Package substrate, signal optimization method thereof and related equipment

Abstract

The invention discloses a packaging substrate and a signal optimization method and related equipment thereof, and the method comprises the steps: carrying out the signal quality evaluation of a model of the packaging substrate in response to a signal optimization instruction, obtaining a signal quality evaluation result, and carrying out the signal optimization of the packaging substrate based on the signal quality evaluation result. And determining the signal transmission channel, the signal quality of which does not meet a preset requirement, in the plurality of signal transmission channels as a target signal transmission channel, and setting a first target region of a reference layer adjacent to a target signal via hole in the target signal transmission channel as a hollow region, so as to increase the distance between the target signal via hole and the reference layer. And increasing the impedance of the target signal via hole, and optimizing the quality of the signal of the target signal transmission channel so as to optimize the model of the package substrate and the quality of the signal of the package substrate manufactured according to the model of the package substrate. Wherein the target signal via hole is a signal via hole penetrating through a core layer of a model of the packaging substrate, and the first target area of the reference layer is an area, with orthographic projection covering the target signal via hole, in the reference layer.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit design, and in particular to a packaging substrate and a signal optimization method and related equipment thereof. Background Art

[0002] The package substrate includes multiple signal transmission channels, which are used to realize signal transmission between the bare die and the printed circuit board. These signal transmission channels are usually composed of signal lines, signal vias and signal pads. However, because the structures of signal lines, signal vias and signal pads are different, the impedances of signal lines, signal vias and signal pads in the same signal transmission channel may be different, resulting in discontinuous impedance of the signal transmission channel, which affects the quality of the signal transmitted by the signal transmission channel.

[0003] Although when designing a package substrate, the impedance of the signal lines, signal vias or signal pads in the package substrate model can be adjusted by adjusting basic items such as the material and size of the signal lines, signal vias or signal pads in the package substrate model to ensure the impedance continuity of each signal transmission channel in the package substrate model, for signal transmission channels that transmit high-frequency signals, the above impedance adjustment method still cannot guarantee the signal quality of the signal transmission channel. Summary of the invention

[0004] The present application discloses a packaging substrate and a signal optimization method and related equipment thereof, so as to optimize the quality of signals in a signal transmission channel in the packaging substrate.

[0005] In a first aspect, the present application discloses a signal optimization method for a packaging substrate, comprising: in response to a signal optimization instruction, performing a signal quality evaluation on a model of the packaging substrate to obtain a signal quality evaluation result; the model of the packaging substrate is a model constructed by simulating the structure of the packaging substrate to be manufactured; the model of the packaging substrate includes a plurality of signal transmission channels, each of the signal transmission channels includes a signal line, a signal via and a signal pad; the signal via is used to realize the electrical connection of the signal lines of different layers, or to realize the electrical connection between the signal line and the signal pad; based on the signal quality evaluation result, determining a target signal transmission channel among the plurality of signal transmission channels; the target signal transmission channel is A signal transmission channel whose signal quality does not meet preset requirements; setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area to increase the impedance of the target signal via by increasing the distance between the target signal via and the reference layer, thereby optimizing the signal quality of the target signal transmission channel and optimizing the signal quality of the packaging substrate made according to the model of the packaging substrate; wherein the target signal via is a signal via that passes through the core layer of the model of the packaging substrate; the reference layer is a conductive layer that is electrically connected to a power supply or a ground among multiple conductive layers of the model of the packaging substrate; the first target area of ​​the reference layer is an area in the reference layer where the orthographic projection covers the target signal via.

[0006] In this way, by increasing the distance between the target signal via and the reference layer in the target signal transmission channel, the impedance of the target signal via can be increased, the impedance continuity of the target signal transmission channel can be optimized, and then the signal quality of the target signal transmission channel can be optimized, so that the signal quality of each signal transmission channel in the packaging substrate model and the packaging substrate made according to the model can meet the preset requirements.

[0007] In some embodiments of the present application, setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area includes: performing a hollowing-out evaluation on the first target area of ​​any reference layer adjacent to the target signal via in the target signal transmission channel to obtain a hollowing-out evaluation result; the hollowing-out evaluation result is used to indicate whether setting the first target area of ​​the reference layer as the hollowed-out area affects the signal quality of other signal transmission channels; and based on the hollowing-out evaluation result, determining whether to set the first target area of ​​the reference layer as the hollowed-out area.

[0008] In this way, it is possible to avoid setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area, thereby affecting the signal quality of other signal transmission channels.

[0009] In some embodiments of the present application, setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area includes: setting the first target areas of multiple reference layers adjacent to the target signal via in the target signal transmission channel as the hollowed-out area; the multiple reference layers are located on the same side of the target signal via, or the multiple reference layers are respectively located on opposite sides of the target signal via.

[0010] In this way, the hollowing area can be set flexibly to improve the hollowing effect.

[0011] In some embodiments of the present application, setting the first target area of ​​multiple reference layers adjacent to the target signal via in the target signal transmission channel as a hollowed-out area includes: setting the first target area of ​​the reference layer close to the target signal via in the multiple reference layers adjacent to the target signal via in the target signal transmission channel as a hollowed-out area; if the signal quality of the target signal transmission channel still does not meet the preset requirements, setting the first target area of ​​the reference layer far from the target signal via in the multiple reference layers adjacent to the target signal via in the target signal transmission channel as a hollowed-out area.

[0012] In this way, the hollowing area can be accurately set according to the quality evaluation results to ensure the signal quality optimization effect.

[0013] In some embodiments of the present application, it also includes: setting a ground via adjacent to the target signal via in the core layer of the packaging substrate model.

[0014] In this way, the signal crosstalk between the target signal via and other signal vias can be reduced, the crosstalk value of the target signal transmission channel can be reduced, and the signal quality of the target signal transmission channel can be improved, so that the signal quality of the packaging substrate model and each signal transmission channel in the packaging substrate manufactured according to the model can meet the preset requirements.

[0015] In some embodiments of the present application, after setting a ground via adjacent to the target signal via in the core layer of the packaging substrate model, it also includes: setting the spacing between the target signal via and the ground via to a preset spacing; the preset spacing at least includes a spacing equal to the aperture of the target signal via.

[0016] In this way, the distance between the target signal via and the ground via can be avoided to be too large or too small, which affects the impedance continuity of the target signal transmission channel, and thus the model of the packaging substrate and the signal quality of each signal transmission channel in the packaging substrate made according to the model can be optimized.

[0017] In some embodiments of the present application, it also includes: setting a second target area of ​​the reference layer adjacent to the target signal pad in the target signal transmission channel as a hollowed-out area to increase the impedance of the target signal pad by increasing the distance between the target signal pad and the reference layer, thereby optimizing the signal quality of the target signal transmission channel; wherein the target signal pad includes a signal pad for outputting a signal in the target signal transmission channel; and the second target area of ​​the reference layer includes an area in the reference layer whose orthographic projection at least partially covers the target signal pad.

[0018] In this way, by increasing the distance between the target signal pad and the reference layer, the impedance of the target signal pad can be increased, the impedance continuity of the target signal transmission channel can be optimized, and the signal quality of the target signal transmission channel can be optimized, so that the packaging substrate model and the signal quality of each signal transmission channel in the packaging substrate made according to the model can meet the preset requirements.

[0019] In a second aspect, the present application also discloses a computer device, including a memory and a processor; the memory is used to store instructions; the processor is used to execute the signal optimization method of the packaging substrate as described in any of the above items according to the instructions stored in the memory.

[0020] In a third aspect, the present application further discloses a computer-readable storage medium storing instructions for executing the signal optimization method for a packaging substrate as described in any one of the above items.

[0021] In a fourth aspect, the present application also discloses a packaging substrate, comprising a plurality of conductive layers and a plurality of dielectric layers stacked in layers, wherein there is a dielectric layer between any two conductive layers; each of the conductive layers comprises a signal line, and the signal lines of at least two of the conductive layers are electrically connected through a signal via that passes through the dielectric layer therebetween, and the signal lines, the signal vias, and the signal pads located on at least one side of the packaging substrate constitute a signal transmission channel; and at least one of the signal transmission channels is a signal transmission channel that has been optimized using the signal optimization method described in any of the above items.

[0022] In this way, the signal quality of the signal transmission channel of the packaging substrate can be improved by setting the first target area of ​​the reference layer adjacent to the target signal via in the packaging substrate as a hollowed-out area, and / or setting one or more ground vias around the target signal via, and / or setting the spacing between the target signal via and the ground via to a preset spacing, and / or setting the second target area of ​​the reference layer adjacent to the target signal pad to a hollowed-out area. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0024] Figure 1 This is a schematic diagram of the cross-sectional structure of a chip packaging module disclosed in an embodiment of the present application.

[0025] Figure 2 A schematic diagram of the cross-sectional structure of a packaging substrate disclosed in an embodiment of the present application.

[0026] Figure 3 This is a flow chart of a signal optimization method for a packaging substrate disclosed in an embodiment of the present application.

[0027] Figure 4 A schematic diagram of the cross-sectional structure of a model of a packaging substrate disclosed in an embodiment of the present application.

[0028] Figure 5 It is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application.

[0029] Figure 6 It is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application.

[0030] Figure 7 It is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application.

[0031] Figure 8 It is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application.

[0032] Fig. 9 It is a schematic diagram of the three-dimensional structure of a target signal via and a conductive layer before a hollowed-out area is set according to an embodiment of the present application.

[0033] Fig.10 It is a schematic diagram of the three-dimensional structure of a target signal via and a conductive layer after a hollowed-out area is set according to an embodiment of the present application.

[0034] Fig.11 It is a schematic diagram of another three-dimensional structure of a target signal via and a conductive layer after setting a hollowed-out area according to an embodiment of the present application.

[0035] Fig.12 A schematic diagram of the via distribution of a core layer disclosed in an embodiment of the present application.

[0036] Fig.13 It is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] like Figure 1 As shown, Figure 1 This is a schematic cross-sectional structure diagram of a chip packaging module disclosed in an embodiment of the present application. The chip packaging module includes a packaging substrate 11, a bare chip 12 and a packaging cover 13 located on one side of the packaging substrate 11, and a printed circuit board 14 located on the other side of the packaging substrate 11.

[0039] like Figure 2 As shown, Figure 2 The cross-sectional structure diagram of a package substrate disclosed in an embodiment of the present application, the package substrate 11 comprises a plurality of conductive layers 111 and a plurality of dielectric layers 112 stacked in layers, and a dielectric layer 112 is disposed between any two conductive layers 111. The core layer is a dielectric layer located at the core of the package substrate 11.

[0040] Each conductive layer 111 includes a signal line 1110, and the signal lines 1110 of any two conductive layers 111 are electrically connected through a signal via 1111 that penetrates the dielectric layer 112 therebetween. In addition, the signal line 1110, the signal via 1111, and the first signal pad 113 and the second signal pad 114 located on both sides of the package substrate 11 respectively constitute a signal transmission channel between the bare chip 12 and the printed circuit board 14.

[0041] The package substrate 11 includes a plurality of signal transmission channels, which are respectively used to transmit power signals, ground signals, high-frequency signals, etc. However, because the structures of the signal line 1110, the signal via 1111, the first signal pad 113, and the second signal pad 114 are different, the impedances of the signal line 1110, the signal via 1111, the first signal pad 113, and the second signal pad 114 are also different, which will cause the impedance of the signal transmission channel to be discontinuous, affecting the quality of the signal transmitted by the signal transmission channel.

[0042] It should be noted that impedance continuity means that the impedance of the transmission line in different sections of the electrical transmission path is consistent. Among them, the impedance of the transmission line is related to factors such as the environment in which the transmission line is located, the change in the cross-section of the transmission line, and the change in the direction of the transmission line. For example, changes in the line width and line spacing of the signal line will cause its impedance to change, and changes in the reference layer of the signal line will also cause its impedance to change. Generally speaking, for the same metal transmission medium, the larger the cross-section, the smaller the impedance. In other words, because the cross-section of the signal via and the signal pad is larger than the cross-section of the signal line, the impedance of the signal via and the signal pad is smaller than the impedance of the signal line, resulting in discontinuous impedance of the signal transmission channel. The discontinuous impedance of the signal transmission channel will cause the quality of the signal to not meet the requirements, for example, causing the insertion loss, return loss, crosstalk, etc. of the signal to not meet the requirements.

[0043] Based on this, the present application discloses a signal optimization method for a packaging substrate, which performs signal quality evaluation on a model of the packaging substrate to obtain a target signal transmission channel whose signal quality does not meet preset requirements, and then increases the impedance of the target signal vias and target signal pads, etc. by adjusting the structure of the target signal vias and target signal pads, etc. in the target signal transmission channel, thereby optimizing the signal quality of the target signal transmission channel.

[0044] As an optional implementation of the disclosure of the present application, the present application embodiment discloses a signal optimization method for a packaging substrate, such as Figure 3 As shown, Figure 3 This is a flow chart of a signal optimization method for a packaging substrate disclosed in an embodiment of the present application, the method comprising:

[0045] S101: In response to a signal optimization instruction, perform signal quality evaluation on a model of a packaging substrate to obtain a signal quality evaluation result.

[0046] The model of the package substrate is a model constructed by simulating the structure of the package substrate to be manufactured. That is, the model of the package substrate is the same as the structure of the package substrate to be manufactured. Figure 2 The model of the package substrate includes a plurality of signal transmission channels, each of which includes a signal line 1110, a signal via 1111 and a signal pad, the signal pad includes a first signal pad 113 and a second signal pad 114, and the signal pad may be a pad including a solder ball. The signal via 1111 is used to realize the electrical connection of the signal line 1110 of different layers, or realize the electrical connection of the signal line 1110 and the signal pad, namely the first signal pad 113 or the second signal pad 114.

[0047] In the embodiment of the present application, the model of the packaging substrate can be simulated to evaluate the signal quality of the model of the packaging substrate, and obtain the signal quality evaluation result of the model of the packaging substrate. It can be understood that the signal quality evaluation result can also indicate the signal quality of each signal transmission channel of the packaging substrate to be manufactured.

[0048] S102: Determine a target signal transmission channel among multiple signal transmission channels based on the signal quality evaluation result.

[0049] Among them, the target signal transmission channel includes a signal transmission channel whose signal quality does not meet the preset requirements among the multiple signal transmission channels. The signal quality evaluation result can indicate which signal transmission channels among the multiple signal transmission channels have signal quality that does not meet the preset requirements and which signal transmission channels have signal quality that meets the preset requirements. Specifically, the signal quality can be characterized by the crosstalk value, insertion loss value, and return loss value of the signal. For example, if the crosstalk value of the signal of any signal transmission channel is better than -30dB, the insertion loss value is better than 1dB, and the return loss value is better than 20dB, then the signal quality of the signal transmission channel meets the preset requirements.

[0050] In some embodiments of the present application, a signal transmission channel whose signal quality does not meet preset requirements can be set as a target signal transmission channel. Of course, the present application is not limited to this. In other embodiments, a signal transmission channel whose signal quality meets preset requirements can also be set as a target signal transmission channel to further optimize the signal quality of the signal transmission channel.

[0051] S103: Setting a first target region of the reference layer adjacent to the target signal via hole in the target signal transmission channel as a hollowing region.

[0052] The target signal via includes a signal via that penetrates a core layer of a model of a package substrate. The reference layer includes a planar conductive structure that is electrically connected to a power source or a ground in a plurality of conductive layers of a model of a package substrate. The first target region of the reference layer includes a region in the reference layer whose orthographic projection at least partially covers the target signal via.

[0053] like Figure 4 As shown, Figure 4 Schematic diagram of the cross-sectional structure of a model of a package substrate disclosed in an embodiment of the present application, taking the target signal transmission channel as the signal transmission channel in the dashed box as an example, the first target area of ​​the reference layer adjacent to the target signal via 1111a, such as the third conductive layer 111a arranged from top to bottom, is set as the hollowed-out area A. Or, Figure 5 As shown, Figure 5This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application, in which a first target area of ​​a reference layer adjacent to a target signal via 1111a, such as the sixth conductive layer 111b arranged from top to bottom, is set as a hollowed-out area A.

[0054] Based on this, the impedance of the target signal via such as 1111a can be increased by increasing the spacing between the target signal via such as 1111a and the reference layer, for example, increasing the spacing between the target signal via such as 1111a and the reference layer from d1 to d2, thereby optimizing the impedance continuity of the target signal transmission channel, optimizing the signal quality of the target signal transmission channel, for example, optimizing the return loss value or insertion loss value of the signal of the target signal transmission channel, thereby enabling the packaging substrate model and the signal quality of each signal transmission channel in the packaging substrate manufactured according to the model to meet the preset requirements.

[0055] It should be noted that the impedance of the signal line 1110, the signal via 1111 or the signal pad refers to the impedance to which the signal transmission is subjected relative to the reference layer. The greater the distance between the signal line 1110, the signal via 1111 or the signal pad and the reference layer, the greater the impedance of the signal line 1110, the signal via 1111 or the signal pad; the smaller the distance between the signal line 1110, the signal via 1111 or the signal pad and the reference layer, the smaller the impedance of the signal line 1110, the signal via 1111 or the signal pad.

[0056] It should also be noted that, because the size of the target signal vias penetrating the core layer is larger than the size of the signal vias penetrating other dielectric layers, adjusting the impedance of the target signal vias is more conducive to adjusting the quality of the signal of the target signal transmission channel. Of course, in other embodiments, the target signal vias may also include signal vias penetrating other dielectric layers, which will not be described in detail here.

[0057] It should also be noted that setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area needs to ensure that the signal quality of other signal transmission channels is not affected. For example, the integrity of the reference layer of other signals needs to be ensured.

[0058] In some embodiments of the present application, before setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as the hollowed-out area, it is also necessary to determine whether the target signal transmission channel has been subjected to basic impedance optimization, wherein the basic impedance optimization is used to optimize the basic items of the signal line, signal via and signal pad in the target signal transmission channel, and the basic items include at least material, size and spacing. If the basic impedance optimization has been performed, the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel is set as the hollowed-out area; if the basic impedance optimization has not been performed, the basic impedance optimization is performed.

[0059] In some embodiments of the present application, a hollowing evaluation of a first target area can be performed on any reference layer adjacent to a target signal via in a target signal transmission channel to obtain a hollowing evaluation result; the hollowing evaluation result is used to indicate whether setting the first target area of ​​the reference layer as a hollowing area affects the signal quality of other signal transmission channels. Then, based on the hollowing evaluation result, it is determined whether to set the first target area of ​​the reference layer as a hollowing area.

[0060] Taking a packaging substrate with 20 conductive layers as an example, these 20 conductive layers are arranged in sequence from top to bottom, and the core layer is between the 10th conductive layer and the 11th conductive layer. The reference layer in the 9th conductive layer or the 12th conductive layer is first evaluated for the hollowing out of the first target area. If the hollowing out evaluation result indicates that it does not affect the signal quality of other signal transmission channels, the first target area of ​​the reference layer in the 9th conductive layer and / or the 12th conductive layer is set as the hollowing out area; if the hollowing out evaluation result indicates that it affects the signal quality of other signal transmission channels, the reference layer in the 8th conductive layer or the 13th conductive layer is first evaluated for the hollowing out of the first target area, and so on, until a conductive layer in which a hollowing out area can be set is found, or until the evaluation of all conductive layers is completed.

[0061] It should be noted that before performing hollowing evaluation on any reference layer for the first target area, it is necessary to determine whether the reference layer has the first target area, that is, determine whether the reference layer has an area whose orthographic projection covers the orthographic projection of the target signal via.

[0062] In some embodiments of the present application, Figure 4 or Figure 5 As shown, a first target region of a reference layer such as a third conductive layer 111a adjacent to a target signal via 1111a in a target signal transmission channel may be set as a hollow region. Of course, the present application is not limited thereto. In other embodiments, first target regions of multiple reference layers adjacent to a target signal via in a target signal transmission channel may also be set as hollow regions. Figure 6 As shown, Figure 6This is a schematic cross-sectional structure diagram of another packaging substrate model disclosed in an embodiment of the present application, in which a plurality of reference layers adjacent to a target signal via 1111a in a target signal transmission channel, such as a reference layer in the third conductive layer 111a and a first target region in the reference layer in the sixth conductive layer 111b, can be set as a hollow region. Based on this, the hollow region can be flexibly set to improve the hollowing effect.

[0063] Furthermore, in some embodiments of the present application, Figure 6 As shown, the first target area is set as a plurality of reference layers of the hollowed-out area, such as the reference layer in the third conductive layer 111a and the reference layer in the sixth conductive layer 111b, which can be respectively located on opposite sides of the target signal via hole 1111a. Of course, the present application is not limited to this. In other embodiments, such as Figure 7 As shown, Figure 7 Schematic diagram of the cross-sectional structure of another model of a package substrate disclosed in an embodiment of the present application, wherein the first target area is set as a plurality of reference layers of the hollowed-out area, such as the reference layer in the third conductive layer 111a and the reference layer in the second conductive layer 111c, which can be located on the same side of the target signal via hole such as 1111a. Or, Figure 8 As shown, Figure 8 It is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application. Multiple reference layers, such as the reference layer in the sixth conductive layer 111b and the reference layer in the seventh conductive layer 111d, may be located on the same side of a target signal via, such as 1111a.

[0064] In order to more clearly illustrate the hollowed-out area, the following is an illustration of the three-dimensional structure of the target signal via and the conductive layer. Fig. 9 and Fig.10 As shown, Fig. 9 Schematic diagram of a three-dimensional structure of a target signal via and a conductive layer before a hollowed-out area is provided according to an embodiment of the present application. Fig.10 Schematic diagram of the three-dimensional structure of a target signal via and a conductive layer after a hollowed-out area is set in an embodiment of the present application. The first target area is set as a plurality of reference layers of the hollowed-out area, such as the second conductive layer 111c, the third conductive layer 111a, the sixth conductive layer 111b and the seventh conductive layer 111d, respectively located on opposite sides of the target signal via such as 1111a. The shapes of the hollowed-out areas located on opposite sides of the target signal via such as 1111a can be the same, for example, the same as the shape of the target signal via such as 1111a. Fig.11 As shown, Fig.11This is a schematic diagram of the three-dimensional structure of another target signal via and conductive layer after setting a hollowed-out area disclosed in an embodiment of the present application, in which the first target area is set as multiple reference layers of the hollowed-out area, such as the second conductive layer 111c and the third conductive layer 111a, and the reference layers are only located on one side of the target signal via such as 1111a.

[0065] It should be noted that if Fig. 9 As shown, the target signal via is electrically connected to the signal line or signal via in other conductive layers through the via pad in the conductive layer adjacent to it. There is an anti-pad between the via pad and other structures in the conductive layer on the same layer, which is used to ensure the insulation between the via pad and other structures in the conductive layer on the same layer. Preferably, the center position of the hollowed-out area is the same as the center position of the target signal via, and the orthographic projection of the hollowed-out area covers and exceeds the orthographic projection of the target signal via and its via pad and anti-pad to ensure the hollowing effect.

[0066] In some embodiments of the present application, the first target area of ​​the reference layer close to the target signal via in the target signal transmission channel among the multiple reference layers adjacent to the target signal via in the target signal transmission channel can be set as a hollowed-out area, and then the signal quality of the model of the package substrate is evaluated. If the signal quality of the target signal transmission channel still does not meet the preset requirements, the first target area of ​​the reference layer far from the target signal via in the multiple reference layers adjacent to the target signal via in the target signal transmission channel is set as a hollowed-out area. Among them, multiple reference layers with hollowed-out areas are continuously set in the package substrate model. Based on this, the hollowed-out area can be accurately set according to the quality evaluation results to ensure the signal quality optimization effect.

[0067] Of course, the present application is not limited to this. In other embodiments, the first target areas of multiple reference layers adjacent to the target signal vias in the target signal transmission channel can also be directly set as hollowed-out areas, which will not be repeated here.

[0068] In some embodiments of the present application, before setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area, a ground via adjacent to the target signal via may also be set in the core layer of the package substrate model.

[0069] like Fig.12 As shown, Fig.12This is a schematic diagram of the via distribution of a core layer disclosed in an embodiment of the present application. One or more ground vias 1111b can be arranged around a target signal via 1111a to reduce signal crosstalk between the target signal via 1111a and other signal vias through the ground vias 1111b, reduce the crosstalk value of the target signal transmission channel, and improve the signal quality of the target signal transmission channel, so that the signal quality of each signal transmission channel in the packaging substrate model and the packaging substrate manufactured according to the model can meet the preset requirements.

[0070] Of course, the present application is not limited to this. In other embodiments, after setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area, a ground via adjacent to the target signal via is set in the core layer of the packaging substrate model, which will not be repeated here.

[0071] In some embodiments of the present application, after a ground via adjacent to a target signal via is provided in the core layer of the package substrate model, such as Fig.12 As shown, the distance D between the target signal via and the ground via can also be set to a preset distance, which at least includes a distance equal to the aperture L of the target signal via, that is, the preset distance is at least equal to the aperture L of the target signal via.

[0072] It is understandable that although the crosstalk between the target signal via and other signal vias can be optimized after the ground via adjacent to the target signal via is set in the core layer of the packaging substrate model, if the spacing between the target signal via and the ground via is too small, the impedance of the target signal via will be too small. If the spacing between the target signal via and the ground via is too large, the impedance of the target signal via will be too large. Therefore, in order to ensure the impedance continuity of the target signal transmission channel, optimize the model of the packaging substrate and the signal quality of each signal transmission channel in the packaging substrate made according to the model, it is necessary to set the spacing between the target signal via and the ground via to an appropriate spacing.

[0073] In some embodiments of the present application, the second target area of ​​the reference layer adjacent to the target signal pad in the target signal transmission channel can also be set as a hollowed-out area to increase the impedance of the target signal pad by increasing the distance between the target signal pad and the reference layer, thereby optimizing the impedance continuity of the target signal transmission channel and the signal quality of the target signal transmission channel, so that the signal quality of each signal transmission channel in the packaging substrate model and the packaging substrate manufactured according to the model can meet the preset requirements.

[0074] The target signal pad includes a signal pad for outputting a signal in a target signal transmission channel. Specifically, the target signal pad includes a signal pad electrically connected to a printed circuit board in a model of a package substrate. The second target area of ​​the reference layer includes an area in the reference layer whose orthographic projection at least partially covers the target signal pad.

[0075] like Fig.13 As shown, Fig.13 This is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application. Taking the target signal transmission channel as the signal transmission channel in the dotted box as an example, the second target area of ​​the reference layer adjacent to the target signal pad 114a is set to a hollowed-out area, such as the second target area of ​​the reference layer in the sixth conductive layer 111b is set to a hollowed-out area B.

[0076] Similarly, a hollowing evaluation of the second target area can be performed on any reference layer adjacent to the target signal pad in the target signal transmission channel to obtain a hollowing evaluation result; the hollowing evaluation result is used to indicate whether setting the second target area of ​​the reference layer as the hollowing area affects the signal quality of other signal transmission channels. Then, based on the hollowing evaluation result, it is determined whether to set the second target area of ​​the reference layer as the hollowing area.

[0077] Taking a packaging substrate with 20 conductive layers as an example, these 20 conductive layers are arranged in sequence from top to bottom, and the conductive layer where the target signal pad is located is the 20th conductive layer. The reference layer in the 19th conductive layer is first evaluated for the hollowing-out area of ​​the second target area. If the hollowing-out evaluation result indicates that it does not affect the signal quality of other signal transmission channels, the second target area of ​​the reference layer in the 19th conductive layer is set as the hollowing-out area; if the hollowing-out evaluation result indicates that it affects the signal quality of other signal transmission channels, the reference layer in the 18th conductive layer is evaluated for the second target area, and so on, until a conductive layer in which a hollowing-out area can be set is found, or until the evaluation of all conductive layers is completed.

[0078] As another optional implementation of the content disclosed in the present application, the embodiment of the present application further discloses a packaging substrate, which is manufactured according to the model of the packaging substrate disclosed in any of the above embodiments. Figure 2 The packaging substrate includes a plurality of conductive layers 111 and a plurality of dielectric layers 112 which are stacked, and there is a dielectric layer 112 between any two conductive layers 111 .

[0079] Each conductive layer 111 includes a signal line 1110. The signal lines 1110 of at least two conductive layers 111 are electrically connected through a signal via 1111 that penetrates the dielectric layer 112 therebetween. The signal line 1110, the signal via 1111, and signal pads located on at least one side of the packaging substrate, such as a first signal pad 113 and a second signal pad 114, constitute a signal transmission channel.

[0080] At least one signal transmission channel is a signal transmission channel that has been signal optimized using the signal optimization method disclosed in any of the above embodiments. In other words, at least one signal transmission channel has the same structure as the target signal transmission channel of the model of the packaging substrate disclosed in any of the above embodiments.

[0081] That is, the first target area of ​​the reference layer adjacent to the target signal via in at least one signal transmission channel is a hollowed-out area, and / or, one or more ground vias are arranged around the target signal via in at least one signal transmission channel, and / or, the distance between the target signal via and the ground via in at least one signal transmission channel is a preset distance, and / or, the second target area of ​​the reference layer adjacent to the target signal pad in at least one signal transmission channel is a hollowed-out area. Based on this, the signal quality of at least one signal transmission channel of the packaging substrate can be improved.

[0082] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer device, including a memory and a processor; the memory is used to store instructions; the processor is used to execute the signal optimization method of the packaging substrate disclosed in any of the above embodiments according to the instructions stored in the memory.

[0083] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer-readable storage medium on which instructions for executing the signal optimization method for the packaging substrate disclosed in any of the above embodiments are stored.

[0084] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this specification can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0085] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer program product, which includes computer program instructions, and when the computer program instructions are executed by a processor, the processor executes the signal optimization method for the packaging substrate disclosed in any of the above embodiments.

[0086] The computer program product may be written in any combination of one or more programming languages ​​to write program codes for performing the operations of the embodiments of the present application, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" language or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0087] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The above embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.

Claims

1. A signal optimization method for a packaging substrate, characterized in that: include: In response to the signal optimization instruction, performing a signal quality evaluation on the model of the packaging substrate to obtain a signal quality evaluation result; The model of the package substrate is a model constructed by simulating the structure of the package substrate to be manufactured; the model of the package substrate includes a plurality of signal transmission channels, each of which includes a signal line, a signal via and a signal pad; the signal via is used to realize the electrical connection of the signal lines of different layers, or realize the electrical connection between the signal line and the signal pad; Based on the signal quality evaluation result, determining a target signal transmission channel among the multiple signal transmission channels; The target signal transmission channel includes a signal transmission channel whose signal quality does not meet a preset requirement among the multiple signal transmission channels; Setting a first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area, so as to increase the impedance of the target signal via by increasing the distance between the target signal via and the reference layer, thereby optimizing the quality of the signal of the target signal transmission channel, and optimizing the quality of the signal of the package substrate manufactured according to the model of the package substrate; Among them, the target signal via includes a signal via that passes through the core layer of the model of the packaging substrate; the reference layer includes a planar conductive structure that is electrically connected to a power supply or a ground in multiple conductive layers of the model of the packaging substrate; and the first target area of ​​the reference layer includes an area in the reference layer where the orthographic projection at least partially covers the target signal via.

2. The method according to claim 1, characterized in that The step of setting the first target area of ​​the reference layer adjacent to the target signal via hole in the target signal transmission channel as a hollowed-out area comprises: Performing a hollowing evaluation of a first target area on any reference layer adjacent to a target signal via in the target signal transmission channel to obtain a hollowing evaluation result; the hollowing evaluation result is used to indicate whether setting the first target area of ​​the reference layer as a hollowing area affects the signal quality of other signal transmission channels; Based on the hollowing evaluation result, it is determined whether to set the first target area of ​​the reference layer as a hollowing area.

3. The method according to claim 1 or 2, characterized in that: The step of setting the first target area of ​​the reference layer adjacent to the target signal via hole in the target signal transmission channel as a hollowed-out area comprises: The first target area of ​​multiple reference layers adjacent to the target signal via in the target signal transmission channel is set as a hollowed-out area; the multiple reference layers are located on the same side of the target signal via, or the multiple reference layers are located on opposite sides of the target signal via.

4. The method according to claim 3, characterized in that The step of setting the first target regions of the plurality of reference layers adjacent to the target signal via holes in the target signal transmission channel as hollow regions comprises: Setting a first target area of ​​a reference layer close to the target signal via hole in the target signal transmission channel among a plurality of reference layers adjacent to the target signal via hole as a hollowing area; If the signal quality of the target signal transmission channel still does not meet the preset requirement, a first target area of ​​a reference layer away from the target signal via hole in the target signal transmission channel is set as a hollowing area.

5. The method according to claim 1, characterized in that Also includes: A ground via adjacent to the target signal via is provided in the core layer of the package substrate model.

6. The method according to claim 5, characterized in that After the ground via hole adjacent to the target signal via hole is provided in the core layer of the package substrate model, the method further includes: The distance between the target signal via and the ground via is set to a preset distance; the preset distance at least includes a distance equal to the aperture of the target signal via.

7. The method according to claim 1, characterized in that Also includes: Setting a second target area of ​​the reference layer adjacent to the target signal pad in the target signal transmission channel as a hollowed-out area, so as to increase the impedance of the target signal pad by increasing the distance between the target signal pad and the reference layer, thereby optimizing the signal quality of the target signal transmission channel; The target signal pad includes a signal pad for outputting a signal in the target signal transmission channel; and the second target area of ​​the reference layer includes an area of ​​the reference layer whose orthographic projection at least partially covers the target signal pad.

8. A computer device, characterized in that: including memory and processor; The memory is used to store instructions; The processor is used to execute the signal optimization method for the packaging substrate according to any one of claims 1 to 7 according to the instructions stored in the memory.

9. A computer-readable storage medium, characterized in that: Instructions for executing the signal optimization method for the packaging substrate according to any one of claims 1 to 7 are stored thereon.

10. A packaging substrate, characterized in that: It comprises a plurality of conductive layers and a plurality of dielectric layers stacked in layers, and there is a dielectric layer between any two conductive layers; Each of the conductive layers includes a signal line, and the signal lines of at least two of the conductive layers are electrically connected through a signal via hole penetrating a dielectric layer therebetween, and the signal line, the signal via hole, and a signal pad located on at least one side of the packaging substrate constitute a signal transmission channel; At least one of the signal transmission channels is a signal transmission channel that has been signal optimized using the signal optimization method described in any one of claims 1 to 7.

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