Circuit board packaging method

Abstract

The invention relates to the technical field of circuit board packaging, and discloses a circuit board packaging method, which comprises the following steps: sequentially carrying out electroplating baking treatment and plug hole exposure treatment on a circuit board to obtain an exposed circuit board; sequentially performing first light ray curing treatment, baking curing treatment and second light ray curing treatment on the exposed circuit board to obtain a cured circuit board; and board brushing treatment, image front film pasting treatment, image exposure treatment and acid etching treatment are sequentially carried out on the cured circuit board, and the processed circuit board is obtained. Therefore, according to the circuit board packaging method, the first light ray curing treatment, the baking curing treatment and the second light ray curing treatment are sequentially carried out on the ink in the through hole of the circuit board, and compared with the prior art, the purpose of improving the curing degree of the ink in the through hole can be achieved through two times of light ray curing treatment.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board packaging, and in particular to a circuit board packaging method. Background Art

[0002] As the requirements for package circuit board assembly continue to advance, more and more circuit boards require ink plugging.

[0003] At present, the existing ink plugging process is usually as follows: solder mask plugging → baking → UV irradiation (ultraviolet irradiation) → board brushing. However, the ink exposed at the through-hole after board brushing is prone to insufficient curing, that is, the photoreactivity rate of the ink at the through-hole is lower than 98%, and the thermal reaction rate is lower than 95%. In this way, after the circuit board is pattern-laminated, the dry film at the through-hole is prone to cross-linking reaction with the ink, which makes it difficult to peel off the dry film from the ink at the through-hole after the circuit board is acidified.

[0004] Therefore, during the packaging process of the circuit board, the ink at the through-hole of the circuit board has the problem of insufficient curing degree. Summary of the invention

[0005] The embodiments of the present invention provide a circuit board packaging method, device, computer equipment and storage medium to solve the problem of insufficient curing degree of ink at the through hole of the circuit board during the circuit board packaging process.

[0006] A circuit board packaging method, characterized in that the method comprises: The circuit board is subjected to an electroplating baking treatment and a plugging hole exposure treatment in sequence to obtain an exposed circuit board; sequentially performing a first light curing treatment, a baking curing treatment, and a second light curing treatment on the exposed circuit board to obtain a cured circuit board; The cured circuit board is subjected to a brushing process, a pre-image film laminating process, an image exposure process and an acid etching process in sequence to obtain a processed circuit board.

[0007] In the above method, optionally, the first light curing process includes: The upper surface and the lower surface of the through hole of the exposed circuit board are irradiated by an ultraviolet lamp according to a preset first irradiation time to obtain a first cured circuit board.

[0008] In the above method, optionally, the baking and curing process comprises: The first cured circuit board is placed in a closed baking device to bake and cure the ink in the through holes of the first cured circuit board according to a preset first baking time to obtain a second cured circuit board.

[0009] In the above method, optionally, the second light curing process includes: The upper surface and the lower surface of the through hole of the second cured circuit board are irradiated by ultraviolet lamps according to a preset second irradiation time to obtain a first cured circuit board, and the second irradiation time is greater than or equal to the first irradiation time.

[0010] In the above method, optionally, the plate brushing process includes: The ink on the cured circuit board whose through-hole openings are higher than the copper surface of the circuit board is brushed off by a board brushing device to obtain a circuit board with smooth through-holes.

[0011] In the above method, optionally, the image pre-filming process includes: The target image dry film is laminated on the circuit board with flat through holes to obtain a laminated circuit board.

[0012] In the above method, optionally, the image exposure processing includes: The film-laminated circuit board is exposed to light to laminate the image on the target image dry film onto the circuit board to obtain an image-laminated circuit board.

[0013] In the above method, optionally, the acid etching treatment comprises: The image-bonded circuit board is placed in an etching agent to etch the copper layer not covered by the image on the image-bonded circuit board to obtain the processed circuit board.

[0014] In the above method, optionally, the electroplating baking process comprises: The electroplated circuit board is placed in a closed baking device to bake the circuit board according to a preset second baking time to obtain a baked circuit board.

[0015] In the above method, optionally, the plugging hole exposure process includes: Using a silk screen scraper to insert ink into the through holes on the baked circuit board to obtain a plugged circuit board; The ink in the through hole of the plugged circuit board is exposed and cured by an exposure device, and the ink outside the through hole position on the plugged circuit board is removed after exposure to obtain the exposed circuit board.

[0016] The above-mentioned circuit board packaging method sequentially performs electroplating baking treatment and plugging exposure treatment on the circuit board to obtain an exposed circuit board; sequentially performs a first light curing treatment, a baking curing treatment and a second light curing treatment on the exposed circuit board to obtain a cured circuit board; sequentially performs a board brushing treatment, a pre-image film lamination treatment, an image exposure treatment and an acid etching treatment on the cured circuit board to obtain a processed circuit board. It can be seen that the circuit board packaging method of the present invention sequentially performs a first light curing treatment, a baking curing treatment and a second light curing treatment on the ink in the through-hole of the circuit board. Compared with the prior art, the two light curing treatments can achieve the purpose of improving the curing degree of the ink at the through-hole opening. BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0017] Figure 1 The present invention is a flowchart of a circuit board packaging method disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0020] It should also be understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0021] As used in the present specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]", depending on the context.

[0022] In addition, in the description of the present specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0023] References to "one embodiment" or "some embodiments" etc. described in the present specification mean that one or more embodiments of the present invention include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0024] The present invention discloses a circuit board packaging method, wherein the circuit board is subjected to an electroplating baking treatment and a plugging hole exposure treatment in sequence to obtain an exposed circuit board; the exposed circuit board is subjected to a first light curing treatment, a baking curing treatment and a second light curing treatment in sequence to obtain a cured circuit board; the cured circuit board is subjected to a board brushing treatment, a pre-image film laminating treatment, an image exposure treatment and an acid etching treatment in sequence to obtain a processed circuit board. It can be seen that the circuit board packaging method of the present invention sequentially performs a first light curing treatment, a baking curing treatment and a second light curing treatment on the ink in the through hole of the circuit board. Compared with the prior art, the purpose of improving the curing degree of the ink at the through hole mouth can be achieved through two light curing treatments. This will be described below through specific embodiments.

[0025] like Figure 1 FIG. 1 is a flowchart of a circuit board packaging method disclosed in an embodiment of the present invention. The method specifically includes the following steps: S101: performing electroplating baking treatment and plugging hole exposure treatment on the circuit board in sequence to obtain an exposed circuit board.

[0026] Among them, the electroplating baking treatment refers to electroplating the circuit board and then baking the electroplated circuit board. Electroplating is to deposit a metal or alloy layer, such as copper, on the surface of the circuit board by electrolytic reaction in the solution with the help of external direct current. The electroplated circuit board is placed in a closed baking equipment to bake the electroplated circuit board. Baking can reduce the residual water vapor on the circuit board after electroplating to avoid the occurrence of circuit board explosion.

[0027] The plugging hole exposure process refers to plugging the through holes on the circuit board with ink, and then exposing and developing the plugged circuit board. The ink plugging process refers to plugging ink into the through holes of the circuit board, and then exposing and developing the plugged circuit board to obtain the exposed circuit board.

[0028] S102: performing a first light curing treatment, a baking curing treatment and a second light curing treatment on the exposed circuit board in sequence to obtain a cured circuit board.

[0029] Specifically, in this embodiment, the first light curing treatment can be performed by an ultraviolet lamp (Uv lamp), and then the electroplated circuit board is baked and cured by a closed baking device. After the baking and curing treatment, the first light curing treatment is performed by an ultraviolet lamp again.

[0030] The first light curing treatment and the second light curing treatment are to improve the photothermal reaction of the ink at the through hole of the circuit board, thereby improving the curing degree of the ink. The baking curing treatment is to cure the ink by heating to improve the curing degree of the ink.

[0031] S103: performing a brushing process, a pre-image film laminating process, an image exposure process, and an acid etching process on the cured circuit board in sequence to obtain a processed circuit board.

[0032] Among them, the board brushing treatment is to brush off the ink on the circuit board through-hole opening that is higher than the surface of the substrate, so as to make the circuit board through-hole opening smooth; the image pre-filming treatment is to stick the target image dry film on the circuit board; the image exposure treatment is to expose the pattern in the graphic special dry film to the circuit board; the acid etching treatment is to bite the copper in the area on the circuit board that is not covered by the target image dry film to obtain the processed circuit board, that is, the circuit circuit board.

[0033] In summary, the present invention discloses a circuit board packaging method, wherein the circuit board is subjected to an electroplating baking treatment and a plugging hole exposure treatment in sequence to obtain an exposed circuit board; the exposed circuit board is subjected to a first light curing treatment, a baking curing treatment, and a second light curing treatment in sequence to obtain a cured circuit board; the cured circuit board is subjected to a brushing treatment, a pre-image film treatment, an image exposure treatment, and an acid etching treatment in sequence to obtain a processed circuit board. It can be seen that the circuit board packaging method of the present invention sequentially performs a first light curing treatment, a baking curing treatment, and a second light curing treatment on the ink in the through hole of the circuit board. Through two light curing treatments, the purpose of improving the curing degree of the ink at the through hole mouth can be achieved compared with the prior art.

[0034] In one implementation, the first light curing process in this embodiment includes: The upper surface and the lower surface of the through hole of the exposed circuit board are irradiated by ultraviolet lamps according to a preset first irradiation time to obtain a first cured circuit board.

[0035] In a specific implementation, the processing time of the ultraviolet lamp in this embodiment, that is, the time of the first light curing treatment can be set according to actual needs, such as 30s, 60s, etc., which is not limited in this embodiment.

[0036] In one implementation, the baking and curing process includes: The first cured circuit board is placed in a closed baking device to bake and cure the ink in the through holes of the first cured circuit board according to a preset first baking time to obtain a second cured circuit board.

[0037] In a specific implementation, the baking equipment in this embodiment can be a closed oven. The first cured circuit board is placed in the closed oven, and then the baking temperature and the first baking time of the oven are set. Since the circuit board has been baked once after electroplating, the baking temperature and the first baking time of this baking and curing treatment can be slightly lower, such as 80°C, 85°C, etc., and the first baking time can be 30min, 40min or 50min, etc. In this embodiment, the baking temperature and the first baking time are not specifically limited.

[0038] In one implementation, the second light curing process includes: The upper surface and the lower surface of the through hole of the second cured circuit board are irradiated by ultraviolet light according to a preset second irradiation time to obtain a first cured circuit board, wherein the second irradiation time is greater than or equal to the first irradiation time.

[0039] In a specific implementation, the processing time of the ultraviolet lamp in this embodiment, that is, the time of the second light curing treatment, can be set according to actual needs, such as 60s, 90s, etc., which is not limited in this embodiment.

[0040] In one implementation, the board brushing process includes: The ink whose through-hole openings on the cured circuit board are higher than the copper surface of the circuit board is brushed off by a board brushing device to obtain a circuit board with smooth through-holes.

[0041] Specifically, the brushing device in this embodiment can be a ceramic brush stick or a ceramic brush plate. The current of the brushing device is 1-3 amperes. The specific current of the brushing device is not limited in this embodiment.

[0042] Furthermore, in this embodiment, the brush marks produced during the brushing process can be smoothed by sandblasting. Specifically, corundum can be used in this embodiment, and the sandblasting time can be 2 minutes, 3 minutes or 5 minutes, etc., and the sandblasting time is not limited in this embodiment.

[0043] In one implementation, the image pre-filming process includes: The target image dry film is laminated on the circuit board with flat through holes to obtain a laminated circuit board. The laminating line speed of laminating the target image dry film includes but is not limited to 1.5 m / min, 2.5 m / min, 3.5 m / min, etc., and the laminating line speed is not limited in this embodiment.

[0044] In one implementation, the image exposure process includes: The laminated circuit board is exposed to light to laminate the image on the target image dry film onto the circuit board to obtain an image-laminated circuit board.

[0045] Specifically, in this embodiment, the image in the target image dry film can be exposed to the circuit board by an exposure machine to obtain an image-bonded circuit board, wherein the exposure energy of the exposure machine includes but is not limited to 70-100 mj.

[0046] In one implementation, the acid etching process includes: The image-bonded circuit board is placed in an etching agent to etch the copper layer not covered by the image on the image-bonded circuit board to obtain a finished circuit board.

[0047] Specifically, the etching agent in this embodiment includes but is not limited to CuCl2 solution.

[0048] In one implementation, the electroplating baking process includes: The electroplated circuit board is placed in a closed baking device to bake the circuit board according to a preset second baking time to obtain a baked circuit board.

[0049] In a specific implementation, the baking equipment in this embodiment can be a closed oven. The electroplated circuit board is placed in the closed oven, and then the baking temperature and the second baking time of the oven are set. The baking temperature can be 193°C, 195°C, etc., and the second baking time can be 100min, 120min or 150min, etc. In this embodiment, there is no specific limitation on the baking temperature and the second baking time.

[0050] In one implementation, the plug hole exposure process includes: The ink is inserted into the through holes on the baked circuit board by a silk screen scraper to obtain a plugged circuit board; The ink in the through-hole of the plugged circuit board is exposed and cured by an exposure device, and the ink outside the through-hole position on the exposed plugged circuit board is removed to obtain an exposed circuit board.

[0051] Specifically, in this embodiment, the ink can be inserted into the through hole of the circuit board by a silk screen scraper to fill the hole wall, and the ink in the through hole can be photoreacted and cured under light conditions by using an exposure device. The exposure device can be an exposure machine, and the exposure energy of the exposure machine includes but is not limited to 490mj / cm², 500mj / cm², 510mj / cm², etc. The development line speed during the development process can be 3.0m / min, 4.0m / min, which is not limited in this embodiment.

[0052] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0053] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A circuit board packaging method, characterized in that: The method comprises: The circuit board is subjected to an electroplating baking treatment and a plugging hole exposure treatment in sequence to obtain an exposed circuit board; sequentially performing a first light curing treatment, a baking curing treatment, and a second light curing treatment on the exposed circuit board to obtain a cured circuit board; The cured circuit board is subjected to a brushing process, a pre-image film laminating process, an image exposure process and an acid etching process in sequence to obtain a processed circuit board.

2. The circuit board packaging method according to claim 1, characterized in that: The first light curing process comprises: The upper surface and the lower surface of the through hole of the exposed circuit board are irradiated by an ultraviolet lamp according to a preset first irradiation time to obtain a first cured circuit board.

3. The circuit board packaging method according to claim 2, characterized in that: The baking and curing process comprises: The first cured circuit board is placed in a closed baking device to bake and cure the ink in the through holes of the first cured circuit board according to a preset first baking time to obtain a second cured circuit board.

4. The circuit board packaging method according to claim 3, characterized in that: The second light curing process comprises: The upper surface and the lower surface of the through hole of the second cured circuit board are irradiated by ultraviolet lamps according to a preset second irradiation time to obtain a first cured circuit board, and the second irradiation time is greater than or equal to the first irradiation time.

5. The circuit board packaging method according to claim 1, wherein: The brushing process includes: The ink on the cured circuit board whose through-hole openings are higher than the copper surface of the circuit board is brushed off by a board brushing device to obtain a circuit board with smooth through-holes.

6. The circuit board packaging method according to claim 5, characterized in that: The image pre-filming process includes: The target image dry film is laminated on the circuit board with flat through holes to obtain a laminated circuit board.

7. The circuit board packaging method according to claim 6, characterized in that: The image exposure process comprises: The film-laminated circuit board is exposed to light to laminate the image on the target image dry film onto the circuit board to obtain an image-laminated circuit board.

8. The circuit board packaging method according to claim 7, characterized in that: The acid etching process comprises: The image-bonded circuit board is placed in an etching agent to etch the copper layer not covered by the image on the image-bonded circuit board to obtain the processed circuit board.

9. The circuit board packaging method according to claim 1, wherein: The electroplating baking process comprises: The electroplated circuit board is placed in a closed baking device to bake the circuit board according to a preset second baking time to obtain a baked circuit board.

10. The circuit board packaging method according to claim 9, characterized in that: The plug hole exposure process comprises: Using a silk screen scraper to insert ink into the through holes on the baked circuit board to obtain a plugged circuit board; The ink in the through hole of the plugged circuit board is exposed and cured by an exposure device, and the ink outside the through hole position on the plugged circuit board is removed after exposure to obtain the exposed circuit board.

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