A radio frequency voltage and current detection module and detection box

Abstract

The present invention relates to the field of radio frequency power supply technology, and specifically to a radio frequency voltage and current detection module and a detection box. The radio frequency voltage and current detection module is arranged on one side of a PCB board through a conductor, and an insulating medium is provided between the conductor and the PCB board, so that a parasitic capacitor C1 is formed between the metal layer and the conductor, and the planar coil L1 senses the current signal of the conductor through magnetic field coupling, and the metal layer collects the voltage signal of the conductor through the formed parasitic capacitor C1 and the capacitor C2 connected in series, so that the sampling voltage signal and the sampling current signal can be almost distortion-free, and the sampling voltage signal and the sampling current signal have little interference, and have good independence; and it can be used for current and voltage detection of a single-conductor radio frequency power supply; there is no need to open a through hole on the PCB board for the conductor to pass through; the planar coil L1, the metal layer and the capacitor C2 are all arranged on the same PCB board and grounded using the grounding layer on the PCB board, so that the PCB board processing and wiring are simpler, and it is more convenient for structural production and spatial setting.

Description

Technical Field

[0001] The present invention relates to the technical field of radio frequency power supply detection, and in particular to a radio frequency voltage and current detection module and a detection box. Background Art

[0002] When the existing RF power supply outputs power, it is necessary to collect the power value at the output end and compare it with the power value set by the user to perform PID closed-loop control. At present, the collection of the output power value mainly uses current sensors for current collection and voltage sensors for voltage collection. The collected signals are sent to the main control for power calculation. However, due to the loss and heat generation of the magnetic materials of current sensors and voltage sensors, low bandwidth and poor linearity, they are not suitable for high-power collection.

[0003] In the public patent documents, such as the invention patent with the authorization announcement number CN117665382B and the name of a power detection circuit and a power detection PCB board, it uses the parasitic capacitor C1 and the first capacitor to perform capacitor voltage division to obtain a sampled voltage signal, and obtains a sampled current signal according to the induced current on the secondary side of the current transformer and the sampling resistor circuit, so that the sampled voltage signal and the sampled current signal can be almost distortion-free, and the interference between the sampled voltage signal and the sampled current signal is small, with good independence, and can collect relatively large power. However, in this technical solution, since its inner conductor runs through the PCB board, the PCB board needs to have a through hole for the inner conductor to pass through, and the circuits on the PCB board are complicated, which leads to complex processing of the PCB board.

[0004] In the public patent documents, such as the invention patent with the authorization announcement number CN105372483B and the name of a radio frequency voltage and current detection device, a metal sheet is arranged in parallel between the inner conductor and the outer conductor, an equivalent capacitor C20 is formed between the metal sheet and the inner conductor, and an equivalent capacitor C30 is formed between the metal sheet and the outer conductor, and a capacitor C10 needs to be connected between the metal sheet and the outer conductor, and the voltage of the radio frequency power supply is measured by dividing the voltage by the equivalent capacitor C20 after the equivalent capacitor C30 and the capacitor C10 are connected in parallel. In this technical solution, the metal sheet is arranged on the circuit board, so there is no need to set a hole for the inner conductor to pass through on the PCB board, which reduces the difficulty of the processing technology of the circuit board; however, in this way, the metal sheet needs to be grounded through the outer conductor, which can only be applied to the voltage detection of the radio frequency power supply of the dual conductor, and cannot be directly applied to the voltage detection of the radio frequency power supply of the single conductor; and the capacitor C10 cannot be arranged on the same circuit board as the metal sheet, but needs to adopt a separate capacitor structure and welded to the outer conductor, resulting in a more complicated structural setting. In addition, the patent document also discloses a current sampling unit. The current sampling unit adopts a planar coil. The geometric centers of the voltage sampling unit and the current sampling unit are at the same position in the length direction of the inner conductor. When the inner conductor is placed horizontally, the voltage sampling unit is placed horizontally at a certain distance directly below it, and the current sampling unit is placed horizontally at a certain distance from the side of the inner conductor. This makes it inconvenient to support and fix the voltage sampling unit and the current sampling unit, and they need to be fixed by other structures. Summary of the invention

[0005] The purpose of the present invention is to overcome the above technical problems and provide a radio frequency voltage and current detection module and a detection box.

[0006] In a first aspect, the present invention provides a radio frequency voltage and current detection module, comprising:

[0007] A PCB board, wherein a planar coil L1, a metal layer and a grounding layer are arranged on the PCB board; the grounding layer is arranged on the upper surface or the lower surface of the PCB board; the metal layer is connected in series with a capacitor C2 and is connected to the grounding layer through the capacitor C2; one end of the planar coil L1 is connected to the grounding layer; the planar coil L1 and the metal layer are arranged adjacent to or nested on the same layer of the PCB board, or are arranged on different layers of the PCB board and are stacked;

[0008] A conductor, wherein the conductor is located at one side of the PCB board, and an insulating medium is provided between the conductor and the PCB board; a parasitic capacitor C1 is formed between the metal layer and the conductor;

[0009] The planar coil L1 senses the current signal of the conductor through magnetic field coupling, and the metal layer collects the voltage signal of the conductor through the parasitic capacitor C1 and the capacitor C2 connected in series.

[0010] The present invention provides a radio frequency voltage and current detection module, wherein the planar coil L1 and the metal layer are located on the same layer of the PCB board, adjacent to each other or nested, or located on different layers of the PCB board and stacked, and the conductor is located on one side of the PCB board, so that the planar coil L1 senses the current signal of the conductor through magnetic field coupling, an insulating medium is provided between the conductor and the PCB board, so that a parasitic capacitor C1 is formed between the metal layer and the conductor, and the metal layer collects the voltage signal of the conductor through the formed parasitic capacitor C1 and the capacitor C2 connected in series, so that the sampled voltage signal and the sampled current signal are almost free of distortion, and the interference between the sampled voltage signal and the sampled current signal is small, and the module has good independence. The conductor is located on one side of the PCB board, and there is no need to open a hole on the PCB board for the conductor to pass through. The PCB board only needs to process the planar coil L1, the metal layer, the grounding layer and the capacitor C2, and the grounding layer is arranged on the upper surface or the lower surface of the PCB board; the metal layer is connected to the grounding layer through the capacitor C2, and it is unnecessary to ground the metal layer through an external conductor, so that the voltage detection of the radio frequency power supply of the single conductor can be used; the planar coil L1, the metal layer and the capacitor C2 are all arranged on the same PCB board and are grounded using the grounding layer on the PCB board, so the PCB board processing and wiring are simpler, and it is more convenient for structural production and space setting.

[0011] Optionally, the conductor axis is at an angle of 0°-10° to the PCB board, and when a parasitic capacitor C1 is formed between the metal layer and the conductor, the space occupied can be reduced, making the volume smaller. When the angle between the conductor axis and the PCB board exceeds 10°, the detection accuracy may be affected.

[0012] Optionally, the insulating medium is air or an insulating member made of insulating material.

[0013] Optionally, the planar coil L1 is in a U-shape, and two ends of the planar coil L1 are led out through vias on a PCB board; the metal layer is in a strip shape, and the metal layer is electrically connected to the capacitor C2 through vias or leads.

[0014] Optionally, the planar coil L1 and the metal layer are located adjacent to each other on the same layer of the PCB board, and the planar coil L1 and the metal layer are respectively located on both sides of the projection of the conductor on the PCB board, so that the planar coil L1 and the metal layer are close to the conductor, and the effects of current detection and voltage detection are better.

[0015] Optionally, the planar coil L1 and the metal layer are nested in the same layer of the PCB board, the metal layer is located in the planar coil L1, and the planar coil L1 and the metal layer are both located in the projection area of ​​the conductor on the PCB board, so that the effects of current detection and voltage detection are better.

[0016] Optionally, a groove is provided on one side of the PCB board; the notch of the groove faces the PCB board, and the conductor is at least partially located in the groove. The groove can be used to position and install the conductor, making the installation faster and more accurate, which is conducive to ensuring the effect of current detection and voltage detection.

[0017] Optionally, the planar coil L1 and the metal layer are both located within the projection of the inner wall of the groove on the PCB board, so as to achieve positioning and installation of the conductor while avoiding the influence of the groove on current detection and voltage detection.

[0018] Optionally, it further comprises a shell, which is welded to the PCB board and forms the groove for accommodating the conductor, and has a simple structure and is easy to process.

[0019] Optionally, a base connected to the PCB is further included, the top surface of the base is provided with the groove, and the top surface of the base is electrically connected to the grounding layer on the lower surface of the PCB. The groove is on the top surface of the base, which is more convenient to process. The top surface of the base is electrically connected to the grounding layer on the lower surface of the PCB, so that the grounding layer can be grounded using the base.

[0020] Optionally, the groove and the PCB board are spaced apart or enclosed to form a channel for the conductor to pass through.

[0021] Optionally, the PCB board includes a first area and a second area, the first area is provided with the metal layer on one side and the capacitor C2 and the first output terminal J1 on the other side; the second area is provided with the planar coil L1 on one side and the second output terminal J2 on the other side.

[0022] In voltage detection and current detection, the capacitor C2 is set in the first area of ​​the PCB board for voltage detection, and the planar coil L1 is set in the second area of ​​the PCB board for current detection. The interference between the sampled voltage signal and the sampled current signal is small, with good independence, high detection accuracy and strong reliability.

[0023] Optionally, the first output terminal J1 includes an inner conductor connected to the capacitor C2 and an outer conductor electrically connected to the control circuit, and is used to transmit a voltage signal of the conductor to the control circuit;

[0024] The second output terminal J2 includes an inner conductor connected to the planar coil L1 and an outer conductor connected to the control circuit, and is used to transmit the current signal of the conductor to the control circuit.

[0025] The first output terminal J1 and the second output terminal J2 both include an inner conductor and an outer conductor, so as to facilitate transmitting the voltage signal and the current signal to the control circuit respectively.

[0026] In a second aspect, the present invention provides a radio frequency voltage and current detection box, comprising a shielding box and the radio frequency voltage and current detection module, wherein the PCB board and the conductor are both fixed in the shielding box, the conductor is insulated from the shielding box, and both ends of the conductor are electrically connected to the outside of the shielding box.

[0027] The shielding box is used to shield external interference, so that the PCB board and conductor of the shielding box are less disturbed during the process of detecting current and voltage, which can improve the accuracy of the detection result.

[0028] Optionally, the shielding box includes a box body at the bottom and a cover body detachably snap-fitted to the box body, the box body and the cover body snap-fitted to form an internal accommodating space, and the PCB board and the conductor are fixedly arranged in the internal accommodating space.

[0029] The shielding box comprises a box body at the bottom and a cover body which is detachably snap-fitted to the box body, so as to facilitate installation of structures such as PCB boards and conductors.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. The present invention provides a radio frequency voltage and current detection module, wherein a planar coil L1 and a metal layer are located on the same layer of the PCB board, adjacently arranged or nested, or located on different layers of the PCB board and stacked, a conductor is placed on one side of the PCB board, the planar coil L1 senses the current signal of the conductor through magnetic field coupling, an insulating medium is provided between the conductor and the PCB board, a parasitic capacitor C1 is formed between the metal layer and the conductor, the metal layer collects the voltage signal of the conductor through the formed parasitic capacitor C1 and the series capacitor C2, and the sampling voltage signal and the sampling current signal can be almost free of distortion, and the interference between the sampling voltage signal and the sampling current signal is small, and the module has good independence. Since the conductor is arranged on one side of the PCB board, there is no need to open a hole for the conductor to pass through on the PCB board, and the PCB board only needs to process the planar coil L1, the metal layer, the ground layer and the capacitor C2. The grounding layer is arranged on the upper surface or the lower surface of the PCB board, and the metal layer is connected to the grounding layer through the capacitor C2. It is unnecessary to ground the metal layer through the outer conductor, so that the voltage detection of the RF power supply of the single conductor can be used; the planar coil L1, the metal layer and the capacitor C2 are all arranged on the same PCB board and grounded by the grounding layer on the PCB board, which makes the PCB board processing and wiring simpler and more convenient for structural production and spatial setting.

[0032] 2. The present invention provides a radio frequency voltage and current detection box, which shields external interference through a shielding box, so that the PCB board and conductor of the shielding box are less interfered during the process of detecting current and voltage, and the accuracy of the detection result can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a first side view schematic diagram of a radio frequency voltage and current detection module;

[0034] Figure 2 It is a first planar schematic diagram of the radio frequency voltage and current detection module;

[0035] Figure 3 It is a second planar schematic diagram of the radio frequency voltage and current detection module;

[0036] Figure 4 It is a third planar schematic diagram of the radio frequency voltage and current detection module;

[0037] Figure 5 is a second side view schematic diagram of the radio frequency voltage and current detection module;

[0038] Figure 6 is a third side view schematic diagram of the radio frequency voltage and current detection module;

[0039] Figure 7 It is a circuit diagram of a radio frequency voltage and current detection module;

[0040] Figure 8 This is a plan view of the PCB board (front view);

[0041] Fig. 9 This is a plan view of the PCB board (back side);

[0042] Fig.10 is a fourth side view schematic diagram of the radio frequency voltage and current detection module;

[0043] Fig.11 This is a schematic diagram of the structure of the RF voltage and current detection box (the cover is not shown).

[0044] Markings in the figure: 1. PCB board; 101. first area; 102. second area; 11. planar coil L1; 12. metal layer; 13. connecting hole; 131. rivet; 14. ground layer; 2. base; 21. groove; 211. shell; 3. conductor; 31. input terminal IN; 32. output terminal OUT; 41. first output terminal J1; 42. second output terminal J2; 5. box body. DETAILED DESCRIPTION

[0045] The present invention is further described in detail below in conjunction with specific embodiments. However, this should not be understood as the scope of the above subject matter of the present invention being limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

[0046] Unless otherwise specified, in the description of the specific embodiments of the present invention, the terms indicating the orientation or position relationship such as "up", "down", "left", "right", "center", "inside", "outside", etc. are all expressions based on the orientation or position relationship shown in the drawings, or are the orientation or position relationship when the invented product / equipment / device is usually used. These terms of orientation or position relationship are only for the convenience of describing the scheme of the present invention or simplifying the description in the specific embodiments, so as to facilitate the technicians to quickly understand the scheme, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific position relationship, and therefore cannot be understood as a limitation on the present invention.

[0047] In addition, if the terms "horizontal", "vertical", "overhanging", "parallel" and the like appear, it does not mean that the corresponding devices / components / elements are required to be absolutely horizontal or vertical or overhanging or parallel, but may be slightly tilted or have deviations. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but may be slightly tilted. Alternatively, it can be simplified to mean that the corresponding devices / components / elements are set in directions such as "horizontal", "vertical", "overhanging", "parallel", etc., and can have an error / deviation of ±10% relative to the corresponding direction setting, more preferably an error / deviation within ±8%, more preferably an error / deviation within ±6%, more preferably an error / deviation within ±5%, and more preferably an error / deviation within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its role in the scheme of the present invention.

[0048] Example 1

[0049] like Figure 1 , Figure 2 , Figure 8 and Fig. 9 As shown, a radio frequency voltage and current detection module comprises a PCB board 1 and a conductor 3, wherein the PCB board 1 is provided with a planar coil L1 11, a metal layer 12 and a grounding layer 14; the grounding layer 14 is provided on the upper surface or the lower surface of the PCB board 1, that is, Figure 1 The planar coil L1 and the metal layer are located on the same layer of the PCB board and are adjacent to each other. Figure 1 and Figure 2 As shown, the planar coil L1 and the metal layer are located on the lower side of the PCB board and are arranged adjacent to each other;

[0050] The conductor 3 is located on one side of the PCB board 1, and an insulating medium is provided between the conductor 3 and the PCB board 1; a parasitic capacitor C1 is formed between the metal layer 12 and the conductor 3; the metal layer is connected in series with a capacitor C2, and is connected to the ground layer 14 through the capacitor C2. The ground layer 14 can refer to Figure 8 or Fig. 9 The metal layer collects the voltage signal of the conductor through the parasitic capacitor C1 and the capacitor C2 connected in series; the planar coil L1 11 induces the current signal of the conductor 3 through magnetic field coupling.

[0051] The insulating medium is air or an insulating member made of insulating material, etc. The insulating medium forms a parasitic capacitor C1 between the metal layer 12 and the conductor 3. The conductor 3 is a copper tube or an aluminum tube.

[0052] As a preferred embodiment, the axis of the conductor 3 is at an angle of 0°-10° to the PCB board 1. When a parasitic capacitor C1 is formed between the metal layer 12 and the conductor 3, the space occupied can be reduced, making the volume smaller. Among them, when the axis of the conductor 3 is at an angle of 0° to the PCB board 1, it means that the axis of the conductor 3 is parallel to the PCB board 1. When the angle between the axis of the conductor 3 and the PCB board 1 exceeds 10°, the detection accuracy may be affected.

[0053] like Figure 1 In the embodiment, the base 2 is a non-magnetic component, such as a copper base or an aluminum base. A horizontal PCB board 1 is provided above the base 2. The PCB board 1 and the base 2 are connected by rivets 131. The rivets 131 can be rivets or screws, etc., so that the grounding layer of the PCB board 1 and the base 2 are electrically connected, and the grounding layer of the PCB board 1 is grounded with the help of the base 2. There is a gap formed by the rivet 131 between the PCB board 1 and the base 2, and a groove 21 facing the PCB board 1 is provided on the upper side of the base 2. The conductor 3 is passed through the groove 21, and the conductor 3 is located between the inner wall of the groove 21 and the PCB board 1. The conductor 3 is arranged parallel to the PCB board 1, and the two ends of the conductor 3 can be fixed to ensure that there is a gap between the PCB board 1 and the conductor 3 and between the inner wall of the groove 21 and the conductor 3, so that there is an insulating medium such as air between the PCB board 1 and the conductor 3 and between the inner wall of the groove 21 and the conductor 3 to cooperate with the conductor 3 and the metal layer 12 to form a parasitic capacitor C1. As shown Figure 1 and Figure 2 As shown, we can know that Figure 1 The lower side of the PCB board 1 is provided with a planar coil L1 11 and a metal layer 12. In this solution, a parasitic capacitor C1 is formed between the conductor 3 and the metal layer 12 by setting an insulating medium. Figure 2 As shown, the planar coil L1 11 and the metal layer 12 are adjacent and spaced apart on the same side of the PCB board 1, the projection of the conductor 3 on the PCB board 1 is located between the planar coil L1 11 and the metal layer 12, the metal layer 12 is connected in series with the capacitor C2 through the parasitic capacitor C1 formed between the conductor 3 and the metal layer 12, and the voltage signal of the conductor 3 is collected through the capacitor C2, the planar coil L1 11 senses the current signal of the conductor 3 through magnetic field coupling, the planar coil L1 11 and the metal layer 12 are both close to the conductor 3, and the current detection and voltage detection effects are better. Among them, the area enclosed between the PCB board 1 and the groove 21 should be less than or equal to the detection area range, so as to ensure that when the conductor 3 passes through the groove 21, the PCB board 1 can accurately detect the corresponding current and voltage, that is, the groove can be used to position and install the conductor, so that the conductor installation is faster and more accurate, which is conducive to ensuring the effect of current detection and voltage detection.

[0054] In addition to the above-described setting method in which the projection of the conductor 3 on the PCB board 1 is located between the planar coil L1 11 and the metal layer 12, it is also possible to make the projection of the conductor 3 on the PCB board 1 be on the same side of the planar coil L1 11 and the metal layer 12; for example, Figure 3 As shown, the projection of the conductor 3 on the PCB board 1 is located on the left side of the planar coil L1 11 and the metal layer 12; for example, Figure 4 As shown, the projection of the conductor 3 on the PCB board 1 is located on the right side of the planar coil L1 11 and the metal layer 12.

[0055] As another implementation manner, the planar coil L1 11 and the metal layer 12 are nested and arranged on the same layer of the PCB board. For example, the metal layer 12 is arranged inside the planar coil L1 11, and both the planar coil L1 and the metal layer are located within the area of the projection of the conductor on the PCB board. The planar coil L1 11 and the metal layer 12 are close to the conductor, and the effects of current detection and voltage detection are better. In addition, by adjusting the distance between the conductor and the PCB board, the detection of different currents can be achieved.

[0056] In addition, the planar coil L1 11 and the metal layer 12 can also be arranged on different sides of the PCB board, that is, the planar coil L1 and the metal layer are located on different layers of the PCB board and are stacked. For example, in Figure 1 the metal layer is located on the lower side of the PCB board and forms a parasitic capacitance C1 with the conductor 3; the planar coil L1 is arranged on the upper side of the PCB board. In this way, the setting of the current signal output by the planar coil L1 11 is more convenient, and there is no need to provide vias for the planar coil L1 11 on the PCB board. In some embodiments, the planar coil L1 is in a "return" shape, and both ends of the planar coil L1 are led out through vias on the PCB board; the metal layer is in a strip shape, and the metal layer is electrically connected to the capacitor C2 through vias or leads. For example, Figure 8 As shown, the overall outer contour of the "return" shape is a rectangle with arc chamfers at the four corners.

[0057] Figure 1 In, there is a gap formed by the riveting part 131 connection between the PCB board 1 and the base 2. For example, Figure 5 and Figure 6 As shown, there may also be no gap between the PCB board 1 and the base 2. For example, Figure 6 Compared with Figure 1 and Figure 5 it can be known from the difference comparison that in addition to using the Figure 1 and Figure 3 circular arc cross-sectional structure in the groove 21 groove wall, a rectangular cross-sectional structure can also be used.

[0058] For example, Figure 7 As shown, the radio frequency voltage and current detection module in this solution uses Figure 7In the circuit, one end of the conductor 3 is electrically connected to the input end IN 31, and the other end is electrically connected to the output end OUT 32; a parasitic capacitor C1 is formed between the conductor 3 and the metal layer 12, one end of the parasitic capacitor C1 is connected in series to one end of the capacitor C2, and the other end of the capacitor C2 is grounded through the grounding layer on the PCB board; two ends of the first output terminal J1 41 are connected in parallel to two ends of the capacitor C2, for detecting the voltage of the conductor 3; the planar coil L111 is located on the side of the conductor 3, one end of the planar coil L1 11 is grounded through the grounding layer on the PCB board, and two ends of the second output terminal J2 42 are electrically connected to two ends of the planar coil L1 11, for detecting the current of the conductor 3.

[0059] like Figure 8 and Fig. 9 As shown, the front and back sides of the PCB board 1 are shown respectively, the planar coil L1 11 and the metal layer 12 are arranged at intervals on the front side of the PCB board 1, the capacitor C2, the first output terminal J141 and the second output terminal J2 42 are arranged on the back side of the PCB board 1, and the front and back sides of the PCB board 1 are electrically connected through a perforation process; in voltage detection and current detection, the capacitor C2 is arranged in the first area 101 of the PCB board 1 for voltage detection, and the planar coil L1 is arranged in the second area 102 of the PCB board 1 for current detection, the first area 101 is located on the left side of the dotted line, and the second area 102 is located on the right side of the dotted line, the interference between the sampled voltage signal and the sampled current signal is small, the system has good independence, high detection accuracy and strong reliability.

[0060] In addition, the first output terminal J1 41 includes an inner conductor connected to the capacitor C2 and an outer conductor electrically connected to the control circuit, and is used to transmit the voltage signal of the conductor 3 to the control circuit; the second output terminal J2 42 includes an inner conductor connected to the planar coil L111 and an outer conductor connected to the control circuit, and is used to transmit the current signal of the conductor 3 to the control circuit. The first output terminal J1 41 and the second output terminal J2 42 both include an inner conductor and an outer conductor, which facilitates the transmission of the voltage signal and the current signal to the control circuit respectively.

[0061] In this solution, in addition to providing the groove 21 on the base 2 facing the PCB board 1 for arranging the conductor 3 parallel to the PCB board 1, it is also possible to adopt Fig.10 The scheme in FIG. 2 forms a groove 21 .

[0062] like Fig.10As shown, the PCB board 1 is arranged parallel to the upper side of the base 2, and the grounding layer of the PCB board 1 is electrically connected to the base 2, and the base is used to form a ground; a shell 211 is welded on the upper side of the PCB board 1. The shell 211 is welded to the PCB board 1 to form a groove 21, and the notch of the groove 21 faces the PCB board 1. The conductor 3 is arranged between the shell 211 and the PCB board 1. There is an insulating medium such as air between the conductor 3 and the shell 211 and between the conductor 3 and the PCB board 1. The metal layer 12 and the planar coil L1 11 are both located on the upper side of the PCB, so that a parasitic capacitor C1 is formed between the conductor 3 and the metal layer 12, and the metal layer collects the voltage signal of the conductor through the parasitic capacitor C1 formed and the capacitor C2 connected in series; the planar coil L1 11 senses the current signal of the conductor 3 through magnetic field coupling. Fig.10 In the embodiment, the housing 211 is used to form the groove 21, and the groove 21 can also be formed by Figure 2-Figure 4 The plane position relationship, the better way is Figure 2 In this way, the projection of the conductor 3 on the PCB board 1 is located between the planar coil L111 and the metal layer 12, and the planar coil L111 and the metal layer 12 are arranged in the housing 211 to prevent the housing 211 from causing detection interference to the planar coil L111 and the metal layer 12. Of course, Fig.10 The method of using the housing 211 to form the groove 21 can also be used to set the planar coil L111 and the metal layer 12 in a nested arrangement in the same layer or in a stacked arrangement in different layers.

[0063] The above-mentioned method of setting the groove 21 on the base 2, or welding the housing 211 to the PCB board 1 to form the groove 21, can provide conditions for the conductor 3 to be arranged parallel to the PCB board 1 and form a parasitic capacitor, and the conductor can be positioned and installed by using the groove, so that the installation is faster and more accurate, which is conducive to ensuring the effect of current detection and voltage detection, but there is no need to open a hole for the conductor 3 to pass through on the PCB board 1. The PCB board 1 only needs to process the planar coil L1, the metal layer 12, the grounding layer and the capacitor C2, etc. Compared with the prior art, the grounding layer is arranged on the upper surface or the lower surface of the PCB board; the metal layer is connected to the grounding layer through the capacitor C2, and it is not necessary to ground the metal layer through the outer conductor, so that it can be used for voltage detection of the radio frequency power supply of a single conductor; the planar coil L1, the metal layer and the capacitor C2 are all arranged on the same PCB board and grounded by using the grounding layer on the PCB board, so the PCB board processing and wiring are simpler, and it is more convenient for structural production and spatial arrangement. The planar coil L1 11 senses the current signal of the conductor 3 through magnetic field coupling, and the metal layer collects the voltage signal of the conductor through the parasitic capacitor C1 and the capacitor C2 connected in series; and in voltage detection and current detection, the parasitic capacitor C1 and the capacitor C2 are set in the first area 101 of the PCB board 1 for voltage detection, and the planar coil L1 11 is set in the second area 102 of the PCB board 1 for current detection, the sampled voltage signal and the sampled current signal are almost free of distortion, the interference between the sampled voltage signal and the sampled current signal is small, and they have good independence, the sampled current signal and the sampled voltage signal both have good linearity, the voltage and current detection accuracy is high, and the reliability is strong.

[0064] Example 2

[0065] This embodiment provides a radio frequency voltage and current detection box, including a shielding box and the radio frequency voltage and current detection module described in Example 1, the PCB board 1 and the conductor 3 are both fixed in the shielding box, the conductor 3 is insulated from the shielding box, and both ends of the conductor 3 are electrically connected to the outside of the shielding box.

[0066] like Fig.11 As shown, the shielding box includes a box body 5 at the bottom and a cover body that is detachably buckled and connected to the box body 5. The box body 5 and the cover body are buckled to form an internal accommodating space. For ease of viewing, the cover body is not shown. Fig.11As shown in . The base 2 is fixedly arranged at the bottom of the box body 5. The box body 5 is a hollow rectangular parallelepiped structure. The base 2 is arranged along the width direction of the box body 5. An arc-shaped groove 21 opening upward is arranged on the upper side of the base 2. The PCB board 1 is arranged on the upper side of the base 2. The PCB board 1 is a rectangular plate structure. The length of the PCB board 1 matches the internal width of the box body 5. There are 4 connecting holes 13 on the PCB board 1. The number of connecting holes 13 can be selected. The PCB board 1 is anchored on the upper side of the base 2 and covers the arc-shaped groove 21 through the connecting holes 13 by the rivet 131, so that the grounding layer of the PCB board 1 is electrically connected to the base 2 to form a ground. The conductor 3 is arranged along the length direction of the box body 5, and the axial direction of the conductor 3 is along the width direction of the PCB board 1. The conductor 3 is located between the PCB board 1 and the groove wall of the groove 21, and is parallel to the PCB board 1. The two ends of the axial line of the conductor 3 are spaced from the inner wall of the box body 5. The two ends of the conductor 3 are fixed by the input terminal IN 31 and the output terminal OUT 32, and the two ends of the conductor 3 are insulated and connected to both sides of the length direction of the box body 5, which can be electrically connected to the external circuit to power the conductor 3. The planar coil L1 11 and the metal layer 12 are located on the lower side of the PCB, the capacitor C2, the first output terminal J141 and the second output terminal J2 42 are located on the upper side of the PCB board 1, and the first output terminal J1 41 and the second output terminal J2 42 are connected to the inner and outer sides of the box body 5, which can be connected to the external circuit to output the current signal and voltage signal obtained by the detection conductor 3. In addition to the case where the planar coil L1 11 and the metal layer 12 are arranged on one side, the planar coil L1 11 and the metal layer 12 can also be arranged on different sides of the PCB board. As in Example 1, in addition to being parallel to the PCB board 1, the conductor 3 can also be actively arranged or there is an angle due to an error, such as an angle ≤10° is a preferred implementation.

[0067] Fig.11 The one used is Figure 1 The structural form can be adapted to change to Figure 5 , Figure 6 and Fig.10 The structural form can realize signal detection of current signals and voltage signals, and there is no need to open a hole in the PCB board 1 for the conductor 3 to pass through.

[0068] The RF voltage and current detection box provided in this embodiment has a shielding box which is a metal conductor. The shielding box is used to shield external interference, so that the PCB board 1 and the conductor 3 of the shielding box are less interfered during the process of detecting current and voltage, thereby improving the accuracy of the detection result.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A radio frequency voltage and current detection module, characterized in that: Include: A PCB board, wherein a planar coil L1, a metal layer and a grounding layer are arranged on the PCB board; the grounding layer is arranged on the upper surface or the lower surface of the PCB board; the metal layer is connected in series with a capacitor C2 and is connected to the grounding layer through the capacitor C2; one end of the planar coil L1 is connected to the grounding layer; the planar coil L1 and the metal layer are located on the same layer of the PCB board, adjacent to each other or nested, or located on different layers of the PCB board and stacked; A base connected to the PCB board, the grounding layer of the PCB board and the base are electrically connected, and the grounding layer of the PCB board is grounded by means of the base; A conductor, wherein the conductor is located at one side of the PCB board, and an insulating medium is provided between the conductor and the PCB board; a parasitic capacitor C1 is formed between the metal layer and the conductor; The planar coil L1 senses the current signal of the conductor through magnetic field coupling, and the metal layer collects the voltage signal of the conductor through the parasitic capacitor C1 and the capacitor C2 connected in series.

2. The RF voltage and current detection module according to claim 1, characterized in that: The planar coil L1 is in a "U" shape, and both ends of the planar coil L1 are led out through the via holes of the PCB board; the metal layer is in a strip shape, and the metal layer is electrically connected to the capacitor C2 through via holes or leads.

3. The RF voltage and current detection module according to claim 1, characterized in that: The planar coil L1 and the metal layer are located on the same layer of the PCB and are adjacent to each other. The planar coil L1 and the metal layer are respectively located on two sides of a projection of the conductor on the PCB.

4. The radio frequency voltage and current detection module according to claim 1, characterized in that: The planar coil L1 and the metal layer are nested in the same layer of the PCB board. The metal layer is located in the planar coil L1 , and both the planar coil L1 and the metal layer are located in the area of ​​the projection of the conductor on the PCB board.

5. The radio frequency voltage and current detection module according to claim 1, characterized in that: A groove is arranged outside one side surface of the PCB board; the notch of the groove faces the PCB board, and the conductor is at least partially located in the groove.

6. The radio frequency voltage and current detection module according to claim 5, characterized in that: The planar coil L1 and the metal layer are both located within the projection of the inner side wall of the groove on the PCB board.

7. The radio frequency voltage and current detection module according to claim 5, characterized in that: It also includes a housing, which is welded to the PCB board and forms the groove for accommodating the conductor. or, It also includes a base connected to the PCB board, the top surface of the base is provided with the groove, and the top surface of the base is electrically connected to the ground layer on the lower surface of the PCB board.

8. The radio frequency voltage and current detection module according to claim 1, characterized in that: The PCB board includes a first area and a second area, the first area is provided with the metal layer on one side and the capacitor C2 and the first output terminal J1 on the other side; the second area is provided with the planar coil L1 on one side and the second output terminal J2 on the other side.

9. The radio frequency voltage and current detection module according to claim 8, characterized in that: The first output terminal J1 includes an inner conductor connected to the capacitor C2 and an outer conductor electrically connected to the control circuit, and is used to transmit the voltage signal of the conductor to the control circuit; The second output terminal J2 includes an inner conductor connected to the planar coil L1 and an outer conductor connected to the control circuit, and is used to transmit the current signal of the conductor to the control circuit.

10. A radio frequency voltage and current detection box, characterized in that: It comprises a shielding box and the radio frequency voltage and current detection module described in any one of claims 1 to 9, wherein the PCB board and the conductor are both fixed in the shielding box, the conductor is insulated from the shielding box, and both ends of the conductor are electrically connected to the outside of the shielding box.

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