Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device, the display panel comprises a substrate, at least one light emitting unit, a first packaging layer and a protection layer, and the light emitting unit is located on one side of the substrate in the thickness direction; the first packaging layers are located on the sides, away from the substrate, of the light-emitting units, the protection layer is located on the side, away from the substrate, of at least one first packaging layer, the protection layer covers at least part of the first packaging layer, and materials of the first packaging layers and materials of the protection layer both comprise inorganic materials. According to the display panel provided by the invention, the use performance of the display device can be improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a display panel and a preparation method thereof and a display device. Background Art

[0002] Currently, flat panel display devices have the advantages of high image quality, power saving, compact size and wide application range, and are used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc.

[0003] However, the performance and process performance of current display products need to be improved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel and a method for manufacturing the same, and a display device, so as to improve the performance / process performance of the display device.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, the present application provides a display panel, comprising: a substrate, at least one light-emitting unit, a first encapsulation layer and a protective layer, wherein the light-emitting unit is located on one side of the substrate along the thickness direction; the first encapsulation layer is arranged on a side of the light-emitting unit away from the substrate, the protective layer is located on a side of the first encapsulation layer away from the substrate, the protective layer covers at least part of the first encapsulation layer, and the material of the first encapsulation layer and the material of the protective layer both include inorganic materials.

[0007] Through the above technical solution, the display panel provided in the present application can use a protective layer to protect the first encapsulation layer and the light-emitting unit to avoid damage to the first encapsulation layer and the light-emitting unit during the process after the first encapsulation layer is formed, thereby improving the packaging reliability and avoiding affecting the light-emitting effect.

[0008] Therefore, the display panel provided by the present application can improve the performance of the display device.

[0009] In some embodiments, the inorganic material of the protective layer is different from the inorganic material of the first encapsulation layer. In this way, in the subsequent etching process, due to the etching selectivity, the protective layer and the first encapsulation layer will not be damaged at the same time, which is conducive to improving reliability.

[0010] Optionally, the inorganic material of the protective layer includes one of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes another of silicon nitride, silicon oxide and silicon oxynitride.

[0011] In some embodiments, the light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode stacked in sequence in a direction away from the substrate, and the first encapsulation layer is located on a side of the second electrode away from the substrate.

[0012] In this way, the first encapsulation layer can encapsulate the light-emitting unit.

[0013] In some embodiments, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, and the protective layer includes a first protective portion and a second protective portion, the first protective portion corresponds to the first light-emitting unit and is located on a side of the first light-emitting unit away from the substrate, the second protective portion corresponds to the second light-emitting unit and is located on a side of the second light-emitting unit away from the substrate, and the first protective portion and the second protective portion are spaced apart.

[0014] In this way, the display panel provided in the present application can have a protective layer that can protect the first light-emitting unit and the second light-emitting unit respectively, and can also protect the portion of the first encapsulation layer corresponding to the first light-emitting unit and the second light-emitting unit.

[0015] Optionally, the inorganic material of the first protection portion is different from the inorganic material of the second protection portion.

[0016] Optionally, the inorganic material of the first protection part includes one of silicon nitride, silicon oxide and silicon oxynitride, the inorganic material of the second protection part includes a second of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes a third of silicon nitride, silicon oxide and silicon oxynitride.

[0017] Optionally, the light emitting color of the first light emitting unit is different from the light emitting color of the second light emitting unit.

[0018] Optionally, the first light emitting unit is adjacent to the second light emitting unit.

[0019] In some embodiments, the first encapsulation layer is adjacent to the light emitting unit along the thickness direction of the substrate, and / or the first encapsulation layer is adjacent to the protective layer along the thickness direction of the substrate. In this way, the first encapsulation layer can encapsulate the light emitting unit, and the protective layer can protect the first encapsulation layer and the light emitting unit encapsulated by the first encapsulation layer.

[0020] In some embodiments, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the first encapsulation layer includes a first encapsulation part and a second encapsulation part, the first encapsulation part corresponds to the first light-emitting unit and is located on a side of the first light-emitting unit away from the substrate, the second encapsulation part corresponds to the second light-emitting unit and is located on a side of the second light-emitting unit away from the substrate, and the first encapsulation part and the second encapsulation part are spaced apart.

[0021] In this way, the first encapsulation layer can encapsulate the first light-emitting unit and the second light-emitting unit through the first encapsulation part and the second encapsulation part respectively.

[0022] Optionally, the inorganic material of the first encapsulation part is the same as the inorganic material of the second encapsulation part. In this way, the first encapsulation part and the second encapsulation part can be prepared using the same material, which is conducive to simplifying the process flow.

[0023] Optionally, the light-emitting unit includes a third light-emitting unit, the first encapsulation layer also includes a third encapsulation part, the third encapsulation part corresponds to the third light-emitting unit and is located on a side of the third light-emitting unit away from the substrate, and the display panel also includes a second encapsulation layer, the second encapsulation layer is located on a side of the first encapsulation part and the second encapsulation part away from the substrate, and the second encapsulation layer is adjacent to the third encapsulation part along the thickness direction of the substrate.

[0024] In this way, there is no need to provide a protective layer between the second packaging layer and the third packaging part, which is beneficial to simplifying the process and reducing the manufacturing cost.

[0025] In some embodiments, the display panel further includes an isolation structure, the isolation structure is located on one side of the substrate along the thickness direction and on the side where the light-emitting unit is located, the isolation structure defines at least one isolation opening, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, the orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the first encapsulation layer on the substrate, and the orthographic projection of at least one isolation opening on the substrate is located within the orthographic projection of the protective layer on the substrate. In this way, the protective layer can protect the portion of the light-emitting unit at the isolation opening, and can also protect the portion of the first encapsulation layer at the isolation opening.

[0026] Optionally, the isolation opening includes a first isolation opening and a second isolation opening, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the orthographic projection of the first light-emitting unit on the substrate is located within the orthographic projection of the corresponding first isolation opening on the substrate, the orthographic projection of the second light-emitting unit on the substrate is located within the orthographic projection of the corresponding second isolation opening on the substrate, the first encapsulation layer includes a first encapsulation portion covering the first isolation opening and a second encapsulation portion covering the second isolation opening, and the protective layer includes a first protective portion covering the first encapsulation portion and a second protective portion covering the second encapsulation portion.

[0027] Optionally, the isolation opening also includes a third isolation opening, the light-emitting unit includes a third light-emitting unit, the orthographic projection of the third light-emitting unit on the substrate is located within the orthographic projection of the corresponding third isolation opening on the substrate, the first encapsulation layer includes a third encapsulation part covering the third isolation opening, and the orthographic projection of the protective layer on the substrate does not overlap with the orthographic projection of the third encapsulation part on the substrate.

[0028] In some embodiments, the display panel provided in the present application also includes a pixel definition layer located on one side of the substrate, the isolation structure is located on the side of the pixel definition layer away from the substrate, the pixel definition layer is provided with a plurality of pixel openings, the light-emitting unit is located in the pixel openings, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation structure on the substrate.

[0029] In a second aspect, the present application provides another display panel, including:

[0030] substrate;

[0031] A plurality of light-emitting units are located on one side of the substrate along the thickness direction;

[0032] A first encapsulation layer is located on a side of the light-emitting unit away from the substrate;

[0033] A protective layer, located on a side of the first encapsulation layer away from the substrate, the protective layer covering at least a portion of the first encapsulation layer;

[0034] Wherein, two protection layers on a side of two different light-emitting units away from the substrate are disconnected.

[0035] In this way, the protective layer can protect two adjacent light-emitting units through the first part and the second part respectively.

[0036] In some embodiments, the material of the first encapsulation layer and the material of the protection layer both include inorganic materials.

[0037] Optionally, the inorganic material of the protection layer is different from the inorganic material of the first encapsulation layer.

[0038] Optionally, the inorganic material of the protective layer includes one of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes another of silicon nitride, silicon oxide and silicon oxynitride.

[0039] In some embodiments, two different light emitting units are disposed adjacent to each other.

[0040] In some embodiments, the light emitting unit includes a first light emitting unit and a second light emitting unit, one of the two different light emitting units is the first light emitting unit, and the other of the two different light emitting units is the second light emitting unit.

[0041] In some embodiments, the protective layer includes a first protective portion and a second protective portion, at least a portion of the orthographic projection of one of the two different light-emitting units on the substrate is located within the orthographic projection of the first protective portion on the substrate, at least a portion of the orthographic projection of the other of the two different light-emitting units on the substrate is located within the orthographic projection of the second protective portion on the substrate, and the orthographic projection of the first protective portion on the substrate is spaced apart from the orthographic projection of the second protective portion on the substrate.

[0042] Optionally, the material of the protective layer includes an inorganic material, and the inorganic material of the first protective portion is different from the inorganic material of the second protective portion.

[0043] Optionally, the inorganic material of the first protection part includes one of silicon nitride, silicon oxide and silicon oxynitride, the inorganic material of the second protection part includes a second of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes a third of silicon nitride, silicon oxide and silicon oxynitride.

[0044] In a third aspect, the present application provides a method for preparing a display panel, comprising:

[0045] providing a substrate;

[0046] Prepare a light-emitting unit on one side of the substrate;

[0047] A first encapsulation layer and a protective layer are prepared on a side of the light emitting unit away from the substrate. The protective layer is located on a side of the first encapsulation layer away from the substrate, and the protective layer covers at least a portion of the first encapsulation layer.

[0048] In this way, the display panel prepared by the preparation method provided in the present application can use the protective layer to protect at least part of the first encapsulation layer, thereby avoiding damage to the first encapsulation layer and the light-emitting unit caused by subsequent processes, thereby improving the packaging reliability and avoiding affecting the light-emitting effect.

[0049] In some embodiments, before preparing the light-emitting unit on one side of the substrate, the preparation method provided by the present application further includes:

[0050] A pixel definition layer is prepared on one side of the substrate, and a pixel opening is formed by patterning;

[0051] An isolation structure is prepared on a side of the pixel definition layer away from the substrate, and an isolation opening is patterned to form, wherein the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate;

[0052] Preparing a light-emitting unit on one side of the substrate includes:

[0053] A light emitting unit is prepared in the pixel opening.

[0054] In some embodiments, preparing a first encapsulation layer and a protective layer on a side of the light-emitting unit away from the substrate includes:

[0055] Prepare a first encapsulation layer on a side of the light-emitting unit away from the substrate;

[0056] A protection layer is formed on a side of the first encapsulation layer away from the substrate.

[0057] Optionally, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, and preparing a first encapsulation layer and a protective layer on a side of the light-emitting unit away from the substrate further includes:

[0058] Prepare a first light-emitting unit on one side of the substrate;

[0059] Prepare a first encapsulation layer on a side of the first light-emitting unit away from the substrate;

[0060] Preparing a protective layer on a side of the first encapsulation layer away from the substrate;

[0061] Prepare a second light-emitting unit on one side of the substrate;

[0062] Prepare a first encapsulation layer on a side of the second light-emitting unit away from the substrate;

[0063] Preparing a protective layer on a side of the first encapsulation layer away from the substrate;

[0064] Among them, the first encapsulation layer on the side of the first light-emitting unit away from the substrate is the first encapsulation part, the first encapsulation layer on the side of the second light-emitting unit away from the substrate is the second encapsulation part, the first encapsulation part and the second encapsulation part are arranged at intervals, the protective layer on the side of the first light-emitting unit away from the substrate is the first protection part, the protective layer on the side of the second light-emitting unit away from the substrate is the second protection part, and the first protection part and the second protection part are arranged at intervals.

[0065] In some embodiments, the material of the first encapsulation layer and the material of the protection layer both include inorganic materials.

[0066] Optionally, the inorganic material of the first encapsulation layer is different from the inorganic material of the protection layer.

[0067] Optionally, the inorganic material of the first encapsulation part is the same as the inorganic material of the second encapsulation part, and the inorganic material of the first protection part is different from the inorganic material of the second protection part.

[0068] In some embodiments, the light-emitting unit includes a third light-emitting unit, and the preparation method further includes:

[0069] After preparing the second protection part, preparing the third light-emitting unit;

[0070] Prepare a first encapsulation layer on a side of the third light-emitting unit away from the substrate;

[0071] The first encapsulation layer on the side of the third light-emitting unit away from the substrate is a third encapsulation portion, and the orthographic projection of the protection layer on the substrate does not overlap with the orthographic projection of the third encapsulation portion on the substrate.

[0072] Optionally, the material of the third encapsulation part includes an inorganic material, and the inorganic material of the third encapsulation part is the same as the inorganic material of the first encapsulation part or the inorganic material of the second encapsulation part.

[0073] In some embodiments, the preparation method provided by the present application further comprises:

[0074] Prepare a second encapsulation layer on a side of the protective layer away from the substrate and a side of the third encapsulation portion away from the substrate;

[0075] Prepare a third encapsulation layer on a side of the second encapsulation layer away from the substrate;

[0076] Preferably, the second encapsulation layer comprises an organic material, and the third encapsulation layer comprises an inorganic material.

[0077] In a fourth aspect, the present application provides a display panel, which is manufactured by any of the manufacturing methods described above. The display panel provided by the present application has the same technical effects as the above manufacturing method, which will not be described in detail here.

[0078] In a fifth aspect, the present application provides a display device, which includes the display panel of any of the above embodiments. The display device provided by the present application has the same technical effects as the above display panel, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0080] Figure 1 One of the structural schematic diagrams of the display panel processing process provided in the embodiment of the present application;

[0081] Figure 2 The second structural schematic diagram of the display panel during processing provided by the embodiment of the present application;

[0082] Figure 3 The third structural diagram of the display panel processing process provided by the embodiment of the present application;

[0083] Figure 4 The fourth structural diagram of the display panel during processing provided by the embodiment of the present application;

[0084] Figure 5 The fifth structural diagram of the display panel processing process provided by the embodiment of the present application;

[0085] Figure 6 The sixth structural diagram of the display panel processing process provided by the embodiment of the present application;

[0086] Figure 7 The seventh structural diagram of the display panel processing process provided by the embodiment of the present application;

[0087] Figure 8 The eighth structural diagram of the display panel processing process provided by the embodiment of the present application;

[0088] Fig. 9 The ninth structural diagram of the display panel processing process provided by the embodiment of the present application;

[0089] Fig.10 One of the structural schematic diagrams of the display panel provided in the embodiment of the present application;

[0090] Fig.11 The second structural schematic diagram of the display panel provided in the embodiment of the present application;

[0091] Fig.12 The third structural diagram of the display panel provided in the embodiment of the present application;

[0092] Fig.13 A fourth structural schematic diagram of a display panel provided in an embodiment of the present application;

[0093] Fig.14 A fifth structural diagram of a display panel provided in an embodiment of the present application;

[0094] Fig.15 The sixth structural diagram of the display panel provided in the embodiment of the present application;

[0095] Fig.16 The tenth structural diagram of the display panel during processing provided by the embodiment of the present application;

[0096] Fig.17 The eleventh structural diagram of the display panel processing process provided by the embodiment of the present application;

[0097] Fig.18 The twelfth structural diagram of the display panel processing process provided by the embodiment of the present application;

[0098] Fig.19 The thirteenth structural diagram of the display panel processing process provided in the embodiment of the present application;

[0099] Fig. 20 The fourteenth structural diagram of the display panel processing process provided in the embodiment of the present application;

[0100] Fig.21 A schematic diagram of the preparation method provided in the embodiment of the present application;

[0101] Fig. 22 A schematic diagram of the preparation method provided in the embodiment of the present application;

[0102] Fig.23 A schematic diagram of the preparation method provided in the embodiment of the present application;

[0103] Fig.24 A schematic diagram of the preparation method provided in the embodiment of the present application;

[0104] Fig.25 A schematic diagram of the preparation method provided in the embodiment of the present application;

[0105] Fig.26 A schematic diagram of the preparation method provided in the examples of the present application.

[0106] Among them, the reference numerals in the figure are:

[0107] 10-substrate; 11-first isolation opening; 12-second isolation opening; 13-third isolation opening; 20-pixel definition layer; 30-isolation structure; 40-light-emitting layer; 41-first light-emitting layer; 42-second light-emitting layer; 43-third light-emitting layer; 44-first electrode; 45-second electrode; 50-first encapsulation layer; 51-first encapsulation part; 52-second encapsulation part; 53-third encapsulation part; 60-second encapsulation layer; 70-etching solution; 71-etching path; 80-protective layer; 81-first protective part; 82-second protective part. DETAILED DESCRIPTION

[0108] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0109] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0110] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0111] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0112] An embodiment of the present application provides a display device, which can be an electronic product such as a mobile phone, a television, a tablet computer, a laptop computer, a desktop computer, a vehicle-mounted display terminal, a wearable device, a human-computer interaction terminal device, etc.

[0113] The display device includes a display panel, and the display panel may include a display panel and other film layers supported by the display panel. The other film layers may include a polarizing film, an optically clear adhesive (OCA), and the like.

[0114] See also Figure 1 A display panel provided in an embodiment of the present application includes a substrate 10, a pixel definition layer 20 (Pixel Defined Layer, PDL) and a first electrode 44 arranged on one side of the substrate 10 in the thickness direction, the pixel definition layer 20 is provided with a pixel opening corresponding to the first electrode 44, and the orthographic projection of the pixel opening on the substrate 10 is located within the orthographic projection of the first electrode 44 on the substrate 10. The display panel also includes an isolation structure 30 and a display function layer arranged on the pixel definition layer 20, the isolation structure 30 defines at least one isolation opening, the display function layer includes at least one light-emitting unit, the light-emitting unit is at least located in the corresponding isolation opening, the orthographic projection of the light-emitting unit on the substrate 10 is located within the orthographic projection of the corresponding isolation opening on the substrate 10, and the light-emitting unit includes a first electrode 44, a light-emitting layer 40, and a second electrode 45 which are sequentially stacked in a direction away from the substrate 10.

[0115] The composition, preparation, etc. of the isolation structure 30 are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN 117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0116] The display panel also includes a driving circuit (not shown) disposed on the substrate 10 , which can be electrically connected to the first electrode 44 (eg, anode) and the second electrode 45 (eg, cathode) of the light-emitting unit to enable the light-emitting layer 40 to emit light.

[0117] Exemplarily, there are multiple light-emitting units, and the multiple light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. That is, some of the light-emitting units in the multiple light-emitting units are first light-emitting units, some of the light-emitting units are second light-emitting units, and the remaining light-emitting units are third light-emitting units. Among them, the first light-emitting unit includes a first electrode 44, a first light-emitting layer 41, and a second electrode 45, the second light-emitting unit includes a first electrode 44, a second light-emitting layer 42, and a second electrode 45, and the third light-emitting unit includes a first electrode 44, a third light-emitting layer 43, and a second electrode 45. That is, the light-emitting layer 40 of the first light-emitting unit is the first light-emitting layer 41, the light-emitting layer 40 of the second light-emitting unit is the second light-emitting layer 42, and the light-emitting layer 40 of the third light-emitting unit is the third light-emitting layer 43.

[0118] The first light-emitting layer 41 , the second light-emitting layer 42 , and the third light-emitting layer 43 can emit light of different colors.

[0119] Exemplarily, the first light-emitting layer 41 can emit blue light, that is, the first light-emitting layer 41 corresponds to B pixels, the second light-emitting layer 42 can emit green light, that is, the second light-emitting layer 42 corresponds to G pixels, and the third light-emitting layer 43 can emit red light, that is, the second light-emitting layer 42 corresponds to R pixels.

[0120] Exemplarily, the plurality of isolation openings include a first isolation opening 11 , a second isolation opening 12 and a third isolation opening 13 . That is, some of the plurality of isolation openings are first isolation openings 11 , some are second isolation openings 12 , and the rest are third isolation openings 13 .

[0121] The display panel further includes a first encapsulation layer 50 , which is disposed on a side of the display function layer away from the substrate 10 .

[0122] When the display panel is processed, the first light emitting unit, the second light emitting unit and the third light emitting unit are processed and formed in sequence. The processing process of the display panel is described below.

[0123] Please also read Figure 2 and Figure 3 , a first light-emitting material, a cathode material and a packaging material are evaporated on a substrate 10 having an isolation structure 30, and then the substrate 10 is etched to remove the first light-emitting material and the cathode material outside the first opening, and to remove the packaging material outside the first packaging area, to obtain a first light-emitting unit and a first packaging layer 50 that encapsulates the first light-emitting unit (a first packaging portion 51).

[0124] Please also read Figure 4 and Figure 5, evaporate a second light-emitting material, a cathode material and a packaging material on the substrate 10, and then etch the substrate 10 to remove the second light-emitting material and the cathode material outside the second opening, and remove the packaging material outside the second packaging area, to obtain a second light-emitting unit and a portion of the first packaging layer 50 that encapsulates the second light-emitting unit (second packaging portion 52).

[0125] Please also read Figure 1 and Figure 6 , evaporate a third light-emitting material, a cathode material and a packaging material on the substrate 10, and then etch the substrate 10 to remove the third light-emitting material and the cathode material outside the third opening, and remove the packaging material outside the third packaging area, so as to obtain a third light-emitting unit and a part of the first packaging layer 50 that encapsulates the third light-emitting unit (third packaging part 53).

[0126] See also Figure 7 , ink jet printing (Ink Jet Print DAM, IJP) is performed on the substrate 10 to obtain a second encapsulation layer 60, so that the second encapsulation layer 60 covers the first encapsulation layer 50 and fills the recessed portion.

[0127] The inventor discovered that please refer to Figure 8 and Fig. 9 In the process of forming the second light-emitting unit and the third light-emitting unit, during the etching process, the etching liquid 70 will damage the first packaging part 51 and the first light-emitting unit, forming an etching path 71 that destroys the first light-emitting unit. This will affect the packaging reliability of the first packaging part 51 and the light-emitting effect of the first light-emitting unit.

[0128] Similarly, during the etching process in the process of forming the third light-emitting unit, the etching solution 70 will damage the second packaging part 52 and the second light-emitting unit, forming an etching path 71 that destroys the second light-emitting unit. This will affect the packaging reliability of the second packaging part 52 and the light-emitting effect of the second light-emitting unit.

[0129] That is to say, the reliability and light-emitting effect of the display panel will be affected during processing, thereby affecting the performance of the display device.

[0130] To solve the above technical problems, please refer to Fig.10 and Fig.11 , a display panel provided in an embodiment of the present application is now further described.

[0131] Compared with the above display panel, the display panel provided in the embodiment of the present application further includes a protective layer 80 , which is located on a side of the first encapsulation layer 50 away from the substrate 10 , and covers at least a portion of the first encapsulation layer 50 .

[0132] The material of the first encapsulation layer 50 and the material of the protective layer 80 both include inorganic materials. Optionally, both the first encapsulation layer 50 and the protective layer 80 can be inorganic layers.

[0133] Optionally, the first encapsulation layer 50 is adjacent to the light emitting unit along the thickness direction of the substrate 10. Optionally, the protective layer 80 is adjacent to the first encapsulation layer 50 along the thickness direction of the substrate 10. In this way, the first encapsulation layer 50 can encapsulate the light emitting unit, and the protective layer 80 can protect the first encapsulation layer 50 and the light emitting unit encapsulated by the first encapsulation layer 50.

[0134] In this way, the protective layer 80 can protect the first encapsulation layer 50 and the light-emitting unit encapsulated by the first encapsulation layer 50, avoiding damage to the first encapsulation layer 50 and the light-emitting unit encapsulated by the first encapsulation layer 50 during the process after the first encapsulation layer 50 is formed, thereby improving the packaging reliability and avoiding affecting the light-emitting effect.

[0135] Therefore, the display panel provided by the present application can improve the performance of the display device.

[0136] The display panel provided in the embodiment of the present application further includes a second encapsulation layer 60, which is disposed on a side of the first encapsulation layer 50 away from the substrate 10 and is used to cover the first encapsulation layer 50 and fill the recess. The protective layer 80 is located between the first encapsulation layer 50 and the second encapsulation layer 60.

[0137] Optionally, the inorganic material of the protective layer 80 is different from the inorganic material of the first encapsulation layer 50. Exemplarily, the protective layer 80 and the first encapsulation layer 50 are made of different inorganic materials. It is understandable that due to the etching selectivity, the selected material can be etched in the etching process. In this way, in the subsequent etching process, due to the etching selectivity, the etching solution 70 will not damage the protective layer 80 and the first encapsulation layer 50 at the same time, which is conducive to improving reliability.

[0138] Optionally, the inorganic material of the protection layer 80 includes one of silicon nitride (SiN), silicon oxide (SiO) and silicon oxynitride (SiON), and the inorganic material of the first encapsulation layer 50 includes another of silicon nitride, silicon oxide and silicon oxynitride.

[0139] Exemplarily, the inorganic material of the protective layer 80 includes silicon nitride, and the inorganic material of the first encapsulation layer 50 includes silicon oxide. Exemplarily, the inorganic material of the protective layer 80 includes silicon nitride, and the inorganic material of the first encapsulation layer 50 includes silicon oxynitride. Exemplarily, the inorganic material of the protective layer 80 includes silicon oxide, and the inorganic material of the first encapsulation layer 50 includes silicon oxynitride. Exemplarily, the inorganic material of the protective layer 80 includes silicon oxide, and the inorganic material of the first encapsulation layer 50 includes silicon oxynitride. Exemplarily, the inorganic material of the protective layer 80 includes silicon oxynitride, and the inorganic material of the first encapsulation layer 50 includes silicon nitride. Exemplarily, the inorganic material of the protective layer 80 includes silicon oxynitride, and the inorganic material of the first encapsulation layer 50 includes silicon nitride. Exemplarily, the inorganic material of the protective layer 80 includes silicon oxynitride, and the inorganic material of the first encapsulation layer 50 includes silicon nitride.

[0140] In some embodiments, the display panel provided by the embodiments of the present application further includes a third encapsulation layer, which is located on a side of the second encapsulation layer 60 facing away from the substrate 10 and covers the second encapsulation layer 60 .

[0141] In some embodiments, the first encapsulation layer 50 is located on a side of the second electrode 45 away from the substrate 10 , and thus the first encapsulation layer 50 can encapsulate the second electrode 45 of the light emitting unit.

[0142] Please also read Fig.10 , Fig.11 , Fig.12 and Fig.13 It should be noted that the display panel provided in the embodiment of the present application can be applicable to a display panel having an isolation structure 30 , and can also be applicable to a display panel not having an isolation structure 30 .

[0143] In the case where the display panel provided in the embodiment of the present application has an isolation structure 30, the isolation structure 30 is located on one side of the substrate 10 along the thickness direction and on the side where the light-emitting unit is located, the first encapsulation layer 50 covers the isolation opening, and the protective layer 80 covers at least one isolation opening, or the protective layer 80 covers at least part of the multiple isolation openings. In other words, the orthographic projection of the isolation opening on the substrate 10 is located within the orthographic projection of the first encapsulation layer 50 on the substrate 10, and the orthographic projection of at least one isolation opening on the substrate 10 is located within the orthographic projection of the protective layer 80 on the substrate 10. In this way, the protective layer 80 can protect the part of the light-emitting unit at the isolation opening, and can also protect the part of the first encapsulation layer 50 at the isolation opening.

[0144] In some embodiments, the protection layer 80 includes a first protection portion 81, the first protection portion 81 corresponds to the first light emitting unit, and the first protection portion 81 is located on a side of the first light emitting unit away from the substrate 10. The orthographic projection of the first isolation opening 11 on the substrate 10 is located within the orthographic projection of the first protection portion 81 on the substrate 10.

[0145] The first protection portion 81 can cover the portion of the first encapsulation layer 50 at the first isolation opening 11 (the first encapsulation portion 51) and the light-emitting unit (the first light-emitting unit) corresponding to the first isolation opening 11. It can be understood that the orthographic projection of the first light-emitting unit on the substrate 10 is located within the orthographic projection of the first isolation opening 11 on the substrate 10. In other words, the orthographic projection of the first encapsulation portion 51 and the first light-emitting unit on the substrate 10 is located within the orthographic projection of the first protection portion 81 on the substrate 10. In this way, the first protection portion 81 can protect the portion of the first encapsulation layer 50 at the first isolation opening 11 and the light-emitting unit corresponding to the first isolation opening 11.

[0146] Exemplarily, the first encapsulation layer 50 includes a first encapsulation portion 51, and an orthographic projection of the first protection portion 81 on the substrate 10 coincides with an orthographic projection of the first encapsulation portion 51 on the substrate 10. The first encapsulation portion 51 may encapsulate the first light emitting unit.

[0147] Exemplarily, the orthographic projection of the first protection portion 81 on the substrate 10 is located within the orthographic projection of the first encapsulation portion 51 on the substrate 10 .

[0148] It can be understood that the first protection portion 81 is located on the side of the first packaging portion 51 away from the substrate 10. When the boundary of the first protection portion 81 exceeds the boundary of the first packaging portion 51, it is necessary to remove part of the first packaging portion 51 facing the substrate 10, which increases the process difficulty.

[0149] Therefore, the display panel of the embodiment of the present application makes the boundary of the first protection portion 81 not exceed the boundary of the first packaging portion 51. On the one hand, the first protection portion 81 can protect the first packaging portion 51, and on the other hand, the process difficulty can be reduced.

[0150] Optionally, the protection layer 80 further includes a second protection portion 82 , which corresponds to the second light emitting unit and is located on a side of the second light emitting unit away from the substrate 10 , and the first protection portion 81 and the second protection portion 82 are spaced apart.

[0151] In this way, the display panel provided in the present application can protect the first light-emitting unit and the second light-emitting unit respectively through the protective layer 80, and can also protect the part of the first encapsulation layer 50 corresponding to the first light-emitting unit and the second light-emitting unit.

[0152] Optionally, the orthographic projection of the second isolation opening 12 on the substrate 10 is located within the orthographic projection of the second protection portion 82 on the substrate 10 .

[0153] Among them, the second protection portion 82 can cover the portion of the first encapsulation layer 50 at the second isolation opening 12 (the second encapsulation portion 52) and the light-emitting unit corresponding to the second isolation opening 12 (the second light-emitting unit). It can be understood that the orthographic projection of the second light-emitting unit on the substrate 10 is located within the orthographic projection of the corresponding second isolation opening 12 on the substrate 10. In other words, the orthographic projection of the second encapsulation portion 52 and the second light-emitting unit on the substrate 10 is located within the orthographic projection of the second protection portion 82 on the substrate 10. In this way, the second protection portion 82 can protect the portion of the first encapsulation layer 50 at the second isolation opening 12 and the light-emitting unit corresponding to the second isolation opening 12.

[0154] Exemplarily, the first encapsulation layer 50 includes a second encapsulation portion 52, and an orthographic projection of the second protection portion 82 on the substrate 10 coincides with an orthographic projection of the second encapsulation portion 52 on the substrate 10. The second encapsulation portion 52 may encapsulate the second light emitting unit.

[0155] Exemplarily, the orthographic projection of the second protection portion 82 on the substrate 10 is located within the orthographic projection of the second encapsulation portion 52 on the substrate 10 .

[0156] It can be understood that the second protection portion 82 is located on the side of the second packaging portion 52 away from the substrate 10. When the boundary of the second protection portion 82 exceeds the boundary of the second packaging portion 52, it is necessary to remove part of the second packaging portion 52 facing the substrate 10, which increases the process difficulty.

[0157] Therefore, the display panel of the embodiment of the present application makes the boundary of the second protection portion 82 not exceed the boundary of the second packaging portion 52. On the one hand, the second protection portion 82 can protect the second packaging portion 52, and on the other hand, the process difficulty can be reduced.

[0158] Optionally, the inorganic material of the first encapsulation part 51 is the same as the inorganic material of the second encapsulation part 52. In this way, the first encapsulation part 51 and the second encapsulation part 52 can be prepared using the same material, which is conducive to simplifying the process.

[0159] Optionally, the first light emitting unit and the second light emitting unit are arranged adjacent to each other.

[0160] Please also read Fig.14 and 15 Of course, the first light emitting unit and the second light emitting unit may also be arranged at intervals. That is, the third light emitting unit may be located between the first light emitting unit and the second light emitting unit.

[0161] In some embodiments, the inorganic material of the first protection portion 81 is different from the inorganic material of the second protection portion 82. In this way, when preparing the second protection portion 82, due to the etching selectivity, the etching solution 70 used to prepare the second protection portion 82 will not damage the first protection portion 81, thereby facilitating reliability improvement.

[0162] It can be understood that the inorganic material of the first protection part 81 can be one of silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON), the inorganic material of the second protection part 82 can be the second of silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON), and the inorganic material of the first encapsulation layer 50 can be the third of silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON).

[0163] Exemplarily, the inorganic material of the first protection portion 81 may be silicon oxide (SiO), the inorganic material of the second protection portion 82 may be silicon nitride (SiN), and the inorganic material of the first encapsulation layer 50 may be silicon oxynitride (SiON).

[0164] Exemplarily, the inorganic material of the first protection portion 81 may be silicon oxide (SiO), the inorganic material of the second protection portion 82 may be silicon oxynitride (SiON), and the inorganic material of the first encapsulation layer 50 may be silicon nitride (SiN).

[0165] Exemplarily, the inorganic material of the first protection portion 81 may be silicon nitride (SiN), the inorganic material of the second protection portion 82 may be silicon oxide (SiO), and the inorganic material of the first encapsulation layer 50 may be silicon oxynitride (SiON).

[0166] Exemplarily, the inorganic material of the first protection portion 81 may be silicon nitride (SiN), the inorganic material of the second protection portion 82 may be silicon oxynitride (SiON), and the inorganic material of the first encapsulation layer 50 may be silicon oxide (SiO).

[0167] Exemplarily, the inorganic material of the first protection portion 81 may be silicon oxynitride (SiON), the inorganic material of the second protection portion 82 may be silicon nitride (SiN), and the inorganic material of the first encapsulation layer 50 may be silicon oxide (SiO).

[0168] Exemplarily, the inorganic material of the first protection portion 81 may be silicon oxynitride (SiON), the inorganic material of the second protection portion 82 may be silicon oxide (SiO), and the inorganic material of the first encapsulation layer 50 may be silicon nitride (SiN).

[0169] Optionally, the first encapsulation layer 50 further includes a third encapsulation portion 53, the third encapsulation portion 53 covers the third isolation opening 13, and the orthographic projection of the third isolation opening 13 on the substrate 10 is located within the orthographic projection of the third encapsulation portion 53 on the substrate 10. The third encapsulation portion 53 corresponds to the third light-emitting unit, and the orthographic projection of the third light-emitting unit on the substrate 10 is located within the orthographic projection of the third encapsulation portion 53 on the substrate 10. The third encapsulation portion 53 is located on the side of the third light-emitting unit away from the substrate 10, and the second encapsulation layer 60 is adjacent to the third encapsulation portion 53 along the thickness direction of the substrate 10. In this way, there is no need to set a protective layer 80 between the second encapsulation layer 60 and the third encapsulation portion 53, which is conducive to simplifying the process flow and reducing manufacturing costs.

[0170] Exemplarily, the orthographic projection of the protection layer 80 on the substrate 10 does not overlap with the orthographic projection of the third encapsulation portion 53 on the substrate 10. In other words, the orthographic projection of the protection layer 80 on the substrate 10 is spaced apart from the orthographic projection of the third encapsulation portion 53 on the substrate 10.

[0171] Optionally, the display panel provided in the embodiment of the present application further includes a pixel definition layer 20 located on one side of the substrate 10, the isolation structure 30 is located on the side of the pixel definition layer 20 away from the substrate 10, the pixel definition layer 20 is provided with a plurality of pixel openings, the light-emitting unit is located in the pixel openings, and the orthographic projection of the pixel opening on the substrate 10 is located in the orthographic projection of the isolation structure 30 on the substrate. In this way, the light-emitting unit can be formed on the basis of the pixel openings.

[0172] The embodiment of the present application also provides another display panel. The display panel provided by the embodiment of the present application is different from the display panel of the above embodiment in that two protective layers 80 on the side away from the substrate 10 of two different light-emitting units are disconnected.

[0173] Optionally, two different light-emitting units are arranged adjacent to each other.

[0174] Optionally, one of the two different light-emitting units is a first light-emitting unit, and the other of the two different light-emitting units is a second light-emitting unit.

[0175] Optionally, the protective layer 80 includes a first protective portion 81 and a second protective portion 82. Exemplarily, the protective layer 80 includes two adjacent and spaced-apart portions, the first portion of the protective layer 80 is the first protective portion 81, and the second portion of the protective layer 80 is the second protective portion 82. In this way, the protective layer 80 can protect two adjacent light-emitting units through the first protective portion 81 and the second protective portion 82, respectively.

[0176] Optionally, the materials of the first protecting portion 81 and the second protecting portion 82 both include inorganic materials, and the inorganic materials of the first protecting portion 81 and the second protecting portion 82 are different.

[0177] The present application also provides a method for preparing a display panel. Figures 10 to 25 A method for manufacturing a display panel is exemplified.

[0178] Please also read Fig.10 , Fig.11 , Fig.12 , Fig.13 , Fig.14 , Fig.15 as well as Fig.21 The method for preparing a display panel provided in the embodiment of the present application comprises the following steps:

[0179] S1, providing a substrate 10;

[0180] S2, preparing a light-emitting unit on one side of the substrate 10;

[0181] S3 , preparing a first encapsulation layer 50 and a protective layer 80 on a side of the light emitting unit away from the substrate 10 , wherein the protective layer 80 is located on a side of the first encapsulation layer 50 away from the substrate 10 , and covers at least a portion of the first encapsulation layer 50 .

[0182] The display panel prepared by the preparation method provided in the embodiment of the present application can utilize the protective layer 80 to protect at least a portion of the first encapsulation layer 50, thereby preventing subsequent processes from causing damage to the first encapsulation layer 50 and the light-emitting unit, thereby improving the packaging reliability and avoiding affecting the light-emitting effect.

[0183] The display panel prepared by the preparation method provided in the present application may further utilize the second encapsulation layer 60 to cover the first encapsulation layer 50 and fill the recessed portion.

[0184] In some embodiments, the preparation method provided in the embodiments of the present application further comprises the steps of:

[0185] S4, preparing a second encapsulation layer 60 on the side of the first encapsulation layer 50 and the protective layer 80 away from the substrate 10. Optionally, the substrate 10 is subjected to inkjet printing (Ink Jet Print DAM, IJP) to obtain the second encapsulation layer 60.

[0186] In some embodiments, the preparation method provided in the embodiments of the present application further comprises the steps of:

[0187] S5, preparing a third encapsulation layer on a side of the second encapsulation layer 60 away from the substrate 10. Optionally, the material of the third encapsulation layer includes an inorganic material.

[0188] Please also read Fig.12 , Fig.13 , Fig.15 as well as Fig. 22In some embodiments, in step S2, before preparing the light-emitting unit on one side of the substrate 10, the preparation method provided by the present application further includes:

[0189] S11, preparing a pixel definition layer 20 on one side of the substrate 10, and patterning to form a pixel opening;

[0190] S12 , preparing an isolation structure 30 on a side of the pixel definition layer 20 away from the substrate 10 , and patterning to form an isolation opening, wherein the orthographic projection of the pixel opening on the substrate 10 is located within the orthographic projection of the isolation opening on the substrate 10 .

[0191] It is understandable that in some other embodiments, after the isolation structure 30 is prepared on the side of the pixel definition layer 20 away from the substrate 10 , the pixel opening is patterned on the basis of the pixel definition layer 20 .

[0192] Optionally, in step S2, preparing a light-emitting unit on one side of the substrate 10 includes:

[0193] A light emitting unit is prepared in the pixel opening.

[0194] In this way, the preparation method provided in this application can prepare Fig.10 , Fig.11 or Fig.14 The display panel shown.

[0195] Please also read Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 as well as Fig.23 In some embodiments, in step S3, preparing the first encapsulation layer 50 and the protective layer 80 on the side of the light emitting unit away from the substrate 10 includes:

[0196] S31, preparing a first encapsulation layer 50 on a side of the light-emitting unit away from the substrate 10;

[0197] S32 , preparing a protection layer 80 on a side of the first encapsulation layer 50 away from the substrate 10 .

[0198] Please also read Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 as well as Fig.24 In some other embodiments, in step S3, preparing the first encapsulation layer 50 and the protective layer 80 on the side of the light emitting unit away from the substrate 10 includes:

[0199] S31, sequentially preparing a first packaging material and a first protective material on one side of the substrate 10;

[0200] S32, removing the first packaging material and the first protective material outside the first packaging area, the light-emitting unit includes a first light-emitting unit, and the light-emitting layer 40 (first light-emitting layer 41) and the second electrode 45 of the first light-emitting unit are projected on the substrate 10 within the first packaging area.

[0201] In some embodiments, the first packaging material and the first protective material both include inorganic materials. In this way, the material of the first packaging part 51 and the material of the protective layer 80 both include inorganic materials, and the protective layer 80 can protect the first packaging part 51 .

[0202] Optionally, the inorganic material of the first encapsulation material is different from the inorganic material of the first protective material. In this way, the inorganic material of the first encapsulation part 51 is different from the inorganic material of the protective layer 80.

[0203] Optionally, in some other embodiments, in step S3, preparing the first encapsulation layer 50 and the protective layer 80 on the side of the light-emitting unit away from the substrate 10 further includes:

[0204] S33, sequentially preparing a second packaging material and a second protective material on one side of the substrate 10;

[0205] S34, removing the second packaging material and the second protective material outside the second packaging area, the light-emitting unit includes a second light-emitting unit, and the light-emitting layer 40 (second light-emitting layer 42) and the second electrode 45 of the second light-emitting unit are projected on the substrate 10 within the second packaging area.

[0206] In some embodiments, the second encapsulation material and the first protection material both include inorganic materials. In this way, the material of the second encapsulation part 52 and the material of the protection layer 80 both include inorganic materials.

[0207] Optionally, the inorganic material of the second encapsulation material is different from the inorganic material of the first protective material. In this way, the inorganic material of the second encapsulation part 52 is different from the inorganic material of the protective layer 80.

[0208] Optionally, in some other embodiments, in step S3, preparing the first encapsulation layer 50 and the protective layer 80 on the side of the light-emitting unit away from the substrate 10 further includes:

[0209] S35, preparing a third packaging material on one side of the substrate 10;

[0210] S36, removing the portion of the third packaging material outside the third packaging area, the light-emitting unit includes a third light-emitting unit, and the orthographic projection of the light-emitting layer 40 (third light-emitting layer 43) and the second electrode 45 of the third light-emitting unit on the substrate 10 is located within the third packaging area.

[0211] In some embodiments, the third encapsulation material is different from the material of the protection layer 80. In this way, the inorganic material of the third encapsulation part 53 is different from the inorganic material of the protection layer 80.

[0212] In this way, the preparation method provided in this application can prepare Fig.13 or Fig.15 The display panel shown.

[0213] Please also read Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 as well as Fig.25 In some embodiments, in step S3, preparing the first encapsulation layer 50 and the protective layer 80 on the side of the light emitting unit away from the substrate 10 includes:

[0214] S31, sequentially preparing a second packaging material and a second protective material on one side of the substrate 10;

[0215] S32, removing the second packaging material and the second protective material outside the second packaging area, the light-emitting unit includes a second light-emitting unit, and the light-emitting layer 40 (second light-emitting layer 42) and the second electrode 45 of the second light-emitting unit are projected on the substrate 10 within the second packaging area.

[0216] In some embodiments, the second encapsulation material and the first protection material both include inorganic materials. In this way, the material of the second encapsulation part 52 and the material of the protection layer 80 both include inorganic materials.

[0217] Optionally, the inorganic material of the second encapsulation material is different from the inorganic material of the first protective material. In this way, the inorganic material of the second encapsulation part 52 is different from the inorganic material of the protective layer 80.

[0218] Optionally, in step S3, preparing the first encapsulation layer 50 and the protective layer 80 on the side of the light-emitting unit away from the substrate 10 further includes:

[0219] S33, sequentially preparing a first packaging material and a first protective material on one side of the substrate 10;

[0220] S34, removing the first packaging material and the first protective material outside the first packaging area, the light-emitting unit includes a first light-emitting unit, and the light-emitting layer 40 (first light-emitting layer 41) and the second electrode 45 of the first light-emitting unit are projected on the substrate 10 within the first packaging area.

[0221] In some embodiments, the first packaging material and the first protective material both include inorganic materials. In this way, the material of the first packaging part 51 and the material of the protective layer 80 both include inorganic materials, and the protective layer 80 can protect the first packaging part 51 .

[0222] Optionally, the inorganic material of the first encapsulation material is different from the inorganic material of the first protective material. In this way, the inorganic material of the first encapsulation part 51 is different from the inorganic material of the protective layer 80.

[0223] Optionally, in step S3, preparing the first encapsulation layer 50 and the protective layer 80 on the side of the light-emitting unit away from the substrate 10 further includes:

[0224] S35, preparing a third packaging material on one side of the substrate 10;

[0225] S36, removing the portion of the third packaging material outside the third packaging area, the light-emitting unit includes a third light-emitting unit, and the orthographic projection of the light-emitting layer 40 (third light-emitting layer 43) and the second electrode 45 of the third light-emitting unit on the substrate 10 is located within the third packaging area.

[0226] In some embodiments, the third encapsulation material is different from the material of the protection layer 80. In this way, the inorganic material of the third encapsulation part 53 is different from the inorganic material of the protection layer 80.

[0227] Please also read Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 as well as Fig.26 In some embodiments, the light emitting unit includes a first light emitting unit and a second light emitting unit, and preparing the first encapsulation layer 50 and the protective layer 80 on a side of the light emitting unit away from the substrate 10 further includes:

[0228] S31, preparing a first light-emitting unit on one side of the substrate 10;

[0229] S32, preparing a first encapsulation layer 50 on a side of the first light-emitting unit away from the substrate 10;

[0230] S33, preparing a protective layer 80 on a side of the first encapsulation layer 50 away from the substrate;

[0231] S34, preparing a second light-emitting unit on one side of the substrate 10;

[0232] S35, preparing a first encapsulation layer 50 on a side of the second light-emitting unit away from the substrate 10;

[0233] S36 , preparing a protection layer 80 on a side of the first encapsulation layer 50 away from the substrate 10 .

[0234] Among them, the first encapsulation layer 50 on the side of the first light-emitting unit away from the substrate 10 is a first encapsulation part 51, the first encapsulation layer 50 on the side of the second light-emitting unit away from the substrate 10 is a second encapsulation part 52, the first encapsulation part 51 and the second encapsulation part 52 are arranged at intervals, the protective layer 80 on the side of the first light-emitting unit away from the substrate 10 is a first protection part 81, the protective layer 80 on the side of the second light-emitting unit away from the substrate 10 is a second protection part 82, and the first protection part 81 and the second protection part 82 are arranged at intervals.

[0235] Optionally, the material of the first encapsulation layer and the material of the protective layer both include inorganic materials. Optionally, the inorganic material of the first encapsulation layer is different from the inorganic material of the protective layer. Optionally, the inorganic material of the first encapsulation part is the same as the inorganic material of the second encapsulation part, and the inorganic material of the first protective part is different from the inorganic material of the second protective part.

[0236] Please also read Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 as well as Fig.26 In some embodiments, the light-emitting unit includes a third light-emitting unit, and the preparation method provided in the embodiment of the present application further includes:

[0237] S36, preparing a third light-emitting unit after preparing the second protection portion 82;

[0238] S37 , preparing a first encapsulation layer 50 on a side of the third light emitting unit away from the substrate 10 .

[0239] The first encapsulation layer 50 on the side of the third light-emitting unit away from the substrate 10 is a third encapsulation portion 53 , and the orthographic projection of the protection layer 80 on the substrate 10 does not overlap with the orthographic projection of the third encapsulation portion 53 on the substrate 10 .

[0240] Optionally, the material of the third encapsulation part 53 includes an inorganic material, and the inorganic material of the third encapsulation part 53 is the same as the inorganic material of the first encapsulation part 51 or the inorganic material of the second encapsulation part 52 .

[0241] In some embodiments, the preparation method provided by the present application further comprises:

[0242] The second encapsulation layer 60 is formed on a side of the protection layer 80 away from the substrate 10 and a side of the third encapsulation portion 53 away from the substrate 10 .

[0243] That is, in step S4 , a second encapsulation layer is prepared on the side of the first encapsulation layer 50 and the protective layer 80 away from the substrate 10 , specifically including: preparing a second encapsulation layer 60 on the side of the protective layer 80 away from the substrate 10 and on the side of the third encapsulation part 53 away from the substrate 10 .

[0244] In this way, the preparation method provided in this application can prepare Fig.13 or Fig.15 The display panel shown.

[0245] It should be noted that some display panels provided in the embodiments of the present application can be manufactured by the manufacturing method of the above embodiment. The display panel provided in the present application has the same technical effect as the above manufacturing method, which will not be described in detail here.

[0246] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; At least one light emitting unit is located on one side of the substrate along the thickness direction; A first encapsulation layer is located on a side of the light-emitting unit away from the substrate; a protective layer, located on a side of at least one of the first encapsulation layers away from the substrate, the protective layer covering at least a portion of the first encapsulation layer; Wherein, the material of the first encapsulation layer and the material of the protective layer both include inorganic materials.

2. The display panel according to claim 1, wherein: The inorganic material of the protective layer is different from the inorganic material of the first encapsulation layer; Preferably, the inorganic material of the protective layer includes one of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes another of silicon nitride, silicon oxide and silicon oxynitride.

3. The display panel according to claim 1, wherein: The light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode which are sequentially stacked in a direction away from the substrate, and the first encapsulation layer is located on a side of the second electrode away from the substrate.

4. The display panel according to claim 1, wherein: The light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the protective layer includes a first protective portion and a second protective portion, the first protective portion corresponds to the first light-emitting unit and is located at a side of the first light-emitting unit away from the substrate, the second protective portion corresponds to the second light-emitting unit and is located at a side of the second light-emitting unit away from the substrate, and the first protective portion and the second protective portion are spaced apart; Preferably, the inorganic material of the first protection portion is different from the inorganic material of the second protection portion; Preferably, the inorganic material of the first protection portion includes one of silicon nitride, silicon oxide and silicon oxynitride, the inorganic material of the second protection portion includes a second of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes a third of silicon nitride, silicon oxide and silicon oxynitride; Preferably, the light emitting color of the first light emitting unit is different from the light emitting color of the second light emitting unit; Preferably, the first light emitting unit is adjacent to the second light emitting unit.

5. The display panel according to claim 1, wherein: The first encapsulation layer is adjacent to the light emitting unit along a thickness direction of the substrate, and / or the first encapsulation layer is adjacent to the protective layer along a thickness direction of the substrate.

6. The display panel according to claim 1, wherein: The light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the first encapsulation layer includes a first encapsulation portion and a second encapsulation portion, the first encapsulation portion corresponds to the first light-emitting unit and is located on a side of the first light-emitting unit away from the substrate, the second encapsulation portion corresponds to the second light-emitting unit and is located on a side of the second light-emitting unit away from the substrate, and the first encapsulation portion is spaced from the second encapsulation portion; Preferably, the inorganic material of the first encapsulation part is the same as the inorganic material of the second encapsulation part; Preferably, the light-emitting unit also includes a third light-emitting unit, the first encapsulation layer also includes a third encapsulation part, the third encapsulation part corresponds to the third light-emitting unit and is located on a side of the third light-emitting unit away from the substrate, the display panel also includes a second encapsulation layer, the second encapsulation layer is located on a side of the first encapsulation part and the second encapsulation part away from the substrate, and the second encapsulation layer is adjacent to the third encapsulation part along the thickness direction of the substrate.

7. The display panel according to claim 1, wherein: The display panel also includes an isolation structure, which is located on one side of the substrate along the thickness direction and on the side where the light-emitting unit is located, and the isolation structure defines at least one isolation opening, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, the orthographic projection of the isolation opening on the substrate is located within the orthographic projection of the first encapsulation layer on the substrate, and at least one of the isolation openings on the substrate is located within the orthographic projection of the protective layer on the substrate.

8. The display panel according to claim 7, wherein: The isolation opening includes a first isolation opening and a second isolation opening, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the orthographic projection of the first light-emitting unit on the substrate is located within the orthographic projection of the corresponding first isolation opening on the substrate, the orthographic projection of the second light-emitting unit on the substrate is located within the orthographic projection of the corresponding second isolation opening on the substrate, the first encapsulation layer includes a first encapsulation portion covering the first isolation opening and a second encapsulation portion covering the second isolation opening, and the protective layer includes a first protective portion covering the first encapsulation portion and a second protective portion covering the second encapsulation portion; Preferably, the isolation opening also includes a third isolation opening, the light-emitting unit includes a third light-emitting unit, the orthographic projection of the third light-emitting unit on the substrate is located within the orthographic projection of the corresponding third isolation opening on the substrate, the first encapsulation layer includes a third encapsulation portion covering the third isolation opening, and the orthographic projection of the protective layer on the substrate does not overlap with the orthographic projection of the third encapsulation portion on the substrate.

9. The display panel according to claim 7, wherein: The display panel also includes a pixel definition layer located on one side of the substrate, the isolation structure is located on a side of the pixel definition layer away from the substrate, the pixel definition layer is provided with a plurality of pixel openings, the light-emitting unit is located in the pixel openings, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation structure on the substrate.

10. A display panel, characterized in that: include: substrate; A plurality of light-emitting units are located on one side of the substrate along the thickness direction; A first encapsulation layer is located on a side of the light-emitting unit away from the substrate; a protective layer, located on a side of the first encapsulation layer away from the substrate, the protective layer covering at least a portion of the first encapsulation layer; Wherein, the two protection layers on the side of two different light-emitting units away from the substrate are disconnected.

11. The display panel according to claim 10, wherein: The material of the first encapsulation layer and the material of the protective layer both include inorganic materials; Preferably, the inorganic material of the protective layer is different from the inorganic material of the first encapsulation layer; Preferably, the inorganic material of the protective layer includes one of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes another of silicon nitride, silicon oxide and silicon oxynitride.

12. The display panel according to claim 10, wherein: Two different light-emitting units are arranged adjacent to each other; Preferably, the light emitting unit includes a first light emitting unit and a second light emitting unit, one of the two different light emitting units is the first light emitting unit, and the other of the two different light emitting units is the second light emitting unit.

13. The display panel according to claim 10, wherein: The protective layer comprises a first protective portion and a second protective portion, at least a portion of an orthographic projection of one of the two different light-emitting units on the substrate is located within the orthographic projection of the first protective portion on the substrate, at least a portion of an orthographic projection of the other of the two different light-emitting units on the substrate is located within the orthographic projection of the second protective portion on the substrate, and the orthographic projection of the first protective portion on the substrate is spaced from the orthographic projection of the second protective portion on the substrate; Preferably, the material of the protective layer includes an inorganic material, and the inorganic material of the first protective portion is different from the inorganic material of the second protective portion; Preferably, the inorganic material of the first protection part includes one of silicon nitride, silicon oxide and silicon oxynitride, the inorganic material of the second protection part includes a second of silicon nitride, silicon oxide and silicon oxynitride, and the inorganic material of the first encapsulation layer includes a third of silicon nitride, silicon oxide and silicon oxynitride.

14. A method for preparing a display panel, characterized in that: include: providing a substrate; Prepare a light-emitting unit on one side of the substrate; A first encapsulation layer and a protective layer are prepared on a side of the light emitting unit away from the substrate. The protective layer is located on a side of the first encapsulation layer away from the substrate, and the protective layer covers at least a portion of the first encapsulation layer.

15. The preparation method according to claim 14, characterized in that: Before preparing the light-emitting unit on one side of the substrate, the preparation method includes: A pixel definition layer is prepared on one side of the substrate, and a pixel opening is formed by patterning; Preparing an isolation structure on a side of the pixel definition layer away from the substrate, and patterning to form an isolation opening, wherein the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate; The step of preparing a light-emitting unit on one side of the substrate comprises: The light emitting unit is prepared in the pixel opening.

16. The preparation method according to claim 14, characterized in that: The step of preparing a first encapsulation layer and a protective layer on a side of the light-emitting unit away from the substrate comprises: Prepare the first encapsulation layer on a side of the light-emitting unit away from the substrate; Preparing the protective layer on a side of the first encapsulation layer away from the substrate; Preferably, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, and the step of preparing a first encapsulation layer and a protective layer on a side of the light-emitting unit away from the substrate further includes: Prepare a first light-emitting unit on one side of the substrate; preparing the first encapsulation layer on a side of the first light-emitting unit away from the substrate; Preparing the protective layer on a side of the first encapsulation layer away from the substrate; Prepare a second light-emitting unit on one side of the substrate; preparing the first encapsulation layer on a side of the second light-emitting unit away from the substrate; Preparing the protective layer on a side of the first encapsulation layer away from the substrate; Among them, the first encapsulation layer on the side of the first light-emitting unit away from the substrate is a first encapsulation part, the first encapsulation layer on the side of the second light-emitting unit away from the substrate is a second encapsulation part, the first encapsulation part and the second encapsulation part are arranged at intervals, the protective layer on the side of the first light-emitting unit away from the substrate is a first protective part, the protective layer on the side of the second light-emitting unit away from the substrate is a second protective part, and the first protective part and the second protective part are arranged at intervals.

17. The preparation method according to claim 16, characterized in that: The material of the first encapsulation layer and the material of the protective layer both include inorganic materials; Preferably, the inorganic material of the first encapsulation layer is different from the inorganic material of the protective layer; Preferably, the inorganic material of the first encapsulation part is the same as the inorganic material of the second encapsulation part, and the inorganic material of the first protection part is different from the inorganic material of the second protection part.

18. The preparation method according to claim 16, characterized in that: The light-emitting unit further includes a third light-emitting unit, and the preparation method further includes: After preparing the second protection part, preparing the third light-emitting unit; Prepare the first encapsulation layer on a side of the third light-emitting unit away from the substrate; The first encapsulation layer on the side of the third light-emitting unit away from the substrate is a third encapsulation portion, and the orthographic projection of the protective layer on the substrate does not overlap with the orthographic projection of the third encapsulation portion on the substrate; Preferably, a material of the third encapsulation part includes an inorganic material, and the inorganic material of the third encapsulation part is the same as the inorganic material of the first encapsulation part or the inorganic material of the second encapsulation part.

19. The preparation method according to claim 18, characterized in that: The preparation method further comprises: preparing a second encapsulation layer on a side of the protective layer away from the substrate and a side of the third encapsulation portion away from the substrate; preparing a third encapsulation layer on a side of the second encapsulation layer away from the substrate; Preferably, the second encapsulation layer comprises an organic material, and the third encapsulation layer comprises an inorganic material.

20. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 13.

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