A sulfur hexafluoride conversion apparatus and method based on dual anode thermal plasma
Through the combination of a dual-anode thermal plasma device and a water cooling system, the problem of efficient degradation of sulfur hexafluoride waste gas is solved, efficient degradation and utilization of tail gas are achieved, and equipment safety is protected.
Patent Information
- Application Number
- CN202411594125.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2044-11-08
AI Technical Summary
Existing technologies are difficult to efficiently degrade sulfur hexafluoride waste gas that does not meet the new gas standards, and it is difficult to reuse or decommission sulfur hexafluoride waste gas, and the degradation efficiency is low.
A sulfur hexafluoride conversion device based on dual-anode thermal plasma is used. Through the combination of gas mixing components, reaction components, degradation components and cooling exhaust components, a thermal plasma reactor is used to degrade the gas, and the temperature is controlled by a water cooling device to achieve low current input and high power output.
The degradation efficiency and rate of sulfur hexafluoride are improved, the tail gas after degradation is usable, the experimental equipment is protected from damage by high temperature and high heat reaction, and the content of degradation components can be displayed intuitively.
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Figure CN119281084B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of sulfur hexafluoride (greenhouse gas) degradation, and in particular to a sulfur hexafluoride conversion device and method based on dual-anode thermal plasma. Background Art
[0002] Sulfur hexafluoride (SF6) is a colorless, odorless, non-toxic, non-flammable, and non-explosive inert gas. In recent years, many common waste gas treatment methods have been used to degrade SF6, including thermal catalytic degradation, photolysis, and electrolysis. Thermal plasma treatment technology, a highly popular waste gas treatment method in recent years, offers advantages such as simplicity, low energy consumption, and thorough treatment. It holds broad application prospects, and related technologies have also been reported for use in SF6 waste gas treatment.
[0003] Currently, there are patents for sulfur hexafluoride gas treatment, such as the "Sulfur Hexafluoride Recovery and Treatment Process" with publication number CN 104386652A on March 4, 2015, and the "Sulfur Hexafluoride Gas Recovery and Inflating Device" with publication number CN 107588325A on January 16, 2018. These patents mainly focus on the collection, purification, and storage of sulfur hexafluoride gas, and also use thermal cracking and water washing to treat SF6 waste gas.
[0004] In order to explore the efficient degradation of SF6 waste gas that has not reached the new gas standard for purification and recovery, is difficult to reuse or is about to be retired, in the process of studying the effects of different methods on its degradation effect, it was found that thermal plasma has a good degradation effect on SF6, and the structure of a dual-anode reactor with an arc-starting voltage can greatly improve the degradation efficiency of SF6. On this basis, a sulfur hexafluoride conversion method and device based on dual-anode thermal plasma was prepared. Summary of the Invention
[0005] In view of the above-mentioned existing problems of efficiently degrading SF6 waste gas that has not reached the new gas standard for purification and recovery, is difficult to reuse or is about to be retired, the present invention is proposed.
[0006] Therefore, the object of the present invention is to provide a sulfur hexafluoride conversion device based on dual anode thermal plasma.
[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a sulfur hexafluoride conversion device based on dual anode thermal plasma, comprising:
[0008] A ventilation assembly, comprising an air mixing element and a control element, wherein the control element is disposed on the air mixing element; and
[0009] A degradation component, comprising a reaction component and a degradation component, wherein the reaction component is arranged on the gas mixing component, and the degradation component is arranged on the reaction component; and
[0010] The cooling exhaust assembly comprises a cooling part and a tail gas part, the cooling part is arranged on the reaction part, and the tail gas part is arranged on the cooling part.
[0011] As a preferred scheme of the sulfur hexafluoride conversion device based on double anode hot plasma, wherein: the gas mixing part comprises a first gas cylinder and a second gas cylinder, the first gas cylinder and the second gas cylinder are connected with a gas distribution and mixing instrument, the first gas cylinder and the second gas cylinder are arranged horizontally, the first gas cylinder contains a certain amount of SF6, and the second gas cylinder contains a certain amount of inert gas.
[0012] As a preferred scheme of the sulfur hexafluoride conversion device based on double anode hot plasma, wherein: the control part comprises a first electromagnetic valve arranged on the first gas cylinder, a second electromagnetic valve arranged on the second gas cylinder, and a third electromagnetic valve arranged on the gas distribution and mixing instrument.
[0013] As a preferred scheme of the sulfur hexafluoride conversion device based on double anode hot plasma, wherein: the reaction part comprises a hot plasma reactor arranged on the gas distribution and mixing instrument, and an arc anode and a cathode tube arranged in the hot plasma reactor.
[0014] As a preferred scheme of the sulfur hexafluoride conversion device based on double anode hot plasma, wherein: the degradation part comprises a gas pump arranged on the hot plasma reactor, and a tungsten powder tank arranged on the gas pump.
[0015] As a preferred scheme of the sulfur hexafluoride conversion device based on double anode hot plasma, wherein: the cooling part comprises a water cooling machine arranged on the hot plasma reactor.
[0016] As a preferred scheme of the sulfur hexafluoride conversion device based on double anode hot plasma, wherein: the tail gas part comprises a cooling machine arranged on the hot plasma reactor, a concentration detector arranged on the cooling machine, and a tail gas recovery device arranged on the concentration detector.
[0017] As a preferred scheme of the sulfur hexafluoride conversion device based on double anode hot plasma, wherein: the number of arc anodes is two, and a cathode tube is arranged between the two arc anodes.
[0018] A sulfur hexafluoride conversion device and method based on double anode hot plasma, comprising the above-mentioned sulfur hexafluoride conversion device based on double anode hot plasma, comprising the following steps:
[0019] The dilution ratio of the mixed gas is controlled by the electromagnetic valve;
[0020] The mixed gas and the tungsten powder are introduced into the reactor to degrade;
[0021] The water cooling is used to cool and monitor the degradation efficiency of the SF6 waste gas in real time.
[0022] As a preferred scheme of the SF6 conversion device and method based on the double-anode hot plasma, the reactor is used to realize low current input and high power output, and the plasma area is expanded to complete the conversion treatment of SF6.
[0023] The present application has the following advantages: the present application can be connected with the SF6 gas and the Ar gas storage bottle, which can improve the degradation efficiency of SF6, realize the treatment of high-concentration SF6, and accelerate the degradation rate of SF6 under high temperature. The tail gas after degradation is also available. The SF6 concentration detector can be used to observe the degradation efficiency of SF6 intuitively and rapidly. The water cooling device installed on the periphery of the reactor and the cooling device at the gas outlet of the reactor can protect the equipment and prevent the gas released by the high-temperature reaction of the reactor from damaging the experimental equipment and detection equipment.
[0024] The present application has the following advantages:
[0025] (1) The present application can realize the degradation of high-concentration SF6, has high degradation efficiency, and has high degradation rate.
[0026] (2) The present application can directly display the content of the degradation components, and the investigation of data is very convenient.
[0027] (3) In the process of degrading SF6, the experimental equipment will not be damaged even under high temperature.
[0028] (4) The arc length and arc pressure are increased by the arc anode, which realizes low current input and high power output.
[0029] (5) The main product after degradation is tungsten hexafluoride, so the tail gas after degradation is available. DETAILED DESCRIPTION
[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0031] Figure 1 It is a schematic diagram of the overall structure of the SF6 conversion device based on the double-anode hot plasma.
[0032] Figure 2 Figure 1 is a schematic diagram of a six fluorine sulfide conversion device based on double anode thermal plasma according to the present application. DETAILED DESCRIPTION
[0033] In order to make the above objectives, features and advantages of the present application more apparent, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0034] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without the specific details and other implementations can be employed. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure aspects of the present application.
[0035] Secondly, the term "one embodiment" or "an embodiment" as used herein means that a particular implementation can include a particular feature, structure, or characteristic, but every embodiment can not necessarily include the particular feature, structure, or characteristic. Furthermore, the following claims can refer to "one embodiment" or "an embodiment" in the sense of claiming a particular feature, structure, or characteristic of more than one embodiment.
[0036] Thirdly, the present application is described in detail with reference to the accompanying drawings. In the detailed description of the present application, the sectional view of the device structure is partially enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.
[0037] Embodiment 1
[0038] Reference Figure 1 - Figure 2 For the first embodiment of the present application, a six fluorine sulfide conversion device based on double anode thermal plasma is provided, which comprises a ventilation assembly 100, including a gas mixing element 101 and a control element 102, the control element 102 is arranged on the gas mixing element 101; and
[0039] A degradation assembly 200, including a reaction element 201 and a degradation element 202, the reaction element 201 is arranged on the gas mixing element 101, and the degradation element 202 is arranged on the reaction element 201. The ventilation assembly 100 and the degradation assembly 200 can complete the degradation work of SF6.
[0040] Specifically, the gas mixing device 101 includes a first gas cylinder 101a and a second gas cylinder 101b, and a gas mixing device 101c connected to the first gas cylinder 101a and the second gas cylinder 101b; the first gas cylinder 101a and the second gas cylinder 101b are fixedly connected to the gas mixing device 101c at the same height; the first gas cylinder 101a and the second gas cylinder 101b are horizontally arranged; the first gas cylinder 101a contains a certain amount of SF6; and the second gas cylinder 101b contains a certain amount of inert gas.
[0041] The inert gas can be Ar or the like.
[0042] Further, the control device 102 includes a first electromagnetic valve 102a arranged on the first gas cylinder 101a, a second electromagnetic valve 102b arranged on the second gas cylinder 101b, and a third electromagnetic valve 102c arranged on the gas mixing device 101c; the flow rates of Ar and SF6 are controlled by the first electromagnetic valve 102a and the second electromagnetic valve 102b, so as to realize the proportioning of the two kinds of gases.
[0043] Further, the reaction device 201 includes a hot plasma reactor 201a arranged on the gas mixing device 101c, an arc anode 201b and a cathode tube 201c arranged in the hot plasma reactor 201a; the hot plasma reactor 201a has a special structure; the arc anode 201b has two numbers; and the cathode tube 201c is arranged in the middle of the two arc anodes 201b. The hot plasma reactor 201a has two anodes and a cathode inserted in the middle of the two anodes; the structure can realize low-current input and high-power output, greatly improves the degradation efficiency, and reduces the arc voltage of the plasma torch due to the existence of the arc anode 201b; the arc anode 201b increases the arc length and arc voltage, expands the plasma area, and promotes the degradation effect.
[0044] Further, the degradation device 202 includes a gas pump 202a arranged on the hot plasma reactor 201a, and a tungsten powder tank 202b arranged on the gas pump 202a; the gas pump 202a is fixedly connected to one side of the hot plasma reactor 201a; and the other side of the gas pump 202a is fixedly connected to the tungsten powder tank 202b containing tungsten powder; the tungsten powder is blown into the hot plasma reactor 201a by the gas pump 202a to participate in the reaction and degrade SF6.
[0045] During operation, each gas cylinder is connected to the gas mixing device through the electromagnetic valve, and the gas is mixed in the gas mixing device. The power supply is turned on, and the mixed gas is introduced into the thermal plasma reactor 201a. At the same time, the gas pump 202a is turned on to blow the tungsten powder into the reactor to fully react with the mixed gas. The gas cylinder includes SF6 waste gas, and Ar. The SF6 waste gas is generally also collected in the gas steel cylinder. During use, the gas in the gas cylinder is discharged through the electromagnetic valve, and the gas circuit can be controlled to be turned off. When using the device, first open the total valve of the carrier gas cylinder, and the initial absolute pressure is about 0.1 Mpa. Then open the electromagnetic valve to discharge the gas, and let the gas enter the gas mixing device. After the gas mixing is completed, the mixed gas is introduced into the thermal plasma reactor 201a, and the tungsten powder is also blown into the reactor through the gas pump 202a to participate in the reaction. The reactor is powered by the power supply. The core of the thermal plasma reactor 201a is a thermal plasma torch, which is composed of two arc anodes 201b, and a cathode is inserted between the two anodes. During the reaction process, the power supply first generates an overvoltage between the cathode and the arc anode 201b to ignite the arc, and then provides a stable current between the cathode and the arc anode 201b to maintain the thermal plasma.
[0046] Example 2
[0047] Reference Figure 1 - Figure 2 For the second embodiment of the present application, a sulfur hexafluoride conversion device based on a double-anode thermal plasma is provided. The device includes a cooling and exhaust assembly 300, which includes a cooling component 301 and an exhaust component 302. The cooling component 301 is arranged on the reaction component 201, and the exhaust component 302 is arranged on the cooling component 301. Through the use of the cooling and exhaust assembly 300, the temperature of the reaction process equipment is reduced, which is beneficial to continuous use and the discharge of exhaust gas.
[0048] Specifically, the cooling component 301 includes a water cooler 301a arranged on the thermal plasma reactor 201a. The water cooler 301a is connected to the outside of the thermal plasma reactor 201a. When the reaction is carried out in the thermal plasma reactor 201a, the cooling can be realized, and the safety of the experimenters and the experimental equipment is ensured.
[0049] Further, the tail gas piece 302 includes a cooling machine 302a arranged on the thermal plasma reactor 201a, a concentration detector 302b arranged on the cooling machine 302a, and a tail gas recovery device 302c arranged on the concentration detector 302b. The cooling machine 302a is fixedly connected to the thermal plasma reactor 201a. The concentration detector 302b is fixedly connected to a position where the tail gas flows on the rear side of the cooling machine 302a, and is used for tail gas detection. The tail gas recovery device 302c is arranged on the rear side of the concentration detector 302b, and is used for tail gas recovery. The tail gas recovery device 302c is arranged at a position where the tail gas flows after the SF6 reaction, and is used for cooling the generated tail gas and detecting the concentration of the tail gas by the concentration detector 302b. Finally, the tail gas recovery device 302c is used for recovering the tail gas.
[0050] During operation, the water cooling device is opened to cool the reactor. After the reaction is completed, the reacted gas is introduced into the cooling device from the gas chamber in the reactor. After cooling, the gas is introduced into the SF6 concentration detector 302b for concentration monitoring. Finally, the tail gas is discharged and recovered.
[0051] When SF6 is injected into the plasma torch, the arc voltage increases significantly, and it is difficult to ignite and maintain. At the same time of high-temperature reaction, the water cooling device is opened to maintain the temperature of the reactor in an ideal range. After passing through the thermal plasma reactor 201a, the high-temperature gas is discharged from the gas chamber in the reactor to the cooling device to prevent damage to the experimental equipment. After cooling, the gas is introduced into the SF6 concentration detector 302b to intuitively reflect the degradation degree of SF6. After processing, the tail gas is collected and processed.
[0052] Embodiment 3
[0053] Reference Figure 1 - Figure 2 The third embodiment of the present application provides a sulfur hexafluoride conversion device and method based on a double-anode thermal plasma, which includes the following contents.
[0054] S1. Control the dilution ratio by the electromagnetic valve, and configure the mixed gas in the gas distribution and mixing device.
[0055] S2. Introduce the mixed gas into the thermal plasma reactor 201a, and blow the tungsten powder into the reactor by the gas pump 202a.
[0056] S3. Turn on the power supply to degrade the mixed gas.
[0057] S4. Cool the reactor by the water cooling system during the degradation process to control the temperature in a reasonable range.
[0058] S5, after the reaction, the gas is discharged through the gas chamber at the bottom of the reactor, and after the cooling device, the SF6 detector is introduced to monitor the degradation efficiency of SF6 waste gas in real time.
[0059] When connecting the equipment, the gas circuit should be connected first, and then the circuit connection. In each stage of the gas circuit connection, a gas flow can be connected through the three-way valve for detection, so that the running state of each stage of equipment can be monitored in real time.
[0060] After the device is running, it should also be closed in the order of gas circuit first and then circuit. Because there is an uncertain reaction device in the equipment, only the gas circuit closing of the equipment is described here. First, the total valve of the SF6 gas cylinder should be closed, and then the electromagnetic valve should be closed, and the gas pump 202a should be closed, and the tungsten powder should not be blown into the reactor. After that, wait for a few minutes, and then turn off the power after the reaction device completely degrades the remaining SF6 mixed gas. Note that the gas circuit of the carrier gas should be closed last, because the carrier gas needs to wash the gas pipe and the remaining SF6 gas in the reaction device. Finally, close the valve of the carrier gas, and the closing sequence is consistent with the SF6 gas circuit.
[0061] Importantly, it should be noted that the configurations and arrangements of the present application shown in the various exemplary embodiments are merely illustrative. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art will readily comprehend, without departing from the novel teachings and advantages described in this application, that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.). For example, elements shown as integrally formed can be constructed of multiple parts or elements, the position of elements can be inverted or otherwise changed, and the nature or number of discrete elements or positions can be varied or changed. Accordingly, all such modifications are intended to be included within the scope of the present application. The order or sequence of any process or method steps can be changed or re-ordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present application. Accordingly, the present application is not limited to particular embodiments, but extends to various modifications that nevertheless fall within the scope of the appended claims.
[0062] In addition, in order to provide a brief description of the exemplary embodiments, not all features of the actual embodiments can be described (i.e., those features that are not relevant to the best mode of carrying out the present application currently considered, or those features that are not relevant to the implementation of the present application).
[0063] It is to be understood that the development process can involve both substantial design and engineering efforts. Those ordinarily skilled in the art will appreciate that such development efforts can be complex and time-consuming, but such is a result of a design, fabrication, and production process that requires the skills of an engineer or engineer designer.
[0064] It should be noted that the above examples are only used to illustrate the technical solutions of the present application but not to limit the present application. Although the present application is described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced, without departing from the spirit and scope of the technical solutions of the present application, and all modifications and equivalent replacements should be included in the scope of the claims of the present application.
Claims
1. A dual anode hot plasma based sulfur hexafluoride conversion apparatus, characterized by: Comprising, a ventilation assembly (100) comprising a gas mixing element (101) and a control element (102), the control element (102) being arranged on the gas mixing element (101); and a degradation assembly (200) comprising a reaction element (201) and a degradation element (202), the reaction element (201) being arranged on the gas mixing element (101), and the degradation element (202) being arranged on the reaction element (201); and a cooling and exhaust assembly (300) comprising a cooling element (301) and an exhaust element (302), the cooling element (301) being arranged on the reaction element (201), and the exhaust element (302) being arranged on the reaction element (201); the gas mixing element (101) comprises a first gas cylinder (101a) and a second gas cylinder (101b), the first gas cylinder (101a) and the second gas cylinder (101b) being connected to a gas distribution and mixing instrument (101c), the first gas cylinder (101a) and the second gas cylinder (101b) being arranged horizontally, the first gas cylinder (101a) containing a certain amount of SF6, and the second gas cylinder (101b) containing a certain amount of inert gas; the reaction element (201) comprises a hot plasma reactor (201a) arranged on the gas distribution and mixing instrument (101c), an arc anode (201b) and a cathode tube (201c) arranged in the hot plasma reactor (201a); the number of arc anodes (201b) is two, and a cathode tube (201c) is arranged between the two arc anodes (201b).
2. The dual anode hot plasma based sulfur hexafluoride conversion apparatus of claim 1, wherein: the control element (102) comprises a first electromagnetic valve (102a) arranged on the first gas cylinder (101a), a second electromagnetic valve (102b) arranged on the second gas cylinder (101b), and a third electromagnetic valve (102c) arranged on the gas distribution and mixing instrument (101c).
3. The dual anode hot plasma based sulfur hexafluoride conversion apparatus of claim 2, wherein: the degradation element (202) comprises a gas pump (202a) connected to the hot plasma reactor (201a), and a tungsten powder tank (202b) connected to the gas pump (202a).
4. The dual anode hot plasma based SF6 conversion apparatus of claim 3, wherein: the cooling element (301) comprises a water cooling machine (301a) connected to the hot plasma reactor (201a).
5. The dual anode hot plasma based sulfur hexafluoride conversion apparatus of claim 4, wherein: the exhaust element (302) comprises a cooling machine (302a) connected to the hot plasma reactor (201a), a concentration detector (302b) connected to the cooling machine (302a), and an exhaust gas recycler (302c) mounted on the concentration detector (302b).
6. A dual anode hot plasma based sulfur hexafluoride conversion apparatus and method, characterized by: The device for converting SF6 based on the double-anode hot plasma according to any one of claims 1-5 comprises the following steps: controlling the dilution ratio to configure mixed gas through electromagnetic valves; passing the mixed gas and tungsten powder into the reactor for degradation; using water cooling to cool down and monitoring the degradation efficiency of SF6 waste gas in real time.
7. The dual anode hot plasma based sulfur hexafluoride conversion apparatus and method of claim 6, wherein: The reactor realizes low current input and high power output, expands the plasma area, and thus completes the conversion treatment of SF6.
Citation Information
Patent Citations
Sulfur hexafluoride recycling process
CN104386652A
Sulfur hexafluoride gas recovery inflation device
CN107588325A
Gas circulation device and method for sulfur hexafluoride gas discharge degradation treatment
CN112604465A
Thermal plasma spray gun
CN113286409A