Wafer appearance detection calibration mechanism

Abstract

The present application relates to wafer appearance detection technical field, especially in kind suitable for wafer appearance detection calibration mechanism, including support frame, the top of support frame is fixedly installed with desktop, the top of desktop is movably installed with first mounting block, the top of first mounting block is slidably installed with second mounting block, the top of second mounting block is installed with clamping assembly, the inside of clamping assembly is clamped with wafer body, the second mounting block is installed with rotating assembly between wafer body, the top of desktop is installed with infrared spotlight away from the side of first mounting block.The present application, through setting clamping assembly stable clamping wafer, it is convenient to detect when rotating, translation and turning function;By setting detection function to determine whether wafer is normal;Set up auxiliary detection assembly can accurately detect problem position when wafer appearance has problem, greatly improve the efficiency, accuracy and comprehensiveness of wafer appearance detection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer appearance detection, and particularly to a wafer appearance detection calibration mechanism. BACKGROUND

[0002] With the development of society, the position of wafer in the semiconductor industry is increasingly important. Wafer refers to a silicon wafer used for the production of silicon semiconductor integrated circuits. Due to its extremely high purity and uniform crystal structure, it has become a basic material for manufacturing various electronic components. A large number of chips can be integrated on the wafer, and these chips are widely used in computers, mobile phones, automotive electronics and many other fields. The quality and performance of the wafer directly affect the reliability and stability of electronic products. Therefore, it is crucial to accurately and efficiently detect the appearance of the wafer.

[0003] However, there are some problems in the existing wafer appearance detection technology. During the detection process, it is difficult to quickly detect the chips in the wafer. This is because the existing detection method usually needs to use a suction cup to clamp the wafer, and after detecting one side, the wafer is taken down and flipped over to detect the back side. The operation is very inconvenient. This method not only has low efficiency, but also easily causes damage to the wafer. In addition, due to the large number of chips on the wafer and the dense distribution, the traditional detection method is difficult to comprehensively and quickly detect the appearance quality of each chip. SUMMARY

[0004] The purpose of the present application is to solve the problems existing in the prior art and provide a wafer appearance detection calibration mechanism.

[0005] In order to achieve the above purpose, the present application adopts the following technical scheme: a wafer appearance detection calibration mechanism, comprising a support frame, a desktop is fixedly installed on the top of the support frame, a first mounting block is movably installed on the top of the desktop, a second mounting block is slidably installed on the top of the first mounting block, a clamping assembly is installed on the top of the second mounting block, a wafer body is clamped and installed in the clamping assembly, a rotating assembly is installed between the second mounting block and the wafer body, an infrared spotlight is installed on the side of the desktop away from the first mounting block, the irradiation direction of the infrared spotlight is towards the wafer body, an infrared receiver is installed on the side of the desktop close to the infrared spotlight, the angles of the infrared spotlight and the infrared receiver are both inclined, an auxiliary detection assembly is installed on the top of the desktop, and the auxiliary detection assembly is located between the wafer body and the infrared spotlight.

[0006] The clamping assembly comprises a bidirectional screw rod, a second sliding block, a second supporting rod, an annular clamping block and a plurality of rollers, the bidirectional screw rod is movably arranged in the second mounting block, the second sliding block is slidably arranged in the second mounting block, the second sliding block is internally provided with a screw hole corresponding to the bidirectional screw rod, the second supporting rod is fixedly connected to the top of the second sliding block, the annular clamping block is fixedly connected to the top of the second supporting rod, and the plurality of rollers are movably arranged in the annular clamping block.

[0007] Further, the first mounting block is movably arranged with a unidirectional screw rod, the first mounting block is fixedly arranged with a first driving motor on one side, the unidirectional screw rod is fixedly arranged on the output end of the first driving motor, and the second mounting block is fixedly connected with a first sliding block at the bottom.

[0008] Further, the bidirectional screw rod is fixedly connected with a rotating handle on one side, the rotating handle is located outside the second mounting block, and the outer surface of the roller is provided with a first clamping groove.

[0009] Further, the rotating assembly comprises a first protective cover, a second driving motor, a driving wheel and a second clamping groove, the first protective cover is fixedly connected to the outer wall of the second mounting block, the second driving motor is fixedly arranged in the first protective cover, the driving wheel is fixedly arranged on the output end of the second driving motor, the driving wheel is located at the bottom of the wafer body, and the second clamping groove is arranged on the outer surface of the driving wheel.

[0010] Further, the first mounting block is fixedly connected with a rotating shaft at the bottom, the top of the table top is provided with a rotating hole, the rotating shaft is movably arranged in the rotating hole, the outer wall of the first mounting block is fixedly connected with a first movable ear plate, the first movable ear plate is slidably arranged with a limiting pin in the inside, the top of the limiting pin is fixedly connected with a pull ring, the pull ring and the first movable ear plate are fixedly arranged with a spring, the spring is sleeved on the limiting pin, the inside of the table top is provided with a limiting groove, the number of the limiting grooves is two, and the limiting grooves correspond to the limiting pins.

[0011] Further, the auxiliary detection assembly comprises an external gear ring, an acrylic plate, a connecting block and a detection camera, the external gear ring is movably arranged on the top of the table top, the acrylic plate is fixedly connected to the front end of the outer wall of the external gear ring, the connecting block is fixedly connected to the side of the outer wall of the external gear ring away from the acrylic plate, the detection camera is fixedly arranged on the outer wall of the connecting block, and the camera of the detection camera faces the direction of the acrylic plate.

[0012] Further, the outer wall of the outer gear ring is meshed with support gears, the number of the support gears is three, the top of the table is fixedly connected with support blocks, the number of the support blocks is two, the two support gears on the top are installed in the inside of the support blocks, the top of the table is fixedly connected with a second movable ear plate, the support gear on the bottom is movably installed on the second movable ear plate, the top of the table is fixedly connected with a second protective cover, the inside of the second protective cover is fixedly installed with a third drive motor, and the support gear on the bottom is fixedly installed on the output end of the third drive motor.

[0013] Further, the top of the table is fixedly connected with a first support rod, the number of the first support rod is two, and the infrared spotlight and the infrared receiver are fixedly installed on the top of the two first support rods.

[0014] Further, the top of the table is fixedly installed with a recording camera, the recording camera is located at the front end of the outer gear ring, and the camera of the recording camera is aligned with the direction of the wafer body.

[0015] Further, the bottom of the support frame is fixedly connected with universal wheels, and the number of the universal wheels is multiple.

[0016] The present application has the following beneficial effects:

[0017] 1. Compared with the prior art, by setting the bidirectional screw rod, the handle, the second support rod, the annular clamping block, the roller and the wafer body, first, the handle is rotated to drive the bidirectional screw rod to rotate, the two second sliding blocks on the bidirectional screw rod move towards or away from each other, the second support rod on the top of the second sliding block moves, so that the annular clamping block fixedly connected to the top of the second support rod moves close to or away from the wafer body, when the annular clamping block moves close to the wafer body, the multiple rollers in the annular clamping block contact the wafer body, and the wafer body is clamped. The wafer is stably clamped, which is convenient for rotating, translating and overturning the wafer during detection, and improves the detection efficiency.

[0018] 2. Compared with the prior art, by setting the first mounting block, the one-way screw rod, the first drive motor, the first sliding block, the limit pin, the pull ring, the limit slot, the second mounting block and the wafer body, during use, the one-way screw rod can be driven to rotate by the first drive motor, so that the first sliding block slides on the first mounting block, thereby driving the second mounting block and the wafer body to translate, and the detection of different areas of the wafer body is realized. If it is necessary to detect the back of the wafer body, the pull ring can be pulled upwards, the limit pin is pulled out of the limit slot, then the first mounting block is rotated, the wafer body is overturned by 180°, the pull ring is released, the limit pin is inserted into another limit slot, and the first mounting block is fixed. The wafer is controlled to rotate, translate and overturn, which is convenient for detecting the chips in different areas of the wafer.

[0019] 3、compared with prior art, by setting wafer body, infrared ray lamp and infrared receiver, in use, start infrared ray lamp, emit oblique infrared ray irradiation on chip on wafer body, if chip appearance has no convex or concave, light will be refracted to infrared receiver, through light refraction principle, can improve the accuracy, reliability and convenience of detection.

[0020] 4、compared with prior art, by setting wafer body, infrared receiver, external gear ring, acrylic plate, connecting block, detection camera, support gear and third driving motor, by setting, if there is chip appearance problem, infrared light cannot be refracted to infrared receiver, but be refracted to acrylic plate, through detection camera on connecting block record the light refracted to acrylic plate, determine the position of problem on wafer body, if refracted light cannot be directly shot by detection camera, can drive support gear to rotate by third driving motor, make external gear ring rotate, drive acrylic plate and detection camera to find light, ensure that the position of problem on wafer body can be accurately detected, can find wafer appearance problem in time, determine the position of problem, provide convenience for subsequent repair and processing. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 it is first view structure schematic diagram of the application;

[0022] Figure 2 it is second view structure schematic diagram of the application;

[0023] Figure 3 it is explosion structure schematic diagram of clamping assembly and rotating assembly in the application;

[0024] Figure 4 it is Figure 3 enlarged structure schematic diagram in A;

[0025] Figure 5 it is Figure 3 enlarged structure schematic diagram in B;

[0026] Figure 6 it is explosion structure schematic diagram of auxiliary detection assembly in the application;

[0027] Figure 7 it is Figure 6 enlarged structure schematic diagram in C;

[0028] Figure 8 it is light refraction line angle schematic diagram when wafer chip appearance has convex in use of the application.

[0029] LEGEND

[0030] 1, support frame; 101, universal wheel; 2, tabletop; 201, first support rod; 3, first mounting block; 301, one-way screw rod; 302, first drive motor; 303, first sliding block; 304, first movable ear plate; 305, limit pin; 306, pull ring; 307, spring; 308, limit groove; 309, rotating shaft; 310, rotating hole; 4, second mounting block; 5, clamping assembly; 501, two-way screw rod; 502, handle; 503, second sliding block; 504, second support rod; 505, annular clamping block; 506, roller; 507, first clamping groove; 6, wafer body; 7, rotating assembly; 701, first protective cover; 702, second drive motor; 703, drive wheel; 704, second clamping groove; 8, infrared spotlight; 9, infrared receiver; 10, auxiliary detection assembly; 1001, external gear ring; 1002, acrylic plate; 1003, connecting block; 1004, detection camera; 1005, support gear; 1006, support block; 1007, second protective cover; 1008, third drive motor; 1009, second movable ear plate; 11, recording camera. DETAILED DESCRIPTION

[0031] REFERENCE Figures 1-8 The application provides a wafer appearance detection calibration mechanism, which comprises a support frame 1, a tabletop 2 fixedly installed at the top of the support frame 1, a first mounting block 3 movably installed at the top of the tabletop 2, a second mounting block 4 slidably installed at the top of the first mounting block 3, a clamping assembly 5 installed at the top of the second mounting block 4, a wafer body 6 clamped in the clamping assembly 5, a rotating assembly 7 installed between the second mounting block 4 and the wafer body 6, an infrared spotlight 8 installed at the side of the tabletop 2 away from the first mounting block 3, the infrared spotlight 8 being directed towards the wafer body 6, an infrared receiver 9 installed at the side of the tabletop 2 close to the infrared spotlight 8, the infrared spotlight 8 and the infrared receiver 9 being inclined, and an auxiliary detection assembly 10 installed at the top of the tabletop 2 and located between the wafer body 6 and the infrared spotlight 8.

[0032] In use, firstly, by rotating the throttle 502, the bidirectional lead screw 501 is rotated. The two second sliders on the bidirectional lead screw 501 will move towards or away from each other. The second support rod 504 at the top of the second slider 503 moves accordingly, so that the annular clamping block 505 fixedly connected to the top of the second support rod 504 moves closer to or away from the wafer body 6. When the annular clamping block 505 moves closer to the wafer body 6, the multiple rollers 506 inside the annular clamping block 505 contact the wafer body 6, thereby clamping the wafer body 6. After clamping, the infrared spotlight 8 is activated, emitting oblique infrared rays that irradiate the chip on the wafer body 6. If the chip has no protrusions or depressions, the light will be refracted onto the infrared receiver 9. If the chip has protrusions or depressions, the light cannot be refracted onto the infrared receiver 9. Then, the auxiliary detection component 10 performs a second detection.

[0033] A one-way lead screw 301 is movably installed inside the first mounting block 3. A first drive motor 302 is fixedly installed on one side of the first mounting block 3. The one-way lead screw 301 is fixedly installed at the output end of the first drive motor 302. A first sliding block 303 is fixedly connected to the bottom of the second mounting block 4. A screw hole corresponding to the one-way lead screw 301 is opened inside the first sliding block 303.

[0034] During testing, after the first drive motor 302 starts, it drives the one-way lead screw 301 to rotate. This is achieved by the first sliding block 303 at the bottom of the second mounting block 4, which enables the second mounting block 4 to slide horizontally on top of the first mounting block 3, thus improving the comprehensiveness of the testing for different areas of the wafer body 6.

[0035] A throttle 502 is fixedly connected to one side of the bidirectional lead screw 501. The throttle 502 is located on the outside of the second mounting block 4. A first slot 507 is provided on the outer surface of the roller 506.

[0036] By rotating the throttle 502, the bidirectional lead screw 501 can be directly driven to rotate, thereby controlling the clamping assembly 5 to clamp and release the wafer body 6; the first slot 507 allows the roller 506 to better clamp and fix the wafer body 6.

[0037] The rotating assembly 7 includes a first protective cover 701, a second drive motor 702, a drive wheel 703, and a second slot 704. The first protective cover 701 is fixedly connected to the outer wall of the second mounting block 4. The second drive motor 702 is fixedly installed inside the first protective cover 701. The drive wheel 703 is fixedly installed at the output end of the second drive motor 702. The drive wheel 703 is located at the bottom of the wafer body 6. The second slot 704 is formed on the outer surface of the drive wheel 703.

[0038] In use, after the second drive motor 702 is started, the drive wheel 703 at its output end rotates. The drive wheel 703 is located at the bottom of the wafer body 6. The friction between the drive wheel 703 and the bottom of the wafer body 6 causes the wafer body 6 to rotate, enabling the infrared spotlight 8 and the infrared receiver 9 to detect the appearance of chips at different positions on the wafer body 6, thereby improving the accuracy and reliability of the detection.

[0039] A rotating shaft 309 is fixedly connected to the bottom of the first mounting block 3. A rotating hole 310 is opened on the top of the tabletop 2. The rotating shaft 309 is movably installed inside the rotating hole 310. A first movable ear plate 304 is fixedly connected to the outer wall of the first mounting block 3. A limit pin 305 is slidably installed inside the first movable ear plate 304. A pull ring 306 is fixedly connected to the top of the limit pin 305. A spring 307 is fixedly installed between the pull ring 306 and the first movable ear plate 304. The spring 307 is sleeved on the limit pin 305. A limit groove 308 is opened inside the tabletop 2. There are two limit grooves 308, and the limit grooves 308 can correspond to the limit pins 305.

[0040] When it is necessary to flip the wafer body 6, pull the pull ring 306 upwards, causing the limiting pin 305 to be pulled out of the limiting groove 308. At this time, the first mounting block 3 can be rotated. After rotating 180°, release the pull ring 306. Under the action of the spring 307, the limiting pin 305 inserts into another limiting groove 308, thereby fixing the first mounting block 3 and completing the flipping of the wafer body 6, improving the efficiency and comprehensiveness of the inspection.

[0041] The auxiliary detection component 10 includes an external gear ring 1001, an acrylic plate 1002, a connecting block 1003, and a detection camera 1004. The external gear ring 1001 is movably located on the top of the tabletop 2. The acrylic plate 1002 is fixedly connected to the front end of the outer wall of the external gear ring 1001. The connecting block 1003 is fixedly connected to the side of the front end of the outer wall of the external gear ring 1001 away from the acrylic plate 1002. The detection camera 1004 is fixedly installed on the outer wall of the connecting block 1003, and the camera of the detection camera 1004 faces the acrylic plate 1002.

[0042] When there is a problem with the appearance of the chip on the wafer body 6, the infrared light cannot be refracted to the infrared receiver 9, but will be refracted to the acrylic plate 1002. At this time, the camera is facing the acrylic plate 1002 and can capture the infrared light refracted to the acrylic plate 1002 to record the location of the problem.

[0043] The outer wall of the external gear ring 1001 is meshed with a support gear 1005. There are three support gears 1005. The top of the desktop 2 is fixedly connected to a support block 1006. There are two support blocks 1006. The two support gears 1005 at the top are installed inside the support blocks 1006. The top of the desktop 2 is fixedly connected to a second movable ear plate 1009. The support gear 1005 at the bottom is movably installed on the second movable ear plate 1009. The top of the desktop 2 is fixedly connected to a second protective cover 1007. The third drive motor 1008 is fixedly installed inside the second protective cover 1007. The support gear 1005 at the bottom is fixedly installed at the output end of the third drive motor 1008.

[0044] In use, the three support gears 1005 provide support for the outer gear ring 1001. Then, the third drive motor 1008 is turned on, driving the support gears 1005 at the bottom to rotate. The support gears 1005 mesh with the outer gear ring 1001, thereby causing the outer gear ring 1001 to rotate, driving the acrylic plate 1002 and the detection camera 1004 to search for the refracted and deflected light.

[0045] The top of the desktop 2 is fixedly connected to a first support rod 201. There are two first support rods 201. The infrared spotlight 8 and the infrared receiver 9 are both fixedly installed on the top of the two first support rods 201.

[0046] In use, the two first support rods 201 provide stable support for the infrared spotlight 8 and the infrared receiver 9, ensuring the accuracy of the detection.

[0047] A recording camera 11 is fixedly installed on the top of the desktop 2. The recording camera 11 is located at the front end of the outer gear ring 1001, and the camera of the recording camera 11 is aimed at the wafer body 6.

[0048] During the inspection process, the recording camera 11 records the entire inspection process of the wafer body 6, providing a basis for subsequent analysis and processing.

[0049] The bottom of the support frame 1 is fixedly connected with casters 101, and there are multiple casters 101.

[0050] The casters 101 allow the entire device to be moved flexibly to different work positions. This improves the device's flexibility and convenience, making it easy to use in various workplaces.

[0051] Infrared spotlight 8 emits angled infrared light, illuminating the chip on the wafer body 6. During propagation, the light follows Fermat's law, meaning it always travels along a path with an extreme value (minimum, maximum, or constant). When the chip's appearance is normal, the light is refracted onto the infrared receiver 9. This is because the wafer and chip surfaces have relatively uniform optical properties under normal conditions, and the light is refracted according to Snell's law (n1sinθ1 = n2sinθ2, where n1 and n2 are the refractive indices of the two media, and n1 and n2 are the angle of incidence and angle of refraction), thus being received by the infrared receiver 9. If the chip's appearance has protrusions or depressions, the optical path changes according to Fermat's law. The light will choose a new path to satisfy Fermat's law, causing the refraction path to deviate from the normal direction and preventing it from being refracted onto the infrared receiver.

[0052] Algorithm for the angle of light refraction when there are protrusions on the surface of a wafer chip:

[0053] ∠Y = Infrared illumination angle.

[0054] ∠X = the convexity angle of the wafer chip.

[0055] Since both the wall surface and the vertical line are perpendicular to the ground,

[0056] Therefore, ∠X = ∠a, and 180° - ∠a = ∠b.

[0057] Since the sum of the three interior angles of a triangle is 180°

[0058] Therefore, 180° - ∠Y - ∠b = ∠c, ∠c = ∠d.

[0059] 180° - ∠X - ∠d = ∠Z.

[0060] Working principle: During testing, the wafer body 6 is first placed between two annular clamping blocks 505. Then, by rotating the handle 502, the annular clamping blocks 505 clamp the wafer body 6. Next, the infrared spotlight 8 is activated, emitting oblique infrared light that shines on the chip on the wafer body 6. If the chip has no protrusions or depressions, the light will be refracted onto the infrared receiver 9; if there is a problem, the light will not be refracted onto the infrared receiver 9, but will be refracted onto the acrylic plate 1002. At this time, the detection camera 1004 on the connecting block 1003 records the light refracted onto the acrylic plate 1002, determining the location of the problem on the wafer body 6.

[0061] If the refracted light cannot be directly captured by the detection camera 1004, the third drive motor 1008 can drive the support gear 1005 to rotate, causing the outer gear ring 1001 to rotate, which in turn drives the acrylic plate 1002 and the detection camera 1004 to search for the light, ensuring that the location of the problem on the wafer body 6 can be accurately detected.

[0062] During the inspection process, the first drive motor 302 can drive the one-way lead screw 301 to rotate, causing the first sliding block 303 to slide on the first mounting block 3, thereby driving the second mounting block 4 and the wafer body 6 to translate, realizing the inspection of different areas of the wafer body 6. At the same time, the second drive motor 702 can drive the drive wheel 703 to rotate, causing the wafer body 6 to rotate, further improving the comprehensiveness of the inspection.

[0063] If it is necessary to inspect the back side of the wafer body 6, the pull ring 306 can be pulled upward to pull the limiting pin 305 out of the limiting groove 308. Then, the first mounting block 3 can be rotated to flip the wafer body 6 180°. After that, the pull ring 306 can be released to insert the limiting pin 305 into another limiting groove 308 to fix the first mounting block 3.

[0064] During the inspection process, the recording camera 11 records the entire inspection process of the wafer body 6, providing a basis for subsequent analysis and processing.

[0065] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer appearance inspection calibration mechanism, comprising a support frame (1), characterized in that: The top of the support frame (1) is fixedly installed with a desktop (2), the top of the desktop (2) is movably installed with a first mounting block (3), the top of the first mounting block (3) is slidably installed with a second mounting block (4), the top of the second mounting block (4) is installed with a clamping assembly (5), the inside of the clamping assembly (5) is clamped with a wafer body (6), the second mounting block (4) and the wafer body (6) are installed with a rotating assembly (7), the top of the desktop (2) is installed with an infrared ray spotlight (8) away from the first mounting block (3), the irradiation direction of the infrared ray spotlight (8) is towards the wafer body (6), the top of the desktop (2) is installed with an infrared receiver (9) close to the infrared ray spotlight (8), the angles of the infrared ray spotlight (8) and the infrared receiver (9) are all inclined, the top of the desktop (2) is installed with an auxiliary detection assembly (10), the auxiliary detection assembly (10) is between the wafer body (6) and the infrared ray spotlight (8); The clamping assembly (5) comprises a bidirectional screw rod (501), a second sliding block (503), a second supporting rod (504), an annular clamping block (505) and a plurality of rollers (506), the bidirectional screw rod (501) is movably installed in the inside of the second mounting block (4), the second sliding block (503) is slidably installed in the inside of the second mounting block (4), the inside of the second sliding block (503) is provided with screw holes corresponding to the bidirectional screw rod (501), the second supporting rod (504) is fixedly connected to the top of the second sliding block (503), the annular clamping block (505) is fixedly connected to the top of the second supporting rod (504), and the plurality of rollers (506) are movably installed in the inside of the annular clamping block (505) and are located on both sides of the wafer body (6); The bottom of the first mounting block (3) is fixedly connected with a rotating shaft (309), the top of the desktop (2) is provided with a rotating hole (310), the rotating shaft (309) is movably installed in the inside of the rotating hole (310), the outer wall of the first mounting block (3) is fixedly connected with a first movable ear plate (304), the inside of the first movable ear plate (304) is slidably installed with a limiting pin (305), the top of the limiting pin (305) is fixedly connected with a pull ring (306), the spring (307) is fixedly installed between the pull ring (306) and the first movable ear plate (304), the spring (307) is sleeved on the limiting pin (305), the inside of the desktop (2) is provided with limiting grooves (308), the number of the limiting grooves (308) is two, and the limiting grooves (308) can correspond to the limiting pin (305). The auxiliary detection assembly (10) comprises an external gear ring (1001), an acrylic plate (1002), a connecting block (1003) and a detection camera (1004), the external gear ring (1001) is movably arranged on the top of the tabletop (2), the acrylic plate (1002) is fixedly connected to the front end of the outer wall of the external gear ring (1001), the connecting block (1003) is fixedly connected to the side of the front end of the outer wall of the external gear ring (1001) away from the acrylic plate (1002), and the detection camera (1004) is fixedly installed on the outer wall of the connecting block (1003), and the camera of the detection camera (1004) faces the direction of the acrylic plate (1002). The outer wall of the external gear ring (1001) is engaged with a supporting gear (1005), the number of the supporting gears (1005) is three, the top of the tabletop (2) is fixedly connected with a supporting block (1006), the number of the supporting blocks (1006) is two, the two supporting gears (1005) on the top are both installed in the supporting block (1006), the top of the tabletop (2) is fixedly connected with a second movable ear plate (1009), and the supporting gear (1005) at the bottom is movably installed on the second movable ear plate (1009), the top of the tabletop (2) is fixedly connected with a second protective cover (1007), the inside of the second protective cover (1007) is fixedly installed with a third driving motor (1008), and the supporting gear (1005) at the bottom is fixedly installed on the output end of the third driving motor (1008).

2. The wafer appearance inspection calibration mechanism according to claim 1, wherein: The inside of the first mounting block (3) is movably installed with a one-way screw rod (301), one side of the first mounting block (3) is fixedly installed with a first driving motor (302), the one-way screw rod (301) is fixedly installed on the output end of the first driving motor (302), and the bottom of the second mounting block (4) is fixedly connected with a first sliding block (303), and the inside of the first sliding block (303) is provided with a screw hole corresponding to the one-way screw rod (301).

3. The wafer appearance inspection calibration mechanism of claim 1, wherein: One side of the bidirectional screw rod (501) is fixedly connected with a rotating handle (502), the rotating handle (502) is located outside the second mounting block (4), and the outer surface of the roller (506) is provided with a first clamping groove (507).

4. The wafer appearance inspection calibration mechanism of claim 1, wherein: The rotating assembly (7) comprises a first protective cover (701), a second driving motor (702), a driving wheel (703) and a second clamping groove (704), the first protective cover (701) is fixedly connected to the outer wall of the second mounting block (4), the second driving motor (702) is fixedly installed in the first protective cover (701), the driving wheel (703) is fixedly installed on the output end of the second driving motor (702), the driving wheel (703) is located at the bottom of the wafer body (6), and the second clamping groove (704) is formed in the outer surface of the driving wheel (703).

5. The wafer appearance inspection calibration mechanism of claim 1, wherein: The top of the table top (2) is fixedly connected with a first support rod (201), the number of the first support rod (201) is two, and the infrared spotlight (8) and the infrared receiver (9) are fixedly installed on the top of the two first support rods (201).

6. The wafer appearance inspection calibration mechanism of claim 1, wherein: The top of the table top (2) is fixedly connected with a first support rod (201), the number of the first support rod (201) is two, and the infrared spotlight (8) and the infrared receiver (9) are fixedly installed on the top of the two first support rods (201).

7. The wafer appearance inspection calibration mechanism of claim 6, wherein: The bottom of the support frame (1) is fixedly connected with universal wheels (101), and the number of the universal wheels (101) is multiple.

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