A packaging apparatus for optoelectronic components

Abstract

The application provides a packaging device for photoelectric element. The bottom of the supporting platform is provided with a fixed circular table, the bottom of the fixed circular table is rotatably installed with a rotating platform, the bottom of the rotating platform is fixedly installed with a rotating motor, and the top of the supporting platform is fixedly installed with a top cover packaging device, a chip loading box, a bottom shell loading box and a pump glue device. The packaging device for photoelectric element provided by the application can continuously rotate the rotating platform to make the packaging part of the photoelectric element fall into the loading box during the packaging work, and the glue is extruded into the photoelectric element by the glue outlet device to seal the photoelectric element. Under the rotation of the photoelectric element, the packaging action is completed once, the continuity of the packaging is improved, and the work efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optoelectronic device packaging, and in particular to a packaging device for optoelectronic devices. BACKGROUND

[0002] The packaging of optoelectronic devices is mainly to protect sensitive optoelectronic devices, provide electrical connections, and achieve specific functions. The packaging can protect the optoelectronic devices from the external environment. The packaging material can isolate the chip circuit from the external environment and prevent impurities in the air from corroding the circuit. The packaging can adjust the fine lead spacing of the chip to a suitable size for the printed circuit board, achieve size transformation from small to large, reduce operating costs and material costs, and improve work efficiency and reliability.

[0003] In the current packaging technology of optoelectronic devices, in order to ensure the strength of the welding between the chip and the soldering leg of the optoelectronic device, the optoelectronic device is usually protected by point glue packaging after welding. The existing component packaging device mainly uses a pump to pressurize the glue in the glue pipe through the glue outlet to package the optoelectronic device. However, the current packaging device is insufficient in controlling the amount of glue, and the control of the amount of glue is difficult to grasp, which cannot adapt to the packaging of optoelectronic devices of different sizes.

[0004] Therefore, it is necessary to provide a packaging device for optoelectronic devices to solve the above technical problems. SUMMARY

[0005] The present application provides a packaging device for optoelectronic devices, which solves the problem of insufficient control of the amount of glue by the packaging device, difficult control of the amount of glue, and inability to adapt to the packaging of optoelectronic devices of different sizes.

[0006] To solve the above technical problems, the present application provides a packaging device for optoelectronic devices, comprising:

[0007] a support platform;

[0008] Supporting legs, the top of four supporting legs is fixedly installed around the bottom of the supporting platform, the bottom of the supporting platform is fixedly installed with a fixed column, the bottom of the fixed column is fixedly installed with a fixed table, the bottom of the fixed table is rotatably installed with a rotating platform, the bottom of the rotating platform is fixedly installed with a rotating motor, the top of the supporting platform is respectively penetrated with a top cover packaging device, a chip loading box and a bottom shell loading box, the bottom outlet of the top cover packaging device, the chip loading box and the bottom shell loading box is attached to the top of the rotating platform, the top cover packaging device comprises a top shell packaging box, the top shell packaging box is provided on the supporting platform, and the bottom outlet of the top shell packaging box is attached to the top of the rotating platform, the inside of the top shell packaging box is sleeved with a pressure plate, the top of the pressure plate is fixedly installed with a packaging box top cover through an extension rod, the extension rod between the packaging box top cover and the pressure plate is sleeved with a first spring, the rotating platform is slidably installed with a loading box through an opening loading port, the top of the rotating platform is provided with a sliding track, the bottom of the push-out block is slidably installed on the sliding track of the rotating platform, and the back of the loading box is fixedly installed with a push-out block.

[0009] The pump glue device comprises an extrusion box, the bottom of the extrusion box is fixedly installed on the top of the supporting platform, the inside of the extrusion box is slidably installed with an extrusion plate, the center position of the extrusion plate is threadedly connected with a lead screw, the bottom of the lead screw is fixedly installed with a gear, the top of the rotating platform is fixedly installed with a toothed plate fixing leg, the top of the toothed plate fixing leg is fixedly installed with an arc-shaped toothed plate, the arc-shaped toothed plate is in meshing transmission with the gear, and the glue outlet of the pump glue device is communicated with a glue conveying pipe.

[0010] Preferably, the second spring is connected between the rotating platform and the push-out block.

[0011] Preferably, a blanking protrusion is fixedly installed on the top of the fixed table and close to the right side of the top cover packaging device.

[0012] Preferably, the glue conveying pipe is communicated with a glue discharging device, the surface of the glue discharging device is arranged on the bottom of the supporting platform, the glue discharging device comprises a fixed block, the top of the fixed block is fixedly installed on the bottom of the supporting platform, the top of the fixed block is fixedly installed with a glue storage cylinder, the glue storage cylinder penetrates the supporting platform, the bottom of the fixed block is rotatably installed with a glue discharging adjusting device, the bottom of the glue discharging adjusting device is fixedly installed with a glue discharging pipe, and the inner surface of the glue discharging pipe is fixedly installed with a glue discharging hole plate.

[0013] Preferably, the glue discharging adjusting device comprises a rotating ring, the surface of the rotating ring is rotatably installed on the surface of the fixed block, the inner surface of the rotating ring is fixedly installed with a rotating shield, and the surface of the glue discharging hole plate is rotatably installed with a fixed shield.

[0014] Preferably, a sliding connecting rod is provided on one side surface of the rotating cover and the fixed cover, and a hole adapted to the sliding connecting rod is opened on the other side surface for cooperation, so that the rotating cover and the fixed cover are slidably connected.

[0015] Preferably, the glue outlet holes of the glue outlet plate are of the same size and evenly distributed, and the rotating baffle can precisely control the glue dispensing.

[0016] Compared with related technologies, the packaging equipment for optoelectronic components provided by the present invention has the following advantages:

[0017] This invention provides a packaging device for optoelectronic components. The device uses a pumping unit to press encapsulating adhesive into a dispensing unit. The rotation of a rotating platform drives an arc-shaped toothed plate to mesh with a gear. The amount of adhesive dispensed is controlled by the meshing length between the arc-shaped toothed plate and the gear. Each time the rotating platform rotates, the device performs one pumping operation after aligning with the dispensing port at the workstation. The fixed control of the dispensing amount significantly increases work efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a preferred embodiment of a packaging device for optoelectronic components provided by the present invention.

[0019] Figure 2 for Figure 1 The diagram shows the structure of the top cover packaging device.

[0020] Figure 3 for Figure 1 The diagram shows the structure of the packaged product.

[0021] Figure 4 for Figure 1 The diagram shows the structure of the glue pumping device.

[0022] Figure 5 for Figure 4 The diagram shows the internal structure of the glue pumping device.

[0023] Figure 6 This is a schematic diagram of another preferred embodiment of a packaging device for optoelectronic components provided by the present invention;

[0024] Figure 7 for Figure 6 The diagram shows the structure of the dispensing device.

[0025] Figure 8 for Figure 7 A schematic diagram of the dispensing orifice plate of the dispensing device shown;

[0026] Figure 9 for Figure 7 The diagram shows the structure of the glue dispensing adjustment device.

[0027] The diagram is labeled as follows: 1. Support leg, 2. Support platform, 3. Rotating platform, 4. Rotating motor, 5. Fixed platform, 6. Fixed column, 7. Glue pumping device, 71. Extrusion box, 72. Extrusion plate, 73. Lead screw, 74. Arc-shaped toothed plate, 75. Gear, 76. Toothed plate fixed leg, 8. Glue dispensing device, 81. Glue storage cylinder, 82. Fixed block, 83. Glue dispensing adjustment device, 831. Rotating ring, 832. Rotating cover, 833. Fixed cover, 84. Glue dispensing pipe, 85. Glue dispensing orifice plate, 9. Top cover packaging device, 901. Packaging box top cover, 902. First spring, 903. Pressure plate, 904. Top shell packaging box, 10. Chip loading box, 11. Bottom shell loading box, 12. Loading box, 13. Push-out block, 14. Discharge protrusion, 15. Glue pipe, 16. Second spring, 901. Packaging box top cover. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] First Embodiment

[0030] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 A packaging device for optoelectronic components, comprising:

[0031] Support platform 2;

[0032] Support legs 1, the tops of the four support legs 1 are respectively fixedly installed around the bottom of the support platform 2. A fixed column 6 is fixedly installed at the bottom of the support platform 2. A fixed platform 5 is fixedly installed at the bottom of the fixed column 6. A rotating platform 3 is rotatably installed at the bottom of the fixed platform 5. A rotating motor 4 is fixedly installed at the bottom of the rotating platform 3. A top cover packaging device 9, a chip loading box 10, and a bottom shell loading box 11 pass through the top of the support platform 2. The bottom outlets of the top cover packaging device 9, the chip loading box 10, and the bottom shell loading box 11 are all in contact with the top of the rotating platform 3. The top cover packaging device 9 includes a top shell packaging box 904. A packaging box 904 is installed through the support platform 2, and the bottom outlet of the top shell packaging box 904 is attached to the top of the rotating platform 3. A pressure plate 903 is installed inside the top shell packaging box 904. The top of the pressure plate 903 is fixedly installed with a packaging box top cover 901 by a telescopic rod. A first spring 902 is installed on the telescopic rod between the packaging box top cover 901 and the pressure plate 903. A loading box 12 is slidably installed on the rotating platform 3 through the loading port. A sliding rail is provided on the top of the rotating platform 3. The bottom of the ejection block 13 is slidably installed on the sliding rail of the rotating platform 3. The ejection block 13 is fixedly installed on the back of the loading box 12.

[0033] The glue pumping device 7 includes: an extrusion box 71, the bottom of which is fixedly installed on the top of the support platform 2; an extrusion plate 72 is slidably installed inside the extrusion box 71; a lead screw 73 is threadedly connected to the center of the extrusion plate 72; a gear 75 is fixedly installed at the bottom of the lead screw 73; a toothed plate fixing leg 76 is fixedly installed on the top of the rotating platform 3; an arc-shaped toothed plate 74 is fixedly installed on the top of the toothed plate fixing leg 76; the arc-shaped toothed plate 74 meshes with the gear 75; and a glue outlet of the glue pumping device 7 is connected to a glue-passing pipe 15.

[0034] When the first spring 902 is in an uncompressed state, it springs the pressure plate 903 to the bottom of the top shell encapsulation box 904.

[0035] A second spring 16 is connected between the rotating platform 3 and the ejection block 13.

[0036] A feeding protrusion 14 is fixedly installed on the top of the fixed platform 5 and on the right side near the top cover sealing device 9.

[0037] The top cover 901 of the packaging box has a long cylindrical rod at its center, and the rod can extend and retract, which can better encapsulate the optoelectronic components under the action of the first spring.

[0038] When the rotating motor 4 rotates, each loaded bottom shell and chip will coincide with the center position of the corresponding workstation, ensuring the normal operation of the device.

[0039] The working principle of the packaging equipment for optoelectronic components provided by this invention is as follows:

[0040] When packaging optoelectronic components, the bottom shell is first loaded into the bottom shell loading box 11. The rotating motor 4 is started to drive the rotating platform 3 to rotate. When the sealed bottom shell falls into the loading port of the rotating platform 3 and rotates to the next station, the chip loading box 10 is loaded with chips. The chips fall into the sealed bottom shell. The rotating platform 3 continues to rotate to the next station. Through the meshing of the arc-shaped toothed plate 74 and the gear 75, the extrusion plate 72 is driven to continuously extrude the encapsulating glue towards the center of the sealed bottom shell. After the glue is extruded, it rotates to the last station for top shell packaging. The top shell is placed into the top shell packaging box 904. At the same time as it falls into the packaging, the first spring 902 will give the pressure plate 903 a certain pressure to better seal the optoelectronic components. Before reaching the next station, the top of the rotating platform 3 will seal the outlets of the bottom shell loading box 11, the chip loading box 10 and the top shell packaging box 904 to prevent the items from falling. When the packaging size of the optoelectronic components changes, the amount of encapsulating glue required also changes.

[0041] Compared with related technologies, the packaging equipment for optoelectronic components provided by the present invention has the following advantages:

[0042] When the rotating motor 4 is started, it drives the rotating platform 3 to rotate. Before reaching the next station, the top of the rotating platform 3 will seal the outlet of the bottom shell loading box 11, the chip loading box 10 and the top shell packaging box 904. By rotating the rotating platform 3, the arc-shaped toothed plate 74 and the gear 75 are continuously meshed to control the amount of glue dispensing, so that the amount of glue dispensing becomes fixed and reliable, which greatly improves the packaging efficiency of optoelectronic components.

[0043] Second Embodiment

[0044] Please refer to the following: Figure 6 , Figure 7 , Figure 8 and Figure 9 Based on the packaging device for optoelectronic components provided in the first embodiment of this application, the second embodiment of this application proposes another packaging device for optoelectronic components. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0045] Specifically, the second embodiment of this application provides a packaging device for optoelectronic components, which differs in that the glue tube 15 is connected to a glue dispensing device 8, the surface of the glue dispensing device 8 is disposed at the bottom of the support platform 2, the glue dispensing device 8 includes a fixing block 82, the top of the fixing block 82 is fixedly installed at the bottom of the support platform 2, a glue storage cylinder 81 is fixedly installed at the top of the fixing block 82, the glue storage cylinder 81 passes through the support platform 2, a glue dispensing adjustment device 83 is rotatably installed at the bottom of the fixing block 82, a glue dispensing tube 84 is fixedly installed at the bottom of the glue dispensing adjustment device 83, and a glue dispensing orifice plate 85 is fixedly installed on the inner surface of the glue dispensing tube 84;

[0046] The glue dispensing adjustment device 83 includes: a rotating ring 831, the surface of which is rotatably mounted on the surface of the fixed block 82; a rotating baffle 832 fixedly mounted on the inner surface of the rotating ring 831; and a fixed baffle 833 rotatably mounted on the surface of the glue dispensing orifice plate 85. A sliding connecting rod is provided on one side of the rotating baffle 832 and the fixed baffle 833, and a hole adapted to the sliding connecting rod is provided on the other side of the rotating baffle 832 for cooperation, allowing for a sliding connection between the rotating baffle 832 and the fixed baffle 833. The glue dispensing orifices of the glue dispensing orifice plate 85 are of uniform size and evenly distributed, and the rotating baffle 832 can precisely control the glue dispensing.

[0047] The toothed plate fixing leg 76 does not hinder the rotation of the rotating platform 3 or the operation of the unloading protrusion 14.

[0048] After being pushed out by the feeding protrusion 14, the ejector block 13 will automatically retract to its initial position.

[0049] When entering the dispensing station, it is necessary to ensure that when entering, the right edge of the dispensing port is completely inside the encapsulation bottom shell, the arc-shaped toothed plate 74 begins to mesh with the gear 75 to extrude glue. When exiting, when the left edge of the dispensing port is about to touch the surface of the encapsulation bottom shell, the arc-shaped toothed plate 74 begins to disengage from the gear 75 and stops extruding glue.

[0050] The working principle of the packaging equipment for optoelectronic components provided by this invention is as follows:

[0051] The rotating motor 4 is started, driving the rotating platform 3 to rotate. At the same time, the arc-shaped toothed plate 74 also rotates. After the packaging bottom shell falls into the loading box 12 and the chip falls into the packaging bottom shell, the rotating platform 3 rotates to the next encapsulation station. The arc-shaped toothed plate 74 meshes with the gear 75. The movement of the arc-shaped toothed plate 74 drives the gear 75 to rotate, which in turn drives the lead screw 73 to rotate. When the lead screw 73 rotates, the extrusion plate 72 moves to extrude the encapsulation glue inside the extrusion box 71 into the glue inlet and outlet device 8. When encapsulating components of different sizes, the rotating ring 831 drives the rotating shield 832 to block the glue outlet plate 85 to control the glue dispensing rate. After the glue dispensing is completed, the packaging top shell is encapsulated. After that, the rotating platform 3 continues to rotate until the ejection block 13 contacts the unloading protrusion 14, gradually pushing out the loading box 12. The encapsulation of an optoelectronic component is completed.

[0052] Compared with related technologies, the packaging equipment for optoelectronic components provided by the present invention has the following advantages:

[0053] The rotating motor 4 drives the rotating platform 3 to rotate. The packaging bottom shell falls into the loading box 12, and the chip falls into the packaging bottom shell. When the rotating platform 3, carrying the optoelectronic components, rotates to the dispensing station, the arc-shaped toothed plate 74 meshes with the gear 75. The movement of the arc-shaped toothed plate 74 drives the gear 75 to rotate, which in turn drives the lead screw 73 to rotate. When the lead screw 73 rotates, the extrusion plate 72 moves to extrude the packaging adhesive inside the extrusion box 71 into the dispensing device 8. When packaging components of different sizes, the rotating ring 831 drives the rotating shield 832 to block the dispensing hole plate 85, controlling the dispensing rate. After dispensing is complete, the packaging top shell is sealed. After this, the rotating platform 3 continues to rotate until the ejector block 13 contacts the unloading protrusion 14, gradually pushing out the loading box 12. This greatly improves the continuity and efficiency of the packaging process.

[0054] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A packaging device for optoelectronic components, characterized in that, include: Support platform; The four support legs are fixedly mounted at their tops around the bottom of the support platform. A fixed column is fixedly mounted at the bottom of the support platform, and a fixed platform is fixedly mounted at the bottom of each fixed column. A rotating platform is rotatably mounted at the bottom of the fixed platform, and a rotating motor is fixedly mounted at the bottom of the rotating platform. A top cover packaging device, a chip loading box, and a bottom shell loading box pass through the top of the support platform. The bottom outlets of the top cover packaging device, the chip loading box, and the bottom shell loading box are all flush with the top of the rotating platform. The top cover packaging device includes a top shell packaging... The top shell of the package is disposed through the support platform, and the bottom outlet of the top shell is fitted with the top of the rotating platform. A pressure plate is installed inside the top shell. The top of the pressure plate is fixedly installed with a top cover of the package via a telescopic rod. A first spring is installed on the telescopic rod between the top cover of the package and the pressure plate. A loading box is slidably installed on the rotating platform through an opening. A sliding rail is provided on the top of the rotating platform. The bottom of the ejector block is slidably installed on the sliding rail of the rotating platform. An ejector block is fixedly installed on the back of the loading box. A glue pumping device is disposed on the support platform. The glue pumping device includes: an extrusion box, the bottom of which is fixedly installed on the top of the support platform; an extrusion plate is slidably installed inside the extrusion box; a lead screw is threadedly connected to the center of the extrusion plate; a gear is fixedly installed at the bottom of the lead screw; a toothed plate fixing leg is fixedly installed on the top of the rotating platform; an arc-shaped toothed plate is fixedly installed on the top of the toothed plate fixing leg; the arc-shaped toothed plate meshes with the gear; and a glue outlet of the glue pumping device is connected to a glue-passing pipe.

2. The packaging equipment for optoelectronic components according to claim 1, characterized in that, A second spring connects the rotating platform to the ejector block.

3. The packaging equipment for optoelectronic components according to claim 2, characterized in that, A feeding protrusion is fixedly installed on the top of the fixed platform and on the right side near the top cover sealing device.

4. The packaging equipment for optoelectronic components according to claim 1, characterized in that, The glue tube is connected to a glue dispensing device. The surface of the glue dispensing device is disposed at the bottom of the support platform. The glue dispensing device includes a fixing block. The top of the fixing block is fixedly installed at the bottom of the support platform. A glue storage cylinder is fixedly installed at the top of the fixing block. The glue storage cylinder passes through the support platform. A glue dispensing adjustment device is rotatably installed at the bottom of the fixing block. A glue dispensing tube is fixedly installed at the bottom of the glue dispensing adjustment device. A glue dispensing orifice plate is fixedly installed on the inner surface of the glue dispensing tube.

5. The packaging equipment for optoelectronic components according to claim 4, characterized in that, The glue dispensing adjustment device includes a rotating ring, the surface of which is rotatably mounted on the surface of the fixed block, a rotating baffle fixedly mounted on the inner surface of the rotating ring, and a fixed baffle rotatably mounted on the surface of the glue dispensing plate.

6. The packaging equipment for optoelectronic components according to claim 5, characterized in that, The rotating cover and the fixed cover are provided with a sliding connecting rod on one side surface and a hole adapted to the sliding connecting rod on the other side surface for cooperation, so that the rotating cover and the fixed cover are slidably connected.

7. A packaging device for optoelectronic components according to claim 6, characterized in that, The glue outlet holes of the glue outlet plate are of the same size and evenly distributed, and the rotating baffle can precisely control the glue dispensing.

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