurality of first fixing rods (104) and second fixing rods (106) by bolts, one side of each of the first fixing rods (104) and the second fixing rods (106) is fixedly connected to a support rod (105), and the top plate (101) is fixedly connected to a heat-transmitting layer (102). The top of the board (101) is fixedly connected to an electronic component mechanism (2), and a transmission mechanism (3) is provided on the side of the top of the top board (101) away from the electronic component mechanism (2), a line fixing mechanism (4) is provided on the side of the top of the top board (101) away from the transmission mechanism (3), and a temperature detection mechanism (5) is provided on the outer wall of the top board (101), and a heat dissipation mechanism (6) is provided at the bottom of the top board (101). The steps of manufacturing the composite printed circuit board are as follows: S1: cutting the top plate (101), the heat-transmitting layer (102) and the heat-conducting layer (103) into production sizes, cleaning the surfaces of the top plate (101), the heat-transmitting layer (102) and the heat-conducting layer (103) with brushes to remove surface pollutants, gluing the heat-transmitting layer (102) and the heat-conducting layer (103) to the top plate (101) in sequence, and then attaching a dry film to the surface of the top plate (101) to prepare for subsequent image transfer, using an exposure device to expose the top plate (101) with ultraviolet light, thereby transferring the image of the top plate (101) to the dry film, and developing, etching and film removal the exposed top plate (101), thereby completing the production of the inner layer board; S2: Check the pads and pins on the top plate (101) to ensure that they are not damaged or bent, determine the correct position and direction according to the circuit diagram or layout diagram, place the regulator (201), the conductor (203), the circuit control chip (204), the sub-circuit control chip (205) and the connection port (206) on the top plate (101) in sequence using tweezers or a solder sucker, ensure that the components are aligned with the pads, heat the soldering station to reach an appropriate working temperature, use solder to heat the pads and pins to fully melt them, apply an appropriate amount of solder wire on the pads and pins to fully cover the pads and pins, wait for the soldering points to cool, and form a solid solder connection, so that the electronic component mechanism (2) can be fixed to the top plate (101); S3: Use solder to heat the pad and the pin to fully melt them, apply a proper amount of solder wire on the pad and the pin to fully cover the pad and the pin, wait for the soldering point to cool down, and form a solid soldering connection, solder the transmission terminal (301) and the transmission block (303) on the top plate (101), and then solder the first transmission line (304) and the second transmission line (306) on the transmission block (303), the analyzer (307) and the fixed terminal (305) in sequence, so that the current information can be transmitted; S4: Fix the two third fixing rods (401) to the top plate (101) by bolts, fix the two connecting rods (403) to the extension block (402) and the third fixing rods (401) respectively by welding, and fix the second transmission line (306) by the buckle (404) on the connecting rod (403), so that the device can stabilize the line; S5: installing the probe fixing frame (501) on the analysis transmitter (504), and sequentially installing a plurality of temperature probes (503) on the probe fixing frame (501), and when the operating temperature of the circuit board is detected by the temperature probe (503), the information is transmitted to the analysis transmitter (504) through the connection line of the analysis transmitter (504) for analysis and evaluation; S6: The bottom plate (601) is fixed to the heat-conducting layer (103) by welding, a power line is connected to the inside of the fan port (602) connected to the bottom plate (601), a plurality of power lines are electrically connected to the heat dissipation fan (603), and the heat-conducting coil (605) and the heat-conducting terminal (604) are bolted to the bottom plate (601) and the heat-conducting layer (103) respectively, so that heat can be conducted.

2. A composite printed circuit board according to claim 1, characterized in that: The electronic component mechanism (2) comprises a voltage stabilizer (201), the top ends of two of the voltage stabilizers (201) are fixedly connected to a plurality of voltage stabilizing terminals (202), a plurality of conductors (203) are arranged on a side of the top end of the top plate (101) away from the voltage stabilizer (201), two connection ports (206) are arranged on one side of the plurality of conductors (203), the upper end surfaces of the connection ports (206) are fixedly connected to connection terminals (207), a sub-circuit control chip (205) is arranged on one side of the connection ports (206), a circuit control chip (204) is arranged on one side of the plurality of sub-circuit control chips (205), and a plurality of transmission circuit lines (208) are fixedly connected to the outer walls of the circuit control chip (204) and the sub-circuit control chip (205).

3. A composite printed circuit board and a method for manufacturing the same according to claim 1, characterized in that: The transmission mechanism (3) comprises a transmission terminal (301), one side of the plurality of transmission terminals (301) is fixedly connected to a transmission rod (302), one side of the plurality of transmission rods (302) is fixedly connected to a transmission block (303), both sides of the top of the transmission block (303) are fixedly connected to a second transmission line (306), and the center of the transmission block (303) is fixedly connected to a plurality of first transmission lines (304), one end of the plurality of second transmission lines (306) away from the transmission block (303) is fixedly connected to an analyzer (307), and one end of the plurality of first transmission lines (304) away from the transmission block (303) is fixedly connected to a fixed terminal (305).

4. A composite printed circuit board and a method for manufacturing the same according to claim 1, characterized in that: The line fixing mechanism (4) comprises a third fixing rod (401), one side of two of the third fixing rods (401) are fixedly connected to an extension block (402), a connecting rod (403) is fixedly connected between the two extension blocks (402) and the two third fixing rods (401), one side of the connecting rod (403) is penetrated by a buckle (404), and the inner walls of the plurality of buckles (404) are buckled with a second transmission line (306).

5. A composite printed circuit board and a method for manufacturing the same according to claim 1, characterized in that: The temperature detection mechanism (5) comprises a probe fixing frame (501), one side of the probe fixing frame (501) is fixedly connected to a cross bar (502), the bottom end of the cross bar (502) is fixedly connected to a plurality of temperature probes (503), and the bottom end of the probe fixing frame (501) is fixedly connected to an analysis transmitter (504).

6. A composite printed circuit board and a method for manufacturing the same according to claim 1, characterized in that: The heat dissipation mechanism (6) comprises a bottom plate (601), the bottom end of the bottom plate (601) is fixedly connected to a plurality of fan ports (602), the inner side walls of the plurality of fan ports (602) are rotatably connected to heat dissipation fans (603), and the inner top surface of the bottom plate (601) is fixedly connected to a plurality of heat-conducting terminals (604), and the bottom ends of the plurality of heat-conducting terminals (604) are fixedly connected to a heat-conducting coil (605).

Images