Plastic-encapsulated chip multilayer ceramic capacitor pressing equipment and its use method

CN119296969BActive Publication Date: 2025-03-07SIYANG GRANDE ELECTRONICS CO LTD
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Patent Information

Application Number
CN202411834770.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-03-07
Estimated Expiration
2044-12-13

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Abstract

The present invention relates to the technical field of capacitor production equipment, and specifically to a plastic-encapsulated multilayer ceramic capacitor pressing device and a method of using the same, comprising a supporting component, a transmission device fixedly installed at the bottom of the front end of the supporting component, a hydraulic device fixedly installed at the top of the supporting component, and the hydraulic device is located above the transmission device, and a pressing plate is fixedly installed below the hydraulic device, the transmission device comprises a connecting rope, a winding wheel, a first gear, a second gear, a driving motor, an alignment rod, a storage mold, a movable sleeve plate and a first alignment key, the movable sleeve plate is symmetrically fixedly installed at the bottom end of the storage mold, the first alignment key is symmetrically fixedly installed at the top ends of both sides of the storage mold, the alignment rod is symmetrically fixedly installed at the bottom ends of both sides of the storage mold, the storage mold is fixedly installed on the connecting rope, and the connecting rope is fixedly installed on the outer ring of the winding wheel. Through the arrangement of the transmission device and the supporting component, the purpose of quickly moving the ceramic embryo out and aligning it with the envelope is achieved.
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Citation Information

Patent Citations

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