A Tin Plating Surface Treatment Device for PCB Boards

Abstract

The present invention relates to the technical field of PCB board processing, and specifically to a tin plating surface treatment device for a PCB board, including a tin plating machine. One side surface of the tin plating machine is fixedly connected with a control panel. One side surface of the tin plating machine is fixedly connected with a placement table. A telescopic frame is arranged on the surface of the tin plating machine. One end of the telescopic frame is fixedly connected with a mounting frame. A tin plating roller is arranged on the inner wall of the mounting frame. A cleaning device is arranged on one side surface of the tin plating machine. The cleaning device cleans substances such as tin liquid and soldering flux adhering to the surface of the tin plating roller after each tin plating process, and it is not easy for the tin liquid on the tin plating roller to solidify. When the tin plating machine of the present invention performs surface tin plating on the PCB board, it can timely and effectively clean substances such as tin liquid and soldering flux adhering to the tin plating roller, and it is not easy for them to solidify, which affects the subsequent tin plating process of the PCB board, improves the use effect and working efficiency of the tin plating machine, and reduces the possibility of poor coating quality of the PCB board.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and particularly relates to a tin plating surface treatment device for a PCB board. Background Art

[0002] A PCB board, whose Chinese name is printed circuit board and also known as printed wiring board, is an important electronic component, a support for electronic components, and a carrier for the electrical interconnection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board. In the process of manufacturing a PCB board, a tin layer needs to be formed on the surface of the PCB board, and at this time, corresponding tin plating processing equipment is required.

[0003] When traditional PCB boards are processed by tin plating, first, the PCB boards are installed on the placement table, then the tin solution and the soldering flux are poured onto the surface of the PCB boards, and then the control panel on one side of the tin plating machine is operated to start the tin plating machine. The telescopic frame on its surface starts to extend, and during this process, the mounting frame drives the tin plating roller to rotate. During the driving process of the telescopic frame, the tin plating roller comes into contact with and rolls on the surface of the PCB board, and the tin solution and the soldering flux are evenly smeared on its surface. However, it is found in the actual operation process that after the tin plating roller of the tin plating machine evenly smears the tin solution and the soldering flux on the PCB board each time, a certain amount of tin solution and soldering flux will adhere to its own surface. These tin solution and soldering flux will solidify on the surface of the tin plating roller after long-term adhesion, resulting in a change in the surface of the tin plating roller, affecting the next tin plating process of the PCB board, affecting the even smearing effect, leading to an increase in the defective rate of the tin plating of the PCB board, and also affecting the use effect and working efficiency of the tin plating machine. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem in the prior art that after the tin plating roller of the tin plating machine evenly smears the tin solution and the soldering flux on the PCB board each time, a certain amount of tin solution and soldering flux will adhere to its own surface. These tin solution and soldering flux will solidify on the surface of the tin plating roller after long-term adhesion, resulting in a change in the surface of the tin plating roller, affecting the next tin plating process of the PCB board, affecting the even smearing effect, leading to an increase in the defective rate of the tin plating of the PCB board, and also affecting the use effect and working efficiency of the tin plating machine. A tin plating surface treatment device for a PCB board is proposed.

[0005] To achieve the above object, the present invention adopts the following technical solutions: including a tin plating machine, a control panel is fixedly connected to one side surface of the tin plating machine, a placing table is fixedly connected to one side surface of the tin plating machine, a telescopic frame is arranged on the surface of the tin plating machine, one end of the telescopic frame is fixedly connected to a mounting frame, a tin plating roller is arranged on the inner wall of the mounting frame, a cleaning device is arranged on one side surface of the tin plating machine, and the cleaning device cleans substances such as tin liquid and soldering flux attached to the surface of the tin plating roller after each tin plating process, so that it is not easy for the tin liquid on the tin plating roller to solidify, affecting the subsequent surface tin plating treatment of the PCB board. A stabilizing device is arranged on the surface of the tin plating machine on one side of the placing table, and the stabilizing device limits and stabilizes the position of the PCB board on the placing table, so as to facilitate the tin plating machine to perform tin plating processing on it, and it is not easy for the PCB board to slide and shift.

[0006] The effects achieved by the above components are as follows: when using the tin plating machine to perform surface tin plating processing on the PCB board, first install the PCB board on the placing table, then start and use the stabilizing device to limit and fix the PCB board to keep the placement position of the PCB board stable. Then pour the tin liquid and soldering flux on the surface of the PCB board, and then operate the control panel on one side of the tin plating machine to start and run the tin plating machine, so that the telescopic frame on its surface starts to extend. During this process, the mounting frame will drive the tin plating roller to rotate. During the driving process of the telescopic frame, the tin plating roller contacts and rolls on the surface of the PCB board, and the tin liquid and soldering flux are evenly smeared on its surface. Then after the processing of the PCB board is completed, the tin plating roller returns to the initial position, and at the same time, the cleaning device is started to clean the tin liquid and soldering flux attached to the tin plating roller. At this time, when the tin plating machine performs surface tin plating processing on the PCB board, it can timely and effectively clean substances such as tin liquid and soldering flux adhered to the tin plating roller, and it is not easy for them to solidify, affecting the subsequent tin plating processing of the PCB board, improving the use effect and working efficiency of the tin plating machine, and reducing the possibility of poor smearing quality of the PCB board.

[0007] Preferably, the cleaning device includes a cleaning frame, assembly telescopic rods are respectively fixedly connected to the four corner positions of the cleaning frame, the input ends of the assembly telescopic rods are fixedly connected to the surface of the tin plating machine, a hydraulic rod is fixedly connected to the surface of the tin plating machine, the output end of the hydraulic rod is fixedly connected to the surface of the cleaning frame, rotating rods are respectively rotatably connected through the mutually adjacent sides of the inner wall of the tin plating machine, brush rollers are fixedly connected to the arc surfaces of the rotating rods, a first servo motor is fixedly connected to one side surface of the cleaning frame, a connecting belt is installed on the output end of the first servo motor and the arc surface of one end of the rotating rod, a hose is fixedly connected and communicated with the bottom surface of the cleaning frame, and a water pump is fixedly connected to one side surface of the tin plating machine, and the output end of the water pump is fixedly connected to the end of the hose far from the cleaning frame.

[0008] The effects achieved by the above components are as follows: When using a tin plating machine to perform surface tin plating on a PCB board, first install the PCB board on the placement table, then start using the stabilizing device to limit and fix the PCB board to keep its placement position stable. Then pour the tin solution and soldering flux on the surface of the PCB board. After that, operate the control panel on one side of the tin plating machine to start the tin plating machine. The telescopic frame on its surface starts to extend. During this process, the mounting frame drives the tin plating roller to rotate. During the driving process of the telescopic frame, the tin plating roller comes into contact with and rolls on the surface of the PCB board, evenly applying the tin solution and soldering flux on its surface. After the processing of the PCB board is completed, the tin plating roller returns to its initial position. At the same time, start the cleaning device to make the hydraulic rod on one side of the cleaning frame start to operate, so that the cleaning frame approaches the tin plating roller with the assistance of the assembled telescopic rod until the tin plating roller is immersed in the clean water inside the cleaning frame. At the same time, start the first servo motor on one side of the cleaning frame to make the rotating rod rotate under the connection drive of the connecting belt. At this time, the brush roller will rotate simultaneously with the tin plating roller and will come into contact and friction with each other, thereby removing the tin solution and soldering flux attached to the tin plating roller. After the cleaning is completed, move the cleaning frame to its initial position, start the water pump, drain the sewage in the cleaning frame through the hose, and then inject new water. When the tin plating machine performs surface tin plating on the PCB board, it can timely and effectively clean the substances such as tin solution and soldering flux adhering to the tin plating roller, and it is not easy for them to solidify, which affects the subsequent tin plating processing of the PCB board, improves the use effect and working efficiency of the tin plating machine, and reduces the possibility of poor coating quality of the PCB board.

[0009] Preferably, a protective cover is provided on the surface of the first servo motor, and the cross-section of the protective cover is in the shape of a "C".

[0010] The effects achieved by the above components are as follows: Through the setting of the protective cover, when the first servo motor is in normal use, it is not easy for the water stains of the cleaning frame to drip or splash onto the output end of the servo motor, resulting in substances such as tin solution and soldering flux in the sewage adhering to the output end of the first servo motor, causing erosion damage to it and affecting its normal use. On the other hand, it also ensures the normal use of the brush roller and extends the service life of the device and equipment.

[0011] Preferably, two mounting blocks are fixedly connected to one side surface of the cleaning frame. A mounting rod is rotatably connected through the sides of the two mounting blocks close to each other. A scraper is fixedly connected to the arc surface of the mounting rod. Torsion springs are respectively sleeved at both ends of the mounting rod where the scraper is located. The two ends of the torsion springs are fixedly connected to the mounting blocks and the scraper respectively. A positioning plate is fixedly connected to one side surface of the cleaning frame, and the positioning plate abuts against one side surface of the scraper.

[0012] The effects achieved by the above components are as follows: after the tin-plating roller cleans off the flux and tin liquid attached to the surface in the cleaning frame, the hydraulic rod is started to return the collecting frame to its initial position. During the descent of the cleaning frame, the scraper on the mounting rod will stably contact and squeeze the positioning plate at one end of the cleaning frame under the torsional force of the torsion spring. At the same time, one side surface of the scraper will just contact the arc surface of the tin-plating roller. At this time, the rotating tin-plating roller will rotate in contact and friction with the scraper, thereby scraping off the water stains attached to the tin-plating roller, thereby facilitating the subsequent tin-plating roller to tin the next PCB board.

[0013] Preferably, bearings are fixedly connected to the arc surfaces at both ends of the mounting rod, respectively, the inner ring of the bearing is fixedly connected to the mounting rod, and the outer ring of the mounting rod is fixedly connected to the inner wall of the mounting block.

[0014] The effect achieved by the above components is: through the setting of the bearing, the mounting rod is allowed to rotate with the inner wall of the mounting block, which can reduce the friction of rotation, thereby reducing the wear between the mounting rod and the mounting block, thereby ensuring the stable rotation of the mounting rod, so that the scraper can continuously and stably scrape off the water stains attached to the tinning roller.

[0015] Preferably, a protective pad is fixedly connected to a surface of one side of the scraper close to the positioning plate, and the protective pad is a rubber pad.

[0016] The effect achieved by the above components is: through the setting of the protective pad, when the tin-plating roller and the scraper come into scraping contact, the scraper will shake, so that the scraper and the positioning plate will frequently come into contact and collide. At this time, the rubber protective plate can reduce the impact force of the contact and collision, thereby ensuring the normal use of the scraper, not prone to abnormal damage, and better scraping off the water stains attached to the tin-plating roller.

[0017] Preferably, the stabilizing device comprises two mounting plates, and the two mounting plates are respectively fixedly connected to the surface of the tin-plating machine, and a screw is rotatably connected through one side of the two mounting plates close to each other, and threads in opposite directions are respectively provided on the arc surfaces at both ends of the screw, and connecting frames are respectively threadedly connected to the surface of the tin-plating machine on the arc surfaces at both ends of the screw, and the connecting frame is slidably connected to the surface of the tin-plating machine, and a fixing rod is fixedly connected to the surface of the tin-plating machine with a second servo motor, and a pulley is respectively fixedly connected to the output end of the second servo motor and the arc surface of the screw, and a transmission belt is arranged on the arc surface of the pulley.

[0018] The effects achieved by the above components are as follows: When the PCB board is placed on the placement table and after the tin plating solution and soldering flux are coated on its surface, the second servo motor on the tin plating machine is started. Since the screw is connected and combined with the second servo motor through the transmission belt, the operation of the second servo motor will drive the screw on the mounting plate to rotate, so that the distance between the connecting frames on the arc surfaces at both ends of the screw changes until the fixed rods fixedly connected to the two connecting frames come into contact with and clamp the PCB board on the placement table, ensuring the stable position of the PCB board. At this time, when using the tin plating machine to perform tin plating processing on the surface of the PCB board, it can better ensure the stable position of the PCB board on the placement table and is not likely to come into contact during the operation of leveling the tin plating solution and soldering flux on the PCB board by the tin plating roller, causing the PCB board to slide and shift, which affects the tin plating effect, thereby improving the use effect and working efficiency of the tin plating machine.

[0019] Preferably, a limiting plate is fixedly connected to the surface of the tin plating machine, and the limiting plate is clamped on the surface of the transmission belt.

[0020] The effects achieved by the above components are as follows: Through the setting of the limiting plate, the transmission belt assembled on the pulleys of the screw and the second servo motor can be more stable and is not likely to shake, resulting in the disassembly of the transmission belt, thereby ensuring the rotational stability of the screw, better limiting and fixing the PCB board on the placement table, improving the tin plating effect on the surface of the PCB board, and further increasing the utilization rate of the finished PCB board.

[0021] Preferably, a stabilizing groove is formed on the surface of the connecting frame, and a stabilizing plate is slidably connected to the inner wall of the stabilizing groove. The stabilizing plate is fixedly connected to the surface of the tin plating machine.

[0022] The effects achieved by the above components are as follows: Through the sliding setting of the stabilizing plate and the stabilizing groove, when the connecting frame slides under the drive of the screw, it can better maintain a stable state and is not likely to shake, so that when the two fixed rods are on both sides of the surface of the PCB board, they can stably contact better, thereby ensuring the stable position of the PCB board and improving the use effect and functionality of the stabilizing device.

[0023] Preferably, an electric telescopic rod is fixedly connected to the surface of the tin plating machine, and a clamping plate is fixedly connected to the output end of the electric telescopic rod. The clamping plate is clamped on the surface of the transmission belt.

[0024] The effects achieved by the above components are as follows: Through the settings of the clamping plate and the electric telescopic rod, when the second servo motor drives the screw to operate, by starting the electric telescopic rod, the clamping plate can be continuously and stably clamped and pressed on the surface of the conveyor belt, so that the conveyor belt can be ensured to be in a stable and tight state at all times, and it is not easy to loosen, enabling the second servo motor to better drive the two fixed rods to limit and fix the PCB board, ensuring the normal use of the stabilizing device.

[0025] In summary, the beneficial effects of the present invention are as follows:

[0026] In the present invention, when the tin plating machine (1) performs surface tin plating processing on the PCB board, it can timely and effectively clean substances such as tin liquid and soldering flux adhering to the tin plating roller (6), and it is not easy for them to solidify, affecting the subsequent tin plating processing of the PCB board, improving the use effect and working efficiency of the tin plating machine (1), and reducing the possibility of poor coating quality of the PCB board.

[0027] In the present invention, when using the tin plating machine (1) to perform tin plating processing on the surface of the PCB board, it can better ensure the stable position of the PCB board on the placement table (3), and it is not easy for the PCB board to slide and shift during the operation of evenly spreading the tin liquid and soldering flux on the PCB board by the tin plating roller (6), affecting the tin plating effect, thereby improving the use effect and working efficiency of the tin plating machine (1). BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0029] Figure 2 is a three-dimensional structural schematic diagram of the cleaning device of the present invention;

[0030] Figure 3 is of the present invention Figure 2 side three-dimensional structural schematic diagram;

[0031] Figure 4 is a three-dimensional structural schematic diagram at the position of the cleaning frame of the present invention;

[0032] Figure 5 is of the present invention Figure 4 partial three-dimensional structural schematic diagram;

[0033] Figure 6 is a three-dimensional structural schematic diagram at the position of the scraper of the present invention;

[0034] Figure 7 is a three-dimensional structural schematic diagram of the stabilizing device of the present invention;

[0035] Figure 8 is of the present invention Figure 7 side three-dimensional structural schematic diagram;

[0036] Figure 9 This is a schematic three-dimensional structure diagram at the position of the screw of the present invention.

[0037] Legend: 1. Tin plating machine; 2. Control panel; 3. Placing table; 4. Telescopic frame; 5. Mounting frame; 6. Tin plating roller; 7. Cleaning device; 71. Cleaning frame; 72. Assembled telescopic rod; 73. Hydraulic rod; 74. Rotating rod; 75. First servo motor; 76. Connecting belt; 77. Brush roller; 78. Hose; 79. Water pump; 710. Mounting rod; 711. Mounting block; 712. Scraper; 713. Positioning plate; 714. Torsion spring; 715. Protective pad; 716. Bearing; 717. Protective cover; 8. Stabilizing device; 81. Mounting plate; 82. Screw; 83. Second servo motor; 84. Pulley; 85. Transmission belt; 86. Connecting frame; 87. Fixed rod; 88. Stabilizing plate; 89. Stabilizing groove; 810. Limiting plate; 811. Electric telescopic rod; 812. Clamping plate. Detailed implementation mode

[0038] Refer to Figure 1 and Figure 2As shown in the figure, the present invention provides a technical solution: a tin plating surface treatment device for a PCB board, including a tin plating machine 1, a control panel 2 fixedly connected to one side surface of the tin plating machine 1, a placement table 3 fixedly connected to one side surface of the tin plating machine 1, a telescopic frame 4 arranged on the surface of the tin plating machine 1, a mounting frame 5 fixedly connected to one end of the telescopic frame 4, a tin plating roller 6 arranged on the inner wall of the mounting frame 5, a cleaning device 7 arranged on one side surface of the tin plating machine 1. The cleaning device 7 cleans substances such as tin liquid and soldering flux adhering to the surface of the tin plating roller 6 after each tin plating process, which is not easy to cause the tin liquid on the tin plating roller 6 to solidify and affect the subsequent surface tin plating treatment of the PCB board. A stabilizing device 8 is arranged on the surface of the tin plating machine 1 on one side of the placement table 3. The stabilizing device 8 limits and stabilizes the position of the PCB board on the placement table 3, so as to facilitate the tin plating machine 1 to perform tin plating processing on it, and it is not easy for the PCB board to slide and shift. When using the tin plating machine 1 to perform surface tin plating processing on the PCB board, first install the PCB board on the placement table 3, then start and use the stabilizing device 8 to limit and fix the PCB board to keep its placement position stable. Then pour the tin liquid and soldering flux on the surface of the PCB board. After that, operate the control panel 2 on one side of the tin plating machine 1 to start the tin plating machine 1 to run, so that the telescopic frame 4 on its surface starts to extend. During this process, the mounting frame 5 will drive the tin plating roller 6 to rotate. During the driving process of the telescopic frame 4, the tin plating roller 6 is in contact with and rolls on the surface of the PCB board, and the tin liquid and soldering flux are evenly smeared on its surface. Then after the processing of the PCB board is completed, the tin plating roller 6 returns to its initial position, and at the same time, the cleaning device 7 is started to clean the tin liquid and soldering flux adhering to the tin plating roller 6. At this time, when the tin plating machine 1 performs surface tin plating processing on the PCB board, it can timely and effectively clean substances such as tin liquid and soldering flux adhering to the tin plating roller 6, which is not easy to cause them to solidify and affect the subsequent tin plating processing of the PCB board, improving the use effect and working efficiency of the tin plating machine 1 and reducing the possibility of poor coating quality of the PCB board.

[0039] Refer to Figures 1-6As shown in the figure, in this embodiment: The cleaning device 7 includes a cleaning frame 71. At the four corner positions of the cleaning frame 71, there are respectively fixedly connected with assembly telescopic rods 72. The input ends of the assembly telescopic rods 72 are fixedly connected to the surface of the tin plating machine 1. On the surface of the tin plating machine 1, there is fixedly connected a hydraulic rod 73. The output end of the hydraulic rod 73 is fixedly connected to the surface of the cleaning frame 71. On one side of the inner wall of the tin plating machine 1 that are close to each other, there are respectively rotatably connected through rotation rods 74. On the arc surface of the rotation rod 74, there is fixedly connected a brush roller 77. On one side surface of the cleaning frame 71, there is fixedly connected a first servo motor 75. At the output end of the first servo motor 75 and on the arc surface of one end of the rotation rod 74, there is installed the same connecting belt 76. At the bottom surface of the cleaning frame 71, there is fixedly connected and communicated with a hose 78. On one side surface of the tin plating machine 1, there is fixedly connected a water pump 79. The output end of the water pump 79 is fixedly connected to the end of the hose 78 that is far from the cleaning frame 71. When using the tin plating machine 1 to perform surface tin plating processing on the PCB board, first install the PCB board on the placement table 3, and then start using the stabilizing device 8 to limit and fix the PCB board to keep the placement position of the PCB board stable. Then pour the tin liquid and the soldering aid liquid onto the surface of the PCB board. After that, operate the control panel 2 on one side of the tin plating machine 1 to start and run the tin plating machine 1, so that the telescopic frame 4 on its surface starts to extend. During this process, the mounting frame 5 will drive the tin plating roller 6 to rotate. During the driving process of the telescopic frame 4, the tin plating roller 6 will come into contact with and roll on the surface of the PCB board, and evenly apply the tin liquid and the soldering aid liquid on its surface. Then, after the processing of the PCB board is completed, return the tin plating roller 6 to the initial position, and at the same time start the cleaning device 7, so that the hydraulic rod 73 on one side of the cleaning frame 71 starts to operate, so that the cleaning frame 71 approaches the tin plating roller 6 with the assistance of the assembly telescopic rods 72 until the tin plating roller 6 is immersed in the clean water inside the cleaning frame 71. At the same time, start the first servo motor 75 on one side of the cleaning frame 71 to make the rotation rod 74 rotate under the drive of the connecting belt 76. At this time, the brush roller 77 and the tin plating roller 6 will rotate simultaneously and will come into contact and friction with each other, so as to remove the tin liquid and the soldering aid liquid attached to the tin plating roller 6. After the cleaning is completed, move the cleaning frame 71 to the initial position, and start the water pump 79 to drain the sewage in the cleaning frame 71 through the hose 78 and inject new water. At this time, when the tin plating machine 1 performs surface tin plating processing on the PCB board, it can timely and effectively clean the substances such as the tin liquid and the soldering aid liquid lamp adhered to the tin plating roller 6, and it is not easy for them to solidify, which affects the subsequent tin plating processing of the PCB board, improves the use effect and working efficiency of the tin plating machine 1, and reduces the possibility of poor coating quality of the PCB board.

[0040] Refer to Figures 1-6As shown, in this implementation: A protective cover 717 is provided on the surface of the first servo motor 75. The cross-section of the protective cover 717 is in a "C" shape. Through the setting of the protective cover 717, when the first servo motor 75 is in normal use, it is not easy for the water stains in the cleaning frame 71 to drip or splash onto the output end of the servo motor, so that the tin liquid soldering flux in the sewage adheres to the output end of the first servo motor 75, causing erosion damage to it and affecting its normal use. On the other hand, it also ensures the normal use of the brush roller 77 and extends the service life of the device and equipment. Two mounting blocks 711 are fixedly connected to one side surface of the cleaning frame 71. A mounting rod 710 is rotatably connected through the side surfaces of the two mounting blocks 711 close to each other. A scraping plate 712 is fixedly connected to the arc surface of the mounting rod 710. Torsion springs 714 are respectively sleeved at both ends of the mounting rod 710 located at the scraping plate 712. The two ends of the torsion spring 714 are respectively fixedly connected to the mounting block 711 and the scraping plate 712. A positioning plate 713 is fixedly connected to one side surface of the cleaning frame 71. The positioning plate 713 abuts against one side surface of the scraping plate 712. After the soldering flux and tin liquid attached to the surface are cleaned off by the tin plating roller 6 in the cleaning frame 71, the hydraulic rod 73 is started to return the collection frame to the initial position. During the downward movement of the cleaning frame 71, the scraping plate 712 on the mounting rod 710 will stably contact and press against the positioning plate 713 at one end of the cleaning frame 71 under the torsional force of the torsion spring 714. At the same time, one side surface of the scraping plate 712 will just come into contact with the arc surface of the tin plating roller 6. At this time, the rotating tin plating roller 6 will have a rotational contact friction with the scraping plate 712, thereby scraping off the water stains attached to the tin plating roller 6, which is convenient for the subsequent tin plating process of the tin plating roller 6 on the next PCB board.

[0041] Refer to Figures 1-6 As shown, in this implementation: Bearings 716 are respectively fixedly connected to the arc surfaces at both ends of the mounting rod 710. The inner ring of the bearing 716 is fixedly connected to the mounting rod 710, and the outer ring of the mounting rod 710 is fixedly connected to the inner wall of the mounting block 711. Through the setting of the bearing 716, the mounting rod 710 can rotate with the inner wall of the mounting block 711, which can reduce the friction of rotation, thereby reducing the wear between the mounting rod 710 and the mounting block 711, and ensuring the stable rotation of the mounting rod 710, so that the scraping plate 712 can continuously and stably scrape off the water stains attached to the tin plating roller 6. A protective pad 715 is fixedly connected to the side surface of the scraping plate 712 close to the positioning plate 713. The protective pad 715 is a rubber pad. Through the setting of the protective pad 715, when the tin plating roller 6 has a scraping contact with the scraping plate 712, it will cause the scraping plate 712 to shake, so that the scraping plate 712 has frequent contact collisions with the positioning plate 713. At this time, the rubber protective plate can reduce and cut the impact force of the contact collision, thereby ensuring the normal use of the scraping plate 712, not easily occurring abnormal damage, and better scraping off the water stains attached to the tin plating roller 6.

[0042] Referring to Figure 1 and Figures 7-9 As shown, in this embodiment: The stabilizing device 8 includes two mounting plates 81, the two mounting plates 81 are respectively fixedly connected to the surface of the tin plating machine 1, a screw rod 82 is rotatably connected through one side of the two mounting plates 81 close to each other, opposite threads are respectively provided on the arc surfaces at both ends of the screw rod 82, connecting frames 86 are respectively threadedly connected to the arc surfaces at both ends of the screw rod 82, the connecting frames 86 are slidably connected to the surface of the tin plating machine 1, a fixing rod 87 is fixedly connected to one side surface of the connecting frame 86, a second servo motor 83 is fixedly connected to the surface of the tin plating machine 1, pulleys 84 are respectively fixedly connected to the output end of the second servo motor 83 and the arc surface of the screw rod 82, a transmission belt 85 is arranged on the arc surface of the pulley 84. When the PCB board is placed on the placement table 3 and the tin plating solution and soldering flux are coated on its surface, the second servo motor 83 on the tin plating machine 1 is started. Because the screw rod 82 is connected and combined with the second servo motor 83 through the transmission belt 85, the operation of the second servo motor 83 will drive the screw rod 82 on the mounting plate 81 to rotate, so that the distance between the connecting frames 86 on the arc surfaces at both ends of the screw rod 82 is changed until the fixing rods 87 fixedly connected to the two connecting frames 86 come into contact with and clamp the PCB board on the placement table 3, ensuring the stable position of the PCB board. At this time, when using the tin plating machine 1 to perform tin plating processing on the surface of the PCB board, it can better ensure the stable position of the PCB board on the placement table 3 and is not easily in contact when the tin plating roller 6 levels the tin plating solution and soldering flux on the PCB board, causing the PCB board to slide and shift, affecting the tin plating effect, thereby improving the use effect and working efficiency of the tin plating machine 1.

[0043] Referring to Figure 1 and Figures 7-9As shown, in this implementation: A limit plate 810 is fixedly connected to the surface of the tin plating machine 1. The limit plate 810 is clamped on the surface of the conveyor belt 85. Through the setting of the limit plate 810, the conveyor belt 85 assembled on the pulleys 84 of the screw rod 82 and the second servo motor 83 can be more stable and not prone to shaking, which may cause the assembly of the conveyor belt 85 to become disengaged. Furthermore, the rotational stability of the screw rod 82 is ensured, enabling better limiting and fixing of the PCB on the placement table 3, improving the tin plating effect on the surface of the PCB, and further enhancing the finished product utilization rate of the PCB. A stabilizing groove 89 is formed on the surface of the connecting frame 86. A stabilizing plate 88 is slidably connected to the inner wall of the stabilizing groove 89. The stabilizing plate 88 is fixedly connected to the surface of the tin plating machine 1. Through the sliding setting of the stabilizing plate 88 and the stabilizing groove 89, when the connecting frame 86 slides under the drive of the screw rod 82, its state can be better maintained and not prone to shaking. As a result, when the two fixing rods 87 are on both sides of the surface of the PCB, they can make better and stable contact, ensuring the position stability of the PCB and improving the usage effect and functionality of the stabilizing device 8.

[0044] Referring to Figure 1 and Figures 7-9 As shown, in this implementation: An electric telescopic rod 811 is fixedly connected to the surface of the tin plating machine 1. A clamping plate 812 is fixedly connected to the output end of the electric telescopic rod 811. The clamping plate 812 is clamped on the surface of the conveyor belt 85. Through the setting of the clamping plate 812 and the electric telescopic rod 811, when the second servo motor 83 drives the screw rod 82 to operate, by starting the electric telescopic rod 811, the clamping plate 812 can be continuously and stably clamped and pressed on the surface of the conveyor belt 85, enabling the conveyor belt 85 to maintain a stable and taut state at all times and not prone to loosening. Thus, the second servo motor 83 can better drive the two fixing rods 87 to limit and fix the PCB, ensuring the normal use of the stabilizing device 8.

[0045] Working principle: When using the tin plating machine 1 to carry out surface tin plating processing on the PCB board, first install the PCB board on the placement table 3, and then start the use of the stabilizing device 8. Start the second servo motor 83 on the tin plating machine 1. Since the screw rod 82 is connected and combined with the second servo motor 83 through the transmission belt 85, the rotation of the second servo motor 83 will drive the screw rod 82 on the mounting plate 81 to rotate, so that the distance between the connecting frames 86 on the arc surfaces at both ends of the screw rod 82 changes until the fixed rods 87 fixedly connected to the two connecting frames 86 form contact clamping on the PCB board on the placement table 3, keeping the placement position of the PCB board stable. Then pour the tin liquid and the soldering flux on the surface of the PCB board. After that, operate the control panel 2 on one side of the tin plating machine 1 to start the tin plating machine 1, so that the telescopic frame 4 on its surface starts to extend. During this process, the mounting frame 5 will drive the tin plating roller 6 to rotate. During the driving process of the telescopic frame 4, the tin plating roller 6 comes into contact with and rolls on the surface of the PCB board, evenly applying the tin liquid and the soldering flux on its surface. Then, after the processing of the PCB board is completed, return the tin plating roller 6 to the initial position, and at the same time start the cleaning device 7, so that the hydraulic rod 73 on one side of the cleaning frame 71 starts to operate, so that the cleaning frame 71 approaches the tin plating roller 6 with the assistance of the assembled telescopic rod 72 until the tin plating roller 6 is immersed in the clean water inside the cleaning frame 71. At the same time, start the first servo motor 75 on one side of the cleaning frame 71, so that the rotating rod 74 rotates under the drive of the connecting belt 76. At this time, the brush roller 77 will rotate simultaneously with the tin plating roller 6 and will come into contact and friction with each other, thereby removing the tin liquid and the soldering flux attached to the tin plating roller 6. After the cleaning is completed, move the cleaning frame 71 to the initial position, and start the water pump 79 to drain the sewage in the cleaning frame 71 through the hose 78 and then inject new water. During the downward movement of the cleaning frame 71, the scraper 712 on the mounting rod 710 will stably contact and press against the positioning plate 713 at one end of the cleaning frame 71 under the torsional force of the torsion spring 714. At the same time, one side surface of the scraper 712 will just come into contact with the arc surface of the tin plating roller 6. At this time, the rotating tin plating roller 6 will rotate and come into contact with the scraper 712 for friction, thereby scraping off the water stains attached to the tin plating roller 6. At this time, when the tin plating machine 1 carries out surface tin plating processing on the PCB board, it can timely and effectively clean the substances such as tin liquid and soldering flux adhered to the tin plating roller 6, and it is not easy for them to solidify, which affects the subsequent tin plating processing of the PCB board, improves the use effect and working efficiency of the tin plating machine 1, and reduces the possibility of poor coating quality of the PCB board.

Claims

1. A tin plating surface treatment device for a PCB board, comprising a tin plating machine (1), characterized in that: One side surface of the tin plating machine (1) is fixedly connected with a control panel (2). One side surface of the tin plating machine (1) is fixedly connected with a placement table (3). A telescopic frame (4) is arranged on the surface of the tin plating machine (1). One end of the telescopic frame (4) is fixedly connected with a mounting frame (5). A tin plating roller (6) is arranged on the inner wall of the mounting frame (5). A cleaning device (7) is arranged on one side surface of the tin plating machine (1). The cleaning device (7) cleans substances such as tin liquid and soldering flux adhering to the surface of the tin plating roller (6) after each tin plating process, and it is not easy for the tin liquid on the tin plating roller (6) to solidify, which affects the subsequent surface tin plating treatment of the PCB board. A stabilizing device (8) is arranged on the surface of the tin plating machine (1) on one side of the placement table (3). The stabilizing device (8) limits and stabilizes the position of the PCB board on the placement table (3), so as to facilitate the tin plating machine (1) to perform tin plating processing on it, and it is not easy for the PCB board to slide and shift. The cleaning device (7) includes a cleaning frame (71). Assembly telescopic rods (72) are respectively fixedly connected to the four corner positions of the cleaning frame (71). The input ends of the assembly telescopic rods (72) are fixedly connected to the surface of the tin plating machine (1). A hydraulic rod (73) is fixedly connected to the surface of the tin plating machine (1). The output end of the hydraulic rod (73) is fixedly connected to the surface of the cleaning frame (71). Rotating rods (74) are respectively rotatably connected through the mutually adjacent sides of the inner wall of the tin plating machine (1). A brush roller (77) is fixedly connected to the arc surface of the rotating rod (74). A first servo motor (75) is fixedly connected to one side surface of the cleaning frame (71). A connecting belt (76) is installed on the arc surface of the output end of the first servo motor (75) and one end of the rotating rod (74). A hose (78) is fixedly connected and communicated with the bottom surface of the cleaning frame (71). A water pump (79) is fixedly connected to one side surface of the tin plating machine (1). The output end of the water pump (79) is fixedly connected to the end of the hose (78) far from the cleaning frame (71). The stabilizing device (8) includes two mounting plates (81). The two mounting plates (81) are respectively fixedly connected to the surface of the tin plating machine (1). A screw rod (82) is rotatably connected through the mutually adjacent sides of the two mounting plates (81). Threads with opposite directions are respectively provided on the arc surfaces at both ends of the screw rod (82). Connecting frames (86) are respectively threadedly connected to the arc surfaces at both ends of the screw rod (82). The connecting frames (86) are slidably connected to the surface of the tin plating machine (1). A fixing rod (87) is fixedly connected to one side surface of the connecting frame (86). A second servo motor (83) is fixedly connected to the surface of the tin plating machine (1). Pulley wheels (84) are respectively fixedly connected to the arc surface of the output end of the second servo motor (83) and the arc surface of the screw rod (82). A transmission belt (85) is arranged on the arc surface of the pulley wheel (84); A protective cover (717) is arranged on the surface of the first servo motor (75). The cross section of the protective cover (717) is in a "C" shape;One side surface of the cleaning frame (71) is fixedly connected with two mounting blocks (711). One side of the two mounting blocks (711) close to each other is penetrated and rotatably connected with a mounting rod (710). A scraping plate (712) is fixedly connected to the arc surface of the mounting rod (710). Torsion springs (714) are respectively sleeved at both ends of the mounting rod (710) where the scraping plate (712) is located. Both ends of the torsion spring (714) are fixedly connected with the mounting block (711) and the scraping plate (712) respectively. A positioning plate (713) is fixedly connected to one side surface of the cleaning frame (71). The positioning plate (713) abuts against one side surface of the scraping plate (712); Bearings (716) are respectively fixedly connected to the arc surfaces at both ends of the mounting rod (710). The inner ring of the bearing (716) is fixedly connected with the mounting rod (710), and the outer ring of the mounting rod (710) is fixedly connected with the inner wall of the mounting block (711); A protective pad (715) is fixedly connected to one side surface of the scraping plate (712) close to the positioning plate (713). The protective pad (715) is a rubber pad; A limiting plate (810) is fixedly connected to the surface of the tin plating machine (1). The limiting plate (810) is clamped on the surface of the conveyor belt (85); A stabilizing groove (89) is formed on the surface of the connecting frame (86). A stabilizing plate (88) is slidably connected to the inner wall of the stabilizing groove (89). The stabilizing plate (88) is fixedly connected to the surface of the tin plating machine (1); An electric telescopic rod (811) is fixedly connected to the surface of the tin plating machine (1). A clamping plate (812) is fixedly connected to the output end of the electric telescopic rod (811). The clamping plate (812) is clamped on the surface of the conveyor belt (85).;

Images