This invention belongs to the field of PC component production technology, specifically relating to a heating mold for dry and wet
heat curing of PC components. It includes a mold platform for fixing PC components, a frame fixed to the ground, and a rectangular curing cover within the frame. The lower end of the rectangular curing cover is located below the ground surface. The interior of the rectangular curing cover is a hollow cavity, including a first curing cavity, a second curing cavity, a third curing cavity, and a fourth curing cavity. Steam pipes are provided on the side walls of the first and second curing cavities, and ventilation pipes are provided on the side walls of the third and fourth curing cavities. Compared with the prior art, this invention has the following advantages: it effectively utilizes above-ground and
underground space, forming four curing cavities in a three-dimensional space, reducing heat loss; it simultaneously cures multiple mold platform groups, achieving integrated dry and wet
heat curing, effectively improving curing efficiency; the various curing cavities are interconnected yet somewhat separated, mutually supplementing each other's
heat energy, increasing energy efficiency compared to horizontal curing.