A high-cleanliness single crystal silicon polishing wafer cleaning equipment

Abstract

The present invention provides a high-cleanliness single-crystal silicon polishing wafer cleaning device, comprising a studio, wherein a plurality of cleaning pools are arranged in sequence inside the studio, a plurality of swing forks are arranged on the side walls in the long side direction of the cleaning pool, a mounting seat is arranged on the swing fork, a flower basket is installed on the mounting seat, and the flower basket is used to carry the single-crystal silicon polishing wafer, and a plurality of groups of lifting drive mechanisms are arranged in the cleaning pool at the tail end, and the lifting drive mechanisms are correspondingly installed between the mounting seat and the flower basket, and the lifting drive mechanisms are arranged below the flower basket, and during the cleaning and drying process, the lifting drive mechanisms lift the single-crystal silicon polishing wafer out of contact with the flower basket, and the driving wheel rotates to drive the single-crystal silicon polishing wafer to rotate, so that the supporting points of the single-crystal silicon polishing wafer are alternately supported, and all-round cleaning and drying are completed, thereby meeting the process requirements.

Description

Technical Field

[0001] The invention relates to the technical field of cleaning single crystal silicon polishing wafers, and in particular to a high-cleanliness single crystal silicon polishing wafer cleaning device. Background Art

[0002] IPA drying utilizes the low surface tension and volatility of isopropyl alcohol (IPA) to replace the water with high surface tension on the surface of objects (such as single crystal silicon polishing sheets, wafers, etc.) to achieve the purpose of drying. IPA drying is usually used in combination with nitrogen (N2). Unheated nitrogen carries IPA to the water surface to form an IPA film on the water surface. When the single crystal silicon polishing sheet is lifted or the water level drops, the IPA film takes the water away from the single crystal silicon polishing sheet. Finally, the hot nitrogen dries the single crystal silicon polishing sheet to achieve thorough drying. After the single crystal silicon polishing sheet is fixed in the basket, the IPA drying method is adopted. At the support point of the basket, the tension film formed by IPA is easily broken, resulting in the surface cleanliness of the single crystal silicon polishing sheet at the support point being easy to cause traces or particles exceeding the standard and failing to meet the process requirements.

[0003] A Chinese patent with publication number CN215809786U discloses an IPA drying device, including a shell with a fixed groove opened inside, and a drying mechanism arranged in the shell, the drying mechanism including a drying cylinder arranged on the bottom wall of the fixed groove, a cleaning component arranged on the top of the drying cylinder and opened on the bottom wall of the drying groove, and a placement component that moves up and down in the drying groove through a lifting component and is used to place objects to be cleaned; a partition is arranged in the drying groove to divide the drying groove into upper and lower parts, and a through groove is opened on the partition to facilitate the placement component to pass through; the present invention facilitates all-round cleaning of the surface of the object to be dried, thereby improving the cleaning efficiency.

[0004] However, this technical solution has the following shortcomings: in the process of moving the object to be cleaned by placing the component, it is still impossible to avoid the existence of clean and dry dead corners in the contact area between the placed component and the object, and the tension film formed by IPA breaks here, which ultimately leads to the surface cleanliness of the single crystal silicon polishing wafer being unqualified and unable to meet the process requirements. Summary of the invention

[0005] The purpose of the present invention is to provide a high-cleanliness single-crystal silicon polishing wafer cleaning equipment in view of the shortcomings of the prior art. By arranging a lifting drive mechanism under the flower basket, during the cleaning and drying process, the lifting drive mechanism lifts the single-crystal silicon polishing wafer out of contact with the flower basket, and the rotation of the active wheel drives the single-crystal silicon polishing wafer to rotate, thereby achieving alternating support of the support points of the single-crystal silicon polishing wafer, avoiding the rupture of the tension film formed by IPA, completing all-round cleaning and drying, and ensuring that the cleanliness of the surface of the single-crystal silicon polishing wafer meets the process requirements.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-cleanliness single crystal silicon polishing wafer cleaning equipment, comprising a working room, wherein a plurality of cleaning pools are arranged in sequence inside the working room, a plurality of swing forks are arranged on the side walls in the long side direction of the cleaning pool, a mounting seat is arranged on the swing fork, a flower basket is installed on the mounting seat, the flower basket is used to carry the single crystal silicon polishing wafer, a plurality of groups of lifting drive mechanisms are arranged in the cleaning pool located at the tail end, the lifting drive mechanisms are correspondingly installed between the mounting seat and the flower basket, and during the cleaning and drying process, the lifting drive mechanism lifts the single crystal silicon polishing wafer out of contact with the flower basket and drives the single crystal silicon polishing wafer to move.

[0007] As a preferred embodiment, the lifting drive mechanism includes a first base and a second base, and mounting blocks are respectively provided on the first base and the second base; a plurality of driving wheels and a plurality of driven wheels are rotatably provided between the two groups of the mounting blocks, and the distribution of the driving wheels and the driven wheels is arranged in a shape similar to the single crystal silicon polishing sheet; a driving member is provided at one end of the driving wheel; and lifting cylinders are also respectively provided at the bottom of the first base and the second base.

[0008] As a preference, the mounting block is split into a first mounting block and a second mounting block, and the first mounting block and the second mounting block are provided with the same number and corresponding driving wheels and the driven wheels; a cam is rotatably provided on the first base, and the cam is located between the first mounting block and the second mounting block; and a plurality of springs are provided between the second base and the mounting block.

[0009] As a preference, a first screw shaft and a second screw shaft are rotatably arranged between the mounting blocks, and a plurality of spiral blades are arranged on the first screw shaft and the second screw shaft; a gear set is arranged on the first screw shaft and the second screw shaft, and the gear set is driven by the driving wheel, and the rotation directions of the first screw shaft and the second screw shaft are opposite.

[0010] Preferably, the driven wheel is provided with a plurality of V-grooves corresponding to the single crystal silicon polishing sheet, and the opening width of the V-grooves is greater than the thickness of the single crystal silicon polishing sheet; a cleaning brush is also provided on the opposite side of the driven wheel contacting the single crystal silicon polishing sheet.

[0011] As a preference, a pair of cleaning rollers are also supported on the mounting block, and the cleaning rollers are located on both sides of the flower basket.

[0012] As a preference, the top of the swing fork is rotatably connected to the side wall of the cleaning tank, and a power member is provided on the opposite side of the side wall of the cleaning tank, and the power member is connected to and drives the swing fork to swing.

[0013] As a preferred embodiment, a trolley is slidably arranged on both sides of the cleaning pool, a lifting rod is arranged on the top of the trolley, and claws are rotatably connected between the lifting rods.

[0014] As a preference, a sealing cover is rotatably provided on the top of the cleaning pool located at the tail end, and a plurality of air inlet nozzles are provided on the sealing cover.

[0015] Preferably, a plurality of groups of drying nozzles are arranged on the side wall of the cleaning pool, and the drying nozzles are located on the side corresponding to the flower basket; an exhaust pipe is also arranged on the side wall of the cleaning pool, and the exhaust pipe penetrates the top of the working room.

[0016] The beneficial effects of the present invention are:

[0017] (1) The present invention provides a lifting drive mechanism. During the cleaning and drying process of the single crystal silicon polishing sheet, the lifting drive mechanism lifts the single crystal silicon polishing sheet away from the contact with the flower basket. The driving wheel rotates to drive the single crystal silicon polishing sheet to rotate, so that the supporting points of the single crystal silicon polishing sheet are alternately supported, thereby avoiding the rupture of the tension film formed by IPA, completing all-round cleaning and drying, improving the cleaning and drying efficiency, and ensuring that the cleanliness of the surface of the single crystal silicon polishing sheet meets the process requirements.

[0018] (2) The present invention divides the mounting block into a first mounting block and a second mounting block in a split manner, and provides a rotating cam and a spring, so that the two parts of the mounting block can slide back and forth alternately on the first base and the second base, thereby causing the driving wheel and the driven wheel on the mounting block to drive the single crystal silicon polishing sheet to swing, thereby further improving the cleaning and drying effects of the surface of the single crystal silicon polishing sheet.

[0019] (3) The present invention provides a first spiral shaft and a second spiral shaft that are rotatably arranged between the mounting blocks. During the cleaning process of the single crystal silicon polishing sheet, the spiral blades stir the water flow to achieve rapid flushing of the surface of the single crystal silicon polishing sheet. The two rotate in opposite directions, and the directions of the stirred water flow are also opposite. Impurities adhered in different directions can be effectively removed, thus avoiding the problem that the impurities are difficult to clean due to the direction of impurity adhesion being the same as the direction of the water flow.

[0020] In summary, the present invention has the advantages of high cleaning and drying efficiency, good and comprehensive effect, and high impurity removal rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 It is a partial schematic diagram of the present invention;

[0023] Figure 3 This is a sectional view of the present invention;

[0024] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0025] Figure 5 It is a partial schematic diagram of the present invention;

[0026] Figure 6 It is a partial schematic diagram of the present invention;

[0027] Figure 7 Schematic diagram of the cam structure;

[0028] Figure 8 is a schematic diagram of the structure of the first spiral shaft;

[0029] Fig. 9 The present invention works as shown in FIG. Figure 1 ;

[0030] Fig.10 The present invention works as shown in FIG. Figure 2 ;

[0031] Fig.11 The present invention works as shown in FIG. Figure 3 ;

[0032] Fig.12 The present invention works as shown in FIG. Figure 4 .

[0033] Figures marked: 1. Studio; 2. Cleaning tank; 21. Sealing cover; 211. Inlet nozzle; 22. Drying nozzle; 23. Exhaust pipe; 3. Swing fork; 31. Power piece; 32. Belt; 4. Mounting seat; 5. Flower basket; 6. Single crystal silicon polishing sheet; 7. Lifting drive mechanism; 71. First base; 711. Cam; 72. Second base; 721. Spring; 73. Mounting block; 731. First mounting block; 7 32. Second mounting block; 733. First screw shaft; 7331. Spiral blade; 7332. Gear set; 734. Second screw shaft; 735. Cleaning roller; 736. Pulley; 737. Limiting groove; 738. Limiting block; 74. Driving wheel; 741. Driving member; 75. Driven wheel; 751. V-groove; 752. Cleaning brush; 76. Lifting cylinder; 8. Crane; 81. Lifting rod; 82. Claw. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0036] Embodiment 1

[0037] like Figures 1 to 12 As shown, this embodiment provides a high-cleanliness single crystal silicon polishing wafer cleaning device, a high-cleanliness single crystal silicon polishing wafer cleaning device, including a studio 1, a plurality of cleaning pools 2 are arranged in sequence inside the studio 1, a plurality of swing forks 3 are arranged on the side walls of the cleaning pool 2 in the long side direction, a mounting seat 4 is arranged on the swing fork 3, a flower basket 5 is installed on the mounting seat 4, the flower basket 5 is used to carry the single crystal silicon polishing wafer 6, a plurality of groups of lifting drive mechanisms 7 are arranged in the cleaning pool 2 at the tail end, the lifting drive mechanisms 7 are correspondingly installed between the mounting seat 4 and the flower basket 5, during the cleaning and drying process, the lifting drive mechanism 7 lifts the single crystal silicon polishing wafer 6 out of contact with the flower basket 5, and drives the single crystal silicon polishing wafer 6 to move.

[0038] It should be noted that the cleaning tank 2 is provided with a noise vibration device to assist in cleaning.

[0039] like Figure 5 , 6 As shown, the lifting drive mechanism 7 includes a first base 71 and a second base 72, and mounting blocks 73 are respectively provided on the first base 71 and the second base 72; a plurality of driving wheels 74 and a plurality of driven wheels 75 are rotatably provided between the two groups of the mounting blocks 73, and the distribution of the driving wheels 74 and the driven wheels 75 is arranged in the shape of the single crystal silicon polishing sheet 6; a driving member 741 is provided at one end of the driving wheel 74; and lifting cylinders 76 are also respectively provided at the bottom of the first base 71 and the second base 72.

[0040] It should be noted here that there are at least two groups of driving wheels 74, which can ensure that at least one driving wheel 74 contacts and drives the single crystal silicon polishing sheet 6 to rotate when facing the circular single crystal silicon polishing sheet 6 and the single crystal silicon polishing sheet 6 with a reference surface; the driving member 741 is preferably an air motor driven by nitrogen to ensure the purity of the gas during the drying process.

[0041] It is worth mentioning that by setting a lifting cylinder 76 at the bottom of the first base 71 and the second base 72, during the operation of the lifting drive mechanism 7, the lifting cylinder 76 extends upward, so that the driving wheel 74 and the driven wheel 75 lift the single crystal silicon polishing sheet 6 out of contact with the flower basket 5, and the driving wheel 74 rotates to drive the single crystal silicon polishing sheet 6 to rotate, so that the supporting points of the single crystal silicon polishing sheet 6 are alternately supported, and the single crystal silicon polishing sheet 6 is fully cleaned and dried.

[0042] like Figures 5 to 12 As shown, the mounting block 73 is split into a first mounting block 731 and a second mounting block 732, and the first mounting block 731 and the second mounting block 732 are provided with the same number and corresponding driving wheels 74 and the driven wheels 75; a cam 711 is rotatably provided on the first base 71, and the cam 711 is located between the first mounting block 731 and the second mounting block 732; a plurality of springs 721 are provided between the second base 72 and the mounting block 73.

[0043] It should be noted here that the cam 711 is driven by a motor, and the motor is buried inside the first base 71. When the cam 711 rotates, the protrusions on it alternately contact and push the first mounting block 731 or the second mounting block 732 to slide backward and squeeze the spring 721 at the rear. When the protrusions do not contact the first mounting block 731 or the second mounting block 732, the spring 721 resets and pushes the first mounting block 731 or the second mounting block 732 to slide forward.

[0044] It should also be noted that the first mounting block 731 and the second mounting block 732 are provided with limiting grooves 737, which cooperate with the limiting blocks 738 on the first base 71 and the second base 72 to make the sliding of the first mounting block 731 and the second mounting block 732 more stable.

[0045] It is worth mentioning here that when the first mounting block 731 and the second mounting block 732 alternately reciprocate back and forth, the driving wheel 74 and the driven wheel 75 on the mounting block 73 drive the single crystal silicon polishing sheet 6 to swing, further improving the cleaning and drying effect of the surface of the single crystal silicon polishing sheet 6.

[0046] like Figure 5 , 6As shown in Figures 8 and 9, a first screw shaft 733 and a second screw shaft 734 are rotatably arranged between the mounting blocks 73, and a plurality of spiral blades 7331 are arranged on the first screw shaft 733 and the second screw shaft 734; a gear set 7332 is arranged on the first screw shaft 733 and the second screw shaft 734, and the gear set 7332 is driven by the driving wheel 74, and the rotation directions of the first screw shaft 733 and the second screw shaft 734 are opposite.

[0047] It should be noted here that the first screw shaft 733 is directly driven by the gear on the driving wheel 74 through gear meshing, and the rotation direction of the first screw shaft 733 is opposite to the rotation direction of the driving wheel 74. The second screw shaft 734 is driven by the gear on the first screw shaft 733 through gear meshing, and the rotation direction of the second screw shaft 734 is opposite to the rotation direction of the first screw shaft 733.

[0048] It is worth mentioning here that during the cleaning process of the single crystal silicon polishing wafer 6 by the first spiral shaft 733 and the second spiral shaft 734, the spiral blade 7331 stirs the water flow to achieve rapid flushing of the surface of the single crystal silicon polishing wafer 6, and the two rotate in opposite directions, and the directions of the stirred water flow are also opposite, so impurities adhered in different directions can be effectively removed, avoiding the problem that the impurities are difficult to clean due to the same direction of impurity adhesion and water flow.

[0049] like Figures 4 to 6 As shown, the driven wheel 75 is provided with a plurality of V-grooves 751 corresponding to the single crystal silicon polishing sheet 6 , and the opening width of the V-grooves 751 is greater than the thickness of the single crystal silicon polishing sheet 6 ; a cleaning brush 752 is also provided on the opposite side of the driven wheel 75 contacting the single crystal silicon polishing sheet 6 .

[0050] It is worth mentioning here that the V-groove 751 can limit the single crystal silicon polishing sheet 6 to prevent the single crystal silicon polishing sheet 6 from being seriously offset and jammed during movement, and the V-groove 751 changes the contact between the driven wheel 75 and the single crystal silicon polishing sheet 6 from surface contact to point contact, thereby reducing the support point area on the side of the single crystal silicon polishing sheet 6, which is conducive to cleaning and drying.

[0051] It is worth mentioning again that a cleaning brush 752 is provided on the outer side of the driven wheel 75 . When the driven wheel 75 rotates, the cleaning brush 752 cleans the V-shaped groove 751 and removes impurities left in the V-shaped groove 751 due to contact with the single crystal silicon polishing sheet 6 .

[0052] like Figure 4 As shown, a pair of cleaning rollers 735 are also supported on the mounting block 73 , and the cleaning rollers 735 are located on both sides of the flower basket 5 .

[0053] It should be noted here that the cleaning roller 735 is connected via a pulley 736 and is driven to rotate by the driving wheel 74. During the rotation, the cleaning roller 735 cleans the groove on the flower basket 5 that carries the single crystal silicon polishing sheet 6, and removes impurities left by the contact between the groove and the single crystal silicon polishing sheet 6.

[0054] Embodiment 2

[0055] like Figure 3 As shown, the components identical or corresponding to those in the first embodiment are marked with the corresponding reference numerals in the first embodiment, the top of the swing fork 3 is rotatably connected to the side wall of the cleaning tank 2, and a power member 31 is provided on the opposite side of the side wall of the cleaning tank 2, and the power member 31 is connected to and drives the swing fork 3 to swing.

[0056] It should be noted here that the swing forks 3 are connected by belt 32 transmission. During the cleaning and drying process of the single crystal silicon polishing wafer 6, the power part 31 drives the swing fork 3 to swing left and right within a certain range, thereby further improving the cleaning and drying effect of the single crystal silicon polishing wafer 6.

[0057] like Figure 1 , 2 As shown, a trolley 8 is slidably provided on both sides of the cleaning pool 2, a lifting rod 81 is provided on the top of the trolley 8, and claws 82 are rotatably connected between the lifting rods 81.

[0058] It should be noted that, when the traveling vehicle 8 slides between the cleaning tanks 2, the flower basket 5 is clamped by the claws 82 and transferred between the cleaning tanks 2 of different processes, which saves manpower and reduces human contact pollution.

[0059] like Figure 2 , 3 As shown, a sealing cover 21 is rotatably provided on the top of the cleaning pool 2 at the tail end, and a plurality of air intake nozzles 211 are provided on the sealing cover 21 .

[0060] It should be noted that when the sealing cover 21 is closed on the top of the cleaning tank 2, the air inlet nozzle 211 fills the cleaning tank 2 with unheated nitrogen to carry IPA to the water surface, forming an IPA tension film on the water surface. When the water level drops, the IPA film takes water away from the single crystal silicon polishing wafer 6.

[0061] like Figure 3 , 4 As shown, a plurality of groups of drying nozzles 22 are arranged on the side wall of the cleaning pool 2, and the drying nozzles 22 are located on the side corresponding to the flower basket 5; an exhaust pipe 23 is also arranged on the side wall of the cleaning pool 2, and the exhaust pipe 23 penetrates the top of the studio 1.

[0062] It should be noted here that the drying nozzle 22 uses nitrogen to heat-dry the single crystal silicon polishing wafer 6 attached with the IPA tension film, and at the same time the exhaust pipe 23 discharges the mixed gas in the cleaning tank 2. IPA is volatile, so the surface of the single crystal silicon polishing wafer is thoroughly dried; in a group of drying nozzles 22, the drying nozzle 22 located at the top faces one side of the flower basket 5, and the drying nozzle 22 located at the bottom faces the other side of the flower basket 5.

[0063] It should also be noted that a water inlet and a water outlet are provided at the bottom of the cleaning pool 2 for filling and draining the cleaning water.

[0064] Working steps

[0065] After the flower basket 5 carrying the single crystal silicon polishing sheet 6 is cleaned in the previous process, it is clamped by the claw 82 and transported to the cleaning pool 2 at the tail end by the crane 8. The flower basket 5 is placed on the mounting seat 4 and immersed in water. The lifting cylinder 76 extends upward, so that the driving wheel 74 and the driven wheel 75 lift the single crystal silicon polishing sheet 6 out of contact with the flower basket 5. The driving wheel 74 rotates to drive the single crystal silicon polishing sheet 6 to rotate. The cam 711 cooperates with the spring 721 to make the first mounting block 731 and the second mounting block 732 alternately reciprocate back and forth, so that the driving wheel 74 and the driven wheel 75 on the mounting block 73 drive the single crystal silicon polishing sheet 6 to swing. During the cleaning process of the single crystal silicon polishing sheet 6, the first spiral shaft 733 and the second spiral shaft 734 drive the water flow to achieve rapid flushing of the surface of the single crystal silicon polishing sheet 6.

[0066] At the same time, the air inlet nozzle 211 fills the cleaning pool 2 with unheated nitrogen to carry IPA to the water surface, forming an IPA film on the water surface. After cleaning, the water is discharged from the drain outlet, the water level drops, and the IPA film adheres to the surface of the single crystal silicon polishing sheet 6 to take the water away from the single crystal silicon polishing sheet. The lifting drive mechanism 7 continues to operate to drive the single crystal silicon polishing sheet 6 to move. After the air inlet nozzle 211 stops intake, the drying nozzle 22 uses nitrogen to heat-dry the single crystal silicon polishing sheet 6 with the IPA tension film attached. At the same time, the exhaust pipe 23 discharges the mixed gas in the cleaning pool 2 to achieve thorough drying of the surface of the single crystal silicon polishing sheet.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-cleanliness single-crystal silicon polishing wafer cleaning device, comprising a studio (1), wherein a plurality of cleaning pools (2) are arranged in sequence inside the studio (1), a plurality of swing forks (3) are arranged on the side walls in the long side direction of the cleaning pools (2), a mounting seat (4) is arranged on the swing forks (3), the mounting seat (4) is used to receive a flower basket (5), and the flower basket (5) is used to carry a single-crystal silicon polishing wafer (6), characterized in that: A plurality of lifting drive mechanisms (7) are arranged in the cleaning pool (2) at the rear end. The lifting drive mechanisms (7) are correspondingly installed between the mounting seat (4) and the flower basket (5). During the cleaning and drying process, the lifting drive mechanisms (7) lift the single crystal silicon polishing sheet (6) out of contact with the flower basket (5) and drive the single crystal silicon polishing sheet (6) to rotate. The lifting drive mechanism (7) comprises a first base (71) and a second base (72), and mounting blocks (73) are respectively provided on the first base (71) and the second base (72); A plurality of groups of driving wheels (74) and a plurality of groups of driven wheels (75) are rotatably arranged between the two groups of mounting blocks (73); the distribution of the driving wheels (74) and the driven wheels (75) is arranged in a shape similar to that of the single crystal silicon polishing sheet (6); A driving member (741) is provided at one end of the driving wheel (74); A lifting cylinder (76) is also provided at the bottom of each of the first base (71) and the second base (72); The mounting block (73) is divided into a first mounting block (731) and a second mounting block (732), and the first mounting block (731) and the second mounting block (732) are provided with the same number and corresponding driving wheels (74) and driven wheels (75); A cam (711) is rotatably disposed on the first base (71), and the cam (711) is located between the first mounting block (731) and the second mounting block (732); A plurality of springs (721) are arranged between the second base (72) and the mounting block (73); The driven wheel (75) is provided with a plurality of V-shaped grooves (751) corresponding to the single crystal silicon polishing sheet (6), and the V-shaped grooves (751) can limit the position of the single crystal silicon polishing sheet (6); During the rotation process, the protrusion on the cam (711) alternately contacts and pushes the first mounting block (731) or the second mounting block (732) to slide backward and squeeze the spring (721) at the rear; when the protrusion does not contact the first mounting block (731) or the second mounting block (732), the spring (721) resets and pushes the first mounting block (731) or the second mounting block (732) to slide forward; while the first mounting block (731) and the second mounting block (732) alternately reciprocate forward and backward, the driving wheel (74) and the driven wheel (75) on the mounting block (73) drive the single crystal silicon polishing sheet (6) to swing.

2. A high-cleanliness single crystal silicon polishing wafer cleaning device according to claim 1, characterized in that: A first spiral shaft (733) and a second spiral shaft (734) are rotatably arranged between the mounting blocks (73), and a plurality of spiral blades (7331) are arranged on the first spiral shaft (733) and the second spiral shaft (734); A gear set (7332) is provided on the first screw shaft (733) and the second screw shaft (734); the gear set (7332) is driven by the driving wheel (74); and the first screw shaft (733) and the second screw shaft (734) rotate in opposite directions.

3. The high-cleanliness single crystal silicon polishing wafer cleaning device according to claim 1, characterized in that: The opening width of the V-shaped groove (751) is greater than the thickness of the single crystal silicon polishing sheet (6); A cleaning brush (752) is also provided on the opposite side of the driven wheel (75) that contacts the single crystal silicon polishing wafer (6).

4. The high-cleanliness single crystal silicon polishing wafer cleaning device according to claim 1, characterized in that: A pair of cleaning rollers (735) are also symmetrically arranged on the mounting block (73), and the cleaning rollers (735) are located on both sides of the flower basket (5).

5. The high-cleanliness single crystal silicon polishing wafer cleaning device according to claim 1, characterized in that: The top of the swing fork (3) is rotatably connected to the side wall of the cleaning pool (2); a power member (31) is provided on the opposite side of the side wall of the cleaning pool (2); the power member (31) is connected to and drives the swing fork (3) to swing.

6. The high-cleanliness single crystal silicon polishing wafer cleaning device according to claim 1, characterized in that: A trolley (8) is slidably provided on both sides of the cleaning pool (2), a lifting rod (81) is provided on the top of the trolley (8), and claws (82) are rotatably connected between the lifting rods (81).

7. The high-cleanliness single crystal silicon polishing wafer cleaning device according to claim 1, characterized in that: A sealing cover (21) is rotatably provided on the top of the cleaning pool (2) at the rear end, and a plurality of air intake nozzles (211) are provided on the sealing cover (21).

8. The high-cleanliness single crystal silicon polishing wafer cleaning device according to claim 1, characterized in that: A plurality of groups of drying nozzles (22) are provided on the side walls of the cleaning pool (2), and the drying nozzles (22) are located on the sides corresponding to the flower baskets (5); An exhaust pipe (23) is also provided on the side wall of the cleaning pool (2), and the exhaust pipe (23) penetrates the top of the working chamber (1).

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