Self-cooling laser module

Abstract

The invention relates to a self-cooling laser module which comprises a packaging cavity, a heat dissipation assembly, a laser generation assembly, a heat transfer assembly, a porous heat conduction assembly and a thermal phase change working medium. Wherein the interior of the packaging cavity is configured to be a sealed cavity; the heat dissipation assembly comprises heat dissipation fins; the laser generation assembly comprises a pump source module and a laser gain medium; the heat transfer assembly comprises a first heat sink and a second heat sink, the first heat sink is in heat conduction connection with the pump source module, and the second heat sink is in heat conduction connection with the laser gain medium; the porous heat conduction assembly comprises a first porous heat conduction layer and a second porous heat conduction layer, the first porous heat conduction layer wraps the surfaces of the first heat sink and the second heat sink, the second porous heat conduction layer wraps the inner surface of the sealing cavity, and a cavity between the first porous heat conduction layer and the second porous heat conduction layer is configured to be a phase change vaporization channel; and the thermal phase change working medium circulates in the porous heat conduction assembly and the phase change vaporization channel to perform vaporization and liquefaction processes.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation and cooling of laser modules, and in particular to a self-cooling laser module. Background Art

[0002] With the continuous development of laser technology, lasers have been widely used in many fields, including industrial processing, medical treatment, scientific research, and communications. These applications place higher demands on the size, energy consumption, and long-term stability of lasers. Traditional cooling and heat dissipation methods are not suitable in some specific scenarios.

[0003] Among existing lasers, solid-state lasers have always been the mainstream application direction. Solid-state lasers are composed of three parts: a pump source, a working substance, and a resonant cavity. The pump source is responsible for providing energy, the working substance is responsible for converting the energy of the pump source into laser light, and the resonant cavity is responsible for providing boundary conditions to ensure the directionality and monochromaticity of the laser light. There are many common pump sources for solid-state lasers, such as xenon lamps, krypton lamps, LDs, and LEDs. However, the energy emitted by the pump source cannot be fully absorbed by the working substance and converted into laser light. Most of it will exist in the form of heat, which is harmful to the laser and requires a separate device to remove the heat.

[0004] Common heat dissipation methods for solid-state lasers include water cooling, air cooling, semiconductor cooling and conduction cooling. Water cooling and semiconductor cooling have high cooling efficiency, but have disadvantages such as large size, complex structure and require additional energy. Air cooling and conduction cooling methods are small in size and require little additional energy, but have the disadvantage of low cooling efficiency. They are not suitable for long-term stable working environments and are only suitable for application scenarios where lasers are emitted for a short period of time. Summary of the Invention

[0005] The present invention discloses a self-cooling laser module, which aims to solve the technical problems existing in the prior art. The present invention adopts the following technical solutions: In one embodiment of the present invention, a self-cooling laser module is provided, comprising a packaging cavity, a heat dissipation component, a laser generating component, a heat transfer component, a porous heat conducting component, and a thermal phase change working medium; The interior of the packaging cavity is configured as a sealed chamber; The heat dissipation component is arranged on at least a portion of the outer surface of the packaging cavity, and the heat dissipation component includes a plurality of heat dissipation fins arranged at intervals; The laser generating assembly is arranged in a sealed chamber and includes a pump source module and a laser gain medium; The heat transfer component includes a first heat sink and a second heat sink, the first heat sink is thermally connected to the pump source module, and the second heat sink is thermally connected to the laser gain medium; The porous heat-conducting component includes a first porous heat-conducting layer and a second porous heat-conducting layer, wherein the first porous heat-conducting layer is coated on the surfaces of the first heat sink and the second heat sink, and the second porous heat-conducting layer is coated on the inner surface of the sealed chamber, and the cavity between the first porous heat-conducting layer and the second porous heat-conducting layer is configured as a phase change vaporization channel; The liquid form of the thermal phase change medium is contained in the pores of the porous heat-conducting component, and the gaseous form is filled in the phase change vaporization channel. The thermal phase change medium circulates in the porous heat-conducting component and the phase change vaporization channel to perform vaporization and liquefaction processes.

[0006] As a preferred technical solution, the packaging cavity includes a first half cavity and a second half cavity, and the first half cavity and the second half cavity both include high thermal conductivity materials; At least the first half cavity is used to accommodate the laser generating component, and at least the upper surface of the second half cavity is provided with a heat dissipation component. The first half cavity and the second half cavity are vacuum sealed.

[0007] As a preferred technical solution, the heat dissipation fins are arranged vertically in an array on the upper surface of the second half cavity, the heat dissipation fins and the second half cavity are integrally formed, and the heat dissipation fins include a high thermal conductivity material.

[0008] As a preferred technical solution, the first heat sink and the second heat sink are both configured with an internal heat conduction section and an external heat dissipation section; The internal heat conduction section is arranged inside the packaging cavity and is closely thermally coupled with the laser generating component; The external heat dissipation section extends outward from both ends of the packaging cavity and is sealed with both ends of the first half cavity and the second half cavity respectively, so as to enhance heat exchange with the outside world.

[0009] As a preferred technical solution, at least a portion of the bottom surface of the first heat sink is tightly thermally coupled with at least a portion of the top surface of the second heat sink; The first heat sink includes a module mating surface and a first heat conducting surface; the module mating surface is configured as a plurality of grooves at the bottom of the first heat sink, for close thermal contact with the pump source module; the first heat conducting surface is configured as the top and side surfaces of the first heat sink, and is closely fitted with the first porous heat conducting layer; The second heat sink includes a dielectric channel and a second heat conduction surface; the dielectric channel is configured as a channel running through the middle of the second heat sink for the laser gain medium to pass through and be in close thermal contact with it; the second heat conduction surface is configured as the bottom and side surfaces of the second heat sink, tightly fitting with the first porous heat conductive layer.

[0010] As a preferred technical solution, the first heat conducting surface and the second heat conducting surface together form a continuous composite curved surface, and the first porous heat conducting layer has a shape that exactly matches the composite curved surface.

[0011] As a preferred technical solution, the second porous thermally conductive layer has the same or different thickness as the first porous thermally conductive layer, the cross-section of the second porous thermally conductive layer is configured to be a proportional enlargement of the cross-section of the first porous thermally conductive layer or other geometric shape, and the cross-section of the phase change vaporization channel can be configured to have a uniform width or different widths.

[0012] As a preferred technical solution, the phase change vaporization channel completely covers the first porous heat-conducting layer in the axial and circumferential directions to form an annular loop.

[0013] As a preferred technical solution, the first porous heat-conducting layer and the second porous heat-conducting layer are both entirely covered with pores, and the pore shapes of both are irregular polygons that are interconnected; The average pore sizes of the first porous thermally conductive layer and the second porous thermally conductive layer can be configured to be the same or different; The porosity of the first and second porous thermally conductive layers may be configured to be the same or different.

[0014] As a preferred technical solution, the porous heat-conducting component includes a porous heat-conducting metal material; Thermal phase change refrigerants include methanol, ethanol or halogenated hydrocarbon refrigerants.

[0015] One embodiment of the above invention has the following advantages or beneficial effects: The present invention mainly provides a self-cooling laser module, which includes a packaging cavity, a heat dissipation component, a laser generation component, a heat transfer component, a porous thermal conductive component and a thermal phase change medium. The heat transfer component is in direct contact with the heat source (i.e., the laser generation component) to ensure rapid heat conduction; the porous thermal conductive component and the heat transfer component have a large heat exchange surface, which enhances the heat transfer efficiency while also being able to store liquid thermal phase change medium; a phase change vaporization channel is provided in the porous thermal conductive component, and the vaporization and liquefaction cycle process of the thermal phase change medium is utilized to achieve efficient heat transfer. At the same time, heat dissipation fins are provided on the outside of the packaging cavity to enhance heat exchange with the environment.

[0016] Unlike traditional active cooling methods, the embodiments of the present invention achieve continuous heat transfer without external energy input. By utilizing the circulation of a thermal phase change working fluid within a closed system, combined with a porous thermal conductive component, a highly efficient self-driven cooling system is created. Driven by the heat generated by the laser component, the thermal phase change working fluid spontaneously circulates between the porous thermal conductive layer and the phase change vaporization channel, effectively transferring heat from the heat source to the heat dissipation area through the process of vaporization heat absorption and liquefaction heat release. This self-cooling mechanism improves the system's energy efficiency, reduces dependence on external cooling equipment, reduces mechanical components, and improves the system's reliability and lifespan. It also makes the entire laser module more compact, making it particularly suitable for space-constrained applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments, which constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings: Figure 1 This is a structural diagram of a self-cooling laser module in a preferred embodiment disclosed in an embodiment of the present invention; Figure 2 This is a structural exploded view of a self-cooling laser module in a preferred embodiment disclosed in an embodiment of the present invention; Figure 3 This is a front view of a self-cooling laser module in a preferred embodiment disclosed in an embodiment of the present invention; Figure 4 for Figure 3 AA-direction three-dimensional cross-section diagram; Figure 5 A side view of a self-cooling laser module according to a preferred embodiment of the present invention; Figure 6 for Figure 5 BB-direction three-dimensional cross-sectional view.

[0018] Description of reference numerals: Packaging cavity 10, first half cavity 11, second half cavity 12, heat dissipation assembly 20, pump source module 30, laser gain medium 40, first heat sink 50, first internal heat conduction section 51, first heat conduction surface 52, first external heat dissipation section 53, second heat sink 60, second internal heat conduction section 61, second heat conduction surface 62, second external heat dissipation section 63, first porous heat conductive layer 70, second porous heat conductive layer 80, phase change vaporization channel 90. DETAILED DESCRIPTION

[0019] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. In the description of the present invention, it should be noted that the term "or" is generally used in the sense of including "and / or" unless the content clearly indicates otherwise.

[0020] In the description of the present invention, the terms "first", "second", etc. are only used to distinguish the descriptions and should not be understood as indicating or implying relative importance.

[0021] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Existing laser module cooling technology typically relies on external active cooling systems, but existing technologies often fail to balance cooling efficiency and lightweight application requirements. To address the various drawbacks of existing technologies, an embodiment of the present invention provides a self-cooling laser module that efficiently dissipates heat while reducing dependence on external cooling equipment and achieving a miniaturized and compact structure.

[0023] like Figure 1 — Figure 6 Preferably, the self-cooling laser module includes a packaging cavity 10, a heat dissipation component 20, a laser generating component, a heat transfer component, a porous thermal conductive component and a thermal phase change medium. The interior of the packaging cavity 10 is configured as a sealed chamber. Except for the heat dissipation component 20, other components are arranged inside the sealed chamber, from the inside to the outside, they are the laser generating component, the heat transfer component and the porous thermal conductive component. A phase change vaporization channel 90 is provided in the porous thermal conductive component, and the thermal phase change medium circulates in the porous thermal conductive component and the phase change vaporization channel 90 to perform a vaporization and liquefaction process; the heat dissipation component 20 is arranged on at least part of the outer surface of the packaging cavity 10, and is used for the self-cooling laser module to directly exchange heat with the external environment.

[0024] In a preferred embodiment, the laser generating component is arranged in a sealed chamber, including a pump source module 30 and a laser gain medium 40, wherein the pump source module 30 is used to convert electrical energy into light energy, and the laser gain medium 40 is used to absorb the light emitted by the pump source and convert part of the energy into laser.

[0025] In a preferred embodiment, the pump source module 30 includes one or more semiconductor laser diodes (LDs) or LD arrays for directly converting electrical energy into light energy. In this embodiment, the specific number, specifications and output parameters of the pump source module 30 are no longer specifically limited, and those skilled in the art can freely adjust them as needed.

[0026] In a preferred embodiment, the laser gain medium 40 is configured as a slender columnar structure, which can be a solid rod, an optical fiber or a flat plate. After absorbing the pump light, the active ions inside the laser gain medium 40 are excited to a high energy level. When these ions fall back to a low energy level, they release photons with a specific wavelength to form a laser. The wavelength of the generated laser depends on the selected gain medium material. In this embodiment, the specific material and size of the laser gain medium 40 are not specifically limited.

[0027] On the one hand, the electro-optical conversion efficiency of the pump source module 30 is between 40% and 60%, so 40%-60% of the input electrical energy will be converted into heat. The performance and life of the pump source module 30 are very sensitive to temperature. Excessively high temperature will cause output power to drop, wavelength drift, and even permanent damage. On the other hand, since the conversion efficiency of the laser gain medium 40 is not 100%, part of the absorbed pump light energy is converted into laser light, while the rest is converted into heat. The increase in temperature will cause a thermal lens effect inside the laser gain medium 40, affecting the quality and stability of the laser beam. In addition, the increase in temperature will cause the laser gain to decrease, affecting the output power and efficiency.

[0028] From the above, it can be seen that in order to ensure that the entire laser module can operate at a stable temperature to ensure output consistency and reliability and high efficiency, the laser generating components need to be effectively cooled.

[0029] In a preferred embodiment, the heat transfer component is used to increase the surface area of ​​heat transfer, thereby accelerating the conduction of heat and the dissipation of heat to the surrounding environment, and preventing the laser generating component from overheating; the heat transfer component includes a first heat sink 50 and a second heat sink 60, wherein the first heat sink 50 is thermally connected to the pump source module 30 and serves as its supporting structure, and the second heat sink 60 is thermally connected to the laser gain medium 40 and serves as its supporting structure.

[0030] In a preferred embodiment, the first heat sink 50 and the second heat sink 60 may be made of the same or different materials. Optional materials include aluminum and its alloys, copper and its alloys, or other composite materials, which are not specifically limited in this embodiment.

[0031] like Figure 2 — Figure 4 In a preferred embodiment, the first heat sink 50 and the second heat sink 60 are both configured with an internal heat conduction section and an external heat dissipation section. The internal heat conduction section is arranged inside the packaging cavity 10, and can absorb the heat generated by the laser generating component and transfer heat to the porous heat conduction component. The external heat dissipation section extends outward from both ends of the packaging cavity 10 and can directly exchange heat with the outside world to enhance the heat dissipation effect.

[0032] In a preferred embodiment, the internal heat conduction section of the first heat sink 50 is defined as a first internal heat conduction section 51. The first internal heat conduction section 51 is tightly thermally coupled with the pump source module 30. Specifically, the first internal heat conduction section 51 includes a module mating surface and a first heat conduction surface 52. The module mating surface is configured as a partial plane or groove at the bottom of the first heat sink 50, which is used to thermally fit tightly with the pump source module 30 to increase the thermal contact area between the two; the first heat conduction surface 52 is configured as the top surface and side surface of the first heat sink 50, which is used to fit tightly with the porous heat conductive component.

[0033] Preferably, the module mating surface can directly abut against the pump source module 30 , or a high thermal conductivity silicone grease or a thermal conductive gasket can be used to fill the small gap between the pump source module 30 and the first heat sink 50 .

[0034] In a preferred embodiment, the internal heat conduction section of the second heat sink 60 is defined as a second internal heat conduction section 61. The second internal heat conduction section 61 is tightly thermally coupled to the laser gain medium 40. Specifically, the second internal heat conduction section 61 includes a dielectric channel and a second heat conduction surface 62. The dielectric channel is configured as a channel axially penetrating the second heat sink 60 for the laser gain medium 40 to pass through and tightly fit therewith to increase the thermal contact area between the two. The second heat conduction surface 62 is configured as the bottom and side surfaces of the second heat sink 60 and is also used to tightly fit with the porous heat conduction component.

[0035] Preferably, the medium channel is a cylindrical channel that matches the shape and size of the laser gain medium 40; the laser gain medium 40 can be directly abutted against the medium channel, or liquid metal or high thermal conductivity epoxy resin can be used to fill the gap between the laser gain medium 40 and the medium channel.

[0036] In a preferred embodiment, the two ends of the laser gain medium 40 extend outward from the two ends of the medium channel for coupling with other optical elements. In this embodiment, the specific optical elements coupled thereto are no longer limited, but preferably, at least the two ends of the medium channel are sealed and connected to the laser gain medium 40 to ensure the sealing of the entire packaging cavity 10.

[0037] In a preferred embodiment, at least a portion of the bottom surface of the first heat sink 50 is tightly thermally coupled to at least a portion of the top surface of the second heat sink 60. Through the thermal coupling between the two, heat redistribution between the two heat sources (i.e., the pump source module 30 and the laser gain medium 40) is achieved. If the heat load of one component is temporarily high, the excess heat can be partially transferred to the other heat sink to balance the overall heat load, making the temperature distribution of the entire system more uniform, helping to reduce the formation of local hot spots and improving the overall heat dissipation efficiency.

[0038] In a preferred embodiment, the external heat dissipation section is the two axial end faces of the first heat sink 50 and the second heat sink 60, and the axial ends of the packaging cavity 10 have a receiving area for the external heat dissipation section to be exposed outward. The external heat dissipation section is sealed with the receiving area at both ends of the packaging cavity 10. The external heat dissipation section of the first heat sink 50 is defined as a first external heat dissipation section 53, and the external heat dissipation section of the second heat sink 60 is defined as a second external heat dissipation section 63. The first external heat dissipation section 53 and the second external heat dissipation section 63 are coplanar, and the two are coplanar with the two ends of the packaging cavity 10, which improves the heat dissipation efficiency while reducing the additional space requirement, which is conducive to the miniaturization of the entire laser module. In addition, the sealing cooperation between the external heat dissipation section and the packaging cavity 10 ensures the sealed isolation of the internal environment, which is conducive to maintaining the vacuum of the sealed chamber.

[0039] In a preferred embodiment, the porous thermal conductive component includes a first porous thermal conductive layer 70 and a second porous thermal conductive layer 80, the first porous thermal conductive layer 70 is coated on the surface of the first heat sink 50 and the second heat sink 60, the second porous thermal conductive layer 80 is coated on the inner surface of the sealed chamber, and the cavity between the first porous thermal conductive layer 70 and the second porous thermal conductive layer 80 is configured as a phase change vaporization channel 90; the liquid form of the thermal phase change medium is accommodated in the pores of the porous thermal conductive component, and the gaseous form of the thermal phase change medium is filled in the phase change vaporization channel 90, and the thermal phase change medium circulates in the porous thermal conductive component and the phase change vaporization channel 90 to perform vaporization and liquefaction processes.

[0040] In a preferred embodiment, the first porous heat-conducting layer 70 is closely fitted to the first heat-conducting surface 52 and the second heat-conducting surface 62. More preferably, the first heat-conducting surface 52 and the second heat-conducting surface 62 together form a continuous composite curved surface to eliminate discontinuities in the heat transfer path, thereby facilitating a more even distribution of heat and improving overall heat transfer efficiency. The first porous heat-conducting layer 70 has a shape that precisely matches the composite curved surface to ensure maximum contact area between the two, thereby improving heat transfer efficiency.

[0041] like Figure 6 In a preferred embodiment, the cross-section of the second porous thermally conductive layer 80 is configured to be a magnified proportion of the cross-section of the first porous thermally conductive layer 70. Accordingly, the cross-section of the sealed chamber is also a magnified proportion of the cross-section of the first porous thermally conductive layer 70. This ensures that the second porous thermally conductive layer 80 can closely adhere to the inner surface of the sealed chamber, ensuring a maximum heat transfer area and improving the overall heat conduction efficiency. At this time, the phase change vaporization channel 90 completely covers the first porous thermally conductive layer 70 in the axial and circumferential directions, forming an annular loop.

[0042] In a preferred embodiment, the cross-section of the phase change vaporization channel 90 has a uniform width. After the phase change vaporization channel 90 is configured as a ring loop with uniform width, it helps to optimize the flow characteristics of the thermal phase change working medium, so that the gaseous thermal phase change working medium can be evenly distributed and flowed, thereby improving the efficiency of the thermal phase change cycle and ensuring uniform distribution of heat in the entire porous heat conductive component.

[0043] In another preferred embodiment, the cross-section of the phase change vaporization channel 90 may not have a uniform width to adapt to the specific shape of the sealed chamber or the first heat sink 50 and the second heat sink 60. In this case, the cross-section of the second porous heat conductive layer 80 is no longer a proportional enlargement of the cross-section of the first porous heat conductive layer 70, but other geometric shapes.

[0044] Preferably, the second porous thermally conductive layer 80 has the same or different thickness as the first porous thermally conductive layer 70. In this embodiment, the thickness relationship and specific thickness of the two are not specifically limited. Those skilled in the art can adjust the thickness of the corresponding area or the corresponding porous thermally conductive layer according to the heat load requirements of different parts.

[0045] In a preferred embodiment, both the first porous thermally conductive layer 70 and the second porous thermally conductive layer 80 are entirely permeated with pores. The pores in both layers are interconnected irregular polygonal shapes. This enhances capillary action, facilitates the storage of a larger amount of liquid thermal phase change medium, and enables its autonomous flow within the porous structure, improving heat transfer efficiency. Furthermore, the irregular polygonal pores significantly increase the internal surface area, which facilitates heat exchange and phase change processes.

[0046] Preferably, the average pore size of the first porous thermally conductive layer 70 and the second porous thermally conductive layer 80 can be configured to be the same or different, and the porosity of the first porous thermally conductive layer 70 and the second porous thermally conductive layer 80 can be configured to be the same or different. Specifically, the pore structure can be optimized according to different phase change processes (such as evaporation and condensation).

[0047] On the one hand, different porosities allow adjustment of the storage capacity of the thermal phase change medium; since the first porous thermal conductive layer 70 is mainly used for evaporation and storage of liquid thermal phase change medium, it can be configured with a higher porosity, while the second porous thermal conductive layer 80 is mainly used for condensation of gaseous thermal phase change medium, it can be configured with a lower porosity.

[0048] On the other hand, different pore sizes can generate different capillary forces, affecting the flow of the thermal phase change medium. Since the first porous heat-conducting layer 70 is close to the heat source, the first porous heat-conducting layer 70 can be configured with a larger average pore size, which is not only beneficial to reducing the resistance to liquid flow and facilitating the circulation of the medium, but also can improve the evaporation efficiency of the thermal phase change medium. Alternatively, the second porous heat-conducting layer 80 can be configured with a larger average pore size to provide more space for rapid flow of steam and enhance cooling efficiency.

[0049] In a preferred embodiment, the filling amount of the liquid thermal phase change medium is within 70% of the porous space inside the first porous heat conductive layer 70 , which is not specifically limited in this embodiment.

[0050] In a preferred embodiment, the porous heat-conducting component can be selected from materials such as porous copper, porous aluminum, porous nickel, porous titanium, porous stainless steel, etc., preferably foam copper, which has higher thermal conductivity and good processing performance; the thermal phase change working fluid can be selected from one of water, methanol, ethanol or halogenated hydrocarbon refrigerant (Freon), which is not specifically limited in this embodiment. Those skilled in the art can select one or another suitable working fluid according to the thermal phase change working fluid.

[0051] In a preferred embodiment, the packaging cavity 10 is composed of a first half cavity 11 and a second half cavity 12, both of which are made of high thermal conductivity materials, such as copper. The first half cavity 11 is arranged at the bottom and the second half cavity 12 is arranged at the top, and is vacuum sealed. At this time, the entire sealed chamber is a vacuum environment, and the boiling point of the thermal phase change medium will be reduced, which allows the thermal phase change medium to start working at a lower temperature, thereby improving the thermal management efficiency and thermal response speed.

[0052] In a preferred embodiment, the first half cavity 11 has a larger volume, and at least the first half cavity 11 is used to accommodate the laser generating component. The heat dissipation component 20 is at least arranged on the upper surface of the second half cavity 12, so that heat is transferred from the heat source below to the heat dissipation component 20 above, conforming to the natural flow direction of the hot air flow. Moreover, due to the rising tendency of hot air, the speed of the air flow will naturally increase when passing through the heat dissipation component 20. A faster air flow speed means a higher convective heat transfer coefficient, thereby improving the heat dissipation efficiency.

[0053] In a preferred embodiment, the heat dissipation assembly 20 includes a plurality of heat dissipation fins arranged at intervals, and the heat dissipation fins are arranged in an array vertically on the upper surface of the second half cavity 12 to increase the heat dissipation surface area and improve the heat dissipation efficiency; more preferably, the heat dissipation fins are integrally formed with the second half cavity 12 to reduce the thermal resistance caused by the material interface, and the heat dissipation fins are made of a material with a high thermal conductivity coefficient, and the same material as the second half cavity 12, such as copper, can be selected.

[0054] In the above embodiment, the working principle of the self-cooling laser module is as follows: During the operation of the pump source module 30 and the laser gain medium 40, most of the energy will exist in the form of heat. This part of the heat can be transferred to the first heat sink 50 and the second heat sink 60. The first heat sink 50 and the second heat sink 60 are wrapped by a porous heat-conducting component containing a thermal phase change medium. The porous heat-conducting component is in a vacuum space and serves as a vaporization phase change environment and evaporation area for the thermal phase change medium. The heat is quickly taken away by the evaporation of the thermal phase change medium. The evaporated thermal phase change medium condenses on the second porous heat-conducting layer 80, and conducts the heat to the packaging cavity 10 and the heat dissipation component 20, and then the heat dissipation component 20 conducts the heat to the ambient air. The porous heat-conducting component can form a circulation of the thermal phase change working fluid. The liquid thermal phase change working fluid returns to the inner side of the first porous heat-conducting layer 70 where it contacts the first heat sink 50 and the second heat sink 60 through the pores, forming a gaseous and liquid circulation. This process does not require external power and does not generate additional power consumption. In addition, the vaporization and liquefaction process of the thermal phase change working fluid is efficient and fast, which can achieve a rapid self-cooling effect for the laser module.

[0055] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely illustrative and are not intended to limit the scope of the present application. Various changes and modifications may be made therein by those skilled in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0056] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0057] Similarly, it should be understood that in order to streamline the present application and aid in understanding one or more of the various inventive aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, this approach of the present application should not be interpreted as reflecting the intention that the application claimed for protection requires more features than those explicitly recited in each claim. More precisely, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with fewer features than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0058] Those skilled in the art will understand that, except where mutually exclusive, all features disclosed in this specification (including the accompanying claims, abstract, and drawings), as well as all processes or units of any method or apparatus disclosed herein, may be combined in any combination. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that provides the same, equivalent, or similar purpose.

Claims

1. A self-cooling laser module, characterized in that: It includes a packaging cavity, a heat dissipation component, a laser generation component, a heat transfer component, a porous heat conduction component, and a thermal phase change working fluid; The interior of the packaging cavity is configured as a sealed chamber; The heat dissipation component is arranged on at least a portion of the outer surface of the packaging cavity, and the heat dissipation component includes a plurality of heat dissipation fins arranged at intervals; The laser generating assembly is disposed in the sealed chamber and includes a pump source module and a laser gain medium; The heat transfer component comprises a first heat sink and a second heat sink, wherein the first heat sink is thermally connected to the pump source module, and the second heat sink is thermally connected to the laser gain medium; The porous heat-conducting component comprises a first porous heat-conducting layer and a second porous heat-conducting layer, wherein the first porous heat-conducting layer is coated on the surfaces of the first heat sink and the second heat sink, and the second porous heat-conducting layer is coated on the inner surface of the sealed chamber, and the cavity between the first porous heat-conducting layer and the second porous heat-conducting layer is configured as a phase-change vaporization channel; The liquid form of the thermal phase change medium is contained in the pores of the porous heat-conducting component, and the gaseous form is filled in the phase change vaporization channel. The thermal phase change medium circulates in the porous heat-conducting component and the phase change vaporization channel to perform vaporization and liquefaction processes.

2. The self-cooling laser module according to claim 1, characterized in that: The packaging cavity comprises a first half cavity and a second half cavity, and the first half cavity and the second half cavity both comprise a high thermal conductivity material; At least the first half cavity is used to accommodate the laser generating component, at least the upper surface of the second half cavity is provided with the heat dissipation component, and the first half cavity and the second half cavity are vacuum-sealed.

3. The self-cooling laser module according to claim 2, characterized in that: The heat dissipation fins are arranged vertically on the upper surface of the second half cavity in an array shape, the heat dissipation fins are integrally formed with the second half cavity, and the heat dissipation fins include a material with a high thermal conductivity coefficient.

4. The self-cooling laser module according to claim 2, characterized in that: The first heat sink and the second heat sink are both configured with an internal heat conduction section and an external heat dissipation section; The internal heat-conducting section is disposed inside the packaging cavity and is tightly thermally coupled with the laser generating component; The external heat dissipation section extends outward from both ends of the packaging cavity and is respectively sealed with both ends of the first half cavity and the second half cavity to enhance heat exchange with the outside.

5. The self-cooling laser module according to claim 4, characterized in that: At least a portion of the bottom surface of the first heat sink is tightly thermally coupled to at least a portion of the top surface of the second heat sink; The first heat sink includes a module mating surface and a first heat conducting surface; the module mating surface is configured as a plurality of grooves at the bottom of the first heat sink, and is used for thermally closely contacting the pump source module; the first heat conducting surface is configured as the top surface and the side surface of the first heat sink, and is closely fitted with the first porous heat conducting layer; The second heat sink includes a medium channel and a second heat conduction surface; the medium channel is configured as a channel that runs through the middle of the second heat sink so that the laser gain medium can pass through and be in close thermal contact with it; the second heat conduction surface is configured as the bottom and side surfaces of the second heat sink, which are tightly matched with the first porous heat conductive layer.

6. The self-cooling laser module according to claim 5, characterized in that: The first heat conducting surface and the second heat conducting surface together form a continuous composite curved surface, and the first porous heat conducting layer has a shape that matches the composite curved surface.

7. The self-cooling laser module according to claim 6, characterized in that: The second porous thermally conductive layer has the same or different thickness as the first porous thermally conductive layer, the cross section of the second porous thermally conductive layer is configured to be a proportional enlargement of the cross section of the first porous thermally conductive layer or other geometric shape, and the cross section of the phase change vaporization channel can be configured to have a uniform width or different widths at different locations.

8. The self-cooling laser module according to claim 7, characterized in that: The phase-change vaporization channel completely covers the first porous heat-conducting layer in the axial direction and the circumferential direction to form an annular loop.

9. The self-cooling laser module according to claim 1, characterized in that: The first porous heat-conducting layer and the second porous heat-conducting layer are all covered with pores, and the shapes of the pores of the two are irregular polygons that are interconnected; The average pore sizes of the first porous thermally conductive layer and the second porous thermally conductive layer may be configured to be the same or different; The porosity of the first porous thermally conductive layer and the second porous thermally conductive layer may be configured to be the same or different.

10. The self-cooling laser module according to any one of claims 1 to 9, characterized in that: The porous heat-conducting component comprises a porous heat-conducting metal material; The thermal phase change working fluid includes methanol, ethanol or halogenated hydrocarbon refrigerant.

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