Hole site measuring method for plate

Abstract

The invention provides a method for measuring hole sites of a plate, which comprises the following steps of: firstly, measuring the length, the width and the thickness of the plate, and then positioning a first reference point and a second reference point which is arranged at an interval with the first reference point on a first side edge of the plate; then, a datum line is positioned according to the first datum point and the second datum point, and finally, a to-be-drilled position of the plate is positioned according to the datum line, so that the plate can be drilled. Therefore, according to the hole site measuring method, the hole sites of the plate can be kept consistent, deviation caused by deflection of the first side edge is avoided, the offset of the plate and the other plate at the joint can be eliminated when the plate and the other plate are jointed, and the machining precision is improved.

Description

Technical Field

[0001] The invention relates to a plate processing method, in particular to a plate hole position measuring method. Background Art

[0002] If two plates 1 are Figure 1 In order to join the two plates 1 together, holes are usually drilled near the side edges 2 of the two plates 1, and then multiple fixings (such as screws, not shown) are used to lock the two plates together. However, when the plates 1 are cut, the side edges 2 may be skewed due to errors. As a result, the two plates 1 may have a significant gap at the joint 3 (such as Figure 2 As shown in the figure, the operator has to spend time to readjust, thus affecting the working efficiency. Summary of the invention

[0003] The main purpose of the present invention is to provide a method for measuring the hole position of a plate, which can eliminate the discontinuity between two plates at the joint to improve the processing accuracy.

[0004] In order to achieve the above main purpose, the hole position measurement method of the present invention includes the following steps: a) measuring the length, width and thickness of a plate; b) locating a first reference point and a second reference point spaced apart from the first reference point on a first side of the plate; c) locating a reference line based on the first reference point and the second reference point; and d) locating a position of a hole to be drilled in the plate based on the reference line.

[0005] From the above, it can be seen that the hole position measurement method of the present invention can make the position of the hole to be drilled remain consistent relative to the reference line, and will not deviate due to the skewness of the first side. In this way, the break generated when the two plates are joined can be effectively eliminated, thereby achieving the purpose of improving processing accuracy.

[0006] Preferably, in step b), a contact sensing device is used to locate the first reference point and the second reference point on the first side of the plate.

[0007] Preferably, the contact sensing device includes a micro switch and a trigger member that can trigger the micro switch. In step b), the contact sensing device is moved to a first sensing position, and then the plate is moved so that one end of the first side pushes against the trigger member, so that the micro switch is triggered and sends a first signal to a computer, and the computer obtains the first reference point based on the first signal. Thereafter, the contact sensing device is moved to a second sensing position, and then the plate is moved so that the other end of the first side pushes against the trigger member, so that the micro switch is triggered and sends a second signal to the computer, and the computer obtains the second reference point based on the second signal.

[0008] Preferably, the micro switch is fixed on a lifting seat, and the lifting seat can be driven by a lifting drive source to rise or fall relative to the plate.

[0009] Preferably, in step a), a first positioning plate is controlled to extend outward, and then the plate is conveyed to allow the first side to abut against the first positioning plate, and then the two pressing blocks of a positioning clamp are driven to clamp and fix the plate, and then a second positioning plate is controlled to extend outward and abut against a second side of the plate opposite to the first side, so as to complete the length measurement of the plate; in step b), the first positioning plate is controlled to retract, and then the lifting drive source drives the lifting seat to drive the micro switch to descend to the first sensing position.

[0010] Preferably, in step a), the pressing blocks are driven to pull the plate so that a third side of the plate perpendicular to the first and second sides abuts against a guide rod of the positioning clamp, and then a wheel group is moved to abut against a fourth side of the plate relative to the third side, thereby completing the width measurement of the plate.

[0011] Preferably, in step a), a servo motor drives a pressing plate downwardly against a top surface of the plate, thereby completing the thickness measurement of the plate.

[0012] Preferably, in step d), the position to be drilled is positioned according to the distance between the reference line and a center point of the position to be drilled.

[0013] The detailed structure, features, assembly or use of the hole position measurement method for the plate provided by the present invention will be described in the detailed description of the implementation method later. However, those with ordinary knowledge in the field of the present invention should understand that the detailed description and the specific embodiments listed for implementing the present invention are only used to illustrate the present invention and are not used to limit the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional exploded view of two plates in the prior art;

[0015] Figure 2 It is a three-dimensional combination diagram of two plates in the prior art;

[0016] Figure 3 is a block diagram of the hole position measurement method of the present invention;

[0017] Figure 4 A three-dimensional diagram of the positioning jaws provided for the hole position measurement method of the present invention, mainly showing that the first side edge of the plate abuts against the first positioning plate;

[0018] Figure 5 Similar Figure 4, mainly showing that the second positioning plate is against the second side edge of the plate;

[0019] Figure 6 It is a three-dimensional diagram of the hole position measurement method of the present invention sensing the length of the plate, mainly showing that the first side edge of the plate abuts against the first positioning plate, and the second positioning plate abuts against the second side edge of the plate;

[0020] Figure 7 It is a three-dimensional diagram of the hole position measurement method of the present invention sensing the width of the plate, mainly showing that the third side of the plate abuts against the guide rod, and the wheel group abuts against the fourth side of the plate;

[0021] Figure 8 It is a three-dimensional diagram of the hole position measurement method of the present invention sensing the thickness of the plate, mainly showing that the pressing plate is against the top surface of the plate;

[0022] Fig. 9 A three-dimensional diagram of positioning the first reference point of a plate by the hole position measurement method of the present invention;

[0023] Fig.10 A three-dimensional diagram of positioning the second reference point of a plate by the hole position measurement method of the present invention;

[0024] Fig.11 A plan view of the reference line for positioning the plate by the hole position measurement method of the present invention;

[0025] Fig.12 It is a three-dimensional composite diagram of two plates after being measured by the hole position measurement method of the present invention.

[0026] Wherein, the reference numerals are:

[0027] 10: Board

[0028] 11: First side

[0029] 12: Second side

[0030] 13: The third side

[0031] 14: The fourth side

[0032] 15: Top surface

[0033] 16: Position to be drilled

[0034] 17:Joint

[0035] C: Center point

[0036] D: Distance

[0037] P1: First reference point

[0038] P2: Second reference point

[0039] L: Baseline

[0040] 20: Conveying platform

[0041] 22: First positioning plate

[0042] 24: Positioning jaws

[0043] 26: Pressed Block

[0044] 28: Guide rod

[0045] SP3: Measurement location

[0046] 30: Second positioning plate

[0047] 32: Wheel group

[0048] 34: Motor mounting seat

[0049] 36:Servo motor

[0050] 40: Contact sensing device

[0051] 41: Micro switch

[0052] 42: Trigger

[0053] 43:Roller

[0054] 44: Lifting seat

[0055] 45: Lifting drive source

[0056] SP1: First sensing position

[0057] SP2: Second sensing position

[0058] S1-S4: steps. DETAILED DESCRIPTION

[0059] In order to explain the technical features of the present invention in detail, the following embodiments are given and illustrated with drawings. First of all, it should be noted that in the entire specification, including the embodiments introduced below and the claims of the patent application scope, the terms related to directions are based on the directions in the drawings. Secondly, in the embodiments and drawings to be introduced below, the same component numbers represent the same or similar components or their structural features.

[0060] See also Figure 3 The hole position measurement method of the present invention comprises the following steps:

[0061] a) Measure the length, width and thickness of a plate 10.

[0062] like Figure 3 In step S1 shown in FIG. 1 , in this step, as shown in FIG. Figures 4 to 6 As shown, the plate 10 is first placed on a conveying platform 20, and a first positioning plate 22 is driven to extend outward, and then the plate 10 is conveyed by the conveying platform 20 until a first side 11 abuts against the first positioning plate 22, and then two front and rear positioning jaws 24 are driven to clamp and fix the plate 10 with two pressing blocks 26 respectively, and the pressing blocks 26 are driven to pull the plate 10 so that a third side 13 of the plate 10 perpendicular to the first side 11 abuts against the guide rod 28 of the positioning jaws 24, and then the positioning jaws 24 are driven to move together with the plate 10 to a measuring position SP3, and then a second positioning plate 30 is controlled to extend outward and abut against a second side 12 of the plate 10 relative to the first side 11, and the length measurement of the plate 10 can be completed by sensing the distance between the first positioning plate 22 and the second positioning plate 30.

[0063] In terms of width, Figure 7 As shown, a wheel set 32 ​​is driven to lean against a fourth side 14 of the plate 10 opposite to the third side 13 , and the width of the plate 10 can be measured by sensing the distance between the guide rods 28 and the wheel sets 32 .

[0064] As for thickness, Figure 8 As shown, with the conveying platform 20 as the reference plane, a servo motor 36 fixed to the motor mounting seat 34 drives a pressing plate 38 passing through the motor mounting seat 34 to move downward to abut against the top surface 15 of the plate 10, and the thickness measurement of the plate 10 can be completed by sensing the distance between the two.

[0065] b) Locate a first reference point P1 and a second reference point P2 spaced apart from the first reference point P1 on the first side edge 11 of the plate 10 .

[0066] like Figure 3 In step S2, a contact sensing device 40 is used to locate a first reference point P1 and a second reference point P2 on the first side edge 11 of the plate 10. Fig. 9As shown, the contact sensing device 40 includes a micro switch 41, a triggering member 42 that can trigger the micro switch 41, and a roller 43 connected to the triggering member 42. The micro switch 41 is fixedly mounted on a lifting seat 44. The lifting seat 44 can be driven by a lifting drive source 45 to rise or fall relative to the plate 10. In this step, the first positioning plate 22 is first controlled to retract, and then the lifting drive source 45 drives the lifting seat 44 to drive the micro switch 41 to descend to a first sensing position SP1. Then, the conveying platform 20 is used to move the plate 10 so that one end of the first side 11 pushes the triggering member 42 through the roller 43, so that the micro switch 41 is triggered and sends a first signal to a computer (not shown in the figure). The computer obtains the first reference point P1 according to the first signal, and then moves the contact sensing device 40 to a second sensing position SP2 through the motor mounting seat 34. Fig.10 As shown, the conveying platform 20 is used to move the plate 10 so that the other end of the first side 11 pushes the trigger member 42 through the roller 43, so that the micro switch 41 is triggered to send a second signal to the computer, and the computer obtains the second reference point P2 according to the second signal.

[0067] c) Locate a reference line L based on the first reference point P1 and the second reference point P2.

[0068] like Figure 3 In step S3 shown in FIG. 1 , in this step, as shown in FIG. Fig.11 As shown, based on the principle that two points form a straight line, a reference line L extending along the first side edge 11 is located by a computer according to the first reference point P1 and the second reference point P2.

[0069] d) Locate a position 16 to be drilled on the plate 10 according to the reference line L.

[0070] like Figure 3 In step S4 shown in FIG. 1 , in this step, as shown in FIG. Fig.11 As shown, the hole position 16 to be drilled is positioned according to the distance D between the reference line L and a center point C of the hole position 16 to be drilled, so that the distance D between the reference line L and the center point C of each hole position 16 to be drilled remains consistent. After the positioning is completed, the drilling process can be carried out by aligning with each hole position 16 to be drilled.

[0071] As can be seen from the above, the hole position measurement method of the present invention can keep the position 16 to be drilled consistent with the reference line L. Even if the first side 11 is skewed due to poor cutting, it will not affect the relative position relationship between the position 16 to be drilled and the first side 11. In this way, when the plate 10 is joined with another plate 10, the difference between the two at the joint 17 can be effectively eliminated (such as Fig.12 As shown), the purpose of improving machining accuracy is achieved.

[0072] The above description is merely the content of the present invention described through the above embodiments, and it cannot be used to limit the patent protection scope of the present invention. Any simple changes or equivalent implementations made according to the contents of the book and patent specification of the present invention should be covered by the patent scope of the present invention.

Claims

1. A method for measuring the hole position of a plate, characterized in that: It includes the following steps: a) Measure the length, width and thickness of a plate; b) locating a first reference point and a second reference point spaced apart from the first reference point on a first side edge of the plate; c) locating a reference line according to the first reference point and the second reference point; and d) Locating a position of the plate to be drilled according to the reference line.

2. The method for measuring the hole position of a plate according to claim 1, characterized in that: In step b), a contact sensing device is used to locate the first reference point and the second reference point on the first side of the plate.

3. The method for measuring the hole position of a plate as claimed in claim 2, characterized in that: The contact sensing device includes a micro switch and a triggering member that can trigger the micro switch. In step b), the contact sensing device is moved to a first sensing position, and then the plate is moved so that one end of the first side pushes against the triggering member, so that the micro switch is triggered and sends a first signal to a computer, and the computer obtains the first reference point according to the first signal. Then, the contact sensing device is moved to a second sensing position, and then the plate is moved so that the other end of the first side pushes against the triggering member, so that the micro switch is triggered and sends a second signal to the computer, and the computer obtains the second reference point according to the second signal.

4. The method for measuring the hole position of a plate as claimed in claim 3, characterized in that: The micro switch is fixed on a lifting seat, and the lifting seat can be driven by a lifting driving source to rise or fall relative to the plate.

5. The method for measuring the hole position of a plate as claimed in claim 4, characterized in that: In step a), a first positioning plate is controlled to extend outward, and then the plate is transported to allow the first side to abut against the first positioning plate, and then the two pressing blocks of a positioning clamp are driven to clamp and fix the plate, and then a second positioning plate is controlled to extend outward and abut against a second side of the plate opposite to the first side, so as to complete the length measurement of the plate; in step b), the first positioning plate is controlled to retract, and then the lifting drive source drives the lifting seat to drive the micro switch to descend to the first sensing position.

6. The method for measuring the hole position of a plate as claimed in claim 5, characterized in that: In step a), the pressing blocks are driven to pull the plate so that a third side of the plate perpendicular to the first and second sides abuts against a guide rod of the positioning clamp, and then a wheel group is moved to abut against a fourth side of the plate relative to the third side, thereby completing the width measurement of the plate.

7. The method for measuring the hole position of a plate as claimed in claim 5, characterized in that: In step a), a servo motor drives a pressing plate downwardly against a top surface of the plate, thereby completing the thickness measurement of the plate.

8. The method for measuring the hole position of a plate according to claim 1, characterized in that: In step d), the location to be drilled is positioned according to the distance between the reference line and a center point of the location to be drilled.

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