Connector device

Abstract

A connector device (1) is provided with a circuit board (10) provided with a main ground circuit (12), and a connector (20) provided on the circuit board (10). The connector (20) has a sub-substrate (35), an IC (36) mounted on the sub-substrate (35), and a heat transfer section (a heat sink (61), a metal plate (60), an outer conductor (33), a sub-ground circuit (52), a conductive member (70), and a connector mounting section (21)) that transfers heat of the IC (36) to the main ground circuit (12). According to the structure, the heat of the IC (36) can be transmitted to the main grounding circuit (12) through the heat transmission part, so that the heat of the IC (36) can be easily released.

Description

Technical Field

[0001] The present disclosure relates to a connector arrangement. Background Art

[0002] Patent Document 1 discloses a board connector provided on a board.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-061188 Summary of the invention

[0006] Problems to be solved by the invention

[0007] When an IC (Integrated Circuit) is built into such a connector, heat generation of the IC becomes a problem.

[0008] An object of the present disclosure is to provide a technology for easily releasing heat of an IC built in a connector.

[0009] Means for solving problems

[0010] The connector device disclosed in the present invention comprises: a circuit substrate provided with a main ground circuit; and a connector provided on the circuit substrate, wherein the connector comprises: a sub-substrate; an IC mounted on the sub-substrate; and a heat transfer portion for transferring heat of the IC to the main ground circuit.

[0011] Effects of the Invention

[0012] According to the connector device of the present disclosure, it is possible to easily release heat from an IC built into the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a top view of the connector device (excluding the cover member) according to the first embodiment.

[0014] Figure 2 yes Figure 1 AA line section view.

[0015] Figure 3 yes Figure 1 BB line cross-sectional view.

[0016] Figure 4 This is an explanatory diagram conceptually showing a path for transferring heat from an IC to a shield layer in the first embodiment.

[0017] Figure 5 This is an explanatory diagram conceptually showing a path for transferring heat from an IC to a main ground circuit in the first embodiment.

[0018] Figure 6 This is equivalent to implementation mode 2. Figure 3 .

[0019] Figure 7 This is an exploded perspective view of the circuit board, the cover member, and the mounting member in the second embodiment.

[0020] Figure 8 This is an explanatory diagram conceptually showing a path for transferring heat from an IC to a shield layer and a path for transferring heat from an IC to a main ground circuit in the second embodiment.

[0021] Fig. 9 This is equivalent to implementation mode 3. Figure 3 .

[0022] Fig.10 It is an exploded perspective view of the circuit board and the mounting cover member in the third embodiment.

[0023] Fig.11 This is an explanatory diagram conceptually showing a path for transferring heat from an IC to a shield layer and a path for transferring heat from an IC to a main ground circuit in the third embodiment. DETAILED DESCRIPTION

[0024] [Description of Embodiments of the Present Disclosure]

[0025] First, embodiments of the present disclosure will be described below.

[0026] (1) A connector device disclosed herein includes: a circuit substrate provided with a main ground circuit; and a connector provided on the circuit substrate, the connector including: a sub-substrate; an IC mounted on the sub-substrate; and a heat transfer portion that transfers heat from the IC to the main ground circuit.

[0027] According to this configuration, the heat of the IC can be transferred to the main ground circuit via the heat transfer portion, so that the heat of the IC can be easily released.

[0028] (2) In (1), the sub-substrate and the IC may be arranged on one side of the circuit substrate in the thickness direction. The connector may include a conductive cover member provided so as to cover the sub-substrate and the IC from the one side in the thickness direction. The heat transfer portion may include a cover heat transfer portion for transferring heat from the IC to the cover member, and the heat from the IC is transferred to the main ground circuit via the cover heat transfer portion and the cover member.

[0029] According to this configuration, the heat of the IC can be released to the main ground circuit by the cover member.

[0030] (3) In the above (2), the connector may include a conductive mounting member mounted on the main ground circuit. The cover member may be detachably mounted on the mounting member.

[0031] According to this structure, the heat of the IC can be released to the main ground circuit through the cover heat transfer portion, the cover member, and the mounting member. In addition, the cover member can be attached to and detached from the circuit board.

[0032] (4) In (1), the circuit substrate and the sub-substrate may be arranged in a manner that the board surfaces face each other. Alternatively, a sub-grounding circuit may be provided on the sub-substrate, and the sub-grounding circuit may be arranged in a manner that faces the main grounding circuit provided on the circuit substrate. The IC may be connected to the sub-grounding circuit. A conductive component may be provided between the sub-grounding circuit and the main grounding circuit. Alternatively, the conductive component may enable the sub-grounding circuit to be electrically connected to the main grounding circuit.

[0033] According to this structure, the conductive component can be used to make the sub-ground circuit and the main ground circuit facing each other conduct, so the heat transfer path for transferring the heat of the IC to the main ground circuit can be shortened. The connector device of (4) can be any structure as long as at least a part of the main ground circuit and at least a part of the sub-ground circuit face each other, and any structure can be any structure as long as the conductive component is arranged between the facing parts. That is, the connector device of (4) can be a structure in which the entire main ground circuit and the entire sub-ground circuit face each other, or a structure in which the entire main ground circuit and only a part of the sub-ground circuit face each other, or a structure in which only a part of the main ground circuit and only a part of the sub-ground circuit face each other, or a structure in which only a part of the main ground circuit and only a part of the sub-ground circuit face each other.

[0034] (5) In (4), the connector may include a mounting portion that is mounted on the circuit substrate and holds the sub-substrate. The conductive member may apply force to separate the circuit substrate and the sub-substrate from each other in a direction in which the surfaces of the circuit substrate and the sub-substrate face each other.

[0035] According to this structure, the sub-substrate is held by the mounting portion so as not to be separated from the circuit substrate, and the conductive component is pressed by the main ground circuit of the circuit substrate and the sub-ground circuit of the sub-substrate, so the contact state between the conductive component and the sub-ground circuit and the main ground circuit is easily stabilized.

[0036] (6) In (1), the connector may include a conductive mounting cover component that covers the sub-substrate and the IC and is mounted on the main ground circuit. The heat transfer portion may include a mounting cover heat transfer portion that transfers heat from the IC to the mounting cover component, and the heat from the IC is transferred to the main ground circuit via the mounting cover heat transfer portion and the mounting cover component.

[0037] According to this configuration, the heat of the IC can be released to the main ground circuit by utilizing the mounting cover member.

[0038] (7) In (1), the connector may include an inner conductor and an outer conductor covering the outer circumference of the inner conductor. The outer conductor may be provided on the main ground circuit. The heat transfer portion may include an outer conductor heat transfer portion for transferring heat from the IC to the outer conductor, and the heat from the IC is transferred to the main ground circuit via the outer conductor heat transfer portion and the outer conductor.

[0039] According to this structure, the heat of the IC can be released to the main ground circuit using the outer conductor.

[0040] (8) In any one of (1) to (7) above, the connector may include an outer conductor that can conduct electricity with a shield layer of the shielded wire, and the heat transfer portion may also transfer heat from the IC to the shield layer.

[0041] According to this structure, the heat of the IC can be released not only to the main ground circuit but also to the shield layer of the shielded electric wire.

[0042] (9) In (8) above, the heat transfer portion may include an outer conductor heat transfer portion that transfers heat from the IC to the outer conductor, and the heat from the IC may be transferred to the shield layer via the outer conductor heat transfer portion and the outer conductor.

[0043] According to this structure, the heat of the IC can be released to the shield layer using the outer conductor.

[0044] (10) In the above (9), the outer conductor heat transfer portion may include a metal plate.

[0045] According to this configuration, the heat transfer efficiency of the outer conductor heat transfer portion can be improved.

[0046] (11) In (10), the heat transfer portion for the outer conductor may include: a first contact portion that contacts a surface on the opposite side of the IC to the sub-substrate side; a second contact portion that contacts the outer conductor at a height position different from the contact position of the IC; and a step portion that connects the first contact portion and the second contact portion in a step shape.

[0047] According to this configuration, the IC and the outer conductor can be connected to each other at locations at different heights via the outer conductor heat transfer portion.

[0048] (12) In the above (8), the outer conductor heat transfer portion may be formed of a sub-ground circuit provided on the sub-substrate.

[0049] According to this structure, it is easy to achieve miniaturization of the outer conductor heat transfer portion.

[0050] (13) In the above (12), the sub-ground circuit may include a sub-extension circuit, the outer conductor may include an extension portion that protrudes in an extension direction of the sub-extension circuit as a contact object, and the extension portion may be in contact with the sub-extension circuit.

[0051] According to this structure, the contact area between the outer conductor and the auxiliary ground circuit can be easily increased, so the heat transfer efficiency can be easily improved.

[0052] (14) In the above (13), the outer conductor may include a restricting portion disposed on the side opposite to the protruding portion side with respect to the sub-board.

[0053] According to this configuration, the sub-substrate can be restricted from being separated from the extended portion by the restriction portion, and thus the contact state between the extended portion and the sub-extension circuit can be easily maintained.

[0054] [Details of Embodiments of the Present Disclosure]

[0055] Hereinafter, specific examples of the present disclosure will be described with reference to the drawings. It should be noted that the present invention is not limited to these examples, but is indicated by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0056] <Implementation Method 1>

[0057] (Structure of Connector Device 1)

[0058] Figure 1 A connector device 1 according to a first embodiment is disclosed. The connector device 1 is mounted on a vehicle, for example. Figure 1 , the cover member 23 described later is shown removed (see Figure 2 ) state. The connector device 1 includes a circuit substrate 10 and a connector 20 provided on the circuit substrate 10. Figure 2As shown, the connector 20 is engaged with the other side connector 80. In the present embodiment, the side where the connector 20 is provided relative to the circuit substrate 10 is defined as the upper side. The side where the other side connector 80 is engaged with the connector 20 is defined as the front side. The direction perpendicular to the up-down direction and the front-back direction is defined as the width direction. In the drawings, the upper side, the lower side, the front side, and the rear side are marked as "U", "L", "F", and "B", respectively.

[0059] The circuit substrate 10 is in a plate shape. The thickness direction of the circuit substrate 10 is the vertical direction, which is a direction perpendicular to the plate surface of the circuit substrate 10. Figure 3 As shown, the circuit board 10 includes a board body 11 and a main ground circuit 12. The board body 11 is plate-shaped. The board body 11 is insulating and made of, for example, resin. A mounting surface 13 is formed on the board body 11. The mounting surface 13 is formed on the upper surface of the board body 11.

[0060] like Figure 3 As shown, the main grounding circuit 12 is provided on the circuit substrate 10 (more specifically, the mounting surface 13). The main grounding circuit 12 is exposed on the mounting surface 13 of the circuit substrate 10. The main grounding circuit 12 has an extension circuit 14 extending in the front-rear direction along the mounting surface 13. A plurality of extension circuits 14 are provided at intervals in the width direction.

[0061] like Figure 2 As shown, the connector 20 is a board connector provided on the circuit board 10. The connector 20 includes a mounting connector portion 21 mounted on the circuit board 10, a relay connector portion 22 connected to the mounting connector portion 21, and a cover member 23.

[0062] The mounting connector portion 21 is an example of a "mounting portion". Figure 2 As shown, the mounting connector part 21 is configured as a card edge connector, for example. The relay connector part 22 is detachably connected to the mounting connector part 21. An opening is formed on the front surface of the mounting connector part 21. The relay connector part 22 is connected to the mounting connector part 21 by inserting the relay connector part 22 into the opening from the front.

[0063] like Figure 2 As shown, the relay connector part 22 is detachably connected to the mounting connector part 21. The relay connector part 22 is connected to the mounting connector part 21 and the counterpart connector 80. The relay connector part 22 functions as an adapter. For example, a plurality of relay connector parts 22 are prepared in advance according to the number of devices installed in the vehicle and the communication specifications (for example, communication speed, etc.). In addition, by connecting the relay connector part 22 corresponding to the specifications of the vehicle to be installed to the mounting connector part 21, the connector device 1 can correspond to a plurality of vehicles.

[0064] like Figure 2 As shown, the relay connector portion 22 includes a fitting member 31 , an inner conductor 32 , an outer conductor 33 , a dielectric 34 , a sub-board 35 , an IC 36 , and a relay portion 37 .

[0065] like Figure 2 As shown, the fitting member 31 is fitted with the mating connector 80. The fitting member 31 has insulating properties and is made of, for example, resin. The fitting member 31 includes a square tube-shaped cover 31A and a rear wall 31B covering the rear surface of the cover 31A.

[0066] like Figure 2 As shown, the inner conductor 32 is in a shape extending in the front-to-back direction. A plurality of inner conductors 32 are arranged at intervals in a direction orthogonal to the front-to-back direction. The front end portion of the inner conductor 32 protrudes into the cover portion 31A, and the rear end portion of the inner conductor 32 protrudes to the rear of the rear wall portion 31B. The inner conductor 32 is electrically connected to the core wire 91 of the shielded wire 90 when the connector 20 and the other-side connector 80 are engaged with each other. Specifically, the inner conductor 32 is electrically connected to the other-side inner conductor 81 of the other-side connector 80. The core wire 91 is electrically connected to the other-side inner conductor 81. That is, the inner conductor 32 is electrically connected to the core wire 91 via the other-side inner conductor 81. The inner conductor 32 is electrically connected to the conductive path of the sub-substrate 35 via the relay portion 37.

[0067] like Figure 2 As shown, the outer conductor 33 covers the outer periphery of the inner conductor 32. The outer conductor 33 has a wall portion 40, and the wall portion 40 has a thickness in the front-to-back direction. The wall portion 40 is formed with an insertion hole 41 through which the inner conductor 32 is inserted. The outer conductor 33 has a barrel portion 42 that protrudes from the outer periphery of the insertion hole 41 toward the front in a cylindrical shape. The barrel portion 42 penetrates the rear wall portion 31B of the fitting component 31 and protrudes into the cover portion 31A. The outer conductor 33 is electrically connected to the shielding layer 92 of the shielded wire 90 when the connector 20 and the counterpart connector 80 are fitted with each other. Specifically, the counterpart outer conductor 82 of the counterpart connector 80 is fitted into the barrel portion 42, so that the outer conductor 33 is electrically connected to the counterpart outer conductor 82. The shielding layer 92 is electrically connected to the counterpart outer conductor 82. That is, the outer conductor 33 is electrically connected to the shielding layer 92 via the counterpart outer conductor 82.

[0068] like Figure 2 As shown, the outer conductor 33 has an upper wall portion 43 extending rearward from the upper end side of the wall portion 40. The outer conductor 33 has a bottom wall portion 44 extending rearward from the lower end side of the wall portion 40.

[0069] like Figure 1As shown in FIG. 1 , the outer conductor 33 has a fixing portion 45 extending outward in the width direction. The fixing portion 45 is fixed to the circuit substrate 10 by screws or the like. The outer conductor 33 is provided on the main grounding circuit 12 and is electrically connected to the main grounding circuit 12. The outer conductor 33 is fixed to the circuit substrate 10 by the fixing portion 45, so that the contact state with the main grounding circuit 12 is more stable.

[0070] like Figure 3 As shown in the figure, the outer conductor 33 has an extension portion 46 and a restriction portion 47 extending backward at a position behind the wall portion 40. The extension portion 46 and the restriction portion 47 are arranged at a distance from each other in the vertical direction. The sub-substrate 35 is arranged in the gap between the extension portion 46 and the restriction portion 47. The sub-substrate 35 contacts the extension portion 46 and the restriction portion 47 and is clamped up and down. The extension portion 46 is arranged at a position above the restriction portion 47. The extension portion 46 and the restriction portion 47 are respectively arranged on both sides of the width direction of the outer conductor 33. The sub-substrate 35 is arranged in the gap between the extension portion 46 and the restriction portion 47 on both sides of the width direction of the outer conductor 33.

[0071] like Figure 2 As shown, the dielectric 34 is disposed between the inner conductor 32 and the outer conductor 33 .

[0072] The sub-substrate 35 is in a plate shape. The thickness direction of the sub-substrate 35 is the up-down direction, which is a direction perpendicular to the plate surface of the sub-substrate 35 and is the arrangement direction of the circuit substrate 10 and the sub-substrate 35. Figure 2 As shown, the sub-substrate 35 is a substrate built into the connector 20. The sub-substrate 35 is connected to the mounting connector portion 21 in a detachable manner. The sub-substrate 35 can communicate with the circuit substrate 10 via the mounting connector portion 21. The sub-substrate 35 is arranged above the circuit substrate 10. The sub-substrate 35 is arranged so that the board surfaces of the sub-substrate 35 and the circuit substrate 10 face each other in the vertical direction. The lower surface of the sub-substrate 35 faces the upper surface of the circuit substrate 10. The sub-substrate 35 has a sub-substrate main body 51 and a sub-grounding circuit 52.

[0073] like Figure 3 As shown in FIG. 1 , the sub-substrate body 51 is in the shape of a plate. The sub-substrate body 51 is insulating and is made of, for example, resin. Figure 1 As shown in FIG. 1 , a sub-mounting surface 53 is formed on the sub-substrate main body 51 . The sub-mounting surface 53 is formed on the upper surface of the sub-substrate main body 51 .

[0074] like Figure 1 and Figure 3As shown, the sub-grounding circuit 52 is provided on the sub-substrate 35 (more specifically, the sub-mounting surface 53). The IC 36 (more specifically, the lead of the IC 36) is electrically connected to the sub-grounding circuit 52. The sub-grounding circuit 52 is exposed on the sub-mounting surface 53 of the sub-substrate 35. The sub-grounding circuit 52 has a sub-extension circuit 54 extending in the front-back direction along the sub-mounting surface 53. A plurality of sub-extension circuits 54 are provided at intervals in the width direction. The sub-extension circuits 54 are provided on both the upper and lower surfaces of the sub-substrate 35. The sub-extension circuits 54 on both the upper and lower surfaces are electrically connected via vias 55 penetrating the sub-substrate main body 51 in the plate thickness direction. When the sub-substrate 35 is arranged between the extension portion 46 and the restriction portion 47 of the outer conductor 33, the sub-extension circuit 54 on the upper surface is in contact with the lower surface of the extension portion 46 (more specifically, in surface contact), and the sub-extension circuit 54 on the lower surface is in contact with the upper surface of the restriction portion 47 (more specifically, in surface contact). That is, the IC 36 is electrically connected to the outer conductor 33 via the sub-ground circuit 52 .

[0075] The IC 36 is mounted on the sub-mounting surface 53 (upper surface) of the sub-substrate 35 .

[0076] like Figure 2 As shown, the relay connector part 22 has a metal plate 60 and a heat sink 61. The metal plate 60 is joined to the upper surface of the upper wall part 43 of the outer conductor 33, and is joined to the upper surface of the IC 36 via the heat sink 61. The metal plate 60 and the heat sink 61 constitute: a first contact part 62 that contacts the upper surface of the IC 36 (more specifically, surface contact); a second contact part 63 that contacts the outer conductor 33 at a height position different from the upper surface of the IC 36 (more specifically, surface contact); and a step part 64 that connects the first contact part 62 and the second contact part 63 in a step shape.

[0077] like Figure 3As shown, the relay connector portion 22 has a conductive member 70. The main ground circuit 12 and the sub-ground circuit 52 are arranged to face each other vertically. The conductive member 70 is arranged between the main ground circuit 12 and the sub-ground circuit 52 arranged to face each other, and is electrically connected to the main ground circuit 12 and the sub-ground circuit 52. The conductive member 70 has a contact conductive portion 71 that contacts the sub-ground circuit 52, a biasing member 72 arranged between the contact conductive portion 71 and the main ground circuit 12, and a guide portion 73 that guides the contact conductive portion 71 in the vertical direction. The contact conductive portion 71 is formed with an inclined surface 71A that is inclined so as to descend downward toward the front end. When the inclined surface 71A is pressed from the front by the sub-board 35, the contact conductive portion 71 moves downward. The biasing member 72 is, for example, a spring member, and biases the contact conductive portion 71 in a direction away from the main ground circuit 12. On the other hand, the sub-board 35 is held by the mounting connector portion 21, and the movement in the direction away from the circuit board 10 (more specifically, upward) is restricted. Therefore, the conductive member 70 is pressed against the main ground circuit 12 and the sub-ground circuit 52 .

[0078] like Figure 2 As shown, the cover member 23 covers the sub-board 35 and the IC 36 from above. The cover member 23 is fixed to the circuit board 10 by screws or the like.

[0079] (Function of connector device 1)

[0080] The connector device 1 can release the heat of the IC 36 to the shield layer 92 of the shielded electric wire 90 as follows.

[0081] (Path R1)

[0082] The heat of IC36 is transferred to the outer conductor 33 through the heat sink 61 and the metal plate 60. As described above, the outer conductor 33 is connected to the shielding layer 92. Therefore, the connector device 1 is as shown in FIG. Figure 4 As shown in the path R1 , the heat of the IC 36 can be released to the shield layer 92 via the heat sink 61 , the metal plate 60 , and the outer conductor 33 .

[0083] Furthermore, the connector device 1 can release the heat of the IC 36 to the shield layer 92 using the outer conductor 33 .

[0084] Furthermore, in the path R1 , the heat of the IC 36 is transferred to the outer conductor 33 via the metal plate 60 , so that the heat transfer efficiency can be improved.

[0085] Furthermore, in the path R1, the heat sink 61 is in surface contact with the IC 36, so that the heat transfer efficiency from the IC 36 to the heat sink 61 can be improved. The metal plate 60 is in surface contact with the heat sink 61, so that the heat transfer efficiency from the heat sink 61 to the metal plate 60 can be improved. The metal plate 60 is in surface contact with the outer conductor 33, so that the heat transfer efficiency from the metal plate 60 to the outer conductor 33 can be improved. That is, in the path R1, the heat transfer efficiency from the IC 36 to the outer conductor 33 can be improved.

[0086] Furthermore, the metal plate 60 and the heat sink 61 constitute a first contact portion 62 that contacts (more specifically, contacts with the surface) the upper surface of the IC 36, a second contact portion 63 that contacts (more specifically, contacts with the surface) the outer conductor 33 at a height position different from the upper surface of the IC 36, and a step portion 64 that connects the first contact portion 62 and the second contact portion 63 in a stepped manner. Therefore, the surfaces of the IC 36 and the outer conductor 33 that have different height positions can be connected to each other by the metal plate 60 and the heat sink 61. In addition, the "height position" refers to the position in the up-down direction (the direction orthogonal to the sub-mounting surface 53) based on the sub-mounting surface 53 of the sub-substrate 35.

[0087] (Path R2, R3)

[0088] In addition, the heat of IC36 is transferred to the outer conductor 33 through the sub-extension circuits 54 on the upper and lower surfaces of the sub-substrate 35. As described above, the outer conductor 33 is connected to the shielding layer 92. Therefore, the connector device 1 is Figure 4 As shown in the path R2, the heat of IC36 can be released to the shielding layer 92 via the secondary extension circuit 54 and the outer conductor 33 on the upper surface. Figure 4 As shown in the path R3 , the heat of the IC 36 can be released to the shield layer 92 via the via 55 , the sub-extension circuit 54 on the lower surface, and the outer conductor 33 .

[0089] In the paths R2 and R3 , the connector device 1 can also release the heat of the IC 36 to the shield layer 92 using the outer conductor 33 .

[0090] Furthermore, the connector device 1 can achieve miniaturization of the connector device 1 through the paths R2 and R3 , and can also ensure a heat transfer path from the IC 36 to the outer conductor 33 .

[0091] In addition, the outer conductor 33 has an extension portion 46 that protrudes rearward. The lower surface of the extension portion 46 contacts (more specifically, contacts with the surface) the auxiliary extension circuit 54 extending in the front-rear direction in the path R2. Therefore, the connector device 1 can easily increase the contact area between the outer conductor 33 and the auxiliary ground circuit 52, thereby easily improving the heat transfer efficiency.

[0092] Furthermore, the outer conductor 33 has a restriction portion 47 disposed on the opposite side of the extension portion 46 relative to the sub-substrate 35. According to this structure, the sub-substrate 35 can be restricted from leaving the extension portion 46 by the restriction portion 47, so that the extension portion 46 and the sub-extension circuit 54 are easily maintained in contact. In addition, the restriction portion 47 also protrudes rearward, and the upper surface of the restriction portion 47 is in contact (more specifically, surface contact) with the sub-extension circuit 54 extending in the front-rear direction in the path R3. Therefore, the connector device 1 can easily increase the contact area between the outer conductor 33 and the sub-ground circuit 52 on both sides of the sub-substrate 35, so that the heat transfer efficiency can be easily improved.

[0093] Furthermore, the connector device 1 can dissipate the heat of the IC 36 to the main ground circuit 12 as follows.

[0094] (Path R11)

[0095] As described in the description of the path R1, the heat of the IC 36 is transferred to the outer conductor 33 through the heat sink 61 and the metal plate 60. In addition, the outer conductor 33 is electrically connected to the main ground circuit 12. Therefore, the connector device 1 is Figure 5 As shown in the path R11 , the heat of the IC 36 can be released to the main ground circuit 12 via the heat sink 61 , the metal plate 60 , and the outer conductor 33 .

[0096] Furthermore, the connector device 1 can release the heat of the IC 36 to the main ground circuit 12 using the outer conductor 33 .

[0097] (Path R12, R13)

[0098] As described in the description of the paths R2 and R3, the heat of the IC 36 is transferred to the outer conductor 33 through the sub-extension circuits 54 on the upper and lower surfaces of the sub-substrate 35. In addition, the outer conductor 33 is electrically connected to the main ground circuit 12. Therefore, the connector device 1 is Figure 5 As shown in the path R12, the heat of IC36 can be released to the main ground circuit 12 via the secondary extension circuit 54 and the outer conductor 33 on the upper surface. Figure 5 As shown in the path R13, the heat of IC36 can be released to the main ground circuit 12 through the via 55, the auxiliary extension circuit 54 on the lower surface and the outer conductor 33. In the paths R12 and R13, the connector device 1 can also release the heat of IC36 to the main ground circuit 12 using the outer conductor 33.

[0099] (Path R14)

[0100] In addition, the auxiliary ground circuit 52 is electrically connected to the main ground circuit 12 via the conductive member 70. Figure 5As shown in the path R14 , the heat of the IC 36 can be released to the main ground circuit 12 via the sub ground circuit 52 and the conductive member 70 .

[0101] Furthermore, the connector device 1 can electrically connect the sub-ground circuit 52 and the main ground circuit 12 facing each other by using the conductive member 70 , and thus can shorten the heat transfer path for transferring the heat of the IC 36 to the main ground circuit 12 .

[0102] Furthermore, the sub-substrate 35 is held by the mounting connector portion 21, and the conductive member 70 applies force so as to separate the circuit substrate 10 and the sub-substrate 35 in the direction in which the board surfaces face each other. According to this structure, the sub-substrate 35 is held by the mounting connector portion 21 so as not to be separated from the circuit substrate 10, and the conductive member 70 is pressed by the main grounding circuit 12 of the circuit substrate 10 and the sub-grounding circuit 52 of the sub-substrate 35, so that the contact state of the conductive member 70 and the sub-grounding circuit 52 and the main grounding circuit 12 is easily stabilized. In addition, the "direction in which the board surfaces face each other" is the direction in which the main grounding circuit 12 and the sub-grounding circuit 52 face each other. In addition, the "direction in which the board surfaces face each other" is a direction orthogonal to the direction in which the connector 20 and the mating connector 80 are fitted.

[0103] (Path R15, R16)

[0104] In addition, the connector device 1 is Figure 5 As shown in the paths R15 and R16 , the heat of the IC 36 can be released to the main ground circuit 12 via the mounting connector portion 21 .

[0105] <Implementation Method 2>

[0106] In Embodiment 2, an example of heat dissipation using a cover member is described. In addition, the same reference numerals are attached to the same structures as those in Embodiment 1, and detailed description thereof is omitted.

[0107] (Structure of Connector Device 201)

[0108] exist Figure 6 A connector device 201 according to a second embodiment is disclosed in FIG. The connector device 201 is mounted on a vehicle, for example. The connector device 201 includes a circuit board 10 and a connector 220 provided on the circuit board 10 .

[0109] like Figure 6 As shown, the connector 220 is a board connector provided on the circuit board 10. The connector 220 includes a mounting connector portion 21, a relay connector portion 222 connected to the mounting connector portion 21, a cover member 223, and a mounting member 270.

[0110] like Figure 6As shown, the relay connector portion 222 includes a fitting member 31 , an inner conductor 32 , an outer conductor 33 , a dielectric 34 , a sub-board 35 , an IC 36 , and a relay portion 37 .

[0111] like Figure 6 As shown, the relay connector portion 222 has a heat sink 260 . The heat sink 260 is provided on the upper surface of the IC 36 .

[0112] The cover member 223 is conductive and is, for example, formed as a metal shell. Figure 6 As shown, the cover member 223 covers the sub-substrate 35 and the IC 36. The cover member 223 is fixed to the circuit substrate 10 by screws or the like. The cover member 223 has a top plate portion 223A, a pair of side plate portions 223B and a rear plate portion 223C. The pair of side plate portions 223B are arranged at intervals in the width direction. Both ends of the top plate portion 223A in the width direction are connected to the upper ends of the pair of side plate portions 223B. The rear plate portion 223C is connected to the rear ends of the top plate portion 223A and the pair of side plate portions 223B. The lower surface and the front surface of the cover member 223 are open.

[0113] like Figure 6 As shown, the cover member 223 is arranged in a state where the top plate portion 223A contacts the upper surface of the heat sink 260. In addition, the cover member 223 is arranged in a state where the top plate portion 223A contacts the rear surface of the outer conductor 33. In addition, the cover member 223 is fixed to the circuit board 10 using the mounting member 270.

[0114] like Figure 7 As shown, the main ground circuit 12 includes an extension circuit 14A extending in the front-rear direction and an extension circuit 14B extending in the width direction along the mounting surface 13. The extension circuits 14A and 14B are arranged corresponding to the position of the lower end of the cover member 223. A plurality of mounting members 270 are mounted on the extension circuits 14A and 14B.

[0115] The mounting member 270 is conductive and is made of metal, for example. The mounting member 270 includes: a plate-shaped base portion 271 fixed to the extension circuits 14A and 14B; and a retaining portion 272 extending upward in a cantilevered manner from both sides of the base portion 271 and clamping the cover member 223. The minimum interval of the retaining portion 272 is smaller than the thickness of the pair of side plate portions 223B and smaller than the thickness of the rear plate portion 223C. The cover member 223 is mounted in a manner that the retaining portion 272 is pushed away from the top of the mounting member 270. The cover member 223 can be loaded and unloaded relative to the mounting member 270.

[0116] (Function of the connector device 201)

[0117] The connector device 201 can release the heat of the IC 36 to the shield layer 92 of the shielded electric wire 90 as follows.

[0118] (Path R4)

[0119] The heat of IC36 is transferred to the outer conductor 33 through the heat sink 260 and the cover member 223. The outer conductor 33 is connected to the shielding layer 92. Figure 8 As shown in the path R4, the heat of IC36 can be released to the shield layer 92 via the heat sink 260, the cover member 223 and the outer conductor 33. That is, the connector device 201 can release the heat of IC36 to the shield layer 92 using the cover member 223.

[0120] In addition, the connector device 201 is the same as that in the first embodiment. Figure 4 As shown in the paths R2 and R3 , the heat of the IC 36 can also be released to the shielding layer 92 .

[0121] In addition, the connector device 201 can dissipate the heat of the IC 36 to the main ground circuit 12 as follows.

[0122] (Path R17)

[0123] As described above, the heat of IC36 is transferred to the outer conductor 33 through the heat sink 260 and the cover member 223. The outer conductor 33 is electrically connected to the main ground circuit 12. Figure 8 As shown in the path R17, the heat of IC36 can be released to the main ground circuit 12 via the heat sink 260, the cover member 223 and the outer conductor 33. That is, the connector device 201 can release the heat of IC36 to the main ground circuit 12 using the cover member 223.

[0124] (Path R18)

[0125] Furthermore, the heat of IC36 is transferred to mounting member 270 through heat sink 260 and cover member 223, and then transferred to main ground circuit 12 through mounting member 270. Figure 8 As shown in the path R18, the heat of IC36 can be released to the main ground circuit 12 through the heat sink 260, the cover member 223 and the mounting member 270. That is, the connector device 201 can release the heat of IC36 to the main ground circuit 12 using the cover member 223. Moreover, the cover member 223 can be attached to and detached from the circuit board 10.

[0126] In addition, the connector device 201 is the same as that in the first embodiment. Figure 5 As shown in the paths R12 , R13 , R15 , and R16 , the heat of IC 36 can also be released to the main ground circuit 12 .

[0127] <Implementation Method 3>

[0128] In Embodiment 3, an example of heat dissipation using a mounting cover member mounted on a circuit board will be described. In addition, the same reference numerals are attached to the same structures as those in Embodiment 1, and detailed descriptions thereof will be omitted.

[0129] (Structure of Connector Device 301)

[0130] exist Fig. 9 A connector device 301 according to Embodiment 3 is disclosed in FIG. The connector device 301 is mounted on a vehicle, for example. The connector device 301 includes a circuit board 310 and a connector 320 provided on the circuit board 310 .

[0131] like Fig.10 As shown, the circuit board 310 includes a board body 311 and a main ground circuit 12. A through hole 310A for mounting a mounting cover member 323 described later is formed in the board body 311. The board body 311 is the same as the board body 11 of the first embodiment in other respects.

[0132] like Fig. 9 As shown, the connector 320 is a board connector provided on the circuit board 310. The connector 320 includes a mounting connector portion 21, a relay connector portion 322 connected to the mounting connector portion 21, and a mounting cover member 323.

[0133] like Fig. 9 As shown, the relay connector portion 322 includes a fitting member 31 , an inner conductor 32 , an outer conductor 33 , a dielectric 34 , a sub-board 35 , an IC 36 , and a relay portion 37 .

[0134] like Fig. 9 As shown, the relay connector portion 322 has a heat sink 360 . The heat sink 360 is provided on the upper surface of the IC 36 .

[0135] The mounting cover member 323 is conductive, for example, made of metal. Fig. 9 As shown, the mounting cover component 323 covers the sub-substrate 35 and IC36, and is mounted on the main ground circuit 12 of the circuit substrate 310. The mounting cover component 323 has a top plate portion 323A, a pair of side plate portions 323B, a rear plate portion 323C and a plurality of leg portions 323D. The pair of side plate portions 323B are arranged at intervals in the width direction. The two ends of the top plate portion 323A in the width direction are connected to the upper ends of the pair of side plate portions 323B. The rear plate portion 323C is connected to the rear ends of the top plate portion 323A and the pair of side plate portions 323B. The leg portion 323D protrudes downward from the lower ends of the pair of side plate portions 323B and the rear plate portion 323C. The lower surface and the front surface of the mounting cover component 323 are open.

[0136] like Fig. 9As shown, the mounting cover member 323 has a retaining protrusion 323E. The retaining protrusion 323E protrudes downward from the top plate portion 323A. The retaining protrusion 323E is arranged in a state of contact with the upper end portion of the heat sink 360. In addition, the mounting cover member 323 is arranged in a state where the top plate portion 323A contacts the rear surface of the outer conductor 33.

[0137] like Fig.10 As shown, the through hole 310A is arranged at a position corresponding to the leg portion 323D of the mounting cover member 323. In addition, the through hole 310A is electrically connected to the main ground circuit 12. The mounting cover member 323 is mounted on the circuit board 310 in a state where the leg portion 323D is inserted through the through hole 310A. Thus, the mounting cover member 323 is electrically connected to the main ground circuit 12.

[0138] (Function of the connector device 301)

[0139] The connector device 301 can release the heat of the IC 36 to the shield layer 92 of the shielded electric wire 90 as follows.

[0140] (Path R5)

[0141] The heat of IC36 is transferred to the outer conductor 33 through the heat sink 360 and the mounting cover 323. The outer conductor 33 is connected to the shielding layer 92. Fig.11 As shown in the path R5, the heat of IC36 can be released to the shield layer 92 via the heat sink 360, the mounting cover member 323 and the outer conductor 33. That is, the connector device 301 can release the heat of IC36 to the shield layer 92 by using the mounting cover member 323.

[0142] In addition, the connector device 301 is the same as that in the first embodiment. Figure 4 As shown in the paths R2 and R3 , the heat of the IC 36 can also be released to the shielding layer 92 .

[0143] In addition, the connector device 301 can dissipate the heat of the IC 36 to the main ground circuit 12 as follows.

[0144] (Path R19)

[0145] As described above, the heat of IC36 is transferred to the outer conductor 33 through the heat sink 360 and the mounting cover member 323. The outer conductor 33 is electrically connected to the main ground circuit 12. Fig.11 As shown in the path R19, the heat of IC36 can be released to the main ground circuit 12 via the heat sink 360, the mounting cover member 323 and the outer conductor 33. That is, the connector device 301 can release the heat of IC36 to the main ground circuit 12 by using the mounting cover member 323.

[0146] (Path R20)

[0147] In addition, the mounting cover member 323 is mounted on the main ground circuit 12. Therefore, the connector device 301 is as shown in FIG. Fig.11 As shown in the path R20, the heat of IC36 can be released to the main ground circuit 12 through the heat sink 360 and the mounting cover member 323. That is, the connector device 301 can release the heat of IC36 to the main ground circuit 12 by using the mounting cover member 323 in the path R20 as well.

[0148] In addition, the connector device 301 is the same as that in the first embodiment. Figure 5 As shown in the paths R12 , R13 , R15 , and R16 , the heat of IC 36 can also be released to the main ground circuit 12 .

[0149] [Other embodiments of the present disclosure]

[0150] The embodiments disclosed this time should be considered in all respects as illustrative and non-restrictive.

[0151] (1) In the above-described embodiments, the connector has a structure in which the mounting connector portion and the relay connector portion are separate components. However, the mounting connector portion and the relay connector portion may be integrated into one component.

[0152] (2) In each of the above embodiments, the heat of the IC is released to the shield layer via the outer conductor. However, the heat of the IC may be released without passing through the outer conductor.

[0153] (3) In the above-mentioned embodiments, the extension portion protrudes toward the rear (in the direction in which the mating connector of the other connector is mated with the other connector), and the secondary extension circuit of the object of contact of the extension portion extends in the front-back direction (in the mating direction of the connector and the other connector), but the present invention is not limited to this structure. For example, the extension portion may protrude in the width direction (in the direction orthogonal to the mating direction of the connector and the other connector), and the secondary extension circuit of the object of contact of the extension portion extends in the width direction.

[0154] Description of Reference Numerals

[0155] 1: Connector device

[0156] 10: Circuit board

[0157] 11: Substrate body

[0158] 12: Main grounding circuit

[0159] 13: Mounting surface

[0160] 14: Extension circuit

[0161] 14A: Extension circuit

[0162] 14B: Extension circuit

[0163] 20: Connector

[0164] 21: Install the connector

[0165] 22: Relay connector

[0166] 23: Cover parts

[0167] 31: Fitting parts

[0168] 31A: Cover

[0169] 31B: Rear wall

[0170] 32: Inner conductor

[0171] 33: Outer conductor (heat transfer part)

[0172] 34: Dielectric

[0173] 35: Sub-board

[0174] 36: IC

[0175] 37: Relay Department

[0176] 40: Wall

[0177] 41: Through hole

[0178] 42: Cylinder

[0179] 43: Upper wall

[0180] 44: Bottom wall

[0181] 45: Fixed part

[0182] 46: Extension

[0183] 47: Restriction Department

[0184] 51: Sub-board main body

[0185] 52: Auxiliary ground circuit (heat transfer part, heat transfer part for outer conductor)

[0186] 53: Auxiliary mounting surface

[0187] 54: Auxiliary extension circuit (heat transfer part, heat transfer part for outer conductor)

[0188] 55: Via hole (heat transfer part, heat transfer part for outer conductor)

[0189] 60: Metal plate (heat transfer part, heat transfer part for outer conductor)

[0190] 61: Heat sink (heat transfer part, heat transfer part for outer conductor)

[0191] 62: First contact part

[0192] 63: Second contact part

[0193] 64: Steps

[0194] 70: Conductive parts (heat transfer parts)

[0195] 71: Contact conductive part

[0196] 71A: Inclined surface

[0197] 72: Force-applying components

[0198] 73: Guidance Department

[0199] 80: Connector on the other side

[0200] 81: Inner conductor of the other side

[0201] 82: The outer conductor of the other side

[0202] 90: Shielded wire

[0203] 91: Core wire

[0204] 92: Shielding layer

[0205] 201: Connector device

[0206] 220: Connector

[0207] 222: Relay connector

[0208] 223: Cover member (heat transfer portion, heat transfer portion for outer conductor)

[0209] 223A: Top plate

[0210] 223B: Side panel

[0211] 223C: Rear panel

[0212] 260: Heat sink (heat transfer part, heat transfer part for outer conductor, heat transfer part for cover)

[0213] 270: Mounting parts (heat transfer part)

[0214] 271: Base

[0215] 272: Maintaining Department

[0216] 301: Connector device

[0217] 310: Circuit board

[0218] 310A: Through hole

[0219] 311: Substrate body

[0220] 320: Connector

[0221] 322: Relay connector

[0222] 323: Mounting cover parts (heat transfer part, heat transfer part for outer conductor)

[0223] 323A: Top plate

[0224] 323B: Side panel

[0225] 323C: Rear panel

[0226] 323D: Legs

[0227] 323E: Keep protrusion

[0228] 360: Heat sink (heat transfer part, heat transfer part for outer conductor, heat transfer part for mounting cover)

[0229] R1: Path

[0230] R2: Path

[0231] R3: Path

[0232] R4: Path

[0233] R5: Path

[0234] R11: Path

[0235] R12: Path

[0236] R13: Path

[0237] R14: Path

[0238] R15: Path

[0239] R16: Path

[0240] R17: Path

[0241] R18: Path

[0242] R19: Path

[0243] R20: Path

Claims

1. A connector device comprising: A circuit substrate is provided with a main grounding circuit; and A connector is provided on the circuit substrate. The connector comprises: a secondary substrate; IC, mounted on the sub-substrate; and a heat transfer portion for transferring heat from the IC to the main ground circuit.

2. The connector device according to claim 1, wherein: The sub-substrate and the IC are arranged on one side of the circuit substrate in the thickness direction. The connector includes a conductive cover member provided so as to cover the sub-substrate and the IC from the one side in the plate thickness direction. The heat transfer portion includes a cover heat transfer portion that transfers heat of the IC to the cover member, and transfers heat of the IC to the main ground circuit via the cover heat transfer portion and the cover member.

3. The connector device according to claim 2, wherein: The connector has a conductive mounting member mounted on the main ground circuit. The cover member is detachably mounted on the mounting member.

4. The connector device according to claim 1, wherein: The circuit substrate and the sub-substrate are arranged so that their surfaces face each other. A sub-ground circuit is provided on the sub-substrate, and the sub-ground circuit is arranged to face the main ground circuit provided on the circuit substrate. The IC is connected to the auxiliary ground circuit, A conductive component is provided between the secondary grounding circuit and the main grounding circuit, The conductive member can connect the secondary ground circuit to the main ground circuit.

5. The connector device according to claim 4, wherein: The connector has a mounting portion, the mounting portion being mounted on the circuit substrate and holding the sub-substrate. The conductive member applies force so as to separate the circuit substrate and the sub-substrate from each other in a direction in which the surfaces of the circuit substrate and the sub-substrate face each other.

6. The connector device according to claim 1, wherein: The connector includes a conductive mounting cover member that covers the sub-substrate and the IC and is mounted on the main ground circuit. The heat transfer portion includes a mounting cover heat transfer portion for transferring heat of the IC to the mounting cover member, and the heat of the IC is transferred to the main ground circuit through the mounting cover heat transfer portion and the mounting cover member.

7. The connector device according to claim 1, wherein: The connector has an inner conductor and an outer conductor covering the outer circumference of the inner conductor. The outer conductor is arranged on the main grounding circuit, The heat transfer portion includes an outer conductor heat transfer portion that transfers heat from the IC to the outer conductor, and the heat from the IC is transferred to the main ground circuit via the outer conductor heat transfer portion and the outer conductor.

Images