Method and device for calibrating parallelism between optical fiber and chip

Abstract

The invention discloses a method and device for calibrating parallelism between an optical fiber and a chip, and relates to the field of silicon optical chip performance detection.The method for calibrating parallelism between the optical fiber and the chip comprises the steps that the chip is adjusted to the preset horizontal orientation, the optical fiber is moved to the position above the chip, and the longitudinal position of the optical fiber is adjusted so that the optical fiber can form optical fiber projection on the surface of the chip; and adjusting the inclination angle of the optical fiber based on the parallelism between the optical fiber and the optical fiber projection until the optical fiber is parallel to the optical fiber projection. The optical fiber projection is formed on the chip through the optical fiber, the parallelism between the optical fiber and the optical fiber projection is observed and adjusted through the parallelism observation camera in an assisting mode, parallelism calibration between the optical fiber and the chip can be achieved, and when batch chip performance testing is carried out, the optical fiber keeps the current posture all the time after single-time calibration; the method and the device are used for batch testing of a plurality of chips with the same model and the same parameter, the accuracy and the consistency of an experimental environment are ensured, and the performance testing accuracy and the convenience of the batch chips are improved.

Description

Technical Field

[0001] The present invention relates to the field of silicon photonic chip performance detection, and in particular to a method and device for parallel calibration between an optical fiber and a chip. Background Art

[0002] Silicon photonics technology is the full name of silicon-based optoelectronics technology. It is an innovative method that uses silicon and silicon-based materials (such as SiGe / Si, SOI, etc.) as substrates and uses CMOS process technology to develop integrated optoelectronic devices. As the heart of the optical module, the silicon photonic chip is the core of the optical communication system.

[0003] The spacing between the optical fiber and the chip is critical, usually 5 to 50 microns, and needs to be kept level. When conducting batch chip performance tests, due to the unevenness of the stage on which the chips are placed and the chips themselves, the initial horizontal calibration of the optical fiber cannot guarantee that the optical fiber and the chip are completely level, resulting in deviations in the experimental basic environment. In this case, the measured data cannot truly reflect the performance of the chip itself. Summary of the invention

[0004] The present application provides a method and device for parallel calibration between an optical fiber and a chip, which can solve the technical problem in the prior art that when performing performance testing on a chip, the chip performance cannot be accurately measured due to the unevenness of the stage on which the chip is placed and the chip itself, and the initial horizontal calibration of the optical fiber cannot ensure that the optical fiber and the chip are completely level, and the initial experimental environment is unqualified.

[0005] In a first aspect, an embodiment of the present application provides a method for parallel calibration between an optical fiber and a chip, comprising:

[0006] Adjust the chip to a preset horizontal orientation, move the optical fiber to above the chip, and adjust the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface;

[0007] Based on the parallelism between the optical fiber and the optical fiber projection, the optical fiber tilt angle is adjusted until the optical fiber is parallel to the optical fiber projection.

[0008] In combination with the first aspect, in one embodiment, adjusting the chip to a preset horizontal orientation and moving the optical fiber above the chip specifically includes:

[0009] A chip adjustment camera is arranged above the chip adsorption platform, with the focus facing the upper surface of the chip adsorption platform, and the focus of the chip adjustment camera is adjusted until an image of the upper surface of the chip is formed in the chip adjustment camera;

[0010] The control chip adjusts the camera to start recognizing the right angle of the chip edge to determine the current horizontal orientation of the chip;

[0011] Based on the determination result of the chip adjustment camera, the horizontal orientation of the chip adsorption platform is adjusted until the chip adjustment camera determines that the chip on the chip adsorption platform is located within a preset orientation angle;

[0012] One end of the optical fiber is fixed, and the other end is facing the adjustment chip adsorption platform. The horizontal position of the optical fiber is adjusted until the free end of the optical fiber is located directly above the adjustment chip adsorption platform.

[0013] In one embodiment, adjusting the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface specifically includes:

[0014] A parallelism observation camera with a focus facing the side of the chip adsorption platform is arranged on one side of the long side of the chip adsorption platform, and the focal length of the parallelism observation camera is adjusted until a side image of the chip is formed in the parallelism observation camera;

[0015] Based on the design parameters of the chip and the optical fiber, the optimal coupling distance between the chip and the optical fiber is calculated;

[0016] Based on the optimal coupling spacing, the longitudinal position of the optical fiber is adjusted until a fiber projection is formed on the chip surface, and both the optical fiber and the fiber projection form images in the parallelism observation camera.

[0017] In one embodiment, adjusting the fiber tilt angle based on the parallelism between the optical fiber and the optical fiber projection so that the optical fiber is parallel to the optical fiber projection specifically includes:

[0018] Based on the parallelism, the optical fiber side image and the optical fiber projection image formed in the camera are observed, and according to the parallelism between the optical fiber side image and the optical fiber projection image, the optical fiber tilt angle is adjusted until the optical fiber side image and the optical fiber projection image are parallel.

[0019] In a second aspect, an embodiment of the present application provides a parallel calibration device between an optical fiber and a chip, which is used to implement the above-mentioned parallel calibration method between an optical fiber and a chip, and the parallel calibration device between an optical fiber and a chip includes:

[0020] A placement component, the placement component includes a chip placement unit and an optical fiber placement unit located on one side of the chip placement unit, the chip placement unit includes a chip adsorption platform and a rotation axis located at the bottom of the chip adsorption platform, and the optical fiber placement unit includes, from top to bottom, an optical fiber bracket facing the chip adsorption platform, a three-degree-of-freedom rotating part, and a three-degree-of-freedom displacement platform;

[0021] An imaging component includes a chip adjustment camera located above the chip adsorption platform and focusing toward the upper surface of the chip adsorption platform, and a parallelism observation camera located on one side of the length direction of the chip adsorption platform and focusing toward the side of the chip adsorption platform.

[0022] In combination with the second aspect, in one embodiment, the chip adsorption platform includes a table body and a negative pressure through hole longitudinally penetrating the table body, and an outflow end of the negative pressure through hole is provided with a connection end for connecting to an external adsorption pipeline.

[0023] In one embodiment, the bottom of the self-rotating rotating shaft is connected to a power source, and the top of the self-rotating rotating shaft is connected to the bottom of the chip adsorption platform.

[0024] In one embodiment, one end of the optical fiber bracket is detachably connected to the top of the three-degree-of-freedom rotating member, and the other end of the optical fiber bracket extends horizontally toward the chip adsorption platform.

[0025] In one embodiment, an optical fiber connector is provided at one end of the optical fiber bracket close to the chip adsorption platform.

[0026] In one embodiment, the imaging assembly further includes a camera bracket for fixing the chip adjustment camera and the parallelism observation camera.

[0027] The beneficial effects brought by the technical solution provided in the embodiments of the present application include:

[0028] The parallel calibration method between optical fiber and chip in the present application forms an optical fiber projection on the chip through the optical fiber, and observes and assists in adjusting the parallelism between the optical fiber and the optical fiber projection through a parallelism observation camera, so as to realize the parallelism calibration between the optical fiber and the chip. When performing batch chip performance testing, after a single calibration, the optical fiber always maintains the current posture, so as to be used for batch testing of multiple chips of the same model and parameters, thereby ensuring the accuracy and consistency of the experimental environment and improving the accuracy and convenience of batch chip performance testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 A schematic diagram of a parallel calibration method between an optical fiber and a chip provided in an embodiment of the present application;

[0031] Figure 2 A schematic diagram of the structure of a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application;

[0032] Figure 3 A schematic diagram of the structure of a placement component and an imaging component in a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application;

[0033] Figure 4 A schematic longitudinal section diagram of a chip adsorption platform in a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application.

[0034] In the figure: 1. chip placement unit; 101. chip adsorption platform; 1011. platform body; 1012. negative pressure through hole; 1013. connection end; 102. rotation axis; 2. optical fiber placement unit; 201. optical fiber bracket; 202. three-degree-of-freedom rotating part; 203. three-degree-of-freedom translation platform; 3. chip adjustment camera; 4. parallelism observation camera. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] First, some technical terms in this application are explained to facilitate those skilled in the art to understand this application:

[0037] Optical fiber, full name optical fiber, is a light transmission tool that uses the principle of total reflection of light in a fiber made of glass or plastic. It has the advantages of fast transmission speed, large bandwidth, and strong anti-interference ability, and is the core of modern communication technology. Optical fiber is responsible for transmitting data in the form of optical signals, allowing information to travel long distances in an instant.

[0038] Chip: A microelectronic component that integrates multiple electronic components on a substrate to complete certain circuit or system functions. It is the most important part of an electronic device, responsible for computing, control, storage and other functions. In a communication system, the chip is responsible for decoding, processing and re-encoding the received optical signal.

[0039] Coupling method between optical fiber and chip: Coupling between optical fiber and chip is a key step to achieve optical signal transmission and processing. Common coupling methods include direct coupling, ball lens coupling, inverted cone coupling, fiber array coupling and grating coupling. Among them, end face coupling is the most common coupling method. The transmission of optical signals is achieved by closely fitting the output light spot of the chip with the end face of the optical fiber. This coupling method has the advantages of simple structure and high coupling efficiency.

[0040] On the first aspect, an embodiment of the present application provides a method for parallel calibration between an optical fiber and a chip, which can solve the technical problem in the prior art that when performing performance testing on a chip, the chip performance cannot be accurately measured due to the unevenness of the stage on which the chip is placed and the chip itself, and the initial horizontal calibration of the optical fiber cannot ensure that the optical fiber and the chip are completely level, and the initial experimental environment is unqualified.

[0041] Figure 1 A schematic flow chart of a parallel calibration method between an optical fiber and a chip provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the parallel calibration method between the optical fiber and the chip in this application specifically includes:

[0042] S1: Adjust the chip to a preset horizontal orientation, move the optical fiber to above the chip, and adjust the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface;

[0043] Chip orientation refers to the direction or angle of the chip surface relative to the optical fiber when the chip is installed or used. In optoelectronic integration, precise control of chip orientation is crucial to achieving efficient optical coupling, reducing optical loss, and improving the overall performance of the system. Therefore, before the experiment begins, it is necessary to first adjust the chip's flatness and orientation. After the chip is adjusted, the optical fiber is transmitted to the top of the chip.

[0044] It should be noted here that the coupling efficiency between the chip and the optical fiber depends on the angle between the chip and the optical fiber. Therefore, in this application, the chip is not required to be absolutely horizontal. As long as the optical fiber is debugged with the chip as the reference, the optical fiber can be debugged to be relatively parallel to the chip.

[0045] The imaging process of optical fiber on chip mainly includes: the optical fiber transmits the optical signal to the inside of the chip through the chip interface, the optical signal processing starts inside the chip, and finally imaging is performed. This process belongs to the prior art and will not be described in detail here. The main influencing factor of optical fiber imaging on chip is the coupling efficiency between optical fiber and chip, and the important parameter that determines the coupling efficiency is the coupling distance between optical fiber and chip. Therefore, in this step, by taking the chip as the debugging reference, the longitudinal position of the optical fiber is adjusted so that the distance between the optical fiber and the chip reaches the optimal coupling efficiency, so that the optical fiber can form a clear and clear optical fiber projection on the chip surface.

[0046] S2: Based on the parallelism between the optical fiber and the optical fiber projection, adjust the optical fiber tilt angle until the optical fiber is parallel to the optical fiber projection.

[0047] The surface of the chip itself is uneven, and it is not convenient to observe the parallelism. Therefore, in this application, the fiber projection formed on the chip surface is observed, and the fiber projection and the fiber are parallelized. The parallelism calibration between the fiber and the chip can be indirectly realized, and the optimal coupling distance between the fiber and the chip can be ensured by observing the clarity of the fiber projection. When performing batch chip performance testing, after a single calibration, the optical fiber always maintains the current posture to be applicable to multiple chips of the same model and parameters, so as to ensure the accuracy and consistency of the test environment and improve the accuracy and convenience of batch chip performance testing.

[0048] Specifically, the step S1 of adjusting the chip to a preset horizontal orientation and moving the optical fiber above the chip specifically includes:

[0049] S101: a chip adjustment camera 3 is arranged above the chip adsorption platform 101 with its focus facing the upper surface of the chip adsorption platform 101, and the chip adjustment camera 3 adjusts its focal length until an image of the upper surface of the chip is formed in the chip adjustment camera 3;

[0050] S102: Control the chip to adjust the camera 3 to start recognizing the right angle of the chip edge to determine the current horizontal orientation of the chip;

[0051] S103: Based on the determination result of the chip adjustment camera 3 , the horizontal orientation of the chip adsorption platform 101 is adjusted until the chip adjustment camera 3 determines that the chip on the chip adsorption platform 101 is located within a preset orientation angle.

[0052] S104: one end of the optical fiber is fixed, and the other end is facing the adjusting chip adsorption platform 101 , and the horizontal position of the optical fiber is adjusted until the free end of the optical fiber is located directly above the adjusting chip adsorption platform 101 .

[0053] The chip adsorption platform 101 is mainly used to stably place the chip. After placement and debugging, the chip adjustment camera 3 is perpendicular to the chip surface to reduce perspective distortion. The focus of the chip adjustment camera 3 is directly on the chip on the chip adsorption platform 101, so that the chip adjustment camera 3 can obtain a clear chip image. Subsequently, the edge detection algorithm is applied to identify the chip edge and extract the right-angle point from the detected chip edge. Finally, based on the extracted right-angle feature points, the orientation angle of the chip edge is calculated and the result is output. The staff can adjust the horizontal orientation of the chip according to the output result of the chip adjustment camera 3.

[0054] Further, the step S1 of adjusting the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface specifically includes:

[0055] S105: a parallelism observation camera 4 with a focus facing the side of the chip adsorption platform 101 is arranged on a side of a long side of the chip adsorption platform 101, and the focal length of the parallelism observation camera 4 is adjusted until a side image of the chip is formed in the parallelism observation camera 4;

[0056] S106: Calculate the optimal coupling distance between the chip and the optical fiber based on the parameters of the chip and the optical fiber;

[0057] S107: Based on the optimal coupling spacing, the longitudinal position of the optical fiber is adjusted until an optical fiber projection is formed on the chip surface, and both the optical fiber and the optical fiber projection form an image in the parallelism observation camera 4;

[0058] The parallelism observation camera 4 is mainly used to observe the horizontality between the optical fiber and the optical fiber shadow. It is arranged on the side of the long side of the chip adsorption platform 101 so that the parallelism observation camera 4 can observe the side of the long side of the optical fiber. After the height position of the optical fiber is adjusted, the optical fiber forms an optical fiber projection on the chip surface. At the same time, the optical fiber and the optical fiber projection are displayed in the parallelism observation camera 4.

[0059] Furthermore, step S2 specifically includes:

[0060] S201: Observe the optical fiber side image and the optical fiber projection image formed in the parallelism camera 4, and adjust the optical fiber tilt angle according to the parallelism between the optical fiber side image and the optical fiber projection image until the optical fiber side image and the optical fiber projection image are parallel.

[0061] The optical fiber forms a side image of the optical fiber in the parallelism observation camera 4, and the optical fiber projection forms a optical fiber projection image in the parallelism observation camera 4. The optical fiber projection is directly formed on the chip surface. Therefore, the parallelism between the optical fiber and the optical fiber projection can be equivalent to the parallelism between the optical fiber and the chip. On the premise that the chip posture has been debugged, the chip is used as a horizontal reference to debug the optical fiber tilt angle until the optical fiber and the optical fiber projection are relatively parallel.

[0062] The parallel calibration method between the optical fiber and the chip in the present application forms an optical fiber projection on the chip through the optical fiber, and observes and assists in adjusting the parallelism between the optical fiber and the optical fiber projection through the parallelism observation camera 4, so as to realize the parallelism calibration between the optical fiber and the chip. When performing batch chip performance testing, after a single calibration, the optical fiber always maintains the current posture, so as to be used for batch testing of multiple chips of the same model and parameters, thereby ensuring the accuracy and consistency of the experimental environment and improving the accuracy and convenience of batch chip performance testing.

[0063] In a second aspect, the present application also provides a parallel calibration device between an optical fiber and a chip, which is used to implement the above-mentioned parallel calibration method between an optical fiber and a chip. Figure 2 A schematic diagram of a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application, Figure 3 A schematic diagram of the structure of a placement component and an imaging component in a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application, such as Figure 2 , Figure 3 As shown, the parallel calibration device between the optical fiber and the chip includes a placement component and an imaging component. The placement component is used to stably place the optical fiber and the chip, and the imaging component is used to assist in debugging the chip posture and the parallelism between the chip and the optical fiber.

[0064] The placement component includes a chip placement unit 1 and an optical fiber placement unit 2 located on one side of the chip placement unit 1, the chip placement unit 1 includes a chip adsorption platform 101 and a rotation axis 102 located at the bottom of the chip adsorption platform 101, and the optical fiber placement unit 2 includes, from top to bottom, an optical fiber bracket 201 facing the chip adsorption platform 101, a three-degree-of-freedom rotating part 202, and a three-degree-of-freedom displacement platform 203.

[0065] The imaging component includes a chip adjustment camera 3 located above the chip adsorption platform 101 and focusing toward the upper surface of the chip adsorption platform 101 , and a parallelism observation camera 4 located on one side of the chip adsorption platform 101 in the length direction and focusing toward the side of the chip adsorption platform 101 .

[0066] The chip placement unit 1 is spaced apart from the optical fiber placement unit 2. The chip adsorption platform 101 in the chip placement unit 1 is mainly used to utilize negative pressure to adsorb the chip during the experiment to ensure the stability of the chip and prevent damage to the chip. The rotation axis 102 located at the bottom of the chip adsorption platform 101 can rotate along its own axial direction to adjust the horizontal orientation of the chip.

[0067] The optical fiber holder 201 in the optical fiber placement unit 2 is mainly used to fix one end of the optical fiber. The three-degree-of-freedom rotating part 202 can drive the optical fiber holder 201 and the optical fiber to rotate around the X-axis, Y-axis and Z-axis. The three-degree-of-freedom translation platform 203 can drive the optical fiber holder 201 and the optical fiber to translate in the X-axis, Y-axis and Z-axis. The three-degree-of-freedom rotating part 202 and the three-degree-of-freedom translation platform 203 cooperate with each other to realize flexible adjustment of the optical fiber at multiple angles.

[0068] Here, it should be noted that the above-mentioned X, Y, and Z refer to three basic directions in three-dimensional space. In three-dimensional space, the X direction usually represents a component in the horizontal direction, or can be understood as the left-right direction, the Y direction represents another component in the horizontal direction, or can be understood as the front-back direction, and the Z direction represents the third direction perpendicular to the X-axis and the Y-axis, and is usually understood as the up-down direction. At the same time, the three-degree-of-freedom translation stage 203 and the three-degree-of-freedom rotating member 202 are existing commonly used components, and will not be described in detail here.

[0069] The chip adjustment camera 3 is located on the normal side of the chip adsorption platform 101 and is perpendicular to the chip adsorption platform 101. The chip adsorption platform 101 and the chip on the chip adsorption platform 101 are located in the lens of the chip adjustment camera 3. The chip adjustment camera 3 obtains the image of the chip, calculates the tilt angle of the chip and outputs the result. The staff can adjust the horizontal orientation of the chip according to the output result of the chip adjustment camera 3.

[0070] The parallelism observation camera 4 is located on one side of the long side of the chip adsorption platform 101. After the chip and the optical fiber are adjusted, one side of the long side of the chip and the optical fiber is within the lens of the parallelism observation camera 4, so that the staff can observe the parallelism between the chip and the optical fiber.

[0071] Furthermore, Figure 4 A schematic longitudinal section diagram of a chip adsorption platform 101 in a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application, as shown in FIG. Figure 4 As shown, the chip adsorption platform 101 includes a table body 1011 and a negative pressure through hole 1012 that longitudinally penetrates the table body 1011, the outflow end of the negative pressure through hole 1012 is provided with a connection end 1013 for connecting to an external adsorption pipeline, the bottom of the self-rotating rotating shaft 102 is connected to a power source, the top of the self-rotating rotating shaft 102 is connected to the bottom of the chip adsorption platform 101, the table body 1011 has a certain thickness, the negative pressure through hole 1012 longitudinally penetrates the table body 1011 and the negative pressure through hole 1012 avoids the position of the self-rotating rotating shaft 102, the external adsorption pipeline is connected to the outflow end of the negative pressure through hole 1012, and in one embodiment of the present application, the connection end 1013 of the negative pressure through hole 1012 is an internal thread type.

[0072] Furthermore, one end of the optical fiber bracket 201 is detachably connected to the top of the three-degree-of-freedom rotating part 202, and the other end of the optical fiber bracket 201 extends horizontally toward the chip adsorption platform 101. In one embodiment of the present application, the optical fiber bracket 201 is in the shape of an elongated strip, and a threaded hole is provided at one end of the optical fiber bracket 201, and a connecting hole corresponding to the threaded hole is provided on the top of the three-degree-of-freedom rotating part 202. The detachable connection between the optical fiber bracket 201 and the three-degree-of-freedom rotating part 202 is achieved by connecting bolts, and the end of the optical fiber bracket 201 without a threaded hole extends horizontally toward the chip adsorption platform 101.

[0073] Furthermore, an optical fiber connector is provided at one end of the optical fiber holder 201 close to the chip adsorption platform 101. The specific connection method of the optical fiber connector includes but is not limited to a strap connection, a threaded connection or a snap connection, etc., as long as the connection stability between the optical fiber holder 201 and the optical fiber is ensured, and no specific restrictions are made in the present application.

[0074] Furthermore, the imaging component also includes a camera bracket for fixing the chip adjustment camera 3 and the parallelism observation camera 4. In the present application, there are two camera brackets. The chip adjustment camera 3 and the parallelism observation camera 4 are respectively arranged on the camera brackets. The camera brackets are fixed on a fixed surface to ensure normal imaging of the chip adjustment camera 3 and the parallelism observation camera 4. No specific restrictions are made in the present application.

[0075] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0076] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0077] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A method for parallel calibration between an optical fiber and a chip, characterized in that: include: Adjust the chip to a preset horizontal orientation, move the optical fiber to above the chip, and adjust the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface; Based on the parallelism between the optical fiber and the optical fiber projection, the optical fiber tilt angle is adjusted until the optical fiber is parallel to the optical fiber projection.

2. A method for parallel calibration between an optical fiber and a chip as claimed in claim 1, characterized in that: The step of adjusting the chip to a preset horizontal orientation and moving the optical fiber above the chip specifically includes: A chip adjustment camera (3) is arranged above the chip adsorption platform (101) with its focus facing the upper surface of the chip adsorption platform (101), and the focal length of the chip adjustment camera (3) is adjusted until an image of the upper surface of the chip is formed in the chip adjustment camera (3); The control chip adjusts the camera (3) to start recognizing the right angle of the edge of the chip to determine the current horizontal orientation of the chip; Based on the determination result of the chip adjustment camera (3), the horizontal orientation of the chip adsorption platform (101) is adjusted until the chip adjustment camera (3) determines that the chip on the chip adsorption platform (101) is located within a preset orientation angle; One end of the optical fiber is fixed, and the other end faces the adjusting chip adsorption platform (101), and the horizontal position of the optical fiber is adjusted until the free end of the optical fiber is located directly above the adjusting chip adsorption platform (101).

3. A method for parallel calibration between an optical fiber and a chip as claimed in claim 1, characterized in that: The adjusting the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface specifically includes: A parallelism observation camera (4) with a focus facing the side of the chip adsorption platform (101) is arranged on a side of a long side of the chip adsorption platform (101), and the focal length of the parallelism observation camera (4) is adjusted until a side image of the chip is formed in the parallelism observation camera (4); Based on the design parameters of the chip and the optical fiber, the optimal coupling distance between the chip and the optical fiber is calculated; Based on the optimal coupling spacing, the longitudinal position of the optical fiber is adjusted until a fiber projection is formed on the chip surface, and both the optical fiber and the fiber projection form images in a parallelism observation camera (4).

4. A method for parallel calibration between an optical fiber and a chip as claimed in claim 3, characterized in that: The adjusting the fiber tilt angle based on the parallelism between the optical fiber and the optical fiber projection so that the optical fiber and the optical fiber projection are parallel specifically includes: Based on the parallelism observation, the optical fiber side image and the optical fiber projection image formed in the camera (4) are observed, and according to the parallelism between the optical fiber side image and the optical fiber projection image, the optical fiber tilt angle is adjusted until the optical fiber side image and the optical fiber projection image are parallel.

5. A parallel calibration device between an optical fiber and a chip, used to implement the parallel calibration method between an optical fiber and a chip according to any one of claims 1 to 4, characterized in that: The optical fiber and chip parallel calibration device comprises: A placement component, the placement component comprising a chip placement unit (1) and an optical fiber placement unit (2) located on one side of the chip placement unit (1), the chip placement unit (1) comprising a chip adsorption platform (101) and a self-rotation rotation axis (102) located at the bottom of the chip adsorption platform (101), the optical fiber placement unit (2) comprising, from top to bottom, an optical fiber support (201) facing the chip adsorption platform (101), a three-degree-of-freedom rotating member (202), and a three-degree-of-freedom displacement platform (203); An imaging component comprises a chip adjustment camera (3) located above the chip adsorption platform (101) and having a focus toward the upper surface of the chip adsorption platform (101), and a parallelism observation camera (4) located on one side in the length direction of the chip adsorption platform (101) and having a focus toward the side of the chip adsorption platform (101).

6. The parallel calibration device between optical fiber and chip as claimed in claim 5, characterized in that: The chip adsorption platform (101) comprises a platform body (1011) and a negative pressure through hole (1012) longitudinally penetrating the platform body (1011); the outflow end of the negative pressure through hole (1012) is provided with a connection end (1013) for connecting to an external adsorption pipeline.

7. The parallel calibration device between an optical fiber and a chip according to claim 6, characterized in that: The bottom of the self-rotating rotating shaft (102) is connected to a power source, and the top of the self-rotating rotating shaft (102) is connected to the bottom of the chip adsorption platform (101).

8. The parallel calibration device between an optical fiber and a chip as claimed in claim 5, characterized in that: One end of the optical fiber bracket (201) is detachably connected to the top of the three-degree-of-freedom rotating member (202), and the other end of the optical fiber bracket (201) extends horizontally toward the chip adsorption platform (101).

9. The parallel calibration device between an optical fiber and a chip according to claim 8, characterized in that: An optical fiber connector is provided at one end of the optical fiber support (201) close to the chip adsorption platform (101).

10. The parallel calibration device between optical fiber and chip according to claim 5, characterized in that: The imaging assembly also includes a camera bracket for fixing the chip adjustment camera (3) and the parallelism observation camera (4).

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