LED packaging process based on TGV substrate

Abstract

The invention discloses an LED packaging technology based on a TGV substrate, relates to the field of LED packaging, solves the problem that an existing TGV glass substrate is easy to break when taken, and comprises the following steps: enabling an adsorption unit to carry out four-corner positioning adsorption on the glass substrate, adjusting the position of the adsorption unit through an adjusting unit, and matching the glass substrate; a glass substrate is placed on the laser working table to be perforated by the taking and adsorbing unit, and the adsorbing unit is cleaned and stored by the recycling and adsorbing unit and the cleaning unit; sputtering seed layer metal, and electroplating metal copper in the holes of the glass substrate; aligning, pressing and welding with the chips which are arranged on the temporary substrate in advance according to the defined specification, and coating protective glue, transparent glue, black glue and the like on the surfaces of the chips; the glass substrate with the exposed copper is polished, and an independent LED chip is manufactured; through the position adjusting mechanism, the top of the glass substrate is adsorbed, the glass substrate is convenient to take, and therefore the safe feeding effect is achieved.

Description

Technical Field

[0001] The invention relates to the field of LED packaging, and in particular to an LED packaging process based on a TGV substrate. Background Art

[0002] LED packaging refers to the packaging of light-emitting chips. The function of packaging is to provide sufficient protection for the chip to prevent the chip from failing due to long-term exposure to the air or mechanical damage, so as to improve the stability of the chip. For LED packaging, it is also required to have good light extraction efficiency and good heat dissipation. Good packaging can make the LED have better luminous efficiency and heat dissipation environment, thereby increasing the life of the LED.

[0003] TGV substrate is an advanced LED packaging technology. It combines the precision of laser processing with the advantages of glass substrate to achieve high-density and high-reliability vertical electrical interconnection. The production steps include: TGV glass placement, TGV through-hole production, seed layer metal plating, electroplating filling, double-sided circuit production, and precise alignment, bonding and welding of the LED chip array and the TGV substrate with circuits to complete the LED packaging. However, TGV glass needs to be thinned to a thinner thickness before double-sided circuit production can be carried out. The thin peeling process is difficult. When the glass is taken, the glass has problems such as insufficient mechanical strength, easy breakage, and low yield, which reduces the yield rate and increases the cost. Summary of the invention

[0004] The object of the present invention is to provide an LED packaging process based on a TGV substrate to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An LED packaging process based on a TGV substrate comprises the following steps:

[0007] S1. Prepare a glass substrate with a thickness of 0.5-1.1 mm, enable the adsorption unit to position and adsorb the glass substrate at four corners, and adjust the position of the adsorption unit through the adjustment unit to match the glass substrate;

[0008] S2, take the adsorption unit and place the glass substrate on the laser workbench, open a hole with a depth of 200-300um, the size feature of the hole is that the top opening is 80-120um, recycle the adsorption unit, and clean and store the adsorption unit with the cleaning unit;

[0009] S3, sputtering the seed layer metal, electroplating metal copper to fill the holes of the glass substrate, or filling the holes with conductive paste after sputtering the metal and curing it, the resistivity of the conductive paste after curing is less than or equal to 0.01 ohm-cm, and polishing the surface of the glass substrate to remove the metal and conductive paste outside the surface openings;

[0010] S4, making a conductive circuit on the glass substrate on one side of the opening;

[0011] S5, aligning, pressing and welding the chips pre-arranged on the temporary substrate according to the defined specifications, separating the temporary substrate, and applying protective glue, transparent glue, black glue, etc. on the surface of the chip;

[0012] S6. Thinning and polishing the side of the glass substrate opposite to the opening surface until the metal in the opening is exposed, separating the temporary carrier, and cutting the glass substrate to produce independent LED chips.

[0013] Preferably, the adsorption unit comprises an annular frame, the top of the annular frame is provided with four mounting plates which are centrally symmetrically distributed, the bottom of the mounting plate is provided with an air valve located in the inner circle of the annular frame, a vacuum suction cup is fixedly installed at the bottom of the air valve, a spring is fixedly installed between the top of the air valve and the bottom of the mounting plate, and the elasticity of the spring is used to provide a buffer for the contact between the vacuum suction cup and the glass substrate, a compressed air pump is fixedly installed on the top of the mounting plate, the compressed air pump is connected to the air valve through an air pipe, the compressed air pump starts the air valve through the air pipe, so that the air valve exhausts the gas between the vacuum suction cup and the glass substrate, and the glass substrate is adsorbed, four centrally symmetrical support rods are fixedly installed on the top of the air valve, the support rods slide through the mounting plate, and provide guidance and support for the movement of the air valve, and a limiting ring located at the top of the mounting plate is fixedly installed between the four support rods.

[0014] Preferably, the adjusting unit includes a rotating ring rotatably mounted on the inner side of the annular frame, the top of the rotating ring is fixedly mounted with a vortex strip, the top of the annular frame is provided with a slide groove for the mounting plate to slide in the afternoon, and the bottom of the mounting plate is fixedly mounted with arc-shaped clips that are equidistantly distributed and cooperate with a plurality of the vortex strips, so that when the rotating ring rotates, the mounting plate can be driven by the vortex strips and the arc-shaped clips to move along the slide groove on the annular frame to adjust the position of the vacuum suction cup, so that guide plates are provided on both sides of the mounting plate, and the guide plates are fixedly mounted on the inner side of the annular frame to improve the stability of the movement of the mounting plate, and the side of the guide plate close to the annular frame contacts the inner side of the rotating ring, and two symmetrically distributed positioning clips are fixedly mounted in the slide groove of the annular frame, and the positioning clips are fixedly connected to the side of the guide plate close to the mounting plate, and a slot for limiting the sliding of the positioning clips is provided on the outer side of the mounting plate, providing a limit for the movement of the mounting plate.

[0015] Preferably, the cleaning unit includes four positioning plates respectively located directly below the four mounting plates, the positioning plates are fixedly mounted on the inner side of the annular frame, two symmetrically distributed guide strips are fixedly mounted on one end of the positioning plate close to the air valve, sliding columns respectively on the same horizontal line with the two guide strips are fixedly mounted on both sides of the air valve, the end of the guide bar close to the sliding column is an inclined structure, so that when the sliding column and the inclined surface of the guide bar move, the air valve can be pushed to move upward, a storage cover is fixedly mounted on the bottom of the positioning plate, a sleeve is provided on the side of the storage cover away from the air valve, and the sleeve is fixedly mounted on the positioning plate. At the bottom, a rotating rod extending to the top of the positioning plate is rotatably installed on the outer side of the sleeve, a gear is fixedly installed on the top of the rotating rod, and a mounting ring is fixedly installed on the bottom of the rotating ring, and four arc-shaped racks respectively matched with the four gears are fixedly installed on the inner side of the mounting ring, so that when the arc-shaped racks are in contact with the gears, as the rotating ring rotates, the arc-shaped racks drive the gears to rotate, and a placing plate is fixedly installed on the end of the rotating rod away from the gear for placing cleaning cotton, and the top of the placing plate is on the same horizontal line as the bottom of the storage cover, so that when the placing plate rotates, the cleaning cotton can be used to clean and protect the bottom of the vacuum suction cup.

[0016] Preferably, two symmetrically distributed handles are fixedly mounted on the top of the annular frame to facilitate pulling the annular frame to move.

[0017] Preferably, a rubber gasket is provided on the outer side of the spring, and the rubber gasket is fixedly mounted on the bottom of the mounting plate to provide buffering and protection for the movement of the air valve.

[0018] Preferably, an anti-skid push ring located on the inner ring of the annular frame is fixedly mounted on the bottom of the swivel to facilitate the rotation operation of the swivel.

[0019] Preferably, a stop bar is fixedly installed on the top of the mounting plate, and two symmetrically distributed stop bars are fixedly installed on the top of the annular frame slide groove to prevent the mounting plate from moving too long.

[0020] Preferably, a turntable is rotatably installed on the inner side of the placement plate, a turntable block that slides through the placement plate is fixedly installed on the bottom of the turntable, and a torsion plate is fixedly installed on the bottom of the turntable to facilitate the cleaning cotton in the rotating placement plate to clean the bottom of the vacuum suction cup.

[0021] Preferably, two symmetrically distributed rubber buckle ropes are fixedly installed on the top of the turntable to fix the cleaning cotton.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention can use a four-point positioning method to adsorb the top of the glass substrate through the adsorption unit, which is convenient for taking the glass substrate and placing it on the laser workbench for drilling operations, thereby improving the safety of glass substrate loading and solving the problem that the glass substrate is easily broken, thereby achieving the effect of safe loading.

[0024] 2. The present invention can synchronously adjust the positions of four vacuum suction cups through the adjustment unit, which is convenient for adsorbing and positioning glass substrates of different sizes. The space in the inner circle of the annular frame can be used to process the glass substrate, which is convenient for directly picking up the glass substrate after the drilling is completed, thereby facilitating the adsorption and picking up of glass substrates of more sizes and improving the convenience of drilling holes in the glass substrate.

[0025] 3. The present invention uses a cleaning unit to store the vacuum suction cup in a storage cover after use, and rotates the placement plate to make the cleaning cotton contact with the bottom of the vacuum suction cup, thereby achieving the effect of facilitating cleaning and protection of the vacuum suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the structure of the vacuum suction cup and the placement plate in the present invention;

[0028] Figure 3 It is a schematic diagram of the structure of the vortex strip and the rotating ring in the present invention;

[0029] Figure 4 It is a schematic diagram of the structure of the storage cover and the guide plate in the present invention;

[0030] Figure 5 It is a schematic diagram of the support rod and the limiting ring structure in the present invention;

[0031] Figure 6 It is a schematic diagram of the structure of the support bar and the stop bar in the present invention;

[0032] Figure 7 It is a schematic diagram of the structure of the mounting ring and the anti-slip push ring in the present invention;

[0033] Figure 8 It is a schematic diagram of the structure of the turntable and the turn block in the present invention.

[0034] In the figure: 1. annular frame; 2. mounting plate; 3. air valve; 4. vacuum suction cup; 5. spring; 6. compressed air pump; 7. air pipe; 8. support rod; 9. limit ring; 10. swivel ring; 11. vortex bar; 12. arc-shaped card bar; 13. guide plate; 14. positioning card bar; 15. positioning plate; 16. guide bar; 17. slide column; 18. storage cover; 19. sleeve; 20. rotating rod; 21. gear; 22. mounting ring; 23. arc-shaped rack; 24. placement plate; 25. handle; 26. rubber gasket; 27. anti-slip push ring; 28. push bar; 29. ​​stop bar; 30. turntable; 31. rotating block; 32. twist plate; 33. rubber buckle rope. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative inspiration are within the scope of protection of the present invention.

[0036] Example 1: Please refer to Figure 1-Figure 8 , a LED packaging process based on a TGV substrate shown in the figure includes the following steps:

[0037] S1. Prepare a glass substrate with a thickness of 0.5-1.1 mm, enable the adsorption unit to position and adsorb the glass substrate at four corners, and adjust the position of the adsorption unit through the adjustment unit to match the glass substrate;

[0038] S2, take the adsorption unit and place the glass substrate on the laser workbench, open a hole with a depth of 200-300um, the size feature of the hole is that the top opening is 80-120um, recycle the adsorption unit, and clean and store the adsorption unit with the cleaning unit;

[0039] S3, sputtering the seed layer metal, electroplating metal copper to fill the holes of the glass substrate, or filling the holes with conductive paste after sputtering the metal and curing it, the resistivity of the conductive paste after curing is less than or equal to 0.01 ohm-cm, and polishing the surface of the glass substrate to remove the metal and conductive paste outside the surface openings;

[0040] S4, making a conductive circuit on the glass substrate on one side of the opening;

[0041] S5, aligning, pressing and welding the chips pre-arranged on the temporary substrate according to the defined specifications, separating the temporary substrate, and applying protective glue, transparent glue, black glue, etc. on the surface of the chip;

[0042] S6. Thinning and polishing the side of the glass substrate opposite to the opening surface until the metal in the opening is exposed, separating the temporary carrier, and cutting the glass substrate to produce independent LED chips.

[0043] The adsorption unit includes an annular frame 1, and four mounting plates 2 are arranged on the top of the annular frame 1 and are symmetrically distributed in the center. An air valve 3 located in the inner circle of the annular frame 1 is arranged at the bottom of the mounting plate 2. A vacuum suction cup 4 is fixedly installed at the bottom of the air valve 3. A spring 5 is fixedly installed between the top of the air valve 3 and the bottom of the mounting plate 2. The elasticity of the spring 5 is used to provide a buffer for the contact between the vacuum suction cup 4 and the glass substrate. A compressed air pump 6 is fixedly installed on the top of the mounting plate 2. The compressed air pump 6 is connected to the air valve 3 through an air pipe 7. The compressed air pump 6 starts the air valve 3 through the air pipe 7, so that the air valve 3 exhausts the gas between the vacuum suction cup 4 and the glass substrate to adsorb the glass substrate. Four centrally symmetrical support rods 8 are fixedly installed on the top of the air valve 3. The support rods 8 slide through the mounting plate 2 to provide guidance and support for the movement of the air valve 3. A limit ring 9 located at the top of the mounting plate 2 is fixedly installed between the four support rods 8.

[0044] The user brings the four vacuum suction cups 4 on the annular frame 1 into contact with the top of the glass substrate, uses the elastic force of the spring 5 to provide a buffer for the contact between the vacuum suction cups 4 and the glass substrate, starts the compressed air pump 6 and the air valve 3 to extract the air between the vacuum suction cups 4 and the glass substrate, and adsorbs and positions the glass substrate. The user can then pick up the glass substrate through the annular frame 1 and place the glass substrate on the laser workbench for drilling, thereby achieving the effect of safe loading and solving the problem of easy breakage of the glass substrate.

[0045] The adjusting unit comprises a rotating ring 10 rotatably mounted on the inner side of the annular frame 1, a spiral strip 11 is fixedly mounted on the top of the rotating ring 10, a slide groove for limiting the sliding of the mounting plate 2 is provided on the top of the annular frame 1, and an arc-shaped clamping strip 12 which is evenly distributed and matched with a plurality of spiral strips 11 is fixedly mounted on the bottom of the mounting plate 2, so that when the rotating ring 10 rotates, the spiral strip 11 and the arc-shaped clamping strip 12 can drive the mounting plate 2 to move along the slide groove on the annular frame 1, so as to adjust the position of the vacuum suction cup 4, and the mounting plate 2 is provided with guide plates 13 on both sides, the guide plates 13 are fixedly installed on the inner side of the annular frame 1 to improve the stability of the movement of the mounting plate 2, the side of the guide plate 13 close to the annular frame 1 is in contact with the inner side of the rotating ring 10, and two symmetrically distributed positioning clips 14 are fixedly installed in the slide groove of the annular frame 1, and the positioning clips 14 are fixedly connected to the side of the guide plate 13 close to the mounting plate 2, and the outer side of the mounting plate 2 is provided with a card slot for the positioning clip 14 to limit the sliding movement, so as to provide a limit for the movement of the mounting plate 2;

[0046] The user can rotate the rotating ring 10 inside the annular frame 1, so that the rotating ring 10 drives the vortex bar 11 to rotate along the arc-shaped clamping strip 12 at the bottom of the mounting plate 2, and the mounting plate 2 is driven by the arc-shaped clamping strip 12 to move along the slide groove of the annular frame 1, and the clamping groove on the mounting plate 2 moves along the outer side of the positioning clamping strip 14, so as to achieve the effect of synchronous movement of the four mounting plates 2 toward the center of the annular frame 1. The mounting plate 2 can adjust the position of the vacuum suction cup 4, and the space in the inner circle of the annular frame 1 can be used to punch holes in the glass substrate, so that the glass substrate can be directly taken after the punching is completed, thereby facilitating the adsorption and taking of glass substrates of more sizes and improving the convenience of punching holes in the glass substrate.

[0047] The cleaning unit includes four positioning plates 15 respectively located directly below the four mounting plates 2. The positioning plates 15 are fixedly mounted on the inner side of the annular frame 1. Two symmetrically distributed guide strips 16 are fixedly mounted on one end of the positioning plate 15 close to the air valve 3. Sliding posts 17 respectively on the same horizontal line with the two guide strips 16 are fixedly mounted on both sides of the air valve 3. The ends of the guide strips 16 close to the sliding posts 17 are inclined structures, so that when the sliding posts 17 and the inclined surfaces of the guide strips 16 move, the air valve 3 can be pushed to move upward. A storage cover 18 is fixedly mounted on the bottom of the positioning plate 15. A sleeve 19 is arranged on the side of the storage cover 18 away from the air valve 3. The sleeve 19 is fixedly mounted on the bottom of the positioning plate 15. The outer surface of the sleeve 19 A rotating rod 20 extending to the top of the positioning plate 15 is installed on the side rotation, a gear 21 is fixedly installed on the top of the rotating rod 20, a mounting ring 22 is fixedly installed on the bottom of the rotating ring 10, and four arc-shaped racks 23 respectively matched with the four gears 21 are fixedly installed on the inner side of the mounting ring 22, so that when the arc-shaped racks 23 are in contact with the gears 21, as the rotating ring 10 rotates, the arc-shaped racks 23 drive the gears 21 to rotate, and a placement plate 24 is fixedly installed on the end of the rotating rod 20 away from the gears 21 for placing cleaning cotton, and the top of the placement plate 24 and the bottom of the storage cover 18 are on the same horizontal line, so that when the placement plate 24 rotates, it can clean and protect the bottom of the vacuum suction cup 4 through the cleaning cotton;

[0048] After the vacuum suction cup 4 is separated from the glass substrate, the user rotates the rotating ring 10 in the opposite direction to drive the four mounting plates 2 to move in the direction opposite to the center of the annular frame 1. When the sliding column 17 on the air valve 3 contacts the inclined surface of the guide strip 16, the sliding column 17 moves upward along the inclined surface of the guide strip 16. Under the limitation and guidance of the support rod 8, the air valve 3 moves in the direction of the mounting plate 2, and the air valve 3 drives the vacuum suction cup 4 to move synchronously, so that the vacuum suction cup 4 is close to the storage cover 18. At the same time, the rotating ring 10 drives the arc rack 23 to rotate synchronously through the mounting ring 22, and the arc rack 23 drives the rotating rod 20 to rotate through the gear 21, so that the rotating rod 20 drives the placement plate 24 to rotate to the bottom of the vacuum suction cup 4, so as to cover and protect the bottom of the vacuum suction cup 4, and the cleaning cotton in the placement plate 24 can clean the bottom of the vacuum suction cup 4, thereby achieving the effect of facilitating the cleaning and protection of the vacuum suction cup 4.

[0049] Working principle: First, the user rotates the rotating ring 10 inside the annular frame 1, so that the rotating ring 10 drives the vortex bar 11 to rotate along the arc-shaped card strip 12 at the bottom of the mounting plate 2, and drives the mounting plate 2 to move along the slide groove of the annular frame 1 through the arc-shaped card strip 12, and the card groove on the mounting plate 2 moves along the outside of the positioning card strip 14, so that the four mounting plates 2 move synchronously toward the center of the annular frame 1, and the mounting plate 2 drives the vacuum suction cups 4 to move synchronously, so that the positions of the four vacuum suction cups 4 match the size of the glass substrate, and then, the user puts the four vacuum suction cups 4 against the top of the glass substrate, and uses the elastic force of the spring 5 to provide a buffer for the contact between the vacuum suction cups 4 and the glass substrate. Subsequently, the user starts the compressed air pump 6 and the air valve 3 to extract the air between the vacuum suction cups 4 and the glass substrate, so that the vacuum suction cups 4 are adsorbed on the glass substrate. At this time, the user picks up the annular frame 1, takes the glass substrate, and places the glass substrate on The laser workbench is used for drilling. Finally, the user starts the compressed air pump 6 and the air valve 3 to separate the vacuum suction cup 4 from the glass substrate, and rotates the rotating ring 10 in the opposite direction, so that the rotating ring 10 drives the four mounting plates 2 to move synchronously in the direction of the outer side of the annular frame 1, and the mounting plate 2 drives the air valve 3 to move synchronously. When the slide column 17 on the air valve 3 contacts the inclined surface of the guide bar 16, the slide column 17 moves upward along the inclined surface of the guide bar 16. Under the limitation and guidance of the support rod 8, the air valve 3 moves in the direction of the mounting plate 2, and pulls the vacuum suction cup 4 to move upward, so that the vacuum suction cup 4 is close to the storage cover 18. At the same time, the rotating ring 10 drives the arc rack 23 to rotate synchronously through the mounting ring 22, and the arc rack 23 drives the rotating rod 20 to rotate through the gear 21, so that the rotating rod 20 drives the placement plate 24 to rotate to the bottom of the vacuum suction cup 4, and the bottom of the vacuum suction cup 4 is shielded and protected, thereby achieving the effect of safely taking the glass substrate.

[0050] Example 2: Please refer to Figure 1-Figure 7The present embodiment further explains the first embodiment. Two symmetrically distributed handles 25 are fixedly installed on the top of the annular frame 1 in the figure, which are convenient for pulling the annular frame 1 to move. A rubber gasket 26 is arranged on the outside of the spring 5. The rubber gasket 26 is fixedly installed on the bottom of the mounting plate 2 to provide buffering and protection for the movement of the air valve 3. An anti-slip push ring 27 located on the inner ring of the annular frame 1 is fixedly installed on the bottom of the swivel 10 to facilitate the rotation operation of the swivel 10. A resist bar 28 is fixedly installed on the top of the mounting plate 2. Two symmetrically distributed baffle bars 29 are fixedly installed on the top of the slide groove of the annular frame 1 to prevent the mounting plate 2 from moving too long.

[0051] In this embodiment: when the vacuum suction cup 4 contacts the top of the glass substrate, the vacuum suction cup 4 drives the air valve 3 to contact the rubber gasket 26. The rubber gasket 26 can provide buffer protection for the bottom of the air valve 3, thereby improving the durability of the air valve 3. The rotating ring 10 can be toggled through the anti-slip push ring 27 to improve the convenience of rotating and adjusting the rotating ring 10. When the mounting plate 2 moves along the slide groove of the annular frame 1, when the support bar 28 on the mounting plate 2 contacts the stop bar 29 on the annular frame 1, a limit is provided for the movement of the mounting plate 2 to prevent the user from rotating too much and causing the mounting plate 2 to fall off the slide groove. After the vacuum suction cup 4 adsorbs the glass substrate, the user can pick up the glass substrate through the two handles 25 for easy transportation.

[0052] Example 3: Please refer to Figure 7 and Figure 8 This embodiment further illustrates other embodiments. A turntable 30 is rotatably installed on the inner side of the placement plate 24 shown in the figure. A turntable 31 that slides through the placement plate 24 is fixedly installed on the bottom of the turntable 30. A torsion plate 32 is fixedly installed on the bottom of the turntable 31 to facilitate the cleaning cotton in the rotation of the placement plate 24 to clean the bottom of the vacuum suction cup 4. Two symmetrically distributed rubber buckle ropes 33 are fixedly installed on the top of the turntable 30 to fix the cleaning cotton.

[0053] In this embodiment: the user can stretch the two rubber buckle ropes 33 to place the cleaning cotton on the turntable 30, and use the elasticity of the rubber buckle ropes 33 to fix the cleaning cotton on the turntable 30, thereby improving the convenience of installing the cleaning cotton. When the placement plate 24 rotates to the bottom of the vacuum suction cup 4, the user can rotate the twist plate 32 to drive the rotating block 31 to rotate, so that the rotating block 31 drives the cleaning cotton on the turntable 30 to rotate, and the bottom of the vacuum suction cup 4 can be cleaned, which is convenient for cleaning and protecting the vacuum suction cup 4.

[0054] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A LED packaging process based on a TGV substrate, characterized in that: The steps include: S1. Prepare a glass substrate with a thickness of 0.5-1.1 mm, enable the adsorption unit to position and adsorb the glass substrate at four corners, and adjust the position of the adsorption unit through the adjustment unit to match the glass substrate; S2, take the adsorption unit and place the glass substrate on the laser workbench, open a hole with a depth of 200-300um, the size feature of the hole is that the top opening is 80-120um, recycle the adsorption unit, and clean and store the adsorption unit with the cleaning unit; S3, sputtering the seed layer metal, electroplating metal copper to fill the holes of the glass substrate, or filling the holes with conductive paste after sputtering the metal and curing it, the resistivity of the conductive paste after curing is less than or equal to 0.01 ohm-cm, and polishing the surface of the glass substrate to remove the metal and conductive paste outside the surface openings; S4, making a conductive circuit on the glass substrate on one side of the opening; S5, aligning, pressing and welding the chips pre-arranged on the temporary substrate according to the defined specifications, separating the temporary substrate, and applying protective glue, transparent glue, black glue, etc. on the surface of the chip; S6. Thinning and polishing the side of the glass substrate opposite to the opening surface until the metal in the opening is exposed, separating the temporary carrier, and cutting the glass substrate to produce independent LED chips.

2. The LED packaging process based on the TGV substrate according to claim 1, characterized in that: The adsorption unit comprises an annular frame (1), the top of the annular frame (1) is provided with four mounting plates (2) which are centrally symmetrically distributed, the bottom of the mounting plate (2) is provided with an air valve (3) which is located in the inner circle of the annular frame (1), the bottom of the air valve (3) is fixedly installed with a vacuum suction cup (4), a spring (5) is fixedly installed between the top of the air valve (3) and the bottom of the mounting plate (2), a compressed air pump (6) is fixedly installed on the top of the mounting plate (2), the compressed air pump (6) is connected to the air valve (3) through an air pipe (7), and four centrally symmetrical support rods (8) are fixedly installed on the top of the air valve (3), the support rods (8) slide through the mounting plate (2), and a limiting ring (9) located at the top of the mounting plate (2) is fixedly installed between the four support rods (8).

3. The LED packaging process based on TGV substrate according to claim 2, characterized in that: The adjusting unit comprises a rotating ring (10) rotatably mounted on the inner side of the annular frame (1), a spiral strip (11) being fixedly mounted on the top of the rotating ring (10), a sliding groove for the mounting plate (2) to slide in the groove being provided on the top of the annular frame (1), an arc-shaped clamping strip (12) which is evenly distributed and matches with a plurality of the spiral strips (11) being fixedly mounted on the bottom of the mounting plate (2), guide plates (13) being arranged on both sides of the mounting plate (2), and the guide plates (13) 13) is fixedly installed on the inner side of the annular frame (1), the side of the guide plate (13) close to the annular frame (1) contacts the inner side of the rotating ring (10), two symmetrically distributed positioning strips (14) are fixedly installed in the slide groove of the annular frame (1), the positioning strips (14) are fixedly connected to the side of the guide plate (13) close to the mounting plate (2), and the outer side of the mounting plate (2) is provided with a slot for the positioning strip (14) to limit the sliding movement.

4. The LED packaging process based on the TGV substrate according to claim 3, characterized in that: The cleaning unit comprises four positioning plates (15) respectively located directly below the four mounting plates (2); the positioning plates (15) are fixedly mounted on the inner side of the annular frame (1); two symmetrically distributed guide strips (16) are fixedly mounted on one end of the positioning plate (15) close to the air valve (3); sliding columns (17) respectively arranged on the same horizontal line as the two guide strips (16) are fixedly mounted on both sides of the air valve (3); one end of the guide strip (16) close to the sliding column (17) is an inclined surface structure; a storage cover (18) is fixedly mounted on the bottom of the positioning plate (15); a sleeve is provided on the side of the storage cover (18) away from the air valve (3); The sleeve (19) is fixedly mounted on the bottom of the positioning plate (15); a rotating rod (20) extending to the top of the positioning plate (15) is rotatably mounted on the outer side of the sleeve (19); a gear (21) is fixedly mounted on the top of the rotating rod (20); a mounting ring (22) is fixedly mounted on the bottom of the rotating ring (10); four arc-shaped racks (23) respectively matched with the four gears (21) are fixedly mounted on the inner side of the mounting ring (22); a placement plate (24) is fixedly mounted on one end of the rotating rod (20) away from the gear (21); the top of the placement plate (24) and the bottom of the storage cover (18) are on the same horizontal line.

5. The LED packaging process based on TGV substrate according to claim 2, characterized in that: Two symmetrically distributed handles (25) are fixedly mounted on the top of the annular frame (1).

6. The LED packaging process based on TGV substrate according to claim 2, characterized in that: A rubber gasket (26) is provided on the outer side of the spring (5), and the rubber gasket (26) is fixedly mounted on the bottom of the mounting plate (2).

7. The LED packaging process based on TGV substrate according to claim 3, characterized in that: An anti-slip push ring (27) located on the inner ring of the annular frame (1) is fixedly mounted on the bottom of the rotating ring (10).

8. The LED packaging process based on TGV substrate according to claim 3, characterized in that: A stop bar (28) is fixedly mounted on the top of the mounting plate (2), and two symmetrically distributed stop bars (29) are fixedly mounted on the top of the slide groove of the annular frame (1).

9. The LED packaging process based on TGV substrate according to claim 4, characterized in that: A rotating disk (30) is rotatably mounted inside the placement disk (24), a rotating block (31) that slides through the placement disk (24) is fixedly mounted at the bottom of the rotating disk (30), and a torsion plate (32) is fixedly mounted at the bottom of the rotating block (31).

10. The LED packaging process based on TGV substrate according to claim 9, characterized in that: Two symmetrically distributed rubber buckle ropes (33) are fixedly mounted on the top of the rotating disk (30).

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