Electronic device

Abstract

The purpose of the present invention is to provide an electronic device in which a substrate is accurately housed in a case and a load acting on the substrate is reduced. An electronic device (1) is provided with a case main body (10), a circuit board (40), and a cover body (50). The housing main body has a support piece (19) rising from the bottom plate (11), a first elastic piece (29a) provided so as to be elastically deformable in the plate thickness direction of the support piece, and a first holding claw (29b) protruding inward from the first elastic piece. The circuit board (40) has a first end surface (45) that faces the inner surface of the support sheet and extends in the front-rear direction (X), and at least a portion of the first end surface is provided with a first cut surface (45a) that is cut in the front-rear direction (X) and is formed at a predetermined position. The first cutting surface is clamped on the first holding claw and is pressed inwards in the left-right direction Y, so that the circuit substrate is held on the housing main body.

Description

Technical Field

[0001] The present invention relates to electronic devices. Background Art

[0002] In the past, electronic devices such as controllers of electronic devices are known (for example, see Patent Documents 1 to 3). Patent Document 1 discloses a safety device, which includes a housing composed of a bottom plate and side walls rising from the bottom plate, a substrate arranged in the housing, and an elastic snap-fit ​​claw that elastically deforms in the plate thickness direction of the side wall and snap-fits with a side of the substrate. According to this structure, by using the elastic snap-fit ​​claw, the substrate can be mounted on the housing without using components such as screws.

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2010-251644

[0005] Patent Document 2: Japanese Patent Application Publication No. 2002-289987

[0006] Patent Document 3: Japanese Patent Application Publication No. 2001-203483

[0007] However, in the electronic device as described above, in order to improve the efficiency of manufacturing, sometimes multiple substrates are cut out from a plate-shaped substrate material, so-called "taking out multiple". In this case, a perforated line-shaped fracture portion is pre-formed on the substrate material, and the substrate material is cut along the fracture portion by bending by hand, etc., thereby manufacturing (cutting off) multiple substrates from one substrate material. However, in the case of such a fracture method, the position for cutting off is easy to be different for each substrate, so it is difficult to obtain the dimensional accuracy of the substrate. Therefore, in the case of cutting off the substrate at a position where the size of the substrate is larger than the assumed size due to the deviation of the size of the substrate, the elastic engaging claw is deformed beyond the assumed ground, and the housing expands. In addition, in this case, due to the restoring force of the elastic engaging claw that is deformed beyond the assumed ground, an unexpected load is applied to the substrate and the electronic components mounted on the substrate. On the other hand, in the case of cutting off the substrate at a position where the size of the substrate is smaller than the assumed position, the holding force of the elastic engaging claw on the substrate is reduced. In addition, sometimes protrusions such as burrs and depressions occur in the fracture portion after cutting. Therefore, for example, in the case of protrusions such as burrs, the connection between the housing and the substrate is hindered. As described above, the cut state of the substrate is an important factor for accurately housing the substrate in the case.

[0008] Regarding the cutting of the substrate, there is known a technique for suppressing the occurrence of protrusions such as burrs by designing the shape of the slit constituting the breaking portion (for example, see Patent Document 2). In the printed substrate described in Patent Document 2, the slit is formed by overlapping a hole in contact with the cutting portion and a through groove having a diameter larger than the diameter of the hole and a semicircular front end and extending along the cutting portion, and the hole and the through groove are used to suppress the occurrence of protrusions such as burrs.

[0009] On the other hand, a technique for dealing with the above-mentioned protrusions such as burrs by improving the structure of a housing for storing substrates is also disclosed (for example, see Patent Document 3). In the housing of the electronic control device described in Patent Document 3, a relief portion is provided at a portion opposite to a connecting portion that is a cut portion of the substrate, and a space is formed between the connecting portion and the relief portion, so that the protrusions such as burrs are stored in the relief portion, thereby storing the substrate in the housing without being affected by the protrusions.

[0010] However, since the size of protrusions and depressions such as burrs is determined by the situation, not only is the deviation of the size of the substrate likely to become larger, but when the fracture portion is formed in advance and the substrate is fractured by bending the substrate by hand, etc., the substrate can be manufactured at a low cost, but as mentioned above, the size of the substrate is prone to deviation. Therefore, it is difficult to deal with the above-mentioned problems regarding storage or load in any of the structures of Patent Documents 2 and 3. Summary of the invention

[0011] An object of the present invention is to provide an electronic device that can accurately accommodate a substrate in a housing and reduce a load on the substrate.

[0012] In order to solve the above-mentioned problems and achieve the purpose, the electronic device comprises: a shell body, which has a bottom plate and is open in a direction opposite to the bottom plate; a circuit substrate, which is housed in the shell body; and a cover body, which covers the opening of the shell body. The electronic device is characterized in that the shell body has: a support sheet, which stands up from the bottom plate; an elastic sheet, which is arranged in a manner that can be elastically deformed in the plate thickness direction of the support sheet; and a retaining claw, which is arranged in a manner that protrudes inward from the elastic sheet, the circuit substrate has a first end face that is opposite to the inner surface of the support sheet and extends in a predetermined direction, and a first cut surface that is cut along the predetermined direction and formed at a predetermined position is provided on at least a portion of the first end face, and the circuit substrate is retained in the shell body by the first cut surface being locked in the retaining claw and pressed inward in an orthogonal direction orthogonal to the predetermined direction.

[0013] According to the present invention, in the circuit substrate, by providing a first cutting surface on at least a portion of the first end face, the dimensional accuracy of the portion extending in a predetermined direction and fixed to the retaining claw can be improved. Thus, even in a scenario where the dimensional accuracy of the circuit substrate is expected to deviate due to the above-mentioned removal of multiple pieces, the positional accuracy of the portion fixed to the retaining claw relative to the housing body can be improved. Therefore, the circuit substrate can be accurately accommodated in the housing body and the circuit substrate can be stably fixed. In addition, by increasing the dimensional accuracy of the portion of the circuit substrate that is fixed to the retaining claw, the elastic sheet is prevented from deforming beyond the expectation. Therefore, the occurrence of an unexpected restoring force on the elastic sheet is also prevented, and the application of an unexpected load to the circuit substrate is prevented. Therefore, an electronic device that accurately accommodates the substrate in the housing and reduces the load acting on the substrate can be provided.

[0014] At this time, it is preferred that the circuit substrate has a second end face, the second end face has a portion that is orthogonal to the first end face and extends along the orthogonal direction, and a second cut surface that is cut along the orthogonal direction and formed at a predetermined position is provided on at least a portion of the second end face, and the circuit substrate is positioned in the housing body by the second cut surface abutting or approaching a portion of the housing body. According to such a structure, the position of the circuit substrate in the orthogonal direction is determined by the retaining claw and the first cut surface, and the position of the circuit substrate in the predetermined direction is determined by the second cut surface and a portion of the housing body. That is, the circuit substrate is positioned relative to the housing body from at least two directions. Therefore, the positional accuracy of the circuit substrate relative to the housing body is improved, and the state in which the circuit substrate is accommodated in the housing body can be stably maintained.

[0015] In addition, it is preferred that the support sheet has a rib protruding inwardly of the housing body, and the side surface of the rib is arranged to abut or approach the second cutting surface. According to such a structure, by making the side surface of the rib abut or approach the second cutting surface, the position of the circuit substrate relative to the predetermined direction of the housing body can be determined. In addition, according to this structure, the side surface of the rib can also be made to slide in contact with the second cutting surface, thereby, the rib can be used as a guide when the circuit substrate is installed in the housing body. Therefore, the substrate can be stored in the housing more accurately.

[0016] In addition, it is preferred that the circuit substrate has a third end face extending from and opposite to the inner surface of the support sheet at a position different from the first end face, the third end face is a non-cut surface, and the distance between the first end face and the inner surface of the support sheet is smaller than the distance between the third end face and the inner surface of the support sheet. According to such a structure, by setting the distance between the first end face having the first cut surface and the inner surface of the support sheet to be smaller than the distance between the third end face as the non-cut surface and the inner surface of the support sheet, it is possible to make it difficult for the third end face to abut against the support sheet, and the first cut surface can be reliably locked by the retaining claw. Therefore, even if there is a case where the size of the circuit substrate is deviated due to, for example, the third end face is formed by bending and breaking, or the size of the circuit substrate is deviated due to the formation of protrusions such as burrs and depressions on the third end face, the substrate can be accurately stored in the housing without being affected, and the load acting on the substrate can be reduced.

[0017] The effects of the present invention are as follows.

[0018] According to the present invention, it is possible to provide an electronic device that can accurately accommodate a substrate in a housing and reduce a load on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a perspective view showing a state in which the electronic device according to the first embodiment of the present invention is assembled.

[0020] Figure 2 This is an exploded perspective view of the electronic device viewed from the upper right.

[0021] Figure 3 It is a perspective view of a casing body constituting an electronic device.

[0022] Figure 4 This is an exploded perspective view of the electronic device viewed from the lower right.

[0023] Figure 5 is a side view of the electronic device.

[0024] Figure 6 It is a top view of a substrate constituting an electronic device.

[0025] Figure 7 It is a diagram showing the separation distance between the substrate and the housing body.

[0026] Figure 8 yes Figure 5 A cross-sectional view of the electronic device taken along line AA.

[0027] Fig. 9 yes Figure 8 An enlarged view of the main part of area A.

[0028] Fig.10This is a perspective view of the electronic device with the terminal block removed.

[0029] Fig.11 Observe from the front Fig.10 A front view of the electronic device in FIG.

[0030] Fig.12 It is a perspective view of an electronic device according to a second embodiment.

[0031] Fig.13 yes Fig.12 A top view of an electronic device in FIG.

[0032] Fig.14 It is a top view of the protective cover installed on the housing body.

[0033] Fig.15 (A) is an enlarged view of a main part showing one of the fixing holes provided in the housing body. Fig.15 (B) is an enlarged view of the main part showing the other side of the fixing hole.

[0034] In the figure: X—front-to-back direction (predetermined direction), Y—left-to-right direction (orthogonal direction), Z—height direction (plate thickness direction), 1—electronic device, 10—housing body, 11—bottom plate, 19—support plate, 27—first wall portion, 28—second wall portion, 29—first locking portion, 29a—first elastic plate (elastic plate), 29b—first retaining claw (retaining claw), 40—circuit substrate, 41—substrate, 42—outer component, 45—first end face, 45a—first cutting face, 50—cover body, 51—top plate, 52—partition wall (side wall), 59—cover side wall. DETAILED DESCRIPTION

[0035] The following is based on Figures 1 to 11 A first embodiment of the present invention will be described. The electronic device 1 of the first embodiment is used as a controller of an electric valve such as an electronic expansion valve constituting a refrigeration cycle, for example. Figure 1 As shown, the electronic device 1 includes a housing body 10, a circuit substrate 40, and a cover body 50. In addition, in the following description, the plate thickness direction of the circuit substrate 40 is set as the height direction and is recorded as the "height direction Z". In addition, one side of the height direction Z is recorded as the "upper side Z1", and the other side is recorded as the "lower side Z2". In addition, one side of the surface extension direction of the circuit substrate 40 orthogonal to the height direction Z is recorded as the front-to-back direction X (predetermined direction), and the other side is recorded as the left-to-right direction Y (orthogonal direction). Furthermore, one side of the front-to-back direction X is recorded as the "front side X1", and the other side is recorded as the "rear side X2". In addition, one side of the left-to-right direction Y is recorded as the "right side Y1", and the other side is recorded as the "left side Y2".

[0036] In addition, the definitions of these directions are only for convenience of explanation and are not necessarily consistent with the directions in the actual use state of the electronic device 1, and do not limit the directions of the electronic device 1. For example, in the actual use state of the electronic device 1, Figure 1 The lower side Z2 portion of the electronic device 1 is installed on the installation object, and the upper side Z1 portion is the surface. Figure 1 The front-to-back direction X in the image becomes the up-down direction. For example, sometimes Figure 1 The front side X1 in the figure actually becomes the bottom side, Figure 1 The rear side X2 in the figure actually becomes the upper side.

[0037] like Figure 2 As shown in FIG. 1 , the housing body 10 is formed into a box shape opened to the upper side Z1 by resin molding or the like. The housing body 10 includes a bottom plate 11 having a rectangular shape with long sides in the left-right direction Y. The surface on the upper side Z1 of the bottom plate 11 constitutes a surface supporting the circuit substrate 40, as shown in FIG. Figure 3 As shown, a mounting surface 12 is provided in the center portion in the front-rear direction X. The mounting surface 12 is formed in a rectangular shape having long sides in the left-right direction Y. Support protrusions 13 are formed at the four corners of the mounting surface 12 and rise upward to the upper side Z1. The protruding end portions 13a of the support protrusions 13 abut against the surface of the lower side Z2 of the circuit substrate 40 to support the circuit substrate 40 upward. Figure 4 As shown, the surface of the lower side Z2 of the bottom plate 11 constitutes a mounting surface 14 for mounting the electronic device 1 on a mounting object. A mounting groove 15 opening toward the lower side Z2 is formed in the center portion of the mounting surface 14 in the front-rear direction X. The mounting groove 15 is formed from the end of the right side Y1 to the end of the left side Y2 of the mounting surface 14 over the left-right direction Y, and is engaged with a rail (not shown) that is the mounting object.

[0038] A guide groove 16 is formed in the central part of the mounting groove 15 in the left-right direction Y, which is connected to the mounting groove 15 and extends to the end of the front side X1 of the mounting surface 14. A substantially rectangular DIN rail locking member 17 is provided in the guide groove 16, and the DIN rail locking member 17 is supported to be able to move forward and backward along the front-back direction X. When the DIN rail locking member 17 is displaced to the front side X1, the electronic device 1 can move along the left-right direction Y on the rail of the installation object via the mounting groove 15 engaged with the rail. On the other hand, when the DIN rail locking member 17 is displaced to the rear side X2, the electronic device 1 is locked on the rail by pressing the rail with the end of the rear side X2 of the DIN rail locking member 17, and the electronic device 1 cannot be displaced on the rail. According to this structure, the position of the electronic device 1 on the rail can be arbitrarily changed. Demolding holes 18 that penetrate along the height direction Z are respectively formed at the left and right end portions of the front and rear end edges of the mounting groove 15. The mold release hole 18 is a hole for extracting a mold when forming a first locking portion 29 described later, and is formed at a position corresponding to a portion on the lower side Z2 of the first locking portion 29 .

[0039] like Figure 2 As shown, a pair of support pieces 19 are formed on both left and right end edges of the bottom plate 11, rising upward to the upper side Z1 and facing each other in the left-right direction Y. The support piece 19 is a side wall that supports the circuit substrate 40 in the left-right direction Y. A first track 20 (rib) protruding inward is formed on the support piece 19. The first track 20 is located in a first groove 41a of the circuit substrate 40 described later, and is a portion for guiding the installation of the circuit substrate 40 to the housing body 10. In the present embodiment, the first track 20 is formed at the edge of the front side X1 and the edge of the rear side X2 of the support piece 19 on the right side Y1 and the left side Y2, respectively, protruding inward in the left-right direction Y and extending in the height direction Z. The width dimension of the first track 20 in the left-right direction Y increases as it goes toward the lower side Z2.

[0040] A second rail 31 is formed in the center of the inner surface of the support piece 19 on the left side Y2 in the front-back direction X, protruding inward in the left-right direction Y and extending in the height direction Z. The dimension of the second rail 31 in the left-right direction Y is constant throughout the height direction Z. The second rail 31 is located in the second groove 41b of the circuit substrate 40 described later, and guides the installation of the circuit substrate 40 to the housing body 10. The second rail 31 is formed only on the support piece 19 on the left side Y2, so that the circuit substrate 40 is stored in the housing body 10 only in the direction in which the second rail 31 is inserted into the second groove 41b. Therefore, it is prevented that the circuit substrate 40 is stored in the housing body 10 in an incorrect direction.

[0041] In addition, although the first rail 20 is formed at the edge of the front side X1 and the edge of the rear side X2 of the support piece 19 on the right side Y1 and the left side Y2, respectively, it is not limited to this, and the first rail 20 may be formed at any position of the support piece 19. In addition, in the present embodiment, the dimension of the left-right direction Y of the second rail 31 is made constant throughout the height direction Z, but the dimension of the left-right direction Y may also increase toward the lower side Z2 in the same manner as the first rail 20. In addition, the second rail 31 does not need to be formed at the central part of the inner surface of the support piece 19 on the left side Y2 in the front-back direction X, and more than one may be formed at any position of the inner surface of the support piece 19 on the left side Y2, and more than one may be formed at any position of the support piece 19 on the right side Y1. In addition, when the second rail 31 is formed on the support piece 19 on both sides, the number of the second rail 31 may be different on the right side Y1 and the left side Y2 so that the orientation of the circuit board 40 stored in the housing body 10 is limited to one orientation.

[0042] The support piece 19 includes a lower wall portion 21 (root portion) constituting a portion on the lower side Z2 (side of the bottom plate of the housing body) and an upper wall portion 22 (front end portion) constituting a portion on the upper side Z1 (side of the opening of the housing body). The outer surface of the lower wall portion 21 is located outside the outer surface of the upper wall portion 22 in the left-right direction Y (that is, the outer surface of the upper wall portion 22 is located inside the outer surface of the lower wall portion 21 in the left-right direction Y), and thus, a step portion 23 extending from the outer surface of the lower wall portion 21 to the outer surface of the upper wall portion 22 in the left-right direction Y is formed at the boundary between the lower wall portion 21 and the upper wall portion 22. A plate-shaped extension portion 24 protruding outward in the front-rear direction X is formed on the lower wall portion 21.

[0043] In the present embodiment, a pair of extensions 24 are formed at the front and rear of the lower wall 21, one of which protrudes from the edge of the front side X1 of the lower wall 21 to the front side X1 and extends to the front side X1 of the partition wall 52 (side wall) of the front side X1 of the cover body 50 described later, and the other protrudes from the edge of the rear side X2 of the lower wall 21 to the rear side X2 and extends to the rear side X2 of the partition wall 52 (side wall) of the rear side X2 of the cover body 50. A fixing hole 25 is formed through the upper part of the extension 24 in the plate thickness direction. The fixing hole 25 is a through hole for fixing the protective cover 70 described later. In order to avoid interference with components mounted on the electronic device 1, the fixing hole 25 is formed at a position that is lower Z2 than the step portion 23, lower Z2 than the connector insertion hole 57 described later, and upper Z1 than the screw terminal block 42a and the screwless terminal block 42b described later.

[0044] In addition, the protective cover 70 may be omitted. In the first embodiment, the electronic device 1 omits the protective cover 70. A substantially rectangular recess 26 is formed in the central portion of the lower wall portion 21 and is recessed inward in the left-right direction Y. The bottom surface of the recess 26 is located at the innermost side of the outer surface of the support sheet 19 in the left-right direction Y. Thus, the lower wall portion 21 includes a first wall portion 27 whose outer surface constitutes the outermost surface of the housing body 10 and a second wall portion 28 in which the recess 26 is formed and which is recessed inwardly than the first wall portion 27. A first locking portion 29 for locking and holding the circuit substrate 40 is formed in the second wall portion 28.

[0045] The first locking portion 29 is a so-called snap, which is formed by cutting the second wall portion 28 (i.e., the support piece 19) in a roughly U-shaped shape along the plate thickness direction, and can be elastically deformed in the left-right direction Y. The first locking portion 29 includes a first elastic piece 29a (elastic piece) configured to be elastically deformable in the left-right direction Y and a first retaining claw 29b (retaining claw) configured to protrude inward from the inner surface of the first elastic piece 29a and have a tapered front end. In the present embodiment, the first locking portion 29 is provided with two separately in the front-to-back direction X. Specifically, the first locking portion 29 is formed at the front and rear ends of the second wall portion 28. However, the number and configuration of the first locking portion 29 are not limited thereto, and the number and configuration thereof can be appropriately changed.

[0046] The upper wall portion 22 is provided with a second locking portion 30 for locking and holding the cover side wall 59 described later. The second locking portion 30 is also provided with two separately in the front-rear direction X in the same manner as the first locking portion 29. Specifically, the second locking portion 30 is formed at the front and rear ends of the upper wall portion 22. The second locking portion 30 is also a buckle in the same manner as the first locking portion 29, and is formed by cutting the upper wall portion 22 (i.e., the support piece 19) in an inverted U-shape along the plate thickness direction, and is elastically deformable in the left-right direction Y. The second locking portion 30 includes a second elastic piece 30a (elastic piece) provided to be elastically deformable in the left-right direction Y, and a second retaining claw 30b (retaining claw) provided to have a pointed front end protruding from the outer surface of the second elastic piece 30a toward the outside in the left-right direction Y. In addition, the first locking portion 29 and the second locking portion 30 are both formed by cutting out a portion of the support piece 19. Therefore, compared with the case where the first locking portion 29 and the second locking portion 30 are constructed separately from the support piece 19, the amount of the first locking portion 29 and the second locking portion 30 protruding from the support piece 19 in the left-right direction Y can be reduced, which can accordingly contribute to the miniaturization of the electronic device 1.

[0047] The circuit board 40 is, for example, a printed circuit board, and is formed into a rectangular shape having long sides in the left-right direction Y. The circuit board 40 is moved toward the lower side Z2 and accommodated in the housing body 10 with the surface of the lower side Z2 facing the bottom plate 11, and is supported across the pair of support pieces 19. Figure 6As shown, the circuit substrate 40 includes a substrate 41 in a substantially rectangular plate shape, an unillustrated circuit disposed on the substrate 41, and a plurality of electronic components mounted on the surface (surface) of the upper side Z1 of the substrate 41. In addition, in the present embodiment, a plurality of electronic components are mounted on the surface (surface) of the upper side Z1 of the substrate 41, but it is not limited thereto, and as long as a plurality of electronic components are mounted on at least the surface (surface) of the upper side Z1 of the substrate 41, electronic components may also be disposed on the surface (surface) of the lower side Z2 of the substrate 41. That is, the circuit substrate 40 may be a single-sided substrate having electronic components disposed on a single side (surface), or a double-sided substrate having electronic components disposed on both sides. In addition, the unillustrated circuit may be disposed on any part of the substrate 41, such as the surface (surface) of the upper side Z1 of the substrate 41, the surface (surface) of the lower side 2 of the substrate 41, the upper and lower surfaces of the substrate 41, the edge of the substrate 41, or the interior of the substrate 41.

[0048] The plurality of electronic components are composed of an outer component 42 arranged near the outer edge (the front edge and the rear edge in this embodiment) of the substrate 41 and an internal component not shown arranged at a position closer to the inner side of the substrate 41 than the outer component 42. In this embodiment, a terminal block is arranged as the outer component 42, and the component arranged in the portion of the outer component 42 along the left side Y2 of the front edge of the substrate 41 is a screw terminal block 42a. In addition, the component arranged next to the screw terminal block 42a on the front side X1 of the outer component 42 and along the rear edge of the substrate 41 is a screwless terminal block 42b. These screw terminal blocks 42a and screwless terminal blocks 42b are the parts that electrically connect the electronic device 1 to an external device.

[0049] The screw terminal block 42a and the screwless terminal block 42b are formed in a box shape. Fig.10 The insertion hole 42c shown in the figure is inserted through the screw terminal block 42a and the substrate connection terminal (not shown) of the screwless terminal block 42b, and is electrically connected to the substrate 41 by welding. Figure 6 As shown, a first groove 41a for accommodating the first rail 20 of the housing body 10 is formed at the edge of the right side Y1 and the edge of the left side Y2 of the substrate 41. The first groove 41a is cut inward and opens outward. The first groove 41a is formed in the front side X1 and the rear side X2 of the substrate 41, respectively, corresponding to the position of the first rail 20. The depth of the first groove 41a is set to be substantially the same as the dimension of the lower end of the first rail 20 in the left-right direction Y. When the circuit substrate 40 is moved from the upper side Z1 to the lower side Z2 of the housing body 10, the inner surface of the first groove 41a is guided by abutting or approaching the first rail 20.

[0050] At this time, by making the depth of the first groove 41a as described above, the closer the circuit substrate 40 is to the upper side Z1, the harder it is for the first rail 20 to abut or approach the inner surface of the first groove 41a, and the easier it is for the circuit substrate 40 to move. On the other hand, the closer the circuit substrate 40 moves to the lower side Z2, the easier it is for the first rail 20 to abut or approach the inner surface of the first groove 41a, so that the circuit substrate 40 is difficult to move relative to the housing body 10, and the position of the circuit substrate 40 relative to the housing body 10 is determined more accurately. In addition, a second groove 41b for accommodating the second rail 31 is formed at the center of the edge of the left side Y2 of the substrate 41 in the front-rear direction X.

[0051] As described above, the second rail 31 has a function of determining the orientation of the circuit substrate 40 when it is accommodated in the housing body 10 to be one direction, so the second groove 41b that accommodates the second rail 31 has a function as an erroneous fitting prevention groove. The second groove 41b is cut inward and opens outward. The depth of the second groove 41b is set to be substantially the same as the dimension of the second rail 31 in the left-right direction Y. When the circuit substrate 40 is moved from the upper side Z1 to the lower side Z2 of the housing body 10, the inner surface of the second groove 41b abuts against or approaches the second rail 31, similarly to the inner surface of the first groove 41a abutting against or approaching the first rail 20, thereby guiding the circuit substrate 40.

[0052] The circuit substrate 40 thus constructed is formed by cutting out a plurality of pieces from a sheet of substrate material, so-called "taking out a plurality of pieces". At this time, in the present embodiment, taking out a plurality of pieces is performed by two different cutting methods. Specifically, first, "NC milling processing" is performed, so that a cutting tool having a cutting edge on the outer periphery is rotated while penetrating the substrate material positioned at a predetermined position, and a predetermined portion of the substrate material is cut while the coordinates of the tool are controlled by a servo motor or the like. Next, "bending and breaking" is performed, in which a continuous or discontinuous groove is formed in the portion of the substrate material that has not been subjected to NC milling processing as a breaking portion, and the substrate 41 is bent to break from the breaking portion. For example, as the bending and breaking, V-cutting is performed in the present embodiment, and a V-shaped groove is continuously formed as a breaking portion, and the substrate 41 is bent to break from the breaking portion.

[0053] NC milling is excellent in precision, so it is possible to suppress the deviation of the size of the circuit substrate 40 after taking out a plurality of them. Specifically, as the precision of cutting, if the intersection of the size produced in the V-cut is about 1 / 10, the intersection of the size produced by the NC milling is about 1 / 100. On the other hand, V-cutting does not require precise control of tools, etc., so it is excellent in working efficiency and cost. In addition, in the present embodiment, V-cutting is performed as an example of bending fracture, but it is not limited to this. For example, it is also possible to form a hole-line-shaped fracture portion by discontinuous grooves and slits in the part of the substrate material that is not subjected to NC milling, and to break the hole-line-shaped fracture portion by bending the substrate 41. In addition, in the present embodiment, after NC milling, bending fractures such as V-cutting are performed, but it is also possible to first perform NC milling on the first end face, the second end face, etc., after taking out a plurality of them, and then implement NC milling on the required parts such as the first end face and the second end face.

[0054] In this embodiment, the front edge of the substrate 41 is a V-cut front V-cut surface 43, and the rear edge of the substrate 41 is a V-cut rear V-cut surface 44. In addition, at both left and right end edges of the substrate 41, the portion between the first groove 41a on the front side X1 and the first groove 41a on the rear side is a first end surface 45 extending along the front-to-back direction X, the inner surface of the first groove 41a is a second end surface 46, and the portion of the second end surface 46 on the outer side of the front-to-back direction X is a third end surface 47 extending along the front-to-back direction X. Figure 7 As shown, the first end surface 45 is opposite to the inner surface of the support piece 19, specifically, the inner surface of the second wall portion 28, and extends along the inner surface in the front-rear direction X. At least a portion of the first end surface 45, specifically, the portion opposite to the first locking portion 29, constitutes a first cut surface 45a cut along the front-rear direction X and formed at a predetermined position by NC milling.

[0055] like Figure 8 As shown, at the portion where the first cutting surface 45a is provided, the dimension in the left-right direction Y from the first cutting surface 45a on the right side Y1 to the first cutting surface 45a on the left side Y2 is larger than the distance from the front end of the first holding claw 29b in the first locking portion 29 on the right side Y1 to the front end of the first holding claw 29b on the left side Y2. Fig. 9As shown, when the circuit substrate 40 is accommodated in the housing body 10, the front end of the first holding claw 29b is pressed by the first cutting surface 45a, and the first elastic piece 29a is elastically deformed outward in the left-right direction Y. The first cutting surface 45a is locked to the first holding claw 29b by its restoring force, and is pressed inward in the left-right direction Y, thereby holding the circuit substrate 40 in the housing body 10. In addition, at this time, the circuit substrate 40 is pushed downward by the lower surface of the first holding claw 29b in a state where it is supported upward by the above-mentioned support protrusion 13, and is clamped by the protruding end 13a of the support protrusion 13 and the lower surface of the first holding claw 29b in the height direction Z. As a result, the circuit substrate 40 is suppressed from falling off in the height direction Z. In this way, the circuit substrate 40 can be easily fixed to the housing body 10 without using screws, pins, etc.

[0056] Furthermore, by providing the first cut surface 45a, the dimensional accuracy of the portion of the circuit substrate 40 extending in the front-rear direction X and locked in the first holding claw 29b can be improved. Thus, even if the dimensional accuracy of the circuit substrate 40 is expected to vary due to the above-mentioned removal of a plurality of pieces, the positional accuracy of the portion formed in the first holding claw 29b relative to the housing body 10 can be improved. In addition, by increasing the dimensional accuracy of the portion of the circuit substrate 40 locked in the first holding claw 29b, the elastic deformation amount of the first locking portion 29 is unlikely to exceed the expected amount, and the force of the first locking portion 29 holding the circuit substrate 40 can be stabilized.

[0057] This is particularly significant when the first cutting surface 45a is provided on both the left and right sides of the circuit substrate 40 as in the present embodiment, and the size of the circuit substrate 40 in the left-right direction Y of the portion where the first cutting surface 45a is formed can be made constant with high precision, and the elastic deformation amount of the first locking portion 29 can be made constant, so that the force of the first locking portion 29 holding the circuit substrate 40 can be made constant. In addition, further, the first locking portion 29 is not provided on the first wall portion 27 constituting the outermost surface of the housing body 10, but is provided on the second wall portion 28 recessed inwardly than the first wall portion 27, so that it is difficult for parts, tools, etc. to collide with the first locking portion 29 from the outside, and it is difficult for external force to act directly on the circuit substrate 40 via the first locking portion 29. Therefore, the state of holding the circuit substrate 40 by the first locking portion 29 is stably maintained.

[0058] The second end face 46 is composed of a portion that is continuous with the first end face 45 and is orthogonal to the first end face 45 and extends in the left-right direction Y, and an arc-shaped portion that connects the portion extending in the left-right direction Y. That is, the second end face 46 has a portion that is orthogonal to the first end face 45 and extends in the left-right direction Y. The portion of the second end face 46 that extends in the left-right direction Y abuts or approaches the side surface of the first rail 20 described above, and at least the abutting or approaching portion constitutes a second cutting surface 46a that is cut along the left-right direction Y and formed at a predetermined position by NC milling. In addition, the displacement of the circuit substrate 40 in the front-rear direction X is restricted by the second cutting surface 46a abutting or approaching the side surface of the first rail 20.

[0059] That is, the second cutting surface 46a is in contact with or close to a part of the housing body 10, so that the circuit board 40 is positioned in the housing body 10. The third end surface 47 is a bending fracture surface (non-cut surface) formed by the above-mentioned V-cut (bending fracture), and extends continuously with the second end surface 46 in the outward direction of the front-rear direction X. Figure 7 As shown, the third end surface 47 is opposite to the inner surface of the support piece 19, specifically, the inner surface of the first wall portion 27, and extends along the inner surface in the front-rear direction X. That is, the third end surface 47 is opposite to the inner surface of the support piece 19 at a position different from the first end surface 45 and extends in the front-rear direction X.

[0060] Here, as described above, from the viewpoint of stabilizing the force of the first locking portion 29 holding the circuit board 40, it is preferable that the separation distance S1 (only within 1 / 2 of the inner surface of the second wall portion 28 (supporting piece 19) of the first cutting surface 45a (first end surface 45) and the inner surface of the second wall portion 28 (supporting piece 19) is 1 / 2. Figure 7 28 (shown in the figure) is formed to be smaller than the separation distance S2 between the third end face 47 and the inner surface of the first wall portion 27 (support piece 19). As a result, the third end face 47, which has a larger dimensional deviation than the first cut face 45a, is difficult to abut against the housing body 10, and the first cut face 45a, which has a smaller dimensional deviation, can be reliably locked by the first locking portion 29. In addition, by setting the relationship between the separation distance S1 and the separation distance S2 as such, even if a component, a tool, etc. collides with a portion other than the second wall portion 28 from the outside, specifically, collides with the first wall portion 27, since a space is ensured between the circuit substrate 40 and the housing body 10, it is possible to suppress the external force applied to the housing body 10 from directly acting on the circuit substrate 40.

[0061] The cover 50 is a member that covers the opening of the housing body 10 and is provided in a manner that is attachable and detachable relative to the housing body 10 in the height direction Z. Fig.10As shown, the cover body 50 has a top plate 51 facing the surface of the upper side Z1 of the substrate 41 (circuit substrate 40). The top plate 51 is formed into a rectangular plate having long sides in the left-right direction Y. The front and rear side end edges of the long sides constituting the top plate 51 constitute the outermost edges in the front-to-back direction X of the cover body 50, and a pair of partition walls 52 (side walls) hang down from the outermost edges toward the surface (surface) of the upper side Z1 of the substrate 41. The partition wall 52 is a wall that separates the outer part 42 from the inner part (not shown), and prevents the tool for soldering the screw terminal block 42a and the screwless terminal block 42b to the substrate 41, other tools such as screws for the outer part 42, tools for tightening the screws, and fingers of the operator operating the electronic device 1 (hereinafter also referred to as foreign matter) from contacting the inner part.

[0062] In addition, in order to prevent foreign matter from contacting the inner part, it is also considered to cover the entire periphery of the outer part 42, such as the periphery of the screw terminal block 42a and the screwless terminal block 42b, but in this case, the shape of the cover body 50 becomes complicated and the versatility is reduced. Therefore, as in the present embodiment, it is preferred to provide a simple structure of a partition wall 52 hanging from the top plate 51. The two ends of the inner wall surface of the partition wall 52 in the left-right direction Y can slide in contact with the outer surface (outer surface) of the side wall of the first track 20 formed at the front and rear end edges of the support piece 19 of the shell body 10 in the front and rear direction X. As a result, the cover body 50 is guided by the first track 20 and moves in the height direction Z and is assembled to the shell body 10.

[0063] like Fig.11 As shown, a convex portion 53 protruding toward the lower side Z2 is formed at the lower edge (front edge) of the partition wall 52. In the present embodiment, the convex portion 53 is formed at the left and right ends of the lower edge of the partition wall 52. The convex portion 53 is located at a position separated by a predetermined gap in the height direction Z relative to the surface (surface) of the upper side Z1 of the substrate 41. By forming the convex portion 53, when the circuit substrate 40 floats in the height direction Z (plate thickness direction) due to impact, vibration, etc., the convex portion 53 is brought into contact with the surface of the upper side Z1 of the substrate 41, so that the floating can be suppressed. In addition. By forming the convex portion 53 at the left and right ends of the lower edge of the partition wall 52, a concave portion 54 opening toward the lower side Z2 is formed between each convex portion 53. The upper end edge 55 (end edge) of the concave portion 54 is farther from the surface of the upper side Z1 of the substrate 41 along the upper side Z1 (height direction Z) than the convex portion 53. By forming the recess 54, a space is created between the substrate 41 and the partition wall 52, and interference between the partition wall 52 and the electronic component can be prevented. Therefore, the space is used as a mounting space for electronic components, and electronic components can be mounted on the substrate 41 in part of the portion where the partition wall 52 is arranged.

[0064] On the other hand, Figure 8As shown, the upper edge 55 of the recess 54 is located at the lower side Z2 than the upper end 42d of the screw terminal block 42a. In addition, the upper edge 55 of the recess 54 is located at the lower side Z2 than the upper end 42e of the screwless terminal block 42b. That is, the upper edge 55 of the recess 54 is located at a position closer to the substrate 41 than the upper end of the outer member 42. Therefore, the screw terminal block 42a and the screwless terminal block 42b overlap with the space generated by the recess 54 in the front-to-back direction X, and the screw terminal block 42a and the screwless terminal block 42b prevent foreign matter from invading the interior of the cover body 50 through the recess 54. A second convex portion 53a protruding toward the lower side Z2 is formed at the central portion of the upper edge 55 of the recess 54 (i.e., the lower edge of the partition wall 52) in the left-right direction Y. The second convex portion 53a is located at a predetermined gap in the height direction Z relative to the surface of the upper side Z1 of the substrate 41, and suppresses the floating of the circuit substrate 40 in the same manner as the convex portion 53. In addition, from the viewpoint of forming the above-mentioned concave portion 54, the second convex portion 53a is not essential and may be omitted.

[0065] In addition, if Figure 2 As shown, the front side X1 or rear side X2 of the partition wall 52 is formed by Fig.10 The insertion hole 42c shown is installed with the screw terminal block 42a and the screwless terminal block 42b (outer member 42), so in order to facilitate the installation work, it is preferable to provide a predetermined gap between the outer surface of the partition wall 52 and the back surface (the surface facing the outer surface of the partition wall 52) of the screw terminal block 42a and the screwless terminal block 42b (outer member 42) along the front-back direction X. However, if the predetermined gap is large, the above-mentioned foreign matter may sometimes invade the gap and contact the inner member in the cover body 50 through the above-mentioned recessed portion 54.

[0066] Therefore, it is preferred that the predetermined gap is smaller than the gap between the upper edge 55 of the recess 54 and the surface of the upper side Z1 of the substrate 41. In addition, the predetermined gap is preferably set to a size smaller than the above-mentioned foreign matter. Specifically, for example, the predetermined gap is preferably set to a size smaller than the head of the screw used for the outer component 42 or the front end of the tool used to tighten the screw. For example, in the present embodiment, the predetermined gap is set to about 5 mm. That is, the partition wall 52 is arranged in a manner closer to the inner side than the outer component 42 across the predetermined gap. In addition, by setting the predetermined gap, the gap can be used as the installation space for the above-mentioned electronic components. Thereby, the installation space for electronic components can be further increased.

[0067] A slit 56 is formed on the plate surface of the partition wall 52, which passes through in the plate thickness direction and extends in the height direction Z. A plurality of slits 56 are arranged in the left-right direction Y. In addition, the width of the slit 56 is about 3 mm, which is smaller than the gap between the upper edge 55 of the recess 54 and the surface on the upper side Z1 of the substrate 41 and the predetermined gap between the outer surface of the partition wall 52 and the back surface of the outer member 42. In addition, in the cover body 50, a connector insertion hole 57 is formed on the upper right portion of the plate surface of the partition wall 52 constituting the front side X1, which passes through in the plate thickness direction (see Figure 2 ). A connector of a wire provided in an external device (not shown) is inserted into the connector insertion hole 57, thereby connecting the external device to the electronic device 1. Figure 2 In other drawings except FIG. 1 , the connector insertion hole 57 may be omitted.

[0068] like Fig.11 As shown, a side end face 58 is formed at the lower part of the left and right ends of the partition wall 52, which is located inward of the outer surface of the cover side wall 59 described later and faces outward in the left-right direction Y. The side end face 58 constitutes a limiting surface that abuts or approaches the inner surface of the support piece 19 of the shell body 10. The side end face 58 restricts the support piece 19 from tilting inward in the left-right direction Y. That is, the position of the support piece 19 is restricted by the side end face 58 abutting or approaching the inner surface of the support piece 19. In this way, by providing the side end face 58 on the partition wall 52, the lower side Z2 portion of the cover body 50 is accommodated inside the shell body 10 between the pair of support pieces 19.

[0069] like Fig.10 As shown, a pair of cover side walls 59 hang down from the left and right side edges of the short side constituting the top plate 51 as side walls different from the partition wall 52. The cover side wall 59 is formed in a plate shape with a smaller height dimension than the partition wall 52, and a locking hole 60 is formed through the plate surface thereof, and the locking hole 60 has an edge portion that is locked with the second holding claw 30b of the second locking portion 30. The distance in the left-right direction Y from the inner surface of the cover side wall 59 on the right side Y1 to the inner surface of the cover side wall 59 on the left side Y2 is larger than the dimension in the left-right direction Y from the outer surface of the upper wall portion 22 on the right side Y1 in the housing body 10 to the outer surface of the upper wall portion 22 on the left side Y2. In addition, the distance in the left-right direction Y from the inner surface of the cover side wall 59 on the right side Y1 to the inner surface of the cover side wall 59 on the left side Y2 is smaller than the distance from the front end portion of the second holding claw 30b in the second locking portion 30 on the right side Y1 to the front end portion of the second holding claw 30b on the left side Y2.

[0070] Furthermore, the dimension of the cover side wall 59 in the height direction Z is set to be larger than the distance from the end surface of the upper side Z1 of the upper wall portion 22 of the shell body 10 to the step portion 23 of the shell body 10. Furthermore, the lower end edge 59a (the end edge in the downward direction) of the cover side wall 59 abuts against the step portion 23 of the shell body 10 when the cover body 50 is assembled to the shell body 10, thereby limiting the displacement of the cover body 50 to the lower side Z2. With such a structure, as shown in FIG. Fig.10 As shown, when the cover body 50 is assembled to the housing body 10, the inner surface of the cover side wall 59 overlaps with the outer surface side of the upper wall portion 22, and the cover side wall 59 covers the upper portion of the housing body 10. At this time, the second retaining claw 30b is pressed by the inner surface of the cover side wall 59, and the second elastic piece 30a is elastically deformed inward in the left-right direction Y. The edge of the locking hole 60 is locked with the second retaining claw 30b by its restoring force, and is pressed outward in the left-right direction Y, thereby retaining the cover body 50 on the housing body 10.

[0071] That is, the cover side wall 59 overlaps and is locked with the outer surface side of the support piece 19 at the upper side Z1 (opening side of the housing body 10) than the first locking portion 29. In addition, the lower end edge 59a of the cover side wall 59 is restricted from displacement to the lower side Z2 by abutting against the step portion 23 of the housing body 10. That is, the position of the cover body 50 is restricted by abutting the lower end edge 59a of the cover side wall 59 against the step portion 23. In addition, by abutting the lower end edge 59a of the cover side wall 59 against the step portion 23, the assembly of the cover body 50 is completed, so there is no need to specially provide a stopper or other components.

[0072] Thus, when the cover body 50 is assembled to the housing body 10, the cover side wall 59 covers the upper side Z1 portion of the housing body 10 from the outside, and the support piece 19 is restricted from being displaced outward in the left-right direction Y by the cover side wall 59. According to such a structure, when the cover body 50 is assembled to the housing body 10, the support piece 19 is restricted from being displaced outward in the left-right direction Y by the cover side wall 59 located on the upper outer side of the support piece 19, and the support piece 19 is restricted from being displaced inward by the side end surface 58 of the partition wall 52 located on the lower inner side of the support piece 19. Therefore, the support piece 19 is difficult to tilt relative to the bottom plate 11.

[0073] In the electronic device 1 of the present embodiment configured as described above, the protruding direction of the first retaining claw 29b in the first retaining portion 29 is opposite to the protruding direction of the second retaining claw 30b in the second retaining portion 30, so that in the same support sheet 19, the first retaining portion 29 is elastically deformed outward in the left-right direction Y, and the second retaining portion 30 is elastically deformed inward in the left-right direction Y. Therefore, for example, the force when the first retaining portion 29 is elastically deformed by the circuit substrate 40 is transmitted to the second retaining portion 30 via the support sheet 19, and the second retaining portion 30 is pressed toward the cover side wall 59 by this force. That is, the force applied to the first retaining portion 29 is added to the second retaining portion 30. On the other hand, the force when the second retaining portion 30 is elastically deformed by the cover side wall 59 is transmitted to the first retaining portion 29 via the support sheet 19, and the first retaining portion 29 is pressed toward the circuit substrate 40 by this force. That is, the force applied to the second retaining portion 30 is added to the first retaining portion 29. In this way, the forces applied to the first locking portion 29 and the second locking portion 30 can be added to each other, and the holding force of the first locking portion 29 and the second locking portion 30 can be improved. In addition, by making the second holding claw 30b of the second locking portion 30 protrude outward in the left-right direction Y, the shape of the upper part of the mold when forming the first locking portion 29 can be simplified, and the forming can be simplified.

[0074] In addition, at this time, there is a case where the support sheet 19 tends to tilt outward in the left-right direction Y in accordance with the elastic deformation of the first elastic sheet 29a pressed by the circuit substrate 40 outward in the left-right direction Y. This becomes significant when the size of the circuit substrate 40 in the left-right direction Y deviates in a larger manner when the circuit substrate 40 is produced by taking out a plurality of pieces as in the present embodiment. In this case, since the first locking portion 29 and the support sheet 19 tend to deform beyond the assumption, an excessive load is applied to the root of the support sheet 19 which has a boundary portion with the bottom plate 11 and is difficult to displace, resulting in a durability problem. In addition, since the first locking portion 29 and the support sheet 19 tend to deform beyond the assumption, their reaction force also increases, and the load applied to the circuit substrate 40 increases. However, as described above, the cover side wall 59 overlaps and locks with the outer surface side of the support sheet 19 at the upper side Z1 (opening side of the housing body 10) than the first locking portion 29, and the front end of the support sheet 19 is restricted from displacement by the cover side wall 59. Therefore, it is suppressed that an excessive load is concentrated on the base of the support piece 19 and an unexpected load is generated on the circuit board 40 .

[0075] On the other hand, there is a case where the support piece 19 tends to tilt inward in the left-right direction Y in response to the elastic deformation of the second elastic piece 30a pressed by the cover side wall 59 inward in the left-right direction Y. In this case, as in the case where the support piece 19 tends to tilt outward in the left-right direction Y in response to the elastic deformation of the first elastic piece 29a, an excessive load is applied to the base of the support piece 19, and the load applied to the circuit board 40 increases. However, as described above, the tilting of the support piece 19 is restricted by the side end surface 58 of the partition wall 52, thereby preventing an excessive load from being concentrated on the base of the support piece 19 and preventing an unintended load from being generated on the circuit board 40.

[0076] As described above, according to the first embodiment, in the circuit substrate 40, the first cut surface 45a is provided on at least a portion of the first end surface 45, thereby improving the dimensional accuracy of the portion extending in the front-rear direction X (predetermined direction) and locked in the first holding claw 29b (holding claw). As a result, even in a scenario where the dimensional accuracy of the circuit substrate 40 is expected to vary due to the above-mentioned multiple removal, etc., the positional accuracy of the portion locked in the first holding claw 29b relative to the housing body 10 can be improved. Therefore, the circuit substrate 40 can be accurately accommodated in the housing body 10, and the circuit substrate 40 can be stably locked. In addition, by increasing the dimensional accuracy of the portion of the circuit substrate 40 that is locked in the first holding claw 29b, the first elastic piece 29a (elastic piece) is suppressed from being deformed beyond the expectation. Therefore, the occurrence of an unexpected restoring force on the first elastic piece 29a is suppressed, and the application of an unexpected load on the circuit substrate 40 is suppressed. Therefore, it is possible to provide the electronic device 1 which can accurately accommodate the circuit board 40 (substrate) in the case body 10 (case) and reduce the load acting on the circuit board 40 .

[0077] In addition, according to the present embodiment, the position of the circuit substrate 40 in the left-right direction Y (orthogonal direction) is determined by the first holding claw 29b and the first cutting surface 45a, and the position of the circuit substrate 40 in the front-back direction X (predetermined direction) is determined by the second cutting surface 46a and the side wall of the first rail 20 (a part of the housing body 10). That is, the circuit substrate 40 is positioned relative to the housing body 10 from at least two directions. Therefore, the position accuracy of the circuit substrate 40 relative to the housing body 10 is improved, and the state of the circuit substrate 40 being accommodated in the housing body 10 can be stably maintained.

[0078] In addition, according to the present embodiment, the position of the circuit substrate 40 in the front-rear direction X relative to the housing body 10 can be determined by making the side surface of the first rail 20 (rib) abut against or approach the second cut surface 46a, so that the side surface of the first rail 20 can also be made to slide in contact with the second cut surface 46a, thereby making it possible to use the first rail 20 as a guide when installing the circuit substrate 40 in the housing body 10. Therefore, the circuit substrate 40 can be housed in the housing body 10 more accurately.

[0079] In addition, according to the present embodiment, the separation distance S1 (distance) between the first cut surface 45a (first end surface 45) having the first cut surface 45a and the inner surface of the support piece 19 is set to be smaller than the separation distance S2 (distance) between the third end surface 47 as the non-cut surface and the inner surface of the support piece 19. As a result, the third end surface 47 is difficult to abut against the support piece 19, and the first cut surface 45a can be reliably locked by the first retaining claw 29b (retaining claw). Therefore, even if there is a case where the size of the circuit substrate 40 is deviated due to the formation of the third end surface 47 by bending and breaking, or the size of the circuit substrate 40 is deviated due to the formation of protrusions such as burrs and depressions on the third end surface 47, etc., the circuit substrate 40 can be accurately accommodated in the housing body 10 without being affected, and the load acting on the circuit substrate 40 can be reduced.

[0080] In addition, according to the present embodiment, the outer component 42 and the inner component of the electronic component of the circuit substrate 40 can be separated in the inner and outer directions by the partition wall 52 hanging from the top plate 51 toward the surface (surface) of the upper side Z1 of the substrate 41. Therefore, for example, it is not necessary to cover most of the periphery of the screw terminal block 42a and the screwless terminal block 42b (outer component 42) as the outer component 42, and it is possible to suppress the contact of foreign objects such as tools and fingers of operators operating electronic devices with the inner component. In addition, since a predetermined gap is provided between the outer surface of the partition wall 52 and the back surface of the outer component 42, the gap can be used as an installation space for the electronic component, and the installation space can be ensured to be large. In addition, the cover body 50 can be formed by a simple structure of the top plate 51 and the partition wall 52 hanging from the top plate 51, without depending on the outer shape of the outer component 42 and the inner component, so the cover body 50 has high versatility and can make the variations of the screw terminal block 42a and the screwless terminal block 42b installed diverse. Therefore, it is possible to provide the electronic device 1 including the cover body 50 (cover) having high versatility and capable of suppressing contact of foreign matter with internal electronic components with a simple structure.

[0081] In addition, according to the present embodiment, when the circuit substrate 40 floats in the height direction Z (plate thickness direction) due to impact, vibration, etc., for example, the floating can be suppressed by making the convex portion 53 of the partition wall 52 abut against the surface (surface) of the upper side Z1 of the substrate 41. In addition, according to this structure, a predetermined gap in the height direction Z is generated between the upper end edge 55 (end edge) of the concave portion 54 of the partition wall 52 and the surface of the upper side Z1 of the substrate 41, so that the gap can be used as the installation space of the above-mentioned electronic components. In addition, the upper end edge 55 of the concave portion 54 is located at a position closer to the substrate 41 than the upper end portion 42d of the outer member 42, so that the partition wall 52 and the outer member 42 overlap in the front-to-back direction X (inside-outside direction), which can suppress foreign matter from passing between the partition wall 52 and the outer member 42 and invading the interior of the electronic device 1.

[0082] In addition, according to the present embodiment, by making the inner surface of the partition wall 52 slidably contact the outer surface of the first rail 20 (rib), the cover body 50 can be moved in the height direction Z (plate thickness direction) while the outer surface of the first rail 20 is used to guide the partition wall 52 of the cover body 50, and the cover body 50 can be assembled to the housing body 10. Therefore, the cover body 50 can be easily and accurately assembled to the housing body 10.

[0083] In addition, according to the present embodiment, the gap in a predetermined direction between the outer surface of the partition wall 52 and the back surface of the outer component 42 is set to a size smaller than the screws used for the outer component 42 and the front end of the tool (foreign matter) used to tighten the screws, thereby preventing these foreign matters from invading the interior of the electronic device 1 through the gap between the partition wall 52 and the outer component 42.

[0084] In addition, according to the present embodiment, even if the size of the circuit substrate 40 housed in the housing body 10 deviates in a larger manner and the first locking portion 29 and the support sheet 19 are deformed beyond the expected amount, the cover side wall 59 overlaps and locks with the outer surface side of the support sheet 19 on the opening side of the housing body 10 closer to the first locking portion 29. Therefore, the front end of the support sheet 19 is restricted from displacement by the cover side wall 59, and it is difficult to tilt outward from the root of the support sheet 19 on the side of the bottom plate 11. As a result, it is possible to suppress excessive load from concentrating on the root of the support sheet 19. Therefore, it is possible to provide an electronic device 1 in which excessive load is suppressed from being applied to the structure for fixing the circuit substrate 40 (substrate).

[0085] In addition, according to the present embodiment, since the support piece 19 of the shell body 10 is cut out and the first elastic piece 29a (elastic piece) is provided, the protrusion amount of the first locking portion 29 from the shell body 10 can be reduced compared to the case where the first elastic piece 29a and the support piece 19 are separately constructed, and accordingly, the shell body 10 can be miniaturized.

[0086] In addition, according to the present embodiment, the force when the first locking portion 29 is pressed from the inside to the outside by the inner circuit substrate 40 and elastically deformed is transmitted to the second locking portion 30 via the support sheet 19, and the second locking portion 30 is pushed toward the cover side wall 59 by this force. That is, the force applied to the first locking portion 29 is added to the second locking portion 30. On the other hand, the force when the second locking portion 30 is pressed from the outside to the inside by the outer cover side wall 59 and elastically deformed is transmitted to the first locking portion 29 via the support sheet 19, and the first locking portion 29 is pushed toward the circuit substrate 40 by this force. That is, the force applied to the second locking portion 30 is added to the first locking portion 29. In this way, by making the protruding directions of the first locking portion 29 and the second locking portion 30 different in the inside and outside of the support sheet 19, the forces applied to the first locking portion 29 and the second locking portion 30 can be added to each other, and the holding force of the first locking portion 29 and the second locking portion 30 can be improved.

[0087] In addition, according to the present embodiment, the step portion 23 constituting the boundary between the lower wall portion 21 and the upper wall portion 22 in the support piece 19 can be used as a structure for abutting the lower end edge 59a (end edge in the downward direction) of the cover side wall 59 to restrict the position of the cover body 50. Therefore, it is not necessary to install a special structure such as a stopper on the housing body 10, and the cover body 50 can be positioned relative to the housing body 10 with a simple structure.

[0088] In addition, according to this embodiment, the side end surface 58 of the cover body 50 overlaps with the inner surface of the support piece 19 as a limiting surface. Therefore, when the shell body 10 and the cover body 50 are combined by overlapping the cover side wall 59 and the outer surface side of the support piece 19, the support piece 19 can be prevented from being pressed by the cover side wall 59 and tilting inward.

[0089] In addition, according to the present embodiment, the first elastic piece 29a (elastic piece) of the first locking portion 29 is provided by cutting the second wall portion 28 of the support piece 19, so that the protrusion amount of the first locking portion 29 from the housing body 10 can be reduced compared to the case where the first elastic piece 29a and the support piece 19 are formed separately, and accordingly, the housing body 10 can be miniaturized. Moreover, the second wall portion 28 having the first locking portion 29 is provided to be recessed inwardly from the first wall portion 27 constituting the outermost surface of the support piece 19, so that it is difficult for parts, tools, etc. to collide from the outside, and it is difficult to be subjected to external force. Therefore, it is possible to suppress the external force from directly becoming a load on the circuit substrate 40. Therefore, it is possible to provide an electronic device 1 that is difficult to apply force to the circuit substrate 40 (substrate) from the outside while achieving miniaturization.

[0090] In addition, according to the present embodiment, in the relationship between the circuit substrate 40 and the support piece 19 of the housing body 10, the separation distance S2 (distance) between the first wall portion 27 to which external force is easily applied and the third end face 47 (end face that is opposed to the inner surface of the first wall portion 27 and extends in the left-right direction Y (predetermined direction)) is greater than the separation distance S1 (distance) between the second wall portion 28 to which external force is difficult to apply and the first end face 45 (end face that extends in the front-back direction X (predetermined direction) along the inner surface of the second wall portion 28) as described above. Therefore, even if a component, a tool, etc. collides with a portion other than the second wall portion 28, specifically, collides with the first wall portion 27 from the outside and applies external force to the housing body 10, it is possible to suppress the external force from becoming a load directly on the circuit substrate 40.

[0091] In addition, according to the present embodiment, in the electronic device 1, the first locking portion 29 that locks and holds the circuit board 40 is pushed by the circuit board 40 and elastically deformed to the outside of the housing body 10. Accordingly, there is a case where the second wall portion 28 having the first locking portion 29 is intended to deform to the outside of the housing body 10. In this case, a load is sometimes applied to the circuit board 40 due to the reaction force of the elastically deformed first locking portion 29. However, according to the present structure, the cover side wall 59 is provided to overlap with the outer surface side of the support sheet 19 having the first locking portion 29 on the opening side of the housing body 10 closer to the first locking portion 29, so that the support sheet 19 is restricted from displacement by the cover side wall 59, and the elastic deformation to the outside of the housing body 10 is alleviated. In addition, the elastic deformation of the first locking portion 29 to the outside of the housing body 10 is also alleviated, so the reaction force of the first locking portion 29 is also alleviated, and the load applied to the circuit board 40 can be reduced.

[0092] Although the embodiments and modifications of the present invention have been described in detail above with reference to the drawings, the specific configuration is not limited to these embodiments, and design changes and the like within the scope not departing from the gist of the present invention are also included in the present invention. Fig.12 1 is a perspective view of an electronic device 1' according to the second embodiment. In the second embodiment, the protective cover 70 is not omitted, which is different from the first embodiment. The protective cover 70 is a protective member covering the upper side of the outer member 42. Fig.13 As shown, the protective cover 70 is supported in the left-right direction Y over the extension 24 of the right side Y1 and the extension 24 of the left side Y2. In this state, the gap in a predetermined direction between the outer surface of the partition wall 52 and the back surface of the outer member 42 is hidden when viewed from the upper side Z1, and the foreign matter mentioned above is more difficult to intrude into the gap from the upper side Z1.

[0093] like Fig.14 As shown in FIG. 1 , the protective cover 70 is formed in a substantially rectangular plate shape. Protrusions 71 protruding outward are formed at both left and right ends of the protective cover 70. Fig.15 As shown, the protective cover 70 is fixed to the housing body 10 by inserting each protrusion 71 into the fixing hole 25 formed in the extension portion 24. According to such a structure, by adopting the protective cover 70, it is possible to suppress the contact of foreign matter, such as foreign matter falling from the upper side of the cover body 50, with the outer member 42 and the foreign matter from entering the predetermined gap between the outer surface of the partition wall 52 and the back side of the outer member 42. Therefore, it is possible to further suppress the contact of foreign matter with the inner member.

Claims

1. An electronic device comprising: a housing body having a bottom plate and opening in a direction opposite to the bottom plate; a circuit board housed in the housing body; and a cover covering the opening of the housing body, The electronic device is characterized in that The housing body has: A supporting sheet, which stands upright from the bottom plate; an elastic sheet disposed in a manner capable of elastic deformation in a plate thickness direction of the support sheet; and A retaining claw is provided in a manner of protruding inward from the elastic piece, The circuit substrate has a first end surface that is opposite to the inner surface of the support sheet and extends in a predetermined direction. A first cut surface cut along the predetermined direction and formed at a predetermined position is provided on at least a portion of the first end surface. The first cut surface is engaged with the holding claw and pressed inward in a direction perpendicular to the predetermined direction, so that the circuit board is held by the case body.

2. The electronic device according to claim 1, characterized in that: The circuit substrate has a second end surface, the second end surface has a portion that is orthogonal to the first end surface and extends in the orthogonal direction, and a second cut surface that is cut along the orthogonal direction and formed at a predetermined position is provided on at least a portion of the second end surface. The circuit board is positioned in the case body by the second cut surface abutting against or approaching a portion of the case body.

3. The electronic device according to claim 2, characterized in that: The support piece has a rib protruding inwardly of the housing body, and is provided so that a side surface of the rib abuts against or is close to the second cut surface.

4. The electronic device according to claim 1, characterized in that: The circuit substrate has a third end surface extending opposite to the inner surface of the support sheet at a position different from the first end surface, and the third end surface is a non-cut surface. The distance between the first end surface and the inner surface of the support sheet is smaller than the distance between the third end surface and the inner surface of the support sheet.

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