Wafer edge searching and degumming mechanism

Abstract

The invention belongs to the technical field of semiconductor processing, and relates to a wafer edge searching and dispergation mechanism which comprises a dispergation unit and a wafer edge searching unit, the dispergation unit comprises a dispergation shell, a dispergation window is formed in the dispergation shell, and a UV lamp set is arranged in the dispergation shell; the wafer edge searching unit is arranged on the dispergation shell, the wafer edge searching unit comprises an edge searching bottom plate, and a wafer edge finder is arranged on the edge searching bottom plate; the edge searching device further comprises an anti-warping unit which is used for preventing the wafer from warping in the edge searching process. And the anti-warping unit is connected to the peptizing shell of the peptizing unit. After the structure is adopted, the beneficial effects are that wafer position calibration and wafer film dispergation can be carried out in a full-automatic manner, and the operation efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a wafer edge finding and debonding mechanism. Background Art

[0002] With the advancement of semiconductor technology, the requirements for product performance are getting higher and higher, and new packaging processes are constantly emerging. When the wafer comes out of the wafer manufacturing plant, the thickness is relatively thick. Due to the requirements for the package size, the wafer will be thinned during packaging to adapt to a smaller package size. In order to protect the circuit layer of the wafer when the wafer is thinned, a film will be attached to the circuit layer of the wafer to protect the wafer from scratches and contamination during thinning and grinding. After the wafer is thinned, this protective film needs to be removed, and the wafer must not be damaged during removal.

[0003] Before wafer film removal, the wafer film must be debonded to facilitate the subsequent film removal. In the prior art, the debonding of the wafer film is done by manually placing and recovering the wafer after filming, which may cause damage to the wafer in the process and has low operating efficiency. The wafer position needs to be manually calibrated, which reduces operating efficiency. Therefore, it is necessary to make improvements. Summary of the invention

[0004] In order to solve the above problems in the prior art, the present invention provides a wafer edge finding and debonding mechanism.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] As one aspect of the present invention, a wafer edge finding and debonding mechanism is provided, which comprises: a debonding unit and a wafer edge finding unit, wherein the debonding unit comprises a debonding shell, a debonding window is provided on the debonding shell, and a UV lamp group is provided in the debonding shell;

[0007] The wafer edge-finding unit is arranged on the disassembly shell, and the wafer edge-finding unit comprises an edge-finding bottom plate, and a wafer edge-finding device is arranged on the edge-finding bottom plate;

[0008] It also includes an anti-warping unit, which is used to prevent the wafer from warping during the edge-finding process; the anti-warping unit is connected to the debonding shell of the debonding unit.

[0009] Optionally, the anti-warping unit includes an anti-warping cylinder connected to the debonding shell, the movable end of the anti-warping cylinder is connected to an anti-warping connecting plate, and a plurality of anti-warping pressure blocks are arranged at intervals on the anti-warping connecting plate; while the wafer edge finder is calibrated, the anti-warping cylinder of the anti-warping unit drives the anti-warping pressure blocks to press down the upper surface of the wafer with the wafer film to prevent the wafer from warping during the calibration process.

[0010] Optionally, the anti-warping pressing block is made of rubber material.

[0011] Optionally, a working port is provided on the side of the degumming shell.

[0012] Optionally, a dissolving box door is provided on the working port.

[0013] Optionally, at least one heat dissipation hole is provided on a side of the debonding housing.

[0014] Optionally, a heat dissipation fan is provided on the heat dissipation hole.

[0015] Optionally, the edge-finding bottom plate is connected to the bottom of the disintegration housing through a support rod.

[0016] Optionally, the movable end of the anti-warping cylinder is arranged downward.

[0017] Optionally, a plurality of anti-warping pressure rods are arranged at intervals on the anti-warping connecting plate, and the bottom ends of the anti-warping pressure rods are connected to anti-warping pressure blocks.

[0018] The beneficial effects of the wafer edge finding and debonding mechanism of the present invention are specifically embodied in: 1. It can fully automatically perform wafer position calibration and wafer film debonding, thereby improving operation efficiency. 2. It has an anti-warping mechanism, which can effectively prevent wafer warping when calibrating the wafer position. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings in the specification, which constitute a part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0020] Figure 1 It is an exploded front view of the disintegration unit and the wafer edge finding unit of the present invention;

[0021] Figure 2 It is a rear view of the structure of the debonding unit and the wafer edge finding unit of the present invention. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] A wafer edge finding and disassembly mechanism according to an embodiment of the present application, such as Figure 1-Figure 2As shown, it includes: a degumming unit, the degumming unit includes a degumming shell 31, a degumming window 32 is opened on the degumming shell 31, for the manipulator of the wafer handling robot to enter, and a UV lamp group 33 is arranged in the degumming shell 31 for degumming the wafer film; a working port 35 is provided on the side of the degumming shell 31, and a degumming box door 34 is provided on the working port 35, and the degumming box door 34 is opened to put an instrument to measure the light intensity of the UV lamp group 33; at least one heat dissipation hole is opened on the side of the degumming shell 31, and a heat dissipation fan is provided on the heat dissipation hole for cooling and dissipating the UV lamp group 33; the manipulator of the wafer handling robot clamps the wafer with the wafer film and enters the degumming shell 31 from the degumming window 32, places the wafer with the wafer film under the UV lamp group 33, and degummes the wafer film through the UV lamp group 33.

[0024] In one embodiment, if Figure 1 As shown, it also includes a wafer edge-finding unit 8, which is arranged on the debonding shell 31. The wafer with the wafer film first passes through the wafer edge-finding unit 8 to calibrate the wafer notch position and rotate to a preset position, and then is sent to the debonding unit 3 for debonding.

[0025] Specifically, Figure 1-Figure 2 As shown, the wafer edge-finding unit 8 includes an edge-finding base plate 81, and the edge-finding base plate 81 is arranged below the disintegration shell 31. As an example, the edge-finding base plate 81 is connected to the below of the disintegration shell 31 through a support rod; a wafer edge-finder 82 is provided on the edge-finding base plate 81, and the structure and working principle of the wafer edge-finder 82 are both prior arts and are not described herein; the handling robot unit places the wafer with the wafer film on the edge-finding chuck 821 of the wafer edge-finder 82, and the wafer edge-finder 82 starts to locate the edge notch position of the wafer so as to determine the direction and position of the wafer.

[0026] Furthermore, if Figure 1-Figure 2 As shown, it also includes an anti-warping unit 9, which is used to prevent the wafer from warping during the edge finding process; the anti-warping unit 9 is connected to the degumming shell 31 of the degumming unit; the anti-warping unit 9 includes an anti-warping cylinder 91 connected to the degumming shell 31, and the movable end of the anti-warping cylinder 91 is arranged downward; the movable end of the anti-warping cylinder 91 is connected to an anti-warping connecting plate 92, and a plurality of anti-warping pressure rods 93 are arranged on the anti-warping connecting plate 92 at intervals, and the bottom end of the anti-warping pressure rod 93 is connected to an anti-warping pressure block 94, and the anti-warping pressure block 94 is made of rubber material; while the wafer edge finder 82 is calibrated, the anti-warping cylinder 91 of the anti-warping unit 9 drives the anti-warping pressure block 94 to press down the upper surface of the wafer with the wafer film to prevent the wafer from warping during the calibration process.

[0027] As described above, the beneficial effects of the present application are: it can fully automatically perform wafer position calibration and wafer film debonding, thereby improving operating efficiency; and it has an anti-warping mechanism that can effectively prevent wafer warping when the wafer position is calibrated.

[0028] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0029] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0030] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0031] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0032] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A wafer edge finding and disassembly mechanism, characterized in that: It includes: A disintegration unit and a wafer edge finding unit, wherein the disintegration unit comprises a disintegration housing, a disintegration window is provided on the disintegration housing, and a UV lamp group is provided in the disintegration housing; The wafer edge-finding unit is arranged on the disassembly shell, and the wafer edge-finding unit comprises an edge-finding bottom plate, and a wafer edge-finding device is arranged on the edge-finding bottom plate; It also includes an anti-warping unit, which is used to prevent the wafer from warping during the edge-finding process; the anti-warping unit is connected to the debonding shell of the debonding unit.

2. The wafer edge finding and disassembly mechanism according to claim 1, characterized in that: The anti-warping unit includes an anti-warping cylinder connected to the debonding shell, the movable end of the anti-warping cylinder is connected to an anti-warping connecting plate, and a plurality of anti-warping pressure blocks are arranged at intervals on the anti-warping connecting plate; while the wafer edge finder is calibrated, the anti-warping cylinder of the anti-warping unit drives the anti-warping pressure blocks to press down the upper surface of the wafer with the wafer film to prevent the wafer from warping during the calibration process.

3. The wafer edge finding and disassembly mechanism according to claim 2, characterized in that: The anti-warping pressing block is made of rubber material.

4. The wafer edge finding and disassembly mechanism according to claim 1, characterized in that: A working opening is arranged on the side of the degumming shell.

5. The wafer edge finding and disassembly mechanism as claimed in claim 4, characterized in that: The working port is provided with a dissolving box door.

6. The wafer edge finding and disassembly mechanism according to claim 1, characterized in that: At least one heat dissipation hole is formed on the side of the debonding housing.

7. The wafer edge finding and disassembly mechanism according to claim 6, characterized in that: A heat dissipation fan is arranged on the heat dissipation hole.

8. The wafer edge finding and disassembly mechanism according to claim 1, characterized in that: The edge-finding bottom plate is connected to the lower side of the disintegration shell through a supporting rod.

9. The wafer edge finding and disassembly mechanism according to claim 2, characterized in that: The movable end of the anti-warping cylinder is arranged downward.

10. The wafer edge finding and disassembly mechanism according to claim 2, characterized in that: A plurality of anti-warping pressure rods are arranged at intervals on the anti-warping connection plate, and the bottom ends of the anti-warping pressure rods are connected to anti-warping pressure blocks.

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